CN107357708B - Radiator control method and device and electronic equipment - Google Patents
Radiator control method and device and electronic equipment Download PDFInfo
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/07—Responding to the occurrence of a fault, e.g. fault tolerance
- G06F11/16—Error detection or correction of the data by redundancy in hardware
- G06F11/20—Error detection or correction of the data by redundancy in hardware using active fault-masking, e.g. by switching out faulty elements or by switching in spare elements
- G06F11/202—Error detection or correction of the data by redundancy in hardware using active fault-masking, e.g. by switching out faulty elements or by switching in spare elements where processing functionality is redundant
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Abstract
The application provides a radiator control method, a radiator control device and electronic equipment, when it is monitored that a certain radiator in the electronic equipment has a fault like a first radiator, the application determines at least one second radiator adjacent to the first radiator by utilizing preset position information of a plurality of radiators, and the at least one second radiator is controlled to rotate towards the direction of the first radiator, so that a radiating area corresponding to the at least one second radiator covers a radiating area corresponding to the first radiator, and the radiating requirement of an electronic element in the radiating area corresponding to the first radiator is met. Therefore, the radiator adjacent to the fault radiator is rotated, so that the radiator can radiate the corresponding area of the fault radiator under the condition that the radiator is not influenced to radiate the electronic element in the area where the radiator is responsible for radiating, the radiating efficiency of the electronic equipment is improved, the power of other radiators is not required to be increased, and the noise is avoided.
Description
Technical Field
The present disclosure relates to the field of heat dissipation control, and more particularly, to a method and an apparatus for controlling a heat sink, and an electronic device.
Background
With the rapid development of electronic technology, electronic components integrated in electronic devices such as desktop computers, notebook computers, various industrial personal computers and servers are increasing, so as to meet various functional requirements of users on the electronic devices in life and work.
During the operation of the electronic device, a large number of heat-generating electronic components will generate heat, which will increase the temperature of the operating environment of the electronic device, thereby affecting the operating performance of the electronic device, and even causing damage to some electronic components due to the over-temperature. Therefore, the heat dissipation of the whole system directly affects the stability and performance of the electronic device.
Based on this, most electronic equipment adopts the heat dissipation mode of cold wind at present, sets up the radiator in electronic equipment promptly, takes the fan as an example, specifically can increase the fan quantity according to the heat dissipation demand, that is to say, can set up a plurality of fans in the electronic equipment usually, carries out cold wind heat dissipation to electronic equipment's different regions to guarantee electronic equipment's normal reliable work.
In practical application, when a certain fan is detected to be out of order, the rotating speeds of other fans must be increased to meet the heat dissipation requirement of the electronic equipment, however, the rotating speeds of other fans are greatly increased to generate a large amount of noise, and meanwhile, because the other fans cannot meet the air flow requirement of an effective heat dissipation area corresponding to the failed fan, the heat dissipation efficiency of the electronic equipment is affected.
Disclosure of Invention
In view of this, the present application provides a method and an apparatus for controlling a heat sink, and an electronic device, when a failure of a heat sink is monitored, it is not necessary to increase working parameters of other heat sinks. The heat dissipation requirement of the electronic equipment can be met, the heat dissipation efficiency is improved, and the noise is avoided.
In order to achieve the above object, the present application provides the following technical solutions:
a method of controlling a heat sink, the method comprising:
monitoring that a first radiator in electronic equipment fails, wherein the first radiator is any one of a plurality of radiators contained in the electronic equipment, and other radiators in the plurality of radiators are called as second radiators;
determining at least one second radiator adjacent to the first radiator by using preset position information of the radiators;
and controlling the determined at least one second radiator to rotate towards the direction of the first radiator so that the heat dissipation area corresponding to the at least one second radiator covers the heat dissipation area corresponding to the first radiator.
Preferably, the controlling the at least one second heat sink to rotate towards the first heat sink includes:
determining the inclination direction and the inclination angle of the at least one second radiator according to the preset position information of the plurality of radiators and the corresponding heat dissipation areas, wherein the inclination direction is the opposite direction of the at least one second radiator relative to the first radiator;
and controlling the at least one second radiator to incline the inclination angle towards the inclination direction.
Preferably, the heat sink includes a heat dissipation component and a power component, and the controlling the at least one second heat sink to rotate toward the first heat sink includes:
sending a preset rotation instruction to a power component in the at least one second radiator, so that the power component controls the at least one second radiator to rotate towards the direction of the first radiator in response to the preset rotation instruction.
Preferably, the method further comprises:
acquiring current heat dissipation areas corresponding to a plurality of second heat radiators in a working state;
detecting whether any two adjacent current heat dissipation areas have overlapping areas or not;
determining that any two adjacent current heat dissipation areas have overlapping areas, and controlling the plurality of second radiators to work according to current parameters;
and determining that two adjacent current heat dissipation areas do not have an overlapping area, and adjusting the inclination angle until any two adjacent current heat dissipation areas have the overlapping area.
Preferably, the method further comprises:
and controlling a second radiator which is not adjacent to the first radiator to maintain unchanged.
