CN107392196A - Image capturing device and manufacturing method thereof - Google Patents

Abstract

An image capturing device and a manufacturing method thereof are provided, wherein the image capturing device comprises a substrate, a light source, a sensor, a shading element, a first reflecting element, a transparent colloid curing layer and a second reflecting element, the light source, the sensor, the shading element, the first reflecting element and the transparent colloid curing layer are arranged on the substrate, the sensor is positioned beside the light source, the shading element is positioned between the light source and the sensor, the first reflecting element is positioned between the shading element and the sensor, the transparent colloid curing layer covers the light source, the sensor, the shading element and the first reflecting element, and the second reflecting element is arranged above the shading element and positioned between the light source and the sensor.

Description

Imaging device and manufacturing method thereof

technical field

The present invention relates to a photoelectric device and its manufacturing method, and in particular to an image pickup device and its manufacturing method.

Background technique

Types of biometric identification include face, voice, iris, retina, vein, palm print, and fingerprint recognition. According to different sensing methods, biometric identification devices can be classified into optical, capacitive, ultrasonic and thermal sensing. Generally speaking, an optical biometric identification device includes a light source, a light guide element, and a sensor. The light beam emitted by the light source irradiates the object to be identified which is pressed on the light guide element, and the sensor receives the light beam reflected by the object to be identified to perform biometric identification.

Taking fingerprint recognition as an example, when a finger presses on the light guide element, the convex part of the fingerprint will contact the light guide element, but the concave part of the fingerprint will not contact the light guide element. Therefore, the convex part of the fingerprint will destroy the total reflection of the light beam in the light guide element, so that the sensor can obtain the dark lines corresponding to the convex part. At the same time, the concave part of the fingerprint will not destroy the total reflection of the light beam in the light guide element, so that the sensor can obtain the bright lines corresponding to the concave part. In this way, the light beams corresponding to the convex and concave portions of the fingerprint will form bright and dark stripe patterns on the light receiving surface of the sensor. Using the algorithm to calculate the information corresponding to the fingerprint image, the user identity can be identified.

Since the light source in the optical biometric identification device is arranged next to the sensor, the large-angle light beam emitted by the light source may directly irradiate the sensor and cause interference. If a shading element is arranged between the light source and the sensor in order to reduce interference, it may affect the transmission of the light beam, causing fingers to be unable to be uniformly irradiated by the light beam, and negatively affect the image quality of the imaging device.

Contents of the invention

The invention provides an image-taking device with good image-taking quality.

The invention provides a method for manufacturing an image-taking device with low cost.

An image capturing device of the present invention includes a substrate, a light source, a sensor, a light shielding element, a first reflecting element, a light-transmitting colloid solidified layer, and a second reflecting element. The light source, the sensor, the shading element, the first reflection element and the light-transmitting colloid solidified layer are arranged on the substrate. The sensor is located next to the light source. The shading element is located between the light source and the sensor. The first reflective element is located between the light shielding element and the sensor. The light-transmitting colloid solidified layer covers the light source, the sensor, the shading element and the first reflection element. The second reflection element is arranged above the light shielding element and between the light source and the sensor.

In an embodiment of the present invention, a plurality of microstructures are formed on the surface of at least one of the substrate, the first reflective element, the light-transmitting colloid solidified layer, and the second reflective element.

In an embodiment of the present invention, a pulse width modulation circuit is integrated in the sensor.

In an embodiment of the present invention, the second reflective element is disposed on the top surface of the light-transmitting colloid cured layer.

In an embodiment of the present invention, the imaging device further includes a transparent base. The transparent base is configured on the substrate and covers the light-shielding element, wherein the second reflective element is configured on the top surface of the transparent base.

In an embodiment of the present invention, at least one of the first reflective element and the second reflective element includes a plurality of light reflective elements arranged at intervals.

In an embodiment of the present invention, the imaging device further includes a plurality of connection lines and a wall structure. A plurality of connection lines are respectively connected between the substrate and the sensor and between the substrate and the light source. The wall structure is configured on the base plate, wherein the wall structure and the base plate form an accommodating space for accommodating the light source, the sensor, the shading element and the first reflection element.

In an embodiment of the present invention, the image capturing device further includes a transparent cover. The light-transmitting cover is arranged on the light-transmitting colloid solidified layer and covers the light source, the sensor, the light-shielding element, the first reflective element, the connecting wire and the wall structure, and the second reflective element is arranged on the light-transmitting cover. The light-transmitting cover has glue filling holes and vacuum holes.

In an embodiment of the present invention, the imaging device further includes an optical collimator or a grating disposed on the sensor and located between the light-transmitting colloid solidified layer and the sensor.

A manufacturing method of an image capturing device of the present invention includes the following steps. The light source, the sensor, the shading element and the first reflective element are arranged on the substrate, wherein the sensor is located beside the light source, the shading element is located between the light source and the sensor, and the first reflective element is located between the shading element and the sensor. A light-transmitting colloid solidified layer is formed on the substrate, wherein the light-transmissive colloid solidified layer covers the light source, the sensor, the light-shielding element and the first reflective element. A second reflective element is formed above the light shielding element, wherein the second reflective element is located between the light source and the sensor.

In an embodiment of the present invention, the manufacturing method of the imaging device further includes the following steps. A plurality of microstructures are formed on the surface of at least one of the substrate, the first reflective element, the light-transmitting colloid solidified layer and the second reflective element.

In an embodiment of the present invention, forming the light-transmitting colloid cured layer includes the following steps. A light-transmitting colloid is formed on the substrate. Curing transparent colloid. Thinning the cured light-transmitting colloid to form a light-transmitting colloid cured layer.

In an embodiment of the invention, forming the second reflective element above the light shielding element includes the following steps. After the light-transmitting colloid cured layer is formed, a second reflective element is formed on the light-transmissive colloid cured layer.

In an embodiment of the present invention, the manufacturing method of the imaging device further includes the following steps. Before forming the light-transmitting colloid solidified layer, a wall structure is formed on the substrate, wherein the wall structure and the substrate form an accommodating space for accommodating the light source, the sensor, the light-shielding element and the first reflective element. Before forming the light-transmitting colloid solidified layer, a plurality of connection lines are formed on the substrate, wherein the plurality of connection lines are respectively connected between the substrate and the sensor and between the substrate and the light source. Before forming the solidified layer of light-transmitting colloid and after forming a plurality of connection lines, cover the light source, sensor, light-shielding element, first reflective element, wall structure and multiple connection lines with a light-transmitting cover, and the light-transmitting cover covers The side wall of the cladding wall structure, wherein the light-transmitting cover has glue filling holes and vacuum holes. Forming the light-transmitting colloid cured layer on the substrate includes the following steps. The transparent colloid is poured into the accommodating space through the glue filling hole. The gas in the accommodating space is drawn out through the vacuum hole.

