CN107442930A - A kind of laser spot dynamic machining method and device - Google Patents

Abstract

The invention discloses a laser focus dynamic processing method and device, belonging to the technical field of laser processing applications. The basic principle of the method of the invention is that the laser focus is not Then it is fixed at a certain position and does not move, but moves downward or upward at a certain speed along the optical axis of the thickness of the workpiece to be processed, or moves linearly, swinging or spirally at a certain frequency. The present invention also provides a method and device for realizing the laser focus dynamic processing of the above method. The method and device of the invention overcome a series of processing problems caused by uneven energy density distribution of the laser optical axis in the traditional processing method.

Description

A laser focus dynamic processing method and device

technical field

The invention belongs to the technical field of laser processing applications, and in particular relates to a method and a device for dynamically processing materials with a laser focus.

Background technique

At present, the conventional method of laser-material interaction is to fix the laser focus at a certain position of the material to be processed, and then start the laser beam to start drilling, cutting, etching, welding and other processing of the material.

During laser processing, the laser focus is in a static state. This laser focusing processing method will cause uneven distribution of energy density along the laser optical axis because the laser focusing beam is a conical focusing spot, that is, the energy density at the focus is the highest, and the farther away from the focus, the lower the energy density, resulting in The material is heated unevenly along the optical axis. The material at the focal point absorbs the laser light with a high energy density and quickly reaches the vaporization temperature. There are more vaporized materials and less molten materials. However, the laser energy absorbed by the material away from the focal point is low, resulting in the gradual decrease of the vaporized material and the gradual increase of the melted material. When it is farther away from the laser focus, the material is in a molten state because it absorbs lower laser energy.

The problems of this processing method are summarized as follows:

(1) In the process of laser drilling and cutting, because the vaporization and evaporation of materials occurs more at the laser focus, and the material outside the focus is in a state of melting more, resulting in far more molten materials than vaporized and evaporated materials ;

(2) A small amount of vaporized and evaporated material not only leads to less removal, but also produces a smaller reverse thrust; it is difficult to remove more molten material from the processed area with a smaller reverse thrust, resulting in a large amount of molten material re-solidified in the On the hole wall or cut end wall, a recast layer is formed;

(3) The recast layer on the laser processing hole wall will lead to the formation of tapered holes and kerfs, which reduces the verticality of the processing hole wall and affects the dimensional accuracy of laser processing;

(4) The formation of the recasting layer will also cause the roughness of laser processing to increase, and at the same time, defects such as cracks, micropores, and coarse grains will be formed in the recasting layer, resulting in a decrease in the quality of laser processing;

(5) The physical and chemical properties of the recast layer and the base material are inconsistent and the bonding force is weak, which will also bring some problems to subsequent processing applications. fall off and break the circuit;

(6) More material melting and less vaporization and evaporation will also lead to the formation of a large amount of hanging slag at the outlet of material processing, which must be processed afterward;

(7) During the laser thermal separation processing of transmissive materials, the uneven energy distribution along the optical axis of the focused laser will cause uneven distribution of the temperature field along the thickness direction of the material, resulting in uneven distribution of the induced thermal stress field, Cause separation of micro-cracks out of control;

(8) During the laser welding process, the static focus spot will make the welding seam poorly formed, and defects such as pores, slag inclusions, and microcracks are prone to occur in the formed weld seam;

(9) The static laser focus will decrease as the energy density goes away from the focus, which will cause the heat conduction loss of the material to increase, resulting in a decrease in the utilization rate of laser energy.

Therefore, it is necessary to develop a novel laser focus processing method or device to overcome the related problems in the prior art.

Contents of the invention

Aiming at the above defects or improvement needs of the prior art, the present invention proposes a method for dynamic laser focus processing, the basic principle of which is that the laser focus is no longer It is fixed at a certain position and does not move, but moves downward or upward at a certain speed along the optical axis of the thickness of the workpiece to be processed, or linearly swings or spirally moves up and down at a certain frequency, in order to overcome the traditional processing methods. Machining problems caused by uneven axial energy density distribution.

In order to achieve the above object, according to one aspect of the present invention, a laser focus dynamic processing method is provided. During the processing, the laser focus spot moves dynamically at a set speed along the optical axis.

In one embodiment of the present invention, the laser focal spot moves downward or upward along the optical axis direction of the thickness of the workpiece to be processed at a set speed.