Preferably, the method further comprises:
monitoring current operating parameters of the plurality of heat sinks;
the monitoring that the first heat sink is malfunctioning includes:
and determining that the current working parameters of the first radiator are abnormal.
A heat sink control apparatus, the apparatus comprising:
the electronic equipment comprises a monitoring module, a control module and a control module, wherein the monitoring module is used for monitoring that a first radiator in the electronic equipment fails, the first radiator is any one radiator in a plurality of radiators contained in the electronic equipment, and other radiators in the plurality of radiators are called as second radiators;
the determining module is used for determining at least one second radiator adjacent to the first radiator in position by utilizing preset position information of the radiators;
the control module is used for controlling the determined at least one second radiator to rotate towards the direction of the first radiator so that the heat dissipation area corresponding to the at least one second radiator covers the heat dissipation area corresponding to the first radiator.
An electronic device, the electronic device comprising:
a plurality of heat sinks;
a memory for storing a program for implementing the heat sink control method as described above;
a controller for loading and executing the program stored in the memory, comprising:
monitoring that a first radiator in electronic equipment fails, wherein the first radiator is any one of a plurality of radiators contained in the electronic equipment, and other radiators in the plurality of radiators are called as second radiators;
determining at least one second radiator adjacent to the first radiator by using preset position information of the radiators;
and controlling the determined at least one second radiator to rotate towards the direction of the first radiator so that the heat dissipation area corresponding to the at least one second radiator covers the heat dissipation area corresponding to the first radiator.
Preferably, the heat sink includes a heat radiating part and a power part;
and the power component is used for controlling the corresponding heat dissipation component to rotate according to the received preset rotation instruction sent by the controller.
Preferably, the electronic device further includes:
and the rotating speed sensor is used for detecting the rotating speed of the radiating fins in the corresponding radiating part and sending the rotating speed to the controller so as to monitor whether the radiating part breaks down or not.
Therefore, compared with the prior art, the application provides a radiator control method, a radiator control device and electronic equipment, wherein a plurality of radiators are arranged in the electronic equipment, when a certain radiator such as a first radiator is monitored to be in fault, the application determines at least one second radiator adjacent to the position of the first radiator by utilizing preset position information of the plurality of radiators, and the determined at least one second radiator is controlled to rotate towards the direction of the first radiator, so that a radiating area corresponding to the at least one second radiator covers a radiating area corresponding to the first radiator, and the radiating requirement of an electronic element in the radiating area corresponding to the first radiator is met. Therefore, the radiator adjacent to the fault radiator is rotated, so that the radiator can radiate the corresponding area of the fault radiator under the condition that the radiator is not influenced to radiate the electronic element in the area where the radiator is responsible for radiating, the radiating efficiency of the electronic equipment is improved, the power of other radiators is not required to be increased, and the noise is avoided.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic view illustrating an operation of a heat sink according to an embodiment of the present disclosure;
FIG. 2 is a schematic view of another heat sink according to an embodiment of the present disclosure;
FIG. 3a is a schematic view of another heat sink according to an embodiment of the present disclosure;
fig. 3b is a schematic view illustrating an operating state of a heat sink according to an embodiment of the present disclosure;
fig. 3c is a schematic view illustrating a state of a heat sink after rotation according to an embodiment of the present disclosure;
fig. 4 is a flowchart of a control method of a heat sink according to an embodiment of the present disclosure;
FIG. 5 is a flow chart of another method for controlling a heat sink according to an embodiment of the present disclosure;
fig. 6 is a structural diagram of a radiator control device according to an embodiment of the present application;
fig. 7 is a structural diagram of another radiator control device according to an embodiment of the present application;
fig. 8 is a structural diagram of another radiator control device according to an embodiment of the present application;
fig. 9 is a hardware structure diagram of an electronic device according to an embodiment of the present disclosure;
fig. 10 is a schematic structural diagram of a heat sink according to an embodiment of the present disclosure;
fig. 11 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In practical applications, for an electronic device that generates a large amount of heat during operation, in order to ensure its operation performance, a plurality of heat sinks are usually disposed inside the electronic device, and as shown in fig. 1 (the present application only takes four heat sinks as an example, but is not limited thereto), there are usually overlapping areas between heat dissipation areas (e.g., S1, S2, S3, and S4 in fig. 1) corresponding to each heat sink, so that when a certain heat sink fails, the operation parameters of other heat sinks can be adjusted, and thus, the heat in the heat dissipation area corresponding to the failed heat sink can be taken away by cold air output by the other heat sinks.
Referring to fig. 2, if # 2 heat sink in the electronic device fails, although the amount of cold air output by other heat sinks can be increased by adjusting the operating conditions of other heat sinks, as shown in fig. 2, a part of area is still limited by the flow direction of cold air, and cold air cannot directly blow on the part of area, which inevitably affects the heat dissipation effect of elements corresponding to the part of area.
