CN107427743A - The degassing decision method for the treatment of fluid - Google Patents
The degassing decision method for the treatment of fluid Download PDFInfo
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- 238000011282 treatment Methods 0.000 title claims abstract description 100
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- 239000001301 oxygen Substances 0.000 description 20
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- 238000007747 plating Methods 0.000 description 19
- 230000008034 disappearance Effects 0.000 description 12
- 238000010943 off-gassing Methods 0.000 description 9
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D19/00—Degasification of liquids
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/04—Removal of gases or vapours ; Gas or pressure control
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
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- Chemical & Material Sciences (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
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- Organic Chemistry (AREA)
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Abstract
Description
技术领域technical field
本发明涉及在处理在表面具有由槽、孔构成的精细图案的作业对象物时,判定对处理液的脱气程度的处理液的脱气判定方法。The present invention relates to a method for judging the degassing of a treatment liquid for judging the degree of degassing of the treatment liquid when processing an object having a fine pattern of grooves and holes on its surface.
背景技术Background technique
在半导体电路装置、多层结构的电路基板等的加工中,进行使用电镀、蚀刻等的处理液的处理,为了提高精细加工的精度,进行除去溶存于这些处理液的液体中的溶存气体。作为用于除去溶存气体的装置,使用在液体供给线插入脱气模块,并在该脱气模块连接与真空泵连接的真空吸引线,并使真空泵工作的脱气装置。脱气模块例如具有使使用了中空纤维的气体分离膜的外侧为真空状态而进行规定的脱气的结构(例如,参照专利文献1、2)。In the processing of semiconductor circuit devices and multilayer circuit boards, etc., treatment using treatment liquids such as plating and etching is performed, and dissolved gases dissolved in the liquids of these treatment liquids are removed in order to improve the accuracy of fine processing. As a device for removing dissolved gas, a degassing device is used that inserts a degassing module into a liquid supply line, connects a vacuum suction line connected to a vacuum pump to the degassing module, and operates the vacuum pump. The degassing module has, for example, a structure in which a predetermined degassing is performed by placing the outside of a gas separation membrane using a hollow fiber in a vacuum state (see, for example, Patent Documents 1 and 2).
专利文献1:日本专利第4043192号公报Patent Document 1: Japanese Patent No. 4043192
专利文献2:日本特开平9-85012号公报Patent Document 2: Japanese Patent Application Laid-Open No. 9-85012
在这样的具备脱气装置的装置中,已知有具有在处理液的循环路径配置溶氧浓度传感器,并根据该溶氧浓度传感器指示的值测定溶存于处理液的氧浓度作为脱气程度的机构的装置。然而,例如,在专利文献1所记载的脱气装置中,溶氧浓度传感器的位置在循环的处理液的路径上,在脱气模块的紧前面,不是测定在处理槽循环并且滞留的处理液本身的溶氧浓度,而测定溢出槽本身的来自捕集槽的处理液的溶氧浓度。因此测定在捕集槽卷入了气泡的状态下的处理液的溶氧浓度,所以并不是测定实际的处理液的溶存气体浓度。In such a device equipped with a degassing device, it is known to have a dissolved oxygen concentration sensor arranged in the circulation path of the treatment liquid, and measure the oxygen concentration dissolved in the treatment liquid as the degree of degassing based on the value indicated by the dissolved oxygen concentration sensor. Mechanism device. However, for example, in the degassing device described in Patent Document 1, the position of the dissolved oxygen concentration sensor is on the path of the circulating treatment liquid, immediately before the degassing module, and does not measure the treatment liquid circulating and stagnant in the treatment tank. The dissolved oxygen concentration of itself is measured, and the dissolved oxygen concentration of the treatment liquid from the catch tank overflowing the tank itself is measured. Therefore, since the dissolved oxygen concentration of the treatment liquid was measured in a state where air bubbles were entangled in the trap tank, the actual dissolved gas concentration of the treatment liquid was not measured.
另外,在专利文献2所记载的装置中,液体中的溶存气体浓度的传感器的位置虽然是在脱气装置与脱气液处理部之间配置传感器,但同样地是在从液体供给线分支的位置配置传感器,所以只是测定间接的溶氧浓度,例如,在需要多个种类的气体,氧气和氮气双方的浓度的情况下,需要增加该数目的传感器,并且测定也产生时滞。In addition, in the device described in Patent Document 2, although the position of the sensor of the dissolved gas concentration in the liquid is to arrange the sensor between the degasser and the degassed liquid processing unit, it is also branched from the liquid supply line. Sensors are arranged at positions, so only the indirect dissolved oxygen concentration is measured. For example, when the concentration of both oxygen and nitrogen is required for multiple types of gases, it is necessary to increase the number of sensors, and the measurement also has a time lag.
发明内容Contents of the invention
因此,本发明的处理液的脱气判定方法的目的在于提供不管气体的种类等而可靠地判定用于处理在表面具有由槽、孔构成的精细图案的作业对象物的处理液的脱气程度的处理液的脱气判定方法。Therefore, the purpose of the degassing determination method of the processing liquid of the present invention is to provide a method for reliably determining the degree of degassing of the processing liquid for processing an object having a fine pattern of grooves and holes on the surface regardless of the type of gas. The degassing determination method of the treatment liquid.
为了解决上述的技术课题,本发明的处理液的脱气判定方法的特征在于,在进行用于处理在表面具有由槽、孔构成的精细图案的作业对象物的处理液所包含的气体的脱气的脱气处理槽内,浸渍用于判定该脱气处理槽内的上述处理液的脱气程度的在表面具备具有需要的凹凸的精细图案的模拟作业对象物,根据该模拟作业对象物的表面状态的时间变化,判定上述处理液的脱气程度。In order to solve the above-mentioned technical problems, the method for judging degassing of a processing liquid according to the present invention is characterized in that the degassing of the gas contained in the processing liquid for processing an object having a fine pattern of grooves and holes on the surface is carried out. In the degassing treatment tank of gas, immerse a simulated work object having a fine pattern of concavity and convexity on the surface for judging the degree of degassing of the above-mentioned treatment liquid in the degassing treatment tank, according to the simulated work object The time change of the surface state is used to determine the degree of degassing of the treatment liquid.
