CN107426920A - A kind of power amplifier - Google Patents
A kind of power amplifier Download PDFInfo
- Publication number
- CN107426920A CN107426920A CN201710818969.3A CN201710818969A CN107426920A CN 107426920 A CN107426920 A CN 107426920A CN 201710818969 A CN201710818969 A CN 201710818969A CN 107426920 A CN107426920 A CN 107426920A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- layer pcb
- power amplifier
- conductive stud
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 230000003321 amplification Effects 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 6
- 238000003032 molecular docking Methods 0.000 abstract description 5
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/023—Stackable modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Amplifiers (AREA)
Abstract
The embodiment of the invention discloses a kind of power amplifier, the first layer pcb board for being provided with high-tension circuit is designed as double-decker with the second layer pcb board for being provided with low-voltage circuit and connected by conductive stud, existing fly line connected mode is abandoned, conductive stud can both play electric action, it can play a supporting role again, solve between existing power amplifier mesohigh circuit and low-voltage circuit using fly line connection by the way of existing for cost it is higher, secondary man-made assembly is needed to increase human cost, easily occur patching mistake so as to cause serious consequence, due to the larger docking of the power of transmission Plugin Requirement is higher and long-time use after easily produce loose contact and even generate heat, sparking, the technical problem of the even more serious consequence such as on fire.
Description
Technical field
The present invention relates to power amplifier field, more particularly to a kind of power amplifier.
Background technology
Power amplifier (English name：Power amplifier), referred to as " power amplifier ", refer in given distortion rate condition
Under, maximum power output can be produced to drive the amplifier of a certain load (such as loudspeaker).Power amplifier is in whole sound equipment
The pivotal role of " tissue, coordination " is served in system, can dominate whole system to a certain extent provide good sound
Matter exports.
Because in power amplifier, high-tension circuit and low-voltage circuit coexist, and interlock between each other.In order to by high-tension electricity
Road keeps apart with low-voltage circuit, avoids, to disturbing caused by low-voltage circuit, in existing power amplifier by outside to fly
The mode of line solves this contradiction, that is, by high-tension line from power end, and using extra electric wire, jumper connection is to needing high pressure
PCB parts, and be linked on PCB using high-power connector.
However, by the way of fly line, cost is higher；Secondary man-made assembly is needed, increases human cost, and easily go out
Mistake is now patched so as to cause serious consequence；Because the power of transmission is larger, docking Plugin Requirement is higher, and uses for a long time
Afterwards, the contact portion of connector easily produces larger impedance because of oxidation, can produce loose contact even generate heat, strike sparks,
The even more serious consequence such as on fire.
The content of the invention
The embodiment of the invention discloses a kind of power amplifier, will be provided with first layer pcb board and the setting of high-tension circuit
The second layer pcb board for having low-voltage circuit is designed as double-decker and connected by conductive stud, has abandoned existing fly line connection
Mode, conductive stud can both play electric action, can play a supporting role again, solve existing power amplifier mesohigh
Between circuit and low-voltage circuit by the way of the fly line connection existing for cost is higher, needs secondary man-made assembly to increase people
Power cost, easily there is patching mistake so as to cause serious consequence, because the larger docking Plugin Requirement of the power of transmission is higher
And loose contact is easily produced after long-time use and the technical problem of even more serious consequence such as even generated heat, strike sparks, be on fire.
The embodiment of the invention discloses a kind of power amplifier, including：Power amplifier shell, it is provided with high-tension circuit
First layer pcb board, second layer pcb board, the conductive stud for being provided with low-voltage circuit；
The low-voltage circuit on the second layer pcb board needs the position of high pressure to pass through the conductive stud and described the
The high-tension circuit on one layer of pcb board is electrically connected with；
The first layer pcb board and the second layer pcb board are connected with power supply；
The first layer pcb board or the second layer pcb board are fixedly connected with the power amplifier shell.
Preferably,
The first layer pcb board is fixedly connected with the power amplifier shell；
The second layer pcb board is located at the top of the first layer pcb board.