In view of the above situation, in the prior art, usually, the operating parameters of the heat sink are further improved, taking a fan as an example, the rotation speed of other fans will be greatly increased, and although the heat dissipation effect of this part of area can be improved to a certain extent, the heat dissipation efficiency of the whole system will be affected by the great increase of the rotation speed of other fans as well as the great noise.
In order to improve the above situation, the present application provides a new heat sink control scheme, that is, after a failure of a certain heat sink, such as a first heat sink, in an electronic device is monitored, the present application determines at least one second heat sink adjacent to the position of the first heat sink by using preset position information of a plurality of heat sinks, and then controls the determined at least one second heat sink to rotate toward the direction of the first heat sink, so that a heat dissipation area corresponding to the at least one second heat sink covers a heat dissipation area corresponding to the first heat sink, thereby meeting a heat dissipation requirement of an electronic component in the heat dissipation area corresponding to the first heat sink. As shown in fig. 3a, after the 2# heat sink fails, the 1# heat sink and the 3# heat sink are controlled to rotate, so that the heat dissipation areas of the 1# heat sink and the 3# heat sink are changed until the heat dissipation areas of the failed heat sink are covered, at this time, all element areas of the electronic device which need heat dissipation processing can be blown by cold air, the working parameters of other heat sinks do not need to be greatly improved, the heat dissipation requirements of the electronic device can be met, and noise is avoided.
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description.
Referring to fig. 4, a flowchart of a method for controlling a heat sink provided in an embodiment of the present application may include the following steps:
step S401, monitoring that a first radiator in the electronic equipment has a fault;
in the embodiment of the present application, the electronic device generally includes a plurality of heat sinks, and the first heat sink may be any one of the plurality of heat sinks. It can be seen that the "first" and "second" of the present embodiment do not indicate the number and order of radiators, and the electronic device may include at least one first radiator and at least one second radiator at the same time.
Optionally, in the embodiment of the present application, whether the corresponding radiator fails may be determined by detecting the working parameters of each radiator in real time or periodically, and the specific detection content may be determined according to the structure of the radiator and the working principle thereof, which is not limited in the present application.
Taking a fan as an example, the fan may be detected in rotation speed and compared with a preset rotation speed threshold, so as to determine whether the fan is faulty according to the comparison result, but the fan is not limited to the detection mode of the rotation speed, which is a working parameter, and fault monitoring may be implemented by detecting input/output voltage, current, and the like, which is not described in detail herein.
Step S402, determining at least one second radiator adjacent to the first radiator by utilizing preset position information of a plurality of radiators included in the electronic equipment;
for the determined electronic equipment, the information such as the number of the radiators and the position relationship among the radiators is determined, the information can be detected by a manufacturer and marked or stored in a preset position, and when the information is needed, the corresponding information can be directly obtained.
Based on this, the preset position information of each heat sink in the electronic device may be obtained in the embodiments of the present application, and may include a distance between each heat sink, corresponding heat dissipation area information, an inclination direction, an inclination angle, and the like, so as to obtain a physical position relationship between a plurality of heat sinks included in the electronic device.
Therefore, after the preset position information of each radiator is obtained, the distribution condition of a plurality of radiators included in the electronic device, the position relationship between any two adjacent radiators and the like can be clearly obtained, so that at least one second radiator adjacent to the current failed first radiator can be determined.
Referring to fig. 1 above, if the # 2 heat sink fails, the heat sinks determined to be adjacent to the location thereof are the # 1 heat sink and the # 3 heat sink; if the 4# radiator fails, the second radiator adjacent to the position of the 4# radiator is determined to be the 3# radiator. It can be seen that, for the first radiators at different positions, the number of the second radiators adjacent to the first radiators at different positions may be different, and of course, the subsequent steps may be completed according to all the second radiators adjacent to the first radiators as required, or the subsequent steps may be completed according to one second radiator adjacent to the first radiators, which is not limited in the present application.
Step S403, controlling the determined at least one second heat sink to rotate toward the first heat sink, so that the heat dissipation area corresponding to the at least one second heat sink covers the heat dissipation area corresponding to the first heat sink.
In combination with the above analysis and fig. 2, if a certain heat sink fails and stops working, at least a partial area of the corresponding heat dissipation area may not be blown by cold air, and the heat dissipation effect of the partial area is affected, therefore, the embodiment of the present application improves the structure of the plurality of heat sinks included in the electronic device, so that each heat sink can rotate by itself, and in combination with fig. 3a, after the 2# heat sink fails, the 1# heat sink and the 3# heat sink rotate toward the 2# heat sink, so that the heat dissipation areas of the 1# heat sink and the 3# heat sink move to the heat dissipation area of the 2# heat sink, and cover the heat dissipation area of the 2# heat sink, and meanwhile, the heat dissipation area of the 3# heat sink still overlaps with the heat dissipation area of the 4# heat sink, and it is ensured that all areas requiring heat dissipation processing in the electronic device can be blown by cold air, so that it is not necessary to greatly increase the working parameters of the, the heat dissipation effect can be improved, and noise generated in the heat dissipation treatment process is avoided.