In an embodiment of the present invention, the glue filling hole and the vacuum hole are located at the part of the side wall surface of the wall structure covered by the light-transmitting cover, and the wall structure includes a first through hole connected to the glue hole and connected to the vacuum pumping hole. hole for the second through hole. Forming the light-transmitting colloid cured layer on the substrate includes the following steps. The transparent glue is poured into the accommodating space through the glue filling hole and the first through hole. The gas in the accommodating space is drawn out through the vacuum hole and the second through hole.

In an embodiment of the invention, forming the second reflective element above the light shielding element includes the following steps. After forming the light-transmitting colloid solidified layer, a second reflective element is formed on the light-transmitting cover.

In an embodiment of the invention, forming the second reflective element above the light shielding element includes the following steps. Before disposing the light-transmitting cover, the light-shielding element is covered with the light-transmitting base, and the second reflection element is formed on the top surface of the light-transmitting base.

In an embodiment of the present invention, the manufacturing method of the imaging device further includes the following steps. Before forming the light-transmitting colloid solidified layer, an optical collimator or grating is arranged on the sensor.

Based on the above, in the image capturing device according to an embodiment of the present invention, since the light shielding element is disposed between the light source and the sensor, the light beam from the light source can be prevented from directly irradiating the sensor. In addition, since the first reflective element and the second reflective element help the light beam to reflect multiple times in the light-transmitting colloid solidified layer, the light beam transmitted to the imaging device can be made more uniform, thereby allowing the object to be measured to be uniform. By light. Therefore, the image capturing device according to an embodiment of the present invention can have good image capturing quality. In addition, in the manufacturing method of the image pickup device according to an embodiment of the present invention, since the light source, the light shielding element, the first reflective element and the sensor occupy a certain space, the required amount of light-transmitting colloid can be reduced, thereby reducing the manufacturing cost .

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

Description of drawings

Fig. 1 is a schematic cross-sectional view of an implementation of an imaging device according to the first embodiment of the present invention.

FIG. 2 is a schematic diagram of the lighting time of the light source and the imaging time of the sensor in FIG. 1 .

3 to 7 are schematic cross-sectional views of other implementations of the imaging device of the first embodiment.

Fig. 8 is a schematic cross-sectional view of an implementation of an image capturing device according to the second embodiment of the present invention.

Fig. 9 is a schematic cross-sectional view of another implementation of the imaging device of the second embodiment.

10 to 13 are schematic cross-sectional views of the manufacturing process of an implementation of the imaging device according to the first embodiment of the present invention.

14 to 17 are schematic cross-sectional views of the manufacturing process of another embodiment of the imaging device of the first embodiment of the present invention.

18 and 19 are schematic cross-sectional views of the manufacturing process of an implementation of the imaging device according to the second embodiment of the present invention.

20 to 22 are schematic cross-sectional views of the manufacturing process of another embodiment of the imaging device of the second embodiment of the present invention.

in:

100, 100A, 100B, 100C, AS: accommodation space

100D, 100E, 200, 200A: B, BB, BL: Beam

Acquisition Device MS: Microstructure

110: Substrate O: Object to be measured

112: Wall structure S: Enclosed space

120: light source S112T, S120T, S140T,

130: Sensor S160T, S170T, S210T:

140: shading element top surface

150: first reflective element S112S: side wall surface

152, 172: reflective element T1: first through hole

160: Translucent colloid curing layer T2: Second through hole

170: second reflective element TC: transparent cover

182, 184: Connecting line TC1: Glue hole

190: Optical collimator TC2: Vacuum hole

210: Light-transmitting base U: Imaging unit.

detailed description

The aforementioned and other technical contents, features and effects of the invention will be clearly presented in the following detailed descriptions of the embodiments with reference to the drawings. The directional terms mentioned in the following embodiments, such as "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the attached drawings. Accordingly, the directional terms used are for illustration and not for limitation of this creation. Also, in any of the following embodiments, the same or similar elements will be given the same or similar symbols.

Fig. 1 is a schematic cross-sectional view of an implementation of an imaging device according to the first embodiment of the present invention. Please refer to FIG. 1 , the imaging device 100 is suitable for capturing the biological characteristics of the object O to be tested. In this embodiment, the analyte O is, for example, a finger, and the biological feature is, for example, a fingerprint or a vein, but not limited thereto. For example, in another embodiment, the analyte O can also be a palm, and the biological feature can be a palm print.

The image capturing device 100 includes a substrate 110 , a light source 120 , a sensor 130 , a light-shielding element 140 , a first reflective element 150 , a transparent colloid solidified layer 160 and a second reflective element 170 .

The substrate 110 serves as a carrier for the above components, and the substrate 110 may have circuits. For example, the substrate 110 may be a printed circuit board (Printed Circuit Board, PCB), a flexible flexible printed circuit board (Flexible Printed Circuit Board, FPCB), a glass substrate with lines or a ceramic substrate with lines, but not This is the limit.

The light source 120 is disposed on the substrate 110 , and the light source 120 is electrically connected to the circuit on the substrate 110 . For example, the image capturing device 100 may further include a connection wire 182, and the light source 120 is electrically connected to the circuit on the substrate 110 through the connection wire 182, but not limited thereto. The light source 120 is adapted to provide a light beam B illuminating the object O to be tested. The light source 120 may include more than one light emitting element. The light emitting element may be a light emitting diode, a laser diode or a combination of the above two. In addition, the light beam B may be visible light, invisible light or a combination of the two. The non-visible light can be infrared light, but not limited thereto.

The sensor 130 is disposed on the substrate 110 and located beside the light source 120 . In addition, the sensor 130 is electrically connected to the circuit on the substrate 110 . For example, the image capturing device 100 may further include a connecting wire 184 through which the sensor 130 is electrically connected to the circuit on the substrate 110 , but not limited thereto. The sensor 130 is adapted to receive the part of the light beam B reflected by the object O (such as the light beam BB). For example, the sensor 130 may be a Charge Coupled Device (CCD), a Complementary Metal-Oxide Semiconductor (CMOS), or other suitable image sensing devices.

In one embodiment, a pulse width modulation circuit can be integrated in the sensor 130 . FIG. 2 is a schematic diagram of the lighting time of the light source and the imaging time of the sensor in FIG. 1 . Please refer to FIG. 2 , by controlling the light emitting time of the light source 120 and the image capturing time of the sensor 130 through the pulse width modulation circuit, the light emitting time of the light source 120 is synchronized with the image capturing time of the sensor 130, and the effect of precise control can be achieved, but not This is the limit.

