CN107385481A - A kind of cyanide-free gold electroplating liquid - Google Patents
A kind of cyanide-free gold electroplating liquid Download PDFInfo
- Publication number
- CN107385481A CN107385481A CN201710644448.0A CN201710644448A CN107385481A CN 107385481 A CN107385481 A CN 107385481A CN 201710644448 A CN201710644448 A CN 201710644448A CN 107385481 A CN107385481 A CN 107385481A
- Authority
- CN
- China
- Prior art keywords
- gold
- cyanogen
- plating liquid
- gold plating
- cyanide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000010931 gold Substances 0.000 title claims abstract description 19
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 19
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 17
- 239000007788 liquid Substances 0.000 title claims abstract description 15
- 238000009713 electroplating Methods 0.000 title description 3
- 238000007747 plating Methods 0.000 claims abstract description 25
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000004094 surface-active agent Substances 0.000 claims abstract description 6
- PQHYOGIRXOKOEJ-UHFFFAOYSA-N 2-(1,2-dicarboxyethylamino)butanedioic acid Chemical compound OC(=O)CC(C(O)=O)NC(C(O)=O)CC(O)=O PQHYOGIRXOKOEJ-UHFFFAOYSA-N 0.000 claims abstract description 5
- -1 sulfite compound Chemical class 0.000 claims abstract description 3
- 150000002344 gold compounds Chemical class 0.000 claims abstract 2
- 150000003839 salts Chemical class 0.000 claims description 9
- RGCKGOZRHPZPFP-UHFFFAOYSA-N alizarin Chemical group C1=CC=C2C(=O)C3=C(O)C(O)=CC=C3C(=O)C2=C1 RGCKGOZRHPZPFP-UHFFFAOYSA-N 0.000 claims description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 150000002343 gold Chemical class 0.000 abstract description 2
- 238000002425 crystallisation Methods 0.000 abstract 1
- 230000008025 crystallization Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 8
- 239000000654 additive Substances 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 235000010265 sodium sulphite Nutrition 0.000 description 4
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 3
- BDGYOXLDSUTJGA-UHFFFAOYSA-N gold;oxalonitrile Chemical compound [Au].N#CC#N BDGYOXLDSUTJGA-UHFFFAOYSA-N 0.000 description 3
- NRTDAKURTMLAFN-UHFFFAOYSA-N potassium;gold(3+);tetracyanide Chemical compound [K+].[Au+3].N#[C-].N#[C-].N#[C-].N#[C-] NRTDAKURTMLAFN-UHFFFAOYSA-N 0.000 description 3
- SDKPSXWGRWWLKR-UHFFFAOYSA-M sodium;9,10-dioxoanthracene-1-sulfonate Chemical compound [Na+].O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2S(=O)(=O)[O-] SDKPSXWGRWWLKR-UHFFFAOYSA-M 0.000 description 3
- 231100000419 toxicity Toxicity 0.000 description 3
- 230000001988 toxicity Effects 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- FFRBMBIXVSCUFS-UHFFFAOYSA-N 2,4-dinitro-1-naphthol Chemical compound C1=CC=C2C(O)=C([N+]([O-])=O)C=C([N+]([O-])=O)C2=C1 FFRBMBIXVSCUFS-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical class OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- BEGBSFPALGFMJI-UHFFFAOYSA-N ethene;sodium Chemical group [Na].C=C BEGBSFPALGFMJI-UHFFFAOYSA-N 0.000 description 1
- IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 description 1
- 231100000636 lethal dose Toxicity 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000002825 nitriles Chemical group 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 231100000572 poisoning Toxicity 0.000 description 1
- 230000000607 poisoning effect Effects 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 1
- 235000019345 sodium thiosulphate Nutrition 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical compound [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 description 1
- 231100000167 toxic agent Toxicity 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
A kind of electric gold plating liquid of no cyanogen, crystallization coating structure and the basically identical plating piece of golden color with premium properties can be obtained using this gold plating liquid.It is characterized in that include the water-soluble gold compound (CN201310446495.6) without cyanogen, sulfite compound, iminodisuccinic acid, surfactant.Using temperature：20 DEG C 60 DEG C, pH value is 7.5 9.0, and the time is 5 minutes or so, electric current 0.5A, and maximum current density must not be higher than 2A/dm2, daily production control is in 0.5A/dm2Below.