It should be noted that, the present application is not limited to how to control the rotation of the heat sinks, so that the heat dissipation area corresponding to the at least one second heat sink covers the heat dissipation area corresponding to the first heat sink, and the overlap between the heat dissipation areas of the at least one second heat sink and the heat dissipation areas of the other non-rotated second heat sinks is still maintained.
Alternatively, the heat sink in the embodiment of the present application may include a heat dissipation member and a power member, and the rotation of the respective heat dissipation members is controlled by the power member. Specifically, this power part can be step-by-step rotating electrical machines, sets for a certain angle of its pulse heat dissipation part rotation, if rotating electrical machines output a rotary pulse, control heat dissipation part and rotate 1.5 degrees towards preset direction, the inclination of heat dissipation part and the pulse relation of rotating electrical machines output can be confirmed through system design and test in the past, this application does not restrict to the concrete corresponding relation between them.
Referring to the top views of the heat sink shown in fig. 3b and 3c, the state of the heat dissipation component and the power component is normally as shown in fig. 3b, and after the controller is rotated in the above manner, the state can be changed to the state shown in fig. 3c, but the invention is not limited thereto.
Therefore, when the determined at least one second radiator needs to be controlled to rotate towards the first radiator, a preset rotation instruction can be sent to a power component in the at least one second radiator, so that the power component responds to the preset rotation instruction to control the corresponding heat dissipation component to rotate towards the first radiator, and the heat dissipation area corresponding to the at least one second radiator covers the heat dissipation area corresponding to the first radiator.
Wherein, regarding the specific inclination angle and the rotation direction of the heat dissipation component of the at least one second heat sink, the control can be realized through different rotation commands, and the rotation command can be determined according to the obtained position relationship between the first heat sink and the at least one second heat sink. Of course, in the above rotation control process, the embodiments of the present application may also monitor the heat dissipation areas of the rotating heat sinks in real time, determine the overlapping of the changed heat dissipation areas, and control the at least one second heat sink to stop rotating.
To sum up, this application makes it can be under the radiating circumstances that does not influence self electronic component who is responsible for in the heat dissipation region through the adjacent radiator of rotatory trouble radiator, has realized corresponding regional heat dissipation to trouble radiator, has improved electronic equipment's radiating efficiency, and need not to increase the power of other radiators, has avoided the production of noise.
Referring to fig. 5, a flow chart of another radiator control method provided in the embodiments of the present application, which specifies an implementation manner of controlling the rotation of the radiator, but is not limited to the implementation manner described in the embodiments, may include the following steps:
step S501, monitoring current working parameters and current heat dissipation areas of a plurality of heat radiators included in the electronic equipment;
in the embodiment of the present application, the content of the current operating parameter monitored correspondingly may be different for different types and structures of heat sinks, and optionally, the operating parameter of the heat sink may include input/output current, voltage, power, and rotation speed, temperature, and the like.
As can be seen from fig. 1, fig. 2 and fig. 3a, effective heat dissipation areas corresponding to different heat sinks are usually different, and the heat dissipation area may be determined according to a direction corresponding to an air outlet of the corresponding heat sink, and may be diffused around the air outlet in a direction opposite to the air outlet, and a contact surface between cold air output by the air outlet and the electronic device may be considered as the heat dissipation area of the heat sink, but is not limited to this method for determining the heat dissipation area.
Therefore, in practical applications, when the rotation direction and the inclination angle of the heat sink are changed, the heat dissipation area corresponding to the heat sink may be changed accordingly, and the specific change process may refer to the heat dissipation area determination process, but is not limited thereto.
Step S502, determining that the current working parameters of the first radiator are abnormal;
in practical application, corresponding fault detection standards can be set for different types of radiators, a critical value, namely a preset parameter threshold, of a corresponding working parameter when each radiator fails is specifically set, and if the detected current working parameter of the radiator does not meet the preset reference threshold (for different working parameters, the judgment result is that the detected current working parameter is greater than the corresponding threshold, a radiator fault is determined, or the judgment result is smaller than the corresponding threshold, and a radiator fault is determined; conversely, the radiator can be considered to be working normally.
Optionally, in order to improve the accuracy and reliability of monitoring the fault condition of the heat sink, in this embodiment of the present application, multiple thresholds may be set, taking fan speed monitoring as an example, if it is detected that the current speed of the fan is less than the first speed threshold, it may be considered that the fan is in fault, if the current speed of the fan is greater than the first speed threshold and less than the second speed threshold, it may be further monitored whether the fan is in fault through other parameters, or whether the fan is in fault or not is determined by improving the fan, and the like.