Referring to FIG. 1 again, the light shielding element 140 is disposed on the substrate 110 and located between the light source 120 and the sensor 130 . The light shielding element 140 is suitable for shielding the large-angle light beam (such as the light beam BL) emitted by the light source 120 to avoid interference caused by the large-angle light beam directly irradiating the sensor 130 . For example, the light-shielding element 140 may be made of a light-absorbing material, or formed by forming a light-absorbing layer on a light-transmitting block. In addition, the height of the shading element 140 may be greater than or equal to the height of the light source 120 and less than the height of the light-transmitting colloid cured layer 160 . That is to say, the top surface S140T of the light shielding element 140 may be higher than the top surface S120T of the light source 120 or be flush with the top surface S120T of the light source 120 . In addition, the top surface S140T of the light-shielding element 140 is lower than the top surface S160T of the light-transmitting colloid cured layer 160 to allow part of the light beam (such as the light beam B) emitted by the light source 120 to pass through.

The first reflective element 150 is disposed on the substrate 110 and located between the light shielding element 140 and the sensor 130 . The first reflective element 150 is adapted to reflect the light beam B passing toward the substrate 110 , so that the light beam B passes away from the substrate 110 . For example, the first reflective element 150 may be a reflective sheet or a reflective layer formed on the substrate 110 by at least one of electroplating, printing, etching, pasting and coating.

The transparent colloid solidified layer 160 is disposed on the substrate 110 and covers the light source 120 , the sensor 130 , the light shielding element 140 and the first reflective element 150 . The light-transmitting colloid solidified layer 160 can be formed by curing the light-transmissive colloid through a heating process or a light-irradiating process. The light-transmitting colloid may be epoxy resin (epoxy), silica gel, optical glue, resin (resin) or other suitable light-transmitting materials.

The second reflective element 170 is disposed above the light shielding element 140 and between the light source 120 and the sensor 130 . Specifically, the second reflective element 170 is at least located on the transmission path of the light beam B from the light source 120 and not shielded by the light shielding element 140, so as to reflect the light beam B transmitted toward the top surface S160T of the light-transmitting colloid cured layer 160, so that the light beam B transmitted toward the first reflective element 150 . The second reflective element 170 may be a reflective sheet or a reflective layer formed on the transparent colloid cured layer 160 by at least one of electroplating, printing, etching, pasting and coating.

In this embodiment, the second reflective element 170 is disposed on the top surface S160T of the light-transmitting colloid cured layer 160 , but it is not limited thereto. The second reflective element 170 may extend from above the light shielding element 140 toward above the first reflective element 150 , and the second reflective element 170 exposes the sensor 130 . The second reflective element 170 may partially overlap the first reflective element 150 , but not limited thereto. In another embodiment, the second reflective element 170 and the first reflective element 150 may completely overlap or not overlap at all. In addition, the first reflective element 150 and the second reflective element 170 may have the same or different reflectivity.

Since the first reflective element 150 and the second reflective element 170 help to allow the light beam B to be reflected multiple times in the light-transmitting colloid solidified layer 160, the light beam B transmitted in the imaging device 100 can be made more uniform, thereby allowing the The object O can receive light evenly, which helps the sensor 130 to capture a complete biometric image. Therefore, the image capturing device 100 can have good image capturing quality.

In this embodiment, the analyte O is directly pressed on the top surface S160T of the light-transmitting colloid solidified layer 160 for biometric identification. In an embodiment, the image capturing device 100 may further include a protective cover (not shown) or a protective film (not shown). The protective cover or protective film is arranged on the light-transmitting colloid solidified layer 160 and the second reflective element 170, and the object O to be tested is pressed on the surface of the protective cover or protective film away from the second reflective element 170 for biometric identification . The protective cover or protective film can protect the light-transmissive colloid cured layer 160 and the second reflective element 170 (for example, anti-scratch).

3 to 7 are schematic cross-sectional views of other implementations of the imaging device of the first embodiment, wherein the same components are denoted by the same reference numerals, and will not be repeated below.

Referring to FIG. 3 , the main differences between the image capturing device 100A and the image capturing device 100 in FIG. 1 are as follows. In the imaging device 100A, the plurality of microstructures MS may be formed on the surface of at least one of the substrate 110, the first reflective element 150, the light-transmitting colloid cured layer 160, and the second reflective element 170, so as to increase The amount of reflection of beam B, making beam B more uniform. FIG. 3 schematically shows that a plurality of microstructures MS are formed on the surface of the first reflective element 150 away from the substrate 110 , but it is not limited thereto. In another embodiment, the plurality of microstructures MS may be formed on the area of the substrate 110 other than the above-mentioned components. The plurality of microstructures MS may be formed on the top surface S160T of the light-transmitting colloid solidified layer 160 , and the plurality of microstructures MS are disposed on a part or all of the second reflective element 170 . The plurality of microstructures MS may be formed on a surface of the second reflective element 170 facing the substrate 110 and/or a surface away from the substrate 110 .

It should be added that the plurality of microstructures MS may be fully or partially configured on the above-mentioned components, and the plurality of microstructures MS may be configured on the above-mentioned components in a continuous or spaced manner. In addition, in any feasible embodiment of the present invention, the plurality of microstructures MS may also be partially bonded and configured on the first reflective element 150 or the second reflective element 170 . For example, the plurality of microstructures MS and the first reflective element 150 (or the second reflective element 170 ) can be bonded through a ring-shaped adhesive layer (not shown), wherein the ring-shaped adhesive layer is located on the plurality of Between a part of the microstructure MS and a part of the first reflective element 150 (or the second reflective element 170), and another part of the plurality of microstructure MS and the first reflective element 150 (or the second reflective element 170) No adhesive layer is provided between the other parts, so that the plurality of microstructures MS, the ring-shaped adhesive layer and the first reflective element 150 (or the second reflective element 170 ) enclose an air gap layer (not shown).

Under the framework of FIG. 3 , the image capturing device 100A may further include a protective cover (not shown) or a protective film (not shown) disposed on the transparent colloid solidified layer 160 and the second reflective element 170 . For related descriptions, please refer to the relevant paragraphs above, and will not be repeated here.

Referring to FIG. 4 , the main differences between the image capturing device 100B and the image capturing device 100 in FIG. 1 are as follows. In the image capturing device 100B, the first reflective element 150 includes a plurality of reflective elements 152 arranged at intervals, and the second reflective element 170 includes a plurality of reflective elements 172 arranged at intervals. Specifically, each of the first reflective element 150 and the second reflective element 170 may be composed of more than one reflective element (such as a reflective sheet or a reflective layer). When the reflective element is composed of multiple reflective elements, these reflective elements can be arranged at intervals. The spaced arrangement may include equal-spaced arrangement and unequal-spaced arrangement (scattered distribution). In another embodiment, only one of the first reflective element 150 and the second reflective element 170 includes a plurality of reflective elements arranged at intervals.