In one embodiment of the present invention, the laser focus spot moves linearly at a set frequency, or the laser focus spot oscillates at a set frequency, or the laser focus spot moves spirally up and down at a set frequency.

According to the second aspect of the present invention, a laser focus dynamic processing device for realizing the above method is provided, which includes a laser, a beam expander collimating mirror, a dynamic focusing mirror, a light guide mirror, a linear reciprocating movement mechanism, and an xy workbench and an industrial computer, wherein the dynamic focus lens includes a positive and negative focus lens group and a negative focus lens, the xy table is used to carry the workpiece to be processed, and the negative focus lens is set on a linear reciprocating movement mechanism so as to be able to move along a straight line, the industrial control The machine is connected with the laser, the linear reciprocating mechanism and the xy worktable at the same time, so as to control the switch of the laser, the movement of the linear reciprocating mechanism and the movement of the xy worktable, the beam expander collimating mirror, the dynamic focusing mirror, the guide The optical mirrors are sequentially arranged along the direction of the optical axis of the laser light emitted by the laser, and the light guide mirror is used to reflect the laser light emitted by the laser to the workpiece to be processed.

In one embodiment of the present invention, when the laser focus performs dynamic drilling processing, the industrial computer controls the laser to emit a laser beam and controls the linear reciprocating mechanism in the dynamic focus mirror to drive the negative focus lens forward or backward at a set speed. Then move in a straight line, so that the laser focus moves up or down along the optical axis direction of the thickness of the workpiece at a set speed to complete the dynamic drilling process of the laser focus. Then, the industrial computer controls the xy table to move the workpiece to be processed to At another position, repeat the above laser focus dynamic drilling process until all the drilling processes are completed.

In one embodiment of the present invention, a focusing lens is also included, and the focusing lens is arranged at the lower end of the light guide mirror, and the focusing lens is used to refocus the focused laser beam output by dynamic focusing to obtain a smaller focused spot diameter, thereby Can be used to drill smaller diameter holes, or to achieve narrower cuts and welds.

According to the third aspect of the present invention, a laser focus dynamic processing device for realizing the above method is also provided, which includes a laser, a beam expander collimator, a dynamic focusing mirror, a linear reciprocating movement mechanism, and an xy two-dimensional scanning galvanometer , xy workbench and industrial computer, wherein the dynamic focus lens includes a positive and negative focus lens group and a negative focus lens, the xy workbench is used to carry the workpiece to be processed, and the negative focus lens is set on a linear reciprocating movement mechanism to be able to move along the Linear movement, the industrial computer is connected with the laser, the linear reciprocating movement mechanism, the xy two-dimensional scanning galvanometer and the xy worktable, so as to control the switch of the laser, the movement of the linear reciprocating movement mechanism, and the xy two-dimensional scanning galvanometer The movement of the xy table and the movement of the xy table, the beam expander collimating mirror, the dynamic focusing mirror, and the xy two-dimensional scanning galvanometer are arranged in sequence along the direction of the laser optical axis emitted by the laser. The focused laser beam output by the mirror is focused on the set position of the workpiece to be processed. The xy two-dimensional scanning galvanometer is composed of x-direction reflectors and y-direction reflectors, which are used to control the laser beam to scan the processing track on the xy plane.

In one embodiment of the present invention, it also includes a scanning focusing field lens, which is arranged at the lower end of the xy two-dimensional scanning galvanometer, and is used to refocus the focused laser beam output by the dynamic focusing lens to obtain a smaller The diameter of the focused spot can be used to drill smaller diameter holes, or to achieve narrower cutting and welding seams.

In one embodiment of the present invention, the positive and negative focus lens groups include at least one negative focus lens and one positive focus lens.

In the present invention, the key components of the device for realizing the laser focus dynamic processing method of the present invention include: a linearly movable negative focusing lens and a dynamic focusing lens, and the dynamic focusing lens includes a fixed set of positive and negative focusing lenses (the positive and negative focusing lenses include One negative focusing lens and one positive focusing lens). The linearly movable negative focusing lens is installed on the linear moving mechanism, which can perform a reciprocating linear motion to change the divergence angle of the laser light speed, and the fixed positive and negative focusing lens groups perform focusing.

