CN107435162A - A kind of environment-friendly type electroplanting device - Google Patents
A kind of environment-friendly type electroplanting device Download PDFInfo
- Publication number
- CN107435162A CN107435162A CN201710895729.3A CN201710895729A CN107435162A CN 107435162 A CN107435162 A CN 107435162A CN 201710895729 A CN201710895729 A CN 201710895729A CN 107435162 A CN107435162 A CN 107435162A
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- China
- Prior art keywords
- electroplating pool
- electroplate liquid
- reaction chamber
- sedimentation basin
- environment
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Links
- 238000009713 electroplating Methods 0.000 claims abstract description 53
- 239000007788 liquid Substances 0.000 claims abstract description 53
- 238000006243 chemical reaction Methods 0.000 claims abstract description 51
- 239000000463 material Substances 0.000 claims abstract description 24
- 238000004062 sedimentation Methods 0.000 claims abstract description 24
- 239000010405 anode material Substances 0.000 claims abstract description 23
- 238000001914 filtration Methods 0.000 claims abstract description 16
- 238000001223 reverse osmosis Methods 0.000 claims abstract description 15
- 150000001875 compounds Chemical class 0.000 claims abstract description 12
- 230000005540 biological transmission Effects 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 241000883990 Flabellum Species 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 8
- 239000010453 quartz Substances 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 2
- 239000010865 sewage Substances 0.000 abstract description 11
- 238000007599 discharging Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910021645 metal ion Inorganic materials 0.000 description 6
- 239000010802 sludge Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 230000007613 environmental effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000006386 neutralization reaction Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000006004 Quartz sand Substances 0.000 description 2
- 239000013543 active substance Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 235000013312 flour Nutrition 0.000 description 2
- 229910001385 heavy metal Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000003204 osmotic effect Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241001075561 Fioria Species 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 208000031320 Teratogenesis Diseases 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 230000000711 cancerogenic effect Effects 0.000 description 1
- 231100000315 carcinogenic Toxicity 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 244000005700 microbiome Species 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000037023 motor activity Effects 0.000 description 1
- 231100000219 mutagenic Toxicity 0.000 description 1
- 230000003505 mutagenic effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000009287 sand filtration Methods 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 231100000167 toxic agent Toxicity 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/06—Filtering particles other than ions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
Abstract
The invention discloses a kind of environment-friendly type electroplanting device,Electroplating pool is provided with device body,One end of the inside of electroplating pool is provided with first anode material,The other end of the inside of electroplating pool is provided with second plate material,Electronplate is provided between first anode material and second plate material,Compound filter bag is provided with first anode material and second plate material,The top of first anode material and second plate material is provided with anode contact,The top of electronplate is provided with negative contacts,Electroplating pool is internally provided with electroplate liquid,The side of electroplating pool is provided with liquid outlet,Liquid outlet one end is provided with shifting pump,Structure of the present invention is novel,It is easy to operate,The pH value of electroplating sewerage can be effectively adjusted by reaction chamber,Pass through the filtering of sedimentation basin and reverse osmosis filter afterwards,Sewage can be made to reach discharge standard,And by the regulation of electroplate liquid reaction tank sewage can be made to recycle again,Discharge meets discharging standards and recycles electroplate liquid,Economical environment-protective.
Description
Technical field
The present invention relates to electroplanting device, and in particular to a kind of environment-friendly type electroplanting device.
Background technology
At present, electroplating technology is widely applied to various different purposes with field, seeming that the decoration based on attractive in appearance is used
Way is, for example, to have glossiness film in formation on vessel surface, or applied in high-tech industry.Electroplanting device is usual
Including components such as electroplating bath, electroplate liquid, negative electrode, anode, thing to be plated and plating metals, wherein thing to be plated connects negative electrode, plating
Metal jointed anode.When bestowing applied voltage between negative electrode and anode, plating metal can separate out positively charged plating metal from
Son, and the electronics that thing surface aggregation to be plated is negatively charged.Plating metal ion is attracted and treated by electroplate liquid to flow to by electronics
Plate thing surface, with thing surface to be plated and electronics with reference to and be deposited on formation plated film in thing surface to be plated.General plating processing is main
Through electrolytic process, between anode and negative electrode after input voltage, the metal ion in electroplate liquid is attracted to swim to negative electrode, and reduce
Plate afterwards on the plated body to be continued in negative electrode, while the metal that anode is continued is redissolved, there is provided the more metals of electroplate liquid
Ion, make electrolytic process continue to carry out, untill enough coating is deposited on plated body, but can be discharged in electroplating process big
The electroplating sewerage of amount, the water quality of electroplating sewerage is complicated, and composition is difficult to control, wherein the chromium contained, copper, nickel, cadmium, zinc, gold, silver etc.