根据本发明,在进行处理液所包含的气体的脱气的脱气处理槽内浸渍具备具有需要的凹凸的精细图案的模拟作业对象物,所以能够直接地测定处理液的脱气程度,实现不管气体的种类,而测定没有测定的时滞等的可靠的上述处理液的脱气程度。According to the present invention, the simulated work object having a fine pattern of concavo-convexity is dipped in the degassing treatment tank for degassing the gas contained in the treatment liquid. The type of gas is used to measure the degree of degassing of the above-mentioned treatment liquid reliably without measurement time lag or the like.
附图说明Description of drawings
图1是表示使用本发明的第一实施方式的处理液的脱气判定方法的电镀装置的构成例的示意图。FIG. 1 is a schematic diagram showing a configuration example of a plating apparatus using a method for determining degassing of a treatment liquid according to a first embodiment of the present invention.
图2是将本发明的第一实施方式的处理液的脱气判定方法所使用的模拟作业对象物的一个例子的主要部分部分地折断示出的立体图。2 is a perspective view partially broken away showing main parts of an example of a simulated work object used in the method for determining degassing of a treatment liquid according to the first embodiment of the present invention.
图3是表示图2所示的模拟作业对象物的一个例子的脱气程度的测定时的时间变化的示意图。FIG. 3 is a schematic diagram showing time changes during measurement of an outgassing degree of an example of the simulated work object shown in FIG. 2 .
图4是表示处理液中的溶氧浓度与到模拟作业对象物变化为止的时间的关系的图表。4 is a graph showing the relationship between the dissolved oxygen concentration in the treatment liquid and the time until the simulated work object changes.
图5是表示使用本发明的第二实施方式的处理液的脱气判定方法的电镀装置的构成例的示意图。5 is a schematic diagram showing a configuration example of a plating apparatus using a method for determining degassing of a treatment liquid according to a second embodiment of the present invention.
图6是表示使用本发明的第三实施方式的处理液的脱气判定方法的处理装置的构成例的示意图。6 is a schematic diagram showing a configuration example of a treatment device using a method for determining outgassing of a treatment liquid according to a third embodiment of the present invention.
具体实施方式detailed description
第一实施方式first embodiment
参照附图对本发明的第一实施方式所涉及的处理液的脱气判定方法进行说明。本实施方式是对电镀工序的预处理用的液体进行脱气的例子,是浸渍在表面具备具有需要的凹凸的精细图案的模拟作业对象物,并在短时间进行可靠的判定的方法。此外,本发明作为用于处理在表面具有由槽、孔构成的精细图案的作业对象物的处理液,并不限定于电镀的预处理液,也能够应用于其它的需要脱气的各种处理液,例如,当然也能够应用于半导体制造工序、其它的电子部件工序所使用的显影液、漂洗液、光致抗蚀剂液、清洗液、蚀刻液、抗蚀剂除去液、电解液、各种药液等。The degassing determination method of the treatment liquid according to the first embodiment of the present invention will be described with reference to the drawings. This embodiment is an example of degassing the pretreatment liquid in the electroplating process, and is a method of immersing a simulated object having a fine pattern of unevenness on the surface and making a reliable determination in a short time. In addition, the present invention is not limited to a pretreatment solution for electroplating as a treatment solution for treating an object having a fine pattern of grooves and holes on the surface, and can also be applied to various other treatments that require degassing. For example, of course, it can also be applied to developing solutions, rinsing solutions, photoresist solutions, cleaning solutions, etching solutions, resist removing solutions, electrolyte solutions, various Medicinal solution, etc.
图1是表示使用第一实施方式的处理液的脱气判定方法的电镀装置的构成例的示意图。成为在作为预处理槽的脱气处理槽10循环地储存有电镀的预处理液Q1的结构,例如具有也能够充分地浸渍直径300mm的半导体晶圆的尺寸。在脱气处理槽10的周围设有用于收集溢出的预处理液Q1的捕集槽12。来自捕集槽12的预处理液Q1经由送液泵14和温度调节器16送至过滤器18,通过过滤器18的预处理液Q1经由脱气膜模块26、和流量计30循环至脱气处理槽10。FIG. 1 is a schematic diagram showing a configuration example of a plating apparatus using a method for determining degassing of a treatment liquid according to a first embodiment. The degassing treatment tank 10 serving as a pretreatment tank is configured to store the electroplating pretreatment liquid Q1 in circulation, and has a size that can sufficiently immerse a semiconductor wafer with a diameter of 300 mm, for example. Around the degassing treatment tank 10, a collection tank 12 for collecting the overflowed pretreatment liquid Q1 is provided. The pretreatment liquid Q 1 from the catch tank 12 is sent to the filter 18 via the liquid delivery pump 14 and the temperature regulator 16, and the pretreatment liquid Q 1 passed through the filter 18 is circulated to the Degassing tank 10.
脱气装置由脱气膜模块26和与其连接的真空泵28构成,脱气膜模块26通过使用中空纤维膜并通过真空泵28使该膜的外侧为真空状态,来进行预处理液Q1的脱气。通过对预处理液Q1进行脱气,在预处理液Q1浸渍了在表面具备具有需要的凹凸的精细图案的作业对象物W的情况下,残留在作业对象物W的具有需要的凹凸的精细图案内的气泡溶解到该预处理液Q1,其结果预处理液Q1侵入图案内。其后在将作业对象物W浸渍到电镀液Q2的情况下,侵入到作业对象物W的具有需要的凹凸的精细图案的预处理液Q1与电镀液置换,电镀液也充分地侵入微小的凹凸,能够未然防止电镀不良的产生。The degassing device is composed of a degassing membrane module 26 and a vacuum pump 28 connected thereto. The degassing membrane module 26 uses a hollow fiber membrane and the outside of the membrane is vacuumed by the vacuum pump 28 to degas the pretreatment liquid Q1. . By degassing the pretreatment liquid Q1, when the pretreatment liquid Q1 impregnates the work object W having a fine pattern of the desired unevenness on the surface, the surface of the work object W having the desired unevenness remains. Bubbles in the fine pattern dissolve into the pretreatment liquid Q 1 , and as a result, the pretreatment liquid Q 1 intrudes into the pattern. Thereafter, when the object W is immersed in the electroplating solution Q2 , the pretreatment liquid Q1 having a fine pattern of concavities and convexities that invades the object W is replaced with the electroplating solution, and the electroplating solution also sufficiently penetrates into the microscopic surface. The unevenness can prevent the occurrence of poor plating.
