Disclosure of Invention
In view of the above, the present invention provides a shock absorbing storage module that can provide a sufficient shock absorbing effect.
According to some embodiments of the present invention, a shock-absorbing storage module includes a shock-absorbing frame, a storage device, at least one locking member and at least one elastic member. The shock absorbing frame is provided with a slot and at least one through hole. The storage device occupies the slot and is removable from the slot. The lock accessory is a through hole penetrating through the shock absorbing frame, and the elastic piece is sleeved on the lock accessory.
According to some embodiments of the invention, the shock absorber includes a support base, the through hole is formed in the support base, the lock accessory includes a cap, and the support base is located between the cap and the elastic member.
According to some embodiments of the invention, the shock absorber comprises a support base, the through hole is formed in the support base, the lock accessory comprises a cap, and the elastic member is located between the cap and the support base.
According to some embodiments of the present invention, the shock absorbing frame includes a supporting seat, the through hole is formed in the supporting seat, the elastic member includes a first buffer portion, a second buffer portion, and a connecting portion, the connecting portion connects the first buffer portion and the second buffer portion, wherein the connecting portion is located in the through hole, and the first buffer portion and the second buffer portion are separated by the supporting seat.
According to some embodiments of the invention, the support base includes an inner surface and an outer surface opposite to each other, the locking device includes a cap, the first buffer portion abuts against the cap and the inner surface of the support base, and the second buffer portion abuts against the outer surface of the support base.
According to some embodiments of the invention, the cross-sectional area of the connecting portion is smaller than the cross-sectional area of the first cushioning portion, the cross-sectional area of the second cushioning portion, or both.
According to some embodiments of the invention, the locking element comprises a cap and a stud connected to each other, the stud has a threaded portion, the through hole is located between the threaded portion and the cap, and the elastic member is sleeved on the threaded portion.
According to some embodiments of the invention, the locking element is separate from the storage device.
According to some embodiments of the present invention, a shock absorbing storage module further comprises a connector, wherein the storage device is connected to the connector in a pluggable manner, and wherein the connector and the shock absorbing frame are relatively stationary.
According to some embodiments of the invention, the connector is locked to the shock frame.
According to some embodiments of the invention, the shock absorber comprises a top plate covering the storage device, and the connector is locked to the top plate.
According to some embodiments of the present invention, when the shock-absorbing storage module is applied to a computer and the casing or motherboard of the computer is impacted by an external force, the external force is transmitted to the shock-absorbing frame through the locking accessory because the shock-absorbing frame is locked on the casing or motherboard by the locking accessory, but the elastic member is sleeved on the locking accessory, so that the elastic member can reduce the vibration of the shock-absorbing frame, thereby achieving the shock-absorbing effect of the storage device.
The above description is merely illustrative of the problems to be solved, the technical means to solve the problems, the efficacy of the invention, etc., and the specific details of the invention are set forth in the following description and related drawings.
Detailed Description
The spirit of the present invention will be clearly described in the following drawings and detailed description, and any person having ordinary skill in the art, having knowledge of the embodiments of the present invention, can make changes and modifications by the technology taught by the present invention, without departing from the spirit and scope of the present invention. For example, recitation of "a first feature being formed over or on" a second feature would include the first feature and the second feature having direct contact in embodiments; and will also include the first feature and the second feature being non-direct contact with additional features formed between the first feature and the second feature. In addition, the present invention will reuse element labels and/or text in several examples. The repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
Fig. 1 is a schematic perspective view of a shock absorbing storage module 10 according to some embodiments of the present invention. Fig. 2 is a schematic cross-sectional view of line 2-2 of fig. 1. In fig. 1 and 2, the storage module 10 includes a shock frame 100, a locking member 200, an elastic member 300, and a storage device 400. The shock frame 100 has a slot S and a through hole 110. The storage device 400 occupies the slot S, and the storage device 400 is removable from the slot S. The locking attachment 200 penetrates through the through hole 110 of the shock frame 100. The elastic member 300 is sleeved on the lock accessory 200. In this embodiment, since the shock-absorbing frame 100 can be locked to a casing or a motherboard of a computer (not shown in the figure) through the lock accessory 200, and since the elastic member 300 is sleeved on the lock accessory 200, even if the casing or the motherboard vibrates, the elastic member 300 can slow down the influence of the vibration on the shock-absorbing frame 100, so that the storage device 400 inserted in the slot S is slowed down to be influenced by the vibration, and the shock-absorbing effect is achieved. Furthermore, when the casing or the motherboard is impacted by external force, the shock-absorbing frame 100 is locked on the casing or the motherboard by the lock accessory 200, so that the external force is transmitted to the shock-absorbing frame 100 by the lock accessory 200, but the elastic piece 300 is sleeved on the lock accessory 200, so that the vibration of the shock-absorbing frame 100 can be reduced by the elastic piece 300, and the shock-absorbing effect of the storage device 400 is further achieved.