Step S503, determining at least one second radiator adjacent to the first radiator by using the preset position information of the radiators;
step S504, determining the inclination direction and the inclination angle of the at least one second radiator according to the preset position information of the plurality of radiators and the corresponding current heat dissipation areas;
in the embodiment of the present application, it can be calculated by using a mathematical angle calculation manner that from the state shown in fig. 2 to the state shown in fig. 3a, the inclination angles of the 1# radiator and the 3# radiator in the arrow direction need to be controlled, wherein, because the area of the air outlet of the radiator and the flow direction and radiation amplitude (which can be expressed by the angle of the air flow edge relative to the outlet of the radiator) of the cold air flow output by the radiator are not changed, and the distance between the radiators and the element to be radiated (such as the grey area in the figure), therefore, the inclination angles of the 2# radiator and the 3# radiator can be calculated by combining a trigonometric function calculation formula, the heat dissipation areas of the two radiators after rotation can be ensured to be overlapped, and the overlapping state of the heat dissipation area of the second heat sink which is not rotated with the heat dissipation area of the other second heat sink is still kept, so that the heat dissipation effect of the electronic equipment is improved.
It should be noted that the present application does not limit how to calculate the determined inclination angle of the at least one second heat sink. The inclination direction of the at least one second heat sink can be determined directly according to the position relationship with the first heat sink, such as the opposite direction of the at least one second heat sink relative to the first heat sink, so that the air outlet of the at least one second heat sink faces the first heat sink, and the heat dissipation area of the at least one second heat sink moves towards the heat dissipation area of the first heat sink.
Step S505, controlling the at least one second heat sink to tilt towards a corresponding tilt direction by a corresponding tilt angle;
optionally, in this embodiment of the application, the determined inclination directions of the second radiators are usually different, especially the second radiators located in different directions to the radiators, the inclination directions are usually opposite, and the determined inclination angles of the second radiators are usually different because the determined spatial distances between the second radiators and the first radiator are different, and the inclination direction and the inclination angle corresponding to each second radiator can be obtained through the step S504.
In practical applications, if the rotating electrical machine is used to control the heat dissipation component to rotate to achieve rotation at any angle in any direction, the embodiment of the present application may send a corresponding rotation command to the corresponding rotating electrical machine according to the calculated tilt direction and tilt angle of each second heat sink, so that the rotating electrical machine controls the heat dissipation component in the second heat sink to rotate correspondingly according to the rotation command, and the requirements of the determined tilt direction and tilt angle are met, but the present application is not limited to this implementation method.
Step S506, detecting whether the heat dissipation areas of any two adjacent second radiators are overlapped, if yes, executing step S508; if not, go to step S507;
step S507, adjusting an inclination angle of a second radiator belonging to the determined at least one second radiator;
optionally, in this embodiment of the present application, regarding whether the heat dissipation area between any two adjacent heat sinks has an overlapping area, the detection may be performed at any stage of the control scheme provided in the present application, so as to ensure the heat dissipation effect of the electronic device, and is not limited to the stage described in this embodiment.
After it is determined that the electronic device has the failed first heat sink, the heat dissipation area of the second heat sink which normally operates may be detected, and the detection process may be any step after step S502, and is not limited to the sequence of steps described in this embodiment.
Moreover, when it is detected that there is a current heat dissipation area corresponding to any two adjacent second radiators without an overlap area, the inclination angle of the two or one second radiator may be adjusted until the heat dissipation area of any adjacent second radiator has the overlap area, and the detection process is applicable to any stage of the control method provided by the embodiment of the present application.
In general, with reference to fig. 2, after a certain heat sink fails, the heat dissipation areas of two adjacent heat sinks at the left and right ends of the heat sink often do not have an overlapping area, at this time, the two heat sinks may be controlled to rotate according to the control method described in the above embodiment, so that the heat dissipation areas of the two heat sinks overlap, and the specific implementation process may refer to the description of the corresponding part of the above embodiment, which is not described again in this embodiment.
And step S508, controlling the plurality of second radiators to work according to the current parameters.
It can be seen that, in the embodiment of the present application, the second heat sink not adjacent to the failed first heat sink is maintained unchanged, and the second heat sink adjacent to the failed first heat sink is subjected to the rotation processing in the above manner, so that the position of the heat dissipation area of the second heat sink adjacent to the failed first heat sink relative to the electronic device element is changed, the air flow output by the currently operating second heat sink can reach all elements to be dissipated, the heat dissipation effect of the electronic device is ensured, and the noise generation is avoided because the operating parameters of the second heat sink do not need to be greatly improved.
In the present application, a radiator is taken as an example to describe a radiator control scheme in detail, and only one implementation is described here, but the present application is not limited to the implementation described in the present embodiment, and the implementation can be adjusted appropriately according to actual needs, which all fall within the protection scope of the present application, and the detailed description of the present application is omitted here. Still taking the number and the position relationship of the heat sinks of the electronic device shown in fig. 1 as an example, the heat sinks in the drawings are collectively referred to as fans, and will not be described one by one.
Based on this, the present application may monitor the rotation speeds of multiple fans of an electronic device, determine that the rotation speed of any one or more fans exceeds a preset rotation speed threshold, determine that the fan is faulty, determine that the fan is a first fan, and refer to other normal fans as second fans, and then determine at least one second fan adjacent to the first fan, such as the 1# fan and the 3# fan in fig. 2, control the determined outlet of the second fan to rotate in a direction close to the first fan, that is, control the upper ends of the 1# fan and the 3# fan to move away from the 2# fan, and change the airflow directions of the 1# fan and the 3# fan as shown by arrows in fig. 3, so that the airflow coverage ranges, i.e., heat dissipation areas, of the two fans move until they overlap, thereby improving the airflow correction of the heat dissipation area corresponding to the faulty fan.