图1的右侧的装置是收纳了电镀液Q2的电镀槽40,与作为预处理槽的脱气处理槽10相同,在电镀槽40的周围设有用于收集溢出的电镀液Q2的捕集槽42。来自捕集槽42的电镀处理液Q2经由送液泵44和温度调节器46送至过滤器48,通过过滤器48的电镀处理液Q2经由流量计54循环到电镀槽40。基板保持工具56所保持的作业对象物W浸渍于电镀槽40内的电镀液Q2,并且阳极电极58与作业对象物W对置地配置,在这些阳极电极58与基板保持工具56之间给予电压进行电解电镀。在利用预处理液Q1进行了处理之后用过电镀液Q2进行处理的情况下,在预处理液Q1浸透作业对象物W的表面的微小的凹凸之后电镀液Q2以置换的方式侵入,所以能够未然防止电镀不良的产生。The device on the right side of Fig. 1 is the electroplating tank 40 that has accommodated the electroplating solution Q 2 , is the same as the degassing treatment tank 10 as the pretreatment tank, and is provided with a trap for collecting the overflowing electroplating solution Q 2 around the electroplating tank 40. Sump 42. The electroplating treatment solution Q 2 from the catch tank 42 is sent to the filter 48 through the liquid delivery pump 44 and the temperature regulator 46 , and the electroplating treatment solution Q 2 passing through the filter 48 is circulated to the electroplating tank 40 through the flow meter 54 . The object W held by the substrate holder 56 is immersed in the plating solution Q 2 in the plating tank 40 , and the anode electrodes 58 are arranged to face the object W, and a voltage is applied between the anode electrodes 58 and the substrate holder 56 Perform electrolytic plating. In the case of treating with the overplating solution Q2 after the treatment with the pretreatment solution Q1, the plating solution Q2 penetrates into the surface of the object W by replacement after the pretreatment solution Q1 penetrates into the fine unevenness of the surface. , so it is possible to prevent the occurrence of poor plating.
为了良好地进行预处理,预处理液Q1的溶存气体浓度成为问题,期望正确地测定预处理液Q1的溶存气体浓度的数值。在如以往的装置那样,在预处理液Q1的循环路径配置传感器的装置中,测量捕集之后的预处理液Q1的气体浓度即脱气程度,无法杜绝捕集时的气泡的卷入,而无法正确地测定预处理液Q1本身的脱气程度。In order to pretreat well, the dissolved gas concentration of the pretreatment liquid Q1 becomes a problem, and it is desired to accurately measure the value of the dissolved gas concentration of the pretreatment liquid Q1. In a device in which a sensor is placed in the circulation path of the pretreatment liquid Q1 as in a conventional device, the gas concentration of the pretreatment liquid Q1 after trapping, that is, the degree of degassing, cannot be prevented from entraining air bubbles at the time of trapping. , but cannot correctly measure the degree of degassing of the pretreatment liquid Q 1 itself.
然而,在使用本实施方式的处理液的脱气判定方法的电镀装置中,如图1所示,在表面具备具有需要的凹凸的精细图案的模拟作业对象物20浸渍到脱气处理槽10,并根据形成在该模拟作业对象物20的表面的气泡消失的时间来测定脱气程度。如图2所示,模拟作业对象物20例如具有在板状的由不锈钢等金属、玻璃、或者树脂等材料构成的保持部件22的一面形成了由发泡树脂材料例如树脂制海绵材料等多孔质材料构成的表面部21的结构。形成在表面的气泡表示保持在多孔质材料的表面的空隙并与浸渍配合地附着于表面的气泡。表面部21是用于配置在进行脱气处理的槽内,并根据形成在表面的气泡的消失时间来测量脱气程度的部件,与作业对象物W相同在表面具有凹凸,即使是暂时也需要在该表面保持气泡。因此,不使用具有比较光滑的表面的材料,而形成由发泡树脂材料例如树脂制海绵材等多孔质材料构成的表面部21。期望根据表面部21的多孔质的结构形成的微小的空隙的直径在0.01mm~2.0mm的范围,更优选具有0.1mm~2.0mm的范围的空隙的直径。在空隙的尺寸过小的情况下,难以判定气泡的消失,在如3mm、4mm那样气泡过大的情况下,由于一个一个气泡的消失占据较大的面积,所以在判断时容易产生误差。在脱气处理槽10内浸渍模拟作业对象物20时,使保持于保持部件22的表面部21与保持部件22一起浸渍。However, in the electroplating apparatus using the degassing determination method of the processing liquid of this embodiment, as shown in FIG. The degree of outgassing is measured based on the time until the air bubbles formed on the surface of the simulated work object 20 disappear. As shown in FIG. 2, the simulated work object 20 has, for example, a plate-shaped holding member 22 made of metal such as stainless steel, glass, or resin, and a porous material such as a foamed resin material such as a resin sponge material is formed on one side. The structure of the surface part 21 made of material. The air bubbles formed on the surface mean air bubbles that remain in the voids on the surface of the porous material and adhere to the surface in cooperation with impregnation. The surface part 21 is a part to be placed in a tank for degassing treatment, and to measure the degree of degassing based on the disappearance time of the air bubbles formed on the surface. Like the work object W, it has unevenness on the surface, and it is necessary even temporarily. Air bubbles remain on the surface. Therefore, instead of using a material having a relatively smooth surface, the surface portion 21 is formed of a porous material such as a foamed resin material such as a resin sponge material. The diameter of the fine voids formed by the porous structure of the surface portion 21 is desirably in the range of 0.01 mm to 2.0 mm, and more preferably has a diameter of the voids in the range of 0.1 mm to 2.0 mm. When the size of the void is too small, it is difficult to determine the disappearance of the bubbles. When the bubbles are too large, such as 3mm and 4mm, since the disappearance of each bubble occupies a large area, it is easy to cause errors in judgment. When immersing the dummy work object 20 in the degassing treatment tank 10 , the surface portion 21 held by the holding member 22 is immersed together with the holding member 22 .