The toxicity such as heavy metal ion and cyanide is larger, and some belong to carcinogenic, teratogenesis, mutagenic extremely toxic substance, endanger pole to the mankind
Greatly, the not disposable electroplating sewerage of current electroplanting device, feature of environmental protection extreme difference.
The content of the invention
The technical problem that to solve of invention is to overcome the not disposable electroplating sewerage of existing electroplanting device, feature of environmental protection extreme difference
A kind of problem, there is provided environment-friendly type electroplanting device.
In order to solve the above-mentioned technical problem, the invention provides following technical scheme：
The invention provides a kind of environment-friendly type electroplanting device, electroplating pool, the electroplating pool are provided with described device body
One end of inside be provided with first anode material, the other end of the inside of the electroplating pool is provided with second plate material, institute
State and electronplate is provided between first anode material and the second plate material, the first anode material and second sun
It is provided with compound filter bag on the material of pole, the top of the first anode material and the second plate material is provided with anode and connect
Point, the top of the electronplate are provided with negative contacts, and the electroplating pool is internally provided with electroplate liquid, and the one of the electroplating pool
Side is provided with liquid outlet, and described liquid outlet one end is provided with shifting pump, and one end of the shifting pump is provided with reaction chamber, described anti-
The top of case is answered to be provided with motor, the bottom of the motor is provided with power transmission shaft, some flabellums is provided with the power transmission shaft,
The both sides of the motor are provided with the first charge door, and the side of the reaction chamber is provided with sedimentation basin, and the one of the sedimentation basin
Side is provided with sludge outlet, and the top inside the sedimentation basin is provided with quartz filter, is set inside the sedimentation basin
There is the other end to be provided with filtering ponds, connector, the filtering ponds are provided between the filtering ponds and the quartz filter
Be internally provided with some screen packs, the other end of the sedimentation basin is provided with reverse osmosis filter, the reverse osmosis filter
Side be provided with electroplate liquid reaction tank, the top of the electroplate liquid reaction tank is provided with high-pressure pump, the side of the high-pressure pump
The second charge door is provided with, the opposite side of the electroplating pool is provided with inlet.
As a preferred technical solution of the present invention, the electroplate liquid reaction tank is consolidated by connecting tube and the inlet
Surely the electroplating pool is connected, the electroplating pool is fixedly connected with the reaction chamber, the reaction with the connecting tube by liquid outlet
Connected between case, the sedimentation basin, the reverse osmosis filter and the electroplate liquid reaction tank by the connecting tube.
As a preferred technical solution of the present invention, the bottom of the compound filter bag is provided with air inlet, the reaction
Case is internally provided with PH detection meters, and the motor activity connects the power transmission shaft, and the flabellum is fixedly connected by welding institute
State power transmission shaft.
As a preferred technical solution of the present invention, some mesh are provided with the screen pack.
As a preferred technical solution of the present invention, first charge door is fixedly connected with the reaction chamber, and described
Two charge doors are fixedly connected with the electroplate liquid reaction tank.
The beneficial effect that is reached of the present invention is：Structure of the present invention is novel, easy to operate, can be fine by compound filter bag
Electroplating processes are carried out to electronplate, and the pH value of electroplating sewerage can be effectively adjusted by reaction chamber, pass through sedimentation basin afterwards
With the filtering of reverse osmosis filter, sewage can be made to reach discharge standard, and can make sewage by the regulation of electroplate liquid reaction tank
Recycle again, reduce the discharge capacity of electroplanting device, discharge meets discharging standards and recycles electroplate liquid, saves
Environmental protection.
Brief description of the drawings
Accompanying drawing is used for providing a further understanding of the present invention, and a part for constitution instruction, the reality with the present invention
Apply example to be used to explain the present invention together, be not construed as limiting the invention.In the accompanying drawings：
Fig. 1 is the agent structure schematic diagram of the present invention；
In figure：1st, device body；2nd, inlet；3rd, compound filter bag；4th, first anode material；5th, electronplate；6th, the second sun
Pole material；7th, electroplate liquid；8th, air inlet；9th, liquid outlet；10th, the first charge door；11st, motor；12nd, shifting pump；13rd, flabellum；14、
Reaction chamber；15th, power transmission shaft；16th, connecting tube；17th, sedimentation basin；18th, sludge outlet；19th, reverse osmosis filter；20th, electroplate liquid
Reaction tank；21st, the second charge door；22nd, high-pressure pump；23rd, electroplating pool；24th, cathode contact；25th, anode contact；26th, screen pack；
27th, quartz filter；28th, filtering ponds；29th, connector.