Therefore, the scheme can consider that the 1# fan and the 3# fan take over the work of the failed 2# fan under the condition that the original heat dissipation work is not influenced, the integral heat dissipation effect of the electronic equipment is ensured, and the noise caused by too high rotating speed of the fans and the adverse influence on the heat dissipation efficiency of the system are avoided because the rotating speeds of the 1# fan and the 3# fan are not required to be greatly increased.
Optionally, according to actual needs, the rotation speed of the fan which normally operates can be appropriately increased, which does not cause adverse effects on the heat dissipation efficiency of the system and does not usually bring about noise.
Referring to fig. 6, a structural diagram of a radiator control apparatus provided in an embodiment of the present application may include:
the monitoring module 61 is configured to monitor that a first heat sink in the electronic device fails, where the first heat sink is any one of a plurality of heat sinks included in the electronic device, and other heat sinks in the plurality of heat sinks are called as second heat sinks;
optionally, in practical applications, the monitoring module 61 may include:
the monitoring unit is used for monitoring the current working parameters of the radiators;
and the abnormality determining unit is used for determining that the current working parameters of the first radiator are abnormal.
A determining module 62, configured to determine at least one second radiator adjacent to the first radiator by using preset position information of the plurality of radiators;
the control module 63 is configured to control the determined at least one second heat sink to rotate towards the first heat sink, so that the heat dissipation area corresponding to the at least one second heat sink covers the heat dissipation area corresponding to the first heat sink.
Therefore, the radiator adjacent to the fault radiator is rotated, so that the radiator can radiate the corresponding area of the fault radiator under the condition that the radiator is not influenced to radiate the electronic element in the area where the radiator is responsible for radiating, the radiating efficiency of the electronic equipment is improved, the power of other radiators is not required to be increased, and the noise is avoided.
Optionally, referring to fig. 7, the control module 63 may include:
the determining unit 631 is configured to determine an inclination direction and an inclination angle of the at least one second heat sink according to preset position information of the plurality of heat sinks and corresponding heat dissipation areas;
the inclination direction may refer to an opposite direction of the at least one second heat sink relative to the first heat sink, and the inclination directions of the determined different second heat sinks relative to the first heat sink may be different, which is not limited in this application.
In addition, as for the calculation of the determined inclination angle of each second heat sink relative to the first heat sink or the electronic device component or the initial position, reference may be made to the description of the corresponding part of the above method embodiment, and this calculation scheme is not described in detail in this application.
A control unit 632, configured to control the at least one second heat sink to incline the inclination angle toward the inclination direction.
In practical application, the airflow direction of the radiator adjacent to the position can be changed by controlling the rotation mode of the radiator adjacent to the position of the radiator with the fault, so that the radiator can cover the radiating area corresponding to the radiator with the fault, and the radiating effect of the electronic equipment is ensured.
As another embodiment of the present application, the control module 63 may also include:
the sending unit is used for sending a preset rotation instruction to a power component in the at least one second radiator so that the power component responds to the preset rotation instruction to control the at least one second radiator to rotate towards the direction of the first radiator.
Optionally, on the basis of the foregoing embodiments, as shown in fig. 8, the apparatus may further include:
an obtaining module 64, configured to obtain current heat dissipation areas corresponding to multiple second heat sinks in a working state;
a detection module 65, configured to detect whether any two acquired adjacent current heat dissipation areas have an overlapping area;
correspondingly, the control module 63 may be further configured to determine that any two adjacent current heat dissipation areas have an overlap area, and control the second heat sinks to operate according to current parameters; and determining that two adjacent current heat dissipation areas do not have an overlapping area, and adjusting the inclination angle until any two adjacent current heat dissipation areas have the overlapping area.
Optionally, the control module 63 may be further configured to control a second heat sink that is not adjacent to the first heat sink to remain unchanged.
To sum up, in the embodiment of the present application, when a failure of a certain heat sink, such as a first heat sink, is monitored, the preset position information of the plurality of heat sinks is utilized to determine at least one second heat sink adjacent to the first heat sink, and the determined at least one second heat sink is controlled to rotate toward the first heat sink, so that the heat dissipation area corresponding to the at least one second heat sink covers the heat dissipation area corresponding to the first heat sink, thereby meeting the heat dissipation requirement of the electronic component in the heat dissipation area corresponding to the first heat sink, ensuring the heat dissipation effect of the electronic device, and avoiding the increase of the work of the second heat sink, affecting the heat dissipation efficiency of the system and generating noise.
The above is mainly described from the perspective of a virtual structure, and the following will describe an apparatus implementing the above-described heat sink control method from the perspective of a physical device.