在本实施方式中,具有将薄片状的树脂制海绵材划分为矩形形状并粘贴到保持部件22的一面的结构。表面部21的形状并不限定于例示那样的矩形形状,也可以是正方形、其它的多边形、圆形、椭圆形等。另外,虽然对在一个保持部件22形成一个表面部21的例子进行了说明,但也可以排列几个气泡产生的程度不同的多个薄片构成表面部21。另外,也能够以能够更换的方式在保持部件22安装表面部21。构成表面部21的发泡树脂只要是通过加热等能够起泡则并不特别限定,能够使用公知的热塑性树脂。具体而言,能够列举聚苯乙烯系树脂、聚烯烃系树脂、聚(甲基)丙烯酸系树脂、聚苯醚系树脂、聚碳酸酯系树脂、聚酯系树脂(例如,聚乳酸系树脂、PET等)等。这些树脂成分既可以单独使用,也可以混合使用。此外,(甲基)丙烯酸是指丙烯酸或者甲基丙烯酸。另外,硅酮橡胶的海绵薄片、氟橡胶的海绵薄片等也能够作为构成表面部21的发泡树脂材料使用。表面部21如后述那样,通过光传感器34或者目视来进行观察,所以期望具有与气泡的反射光不同的颜色的表面色,以使在气泡形成在表面时和气泡从表面消失时被该表面反射的光有差别。例如,若表面色是比较暗的颜色、黑色、蓝色、橙色等颜色,则更容易辨别。也能够在不毁坏表面的微小的凹凸的范围内,对表面部21施加需要的着色。In the present embodiment, a sheet-like resin sponge material is divided into rectangular shapes and attached to one surface of the holding member 22 . The shape of the surface portion 21 is not limited to the illustrated rectangular shape, and may be a square, another polygon, a circle, an ellipse, or the like. In addition, although the example in which one surface portion 21 is formed on one holding member 22 has been described, a plurality of sheets having different degrees of bubble generation may be arranged to form the surface portion 21 . In addition, the surface portion 21 can also be attached to the holding member 22 in a replaceable manner. The foamed resin constituting the surface portion 21 is not particularly limited as long as it can be foamed by heating or the like, and known thermoplastic resins can be used. Specifically, polystyrene-based resins, polyolefin-based resins, poly(meth)acrylic resins, polyphenylene ether-based resins, polycarbonate-based resins, polyester-based resins (for example, polylactic acid-based resins, PET, etc.) etc. These resin components may be used alone or in combination. In addition, (meth)acrylic acid means acrylic acid or methacrylic acid. In addition, a sponge sheet of silicone rubber, a sponge sheet of fluororubber, or the like can also be used as the foamed resin material constituting the surface portion 21 . The surface portion 21 is observed with the optical sensor 34 or visually as will be described later, so it is desirable to have a surface color different from the reflected light of the air bubbles so that it can be seen when the air bubbles are formed on the surface and when the air bubbles disappear from the surface. Surfaces reflect light differently. For example, if the surface color is a darker color, black, blue, orange, etc., it is easier to distinguish. It is also possible to apply desired coloring to the surface portion 21 within a range that does not damage minute unevenness on the surface.
这里,对使模拟作业对象物20对于脱气的条件与假定的作业对象物W接近的设定方法的一个例子进行简单说明。例如,若在脱气处理槽10处理的作业对象物W为Φ300mm的半导体晶圆,则在假定了在该半导体晶圆较大地产生了气泡的情况的情况下,半导体晶圆的有效直径为Φ294mm,其有效面积为67852mm2。另外,晶圆的开口部、作为布线使用的情况下等的图案的槽等的开口率为30%,图案的孔、槽的深度为0.1mm。这样一来假设在槽、孔等图案全部进入了气泡的情况下,能够计算为该气泡的体积为2036mm3左右。另一方面,若模拟作业对象物20的表面部21的结构为发泡率四倍且原来的材料厚度为0.5mm,则其厚度为2mm,若假设为50mm方形,则有效面积为2500mm2,但考虑其有效体积是从与液体接触的面到深度1mm的范围,并且侧壁部分的深度1mm左右与液体接触,所以大致计算为有效体积为2696mm3左右。这里设为气泡进入有效体积的全部的情况,若其有效体积的3/4为空隙,则计算出的体积为2022mm3,可知与半导体晶圆的气泡的计算出的体积2036mm3左右同等程度。换言之,若作为模拟作业对象物20,表面部21的结构为厚度2mm,50mm见方的尺寸,则与作业对象物W为Φ300mm的半导体晶圆的情况相比较能够预料同等程度的气泡的量,测定模拟作业对象物20中的气泡的消失接近测定作业对象物W本身所收进的气泡的消失。Here, an example of a setting method for making the degassing condition of the simulated work object 20 close to the assumed work object W will be briefly described. For example, if the work object W processed in the degassing treatment tank 10 is a semiconductor wafer of Φ300 mm, then under the assumption that bubbles are largely generated in the semiconductor wafer, the effective diameter of the semiconductor wafer is Φ294 mm. , its effective area is 67852mm 2 . In addition, the aperture ratio of the opening of the wafer and the groove of the pattern when used as wiring, etc. is 30%, and the depth of the hole and groove of the pattern is 0.1 mm. In this way, assuming that all patterns such as grooves and holes are filled with air bubbles, it can be calculated that the volume of the air bubbles is about 2036 mm 3 . On the other hand, if the structure of the surface portion 21 of the simulated work object 20 is four times the expansion rate and the original material thickness is 0.5 mm, its thickness is 2 mm, and if it is assumed to be 50 mm square, the effective area is 2500 mm 2 , However, considering that the effective volume is from the surface in contact with the liquid to a depth of 1 mm, and the side wall part is in contact with the liquid at a depth of about 1 mm, the effective volume is roughly calculated to be about 2696 mm 3 . Here, it is assumed that bubbles enter the entire effective volume. If 3/4 of the effective volume is voids, the calculated volume is 2022 mm 3 , which is about the same as the calculated volume of bubbles in a semiconductor wafer of 2036 mm 3 . In other words, if the structure of the surface portion 21 is 2 mm thick and 50 mm square as the simulated work object 20, the amount of air bubbles at the same level can be expected compared with the case where the work object W is a Φ300 mm semiconductor wafer. The simulating disappearance of air bubbles in the work object 20 is close to measuring the disappearance of air bubbles contained in the work object W itself.