Description
Technical field：
The present invention relates to Gold-plating technique, and in particular to plating is gold-plated.
Background technology：
It is gold-plated industry in, majority enterprise of China from toxicity it is very high gold salt ----gold potassium cyanide is as gold-plated master
Salt, according to the corrosion resistance and coating of workpiece, the characteristic of plating piece prepares acid gold-plated or alkaline gold plating solution again, to meet to work
The requirement of skill condition.
Existing craft of gilding, mainly there is cyanide is gold-plated, and sulphite is gold-plated, and citrate is gold-plated etc., except sulfurous acid
Salt is gold-plated outer, it is other it is gold-plated using gold potassium cyanide KAu (CN) 2 as gold-plated main salt.There is a small amount of low cyanogen of also use to plate
Gold reagent.When alkaline cyaniding is gold-plated, potassium cyanide too high levels in the electroplate liquid of the craft of gilding, toxicity is larger, most of enterprises
Industry seldom uses.The gold-plated faintly acid that belongs to of citrate is gold-plated, and using more in gold-plated industry, it is also with aurous cyanide
Potassium is as containing the main salt of gold.It is well known that the toxicity of cyanide is extremely strong, its lethal dose of gold potassium cyanide, and extremely toxic substance.With
The electroplating solution that gold potassium cyanide is prepared, CN- contents are 500-1089mg/L in the raffinate after plating.The cyanide wastewater
Discharge, serious murder by poisoning and pollution are caused to environment.Therefore consider that environmental requirement uses the non-cyanide electroless gold liquid without cyanogen.
The content of the invention：
The present invention provides a kind of environment-friendly type electricity gold plating liquid of no cyanogen
This solution is entirely without cyanogen
To achieve the above objectives, the water-soluble gold salt (CN201310446495.6) for employing a kind of no cyanogen is used as main salt,
And electric gold plating liquid is made, its feature includes following：
1. use the water-soluble gold salt without cyanogen.
2. additive uses sodium sulfite, iminodisuccinic acid, rare metal salts.
3. additive can also be sulfite compound, iminobisuccinate compound.
4. surfactant is turkey red oil.
5. electric current is 0.3-2A/dm2, preferably 0.5-1A/dm2。
6. the time is 3-15 minutes, preferably 5-8 minutes.
The popularization of the present invention has fabulous economic benefit and social benefit.
Further illustrated below in conjunction with example：
1.
| Main salt | Without cyanogen gold salt | 3g/L |
| Additive | Sodium sulfite | 50g/L |
| Complexing agent | Iminodisuccinic acid | 50g/L |
| Sodium ethylene diamine tetracetate | 5g/L | |
| Surfactant | Turkey red oil | 2g/L |
| Time | 10 minutes | |
| Temperature | 45 degree | |
| Electric current | 0.5A/dm2 |
2.
| Main salt | Without cyanogen gold salt | 20g/L |
| Additive | Sodium sulfite | 150g/L |
| Organic phosphate | 10g/L | |
| Iminodisuccinic acid | 20g/L | |
| Surfactant | Turkey red oil | 2g/L |
| Time | 10 minutes | |
| Temperature | 50 degree | |
| Electric current | 0.6A/dm2 |
3.
| Main salt | Without cyanogen gold salt | 1g/L |
| Additive | Sodium sulfite | 50g/L |
| Sodium thiosulfate | 20g/L | |
| Surfactant | Turkey red oil | 2g/L |
| Time | 15 minutes | |
| Temperature | 45 degree | |
| Electric current | 0.5A/dm2 |
Bright golden yellow layer gold can be obtained using this gold plating liquid, and the metals such as silver, cobalt, nickel can be added and plate out alloy.
Cost is low, and binding force of cladding material is good, and hardness is up to standard.It can be applied to industrialize gold-plated.
