CN107363730A - eddy current testing device and system - Google Patents
eddy current testing device and system Download PDFInfo
- Publication number
- CN107363730A CN107363730A CN201710812936.8A CN201710812936A CN107363730A CN 107363730 A CN107363730 A CN 107363730A CN 201710812936 A CN201710812936 A CN 201710812936A CN 107363730 A CN107363730 A CN 107363730A
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- CN
- China
- Prior art keywords
- eddy current
- acquisition process
- signal acquisition
- process module
- current sensor
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
- B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Investigating Or Analyzing Materials By The Use Of Magnetic Means (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention provides a kind of eddy current testing device and system, belongs to chemical polishing appts technical field, and the online end point determination device of the vortex includes：Polishing pad, eddy current sensor and wire；Eddy current sensor is arranged in polishing pad, and wire is connected with eddy current sensor, and the external connection end of wire is drawn outside polishing pad.The eddy current testing device, which solves, is vortexed online end-point detecting system detecting distance length in existing chemical-mechanical polisher, caused by detection signal it is undesirable, and detection probe protrudes the flimsy problem of detection sensor caused by polishing block surface.The eddy detection system includes polishing block, signal acquisition process module, control device and above-mentioned eddy current testing device；Polishing pad is connected with polishing block, and eddy current sensor is connected by wire with signal acquisition process module, and signal acquisition process module more accurately detects the film thickness of testee detection signal is transmitted to control device.
Description
Technical field
The present invention relates to chemical polishing appts technical field, and in particular to a kind of eddy current testing device and system.
Background technology
It is well known that the thickness of metallic film can be measured using eddy detection technology, and metallic film is thinner, then requires
The driving frequency of Eddy Current Testing Transducer is higher, and the distance of detection sensor and object to be detected is nearer, the thickness of metallic film
Curved line relation with detection signal could be better, could relatively accurately detect the film thickness of testee.
End-point detecting system is vortexed as a kind of metallic film measuring system, is preferably applied to chemically mechanical polishing
In equipment, it can effective on-line checking crystal column surface metallic film thickness change, it is thin so as to be accurately controlled crystal column surface
The polishing process of film.
In general, such as patent of invention CN1230279C, CN101329157B, all it is that eddy current sensor is placed in polishing block
In, the distance between eddy current sensor detection faces and crystal column surface metallic film are at least above the thickness of polishing pad, i.e. wafer table
Face metallic film and the distance between eddy current sensor are larger, it is impossible to preferably reflect crystal column surface in CMP process
The polishing process of metallic film.
In another example CN100399500C, the CN103260828A such as patent of invention etc., describe and an end are opened on polishing pad
Point detection zone, the polishing pad thinner thickness in this region, the Eddy Current Testing Transducer in polishing block can stretch out polishing block surface
Although 0-2mm, the method shorten the distance of eddy current sensor and detected wafer, but the vortex for protruding polishing block surface passes
Sensor is damaged, or be subject to other reason damages during polishing pad is laid due to improper operation.
To sum up, the problem of online end-point detecting system is present is vortexed in existing chemical-mechanical polisher has,
1st, the distance between crystal column surface metallic film and eddy current sensor are larger, cause detection signal undesirable；
2nd, detection probe protrudes the detection sensor damage that polishing block surface easily causes.
The content of the invention
The first object of the present invention is to provide a kind of eddy current testing device, and the eddy current testing device sets eddy current sensor
Put in polishing pad, solve and online end-point detecting system detecting distance length is vortexed in existing chemical-mechanical polisher, cause
Detection signal it is undesirable, and detection probe protrudes the flimsy problem of detection sensor caused by polishing block surface.
The second object of the present invention is to provide a kind of eddy detection system, and in the system, polishing pad is connected with polishing block,
Eddy current sensor is connected by wire with signal acquisition process module, signal acquisition process module to by detection signal transmit to
Control device, and then more accurately detect by the film thickness of hot object.