这里,对模拟作业对象物20的表面部21上的气泡进行说明,如图3示意地所示,示出表示保持部件22上的表面部布满气泡的状态的表面部21A、从布满气泡的状态脱落了少许气泡的状态的表面部21B、以及气泡从表面消失而表面的整个面几乎现出材料本身的表面的表面部21C的经时的迁移。通过实验可知无论是何种溶存气体的程度均依次示出相同的迁移21A、21B、21C,可知若溶存气体量不同,则虽然迁移21A、21B、21C的顺序本身不变,但从表面部21A到表面部21C的状态变化所涉及的时间改变。Here, the air bubbles on the surface portion 21 of the simulated work object 20 will be described. As schematically shown in FIG. The surface part 21B in a state where a few air bubbles have fallen off, and the time-dependent migration of the surface part 21C in which the air bubbles disappear from the surface and almost the entire surface of the surface shows the surface of the material itself. It can be seen from experiments that the same transitions 21A, 21B, and 21C are sequentially shown regardless of the degree of dissolved gas. It can be seen that if the amount of dissolved gas is different, although the order of transitions 21A, 21B, and 21C itself does not change, the transition from the surface portion 21A The time involved in the state change to the surface portion 21C changes.
例如,在溶氧浓度为0.6~2.2[Omg/L]的范围的情况下,在30秒后成为表面部21A的气泡状态,并经由表面部21B的状态,在5分钟后成为气泡从表面消失而表面的整个面几乎现出材料本身的表面的表面部21C的状态。另外,在溶氧浓度为3.2[Omg/L]左右的情况下,在30秒后成为表面部21A的气泡状态,并经由表面部21B的状态,在8分钟后成为气泡从表面消失的表面部21C的状态。在溶氧浓度为4.5[Omg/L]左右的情况下,在30秒后成为表面部21A的气泡状态的地方不变,但经由表面部21B的状态,在15分钟后才终于成为气泡从表面消失的表面部21C的状态。并且,在溶氧浓度为5.5[Omg/L]左右的情况下,在30秒后成为表面部21A的气泡状态的地方不变,但经由表面部21B的状态,在更长的30分钟后才终于成为气泡从表面消失的表面部21C的状态。即,模拟作业对象物20的表面状态的时间变化能够通过测定从浸渍开始时到在开始时形成在模拟作业对象物20的表面的气泡从该表面消失为止的时间来较大地可视化,图4通过表示指数函数的变化的图表示出这样的处理液中的溶氧浓度与到模拟作业对象物变化为止的时间的关系。For example, in the case where the dissolved oxygen concentration is in the range of 0.6 to 2.2 [0 mg/L], after 30 seconds, the surface portion 21A becomes in the state of air bubbles, and after passing through the state of the surface portion 21B, the air bubbles disappear from the surface after 5 minutes. On the other hand, almost the entire surface of the surface appears in the state of the surface portion 21C of the surface of the material itself. In addition, when the dissolved oxygen concentration is about 3.2 [Omg/L], after 30 seconds, the surface portion 21A will be in the state of air bubbles, and after passing through the state of the surface portion 21B, it will become the surface portion where the air bubbles disappear from the surface after 8 minutes. 21C status. When the dissolved oxygen concentration is about 4.5 [Omg/L], after 30 seconds, the place that becomes the bubble state of the surface portion 21A does not change, but the state of the surface portion 21B finally becomes bubbles from the surface after 15 minutes. The state of the disappearing surface portion 21C. In addition, when the dissolved oxygen concentration is about 5.5 [Omg/L], after 30 seconds, the place where the bubble state of the surface portion 21A does not change, but the state of the surface portion 21B does not change after 30 minutes. Finally, the surface portion 21C is in a state where air bubbles disappear from the surface. That is, the temporal change of the surface state of the simulated work object 20 can be largely visualized by measuring the time from the start of immersion to the disappearance of the air bubbles formed on the surface of the simulated work object 20 from the surface at the start, as shown in FIG. 4 The graph showing the change of the exponential function shows the relationship between the concentration of dissolved oxygen in such a treatment liquid and the time until the simulated work object changes.
图4所示的溶氧浓度与到模拟作业对象物变化为止的时间的关系虽然也根据作业对象物W的精细图案的状态、脱气处理槽10的尺寸、脱气装置的性能、预处理液Q1的循环系统的能力等而变化,但在各个脱气系统中对某个恒定的作业对象物W示出具有固有的再现性的时间变化。因此,例如,根据图4的图表,可知若为作为目标的溶氧浓度为3.2[Omg/L]这样的情况,则若经过8分钟的时间则气泡消失,可知在如半导体晶圆那样假定了作业对象物W的情况下在预处理液Q1浸渍8分钟左右即可。The relationship between the dissolved oxygen concentration shown in FIG. 4 and the time until the change of the simulated work object depends on the state of the fine pattern of the work object W, the size of the degassing treatment tank 10, the performance of the degassing device, and the pretreatment liquid. The capacity of the circulation system of Q1 varies, but each degassing system exhibits a time variation with inherent reproducibility for a certain constant work object W. Therefore, for example, according to the graph of FIG. 4 , it can be seen that if the target dissolved oxygen concentration is 3.2 [0 mg/L], the air bubbles disappear after 8 minutes. In the case of the work object W, it suffices to immerse in the pretreatment liquid Q1 for about 8 minutes.