Preferably,
The conductive stud is copper stud.
Preferably,
The power amplifier also includes conductive screw；
Positioning hole is provided with the first layer pcb board and the second layer pcb board；
The conductive stud is provided at both ends with screw hole；
The conductive screw is connected through the positioning hole with the conductive stud.
Preferably,
Heat emission hole is provided with the power amplifier shell.
Preferably,
Ventilating duct is formed between the first layer pcb board and the second layer pcb board；
The heat emission hole is arranged on stating on power amplifier shell at the ventilating duct port.
Preferably,
Radiator fan is provided with ventilating duct between the first layer pcb board and the second layer pcb board.
Preferably,
The fan is arranged on the end of the ventilating duct.
Preferably,
The power amplifier shell be connected with the first layer pcb board or the second layer pcb board side be provided with it is scattered
Hot device.
Preferably,
The spreader surface is provided with some grooves, for increasing heat radiation area.
As can be seen from the above technical solutions, the embodiment of the present invention has advantages below：
1st, the embodiments of the invention provide a kind of power amplifier, by the first layer pcb board for being provided with high-tension circuit and set
The second layer pcb board for being equipped with low-voltage circuit is designed as double-decker and connected by conductive stud, has abandoned existing fly line and has connected
Mode is connect, the design of double-decker make it that the isolation distance between high-tension circuit and low-voltage circuit is bigger, anti-tampering property and safety
Property it is more preferable, and the topology layout inside power amplifier can be optimized, efficiently reduce PCB surface product, help to reduce product
Size, the cost of product is greatly lowered,；Conductive stud can both play electric action, can play a supporting role again, solution
Determined between existing power amplifier mesohigh circuit and low-voltage circuit using fly line connection by the way of existing for cost higher
Technical problem；The accurate connection of conductive stud and first layer pcb board and second layer pcb board is it is possible to prevente effectively from the easy wrong of fly line
Technical problem；And conductive stud can compare with securely locking high-voltage transmission contact surface, solve existing power amplification
Can be due to the larger docking Plugin Requirement of the power of transmission by the way of fly line connection between device mesohigh circuit and low-voltage circuit
Higher technical problem, at the same also solve for a long time easily produced using the contact portion of rear connector because of oxidation it is larger
Impedance such as is even generated heat, struck sparks, be on fire at the technical problem of even more serious consequence so as to produce loose contact.
2nd, the embodiments of the invention provide a kind of power amplifier, the double-decker of first layer pcb board and second layer pcb board
So that between first layer pcb board and the second layer pcb board formation rule ventilating duct, and solve work(caused by fly line connected mode
Rate amplifier internal wire arranges at random, space-consuming so as to influence the technical problem of the circulation of air, and ventilating duct is with dissipating
Hot hole and radiator fan coordinate, and radiating can be better achieved, and improve the life-span of power amplifier component.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, may be used also
To obtain other accompanying drawings according to these accompanying drawings.
Fig. 1 is the structural representation inside a kind of power amplifier provided in the embodiment of the present invention.
Embodiment
The embodiment of the invention discloses a kind of power amplifier, by the first layer pcb board 2 for being provided with high-tension circuit and sets
The second layer pcb board 1 for having low-voltage circuit is designed as bilayer and connected by conductive stud 3, has abandoned existing fly line connection side
Formula, conductive stud 3 can both play electric action, can play a supporting role again, solve existing power amplifier mesohigh
Between circuit and low-voltage circuit by the way of the fly line connection existing for cost is higher, needs secondary man-made assembly to increase people
Power cost, easily there is patching mistake so as to cause serious consequence, because the larger docking Plugin Requirement of the power of transmission is higher
And loose contact is easily produced after long-time use and the technical problem of even more serious consequence such as even generated heat, strike sparks, be on fire.