The working principle of the device of the invention is: when the laser starts drilling, the industrial computer simultaneously controls the laser and the dynamic focusing mirror. After the laser beam emitted by the laser is expanded and collimated by the beam expander and collimator, the negative focus lens input into the dynamic focus lens diverges the laser beam. The focus point is introduced into a certain position on the surface or inside of the workpiece to be processed.

When the linearly movable negative focusing lens moves forward or backward at a certain speed, the divergence angle of the laser beam speed will also change, and the diameter of the spot projected on the positive and negative focusing lenses will also change, thereby changing the laser focus on the optical axis. The position makes the laser focus move downward or upward along the optical axis direction of the workpiece thickness to realize the dynamic drilling function of the laser focus.

During the laser cutting, etching or welding process, the industrial computer controls the laser, the dynamic focusing mirror and the two-dimensional worktable at the same time. After the laser emits the laser beam, the negative focus lens can be moved in a straight line to move back and forth in a straight line at a certain frequency, and the laser focus can be moved downward and upward along the optical axis direction of the thickness of the workpiece. At the same time, the two-dimensional worktable drives the workpiece to move, realizing dynamic cutting and cutting of the laser focus. Welding function.

The laser focus dynamic processing method of the present invention can also use a dynamic focusing mirror to cooperate with a two-dimensional scanning galvanometer to realize the laser focus moving up and down along the optical axis direction of the thickness of the workpiece in a swinging or spiral manner.

Generally speaking, compared with the prior art, the above technical solutions conceived by the present invention can achieve the following beneficial effects:

The laser focus spot moves dynamically along the optical axis, which can improve the uniformity of the energy density distribution of the laser along the optical axis; because the laser focus spot moves rapidly along the optical axis, the absorption rate of the laser energy by the material along the laser optical axis can be improved, so that The energy density of the laser energy absorbed by the processed material on the laser optical axis is at the focal spot; because the material along the laser optical axis is processed at the focal point, the vaporization and evaporation of the material are increased, the melting amount and heat conduction loss are reduced, and the laser energy is improved. utilization rate;

In the drilling process, the increase of material vaporization and evaporation will increase the slag removal ability, reduce or eliminate the recast layer, and improve the taper of the drill hole; the reduction of the melting amount and heat conduction loss will help reduce and eliminate the recast layer and improve the taper of the drill hole ;The increase of material vaporization and evaporation and the reduction of melting are beneficial to reduce or eliminate the phenomenon of cutting and drilling slag;

During the laser thermal separation processing of transmissive materials, the laser focus moves rapidly along the optical axis, which improves the uneven distribution of energy along the optical axis, makes the temperature field along the optical axis more uniform, and the thermal stress field induced along the optical axis The uniformity of distribution is enhanced, so as to realize the control of the direction of separation micro-cracks;

During the laser welding process, the rapid movement of the focused spot along the optical axis will make it easier for the pores and slag in the weld to escape, which is conducive to improving the quality of the laser weld.

Description of drawings

Fig. 1 is one of the laser focus dynamic processing methods provided by the embodiment of the present invention: a schematic diagram of the downward movement of the focus;

Fig. 2 is one of the laser focus dynamic processing methods provided by the embodiment of the present invention: a schematic diagram of moving the focus upward;

Fig. 3 is a schematic diagram of a laser focus dynamic processing device implementing one of the laser focus dynamic processing methods provided by an embodiment of the present invention;

Fig. 4 is the second schematic diagram of the laser focus dynamic processing method provided by the embodiment of the present invention;

5 is a schematic diagram of a laser focus dynamic processing device for realizing the second laser focus dynamic processing method provided by an embodiment of the present invention;

Fig. 6 is the device for realizing the third dynamic processing method of laser focus provided by the embodiment of the present invention;

Fig. 7 is another device for implementing the third method of laser focus dynamic processing provided by the embodiment of the present invention. On the basis of the device shown in Fig. 6, this device performs secondary focusing on the focused laser beam, and its beam diameter is smaller , for welding or slitting with smaller aperture diameter or smaller width;

Fig. 8 is a schematic diagram of the third laser focus dynamic processing method provided by the embodiment of the present invention: spiral laser focus dynamic drilling;

Fig. 9 is a schematic diagram of the third laser focus dynamic processing method provided by the embodiment of the present invention: concentric circular laser focus dynamic drilling;

Fig. 10 is a schematic diagram of the third laser focus dynamic processing method provided by the embodiment of the present invention: swing laser focus dynamic processing.