另外,图4的图表示出溶氧浓度与到模拟作业对象物变化为止的时间的关系,但其示出通过实验得到的数据,若设定为作业对象物W的精细图案中的气泡的产生状况与模拟作业对象物20的气泡的产生状况接近,则模拟作业对象物20中的表面部21上的气泡的时间变化几乎是对实际的作业对象物W进行模拟。这里气泡本身通常为空气,空气不仅包含氧,也包含氮气、水蒸气等成分。根据本实施方式的处理液的脱气判定方法,直接测定气泡本身的残留程度,所以并不像以往那样仅判定溶氧浓度,而能够进行也充分地考虑了氮气、水蒸气等成分的可靠地接近实际情况的判定。换言之,根据本实施方式的处理液的脱气判定方法,不需要气体的每个种类的传感器,而能够直接测定气泡本身的变化。In addition, the graph of FIG. 4 shows the relationship between the dissolved oxygen concentration and the time until the change of the simulated work object, but it shows the data obtained by the experiment. If it is set as the generation of bubbles in the fine pattern of the work object W If the conditions are close to the bubble generation conditions of the simulated object 20 , the temporal change of the air bubbles on the surface portion 21 of the simulated object 20 is almost a simulation of the actual object W. Here, the bubble itself is usually air, and the air contains not only oxygen, but also nitrogen, water vapor and other components. According to the method for judging the outgassing of the treatment liquid in this embodiment, the residual degree of bubbles itself is directly measured, so instead of just judging the concentration of dissolved oxygen as in the past, it is possible to perform reliable degassing that also fully considers components such as nitrogen gas and water vapor. Judgment close to the actual situation. In other words, according to the degassing determination method of the treatment liquid according to this embodiment, it is possible to directly measure the change of the bubble itself without requiring sensors for each type of gas.
在本实施方式的处理液的脱气判定方法中,关于模拟作业对象物20的表面部21的表面状态的时间变化,能够通过光学监视器测定或者通过目视观察模拟作业对象物20的表面部21的气泡的变化。在本实施方式中,与脱气处理槽10的内部的模拟作业对象物21的表面部21对置地配设能够测量模拟作业对象物20的表面部21的光反射量的光传感器34。若根据来自光传感器34的电信号测量模拟作业对象物21的表面部21的气泡的变化,则能够推测表面部21上的气泡的消失的时刻,能够判定预处理液Q1的溶存气体的状态。另外,在脱气处理槽10,能够在脱气处理槽10的侧壁形成在图1以虚线示出的窗部24,此时作业者能够通过目视判断气泡的消失的时刻。另外,若调节观察用的光的角度,将模拟作业对象物20的表面部21配置在能够从处理液的液面侧目视的角度,则也能够不需要窗部等的配设。In the method for judging degassing of the processing liquid in this embodiment, the temporal change of the surface state of the surface portion 21 of the simulated work object 20 can be measured with an optical monitor or visually observed on the surface of the simulated work object 20. 21 bubble changes. In this embodiment, an optical sensor 34 capable of measuring the light reflection amount of the surface portion 21 of the pseudo-work object 20 is disposed facing the surface portion 21 of the pseudo-work object 21 inside the degassing treatment tank 10 . If the change of the air bubbles on the surface portion 21 of the simulated work object 21 is measured based on the electrical signal from the optical sensor 34, the timing of the disappearance of the air bubbles on the surface portion 21 can be estimated, and the state of the dissolved gas in the pretreatment liquid Q1 can be determined. . In addition, in the degassing treatment tank 10, a window portion 24 shown by a dotted line in FIG. 1 can be formed on the side wall of the degassing treatment tank 10. At this time, the operator can visually judge the timing of the disappearance of the bubbles. In addition, if the angle of light for observation is adjusted and the surface portion 21 of the dummy work object 20 is arranged at an angle that can be viewed from the liquid surface side of the treatment liquid, the arrangement of a window or the like can also be unnecessary.
此外,在第一实施方式中,预处理液Q1例如使用纯水,但并不限定于此,作为预处理液Q1,例如也有加入表面活性剂的水、(酸性)脱脂剂、稀硫酸、盐酸、从电镀液除去了金属成分后的预浸液(对于甲磺酸的焊料电镀液的甲磺酸液等)。另外,脱气也考虑超声波等的并用。另外,在第一实施方式中,对利用捕集槽12收集溢出的处理液的脱气处理槽10进行了说明,但也能够将本发明的处理液的脱气判定方法应用于没有利用捕集槽收集溢出的处理液的机构的脱气处理槽。In addition, in the first embodiment, for example, pure water is used as the pretreatment liquid Q 1 , but it is not limited thereto. As the pretreatment liquid Q 1 , there are, for example, water added with a surfactant, (acidic) degreasing agent, dilute sulfuric acid, etc. , hydrochloric acid, and a pre-dip solution obtained by removing metal components from the plating solution (methanesulfonic acid solution for methanesulfonic acid solder plating solution, etc.). In addition, the combined use of ultrasonic waves and the like is also considered for degassing. In addition, in the first embodiment, the degassing treatment tank 10 which collects the overflowing treatment liquid by the collection tank 12 has been described, but the degassing determination method of the treatment liquid according to the present invention can also be applied to The tank is a degassing treatment tank that collects the overflowing treatment liquid.
第二实施方式second embodiment
本实施方式是对电镀处理用的液体进行脱气的例子,是将在表面具备具有需要的凹凸的精细图案的模拟作业对象物80浸渍到电镀槽60,并在短时间进行可靠的判定的方法。在本实施方式中,电镀槽60本身作为脱气处理槽发挥作用。This embodiment is an example of degassing the liquid for electroplating treatment, and is a method of dipping a simulated object 80 having a fine pattern with desired unevenness on the surface into the electroplating tank 60 and making a reliable judgment in a short time. . In this embodiment, the plating tank 60 itself functions as a degassing treatment tank.