In addition, since the lock accessory 200 sleeved with the elastic member 300 in the present embodiment is used to lock the shock-absorbing frame 100 to a casing or a motherboard of a computer, when the storage module 10 is applied to a computer such as an integrated computer, the storage device 400 inserted into the slot S of the shock-absorbing frame 100 can be directly extracted from the slot S because of being a removable storage device, and in design, not only the storage device 400 has a shock-absorbing effect, but also the convenience of the storage device 400 in replacement and maintenance can be improved.
In some embodiments, as shown in fig. 2, the shock frame 100 further includes a support base 120. The through hole 110 is formed in the support base 120. The elastic member 300 includes a first buffer portion 310, a second buffer portion 320, and a connection portion 330. The first buffer portion 310, the second buffer portion 320 and the connecting portion 330 are all sleeved on the lock accessory 200. The connection portion 330 connects the first buffer portion 310 and the second buffer portion 320. The connecting portion 330 is disposed in the through hole 110, and the first buffer portion 310 and the second buffer portion 320 are separated by the supporting seat 120. In other words, the connecting portion 330 is located between the first buffer portion 310 and the second buffer portion 320 and connects the first buffer portion 310 and the second buffer portion 320, and the first buffer portion 310 and the second buffer portion 320 are located at opposite sides (e.g. upper and lower sides) of the supporting seat 120. The locking device 200 is locked on the casing or the motherboard through the first buffer portion 310, the connecting portion 330 and the second buffer portion 320, so that the first buffer portion 310 and the second buffer portion 320 located at opposite sides of the supporting seat 120 and the connecting portion 330 located in the through hole 110 can help to reduce the vibration of the supporting seat 120.
Specifically, as shown in fig. 2, in some embodiments, the support base 120 includes an inner surface 122 and an outer surface 124. The inner surface 122 is opposite the outer surface 124. The first buffer portion 310 abuts against the inner surface 122 of the supporting seat 120. The second buffer portion 320 abuts against the outer surface 124 of the supporting seat 120. The connecting portion 330 is clamped between the locking member 200 and the wall of the through hole 110. In this way, the first buffer portion 310 can reduce the impact of the force applied to the first buffer portion 320 on the inner surface 122 of the supporting seat 120, the second buffer portion 320 can reduce the impact of the force applied to the second buffer portion on the outer surface 124 of the supporting seat 120, and the connecting portion 330 can reduce the impact of the force applied to the connecting portion 330 on the wall of the through hole 110, so as to further enhance the shock absorbing effect of the elastic member 300 on the supporting seat 120. For example, in some embodiments, the first buffer portion 310, the second buffer portion 320, the connecting portion 330, or any combination thereof may be an elastic damping, an elastic pad, a rubber, or any material capable of absorbing force, so as to facilitate the impact on the support base 120.
In some embodiments, as shown in fig. 2, lock accessory 200 includes cap 210. The first buffer portion 310 abuts against the inner surface 122 of the support base 120 and the cap 210. Specifically, in some embodiments, the upper surface of the first buffer portion 310 abuts against the cap 210, and the lower surface of the first buffer portion 310 abuts against the inner surface 122 of the supporting seat 120. In other words, the cap 210 is separated from the support base 120 by the first buffer 310. Therefore, even if the cap 210 is vibrated by the force from the casing or the motherboard, the first buffer portion 310 can reduce the impact of the force from the cap 210 on the supporting seat 120.
In some embodiments, lock accessory 200 further includes a stud 220. The stud 220 is a through hole 110 connected to the cap 210 and penetrating the support base 120. In some embodiments, the first buffer portion 310 surrounds and abuts against the stud 220. Therefore, even if the stud 220 vibrates due to the force from the casing or the motherboard, the first buffer portion 310 can reduce the impact of the force from the stud 220 on the supporting seat 120. Similarly, in some embodiments, the second buffer 320 surrounds and abuts against the stud 220. Therefore, even if the stud 220 vibrates due to the force from the casing or the motherboard, the second buffer portion 320 can reduce the impact of the force from the stud 220 on the supporting seat 120. Also similarly, the connecting portion 330 surrounds and abuts the stud 220. Therefore, even if the stud 220 vibrates due to the force from the casing or the motherboard, the connection portion 330 can reduce the impact of the force from the stud 220 on the support base 120. Although in the embodiment shown in fig. 2, the first buffer portion 310, the second buffer portion 320 and the connecting portion 330 all abut against the stud 220, in other embodiments, only the first buffer portion 310, the second buffer portion 320, the connecting portion 330 or any two thereof may abut against the stud 220.
