CN107447207A - A kind of soft board adjustment liquid and method of roughening - Google Patents
A kind of soft board adjustment liquid and method of roughening Download PDFInfo
- Publication number
- CN107447207A CN107447207A CN201710646654.5A CN201710646654A CN107447207A CN 107447207 A CN107447207 A CN 107447207A CN 201710646654 A CN201710646654 A CN 201710646654A CN 107447207 A CN107447207 A CN 107447207A
- Authority
- CN
- China
- Prior art keywords
- soft board
- roughening
- adjustment liquid
- liquid
- mass concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 57
- 238000007788 roughening Methods 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 34
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 claims abstract description 12
- 235000010265 sodium sulphite Nutrition 0.000 claims abstract description 6
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 claims abstract description 6
- 235000019345 sodium thiosulphate Nutrition 0.000 claims abstract description 6
- 150000004985 diamines Chemical class 0.000 claims abstract description 5
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 21
- 229910052802 copper Inorganic materials 0.000 abstract description 21
- 239000010949 copper Substances 0.000 abstract description 21
- 238000005187 foaming Methods 0.000 abstract description 10
- 238000010521 absorption reaction Methods 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 description 9
- 238000002360 preparation method Methods 0.000 description 8
- 238000007747 plating Methods 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 highly basic Chemical compound 0.000 description 1
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/26—Roughening, e.g. by etching using organic liquids
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Abstract
The invention provides a kind of soft board adjustment liquid and method of roughening.The soft board adjustment liquid of the present invention, based on mass concentration, the soft board adjustment liquid includes following material：5~100g/L of highly basic；0.1~10g/L of sodium sulfite；2~5g/L of sodium thiosulfate；0.5~50g/L of diamine.Soft board of the present invention adjusts liquid, and PI material surfaces can be made to have the roughness of stable and uniform, is advantageous to regulator absorption thereafter after adjusted liquid roughening on through hole or the PI of blind hole, and adhesive force is good, and surface is without foaming phenomena；Electroless copper follow-up on PI materials is set completely to cover, the surfacing after coating is fine and smooth.The method of roughening of the soft board adjustment liquid of the present invention, technique is simple, convenient operation and control.
Description
Technical field
The invention belongs to chemical copper technical field, is related to a kind of soft board adjustment liquid and method of roughening.
Background technology
PCB (Printed Circuit Board), Chinese is printed circuit board, also known as printed substrate, is important
Electronic unit, be electronic component supporter, be electronic component electrical connection carrier.Because it is to use electronic seal
What brush art made, therefore be referred to as " printing " circuit board.
As microelectronic packaging technology develops to high speed, lightness direction, it is desirable to which baseplate material has relatively low dielectric
Constant, the resistivity of metal line material is low, and deelectric transferred ability is high.Polyimides (Polyimide, abbreviation PI) material has
Good insulating properties and sealing, and heat endurance it is high, can high temperature resistant and extremely low temperature, with good mechanical performance, thermal expansion
Coefficient is low, nontoxic, and especially he has low dielectric constant, can reduce current interference and energy consumption between wire.So PI
It is preferable base plate for packaging, is widely used in civil electronic device products, communication device.PI materials are as PCB
The insulating barrier of soft board, its hole metallization process, a kind of special PI regulators of soft board need to be developed, PI base materials can be roughened, had
Beneficial to the absorption of regulator thereafter on through hole or the PI of blind hole.
CN102031505A disclose it is a kind of for polyimides chemistry roughening activation adjustment liquid, it is described adjustment liquid be containing
There is the aqueous solution of the complex compound of nickel, highly basic, hydrazine hydrate and surfactant；The highly basic is sodium hydroxide or potassium hydroxide.Should
After liquid is adjusted for the chemistry roughening activation of polyimides, the roughness stable and uniform on surface is poor, the adhesion of polyimides
It is poor.
The content of the invention
In view of the shortcomings of the prior art, an object of the present invention is to provide a kind of soft board adjustment liquid, can make PI materials
Surface has the roughness of stable and uniform, is advantageous to regulator absorption thereafter after adjusted liquid roughening in through hole or the PI of blind hole
On, electroless copper follow-up on PI materials is completely covered.
To use following technical scheme up to this purpose, the present invention：
A kind of soft board adjusts liquid, and based on mass concentration, the soft board adjustment liquid includes following material：
The usual facile hydrolysis in the basic conditions of PI, and by controllable hydrolysis so as to realize the roughening on surface, it is of the invention sharp
With PI this characteristic, in the basic conditions, using KOH concentration in 5~100g/L scope, add through specific chemistry is added
Add agent：0.1~10g/L of sodium sulfite, 2~5g/L of sodium thiosulfate, 0.5~50g/L of diamine, realize that soft board PI base materials are controllable thick
Change, be advantageous to regulator absorption thereafter on through hole or the PI of blind hole.