Referring to Fig. 1, a kind of one embodiment of the power amplifier provided in the embodiment of the present invention includes：Power amplification
Device shell 7, the first layer pcb board 2 for being provided with high-tension circuit, the second layer pcb board 1 for being provided with low-voltage circuit, conductive stud 3,
Conductive screw 4, the low-voltage circuit on second layer pcb board 1 need the position of high pressure pass through conductive stud 3 with first layer pcb board 2
High-tension circuit be electrically connected with, first layer pcb board 2 and second layer pcb board 1 be connected with power supply, first layer pcb board 2 or the second
Layer pcb board 1 is fixedly connected with power amplifier shell 7；Preferably, first layer pcb board 2 is fixed with power amplifier shell 7 and connected
Connect, second layer pcb board 1 is located at the top of first layer pcb board 2；Conductive stud 3 is preferably copper stud；First layer pcb board 2 and
Positioning hole is provided with two layers of pcb board 1, conductive stud 3 is provided at both ends with screw hole, and conductive screw 4 is through positioning hole with leading
Electric stud 3 connects, the accurate matching of conductive stud 3 and positioning hole, avoids fly line easily because manually patching and producing and patch
The technical problem of mistake.
Heat emission hole 6 is additionally provided with power amplifier shell 7；Formed between first layer pcb board 2 and second layer pcb board 1 logical
Air channel, heat emission hole 6 are preferably provided at stating on power amplifier shell 7 at ventilating duct port；First layer pcb board 2 and the second layer
Radiator fan 5 is also provided with ventilating duct between pcb board 1, fan is preferably provided at the end of ventilating duct.
Power amplifier shell 7 is connected side with first layer pcb board 2 or second layer pcb board 1 and is provided with radiator, radiating
Device surface is provided with some grooves, for increasing heat radiation area.
The above is the detailed description of structure and the connected mode progress to a kind of power amplifier, for ease of understanding, below
A kind of application of power amplifier will be illustrated with a concrete application scene, application examples includes：
Connect as shown in figure 1, the first layer pcb board 2 for being provided with high-tension circuit is arranged on bottom with power amplifier shell 7
Connect, the second layer pcb board 1 for being provided with low-voltage circuit is arranged on first layer pcb board upper strata, the low-voltage circuit on second layer pcb board 1
The position of high pressure is needed to be electrically connected with by conductive stud 3 and conductive screw 4 with the high-tension circuit on first layer pcb board 2, together
When, conductive stud 3 also acts as supporting role, without setting single support component, realize high-tension circuit and low-voltage circuit every
From；Also, ventilating duct is formd between first layer pcb board 2 and second layer pcb board 1, the power at the end of ventilating duct one end is put
Be provided with heat emission hole 6 on big device shell 7, the other end of ventilating duct be provided with radiator fan 5, radiator fan 5, ventilating duct and
Heat emission hole 6 coordinates jointly, forms the effective radiator structure of power amplifier.
A kind of power amplifier provided by the present invention is described in detail above, for the general technology of this area
Personnel, according to the thought of the embodiment of the present invention, there will be changes in specific embodiments and applications, to sum up institute
State, this specification content should not be construed as limiting the invention.
Claims (10)
- A kind of 1. power amplifier, it is characterised in that including：Power amplifier shell, the first layer PCB for being provided with high-tension circuit Plate, second layer pcb board, the conductive stud for being provided with low-voltage circuit；The low-voltage circuit on the second layer pcb board needs the position of high pressure to pass through the conductive stud and the first layer The high-tension circuit on pcb board is electrically connected with；The first layer pcb board and the second layer pcb board are connected with power supply；The first layer pcb board or the second layer pcb board are fixedly connected with the power amplifier shell.
- 2. power amplifier according to claim 1, it is characterised in that the first layer pcb board and the power amplification Device shell is fixedly connected；The second layer pcb board is located at the top of the first layer pcb board.
- 3. power amplifier according to claim 1, it is characterised in that the conductive stud is copper stud.
- 4. power amplifier according to claim 1, it is characterised in that also including conductive screw；Positioning hole is provided with the first layer pcb board and the second layer pcb board；The conductive stud is provided at both ends with screw hole；The conductive screw is connected through the positioning hole with the conductive stud.