Under the framework of FIG. 4 , the image capturing device 100B may further include a protective cover (not shown) or a protective film (not shown) disposed on the transparent colloid solidified layer 160 and the second reflective element 170 . In addition, a plurality of microstructures MS ( See Figure 3). For related descriptions, please refer to the relevant paragraphs above, and will not be repeated here.

Referring to FIG. 5 , the main differences between the image capturing device 100C and the image capturing device 100 in FIG. 1 are as follows. In the image capturing device 100C, the image capturing device 100C further includes an optical collimator 190 disposed on the sensor 130 and located between the light-transmitting colloid solidified layer 160 and the sensor 130 . The optical collimator 190 is adapted to collimate the light beam delivered to the sensor 130 . In another embodiment, the optical collimator 190 can also be replaced by a grating. In addition, the optical collimator 190 and the grating can be fixed on the sensor 130 through an adhesive layer (not shown) or a fixing mechanism (not shown).

Under the framework of FIG. 5 , the image capturing device 100C may further include a protective cover (not shown) or a protective film (not shown) disposed on the transparent colloid solidified layer 160 and the second reflective element 170 . In addition, a plurality of microstructures MS may be formed on the surface of at least one of the substrate 110 , the first reflective element 150 , the light-transmitting colloid cured layer 160 and the second reflective element 170 (see FIG. 3 ). In addition, at least one of the first reflective element 150 and the second reflective element 170 may include a plurality of reflective elements arranged at intervals (see FIG. 4 ). For related descriptions, please refer to the relevant paragraphs above, and will not be repeated here.

Please refer to FIG. 6 , the main differences between the image capturing device 100D and the image capturing device 100 in FIG. 1 are as follows. In the image capturing device 100D, the image capturing device 100D further includes a wall structure 112 . The wall structure 112 is disposed on the substrate 110 , wherein the wall structure 112 and the substrate 110 form an accommodating space AS for accommodating the light source 120 , the sensor 130 , the shading element 140 and the first reflective element 150 . In one embodiment, the wall structure 112 and the base plate 110 may be integrally formed. For example, the wall structure 112 and the base plate 110 can be formed by removing a groove from a base material, wherein the space occupied before the groove is removed is the accommodating space AS. In another embodiment, the wall structure 112 may be fixed on the base plate 110 through mechanical components or an adhesive layer (not shown), and the wall structure 112 and the base plate 110 may have the same or different materials.

Under the framework of FIG. 6 , the image capturing device 100D may further include a protective cover (not shown) or a protective film (not shown) disposed on the transparent colloid solidified layer 160 and the second reflective element 170 . In addition, a plurality of microstructures MS may be formed on the surface of at least one of the substrate 110 , the first reflective element 150 , the light-transmitting colloid cured layer 160 and the second reflective element 170 (see FIG. 3 ). In addition, at least one of the first reflective element 150 and the second reflective element 170 may include a plurality of reflective elements arranged at intervals (see FIG. 4 ). Furthermore, the imaging device 100D may further include an optical collimator 190 (see FIG. 5 ) or a grating disposed on the sensor 130 and located between the light-transmitting colloid solidified layer 160 and the sensor 130 . For related descriptions, please refer to the relevant paragraphs above, and will not be repeated here.

Please refer to FIG. 7 , the main differences between the image capturing device 100E and the image capturing device 100D in FIG. 6 are as follows. In the image capturing device 100E, the image capturing device 100E further includes a transparent cover TC. The transparent cover TC is disposed on the transparent glue solidified layer 160 and covers the light source 120 , the sensor 130 , the shading element 140 , the first reflective element 150 , the connecting wire 182 , the connecting wire 184 and the wall structure 112 . In addition, the second reflective element 170 is disposed on the transparent cover TC.

The transparent cover TC has a glue filling hole TC1 and a vacuum hole TC2. The glue filling hole TC1 is suitable for filling the transparent glue forming the transparent glue solidified layer 160 , and the vacuum hole TC2 is suitable for connecting with a vacuum device to extract the gas in the accommodating space AS when filling the transparent glue.

In this embodiment, the light-transmitting cover TC also covers the side wall surface S112S of the wall structure 112, and the glue filling hole TC1 and the vacuum hole TC2 are respectively formed on the side wall surface of the light-transmitting cover TC covering the wall structure 112 S112S part. The wall structure 112 includes a first through hole T1 and a second through hole T2. The first through hole T1 and the second through hole T2 are respectively formed in the part of the wall structure 112 located on two opposite sides of the substrate 110, wherein the first through hole T1 is connected to the glue filling hole TC1, and the second through hole T2 is connected to the vacuum pumping hole. hole TC2 connection. However, the present invention is not limited thereto. The glue filling hole TC1 and the vacuum hole TC2 can be formed on the portion of the transparent cover TC on the substrate 110 , so that the wall structure 112 does not need to form the first through hole T1 and the second through hole T2 .

Under the framework of FIG. 7 , the image capturing device 100E may further include a protective cover (not shown) or a protective film (not shown) disposed on the transparent cover TC and the second reflective element 170 . In addition, a plurality of microstructures MS may be formed on the surface of at least one of the substrate 110 , the first reflective element 150 , the light-transmitting colloid cured layer 160 and the second reflective element 170 (see FIG. 3 ). In addition, at least one of the first reflective element 150 and the second reflective element 170 may include a plurality of reflective elements arranged at intervals (see FIG. 4 ). Moreover, the imaging device 100E may further include an optical collimator 190 (see FIG. 5 ) or a grating disposed on the sensor 130 and located between the light-transmitting colloid solidified layer 160 and the sensor 130 . For related descriptions, please refer to the relevant paragraphs above, and will not be repeated here.

Fig. 8 is a schematic cross-sectional view of an implementation of an image capturing device according to the second embodiment of the present invention. Please refer to FIG. 8 , the image capturing device 200 is similar to the image capturing device 100 in FIG. 1 , wherein the same components are denoted by the same reference numerals, and will not be repeated below. The main differences between the imaging device 200 and the imaging device 100 in FIG. 1 are as follows. In the image capturing device 200 , the image capturing device 200 further includes a transparent base 210 . The transparent base 210 is disposed on the substrate 110 and covers the light shielding element 140 .