Referring to fig. 9, a hardware structure diagram of an electronic device provided in an embodiment of the present application is shown, where the electronic device may include:
a plurality of heat sinks 91;
in the embodiment of the application, the heat sink can output cold air during operation and blow the cold air in the form of air flow to each heating element of the electronic device, so as to reduce the ambient temperature in the electronic device. The operation of the heat sink can be referred to the description of the corresponding parts of the above method embodiments, and the embodiment is not described in detail here.
Alternatively, as shown in fig. 10, the heat sink 91 may include a heat dissipation component 911 and a power component 912, wherein the heat dissipation component 911 may be a fan or the like, and the power component 912 may be a stepping type rotating electrical machine, but is not limited thereto.
In practical application, the stepping type rotating motor can be preset to output one pulse to control the rotating angle of the fan, so that when the fan is required to rotate for a certain angle, the relationship can be directly utilized to determine that the rotating motor needs to output a plurality of pulses, and the rotation of the fan can be accurately controlled.
A memory 92 for storing a program for implementing the heat sink control method described above, and may further include information on each heat sink member as necessary;
a controller for loading and executing a program stored in a memory, comprising:
monitoring that a first radiator in electronic equipment fails, wherein the first radiator is any one of a plurality of radiators contained in the electronic equipment, and other radiators in the plurality of radiators are called as second radiators;
determining at least one second radiator adjacent to the first radiator by using preset position information of the radiators;
and controlling the determined at least one second radiator to rotate towards the direction of the first radiator so that the heat dissipation area corresponding to the at least one second radiator covers the heat dissipation area corresponding to the first radiator.
Optionally, the controller may further load a program for implementing the following steps, including:
determining the inclination direction and the inclination angle of the at least one second radiator according to the preset position information of the plurality of radiators and the corresponding heat dissipation areas, wherein the inclination direction is the opposite direction of the at least one second radiator relative to the first radiator;
and controlling the at least one second radiator to incline the inclination angle towards the inclination direction.
Or sending a preset rotation instruction to a power component in the at least one second radiator, so that the power component controls the at least one second radiator to rotate towards the direction of the first radiator in response to the preset rotation instruction.
As another embodiment of the present application, the controller may further load a program implementing the following method, including:
detecting whether any two adjacent current heat dissipation areas have overlapping areas or not;
determining that any two adjacent current heat dissipation areas have overlapping areas, and controlling the plurality of second radiators to work according to current parameters;
and determining that two adjacent current heat dissipation areas do not have an overlapping area, and adjusting the inclination angle until any two adjacent current heat dissipation areas have the overlapping area.
It should be noted that, regarding the hardware composition of the electronic device, the hardware composition is not limited to the above-mentioned several devices, and may further include a power supply, a communication interface, a display screen, and the like, which may be determined according to the product type of the electronic device, and the detailed description of the application is not repeated here.
In addition, as shown in fig. 11, in order to detect the failure of the heat sink, the electronic device may further include a rotation speed sensor 94 for detecting a rotation speed of the heat sink in the corresponding heat sink and transmitting the rotation speed to the controller to monitor whether the heat sink is failed.
Of course, for through other fault detection methods, the electronic device may also include corresponding fault detection equipment to implement fault detection on the heat sink, and details are not described herein.
In conclusion, the radiator adjacent to the fault radiator is rotated, so that the radiator can radiate the corresponding area of the fault radiator under the condition that the radiator is not influenced to radiate the electronic element in the area where the radiator is responsible for radiating, the radiating efficiency of the electronic equipment is improved, the power of other radiators is not required to be increased, and the noise is avoided.
The embodiment of the present application further provides a storage medium, which is used to store a program for implementing the heat sink control method, where the program is suitable for loading and executing a controller, and the specific implementation process of implementing the heat sink control method may refer to the description of the corresponding part in the foregoing embodiment, and this embodiment is not described in detail here.
In addition, it should be noted that, in the embodiments described above, relational terms such as first, second and the like are only used for distinguishing one operation, unit or module from another operation, unit or module, and do not necessarily require or imply any actual relation or order between the units, the units or modules. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method or system that comprises the element.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. For the device and the electronic equipment disclosed by the embodiment, the description is relatively simple because the device and the electronic equipment correspond to the method disclosed by the embodiment, and the relevant points can be referred to the description of the method part.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative components and steps have been described above generally in terms of their functionality in order to clearly illustrate this interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in Random Access Memory (RAM), memory, Read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. A method of controlling a heat sink, the method comprising:
monitoring that a first radiator in electronic equipment fails, wherein the first radiator is any one of a plurality of radiators contained in the electronic equipment, and other radiators in the plurality of radiators are called as second radiators;
determining at least one second radiator adjacent to the first radiator by using preset position information of the radiators;
controlling the determined at least one second radiator to rotate towards the direction of the first radiator so as to enable a heat dissipation area corresponding to the at least one second radiator to cover the heat dissipation area corresponding to the first radiator and then stop rotating;
the controlling the at least one second heat sink to rotate towards the first heat sink direction includes:
determining the inclination direction and the inclination angle of the at least one second radiator according to the preset position information of the plurality of radiators and the corresponding heat dissipation areas, wherein the inclination direction is the opposite direction of the at least one second radiator relative to the first radiator;
and controlling the at least one second radiator to incline the inclination angle towards the inclination direction.