Based on above-mentioned first purpose, eddy current testing device provided by the invention, including：Polishing pad, eddy current sensor and lead
Line；The eddy current sensor is arranged in the polishing pad, and the wire is connected with the eddy current sensor, and the wire
External connection end is drawn outside the polishing pad.
Further, the eddy current sensor is set at least one.To detect the film thickness of testee, so as to anti-
Reflect the polishing process of crystal column surface metallic film in CMP process.
In addition, according to actual use situation, for the reliability of Detection results, multiple whirlpools can also be set in polishing pad
Flow sensor.To detect the film thickness of testee, so as to more accurately reflect wafer table in CMP process
The polishing process of face metallic film.
Further, in addition to coating member, the coating member are arranged in the polishing pad, also, the coating member bag
Overlay on the eddy current sensor surfaces.Above-mentioned coating member plays a part of protecting eddy current sensor.
Further, the coating member is molded using polyurethane material.
Based on above-mentioned second purpose, a kind of eddy detection system provided by the invention, including polishing block, signal acquisition process
Module, control device and above-mentioned eddy current testing device；
The polishing pad is connected with the polishing block, and the eddy current sensor passes through wire and the signal acquisition process mould
Block connects, and the signal acquisition process module is detection signal is transmitted to the control device.
Further, transmission of wireless signals is used between the signal acquisition process module and the control device.
Further, the signal acquisition process module is arranged on outside the polishing block.
Further, the signal acquisition process module is arranged on inside the polishing block, the signal acquisition process mould
Block is electrically connected by conducting slip ring with the control device.
Further, set in the polishing block to accommodate the mounting hole of described signal acquisition process module and to
The lead channels of the wire are installed.
Further, the control device is CMP machine platform or factory-automation server.
Eddy current testing device provided by the invention includes polishing pad, eddy current sensor and wire；The eddy current sensor is set
Put in the polishing pad, the wire is connected with the eddy current sensor, and the external connection end of the wire is drawn in the throwing
Outside light pad.In the detection means, closer to the distance, the thickness and detection letter of metallic film of detection sensor and object to be detected
Number curved line relation it is preferable, can relatively accurately detect the film thickness of testee, solve existing chemically mechanical polishing
Online end-point detecting system detecting distance length is vortexed in equipment, caused by detection signal it is undesirable, and detection probe protrudes and throws
The flimsy problem of detection sensor caused by light table surface.
Eddy detection system provided by the invention, including polishing block, signal acquisition process module, control device and above-mentioned
Eddy current testing device；Polishing pad is connected with polishing block, and eddy current sensor is connected by wire with signal acquisition process module, letter
Number acquisition processing module is detection signal is transmitted to control device.The detecting system includes above-mentioned eddy current testing device, tool
There is the advantages of eddy current testing device, in addition, signal acquisition process module is detection signal is transmitted to control device, Jin Ergeng
The film thickness of accurate detection testee.
Brief description of the drawings
, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical scheme of the prior art
The required accompanying drawing used is briefly described in embodiment or description of the prior art, it should be apparent that, in describing below
Accompanying drawing is some embodiments of the present invention, for those of ordinary skill in the art, before creative work is not paid
Put, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation for the eddy current testing device that the embodiment of the present invention one provides；
Fig. 2 is another structural representation for the eddy current testing device that the embodiment of the present invention one provides；
Fig. 3 is the top view of polishing pad in the eddy current testing device that the embodiment of the present invention one provides；
Fig. 4 is the structural representation for the eddy detection system that the embodiment of the present invention two provides；
Fig. 5 is the structural representation for the eddy detection system that the embodiment of the present invention three provides.
Icon：100- polishing pads；200- eddy current sensors；300- wires；
400- coating members；500- polishing blocks；600- signal acquisition process modules；
510- mounting holes；520- lead channels；700- control devices；
800- conducting slip rings.