In this embodiment, the light-transmitting base 210 is a light-transmitting casing for covering the light-shielding element 140 , and the light-transmitting casing and the substrate 110 form a closed space S for accommodating the light-shielding element 140 . The light shielding element 140 may not fill the closed space S, that is, there may be a gap between the light shielding element 140 and the light-transmitting housing. The gap may be filled with an adhesive material used to fix the light shielding element 140 and the light-transmitting case, but not limited thereto. In another embodiment, the light-transmitting base 210 may be a light-transmitting layer formed on the sidewall surface and the top surface of the light-shielding element 140 by at least one of electroplating, printing, etching, pasting, and coating. , and the transparent layer can be made of more than one layer of transparent material.

In this embodiment, the transparent base 210 does not cover the first reflective element 150 , that is, the transparent base 210 does not overlap with the first reflective element 150 , but not limited thereto. In another embodiment, the transparent base 210 may cover a portion of the first reflective element 150 adjacent to the transparent base 210 , so that the transparent base 210 partially overlaps the first reflective element 150 .

The second reflective element 170 is disposed on the top surface S210T of the transparent base 210 , wherein the top surface S170T of the second reflective element 170 can be flush with the top surface S160T of the transparent colloid cured layer 160 . That is to say, the top surface S170T of the second reflective element 170 has the same height as the top surface S160T of the transparent colloid cured layer 160 , but not limited thereto. In another embodiment, the top surface S170T of the second reflective element 170 may be lower than the top surface S160T of the light-transmissive colloid solidified layer 160, and the light-transmissive colloid solidified layer 160 may further cover the second reflective element 170 and be located on the second reflective surface. Light-transmitting base 210 under element 170 .

Under the framework of FIG. 8 , the imaging device 200 may further include a protective cover (not shown) or a protective film (not shown) disposed on the light-transmitting colloid solidified layer 160 and the second reflective element 170 . In addition, a plurality of microstructures MS may be formed on the surface of at least one of the substrate 110 , the first reflective element 150 , the light-transmitting colloid cured layer 160 and the second reflective element 170 (see FIG. 3 ). In addition, at least one of the first reflective element 150 and the second reflective element 170 may include a plurality of reflective elements arranged at intervals (see FIG. 4 ). Furthermore, the imaging device 200 may further include an optical collimator 190 (see FIG. 5 ) or a grating disposed on the sensor 130 and located between the light-transmitting colloid solidified layer 160 and the sensor 130 . Furthermore, the imaging device 200 may further include a wall structure 112 (see FIG. 6 ). For related descriptions, please refer to the relevant paragraphs above, and will not be repeated here.

Fig. 9 is a schematic cross-sectional view of another implementation of the imaging device of the second embodiment. Please refer to FIG. 9 , the image capturing device 200A is similar to the image capturing device 200 in FIG. 8 , wherein the same elements are denoted by the same reference numerals, and will not be repeated below. The main differences between the imaging device 200A and the imaging device 200 in FIG. 8 are as follows. In the image capturing device 200A, the image capturing device 200A further includes a wall structure 112 and a transparent cover TC. For the relevant description of the wall structure 112 and the transparent cover TC, please refer to the relevant paragraphs above, and will not be repeated here.

Under the framework of FIG. 9 , the light-transmitting cover TC can protect the light-transmitting colloid solidified layer 160 and the second reflective element 170 located below, so there is no need to additionally provide a protective cover or protective film. In addition, a plurality of microstructures MS may be formed on the surface of at least one of the substrate 110 , the first reflective element 150 , the light-transmitting colloid cured layer 160 and the second reflective element 170 (see FIG. 3 ). In addition, at least one of the first reflective element 150 and the second reflective element 170 may include a plurality of reflective elements arranged at intervals (see FIG. 4 ). Furthermore, the imaging device 200A may further include an optical collimator 190 (see FIG. 5 ) or a grating disposed on the sensor 130 and located between the light-transmitting colloid cured layer 160 and the sensor 130 . For related descriptions, please refer to the relevant paragraphs above, and will not be repeated here.

The manufacturing methods of the imaging devices of the first embodiment and the second embodiment are described below with reference to FIGS. 10 to 22 . However, the manufacturing methods of the imaging devices of the first embodiment and the second embodiment are not limited to the following.

10 to 13 are schematic cross-sectional views of the manufacturing process of an implementation of the imaging device according to the first embodiment of the present invention. Referring to FIG. 10 , the light source 120 , the sensor 130 , the light-shielding element 140 and the first reflective element 150 are disposed on the substrate 110 . The relative arrangement of the above-mentioned elements can be referred to the relevant paragraphs above, and will not be repeated here. In this embodiment, connecting wires 182, connecting wires 184, and wall structure 112 can be further arranged on the substrate 110, wherein the light source 120 is electrically connected to the circuit on the substrate 110 through the connecting wire 182, and the sensor 130 is connected through the connecting wire 182. The wire 184 is electrically connected to the circuit on the substrate 110 , and the wall structure 112 and the substrate 110 form an accommodating space AS for accommodating the light source 120 , the sensor 130 , the shading element 140 and the first reflective element 150 . In another embodiment, at least one of the light source 120 and the sensor 130 can be connected to the circuit on the substrate 110 through solder balls, and at least one of the connecting wire 182 and the connecting wire 184 can be omitted.

The order in which the light source 120 , the sensor 130 , the shading element 140 , the first reflective element 150 , the connecting wire 182 , the connecting wire 184 , and the wall structure 112 are arranged on the substrate 110 can be determined according to requirements, and no further description is given here.

Referring to FIG. 11 , a light-transmitting colloid solidified layer 160 is formed on the substrate 110 , wherein the light-transmissive colloid solidified layer 160 covers the light source 120 , the sensor 130 , the shading element 140 , the first reflective element 150 , the connecting wire 182 and the connecting wire 184 .

Forming the light-transmitting colloid solidified layer 160 may include the following steps. First, a transparent colloid is formed on the substrate 110 . The light-transmitting colloid can be heat-curable colloid or light-curable colloid. Secondly, the light-transmitting colloid can be cured through a heating process or a lighting process. The heating process may include a baking procedure. If the heat-up process is used to cure the light-transmitting glue, the cured light-transmitting glue may expand due to heat, so that the top surface of the cured light-transmitting glue is higher than the top surface S112T of the wall structure 112 . Therefore, in any feasible embodiment of the present invention, the cured light-transmitting colloid can be selectively thinned through a grinding process. In addition to reducing the overall thickness, the grinding process can also make the top surface S160T of the transparent colloid solidified layer 160 more flat. In this embodiment, the top surface S160T of the light-transmitting colloid solidified layer 160 is flush with the top surface S112T of the wall structure 112 , that is, the top surface S160T of the light-transmissive colloid solidified layer 160 is flush with the top surface S112T of the wall structure 112 S112T has the same height, but not limited thereto.