如图5所示,本实施方式的处理液的脱气判定方法所涉及的电镀装置与图1的右侧的电镀装置相同,具有收纳了电镀液Q2的电镀槽60,在电镀槽60的周围设有用于收集溢出的电镀液Q2的捕集槽62。来自捕集槽62的电镀处理液Q2经由送液泵64和温度调节器66送至过滤器68,通过了过滤器68的电镀处理液Q2经由脱气膜模块70、和流量计74循环到电镀槽60。脱气装置由脱气膜模块70和与其连接的真空泵72构成,进行需要的对电镀液Q2的脱气。对电镀槽60内的电镀液Q2浸渍基板保持工具76所保持的作业对象物W,并且阳极电极78与作业对象物W对置地配置,并对这些阳极电极78与基板保持工具76之间给予电压来进行电解电镀。此外,虽然在本实施方式中,列举电解电镀的例子,但也能够除去电极等进行无电解电镀。As shown in FIG. 5 , the electroplating apparatus related to the degassing determination method of the processing liquid in this embodiment is the same as the electroplating apparatus on the right side of FIG. A catch tank 62 for collecting the overflowing electroplating solution Q 2 is arranged around it. The electroplating treatment solution Q 2 from the catch tank 62 is sent to the filter 68 via the liquid delivery pump 64 and the temperature regulator 66, and the electroplating treatment solution Q 2 that has passed through the filter 68 circulates through the degassing membrane module 70 and the flow meter 74 to plating tank 60. The degassing device is composed of a degassing membrane module 70 and a vacuum pump 72 connected thereto, and performs required degassing of the electroplating solution Q 2 . The object W held by the substrate holding tool 76 is immersed in the plating solution Q2 in the plating tank 60, and the anode electrodes 78 are arranged to face the object W, and a gap is applied between the anode electrodes 78 and the substrate holding tool 76. Voltage for electrolytic plating. In addition, although the example of electrolytic plating was given in this embodiment, it is also possible to remove electrodes etc. and perform electroless plating.
如图5所示,能够在这样的电镀槽60浸渍在表面具备具有需要的凹凸精细图案的模拟作业对象物80,并根据形成在该模拟作业对象物80的表面的气泡消失的时间测定脱气程度。模拟作业对象物80与上述的第一实施方式的模拟作业对象物20相同,具有在保持部件82的一面安装表面部81的结构,并根据到覆盖在表面部81的气泡在液体中消失为止的时间测定脱气程度。此外,在模拟作业对象物80的表面部81上的气泡的消失现象与在模拟作业对象物20的表面部21上的气泡的消失现象相同,模拟作业对象物80的表面部81的气泡能够经由未图示的光传感器或者通过目视进行判断。As shown in FIG. 5 , in such an electroplating tank 60 , a simulated work object 80 having a desired concave-convex fine pattern on the surface can be immersed, and the outgassing can be measured based on the time until the air bubbles formed on the surface of the simulated work object 80 disappear. degree. The dummy work object 80 is the same as the dummy work object 20 of the above-mentioned first embodiment. Time measures the degree of outgassing. In addition, the disappearance phenomenon of the air bubbles on the surface portion 81 of the simulated work object 80 is the same as the disappearance phenomenon of the air bubbles on the surface portion 21 of the simulated work object 20, and the air bubbles on the surface portion 81 of the simulated work object 80 can pass through An unillustrated optical sensor can be judged visually.
在本实施方式中,在进行电镀处理的电镀槽60直接进行使用了模拟作业对象物80的判定,所以能够不管气体的种类,而可靠地进行没有时滞的脱气程度的测定。In the present embodiment, since the determination using the dummy object 80 is directly performed in the plating tank 60 where the plating process is performed, it is possible to reliably measure the degree of outgassing without a time lag regardless of the type of gas.
第三实施方式third embodiment
本实施方式是对作为电镀的预处理用的液体的预处理液Q1进行脱气的例子,是在与脱气处理槽61直接连接的作为测定部发挥作用的测定槽94,将在表面具备具有需要的凹凸的精细图案的模拟作业对象物90浸渍到预处理液Q1,并在短时间进行可靠的判定的方法。此外,对于图6所示的第三实施方式的处理液的脱气判定方法所涉及的预处理用的装置的各部件,对与先前说明的第二实施方式所涉及的电镀装置相同的部件附加相同的参照附图标记,并省略重复的说明。This embodiment is an example of degassing the pretreatment liquid Q1, which is a liquid for pretreatment of electroplating, and it is the measuring tank 94 functioning as a measuring part directly connected to the degassing treatment tank 61. A method of dipping a dummy work object 90 having a fine pattern of concavities and convexities into the pretreatment liquid Q 1 to make a reliable judgment in a short time. In addition, for each component of the pretreatment device related to the degassing determination method of the treatment liquid according to the third embodiment shown in FIG. The same reference numerals are used, and repeated explanations are omitted.
如图6所示,在电镀的预处理用的装置中,构成为具有经由回流路95与脱气处理槽61直接连接的测定槽94,存积在脱气处理槽61的预处理液Q1的一部分回流到测定槽94内。在测定槽94的上端侧设有排出路96,从而溢出测定槽94的预处理液Q1被收集到捕集槽62。As shown in FIG. 6, in the apparatus for pretreatment of electroplating, it is configured to have a measurement tank 94 directly connected to the degassing treatment tank 61 via a return flow path 95, and the pretreatment liquid Q1 stored in the degassing treatment tank 61 Part of it flows back into the measuring tank 94. A discharge path 96 is provided on the upper end side of the measuring tank 94 so that the pretreatment liquid Q1 overflowing the measuring tank 94 is collected in the collecting tank 62 .