Embodiment
Technical scheme is clearly and completely described below in conjunction with accompanying drawing, it is clear that described implementation
Example is part of the embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill
The every other embodiment that personnel are obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
In the description of the invention, it is necessary to explanation, term " " center ", " on ", " under ", "left", "right", " vertical ",
The orientation or position relationship of the instruction such as " level ", " interior ", " outer " be based on orientation shown in the drawings or position relationship, merely to
Be easy to the description present invention and simplify description, rather than instruction or imply signified device or element must have specific orientation,
With specific azimuth configuration and operation, therefore it is not considered as limiting the invention.In addition, term " first ", " second ",
" the 3rd " is only used for describing purpose, and it is not intended that instruction or hint relative importance.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or electrical connection；Can be joined directly together, can also be indirectly connected by intermediary, Ke Yishi
The connection of two element internals.For the ordinary skill in the art, with concrete condition above-mentioned term can be understood at this
Concrete meaning in invention.
Embodiment one
It refer to shown in Fig. 1；The eddy current testing device provided in the present embodiment includes：Polishing pad 100, eddy current sensor
200 and wire 300；The eddy current sensor 200 is arranged in polishing pad 100, and wire 300 is connected with eddy current sensor 200, and
The external connection end of wire 300 is drawn outside polishing pad 100.
In the present embodiment, eddy current sensor 200 is set into (integrated) inside polishing pad 100, eddy current sensor 200 and quilt
The distance of detection object is effectively close, and the thickness of metallic film and the curved line relation of detection signal are more accurate, can be more smart
Really detect the film thickness of testee.
As the preferred embodiment of the present invention, above-mentioned eddy current testing device is in specific manufacture, i.e. is polishing
Eddy current sensor 200, and extraction wire 300 are added when pad 100 is molded.With it is simple in construction, be readily produced the characteristics of.
As the preferred embodiment of the present invention, the eddy current sensor 200 sets at least one.That is, it is specific real
Shi Shi, the eddy current sensor 200 integrated in polishing pad 100 can set 1, to detect the film thickness of testee, so as to
Reflect the polishing process of crystal column surface metallic film in CMP process.
As shown in figure 3, in addition, according to actual use situation, can also be in polishing pad for the reliability of Detection results
Multiple eddy current sensors 200 are set in 100.To detect the film thickness of testee, so as to more accurately reflect chemical machine
The polishing process of crystal column surface metallic film in tool polishing process.
As described in Figure, when in polishing pad 100 using multiple eddy current sensors 200, multiple eddy current sensors 200 can divide
Cloth is in the same diametric(al) of the circular polishing pad 100.According to actual use situation other can also be used scattered
Arrangement.In above-mentioned multiple eddy current sensors 200, no matter which kind of arrangement is used in polishing pad 100, can reached
Act on below：
1st, multiple eddy current sensors 200 are arranged in polishing pad 100, make eddy current sensor 200 and object to be detected away from
It is close from effective, shorten the distance of eddy current sensor 200 and testee, the thickness of metallic film and the curve of detection signal
Relation is more accurate, can relatively accurately detect the film thickness of testee.
2nd, multiple eddy current sensors 200 can increase the reliability of Detection results.
As shown in Fig. 2 a preferred embodiment as the present invention, the eddy current testing device also include coating member 400,
The coating member 400 is arranged in polishing pad 100, also, the coating member 400 is coated on the surface of eddy current sensor 200.
Above-mentioned coating member 400 plays a part of protecting eddy current sensor 200, when it is implemented, its profile can be set
It is adapted with the profile of eddy current sensor 200, such as the shape such as rectangle, square or circle.The material of the coating member 400 can
With using materials such as polyurethanes.It is for instance possible to use polyurethane elastomer, it has good tensile strength, tear-proof strong
The advantages that degree, impact resistance, wearability, weatherability, hydrolytic resistance, oil resistivity.
During actual manufacture, the materials such as a strata urethane are molded outside eddy current sensor 200, polishing pad 100 adds when being molded
Enter the eddy current sensor after being coated by polyurethane material 200, and extraction wire 300 is arrived outside polishing pad 100.