Among them, one of the laser focus dynamic processing methods refers to the laser focus dynamic drilling method; the second laser focus dynamic processing method refers to the laser focus dynamic cutting, etching, scribing or welding method; the third laser focus dynamic processing method refers to Laser focus dynamic helical or concentric drilling and oscillating processing methods.

detailed description

In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.

One of the specific embodiments of the present invention: a laser focus dynamic drilling method.

The basic principle of the laser focus dynamic drilling method is shown in Figure 1 and Figure 2, Figure 1 is one of the laser focus dynamic processing methods provided by the embodiment of the present invention: a schematic diagram of the focus moving downward; Figure 2 is the laser focus provided by the embodiment of the present invention One of the focus dynamic processing methods: the schematic diagram of the upward movement of the focus.

Specifically, the initial focal point 1 of the focused laser beam is located on the surface or a certain position of the workpiece 2 to be processed. After the laser emits the laser beam, the focus 1 starts to move downward at a certain speed until the required small hole 3 is formed on the workpiece 2, the laser stops sending the laser beam, and the position of the laser focus 1 returns to the original position at the same time. The initial focus 1 of the focused laser beam can also be located on the bottom surface of the workpiece 2 to be processed (as shown in Figure 2). After the laser emits the laser beam, the focus 1 begins to move upward at a certain speed until the workpiece 2 forms After the pinhole 3 is required, the laser stops sending the laser beam, and the position of the laser focus 1 returns to the initial position at the same time.

One of the devices for realizing this method is shown in FIG. 3 , which is a schematic diagram of a laser focus dynamic processing device for realizing one of the laser focus dynamic processing methods provided by an embodiment of the present invention. It can be seen from the figure that it includes a laser 10 , a beam expander collimating mirror 11 , a dynamic focusing mirror 12 , a light guide mirror 16 , an xy table 17 and an industrial computer 18 . , wherein the dynamic focusing lens 12 includes a linearly movable negative focusing lens 13 and a positive and negative focusing lens group 14, the linearly movable negative focusing lens 13 is fixed on a rectilinear reciprocating mechanism 15, and the positive and negative focusing lens group 14 consists of at least one negative focusing lens The focusing lens and a positive focusing lens are composed. The workpiece 2 to be processed is fixed on the xy table 17 plane, and the focus of the laser beam is located at the set position of the workpiece 2 . The industrial computer 18 simultaneously controls the laser 10 , the dynamic focusing mirror 12 and the xy table 17 .

The working method of the device described in Fig. 3 when laser focus dynamic drilling is as follows:

The industrial computer 18 controls the laser 10 to emit the laser beam, and controls the rectilinear reciprocating mechanism 15 in the dynamic focusing mirror 12 to drive the negative focusing lens 13 to move forward or backward at a set speed, so that the laser focus 1 can be set at a set speed. The speed moves up or down along the optical axis direction of the thickness of the workpiece 2 (the optical axis direction of the thickness is the optical axis direction of the laser beam, that is, the thickness direction of the workpiece 2), and the dynamic drilling process of the laser focus is completed. The industrial computer 18 then controls the xy workbench 17 to move the workpiece 2 to another position, and repeats the above laser focus dynamic drilling process until all small holes are processed.

The second specific embodiment of the present invention: laser focus dynamic cutting, etching, scribing or welding.

The basic principle of the laser focus dynamic cutting, etching, scribing or welding method is shown in Figure 4, and Figure 4 is a schematic diagram of the second laser focus dynamic processing method provided by the embodiment of the present invention.

Specifically, the initial focal point 1 of the focused laser beam is located on the surface or a certain position of the workpiece 2 to be processed. After the laser emits the laser beam, the laser focus 1 starts to move up and down at the set frequency, and at the same time the workpiece 2 moves relative to the laser beam focus 1 until the required slit, etching, scribing or welding 4 is formed, The laser stops sending the laser beam, at the same time the laser focus 1 returns to the initial position, and the workpiece 2 stops moving. The industrial computer 18 controls the laser 10 to emit the laser beam and controls the rectilinear reciprocating mechanism 15 in the dynamic focusing mirror 12 to drive the negative focusing lens 13 to reciprocate linearly at a set frequency, so that the laser focus 1 moves along the workpiece 2 at a certain frequency. The thickness optical axis moves up and down, and at the same time, the industrial computer 18 controls the xy workbench 17 to move the workpiece 2 at a certain speed to complete the laser focus dynamic cutting, etching, scribing or welding processing.