- 5. according to the power amplifier described in claim 1, it is characterised in that be provided with radiating on the power amplifier shell Hole.
- 6. according to the power amplifier described in claim 5, it is characterised in that the first layer pcb board and the second layer pcb board Between form ventilating duct；The heat emission hole is arranged on stating on power amplifier shell at the ventilating duct port.
- 7. according to the power amplifier described in claim 6, it is characterised in that the first layer pcb board and the second layer pcb board Between ventilating duct in be provided with radiator fan.
- 8. according to the power amplifier described in claim 7, it is characterised in that the fan is arranged on the end of the ventilating duct.
- 9. power amplifier according to claim 1, it is characterised in that the power amplifier shell and the first layer Pcb board or second layer pcb board connection side are provided with radiator.
- 10. power amplifier according to claim 9, it is characterised in that the spreader surface is provided with some grooves, For increasing heat radiation area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710818969.3A CN107426920A (en) | 2017-09-12 | 2017-09-12 | A kind of power amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710818969.3A CN107426920A (en) | 2017-09-12 | 2017-09-12 | A kind of power amplifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107426920A true CN107426920A (en) | 2017-12-01 |
Family
ID=60432054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710818969.3A Pending CN107426920A (en) | 2017-09-12 | 2017-09-12 | A kind of power amplifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107426920A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4799314A (en) * | 1987-07-02 | 1989-01-24 | Unisys Corporation | Method of mounting a printed circuit board |
| CN1248355A (en) * | 1997-02-21 | 2000-03-22 | 国际功率装置公司 | Multi-deck power converter module |
| US20060192509A1 (en) * | 2005-02-25 | 2006-08-31 | Mitsubishi Heavy Industries, Ltd. | Inverter apparatus suitable for battery vehicle |
| CN101635526A (en) * | 2008-07-24 | 2010-01-27 | 三星电子株式会社 | High-voltage power supply |
| CN205378461U (en) * | 2015-12-28 | 2016-07-06 | 广东高标电子科技有限公司 | Controller for electric vehicle |
| CN205454238U (en) * | 2015-12-28 | 2016-08-10 | 广东高标电子科技有限公司 | Capacitance connection structure and electric vehicle controller |
| CN207201080U (en) * | 2017-09-12 | 2018-04-06 | 广州市天歌音响设备有限公司 | A kind of power amplifier |
-
2017
- 2017-09-12 CN CN201710818969.3A patent/CN107426920A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4799314A (en) * | 1987-07-02 | 1989-01-24 | Unisys Corporation | Method of mounting a printed circuit board |
| CN1248355A (en) * | 1997-02-21 | 2000-03-22 | 国际功率装置公司 | Multi-deck power converter module |
| US20060192509A1 (en) * | 2005-02-25 | 2006-08-31 | Mitsubishi Heavy Industries, Ltd. | Inverter apparatus suitable for battery vehicle |
| CN101635526A (en) * | 2008-07-24 | 2010-01-27 | 三星电子株式会社 | High-voltage power supply |
| CN205378461U (en) * | 2015-12-28 | 2016-07-06 | 广东高标电子科技有限公司 | Controller for electric vehicle |
| CN205454238U (en) * | 2015-12-28 | 2016-08-10 | 广东高标电子科技有限公司 | Capacitance connection structure and electric vehicle controller |
| CN207201080U (en) * | 2017-09-12 | 2018-04-06 | 广州市天歌音响设备有限公司 | A kind of power amplifier |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20180927 Address after: 511442 No. 16, west line industrial zone, Keng Tau Village, Panyu District South Village, Guangzhou, Guangdong province (self declaration) Applicant after: Tiangong (Guangzhou) audio equipment Co.,Ltd. Address before: 510000 Part 16 of West Line Industrial Zone, Keng Tau Village, Panyu District South Village, Guangzhou, Guangdong Applicant before: GUANGZHOU STVDIO DUE EQUIPMENT CO.,LTD. |
|
| TA01 | Transfer of patent application right | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171201 |
|
| RJ01 | Rejection of invention patent application after publication |