Specific implementation
The preferred embodiments of the present invention are illustrated below in conjunction with accompanying drawing, it will be appreciated that described herein preferred real
Apply example to be merely to illustrate and explain the present invention, be not intended to limit the present invention.
Embodiment 1
As Fig. 1 shows, the invention provides a kind of environment-friendly type electroplanting device, electroplating pool 23 is provided with device body 1, is electroplated
One end of the inside in pond 23 is provided with first anode material 4, and the other end of the inside of electroplating pool 23 is provided with second plate material
6, electronplate 5, first anode material 4 and second plate material 6 are provided between first anode material 4 and second plate material 6
On be provided with compound filter bag 3, the top of first anode material 4 and second plate material 6 is provided with anode contact 25, electronplate 5
Top be provided with negative contacts 24, electroplating pool 23 is internally provided with electroplate liquid 7, and the side of electroplating pool 23 is provided with liquid outlet
9, the one end of liquid outlet 9 is provided with shifting pump 12, and one end of shifting pump 12 is provided with reaction chamber 14, and the top of reaction chamber 14 is provided with
Motor 11, the bottom of motor 11 are provided with power transmission shaft 15, some flabellums 13 are provided with power transmission shaft 15, and the both sides of motor 11 are equal
The first charge door 10 is provided with, the side of reaction chamber 14 is provided with sedimentation basin 17, and the side of sedimentation basin 17 is provided with sludge discharge
Mouthfuls 18, the top inside sedimentation basin 17 is provided with quartz filter 27, and sedimentation basin 17 is internally provided with the other end and was provided with
Filter tank 28, is provided with connector 29 between filtering ponds 28 and quartz filter 27, filtering ponds 28 are internally provided with some mistakes
Filter screen 26, the other end of sedimentation basin 17 are provided with reverse osmosis filter 19, and the side of reverse osmosis filter 19 is provided with electroplate liquid
Reaction tank 20, the top of electroplate liquid reaction tank 20 are provided with high-pressure pump 22, and the side of high-pressure pump 22 is provided with the second charge door 21,
The opposite side of electroplating pool 23 is provided with inlet 2.
Electroplate liquid reaction tank 20 is fixedly connected with electroplating pool 23 by connecting tube 16 with inlet 2, is easy to transmit electroplate liquid
To electroplating pool 23, electroplating pool 23 is fixedly connected with reaction chamber 14 with connecting tube 16 by liquid outlet 9, is easy to electroplating sewerage being transported to
Reaction chamber 14, connected between reaction chamber 14, sedimentation basin 17, reverse osmosis filter 19 and electroplate liquid reaction tank 20 by connecting tube 16
Connect, be easy to the circulation of electroplating sewerage.
The bottom of compound filter bag 3 is provided with air inlet 8, is easy to reduce the damage of first anode material 4 and second plate material 6
Consumption, reaction chamber 14 are internally provided with PH detection meters, are easy to detect the pH value in reaction chamber 14, motor 11 is flexibly connected power transmission shaft
15, flabellum 13 is fixedly connected by welding power transmission shaft 15, is easy to stir electroplating sewerage, so that sewage reaction is rapider.
Some mesh are provided with screen pack 26, the impurity being easy in filter water.
First charge door 10 is fixedly connected with reaction chamber 14, and the second charge door 21 is fixedly connected with electroplate liquid reaction tank 20, is easy to
Chemical material is added in reaction chamber 14 and electroplate liquid reaction tank 20.
