CN107389105A - Sensor module - Google Patents
Sensor module Download PDFInfo
- Publication number
- CN107389105A CN107389105A CN201710703740.5A CN201710703740A CN107389105A CN 107389105 A CN107389105 A CN 107389105A CN 201710703740 A CN201710703740 A CN 201710703740A CN 107389105 A CN107389105 A CN 107389105A
- Authority
- CN
- China
- Prior art keywords
- sensor module
- optical sensor
- module
- base
- shell body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 34
- 238000003780 insertion Methods 0.000 claims abstract description 4
- 230000037431 insertion Effects 0.000 claims abstract description 4
- 230000006978 adaptation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optical Communication System (AREA)
Abstract
The present invention uses such a sensor module, including lens mechanism, support, optical sensor module, multigroup cable and the base from top to bottom installed successively, support vertically on offer the optical channel of insertion, lens mechanism is arranged in the optical channel, the installing space for accommodating optical sensor module is formed between frame bottom and base, multigroup cable laying forms electrical connection in the lower section of optical sensor module and with optical sensor module, sensor of the invention module uses said structure, thus it is compact-sized, be readily produced assembling.
Description
Technical field
The present invention relates to a kind of module for optical field, more particularly to a kind of sensor module.
Background technology
Sensor module is to use sensor of the photoelectric cell as detecting element.It first changes measured change
Into the change of optical signal, then electric signal is further converted optical signals into by photoelectric cell.Sensor module is typically by light
Source, optical path and photoelectric cell three parts composition.Overseas enterprise grasps more advanced, domestic enterprise to sensor module technology
Want to break the necessary autonomous innovation of monopolization of the overseas enterprise to these products.
The content of the invention
In view of this, it is an object of the invention to provide a kind of cost-effective and be readily produced the sensor module of assembling.
In order to realize the above object the present invention uses such a sensor module, including from top to bottom install successively
Lens mechanism, support, optical sensor module, multigroup cable and base, support vertically on offer the light of insertion
Passage, lens mechanism are arranged in the optical channel, and the installation for accommodating optical sensor module is formed between frame bottom and base
Space, multigroup cable laying form electrical connection in the lower section of optical sensor module and with optical sensor module.
Sensor of the invention module uses said structure, thus it is compact-sized, be readily produced assembling.
The present invention, which is further arranged to optical sensor module, to be included housing and the transmitter module being arranged in housing, connects
Receive module, circuit board, wiring conducting strip；Wherein transmitter module and receiving module is all disposed within circuit board, and wiring conducting strip is adopted
With pin configuration is punctured, multigroup to puncture the welding of pin one end on circuit boards, the other end is used for and cable connection.
Whole sensor module natively compares miniaturization, and also very little, optics pass the installing space between support and base
Sensor module using so design, with regard to very little assemble also very convenient by dimensional space；Part is fewer, and work is also compared can
By stable；Wiring conducting strip is using puncturing pin configuration simultaneously, compared with traditional round hole arrangement, the present invention have existing line plate without
The size advantage and stable performance that method reaches.
The present invention, which is further arranged to housing, includes upper lid and shell body, and shell body is shaped as a cuboid, the length
The centre of cube is that through slot is used to place circuit board, and the size of through slot is adapted with circuit board, punctures pin from shell body
Lower section expose；It is upper to cover on shell body upper surface, opened up on upper lid and the transmitter module on circuit board and receiving module phase
The short slot of adaptation.
Said structure layout designs are reasonable, easy to assembly.
The both sides that the present invention is further arranged to base are upwardly formed fixture block opposite each other, and the both sides of support are with respect to the card
Block forms neck, and the clamping engagement for forming support and base is coordinated by fixture block and neck.
The present invention is further arranged to lens mechanism and is made up of lens and mounting seat.
Brief description of the drawings
Fig. 1 is sensor module decomposing schematic representation of the embodiment of the present invention.
Fig. 2 is support sectional view of the embodiment of the present invention.
Fig. 3 is support stereogram of the embodiment of the present invention.
Fig. 4 is optical sensor module exploded pictorial of embodiment of the present invention Fig. 1.
Fig. 5 is optical sensor module exploded pictorial of embodiment of the present invention Fig. 2.
Fig. 6 is optical sensor module stereogram of the embodiment of the present invention.
Fig. 7 is optical sensor module sectional view of the embodiment of the present invention.
Fig. 8 is shell body front view of the embodiment of the present invention.
Fig. 9 is shell body sectional view of the embodiment of the present invention.
Figure 10 is lid front view in the embodiment of the present invention.
Embodiment
As Figure 1-10 shows, the present invention is a kind of sensor module, including from top to bottom install successively lens mechanism, branch
Frame 3, optical sensor module, multigroup cable 4 and base 5, support 3 vertically on offer the optical channel of insertion, thoroughly
Illuminating apparatus structure is arranged in the optical channel, and the installing space for accommodating optical sensor module is formed between the bottom of support 3 and base 5,
Multigroup cable 4 is laid on the lower section of optical sensor module and formed with optical sensor module and is electrically connected.Optical sensor
Module includes upper lid 6, shell body 7, transmitter module, receiving module, circuit board 8, wiring conducting strip；Shell body 7 is shaped as one
Individual cuboid, the centre of the cuboid are used to place circuit board 8 for through slot, and the size of through slot is adapted with circuit board 8, connect
Using the structure of pin 9 is punctured, multigroup one end of pin 9 that punctures is welded on circuit board 8 line conducting strip, and the other end is used for and cable 4
Connection.Pin 9 is punctured from the lower section of shell body 7 to expose；Upper lid 6 is covered on the upper surface of shell body 7, is opened up on upper lid 6 and circuit
The short slot 61 that transmitter module and receiving module on plate 8 are adapted.Wherein transmitter module and receiving module are all disposed within circuit board 8
On, the both sides of base 5 are upwardly formed fixture block 51 opposite each other, and the both sides of support 3 form neck with respect to the fixture block 51, pass through card
Block 51 and neck 31 coordinate the clamping engagement for forming support 3 and base 5.Lens mechanism is made up of lens 1 and mounting seat 2.