The advantage of this laser focus dynamic processing method is that the optical path is simple and the laser focus dynamic processing range is wide.

In order to obtain a smaller focus spot diameter, the second laser focus dynamic processing method device provided by the present invention is shown in Figure 5, and Figure 5 is the laser focus dynamic processing device for realizing the second laser focus dynamic processing method provided by the embodiment of the present invention schematic diagram.

Specifically, a focusing lens 20 is added after the light guide mirror 16, and the focusing lens 20 performs secondary focusing on the focused laser beam output by the dynamic focusing, so as to obtain a smaller focused spot diameter and realize drilling smaller hole diameters and Narrower cut and weld widths.

The working method of the laser focus dynamic processing device for realizing the second laser focus dynamic processing method shown in FIG. 5 is the same as that of the device described in FIG. 3 .

One of the above laser focus dynamic processing methods and the second two laser focus dynamic processing method devices have a common feature that the laser beam does not move, but the xy table drives the workpiece to move to form a laser processing track.

Embodiment 3 of the present invention: In order to overcome the problems of slow laser processing speed and the inability to realize dynamic spiral or concentric circle drilling and swing processing of laser focus, the present invention provides Embodiment 3. The third laser focus dynamic processing method refers to the laser focus dynamic spiral or concentric drilling and swing processing methods.

Among them, Figure 8 is the third dynamic processing method of laser focus provided by the embodiment of the present invention: a schematic diagram of dynamic drilling of spiral laser focus; Figure 9 is the third dynamic processing method of laser focus provided by the embodiment of the present invention: concentric circle laser focus Schematic diagram of dynamic drilling; FIG. 10 is a schematic diagram of the third laser focus dynamic processing method provided by the embodiment of the present invention: swing laser focus dynamic processing.

FIG. 6 is a device for implementing the third method of laser focus dynamic processing provided by an embodiment of the present invention. It can be seen from the figure that an xy two-dimensional scanning galvanometer 25 is added behind the dynamic focusing mirror 12 . The focused laser beam output from the dynamic focusing mirror is focused on a certain position of the workpiece 2 after passing through the xy two-dimensional scanning galvanometer 25 . Since the xy two-dimensional scanning galvanometer 25 is composed of x-direction and y-direction reflectors, it can be used to control the laser beam to scan the processing track on the xy plane. It has light weight and small inertia, and can realize high-speed scanning processing on the xy plane. graphics.

When the device in this embodiment is working, the industrial computer 18 simultaneously controls the laser 10 , the rectilinear reciprocating mechanism 15 in the dynamic focusing mirror 12 , the xy table 17 and the two-dimensional scanning vibrating mirror 25 .

If it is necessary to obtain a smaller laser focusing spot diameter, a scanning focusing field lens 26 with a suitable focal length can be installed at the output port of the xy two-dimensional scanning galvanometer 25 to refocus the focused laser beam output by the dynamic focusing mirror 12, as shown in the figure 7. Fig. 7 is another device for implementing the third method of laser focus dynamic processing provided by the embodiment of the present invention. On the basis of the device shown in Fig. 6, this device performs secondary focusing on the focused laser beam, and its beam diameter is smaller , for welding or slitting with smaller diameter or smaller width.

The operating principle of the device in this embodiment is: when the laser focus is dynamically drilled, the industrial computer 18 controls the laser 10 to emit a laser beam and controls the linearly reciprocating mechanism 15 in the dynamic focusing mirror 12 to drive the negative focusing lens 13 to the center at a certain speed. Moving forward or backward in a straight line, while the xy two-dimensional scanning galvanometer 25 controls the scanning trajectory of the focused laser beam on the xy plane, thereby realizing the dynamic drilling of the spiral laser focus (as shown in Figure 8) or the dynamic drilling of the concentric circle laser focus (See Figure 9).

After the scanning galvanometer 25 scans the field, the industrial computer 18 controls the xy table 17 to move the workpiece 2 to the new scanning galvanometer 25 and continues the drilling process until the drilling process is completed.