The eddy current testing device that the present embodiment provides includes polishing pad 100, eddy current sensor 200 and wire 300；Vortex passes
Sensor 200 is arranged in polishing pad 100, and wire 300 is connected with eddy current sensor 200, and the external connection end of wire 300 is drawn in throwing
Outside light pad 100.In the detection means, closer to the distance, the thickness of metallic film and the inspection of detection sensor and object to be detected
It is preferable to survey the curved line relation of signal, can relatively accurately detect the film thickness of testee, solve existing chemical machinery
Online end-point detecting system detecting distance length is vortexed in polissoir, caused by detection signal it is undesirable, and detection probe dashes forward
The flimsy problem of detection sensor caused by going out the surface of polishing block 500.
Embodiment two
As shown in figure 4, present embodiments provide a kind of eddy detection system, the eddy detection system include polishing block 500,
The eddy current testing device that signal acquisition process module 600, control device 700 and above-described embodiment one provide.
In the eddy current testing device, polishing pad 100 is connected with polishing block 500, passes through the vortex being arranged in polishing pad 100
Sensor 200, it is capable of the thickness change signal of effective on-line checking crystal column surface metallic film；
Eddy current sensor 200 is connected by wire 300 with signal acquisition process module 600, signal acquisition process module 600
Above-mentioned detection signal can be gathered in real time, and the detection signal is handled to thickness information and transmitted to control device 700, and then
The thickness change of effective on-line checking crystal column surface metallic film, so as to be accurately controlled the polished of crystal column surface film
Journey.
In this implementation, transmission of wireless signals is used between the signal acquisition process module 600 and control device 700.This
In transmission of wireless signals refer to a kind of mode carried out data transmission using wireless technology.It is pair to be wirelessly transferred with wire transmission
Answer.Transmission of wireless signals has the characteristics such as easy for installation, flexibility is strong, cost performance is high so that the monitoring system of more conglomerate is adopted
With wireless transmission method, the connection established between monitored point and Surveillance center.For example, in the present embodiment, signal acquisition process
Bluetooth wireless transmission module, zigbee wireless transport modules etc. can be used between module 600 and control device 700.
In this implementation, the signal acquisition process module 600 is arranged on outside the polishing block 500.
In this implementation, the control device 700 is CMP machine platform or factory-automation server.
The eddy detection system that the present embodiment provides, including polishing block 500, polishing pad 100 are connected with polishing block 500, whirlpool
Flow sensor 200 is connected by wire 300 with signal acquisition process module 600, signal acquisition process module 600 to will detection
Signal is transmitted to control device 700.The detecting system includes above-mentioned eddy current testing device, has the advantages of eddy current testing device,
In addition, signal acquisition process module 600 is transmitted detection signal to control device 700 by transmission of wireless signals mode, and then
More accurately detect the film thickness of testee.
Embodiment three
As shown in figure 5, present embodiments provide a kind of eddy detection system, the eddy detection system include polishing block 500,
The eddy current testing device that signal acquisition process module 600, control device 700 and above-described embodiment one provide.
In the eddy current testing device, polishing pad 100 is connected with polishing block 500, passes through the vortex being arranged in polishing pad 100
Sensor 200, it is capable of the thickness change signal of effective on-line checking crystal column surface metallic film；
Eddy current sensor 200 is connected by wire 300 with signal acquisition process module 600, signal acquisition process module 600
Above-mentioned detection signal can be gathered in real time, and the detection signal is handled to thickness information and transmitted to control device 700, and then
The thickness change of effective on-line checking crystal column surface metallic film, so as to be accurately controlled the polished of crystal column surface film
Journey.
In this implementation, set in the polishing block 500 to accommodate the He of mounting hole 510 of signal acquisition process module 600
To the lead channels 520 of conducting wire 300.
Signal acquisition process module 600 is arranged on the mounting hole 510 inside polishing block 500, and wire 300 is arranged on wire and led to
In road 520, the signal acquisition process module 600 is electrically connected by conducting slip ring 800 with control device 700.
In the present embodiment, control device 700 is CMP machine platform or factory-automation server.