It is worth mentioning that when the light-transmitting colloid is filled into the accommodating space AS, due to the protection of the wall structure 112, the light-transmitting colloid will not directly impact the components located in the accommodating space AS (such as the connection line 182, The connecting wire 184 and the light source 120, etc.), thereby helping to improve problems such as disconnection and component offset, thereby improving yield and reducing cost.

Referring to FIG. 12 , a second reflective element 170 is formed above the light shielding element 140 . Specifically, the second reflective element 170 is disposed on the top surface S160T of the transparent colloid cured layer 160 and located between the light source 120 and the sensor 130 . In this way, the imaging device (such as the imaging device 100D in FIG. 6 ) is preliminarily completed.

Please refer to FIG. 13 , multiple imaging units U (including a light source 120 , a sensor 130 , a shading element 140 , a first reflective element 150 , a light-transmitting colloid solidified layer 160 and a second reflective element 170 ) can be fabricated simultaneously on a substrate 110 . And through a cutting process (for example, cutting the substrate 110 along the dotted line in FIG. 13 ) to divide a plurality of imaging devices. During the cutting process, if the wall structure 112 is removed together, the imaging device 100 shown in FIG. 1 is formed. On the contrary, if the wall structure 112 remains, the imaging device 100D shown in FIG. 6 is formed.

After forming the second reflective element 170 , a protective cover (not shown) or a protective film (not shown) can be further disposed on the transparent colloid cured layer 160 and the second reflective element 170 . In addition, in the step of manufacturing the imaging device, a plurality of microstructures may be further formed on the surface of at least one of the substrate 110 , the first reflective element 150 , the light-transmitting colloid cured layer 160 , and the second reflective element 170 . For example, before filling the light-transmitting colloid into the accommodating space AS in FIG. 11 , multiple microstructures can be formed on the surface of the first reflective element 150 away from the substrate 110 , so that the imaging shown in FIG. 3 can be formed. Apparatus 100A. In addition, in the step of forming the first reflective element 150 in FIG. 10 and the step of forming the second reflective element 170 in FIG. 12, a single reflective unit can be replaced by a plurality of reflective units, so that the imaging device shown in FIG. 4 can be formed. 100B. Furthermore, before forming the light-transmitting colloid solidified layer 160 in FIG. 11 , an optical collimator or grating can be disposed on the sensor 130 , so that the imaging device 100C shown in FIG. 5 can be formed.

14 to 17 are schematic cross-sectional views of the manufacturing process of another embodiment of the imaging device of the first embodiment of the present invention. Referring to FIG. 14, the light source 120, the sensor 130, the shading element 140, the first reflective element 150, the connecting wire 182, the connecting wire 184, and the wall structure 112 are arranged on the substrate 110, wherein the order in which the above-mentioned elements are arranged on the substrate 110 can be changed. It depends on the needs, so I won't explain more here. In addition, for the relative configuration relationship of the above components, please refer to the relevant paragraphs above, which will not be repeated here.

In this embodiment, the wall structure 112 includes a first through hole T1 and a second through hole T2 . The first through hole T1 and the second through hole T2 are respectively formed in portions of the wall structure 112 located on two opposite sides of the substrate 110 .

15, the light source 120, the sensor 130, the shading element 140, the first reflective element 150, the wall structure 112, the connection line 182 and the connection line 184 are covered with a light-transmitting cover TC, wherein the light-transmitting cover TC has glue hole TC1 and vacuum hole TC2. The glue filling hole TC1 is suitable for filling the transparent glue forming the transparent glue solidified layer 160 , and the vacuum hole TC2 is suitable for connecting with a vacuum device to extract the gas in the accommodating space AS when filling the transparent glue.

In this embodiment, the light-transmitting cover TC also covers the side wall surface S112S of the wall structure 112, and the glue filling hole TC1 and the vacuum hole TC2 are respectively formed on the side wall surface of the light-transmitting cover TC covering the wall structure 112 S112S part. The glue filling hole TC1 is connected to the first through hole T1, so that the glue filling hole TC1 and the first through hole T1 form a channel connecting the external space and the accommodating space AS. On the other hand, the vacuum hole TC2 is connected to the second through hole T2, so that the vacuum hole TC2 and the second through hole T2 form a channel connecting the external space and the accommodating space AS.

Referring to FIG. 16 , a light-transmitting colloid solidified layer 160 is formed on the substrate 110 , wherein the light-transmissive colloid solidified layer 160 covers the light source 120 , the sensor 130 , the shading element 140 , the first reflective element 150 , the connection line 182 and the connection line 184 .

Forming the light-transmitting colloid cured layer 160 on the substrate 110 may include the following steps. The light-transmitting colloid is poured into the accommodating space AS through the glue filling hole TC1 and the first through hole T1, and the gas in the accommodating space AS is pumped out through the vacuum hole TC2 and the second through hole T2. Can be done simultaneously. In this way, the transparent colloid poured into the accommodating space AS can be kept in a vacuum state, which helps to prevent air bubbles from forming in the transparent colloid. In yet another embodiment, the substrate 110 can be placed on a vibration plane. When pouring glue, the vibrating plane can be vibrated. Via the vibration, it is helpful to evenly fill the transparent colloid in the accommodating space AS. Then, the gas in the accommodating space AS is exhausted through the vacuum hole TC2 and the second through hole T2, which can avoid the generation of air bubbles, thereby achieving the effect of improving the overall yield.

In another embodiment, the glue filling hole TC1 and the vacuum hole TC2 can be formed on the part of the transparent cover TC on the substrate 110, so that the wall structure 112 does not need to form the first through hole T1 and the second through hole. T2. Under this framework, forming the transparent colloid solidified layer 160 on the substrate 110 includes the following steps. The translucent glue is poured into the accommodating space AS through the glue filling hole TC1 , and the gas in the accommodating space AS is pumped out through the vacuum hole TC2 . The vibration can also be used to evenly fill the transparent colloid in the accommodating space AS.

Referring to FIG. 17 , a second reflective element 170 is formed on the transparent cover TC. In this way, the imaging device (such as the imaging device 100E in FIG. 7 ) is preliminarily completed.

After forming the second reflective element 170 , a protective cover (not shown) or a protective film (not shown) may be further disposed on the transparent cover TC and the second reflective element 170 . In addition, in the step of manufacturing the imaging device, a plurality of microstructures may be further formed on the surface of at least one of the substrate 110 , the first reflective element 150 , the light-transmitting colloid cured layer 160 , and the second reflective element 170 . In addition, in the step of forming the first reflective element 150 in FIG. 14 and the step of forming the second reflective element 170 in FIG. 17 , a single reflective unit may be replaced by multiple reflective units. In addition, before forming the transparent cover TC in FIG. 15 , an optical collimator or a grating can be arranged on the sensor 130 .

