CN107424897A - Plasma surface processor and plasma apparatus cavity body structure - Google Patents

Abstract

The invention relates to the field of vacuum equipment, and discloses a plasma surface treatment equipment and a cavity structure of the plasma equipment. The cavity structure of the plasma equipment includes: a material box, a radio frequency electrode and a grounding electrode; the plasma surface treatment equipment includes The gas module and the vacuum plasma cavity of the gas extraction port are provided with a material box, a radio frequency electrode and a ground electrode in the vacuum plasma cavity. There are multiple targets in the material box, and these targets are arranged at intervals in the material box, and a gap for air flow is reserved between any two adjacent targets; there are several targets on the side wall of the material box Ventilation slots, the number of ventilation slots and gaps are set correspondingly, so that the ventilation slots and gaps together form an air flow channel passing through the surface of the target; the radio frequency electrode is located on one side of the material box, and is facing the air flow channel; at least a part of the ground electrode is located on the ground The electrodes are located on the other side of the cartridge, facing the airflow channel. The invention can improve the surface treatment effect of the target object.

Description

Plasma surface treatment equipment and cavity structure of plasma equipment

technical field

The invention relates to the field of vacuum equipment, in particular to a plasma surface treatment equipment and a cavity structure of the plasma equipment.

Background technique

The vacuum plasma cleaning process refers to the generation of high-energy disordered plasma under a certain pressure through the electrodes in the vacuum chamber, and the plasma bombards the product to be cleaned, that is, the surface of the target object, to achieve the purpose of cleaning A plasma surface treatment process.

Semiconductor substrates, lead frames, and integrated circuit boards are products at various stages of today's semiconductor production process. In the production process, it is often necessary to use vacuum plasma surface treatment equipment to clean the surface. These products are therefore common targets for vacuum plasma cleaning.

In the prior art, the target object is usually contained in a magazine, and ventilation slots are often arranged on the magazine, and these ventilation slots are used to pass plasma gas to ensure cleaning effect.

During surface treatment, whether the gas can effectively pass through the surface of the target and the uniformity of the gas are important factors affecting the treatment effect. However, due to the structural limitations of the prior art, it is difficult for the gas to effectively flow through the center of the object when passing through the ventilation slots. Although the edge treatment effect of the object meets expectations, the treatment effect in the middle of the object is not satisfactory.

Contents of the invention

The purpose of the present invention is to provide a plasma surface treatment equipment, which can improve the treatment effect on the surface of the object.

In order to solve the above technical problems, the present invention provides a vacuum plasma surface treatment equipment, comprising:

A vacuum plasma chamber with an air intake module and an air extraction port is provided, and a material box, a radio frequency electrode and a ground electrode are arranged in the vacuum plasma chamber;

There are multiple targets in the material box, and these targets are arranged at intervals in the material box, and a gap for air flow is reserved between any adjacent two targets; there are several holes on the side wall of the material box. Two ventilation slots, the ventilation slots and the gaps are set correspondingly, so that the ventilation slots and the gaps together form an air flow channel through the surface of the target;

The radio frequency electrode is located on one side of the cartridge and is facing the airflow channel;

At least a part of the grounding electrode is located on the other side of the cartridge and faces the airflow channel;

The gas enters the vacuum plasma cavity through the air intake module, is ionized under the electric field of the radio frequency electrode and the ground electrode, passes through the gas flow channel and treats the surface of the target object, and then is drawn out from the gas extraction port.

The present invention also provides a plasma equipment cavity structure, including: a material box, a radio frequency electrode and a ground electrode;

There are multiple targets in the material box, and these targets are arranged at intervals in the material box, and a gap for air flow is reserved between any adjacent two targets; there are several holes on the side wall of the material box. The ventilation slots, the ventilation slots and the gaps are arranged correspondingly, so that the ventilation slots and the gaps together constitute the air flow passage through the surface of the target;

The radio frequency electrode is located on one side of the cartridge and is facing the airflow channel;

At least a part of the grounding electrode is located on the other side of the magazine, facing the airflow channel.

Compared with the prior art, the present invention arranges the radio frequency electrode on one side of the material box, so that the plasma gas released from the radio frequency electrode can pass through the reserved air flow channel without hindrance. Because the flow path of the gas is more controllable, the treatment effect of the central part of the target can be improved.