In the present invention, the highly basic is potassium hydroxide.Preferably, the mass concentration of the highly basic is 50~60g/L, such as
The mass concentration of highly basic be 50g/L, 51g/L, 52g/L, 53g/L, 54g/L, 55g/L, 56g/L, 57g/L, 58g/L, 59g/L,
60g/L。
In the present invention, the mass concentration of the sodium sulfite is 3~6g/L, such as the mass concentration of sodium sulfite is 3g/
L、3.2g/L、3.5g/L、3.6g/L、3.8g/L、4g/L、4.2g/L、4.5g/L、4.6g/L、4.8g/L、5g/L、5.1g/L、
5.3g/L、5.5g/L、5.7g/L、5.8g/L、6g/L。
In the present invention, the mass concentration of the sodium thiosulfate is 3~4g/L, such as the mass concentration of sodium thiosulfate is
3g/L、3.1g/L、3.2g/L、3.3g/L、3.4g/L、3.5g/L、3.6g/L、3.7g/L、3.8g/L、3.9g/L、4g/L。
In the present invention, the mass concentration of the diamine is 20~40g/L, such as the mass concentration of diamine is 20g/L, 22g/
L、25g/L、26g/L、28g/L、30g/L、31g/L、33g/L、35g/L、36g/L、38g/L、40g/L。
As the preferred scheme of the present invention, based on mass concentration, the soft board adjustment liquid includes following material：
As the preferred scheme of the present invention, based on mass concentration, the soft board adjustment liquid includes following material：
The preparation method of soft board of the present invention adjustment liquid is：By each group in the soft board adjustment liquid matched the present invention
Divide and be dissolved in the water, you can the preparation adjustment liquid being roughened for soft board chemistry, for the no spy of addition sequence of each component
Do not limit.It is first that highly basic is soluble in water under preferable case, obtain strong base solution；Then by sodium sulfite, sodium thiosulfate, connection
Amine solvent prepares mixed liquor in water, then mixed liquor is added into stirring to dissolving in strong base solution and obtains the soft board adjustment liquid.
In the case of further preferably, operation is all stirred after adding raw material every time, raw material is quickly dissolved.
The second object of the present invention is to provide a kind of method of roughening of the soft board adjustment liquid described in use, the roughening side
Method is：Flexible board substrate is contacted with soft board adjustment liquid and carries out roughening treatment.
The temperature of the roughening treatment is 40~60 DEG C, and the time of the roughening treatment is 1~3min.
Compared with prior art, beneficial effects of the present invention are：
Soft board of the present invention adjusts liquid, and PI material surfaces can be made to have the roughness of stable and uniform, had after adjusted liquid roughening
Beneficial to the absorption of regulator thereafter on through hole or the PI of blind hole, and adhesive force is good, and surface is without foaming phenomena；Make follow-up on PI materials
Electroless copper completely cover, surfacing after coating is fine and smooth.
The method of roughening of the soft board adjustment liquid of the present invention, technique is simple, convenient operation and control.
Embodiment
Technical scheme is further illustrated below by embodiment.
In the whole technique of the electroless copper of circuit board, including several basic handling processes：
1) liquid adjustment, fully washing are adjusted；
2) microetch is roughened, fully washing；
3) presoak；
4) activate, fully washing；
5) reduction or dispergation, fully washing；
6) electroless copper, fully washing.
Following examples carry out copper facing by above-mentioned technological process to the flexible board substrate with PI insulating barriers.
Embodiment 1
The soft board of the present embodiment adjusts liquid based on mass concentration, includes following material：
Roughening is adjusted to base material using the soft board adjustment liquid of above-mentioned preparation, the temperature of roughening treatment is 40 DEG C, roughening
After the time of processing is 1min, then copper facing, the substrate surface flat smooth after copper facing, no plating leakage and table are carried out by above-mentioned technique
Face is without foaming phenomena.
Embodiment 2
The soft board of the present embodiment adjusts liquid based on mass concentration, includes following material：
Roughening is adjusted to base material using the soft board adjustment liquid of above-mentioned preparation, the temperature of roughening treatment is 60 DEG C, roughening
After the time of processing is 3min, then copper facing, the substrate surface flat smooth after copper facing, no plating leakage and table are carried out by above-mentioned technique
Face is without foaming phenomena.