18 and 19 are schematic cross-sectional views of the manufacturing process of an implementation of the imaging device according to the second embodiment of the present invention. Referring to FIG. 18, the light source 120, the sensor 130, the shading element 140, the first reflective element 150, the connection line 182, the connection line 184, and the wall structure 112 are arranged on the substrate 110, wherein the order in which the above elements are arranged on the substrate 110 can be changed. It depends on the needs, so I won't explain more here. In addition, after disposing the light-shielding element 140 on the substrate 110 , the light-shielding element 140 may be covered by the light-transmitting base 210 , and the second reflective element 170 may be formed on the top surface S210T of the light-transmitting base 210 . For the relative configuration relationship of the above components, please refer to the relevant paragraphs above, which will not be repeated here.

In this embodiment, the top surface S170T of the second reflective element 170 is flush with the top surface S112T of the wall structure 112, that is, the top surface S170T of the second reflective element 170 and the top surface S112T of the wall structure 112 have Same height, but not limited to. In another embodiment, the top surface S170T of the second reflective element 170 may be lower than the top surface S112T of the wall structure 112 .

Referring to FIG. 19 , a transparent colloid solidified layer 160 is formed on the substrate 110 , wherein the translucent colloid solidified layer 160 covers the light source 120 , the sensor 130 , the shading element 140 , the first reflective element 150 , the connection line 182 and the connection line 184 . For the relevant description of forming the light-transmitting colloid solidified layer 160 , please refer to the relevant paragraphs above, and will not be repeated here.

Under the structure that the top surface S170T of the second reflective element 170 is flush with the top surface S112T of the wall structure 112, the top surface S160T of the light-transmitting colloid solidified layer 160 can be flush with the top surface S170T of the second reflective element 170 and the top surface S112T of the wall structure 112. The top surface S112T of the wall structure 112, but not limited thereto. Under the structure that the top surface S170T of the second reflective element 170 is lower than the top surface S112T of the wall structure 112, the top surface S160T of the light-transmitting colloid solidified layer 160 can be flush with the top surface S112T of the wall structure 112, and the transparent The photocolloid solidified layer 160 can further cover the transparent base 210 and the second reflective element 170 .

In one embodiment, the wall structure 112 can be further removed by a cutting process to form the imaging device 200 shown in FIG. 8 . In addition, after forming the transparent colloid solidified layer 160 , a protective cover (not shown) or a protective film (not shown) may be further disposed on the transparent colloid solidified layer 160 and the second reflective element 170 . In addition, in the step of manufacturing the imaging device, a plurality of microstructures may be further formed on the surface of at least one of the substrate 110 , the first reflective element 150 , the light-transmitting colloid cured layer 160 , and the second reflective element 170 . Furthermore, in the step of forming the first reflective element 150 and the second reflective element 170 in FIG. 18 , a single reflective unit may be replaced by multiple reflective units. Furthermore, before the light-transmitting colloid solidified layer 160 is formed in FIG. 19 , an optical collimator or grating can be arranged on the sensor 130 .

20 to 22 are schematic cross-sectional views of the manufacturing process of another embodiment of the imaging device of the second embodiment of the present invention. Please refer to FIG. 20 , the light source 120 , the sensor 130 , the shading element 140 , the first reflective element 150 , the light-transmitting base 210 , the second reflective element 170 , the connection line 182 , the connection line 184 and the wall structure 112 are arranged on the substrate 110 , wherein the order in which the above-mentioned elements are arranged on the substrate 110 can be determined according to requirements, and will not be further described here. In addition, for the relative configuration relationship of the above components, please refer to the relevant paragraphs above, which will not be repeated here.

In this embodiment, the wall structure 112 includes a first through hole T1 and a second through hole T2 . The first through hole T1 and the second through hole T2 are respectively formed in portions of the wall structure 112 located on two opposite sides of the substrate 110 .

Please refer to FIG. 21, cover the light source 120, the sensor 130, the shading element 140, the first reflective element 150, the light-transmitting base 210, the second reflective element 170, the connecting wire 182, the connecting wire 184 and the wall with the transparent cover TC. Structure 112, wherein the transparent cover TC has a glue filling hole TC1 and a vacuum hole TC2. The glue filling hole TC1 is suitable for filling the transparent glue forming the transparent glue solidified layer 160 , and the vacuum hole TC2 is suitable for connecting with a vacuum device to extract the gas in the accommodating space AS when filling the transparent glue.

In this embodiment, the light-transmitting cover TC also covers the side wall surface S112S of the wall structure 112, and the glue filling hole TC1 and the vacuum hole TC2 are respectively formed on the side wall surface of the light-transmitting cover TC covering the wall structure 112 S112S part. The glue filling hole TC1 is connected to the first through hole T1, so that the glue filling hole TC1 and the first through hole T1 form a channel connecting the external space and the accommodating space AS. On the other hand, the vacuum hole TC2 is connected to the second through hole T2, so that the vacuum hole TC2 and the second through hole T2 form a channel connecting the external space and the accommodating space AS.

Referring to FIG. 22 , a light-transmitting colloid solidified layer 160 is formed on the substrate 110 , wherein the light-transmissive colloid solidified layer 160 covers the light source 120 , the sensor 130 , the shading element 140 , the first reflective element 150 , the connection line 182 and the connection line 184 . For the related description of forming the light-transmitting colloid solidified layer 160 on the substrate 110 , please refer to the relevant paragraphs above, and will not be repeated here. In this way, the imaging device (such as the imaging device 200A in FIG. 9 ) is preliminarily completed.

Under the framework of FIG. 22 , the light-transmitting cover TC can protect the light-transmitting colloid solidified layer 160 and the second reflective element 170 below, so there is no need to additionally provide a protective cover or protective film. In addition, in the step of manufacturing the imaging device, a plurality of microstructures may be further formed on the surface of at least one of the substrate 110 , the first reflective element 150 , the light-transmitting colloid cured layer 160 and the second reflective element 170 . In addition, in the step of forming the first reflective element 150 and the second reflective element 170 in FIG. 20 , a single reflective unit may be replaced by multiple reflective units. Furthermore, before the light-transmitting cover TC is provided in FIG. 21 , an optical collimator or grating can be arranged on the sensor 130 .