2. The method of claim 1, wherein the heat sink comprises a heat dissipating component and a power component, and wherein controlling the at least one second heat sink to rotate in a direction toward the first heat sink comprises:
sending a preset rotation instruction to a power component in the at least one second radiator, so that the power component controls the at least one second radiator to rotate towards the direction of the first radiator in response to the preset rotation instruction.
3. The method of claim 1, further comprising:
acquiring current heat dissipation areas corresponding to a plurality of second heat radiators in a working state;
detecting whether any two adjacent current heat dissipation areas have overlapping areas or not;
determining that any two adjacent current heat dissipation areas have overlapping areas, and controlling the plurality of second radiators to work according to current parameters;
and determining that two adjacent current heat dissipation areas do not have an overlapping area, and adjusting the inclination angle until any two adjacent current heat dissipation areas have the overlapping area.
4. The method of claim 1, further comprising:
and controlling a second radiator which is not adjacent to the first radiator to maintain unchanged.
5. The method according to any one of claims 1-4, further comprising:
monitoring current operating parameters of the plurality of heat sinks;
the monitoring that the first heat sink is malfunctioning includes:
and determining that the current working parameters of the first radiator are abnormal.
6. A radiator control apparatus, comprising:
the electronic equipment comprises a monitoring module, a control module and a control module, wherein the monitoring module is used for monitoring that a first radiator in the electronic equipment fails, the first radiator is any one radiator in a plurality of radiators contained in the electronic equipment, and other radiators in the plurality of radiators are called as second radiators;
the determining module is used for determining at least one second radiator adjacent to the first radiator in position by utilizing preset position information of the radiators;
the control module is used for controlling the determined at least one second radiator to rotate towards the direction of the first radiator so as to enable the heat dissipation area corresponding to the at least one second radiator to cover the heat dissipation area corresponding to the first radiator and then stop rotating;
the controlling the at least one second heat sink to rotate towards the first heat sink direction includes:
determining the inclination direction and the inclination angle of the at least one second radiator according to the preset position information of the plurality of radiators and the corresponding heat dissipation areas, wherein the inclination direction is the opposite direction of the at least one second radiator relative to the first radiator;
and controlling the at least one second radiator to incline the inclination angle towards the inclination direction.
7. An electronic device, characterized in that the electronic device comprises:
a plurality of heat sinks;
a memory for storing a program for implementing the heat sink control method according to any one of claims 1 to 5;
a controller for loading and executing the program stored in the memory, comprising:
monitoring that a first radiator in electronic equipment fails, wherein the first radiator is any one of a plurality of radiators contained in the electronic equipment, and other radiators in the plurality of radiators are called as second radiators;
determining at least one second radiator adjacent to the first radiator by using preset position information of the radiators;
and controlling the determined at least one second radiator to rotate towards the direction of the first radiator so that the heat dissipation area corresponding to the at least one second radiator covers the heat dissipation area corresponding to the first radiator.
8. The electronic device of claim 7, wherein the heat sink comprises a heat dissipating component and a power component;
and the power component is used for controlling the corresponding heat dissipation component to rotate according to the received preset rotation instruction sent by the controller.
9. The electronic device of claim 8, further comprising:
and the rotating speed sensor is used for detecting the rotating speed of the radiating fins in the corresponding radiating part and sending the rotating speed to the controller so as to monitor whether the radiating part breaks down or not.
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| CN110062556B (en) | 2018-01-18 | 2021-01-08 | 伊姆西Ip控股有限责任公司 | Device with time division multiplexing heat dissipation capability |
| CN108664102B (en) * | 2018-04-24 | 2021-08-17 | 西安易朴通讯技术有限公司 | Electronic device and heat dissipation method |
| CN109709829B (en) * | 2018-12-21 | 2020-07-24 | 联想(北京)有限公司 | Control method and electronic equipment |
| CN109788727B (en) * | 2019-03-29 | 2020-12-18 | 联想(北京)有限公司 | Heat dissipation system and heat dissipation method |
| US11703921B2 (en) * | 2020-03-09 | 2023-07-18 | Nvidia Corporation | Configurable heatsink |
| CN115167567B (en) * | 2022-07-29 | 2024-07-23 | 联想(北京)信息技术有限公司 | Temperature control method and device |
| CN116594455B (en) * | 2023-07-17 | 2023-09-26 | 山东天互信息科技股份有限公司 | Smart city equipment information control processing method and system based on big data |
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| CN102858133A (en) * | 2011-06-27 | 2013-01-02 | 中兴通讯股份有限公司 | Electronic equipment as well as heat dissipation control method and device of electronic equipment |
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| US8145926B2 (en) * | 2008-09-30 | 2012-03-27 | Intel Corporation | Fan speed control of silicon based devices in low power mode to reduce platform power |
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| CN102858133A (en) * | 2011-06-27 | 2013-01-02 | 中兴通讯股份有限公司 | Electronic equipment as well as heat dissipation control method and device of electronic equipment |
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