Claims (5)
- A kind of 1. sensor module, it is characterised in that：The sensor module include from top to bottom install successively lens mechanism, Support, optical sensor module, multigroup cable and base, support vertically on offer the optical channel of insertion, lens Mechanism is arranged in the optical channel, and the installing space for accommodating optical sensor module is formed between frame bottom and base, multigroup Cable laying forms electrical connection in the lower section of optical sensor module and with optical sensor module.
- 2. sensor module according to claim 1, it is characterised in that：The optical sensor module include housing and Transmitter module, receiving module, circuit board, the wiring conducting strip being arranged in housing；Wherein transmitter module and receiving module is all set Put on circuit boards, wiring conducting strip is welded on circuit boards using pin configuration, multigroup pin one end that punctures is punctured, the other end For with cable connection.
- 3. sensor module according to claim 2, it is characterised in that：The housing includes upper lid and shell body, shell Body is shaped as a cuboid, and the centre of the cuboid is used to place circuit board, the size and circuit of through slot for through slot Plate is adapted, and is punctured pin and is exposed below shell body；It is upper to cover on shell body upper surface, opened up on upper lid and circuit board On the short slot that is adapted of transmitter module and receiving module.
- 4. sensor module according to claim 2, it is characterised in that：The both sides of the base are upwardly formed opposite each other Fixture block, the both sides of support form neck with respect to the fixture block, coordinate the clamping for forming support and base to match somebody with somebody by fixture block and neck Close.
- 5. sensor module according to claim 2, it is characterised in that：The lens mechanism is by lens and mounting seat structure Into.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710703740.5A CN107389105A (en) | 2017-08-16 | 2017-08-16 | Sensor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710703740.5A CN107389105A (en) | 2017-08-16 | 2017-08-16 | Sensor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107389105A true CN107389105A (en) | 2017-11-24 |
Family
ID=60352948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710703740.5A Pending CN107389105A (en) | 2017-08-16 | 2017-08-16 | Sensor module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107389105A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2627524Y (en) * | 2003-05-15 | 2004-07-21 | 富士康(昆山)电脑接插件有限公司 | Photoelectric conversion module unit |
| CN1782969A (en) * | 2004-11-30 | 2006-06-07 | 艾勒博科技股份有限公司 | Optical module and input apparatus using the same |
| US20110254763A1 (en) * | 2010-04-14 | 2011-10-20 | Samsung Electro-Mechanics Co., Ltd. | Optical pointing module and electronic apparatus |
| US20120235037A1 (en) * | 2011-03-16 | 2012-09-20 | Generalplus Technology Inc. | Optical identification module device and optical reader having the same |
| CN103728699A (en) * | 2014-01-06 | 2014-04-16 | 中国电子科技集团公司第三十四研究所 | Wireless optical module used for interconnection of circuit boards |
| CN104536103A (en) * | 2010-04-20 | 2015-04-22 | 富士康(昆山)电脑接插件有限公司 | Opto-electronic device assembly |
| CN204902857U (en) * | 2015-07-07 | 2015-12-23 | 康崔耐科斯公司 | Photoelectric sensor |
| CN205561870U (en) * | 2016-03-22 | 2016-09-07 | 深圳市鼎创电子有限公司 | Dualbeam penetrates sample formula photoelectric sensor directly |
-
2017
- 2017-08-16 CN CN201710703740.5A patent/CN107389105A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2627524Y (en) * | 2003-05-15 | 2004-07-21 | 富士康(昆山)电脑接插件有限公司 | Photoelectric conversion module unit |
| CN1782969A (en) * | 2004-11-30 | 2006-06-07 | 艾勒博科技股份有限公司 | Optical module and input apparatus using the same |
| US20110254763A1 (en) * | 2010-04-14 | 2011-10-20 | Samsung Electro-Mechanics Co., Ltd. | Optical pointing module and electronic apparatus |
| CN104536103A (en) * | 2010-04-20 | 2015-04-22 | 富士康(昆山)电脑接插件有限公司 | Opto-electronic device assembly |
| US20120235037A1 (en) * | 2011-03-16 | 2012-09-20 | Generalplus Technology Inc. | Optical identification module device and optical reader having the same |
| CN103728699A (en) * | 2014-01-06 | 2014-04-16 | 中国电子科技集团公司第三十四研究所 | Wireless optical module used for interconnection of circuit boards |
| CN204902857U (en) * | 2015-07-07 | 2015-12-23 | 康崔耐科斯公司 | Photoelectric sensor |
| CN205561870U (en) * | 2016-03-22 | 2016-09-07 | 深圳市鼎创电子有限公司 | Dualbeam penetrates sample formula photoelectric sensor directly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171124 |
|
| WD01 | Invention patent application deemed withdrawn after publication |