During specific work, first anode material 4 and second plate material 6, Zhi Hou are placed in compound filter bag 3 first
After connecting voltage with anode contact 25 by cathode contact 24, after input voltage, the metal ion in electroplate liquid 7 is attracted to swim to the moon
Polar contact 24, and being plated after reducing on the electronplate 5 to be continued in cathode contact 24, at the same anode contact 25 continued the
One anode material 4 and second plate material 6 are redissolved, there is provided 7 more metal ions of electroplate liquid, electrolytic process is persistently entered
OK, untill depositing enough coating on electronplate 5, and enter the air of compound filter bag 3, that is, follow between inside and outside bag body
Gap flow up, except can produce disturbance electroplate liquid 7 effect, accelerate electroplate liquid 7 in metal ion swim to electronplate 5 it
Outside, a relative bubble film for being coated on first anode material 4 and the periphery of second plate material 6 can be more formed, in order to production can be used
The effect barriering effect that organic solvent in raw limitation electroplate liquid 7 contacts with first anode material 4 and second plate material 6, with
Relatively more positive, reliable means reduce first anode material 4 and second plate material 6 consumes and depletion of additive, afterwards
After electroplating sewerage is transferred in reaction chamber 14 by shifting pump 12, alkali is added by the first charge door 10 afterwards, adjusts pH value, respectively
Metal generates corresponding hydroxide sediment under certain pH value, according to we accumulated in the past to electroplating sewerage industry
Process experience, the pH value that combined sewage most preferably precipitates be 9.5, pass through the rotating drive shaft 15 of motor 11, power transmission shaft 15 rotation fan
Leaf 13, the electric rotating plating solution 7 of flabellum 13, alkali and electroplating sewerage is fully merged so as to reach acceleration, afterwards input electroplating sewerage
To sedimentation basin 17, the Guartz filter 27 in sedimentation basin 17 afterwards, Guartz filter 27 it be to be used as filtering to be situated between by the use of quartz sand
Matter, under pressure, the quartz sand filtration the higher water of turbidity by certain thickness granular or non-grain are effective to cut
Stay suspension, organic matter, colloidal particles, microorganism, chlorine, odor and part heavy metal ion removed in water etc., after filter, water outlet
PH or meta-alkalescence, therefore again through PH regulating reservoirs acid adding regulation after can qualified discharge.Sludge after press filtration is discharged by sludge
Mouthfuls 18 discharge, and outward transport afterwards concentrates buried or brickmaking or recovery metal ion or through other harmless treatments, afterwards electroplating sewerage
Filtered in filtering ponds 28 by screen pack 26, the sewage reduced through broken cyanide and chromium is mixed with combined sewage, in filtering ponds
Secondary neutralization precipitation handling process is used in 28, nertralizer is used cooperatively using powder stone flour and sodium hydroxide, a neutralization reaction
Powder stone flour and sodium hydroxide are added, on-line monitoring PH is counted between 7.5~8 by import PH, secondary neutralization reaction uses hydroxide
Sodium simultaneously controls PH between 10~10.5, and electroplating sewerage is transferred into reverse osmosis filter 19 afterwards, and reverse osmosis filter 19 is
One kind isolates the UF membrane operation of solvent using pressure differential as motive force from solution.Pressure is applied to the feed liquid of film side, when
When pressure exceedes its osmotic pressure, solvent can make inverse osmosis against the direction of naturally osmotic.So as to which the low-pressure side in film obtains
The solvent of transmission, i.e. penetrating fluid；The solution that high-pressure side is concentrated, i.e. concentrate, reach most electroplating sewerage and further purify, it
Electroplate liquid reaction tank 20 is transferred to by connecting tube 16 afterwards, conduction is added in electroplate liquid reaction tank 20 by the second charge door 21
Salt, positive active agent and buffer, the electroplating sewerage after purification and conducting salt, positive active agent and buffer is set fully to merge,
Electroplating pool 23 is pumped into by high-pressure pump 22 afterwards, sewage can be made to recycle again, reduces the discharge capacity of electroplanting device, is discharged
Meet discharging standards and recycle electroplate liquid, economical environment-protective.
The beneficial effect that is reached of the present invention is：Structure of the present invention is novel, easy to operate, can be fine by compound filter bag
Electroplating processes are carried out to electronplate, and the pH value of electroplating sewerage can be effectively adjusted by reaction chamber, pass through sedimentation basin afterwards
With the filtering of reverse osmosis filter, sewage can be made to reach discharge standard, and can make sewage by the regulation of electroplate liquid reaction tank
Recycle again, reduce the discharge capacity of electroplanting device, discharge meets discharging standards and recycles electroplate liquid, saves
Environmental protection.
Finally it should be noted that：The preferred embodiment of present invention described above, is not intended to limit the invention, although
The present invention is described in detail with reference to the foregoing embodiments, for those skilled in the art, it still can be right
Technical scheme described in foregoing embodiments is modified, or carries out equivalent substitution to which part technical characteristic.It is all
Within the spirit and principles in the present invention, any modification, equivalent substitution and improvements made etc., the protection of the present invention should be included in
Within the scope of.