Accompanying drawing is the picture of the plating gold of 2 use this plating solutions,
Fig. 1 is the figure for using the plating solution of example 1 gold-plated on plating piece,
Fig. 2 is using the plating solution of example 2 figure gold-plated in nickel sheet in Hull cell.
Claims (6)
1. a kind of plating gold plating liquid of no cyanogen, its main salt is the water-soluble gold compound (CN201310446495.6) without cyanogen.
2. electric gold plating liquid as claimed in claim 1, it is characterised in that further contain sulfite compound.
3. electric gold plating liquid as claimed in claim 1, it is characterised in that further contain iminodisuccinic acid, organic more phosphorus
Hydrochlorate.
4. electric gold plating liquid as claimed in claim 1, it is characterised in that surfactant is turkey red oil.
5. a kind of plating gold plating liquid of no cyanogen, it is characterised in that be the plating described in any one of usage right requirement 1 or 2 or 3
What gold plating liquid made.
6. its operating condition is：Temperature：Spend the time for 20 degree -60：3-20 minute current densities：0.3-2A/dm2。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710644448.0A CN107385481A (en) | 2017-07-26 | 2017-07-26 | A kind of cyanide-free gold electroplating liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710644448.0A CN107385481A (en) | 2017-07-26 | 2017-07-26 | A kind of cyanide-free gold electroplating liquid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107385481A true CN107385481A (en) | 2017-11-24 |
Family
ID=60343545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710644448.0A Pending CN107385481A (en) | 2017-07-26 | 2017-07-26 | A kind of cyanide-free gold electroplating liquid |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107385481A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101906649A (en) * | 2010-08-11 | 2010-12-08 | 哈尔滨工业大学 | Plating solution for cyanide-free electroplating and method for electroplating gold using the solution for cyanide-free electroplating |
| CN102037162A (en) * | 2008-05-07 | 2011-04-27 | 尤米科尔电镀技术有限公司 | Pd and Pd-Ni electrolyte baths |
| CN102168294A (en) * | 2011-05-19 | 2011-08-31 | 北京工业大学 | Method for improving tungsten-base gold-plating bond strength |
| CN102041530B (en) * | 2009-10-13 | 2012-12-26 | 深圳国宝造币有限公司 | Protective clamp for local metal plating of workpiece and cyanide-free gold plating method thereof |
| CN103014790A (en) * | 2013-01-11 | 2013-04-03 | 余泽玲 | Acidic plating method of decorative gold having low gold content |
| CN104136658A (en) * | 2012-02-01 | 2014-11-05 | 安美特德国有限公司 | Electroless nickel plating bath |
| CN104862752A (en) * | 2015-06-12 | 2015-08-26 | 深圳市联合蓝海投资有限公司 | Modified cyanide-free gold plating solution and application thereof as well as preparation method of hard gold |
-
2017
- 2017-07-26 CN CN201710644448.0A patent/CN107385481A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102037162A (en) * | 2008-05-07 | 2011-04-27 | 尤米科尔电镀技术有限公司 | Pd and Pd-Ni electrolyte baths |
| CN102041530B (en) * | 2009-10-13 | 2012-12-26 | 深圳国宝造币有限公司 | Protective clamp for local metal plating of workpiece and cyanide-free gold plating method thereof |
| CN101906649A (en) * | 2010-08-11 | 2010-12-08 | 哈尔滨工业大学 | Plating solution for cyanide-free electroplating and method for electroplating gold using the solution for cyanide-free electroplating |
| CN102168294A (en) * | 2011-05-19 | 2011-08-31 | 北京工业大学 | Method for improving tungsten-base gold-plating bond strength |
| CN104136658A (en) * | 2012-02-01 | 2014-11-05 | 安美特德国有限公司 | Electroless nickel plating bath |
| CN103014790A (en) * | 2013-01-11 | 2013-04-03 | 余泽玲 | Acidic plating method of decorative gold having low gold content |
| CN104862752A (en) * | 2015-06-12 | 2015-08-26 | 深圳市联合蓝海投资有限公司 | Modified cyanide-free gold plating solution and application thereof as well as preparation method of hard gold |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171124 |