Embodiment 3
The soft board of the present embodiment adjusts liquid based on mass concentration, includes following material：
Roughening is adjusted to base material using the soft board adjustment liquid of above-mentioned preparation, the temperature of roughening treatment is 55 DEG C, roughening
After the time of processing is 3min, then copper facing, the substrate surface flat smooth after copper facing, no plating leakage and table are carried out by above-mentioned technique
Face is without foaming phenomena.
Embodiment 4
The soft board of the present embodiment adjusts liquid based on mass concentration, includes following material：
Roughening is adjusted to base material using the soft board adjustment liquid of above-mentioned preparation, the temperature of roughening treatment is 45 DEG C, roughening
After the time of processing is 2min, then copper facing, the substrate surface flat smooth after copper facing, no plating leakage and table are carried out by above-mentioned technique
Face is without foaming phenomena.
Embodiment 5
The soft board of the present embodiment adjusts liquid based on mass concentration, includes following material：
Roughening is adjusted to base material using the soft board adjustment liquid of above-mentioned preparation, the temperature of roughening treatment is 55 DEG C, roughening
After the time of processing is 3min, then copper facing, the substrate surface flat smooth after copper facing, no plating leakage and table are carried out by above-mentioned technique
Face is without foaming phenomena.
Embodiment 6
The soft board of the present embodiment adjusts liquid based on mass concentration, includes following material：
Roughening is adjusted to base material using the soft board adjustment liquid of above-mentioned preparation, the temperature of roughening treatment is 60 DEG C, roughening
After the time of processing is 3min, then copper facing, the substrate surface flat smooth after copper facing, no plating leakage and table are carried out by above-mentioned technique
Face is without foaming phenomena.
Comparative example
Using method disclosed in CN102031505A embodiments 1, the adjustment liquid of this comparative example, the base material after copper facing are prepared
There is foaming phenomena surface irregularity, subregion.
Soft board of the present invention adjusts liquid, and PI material surfaces can be made to have the roughness of stable and uniform, had after adjusted liquid roughening
Beneficial to the absorption of regulator thereafter on through hole or the PI of blind hole, and adhesive force is good, and surface is without foaming phenomena；Make follow-up on PI materials
Electroless copper completely cover, surfacing after coating is fine and smooth.The method of roughening of the soft board adjustment liquid of the present invention, technique letter
It is single, convenient operation and control.
Applicant states that the present invention illustrates the detailed process equipment of the present invention and technological process by above-described embodiment,
But the invention is not limited in above-mentioned detailed process equipment and technological process, that is, it is above-mentioned detailed not mean that the present invention has to rely on
Process equipment and technological process could be implemented.Person of ordinary skill in the field it will be clearly understood that any improvement in the present invention,
The addition of equivalence replacement and auxiliary element to each raw material of product of the present invention, selection of concrete mode etc., all fall within the present invention's
Within the scope of protection domain and disclosure.
Claims (10)
1. a kind of soft board adjusts liquid, it is characterised in that based on mass concentration, the soft board adjustment liquid includes following material：
2. soft board according to claim 1 adjusts liquid, it is characterised in that the highly basic is potassium hydroxide.
3. soft board according to claim 1 or 2 adjusts liquid, it is characterised in that the mass concentration of the highly basic is 50~
60g/L。
4. the soft board adjustment liquid according to one of claim 1-3, it is characterised in that the mass concentration of the sodium sulfite is
3~6g/L.
5. the soft board adjustment liquid according to one of claim 1-4, it is characterised in that the mass concentration of the sodium thiosulfate
For 3~4g/L.
6. according to one of claim 1-5 soft board adjustment liquid, it is characterised in that the mass concentration of the diamine be 20~
40g/L。
7. the soft board adjustment liquid according to one of claim 1-6, it is characterised in that based on mass concentration, the soft board is adjusted
Whole liquid includes following material：
8. the soft board adjustment liquid according to one of claim 1-7, it is characterised in that based on mass concentration, the soft board is adjusted
Whole liquid includes following material：
A kind of 9. method of roughening of soft board adjustment liquid using as described in one of claim 1-8, it is characterised in that the roughening
Method is：Flexible board substrate is contacted with soft board adjustment liquid and carries out roughening treatment.