During the dynamic cutting, etching, scribing or welding of the laser focus, the industrial computer 18 controls the laser 10 to emit the laser beam and controls the rectilinear reciprocating mechanism 15 in the dynamic focusing mirror 12 to drive the negative focusing lens 13 to reciprocate at a certain frequency At the same time, the xy two-dimensional scanning galvanometer 25 controls the scanning trajectory of the focused laser beam on the xy plane, which can realize the dynamic cutting, etching, scribing or welding processing of the swinging laser focus (see Figure 10). After the scanning galvanometer 25 scans the field, the industrial computer 18 controls the xy workbench 17 to move the workpiece 2 to the new scanning galvanometer 25 and continues the laser processing until the entire workpiece is processed.

In order to further illustrate the superiority of the processing method of the present invention, the method of the present invention will be described in detail below in conjunction with specific processing examples.

Example 1:

One of the specific embodiments of the present invention is used to perform laser focus dynamic drilling on Al ₂ O ₃ ceramic materials with a thickness of 1 mm.

The laser source in the laser focus dynamic drilling system is a pulsed laser with a pulse width of 25ns, a repetition rate of 100kHz, a wavelength of 1064nm, and an output power of 50W. The range of the movable negative focusing lens in the dynamic focusing mirror is 2mm, and the diameter of the laser focusing spot is 50μm. And it can move 20mm along the optical axis. Position the laser focus on the surface of the material to be processed, and move the laser focus downward at a speed of 0.5mm/s when drilling.

The experimental results show that the diameter of the small hole obtained in the ceramic is 70 μm, the taper of the hole wall is less than 0.1°, there is no recast layer and microcracks on the hole wall, and the heat affected zone is less than 1 μm. The surface and bottom of the small hole are basically free of debris.

Example 2:

Using the second specific embodiment of the present invention, the soda-lime glass material with a thickness of 20 mm is used for laser focus dynamic thermal crack cutting and separation processing.

The laser source in the laser focus dynamic cutting system is a continuous laser with a wavelength of 1064nm and an output power of 100W. The range of the movable negative focus lens in the dynamic focus mirror is 5mm, and the laser focus spot diameter is 0.1mm and can move along the optical axis within a range of 50mm. . The laser focus is located in the middle of the material to be processed, and the laser focus is set to move up and down with an amplitude of 2 mm and a frequency of 50 Hz during the thermal crack cutting and separation process.

The experimental results show that the glass separation cut is smooth and steep, without chipping, the end surface of the cut is smooth and smooth, and can be cut and separated with a certain curvature.

Example 3:

Using the third specific embodiment of the present invention, the laser scanning type focus dynamic drilling of small holes with a diameter of 1 mm is performed on the Al ₂ O ₃ ceramic material with a thickness of 2 mm.

The laser source in the laser focus dynamic drilling system is a pulsed laser with a pulse width of 25ns, a repetition rate of 500kHz, a wavelength of 1064nm, and an output power of 50W. The range of the movable negative focusing lens in the dynamic focusing mirror is 2mm, and the diameter of the laser focusing spot is 10μm. And it can move 20mm along the optical axis. Position the laser focus on the surface of the material to be processed, set the laser focus to move downward at a speed of 1mm/s, and scan at a speed of 1m/s.

The experimental results show that the diameter of the small hole obtained in the ceramic is 1.02mm, the taper of the hole wall is less than 0.01°, there is no recast layer and microcracks on the hole wall, and the heat affected zone is less than 0.5m. There is no residue on the surface and bottom of the small hole.

It is easy for those skilled in the art to understand that the above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention, All should be included within the protection scope of the present invention.

Claims (9)

1. A kind of 1. laser spot dynamic machining method, it is characterised in that in process, laser spot hot spot is along optical axis to set Speed dynamic mobile.
2. 2. a kind of laser spot dynamic machining method as claimed in claim 1, it is characterised in that laser spot hot spot is to set Speed moved downward or upward along workpiece to be processed thickness optical axis direction.
3. 3. a kind of laser spot dynamic machining method as claimed in claim 1, it is characterised in that laser spot hot spot is to set Frequency linearity movement, or warble of the laser spot hot spot to set, or frequency spiral of the laser spot hot spot to set Formula moves up and down.
4. 4. realize the laser spot dynamic machining device of the method as described in one of claim 1-2, it is characterised in that it includes Laser (10), beam-expanding collimation mirror (11), dynamic focusing mirror (12), guide-lighting mirror (16), can straight line back and forth movement mechanism (15), xy Workbench (17) and industrial computer (18), wherein,