In some embodiments, the stud 220 has a threaded portion 222. The through hole 110 is located between the threaded portion 222 and the cap 210, and the second buffer portion 320 is sleeved on the threaded portion 222. In other words, the threaded portion 222 can pass through the through hole 110 and be locked to the chassis or the motherboard, and since the second buffer portion 320 is sleeved on the threaded portion 222, when the threaded portion 222 is locked to the chassis or the motherboard, the second buffer portion 320 can be abutted against the supporting seat 120 and the chassis or the motherboard, so as to reduce the impact of the force from the chassis or the motherboard to the supporting seat 120.
In some embodiments, the cross-sectional area of the connecting portion 330 is smaller than the cross-sectional area of the first buffer portion 310, the cross-sectional area of the second buffer portion 320, or both. The cross-sectional area as referred to herein refers to the area of the cross-section of the object along a direction parallel to the inner surface 122 or the outer surface 124 of the support base 120. The design can facilitate the connection portion 330 being located in the through hole 110, and the first buffer portion 310 and the second buffer portion 320 respectively abut against the inner surface 122 and the outer surface 124 of the supporting seat 120, so as to enhance the shock absorbing effect.
For example, the first buffer portion 310, the second buffer portion 320 and the connecting portion 330 may be integrally formed as an elastomer. In some embodiments, during the process of assembling the elastic member 300 on the supporting seat 120, the elastic member 300 may be moved from the outer side of the outer surface 124 toward the supporting seat 120, then the first buffer portion 310 may be pressed into the through hole 110, and then the second buffer portion 320 may be pressed toward the supporting seat 120, so as to press the first buffer portion 310 out of the through hole 110, and the connecting portion 330 may enter the through hole 110. Since the first buffer portion 310 is elastic, when the first buffer portion 310 is pressed into the through hole 110, it is compressed by the wall of the through hole 110, and when the first buffer portion 310 leaves the through hole 110, it returns to its original shape and abuts against the inner surface 122 of the supporting seat 120. In other embodiments, during the process of assembling the elastic member 300 on the supporting seat 120, the elastic member 300 may be moved from the inner side of the inner surface 122 toward the supporting seat 120, then the second buffer portion 320 may be pressed into the through hole 110, and then the first buffer portion 310 may be pressed toward the supporting seat 120, so as to press the second buffer portion 320 out of the through hole 110, and the connecting portion 330 may enter the through hole 110. Since the second buffer portion 320 is elastic, when the second buffer portion 320 is pressed into the through hole 110, it is compressed by the wall of the through hole 110, and when the second buffer portion 320 leaves the through hole 110, it returns to its original shape and abuts against the outer surface 124 of the support base 120.
In some embodiments, the first buffer portion 310, the second buffer portion 320, and the connecting portion 330 may not be integrally formed. For example, the first buffer portion 310, the second buffer portion 320 and the connecting portion 330 may be fixed together by adhesion. In addition, in the process of assembling the elastic member 300 on the supporting seat 120, the connecting portion 330 is disposed in the through hole 110, and then the first buffer portion 310 and the second buffer portion 320 are adhered to the upper and lower sides of the connecting portion 330 respectively.
In some embodiments, as shown in fig. 1, the storage module 10 further includes a connector 500. The storage device 400 is connected to the connector 500 in a pluggable manner. The connector 500 is relatively stationary with respect to the shock frame 100. That is, the connector 500 does not move relative to the shock frame 100. In this way, when the shock frame 100 is impacted by the outside, the connector 500 and the shock frame 100 vibrate or are stationary synchronously. Therefore, the connector 500 also vibrates synchronously or is stationary synchronously with the storage device 400 in the slot S of the shock-absorbing frame 100, so that the storage device 400 and the connector 500 are prevented from being pulled mutually due to the relative motion, and damage to the storage device 400 and the connector 500 is avoided. In addition, since the elastic member 300 can reduce the vibration of the shock frame 100, the connector 500, which is relatively stationary with respect to the shock frame 100, can be prevented from being damaged due to the vibration.