10. method of roughening according to claim 9, the temperature of the roughening treatment is 40~60 DEG C, the roughening treatment
Time be 1~3min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710646654.5A CN107447207A (en) | 2017-08-01 | 2017-08-01 | A kind of soft board adjustment liquid and method of roughening |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710646654.5A CN107447207A (en) | 2017-08-01 | 2017-08-01 | A kind of soft board adjustment liquid and method of roughening |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107447207A true CN107447207A (en) | 2017-12-08 |
Family
ID=60490653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710646654.5A Pending CN107447207A (en) | 2017-08-01 | 2017-08-01 | A kind of soft board adjustment liquid and method of roughening |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107447207A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0281312A2 (en) * | 1987-02-24 | 1988-09-07 | Polyonics Corporation | Textured polyimide film |
| CN101736330A (en) * | 2008-11-25 | 2010-06-16 | 比亚迪股份有限公司 | Method for metalizing polyimide surface |
| CN105420700A (en) * | 2014-09-18 | 2016-03-23 | 比亚迪股份有限公司 | Polyimide circuit board and manufacturing method thereof |
| CN105463416A (en) * | 2014-07-31 | 2016-04-06 | 比亚迪股份有限公司 | Adjusting liquid for chemical roughening of polyimide, and a method for surface chemical roughening of polyimide |
| CN106255347A (en) * | 2016-08-23 | 2016-12-21 | 台山市精诚达电路有限公司 | FPC hole metallization technique |
| CN106350788A (en) * | 2016-09-18 | 2017-01-25 | 电子科技大学 | Chemical plating front surface modifying system and surface modifying method of organic polymer base material |
-
2017
- 2017-08-01 CN CN201710646654.5A patent/CN107447207A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0281312A2 (en) * | 1987-02-24 | 1988-09-07 | Polyonics Corporation | Textured polyimide film |
| CN101736330A (en) * | 2008-11-25 | 2010-06-16 | 比亚迪股份有限公司 | Method for metalizing polyimide surface |
| CN105463416A (en) * | 2014-07-31 | 2016-04-06 | 比亚迪股份有限公司 | Adjusting liquid for chemical roughening of polyimide, and a method for surface chemical roughening of polyimide |
| CN105420700A (en) * | 2014-09-18 | 2016-03-23 | 比亚迪股份有限公司 | Polyimide circuit board and manufacturing method thereof |
| CN106255347A (en) * | 2016-08-23 | 2016-12-21 | 台山市精诚达电路有限公司 | FPC hole metallization technique |
| CN106350788A (en) * | 2016-09-18 | 2017-01-25 | 电子科技大学 | Chemical plating front surface modifying system and surface modifying method of organic polymer base material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6143356A (en) | Diffusion barrier and adhesive for PARMOD™ application to rigid printed wiring boards | |
| EP0374487B1 (en) | Method for conditioning an organic polymeric material | |
| EP1833928A1 (en) | Conductive silver dispersions and uses thereof | |
| CN102869732B (en) | Ink for printing a mobile phone antenna pattern, method for manufacturing a synthetic resin part for a mobile phone on which an antenna pattern is printed using the ink, and synthetic resin part for a mobile phone on which an antenna pattern is print | |
| JP2011091066A (en) | Low dielectric loss wiring board, multilayer wiring board, and copper foil and laminate used for the same | |
| CN101911844B (en) | Metal-clad substrate, and method for production thereof | |
| CN106480479A (en) | The preparation method of flexible additive for electrolytic copper foil, product and its application | |
| EP0887132A2 (en) | Copper fine powder and method for preparing the same | |
| CN105420700B (en) | A kind of polyimide circuits plate and preparation method thereof | |
| CN103992688B (en) | Polyimide resin surface modifier and polyimide resin surface modifying method | |
| CN110181904A (en) | A kind of high frequency is without glue double side flexible copper coated board and preparation method thereof | |
| CN104005009B (en) | The preparation of a kind of integrated molding has the method for the polyimides flexibility glue-free copper coated plate of ultra-thin layers of copper | |
| CN102037063B (en) | Method for conditioning insulating resin and its use | |
| CN107447207A (en) | A kind of soft board adjustment liquid and method of roughening | |
| CN103508759B (en) | High-power LED (Light Emitting Diode) base and preparation method thereof | |
| CN207909682U (en) | A kind of wireless charging receiving coil | |
| TWI638821B (en) | Metal catalyst, manufacturing method and applications thereof | |
| JP2008280592A (en) | Method for producing electrically conductive metal nanoparticle, electrically conductive metal nanoparticle, ink composition using the same, and method for forming wiring | |
| EP3112499A1 (en) | Method for metallizing dielectric substrate surface, and dielectric substrate provided with metal film | |
| CN114875460A (en) | Synthetic method and application of ultrathin pore-filling copper plating leveling agent | |
| CN107022162A (en) | A kind of Organic Conductive Films conditioner and preparation method thereof | |
| CN113355664B (en) | Electroless plating solution for antenna surface metallization and preparation method and application thereof | |
| CN113056088B (en) | High-performance flexible circuit board | |
| WO1991009151A1 (en) | Method of metallizing substrates by chemical redox | |
| CN112839450A (en) | Heat treatment device for roll-to-roll production process of flexible circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171208 |