Claims (5)
1. a kind of environment-friendly type electroplanting device, including device body (1), it is characterised in that described device body is provided with electricity on (1)
Plate pond (23), one end of the inside of the electroplating pool (23) is provided with first anode material (4), the inside of the electroplating pool (23)
The other end be provided with second plate material (6), set between the first anode material (4) and the second plate material (6)
Electronplate (5) is equipped with, compound filter bag (3), institute are provided with the first anode material (4) and the second plate material (6)
The top for stating first anode material (4) and the second plate material (6) is provided with anode contact (25), the electronplate (5)
Top be provided with negative contacts (24), the electroplating pool (23) is internally provided with electroplate liquid (7), the electroplating pool (23)
Side is provided with liquid outlet (9), and described liquid outlet (9) one end is provided with shifting pump (12), and one end of the shifting pump (12) is set
Reaction chamber (14) is equipped with, the top of the reaction chamber (14) is provided with motor (11), and the bottom of the motor (11) is provided with biography
Moving axis (15), some flabellums (13) is provided with the power transmission shaft (15), the both sides of the motor (11) are provided with first
Charge door (10), the side of the reaction chamber (14) are provided with sedimentation basin (17), and the side of the sedimentation basin (17) is provided with dirt
Mud outlet (18), the internal top of the sedimentation basin (17) are provided with quartz filter (27), and the sedimentation basin (17) is interior
Portion is provided with the other end and is provided with filtering ponds (28), is provided between the filtering ponds (28) and the quartz filter (27)
Connector (29), the filtering ponds (28) are internally provided with some screen packs (26), and the other end of the sedimentation basin (17) is set
Reverse osmosis filter (19) is equipped with, the side of the reverse osmosis filter (19) is provided with electroplate liquid reaction tank (20), the electricity
The top of plating solution reaction tank (20) is provided with high-pressure pump (22), and the side of the high-pressure pump (22) is provided with the second charge door
(21), the opposite side of the electroplating pool (23) is provided with inlet (2).
2. a kind of environment-friendly type electroplanting device according to claim 1, it is characterised in that the electroplate liquid reaction tank (20) is logical
Cross connecting tube (16) and be fixedly connected with the electroplating pool (23) with the inlet (2), the electroplating pool (23) by it is described go out liquid
Mouth (9) is fixedly connected with the reaction chamber (14), the reaction chamber (14), the sedimentation basin (17), institute with the connecting tube (16)
State and connected between reverse osmosis filter (19) and the electroplate liquid reaction tank (20) by the connecting tube (16).
A kind of 3. environment-friendly type electroplanting device according to claim 1, it is characterised in that the bottom of the compound filter bag (3)
Air inlet (8) is provided with, the reaction chamber (14) is internally provided with PH detection meters, and the motor (11) is flexibly connected the biography
Moving axis (15), the flabellum (13) are fixedly connected by welding the power transmission shaft (15).
4. a kind of environment-friendly type electroplanting device according to claim 1, it is characterised in that be provided with the screen pack (26)
Some mesh.
5. a kind of environment-friendly type electroplanting device according to claim 1, it is characterised in that first charge door (10) is fixed
The reaction chamber (14) is connected, second charge door (21) is fixedly connected with the electroplate liquid reaction tank (20).
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| CN108103563A (en) * | 2018-02-08 | 2018-06-01 | 遵义市汇川区吉美电镀有限责任公司 | A kind of plating deslagging device |
| CN108950624A (en) * | 2018-08-28 | 2018-12-07 | 王志伟 | A kind of connection rod of automobile engine automation electro-brush plating reparation liquid purification process |
| CN112495691A (en) * | 2020-10-27 | 2021-03-16 | 南京科赫科技有限公司 | Material deep coating device for gas purification |
| CN113265693A (en) * | 2020-06-15 | 2021-08-17 | 台湾积体电路制造股份有限公司 | Treatment system and method for treating an electrochemical plating bath |
| CN114045548A (en) * | 2021-12-23 | 2022-02-15 | 江苏舒扬智能装备有限公司 | But perpendicular continuous electroplating equipment |
| CN116288292A (en) * | 2023-03-20 | 2023-06-23 | 聂柱根 | Chemical tin liquid tin reduction regeneration copper removal device |
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| CN108103563A (en) * | 2018-02-08 | 2018-06-01 | 遵义市汇川区吉美电镀有限责任公司 | A kind of plating deslagging device |
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| CN114045548A (en) * | 2021-12-23 | 2022-02-15 | 江苏舒扬智能装备有限公司 | But perpendicular continuous electroplating equipment |
| CN116288292A (en) * | 2023-03-20 | 2023-06-23 | 聂柱根 | Chemical tin liquid tin reduction regeneration copper removal device |
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