For example, as shown in FIG. 1, in some embodiments, the connector 500 is locked to the shock frame 100 to vibrate synchronously or to rest synchronously with the shock frame 100. In other embodiments, the connector 500 may be fixed to the shock absorber 100 in other manners, for example, the connector 500 may be adhered or welded to the shock absorber 100, but the invention is not limited thereto.
In some embodiments, one end of the connector 500 is connected to the storage device 400 in a pluggable manner, and the other end of the connector 500 is connected to a flexible wire, and the flexible wire is further connected to the motherboard in a pluggable manner, when the storage device 400 is plugged onto the connector 500, the connector 500 can be electrically connected to the storage device 400, so that a processing unit (e.g., a central processing unit) on the motherboard can read and write data of the storage device 400 through the connector 500.
It should be noted that, in some embodiments, the storage device 400 shown in fig. 1 may be formed by, for example, a hard disk 410 accommodated in a hard disk frame 420, wherein the hard disk 410 is attached to the hard disk frame 420 by using screws. In addition, the hard disk frame 420 is further provided with an auxiliary extracting member 422 on a side far away from the connector 500, so that a user can conveniently extract the storage device 400 by using the auxiliary extracting member 422 to separate from the slot S of the shock absorbing frame 100.
As shown in fig. 1, in some embodiments, the shock frame 100 includes a top plate 140, and the top plate 140 covers the storage device 400. The connector 500 is locked to the top plate 140. Specifically, the top plate 140 is positioned over the storage device 400, and the connector 500 is locked to a surface of the top plate 140 that is relatively adjacent to the storage device 400. That is, the connector 500 has a lower level than the top plate 140. In this way, when the storage device 400 is inserted into the slot S of the shock frame 100 to be located under the top plate 140, the connector 500 may be connected in contact with a connection port (not shown) of the storage device 400. In addition, the top plate 140 may also protect the storage device 400 from scratches.
FIG. 3 is a side view of a shock frame of a shock-absorbing storage module according to some embodiments of the present invention. As shown in fig. 3, in some embodiments, the shock absorbing frame 100 further includes a pair of supporting surfaces 130 and a pair of guiding surfaces 150, and the supporting base 120, the supporting surfaces 130, the top plate 140 and the guiding surfaces 150 are integrally formed, so that the shock absorbing effect of the storage device 400 is achieved by using a relatively compact structural member. The guiding surface 150 is connected to the bottom of the top plate 140, and a supporting surface 130 is connected to a corresponding guiding surface 150, so that the guiding surface 150 and the supporting surface 130 together form a guiding rail L for clamping the storage device 400. In this way, the storage device 400 can be moved between a pair of rails L by a force greater than a certain friction force to enter or leave the slot S of the shock absorber 100, wherein the friction force is determined according to the clamping force of the rails L actually designed, which is not limited herein. Further, the storage device 400 can move on the guiding surface 150 and the supporting surface 130, and when the storage device 400 is inserted into the slot S, the supporting surface 130 can support the storage device 400, so as to prevent the storage device 400 from falling on the chassis or the motherboard. In some embodiments, the two guide surfaces 150 are parallel and opposite, and the guide surface 150 is perpendicular to the support surface 130. That is, the guide surface 150 and the bearing surface 130 together form a right angle rail L to further match the profile of the storage device 400.
In some embodiments, as shown in fig. 3, lock accessory 200 is separated from storage device 400 to prevent vibration of lock accessory 200 from directly affecting storage device 400. For example, the bearing surface 130 is higher than the inner surface 122 of the support base 120. The bearing surface 130 is spaced from the inner surface 122 of the support base 120 by a greater vertical distance than the upper surface of the cap 210 is spaced from the inner surface 122 of the support base 120. Therefore, when the lock accessory 200 is locked on the supporting seat 120 and the storage device 400 is supported on the supporting surface 130, the lock accessory 200 can be separated from the storage device 400, so as to improve the shock absorbing effect on the storage device 400.
Fig. 4 is an enlarged schematic cross-sectional view of a storage module 10a according to another embodiment of the invention. As shown in fig. 4, the main difference between the present embodiment and the foregoing embodiment is that: the elastic member 300a is located below the supporting seat 120. As shown in fig. 4, the elastic member 300a is located below the supporting seat 120 but not located in the through hole 110 and above the supporting seat 120, and the elastic member 300a is sleeved on the threaded portion 222 of the lock accessory 200. In other words, the threaded portion 222 of the locking device 200 is locked to the chassis or the motherboard through the elastic member 300a under the supporting seat 120, so that the elastic member 300a under the supporting seat 120 abuts against between the supporting seat 120 and the chassis or the motherboard, thereby helping to reduce the vibration of the supporting seat 120.