Preferably, the target object is a semiconductor substrate, a lead frame or an integrated circuit board. These three are conventional products in the semiconductor industry, and it is of great significance to improve the surface treatment effect of these three.

Preferably, the ground electrode is formed as a frame, and the magazine is located inside the frame formed by the ground electrode;

Wherein, several ventilation holes are provided on the surface of the frame body opposite to the radio frequency electrode, and the gas passes through the air flow channel and the ventilation holes, and then is drawn out from the air suction port. Usually, the vacuum chamber is a square chamber, and the frame formed by the ground electrode is inside the vacuum chamber. Ventilation holes are provided, so that the gas can be directly released from the ventilation holes after passing through the airflow channel, and the gas flows more smoothly.

Further, preferably, the plasma surface treatment equipment further includes a positioning bar arranged on the inner wall of the frame formed by the ground electrode, and the positioning bar is used to limit the position of the cartridge. Setting the positioning bar to limit the position of the material box not only saves the time for positioning the material box, but also prevents too much gas from flowing away between the material box and the electrode through the blocking of the positioning bar, and improves the uniformity of gas circulation in the cavity .

Further, preferably, the magazine is a cuboid, and there are four positioning bars, and these four positioning bars respectively correspond to the four sides of the magazine in the length direction to form a slot, and the magazine slides along the length direction and snaps in The card slot.

The way of sliding and snapping in can facilitate the loading and unloading of the material box, and the positioning of the four corners also has a stable fixing effect.

Preferably, the number, shape and position of the ventilation holes are respectively consistent with the ventilation slots. The ventilation holes on the frame correspond to the ventilation grooves on the side wall of the material box one by one, which can reduce obstructions as much as possible and make the gas flow more smoothly.

In addition, preferably, an even number of cartridges is arranged in the vacuum plasma chamber, and these cartridges are divided into two groups, and the two groups of cartridges are respectively located on both sides of the radio frequency electrode. The cartridge and the radio frequency electrode are enclosed inside the frame formed by the ground electrode. Arranging magazines on both sides of the vacuum plasma chamber can improve the space utilization rate of the vacuum plasma chamber.

Preferably, the gas pumping port is located at a position facing the radio frequency electrode, and the gas pumping direction of the gas pumping port is perpendicular to the flow direction of the gas in the gas flow channel. Compared with the gas inlets arranged in parallel, the gas inlets arranged vertically unify the direction of the gas flow and prevent gas from hedging.

In addition, preferably, the air intake module is located at a position facing the radio frequency electrode, and the air intake direction of the air intake module is consistent with the height direction of the magazine. When the air intake direction of the air intake module is consistent with the height direction of the material box, the obstruction of the gas flow direction by the radio frequency electrode can be avoided. Moreover, the air intake module directly facing the radio frequency electrode can fully ionize the gas and then enter the gas flow channel to process the surface of the target.

Preferably, there are two air intake modules, and the two air intake modules are respectively located on both sides of the radio frequency electrode. Air intake modules are provided on both sides, which can make better use of the inner space of the vacuum plasma cavity and improve the uniformity of gas distribution compared with the intake modules on one side.

In addition, preferably, the surface treatment includes cleaning, activation, oxide removal, nano-coating or surface grafting. The invention can realize various types of surface treatment, and thus can meet the surface treatment requirements of different materials.

Description of drawings

Fig. 1 is a three-dimensional schematic diagram of a magazine according to the first embodiment of the present invention;

Fig. 2 is a three-dimensional schematic diagram of a plasma surface treatment device according to a first embodiment of the present invention;

3 is a perspective view of a plasma surface treatment device according to a second embodiment of the present invention;

4 is a schematic front view of plasma surface treatment equipment according to a third embodiment of the present invention;

Fig. 5 is a three-dimensional schematic diagram of a plasma surface treatment device according to a fourth embodiment of the present invention;

Fig. 6 is a bottom-view sectional schematic view of the plasma surface treatment equipment according to the fifth and sixth embodiments of the present invention;

7 is a schematic front view of plasma surface treatment equipment according to the seventh embodiment of the present invention;

Fig. 8 is a schematic front view of the cavity structure of the plasma equipment according to the eighth embodiment of the present invention;

Fig. 9 is a schematic perspective view of the cavity structure of the plasma equipment according to the eighth embodiment of the present invention.