Eddy detection system provided by the invention, polishing pad 100 are connected with polishing block 500, and eddy current sensor 200 is by leading
Line 300 is connected with signal acquisition process module 600, and signal acquisition process module 600 by detection signal passing through conducting slip ring
800 transmit to control device 700.The detecting system includes above-mentioned eddy current testing device, has the advantages of eddy current testing device, separately
Outside, signal acquisition process module 600 is detection signal is transmitted to control device 700, and then more accurately detects testee
Film thickness.
Finally it should be noted that：Various embodiments above is merely illustrative of the technical solution of the present invention, rather than its limitations；To the greatest extent
The present invention is described in detail with reference to foregoing embodiments for pipe, it will be understood by those within the art that：Its according to
The technical scheme described in foregoing embodiments can so be modified, either which part or all technical characteristic are entered
Row equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the present invention technology
The scope of scheme.
Claims (10)
- A kind of 1. eddy current testing device, it is characterised in that including：Polishing pad, eddy current sensor and wire；The eddy current sensor It is arranged in the polishing pad, the wire is connected with the eddy current sensor, and the external connection end of the wire is drawn in described Outside polishing pad.
- 2. eddy current testing device according to claim 1, it is characterised in that the eddy current sensor sets at least one.
- 3. eddy current testing device according to claim 1 or 2, it is characterised in that also set including coating member, the coating member Put in the polishing pad, also, the coating member is coated on the eddy current sensor surfaces.
- 4. eddy current testing device according to claim 3, it is characterised in that the coating member is molded using polyurethane material Form.
- 5. a kind of eddy detection system, it is characterised in that including polishing block, signal acquisition process module, control device and power Profit requires the eddy current testing device described in any one of 1-4；The polishing pad is connected with the polishing block, and the eddy current sensor is connected by wire and the signal acquisition process module Connect, the signal acquisition process module is detection signal is transmitted to the control device.
- 6. eddy detection system according to claim 5, it is characterised in that the signal acquisition process module and the control Transmission of wireless signals is used between device processed.
- 7. the eddy detection system according to claim 5 or 6, it is characterised in that the signal acquisition process module is set Outside the polishing block.
- 8. eddy detection system according to claim 5, it is characterised in that the signal acquisition process module is arranged on institute State inside polishing block, the signal acquisition process module is electrically connected by conducting slip ring with the control device.
- 9. the eddy detection system according to claim 5 or 8, it is characterised in that set in the polishing block to accommodate The mounting hole of described signal acquisition process module and to install the lead channels of the wire.
- 10. according to the eddy detection system described in claim 5,6 or 8, it is characterised in that the control device is CMP machine platform Or factory-automation server.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710812936.8A CN107363730A (en) | 2017-09-11 | 2017-09-11 | eddy current testing device and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710812936.8A CN107363730A (en) | 2017-09-11 | 2017-09-11 | eddy current testing device and system |
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| Publication Number | Publication Date |
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| CN107363730A true CN107363730A (en) | 2017-11-21 |
Family
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Family Applications (1)
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|---|---|---|---|
| CN201710812936.8A Pending CN107363730A (en) | 2017-09-11 | 2017-09-11 | eddy current testing device and system |
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Cited By (3)
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|---|---|---|---|---|
| CN113579964A (en) * | 2021-08-05 | 2021-11-02 | 青岛理工大学 | Grinding wheel polishing control device and closed-loop control system comprising same |
| CN113664712A (en) * | 2021-08-13 | 2021-11-19 | 芯盟科技有限公司 | Eddy current detection device and method for measuring thickness of metal layer |
| CN115135450A (en) * | 2020-05-14 | 2022-09-30 | 应用材料公司 | Technique for training neural networks for in-situ monitoring during polishing and polishing system |
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| CN113664712A (en) * | 2021-08-13 | 2021-11-19 | 芯盟科技有限公司 | Eddy current detection device and method for measuring thickness of metal layer |
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Application publication date: 20171121 |