Specifically, in some embodiments, the elastic member 300a abuts against the outer surface 124 of the supporting seat 120. In this way, the elastic member 300a can reduce the impact of the force applied to the elastic member on the outer surface 124 of the supporting seat 120. For example, in some embodiments, the elastic member 300a may be an elastic damping, an elastic pad, rubber or any material capable of absorbing force, so as to facilitate the impact on the supporting seat 120. For example, the elastic member 300a surrounds and abuts against the portion of the threaded portion 222. Therefore, even if the screw portion 222 is vibrated by the force from the casing or the motherboard, the elastic member 300a can alleviate the impact of the force from the screw portion 222 on the supporting seat 120.
Fig. 5 is an enlarged schematic cross-sectional view of a storage module 10b according to some embodiments of the present invention. As shown in fig. 5, the main difference between the present embodiment and the foregoing embodiment is that: the elastic member 300b is located between the cap 210 and the support base 120. As shown in FIG. 5, the shock frame 100 includes a support base 120. The through hole 110 is formed in the support base 120. The elastic member 300b is located between the cap 210 and the supporting seat 120, and the elastic member 300b is sleeved on the lock accessory 200. In other words, the locking device 200 is locked to the housing or the motherboard through the elastic member 300b above the supporting base 120, so that the elastic member 300b above the supporting base 120 can help to reduce the vibration of the supporting base 120. Furthermore, when the casing or the motherboard is impacted by an external force, the shock-absorbing frame 100 is locked on the casing or the motherboard by the lock accessory 200, so that the external force is transmitted to the shock-absorbing frame 100 by the lock accessory 200, but the elastic member 300b is sleeved on the lock accessory 200 and is located between the cap 210 and the supporting seat 120, so that the vibration of the shock-absorbing frame 100 can be reduced by the elastic member 300b, and the shock-absorbing effect of the storage device 400 is further achieved.
Specifically, in some embodiments, the elastic member 300b abuts against the inner surface 122 of the supporting seat 120. In this way, the elastic member 300b can reduce the impact of the force applied to the elastic member on the inner surface 122 of the supporting seat 120. For example, in some embodiments, the elastic member 300b may be an elastic damping, an elastic pad, rubber or any material capable of absorbing force, so as to facilitate the impact on the supporting seat 120.
In some embodiments, the elastic member 300b is abutted between the cap 210 and the inner surface 122 of the support base 120 as shown in fig. 5. Specifically, in some embodiments, the upper surface of the elastic member 300b abuts against the cap 210, and the lower surface of the elastic member 300b abuts against the inner surface 122 of the supporting seat 120. In other words, the cap 210 is separated from the support base 120 by the elastic member 300 b. Therefore, even if the cap 210 is vibrated by the force from the casing or the motherboard, the elastic member 300b can alleviate the impact of the force from the cap 210 on the supporting base 120.
In some embodiments, as shown in fig. 5, the elastic member 300b surrounds and abuts against the stud 220. Therefore, even if the stud 220 vibrates due to the force from the casing or the motherboard, the elastic member 300b can also alleviate the impact of the force from the stud 220 on the supporting seat 120.
It should be understood that the above embodiment is exemplified by a lock accessory and an elastic member, but in other embodiments, the number of lock accessories and elastic members may be plural.
In summary, the shock absorbing storage module of the present invention uses the locking member sleeved with the elastic member to lock the shock absorbing frame on the casing or motherboard of the computer, so that the elastic member directly provides the shock absorbing frame with a buffering effect. When the external force of the vibration computer is generated, the elastic piece can buffer the external force to be transmitted to the shock-absorbing frame, so that the vibration of the shock-absorbing frame is reduced, and the storage device inserted into the shock-absorbing frame has a shock-absorbing effect. In addition, because the shock-absorbing frame adopts an integrally formed structure, the shock-absorbing storage module can provide a better shock-absorbing effect of the storage device only through simple structural members of the shock-absorbing frame, the locking accessory and the elastic piece in the whole design.
While the present invention has been described with reference to the embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention, and it is intended that the scope of the invention be limited only by the appended claims.