Explanation of reference signs:

1-vacuum plasma cavity; 2-material box; 3-intake module; 4-ground electrode; 4a-positioning bar; 4b-ventilation hole; 5-radio frequency electrode; Airflow channel; 8a-gap; 8b-ventilation slot;.

detailed description

Implementation Mode 1

The first embodiment of the present invention provides a plasma surface treatment device, as shown in Figure 1 and Figure 2, including:

A vacuum plasma chamber 1 provided with an air intake module 3 and an air extraction port 7, and a cartridge 2, a radio frequency electrode 5 and a ground electrode 4 are arranged in the vacuum plasma chamber 1;

A plurality of targets 6 are housed in the magazine 2, and these targets 6 are arranged at intervals in the magazine 2, and a gap 8a for air flow is reserved between any adjacent two targets 6; There are several ventilation grooves 8b on the side wall, and the ventilation grooves 8b and the gaps 8a are set correspondingly, so that the ventilation grooves 8b and the gaps 8a together constitute the airflow channel 8 passing through the surface of the target 6;

The radio frequency electrode 5 is located on one side of the cartridge 2 and faces the air flow channel 8;

At least a part of the ground electrode 4 is located on the other side of the cartridge 2, and is facing the airflow channel 8;

The gas enters the vacuum plasma cavity 1 through the air intake module 3, is ionized under the electric field of the radio frequency electrode 5 and the ground electrode 4, passes through the gas flow channel 8 and treats the surface of the target object 6, and then is drawn out from the gas extraction port 7 .

Wherein, one or more cartridges 2 can be arranged in the plasma surface treatment equipment. The inventor of the present invention suggests that a length of 0.1cm to 50cm and a height of 0.1cm to 10cm are set in each cartridge 2. A ventilation slot 8b of 0.1 cm to 10 cm is a preferred embodiment. (To be written in the claim) For example, it is a preferred embodiment that a ventilation slot 8b with a length of 1 cm to 5 cm and a height of 0.2 cm to 2 cm is set every 0.2 cm to 2 cm. Of course, it may not be limited to this size solution in actual use. Preferably, the number of the ventilation slots 8b and the gaps 8a can be the same and set in one-to-one correspondence, so as to better improve the treatment effect in the middle of the object 6 .

Those of ordinary skill in the art know that through plasma surface treatment, physical and chemical changes can occur on the surface of the target 6, such as etching the surface of the target 6 to make it rough, or forming a dense cross-linked layer, or introducing Oxygen polar groups, so that the hydrophilicity, adhesiveness, dyeability, biocompatibility or electrical properties of the target object 6 are improved.

In this embodiment, the surface treatment includes cleaning, activation, oxide removal, nano-coating or surface grafting. The invention can realize various types of surface treatment, so it can meet the surface treatment requirements of different materials, including parts, films and circuit boards.

In addition, in this embodiment, the applicable target object 6 is an article that can be stacked. Specifically, the target object 6 may be a semiconductor substrate, a lead frame or an integrated circuit board. These three are conventional products in the semiconductor industry, and it is of great significance to improve the surface treatment effect of these three.

Compared with the prior art, the present invention arranges the radio frequency electrode 5 on one side of the cartridge 2, so that the plasma gas released from the radio frequency electrode 5 can pass through the reserved air flow channel 8 without hindrance. Since the flow path of the gas is more controllable, the treatment effect of the central part of the object 6 can be improved.

Implementation mode two

A second embodiment of the present invention provides a vacuum plasma cleaning device. The second embodiment is a further improvement of the first embodiment. The main improvement is that, in the second embodiment of the present invention, as shown in FIG. Inside the formed frame.

Among them, several ventilation holes 4b are provided on the surface of the frame body opposite to the radio frequency electrode 5, and the gas passes through the air flow channel 8 and the ventilation holes 4b, and then is drawn out from the air suction port 7. Usually, the vacuum plasma chamber 1 is square, and the frame formed by the ground electrode 4 is inside the vacuum plasma chamber 1 . Ventilation holes 4b are provided so that the gas can be released directly from the ventilation holes 4b after passing through the airflow channel 8, and the flow thereof is smoother.