如图6所示,能够在这样的测定槽94浸渍在表面具备具有需要的凹凸的精细图案的模拟作业对象物90,并根据形成在该模拟作业对象物90的表面的气泡消失的时间测定脱气程度。模拟作业对象物90与上述的第一实施方式的模拟作业对象物20相同,具有在保持部件92的一面安装表面部91的结构,并根据到形成在表面部91的气泡从液体中消失为止的时间来测定脱气程度。在模拟作业对象物90的表面部91上的气泡的消失现象与在模拟作业对象物20的表面部21上的气泡的消失现象相同,模拟作业对象物90的表面部91的气泡能够经由未图示的光传感器或者通过目视来进行判断。As shown in FIG. 6 , it is possible to immerse a simulated work object 90 having a fine pattern of desired concavities and convexities on the surface in such a measuring tank 94, and measure the degassing time according to the time until the air bubbles formed on the surface of the simulated work object 90 disappear. gas level. The dummy work object 90 is the same as the dummy work object 20 of the above-mentioned first embodiment, and has a structure in which the surface portion 91 is attached to one side of the holding member 92, and is formed by a process until air bubbles formed on the surface portion 91 disappear from the liquid. time to determine the degree of outgassing. The disappearance phenomenon of the air bubbles on the surface portion 91 of the simulated work object 90 is the same as the disappearance phenomenon of the air bubbles on the surface portion 21 of the simulated work object 20, and the air bubbles on the surface portion 91 of the simulated work object 90 can pass through The light sensor shown or by visual inspection.
在本实施方式中,在测定槽94直接进行使用了模拟作业对象物90的判定,所以不管气体的种类,而能够可靠地进行没有时滞的脱气程度的测定。并且,即使在对脱气处理槽的传感器的安装或者用于目视的窗的设置困难的情况下,也能够进行在测定槽94的测定,所以能够使本发明的处理液的脱气判定方法应用于许多的脱气处理槽。In the present embodiment, since determination using the dummy work object 90 is directly performed in the measurement tank 94, the degree of outgassing can be reliably measured without a time lag regardless of the type of gas. And, even if it is difficult to install the sensor of the degassing treatment tank or to install the window for visual observation, the measurement in the measurement tank 94 can be carried out, so the degassing determination method of the treatment liquid of the present invention can be made Used in many degassing tanks.
本发明的处理液的脱气判定方法作为用于处理在表面具有由槽、孔构成的精细图案的作业对象物的处理液,并不限定于电镀的预处理液或者电镀处理液,也能够应用于其它的需要脱气的各种处理液。例如,也能够将本发明应用于半导体制造工序、其它的电子部件工序所使用的显影液、漂洗液、光致抗蚀剂液、清洗液、蚀刻液、抗蚀剂除去液、电解液、各种药液等。The degassing determination method of the treatment liquid of the present invention is not limited to the pretreatment liquid for electroplating or the electroplating treatment liquid, but can also be applied For other processing fluids that need to be degassed. For example, the present invention can also be applied to developing solutions, rinsing solutions, photoresist solutions, cleaning solutions, etching solutions, resist removing solutions, electrolyte solutions, various Medicinal solution, etc.
附图标记说明Explanation of reference signs
10…脱气处理槽;12…捕集槽;14、44、64…送液泵;16、46、66…温度调节器;18、48、68…过滤器;26、70…脱气膜模块;30、54、74…流量计;20、80、90…模拟作业对象物;21、81、91…表面部;22、82、92…保持部件;60…电镀槽;58、78…阳极电极;94…测定槽;W…作业对象物;Q1…预处理液;Q2…电镀液。10...Degassing treatment tank; 12...Catching tank; 14, 44, 64...Liquid delivery pump; 16, 46, 66...Temperature regulator; 18, 48, 68...Filter; 26, 70...Degassing membrane module ;30, 54, 74...flow meter; 20, 80, 90...simulation work object; 21, 81, 91...surface part; 22, 82, 92...holding part; 60...plating tank; 58, 78...anode electrode ; 94...measurement tank; W...work object; Q 1 ...pretreatment solution; Q 2 ...plating solution.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114540929A (en) * | 2020-11-26 | 2022-05-27 | 长鑫存储技术有限公司 | Electroplating method and electroplating device |
TWI828729B (en) * | 2018-07-27 | 2024-01-11 | 瑞士商赫孚孟拉羅股份公司 | Method of filling at least one degassed drug product into containers and drug product filling device |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001077514A (en) * | 1999-09-03 | 2001-03-23 | Cmk Corp | Manufacturing method of printed wiring board |
TW522455B (en) * | 1998-11-09 | 2003-03-01 | Ebara Corp | Plating method and apparatus therefor |
TW200300130A (en) * | 2001-10-31 | 2003-05-16 | Nec Corp | Apparatus for producing wash water or immersion water used in semiconductor devices and process of wash or immersion |
CN1499992A (en) * | 2001-02-07 | 2004-05-26 | Process for degassing queous plating solution | |
TW200503103A (en) * | 2003-04-29 | 2005-01-16 | Nutool Inc | Method and apparatus for reduction of defects in wet processed layers |
CN201276605Y (en) * | 2008-03-07 | 2009-07-22 | 竞铭机械股份有限公司 | Degassing device |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4611341B2 (en) * | 1998-11-09 | 2011-01-12 | 株式会社荏原製作所 | Plating method and apparatus |
JP5060365B2 (en) * | 2008-03-31 | 2012-10-31 | 株式会社東芝 | Plating apparatus, plating method, and electronic device manufacturing method |
-
2015
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW522455B (en) * | 1998-11-09 | 2003-03-01 | Ebara Corp | Plating method and apparatus therefor |
JP2001077514A (en) * | 1999-09-03 | 2001-03-23 | Cmk Corp | Manufacturing method of printed wiring board |
CN1499992A (en) * | 2001-02-07 | 2004-05-26 | Process for degassing queous plating solution | |
TW200300130A (en) * | 2001-10-31 | 2003-05-16 | Nec Corp | Apparatus for producing wash water or immersion water used in semiconductor devices and process of wash or immersion |
TW200503103A (en) * | 2003-04-29 | 2005-01-16 | Nutool Inc | Method and apparatus for reduction of defects in wet processed layers |
CN201276605Y (en) * | 2008-03-07 | 2009-07-22 | 竞铭机械股份有限公司 | Degassing device |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI828729B (en) * | 2018-07-27 | 2024-01-11 | 瑞士商赫孚孟拉羅股份公司 | Method of filling at least one degassed drug product into containers and drug product filling device |
CN114540929A (en) * | 2020-11-26 | 2022-05-27 | 长鑫存储技术有限公司 | Electroplating method and electroplating device |
CN114540929B (en) * | 2020-11-26 | 2023-09-08 | 长鑫存储技术有限公司 | Electroplating method and electroplating device |
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