To sum up, in the image capturing device according to an embodiment of the present invention, since the light shielding element is arranged between the light source and the sensor, the light beam from the light source can be prevented from directly irradiating the sensor. In addition, since the first reflective element and the second reflective element help the light beam to reflect multiple times in the light-transmitting colloid solidified layer, the light beam transmitted to the imaging device can be made more uniform, thereby allowing the object to be measured to be uniform. By light. Therefore, the image capturing device according to an embodiment of the present invention can have good image capturing quality. In an embodiment, the image capturing device may further include a protective cover or a protective film to protect (for example, scratch-proof) the underlying elements (such as the light-transmitting colloid solidified layer 160 or the second reflective element). In another embodiment, a plurality of microstructures may be formed on the surface of at least one of the substrate, the first reflective element, the light-transmitting colloid cured layer, and the second reflective element, so as to increase the reflection of the light beam and make the light beam more uniform. In yet another embodiment, at least one of the first reflective element and the second reflective element may include a plurality of reflective elements arranged at intervals to make the light beam uniform. In yet another embodiment, the imaging device may further include an optical collimator or a grating to collimate the beam delivered to the sensor. In addition, in the manufacturing method of the image pickup device according to an embodiment of the present invention, since the light source, the light shielding element, the first reflective element and the sensor occupy a certain space, the required amount of light-transmitting colloid can be reduced, thereby reducing the manufacturing cost . In one embodiment, the wall structure can be formed before the glue pouring, so as to improve problems such as disconnection and component deviation during the glue pouring process, thereby improving the yield and reducing the cost. In another embodiment, the gas in the accommodating space can be pumped out while the glue is poured to avoid the generation of air bubbles, and the light-transmitting colloid can be evenly filled in the accommodating space by vibrating the substrate, thereby achieving an overall Yield improvement effect.

Although the present invention has been disclosed as above with the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the scope of the appended patent application.

Claims (18)

1. An imaging device, characterized in that, comprising: a substrate; a light source configured on the substrate; a sensor configured on the substrate and located next to the light source; a shading element, configured on the substrate and located between the light source and the sensor; a first reflective element, configured on the substrate and located between the light shielding element and the sensor; a light-transmitting colloid solidified layer, disposed on the substrate and covering the sensor, the light source, the shading element and the first reflective element; and A second reflective element is disposed above the shading element and between the light source and the sensor. 2. The image pickup device according to claim 1, wherein at least one of the substrate, the first reflective element, the light-transmitting colloid solidified layer, and the second reflective element has a surface Multiple microstructures are formed on it. 3. The image capturing device according to claim 1, wherein a pulse width modulation circuit is integrated in the sensor. 4. The image capturing device according to claim 1, wherein the second reflective element is disposed on the top surface of the light-transmitting colloid solidified layer. 5. The imaging device according to claim 1, further comprising: a light-transmitting base disposed on the substrate and covering the light-shielding element, wherein the second reflective element is disposed on the on the top surface of the light-transmitting base. 6 . The image capturing device according to claim 1 , wherein at least one of the first reflective element and the second reflective element comprises a plurality of light reflective elements arranged at intervals. 7. The imaging device according to claim 1, further comprising: a plurality of connecting wires respectively connected between the substrate and the sensor and between the substrate and the light source; and A wall structure is disposed on the substrate, wherein the wall structure and the substrate form an accommodating space for accommodating the light source, the sensor, the shading element and the first reflective element. 8. The imaging device according to claim 7, further comprising: a light-transmitting cover disposed on the light-transmitting colloid solidified layer and covering the light source, the sensor, and the shading element , the first reflective element, a plurality of the connecting lines and the wall structure, and the second reflective element is arranged on the transparent cover, wherein the transparent cover has a glue hole and a vacuum hole. 9. The imaging device according to claim 1, further comprising: an optical collimator or a grating disposed on the sensor and between the light-transmitting colloid solidified layer and the sensor . 10. A method for manufacturing an image-taking device, comprising: A light source, a sensor, a shading element and a first reflective element are arranged on a substrate, wherein the sensor is located beside the light source, the shading element is located between the light source and the sensor, and the first reflective element a reflective element is located between the shading element and the sensor; forming a light-transmitting colloid solidified layer on the substrate, wherein the light-transmissive colloid solidified layer covers the sensor, the light source, the shading element and the first reflective element; and A second reflective element is formed above the light shielding element, wherein the second reflective element is located between the light source and the sensor. 11. The manufacturing method of the imaging device according to claim 10, further comprising: A plurality of microstructures are formed on the surface of at least one of the substrate, the first reflective element, the light-transmitting colloid cured layer, and the second reflective element. 12. The method for manufacturing an image pickup device according to claim 10, wherein forming the light-transmitting colloid solidified layer comprises: forming a transparent colloid on the substrate; curing the light-transmitting colloid; and Thinning the cured light-transmitting colloid to form a cured layer of the light-transmitting colloid. 13. The method for manufacturing an image pickup device according to claim 10, wherein forming the second reflective element above the light shielding element comprises: After the light-transmitting colloid solidified layer is formed, the second reflective element is formed on the light-transmissive colloid solidified layer. 14. The manufacturing method of the imaging device according to claim 10, further comprising: Before forming the light-transmitting colloid solidified layer, a wall structure is formed on the substrate, and the wall structure forms with the substrate to accommodate the light source, the sensor, the shading element and the first an accommodating space for the reflective element; Before forming the light-transmitting colloid solidified layer, a plurality of connection lines are formed on the substrate, and the plurality of connection lines are respectively connected between the substrate and the sensor and between the substrate and the light source ;as well as Before forming the light-transmitting colloid solidified layer and after forming a plurality of the connection lines, cover the light source, the sensor, the light-shielding element, the first reflective element, the A wall structure and a plurality of connecting lines, and the light-transmitting cover covers the side wall of the wall structure, wherein the light-transmitting cover has a glue filling hole and a vacuum hole, Wherein forming the light-transmitting colloid solidified layer on the substrate comprises: pouring a light-transmitting colloid into the accommodating space through the glue filling hole; and The gas in the accommodating space is drawn out through the vacuum hole. 15. The manufacturing method of the imaging device according to claim 14, wherein the glue filling hole and the vacuuming hole are located on the side wall surface of the transparent cover covering the wall structure. part, and the wall structure includes a first through hole connected to the glue filling hole and a second through hole connected to the vacuum hole, Wherein forming the light-transmitting colloid solidified layer on the substrate comprises: pouring the light-transmitting glue into the accommodating space through the glue filling hole and the first through hole; and The gas in the accommodating space is pumped out through the vacuum hole and the second through hole. 16. The method for manufacturing an image pickup device according to claim 14, wherein forming the second reflective element above the light shielding element comprises: After forming the light-transmitting colloid solidified layer, the second reflective element is formed on the light-transmitting cover. 17. The method for manufacturing an image pickup device according to claim 14, wherein forming the second reflective element above the light shielding element comprises: Before disposing the light-transmitting cover, the light-shielding element is covered with a light-transmitting base, and the second reflective element is formed on the top surface of the light-transmitting base. 18. The manufacturing method of the imaging device according to claim 10, further comprising: Before forming the light-transmitting colloid solidified layer, an optical collimator or a grating is arranged on the sensor.