In this embodiment, the number, shape and position of the ventilation holes 4b can be consistent with the ventilation grooves 8b, or can be uniformly and densely distributed on the frame as shown in FIG. 3 . The ventilation holes 4b on the frame correspond one-to-one to the ventilation slots 8b on the side wall of the cartridge 2, which can reduce obstacles as much as possible and make the gas flow more smoothly.

Implementation Mode Three

A third embodiment of the present invention provides a vacuum plasma cleaning device. The third embodiment is a further improvement of any one of the first or second embodiments. The main improvement is that, in the third embodiment of the present invention, as shown in FIG. 4 , the plasma surface treatment equipment also includes The positioning bar 4a is arranged on the inner wall of the frame body formed by the ground electrode 4, and the positioning bar 4a is used to limit the position of the cartridge 2. Setting the positioning bar 4a to limit the position of the material box 2 not only saves the time for locating the material box 2, but also prevents too much gas from flowing between the material box 2 and the electrode through the blocking of the positioning bar 4a, and improves the flow of gas in the cavity. Uniformity of circulation in the body.

In this embodiment, the material box 2 is a cuboid, and there are four positioning bars 4a, and these four positioning bars 4a respectively correspond to the four sides of the material box 2 in the length direction to form a slot, and the material box 2 along the The longitudinal direction slides and snaps into the slot.

The loading and unloading of the material box 2 can be facilitated by adopting the way of sliding and snapping in, and the positioning of the four corners also has a stable fixing effect.

Implementation Mode Four

A fourth embodiment of the present invention provides a plasma surface treatment device. The fourth embodiment is a further improvement of the second embodiment. The main improvement is that, in the fourth embodiment of the present invention, as shown in FIG. These cartridges 2 are divided into two groups, and the two groups of cartridges 2 are respectively located on both sides of the radio frequency electrode 5 .

The magazine 2 and the radio frequency electrode 5 are enclosed in the frame formed by the ground electrode 4 . The space utilization rate of the vacuum plasma chamber 1 can be improved by arranging the cartridges 2 on both sides of the vacuum plasma chamber 1 .

Implementation Mode Five

A fifth embodiment of the present invention provides a plasma surface treatment device. The fifth embodiment is a further improvement of any one of the first to fourth embodiments. Specifically, in the fifth embodiment of the present invention, as shown in FIG. Improve.

The pumping port 7 is located at the position facing the RF electrode 5 , and the pumping direction of the pumping port 7 is perpendicular to the flow direction of the gas in the gas flow channel 8 . Compared with the gas extraction ports 7 arranged in parallel, the gas extraction ports 7 arranged vertically unify the direction of gas flow and prevent the gas from colliding.

Embodiment Six

A sixth embodiment of the present invention provides a plasma surface treatment device. The sixth embodiment is a further improvement of any one of the first to fifth embodiments. The main improvement is that, in the sixth embodiment of the present invention, also referring to FIG. 6 , the air intake module 3 is located at the front For the position of the radio frequency electrode 5 , the air intake direction of the air intake module 3 is consistent with the height direction of the cartridge 2 .

Specifically, referring to FIG. 6 , the air intake module 3 includes a plurality of air intake holes arranged at intervals along the length direction of the radio frequency electrode 5 , and the gas blown from these air intake holes can better pass through the surface of the radio frequency electrode 5 .

Wherein, preferably, air inlet holes may be provided at intervals of 4 cm to 5 cm, and the size radius of the air inlet holes may be 3 mm to 5 mm. When the air intake module 3 faces the radio frequency electrode 5, it can avoid the radio frequency electrode 5 from obstructing the gas flow direction. Moreover, the air intake module 3 disposed facing the radio frequency electrode 5 can fully ionize the gas and then enter the gas flow channel 8 to process the surface of the target object 6 .

Implementation Mode Seven

A seventh embodiment of the present invention provides a plasma surface treatment device. The seventh embodiment is a further improvement of the sixth embodiment. The main improvement is that, in the seventh embodiment of the present invention, as shown in FIG. 7, there are two air intake modules 3, and the two air intake modules 3 are located on both sides of the radio frequency electrode 5 respectively. The air intake modules 3 are provided on both sides, so that the inner space of the vacuum plasma chamber 1 can be better utilized compared with the air intake modules 3 on one side, and the uniformity of gas distribution can be improved.