   Dynamic focusing mirror (12) includes positive and negative focusing microscope group (14) and a piece of negative focusing eyeglass (13),

   Xy workbench (17) is used to carry workpiece to be processed (2), and negative focusing eyeglass (13) is arranged on can straight line back and forth movement mechanism (15) on, moved linearly with energy edge,

   Industrial computer (18) at the same with laser (10), can straight line back and forth movement mechanism (15) and xy workbench (17) be connected, with Can control respectively laser (10) switch, can the movement of straight line back and forth movement mechanism (15) and the movement of xy workbench (17),

   The side for the laser beam axis that beam-expanding collimation mirror (11), dynamic focusing mirror (12), guide-lighting mirror (16) are launched along laser (10) To setting gradually,

   Guide-lighting mirror (16) is used for the laser reflection of laser (10) transmitting to workpiece to be processed (2).
5. 5. laser spot dynamic machining device as claimed in claim 4, it is characterised in that perform dynamic boring in laser spot During processing, industrial computer (18) control laser (10) send laser beam and control in dynamic focusing mirror (12) can straight line come and go fortune Motivation structure (15) drives negative focusing eyeglass (13) to be moved along a straight line forward or backward with the speed of setting,

   So that laser spot (1) is moved up or down with thickness optical axis direction of the speed of setting along workpiece to be processed (2), The processing of laser spot dynamic boring is completed,

   Then, industrial computer (18) controls the mobile workpiece to be processed (2) of xy workbench (17) to arrive another position again, repeats to swash above Optical focus dynamic boring procedure, until completing all Drilling operations.
6. 6. laser spot dynamic machining device as claimed in claim 4, it is characterised in that also including focus lamp (20), focus on Mirror (20) is arranged on guide-lighting mirror (16) lower end, and focus lamp (20) is used to carry out secondary gather to the focusing laser beam of dynamic focusing output Jiao, to obtain smaller focal beam spot diameter, so as to bore the hole of smaller diameter for realizing or realize narrower cutting and weldering Seam.
7. 7. realize the laser spot dynamic machining device of the method as described in one of claim 1-3, it is characterised in that it includes Laser (10), beam-expanding collimation mirror (11), dynamic focusing mirror (12), can straight line back and forth movement mechanism (15), xy bidimensionals scanning shake Mirror (25), xy workbench (17) and industrial computer (18), wherein,

   Dynamic focusing mirror (12) includes positive and negative focusing microscope group (14) and a piece of negative focusing eyeglass (13),

   Xy workbench (17) is used to carry workpiece to be processed (2), and negative focusing eyeglass (13) is arranged on can straight line back and forth movement mechanism (15) on, moved linearly with energy edge,

   Industrial computer (18) at the same with laser (10), can straight line back and forth movement mechanism (15), xy bidimensionals scanning galvanometer (25) and Xy workbench (17) is connected, with can control respectively the switch of laser (10), can straight line back and forth movement mechanism (15) movement, The movement of xy bidimensionals scanning galvanometer (25) and the movement of xy workbench (17),

   The laser light that beam-expanding collimation mirror (11), dynamic focusing mirror (12), xy bidimensionals scanning galvanometer (25) are launched along laser 10 The direction of axle is set gradually,

   The focusing laser beam focus that xy bidimensionals scanning galvanometer (25) is used to export from dynamic focus lamp is in workpiece to be processed (2) Setting position,

   Xy bidimensionals scanning galvanometer (25) is made up of x directions reflecting optics and y directions reflecting optics, for controlling laser beam in xy Flat scanning machining locus.
8. 8. laser spot dynamic machining device as claimed in claim 7, it is characterised in that also include

   Scanning focused field lens (26), scanning focused field lens (26) are arranged on xy bidimensionals scanning galvanometer (25) lower end, for dynamic The focusing laser beam of focus lamp (12) output carries out secondary focusing, to obtain smaller focal beam spot diameter, so as to for reality Now bore the hole of smaller diameter or realize narrower cutting and weld seam.
9. 9. the laser spot dynamic machining device as described in claim 4 or 7, it is characterised in that positive and negative focusing microscope group (14) is extremely Include a piece of negative focusing eyeglass and a piece of positive focusing lens less.