Embodiment Eight

The eighth embodiment of the present invention provides a cavity structure of a plasma device, as shown in FIG. 8 , including a cartridge 2 , a radio frequency electrode 5 and a ground electrode 4 .

In the eighth embodiment of the present invention, as shown in FIG. 9, a plurality of targets 6 are housed in the cartridge 2, and these targets 6 are arranged at intervals in the cartridge 2, and any adjacent two targets 6 A gap 8a is reserved between them for the passage of air flow; several ventilation grooves 8b are opened on the side wall of the cartridge 2, and the ventilation groove 8b and the gap 8a are set correspondingly, so that the ventilation groove 8b and the gap 8a together constitute the passage of the target object. 6 surface air flow channels 8;

The radio frequency electrode 5 is located on one side of the cartridge 2 and faces the air flow channel 8;

At least a part of the ground electrode 4 is located on the other side of the magazine 2 and faces the airflow channel 8 .

The ground electrode 4 is formed as a frame, and the cartridge 2 is located inside the frame formed by the ground electrode 4;

Wherein, several ventilation holes 4b are provided on the surface of the frame body opposite to the radio frequency electrode 5 .

The gas enters the cavity structure of the plasma equipment, is ionized under the action of the electric field of the radio frequency electrode 5 and the ground electrode 4, passes through the gas flow channel 8 and processes the surface of the target object 6, and is then extracted. Preferably, the number of the ventilation slots 8b and the gaps 8a can be the same and set in one-to-one correspondence, so as to better improve the treatment effect in the middle of the object 6 .

In this embodiment, the cavity structure of the plasma equipment further includes a positioning bar 4 a arranged on the inner wall of the frame formed by the ground electrode 4 , and the positioning bar 4 a is used to limit the position of the cartridge 2 . Ventilation holes 4b are provided so that the gas can be released directly from the ventilation holes 4b after passing through the airflow channel 8, and the flow thereof is smoother. The number, shape and position of the ventilation holes 4b can be consistent with the ventilation slots 8b respectively.

The material box 2 can be a cuboid, and there can be four positioning bars 4a, and these four positioning bars 4a can respectively correspond to the four sides of the material box 2 in the length direction to form a card slot, and the material box 2 can slide along the length direction and snap in card slot. The loading and unloading of the material box 2 can be facilitated by adopting the way of sliding and snapping in, and the positioning of the four corners also has a stable fixing effect.

It is worth mentioning that the cavity structure of the plasma equipment in this embodiment is not limited to be applied to plasma surface treatment equipment. It can also be applied in other fields of plasma equipment.

Those of ordinary skill in the art can understand that in the foregoing implementation manners, many technical details are provided for readers to better understand the present application. However, even without these technical details and various changes and modifications based on the above-mentioned embodiments, the technical solution claimed in each claim of the present application can be basically realized. Therefore, in practice, various changes may be made to the above-described embodiments in form and detail without departing from the spirit and scope of the present invention.

Claims (16)

1. A kind of plasma surface treatment equipment, is used for cleaning object (6), is characterized in that, comprises: be provided with the vacuum plasma cavity (1) of gas inlet module (3) and gas extraction port (7), described The vacuum plasma cavity (1) is provided with a material box (2), a radio frequency electrode (5) and a ground electrode (4); A plurality of targets (6) are housed in the magazine (2), and these targets (6) are arranged at intervals in the magazine (2), and make any adjacent two targets (6) A gap (8a) is reserved for the passage of air flow; several ventilation slots (8b) are opened on the side wall of the magazine (2), and the ventilation slots (8b) are set correspondingly to the gap (8a) , so that the ventilation groove (8b) and the gap (8a) jointly constitute an airflow channel (8) passing through the surface of the target (6); The radio frequency electrode (5) is located on one side of the cartridge (2) and is facing the airflow channel (8); At least a part of the ground electrode (4) is located on the other side of the cartridge (2), and is facing the air flow channel (8); The gas enters the vacuum plasma cavity (1) through the air intake module (3), is ionized under the electric field of the radio frequency electrode (5) and the ground electrode (4), and passes through the gas flow channel ( 8) and process the surface of the target object (6), and then be drawn out from the air suction port (7). 2. The plasma surface treatment device according to claim 1, characterized in that: the target object (6) is a semiconductor substrate, a lead frame or an integrated circuit board. 3. The plasma surface treatment equipment according to claim 1, characterized in that: the ground electrode (4) is formed as a frame, and the cartridge (2) is located in the frame formed by the ground electrode (4) inside the body; Wherein, several ventilation holes (4b) are arranged on the surface of the frame body opposite to the radio frequency electrode (5), and the gas passes through the airflow channel (8) and the ventilation holes (4b), and then flows from the It is drawn out from the air suction port (7). 4. The plasma surface treatment device according to claim 3, characterized in that: the plasma surface treatment device further comprises positioning strips (4a) arranged on the inner wall of the frame formed by the ground electrode (4) ), the positioning bar (4a) is used to limit the position of the magazine (2). 5. The plasma surface treatment device according to claim 4, characterized in that: the magazine (2) is a cuboid, and there are four positioning bars (4a), and these four positioning bars (4a) are respectively Slots are formed corresponding to the four sides of the magazine (2) in the length direction, and the magazine (2) slides along the length direction and snaps into the slots. 6. The plasma surface treatment equipment according to claim 3, characterized in that the number, shape and position of the ventilation holes (4b) are respectively consistent with the ventilation slots (8b). 7. The plasma surface treatment equipment according to claim 3, characterized in that: an even number of magazines (2) are arranged in the vacuum plasma chamber (1), and these magazines (2) are divided into two groups , these two groups of cartridges (2) are respectively located on both sides of the radio frequency electrode (5); The magazine (2) and the radio frequency electrode (5) are enclosed in the frame body formed by the ground electrode (4). 8. The plasma surface treatment equipment according to claim 1, characterized in that: the air extraction port (7) is located at a position facing the radio frequency electrode (5), and the air extraction of the air extraction port (7) The direction is perpendicular to the flow direction of gas in the gas flow channel (8). 9. The plasma surface treatment equipment according to claim 1, characterized in that: the air intake module (3) is located at a position facing the radio frequency electrode (5), and the air intake module (3) The air intake direction is consistent with the height direction of the magazine (2). 10. The plasma surface treatment equipment according to claim 9, characterized in that: there are two air intake modules (3), and the two air intake modules (3) are respectively located at the radio frequency electrode (5) on both sides. 11. The plasma surface treatment device according to any one of claims 1 to 10, wherein the surface treatment includes cleaning, activation, oxide removal, nano-coating or surface grafting. 12. A plasma equipment cavity structure, characterized in that: comprising: a material box (2), a radio frequency electrode (5) and a ground electrode (4); A plurality of targets (6) are housed in the magazine (2), and these targets (6) are arranged at intervals in the magazine (2), and make any adjacent two targets (6) A gap (8a) is reserved for the passage of air flow; several ventilation slots (8b) are opened on the side wall of the magazine (2), and the ventilation slots (8b) are set correspondingly to the gap (8a) , so that the ventilation groove (8b) and the gap (8a) jointly constitute an airflow channel (8) passing through the surface of the target (6); The radio frequency electrode (5) is located on one side of the cartridge (2) and is facing the airflow channel (8); At least a part of the ground electrode (4) is located on the other side of the cartridge (2), facing the airflow channel (8). 13. The cavity structure of plasma equipment according to claim 12, characterized in that: the ground electrode (4) is formed as a frame, and the cartridge (2) is located in the space formed by the ground electrode (4). Inside the frame; Wherein, several ventilation holes (4b) are provided on the surface of the frame body opposite to the radio frequency electrode (5). 14. The cavity structure of plasma equipment according to claim 13, characterized in that: the cavity structure of plasma equipment further comprises positioning strips arranged on the inner wall of the frame formed by the ground electrode (4) (4a), the positioning bar (4a) is used to limit the position of the magazine (2). 15. The chamber structure of plasma equipment according to claim 14, characterized in that: the magazine (2) is a cuboid, there are four positioning bars (4a), and the four positioning bars (4a) Respectively corresponding to the four sides of the material box (2) in the length direction, a locking groove is formed, and the material box (2) slides along the length direction and is locked into the locking groove. 16. The cavity structure of plasma equipment according to claim 13, characterized in that the number, shape and position of the ventilation holes (4b) are respectively consistent with the ventilation slots (8b).