CN107329144A - A kind of miniature laser range finder module and range unit - Google Patents
A kind of miniature laser range finder module and range unit Download PDFInfo
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- CN107329144A CN107329144A CN201710703504.3A CN201710703504A CN107329144A CN 107329144 A CN107329144 A CN 107329144A CN 201710703504 A CN201710703504 A CN 201710703504A CN 107329144 A CN107329144 A CN 107329144A
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- 239000004065 semiconductor Substances 0.000 claims description 11
- 229910044991 metal oxide Inorganic materials 0.000 claims description 6
- 150000004706 metal oxides Chemical class 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- 238000013461 design Methods 0.000 claims description 4
- 238000002955 isolation Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 8
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/06—Systems determining position data of a target
- G01S17/08—Systems determining position data of a target for measuring distance only
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Electromagnetism (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
本发明实施例公开了一种微型激光测距模块及测距装置。本发明实施例中微型激光测距模块包括壳体,该壳体呈长方体形状,该壳体顶部设置半导体激光器发射模块,该壳体前端设置有凸出所述壳体的激光接收模块。本发明实施例中微型激光测距模块把激光发射端与接收端集成在一起,使用方便,直接像芯片一样粘贴到指定位置就行了,不需要进行发射端与接收端位置匹配调整,发射与接收一体化可以减少工艺的复杂性。
The embodiment of the invention discloses a miniature laser ranging module and a ranging device. In the embodiment of the present invention, the miniature laser ranging module includes a housing, the housing is in the shape of a cuboid, the top of the housing is provided with a semiconductor laser emitting module, and the front end of the housing is provided with a laser receiving module protruding from the housing. In the embodiment of the present invention, the micro-laser ranging module integrates the laser transmitting end and the receiving end, which is convenient to use and can be directly pasted to the designated position like a chip. Integration reduces process complexity.
Description
技术领域technical field
本发明涉及激光技术领域,特别涉及一种微型激光测距模块及测距装置。The invention relates to the field of laser technology, in particular to a miniature laser ranging module and a ranging device.
背景技术Background technique
现有的激光测距模块是激光器发射与接收模块是分开的,没有进行集成,这样两个模块的体积很大,在激光雷达,手机相机测距对焦等运用,需要使用到体积微型的激光器测距模块,如果没有进行集成处理的测距模块是很难满足这些微型运用。同时发射端与接收端分开,占用空间大,发射端与接收端匹配调整困难;发射端与接收端分开制作工艺步骤复杂,需要先贴发射端,再贴接收端,而且位置要求高;激光器发的光一小部分会被基底挡住,热沉镀金设计在使用中很容易导致短路。In the existing laser ranging module, the laser transmitting and receiving modules are separated and not integrated, so the two modules are large in size. In the application of laser radar, mobile phone camera ranging and focusing, etc., it is necessary to use a small laser measuring device. If there is no ranging module for integrated processing, it is difficult to meet these miniature applications. At the same time, the transmitting end is separated from the receiving end, which takes up a lot of space, and it is difficult to match and adjust the transmitting end and the receiving end; A small part of the light will be blocked by the substrate, and the gold-plated design of the heat sink can easily cause a short circuit during use.
发明内容Contents of the invention
本发明实施例提供了一种微型激光测距模块及测距装置,已解决目前微型激光测距模块发射端与接收端分开,占用空间大,发射端与接收端匹配调整困难;发射端与接收端分开制作工艺步骤复杂的问题。The embodiment of the present invention provides a miniature laser ranging module and a ranging device, which have solved the problem that the transmitting end of the miniature laser ranging module is separated from the receiving end, occupies a large space, and is difficult to match and adjust the transmitting end and the receiving end; The terminal separates the problem of complicated manufacturing process steps.
第一方面,本发明提供一种微型激光测距模块,所述微型激光测距模块包括壳体,所述壳体呈长方体形状,所述壳体顶部设置半导体激光器发射模块,所述壳体前端设置有凸出所述壳体的激光接收模块。In a first aspect, the present invention provides a miniature laser ranging module, the miniature laser ranging module includes a housing, the housing is in the shape of a cuboid, a semiconductor laser emitting module is arranged on the top of the housing, and the front end of the housing is A laser receiving module protruding from the housing is provided.
进一步的,所述激光接收模块包括雪崩二极管。Further, the laser receiving module includes an avalanche diode.
进一步的,所述壳体前端左侧设置为雪崩二极管正极,所述壳体前端右侧为雪崩二极管负极。Further, the left side of the front end of the casing is set as the positive pole of the avalanche diode, and the right side of the front end of the casing is set as the negative pole of the avalanche diode.
进一步的,所述壳体后端中间为金属氧化物主体。Further, the middle of the rear end of the housing is a metal oxide body.
进一步的,所述金属氧化物主体为氧化铝主体。Further, the metal oxide host is an alumina host.
进一步的,所述半导体激光器发射模块前端伸出100μm~500μm。Further, the front end of the semiconductor laser emitting module protrudes by 100 μm to 500 μm.
进一步的,所述半导体激光器发射模块前端伸出200μm。Further, the front end of the semiconductor laser emitting module protrudes by 200 μm.
进一步的,所述壳体前端,所述雪崩二极管负极和所述雪崩二极管正极之间设置有避免焊接时正负极短路的隔离区域。Further, an isolation area is provided between the front end of the housing, the cathode of the avalanche diode and the anode of the avalanche diode to avoid short circuit of the anode and cathode during welding.
进一步的,所述雪崩二极管采用负极镀金设计。Further, the avalanche diode adopts a gold-plated cathode design.
第二方面,本发明提供一种激光测距装置,所述装置包括如第一方面中任一所述的微型激光测距模块。In a second aspect, the present invention provides a laser distance measuring device, which includes the miniature laser distance measuring module as described in any one of the first aspects.
从以上技术方案可以看出,本发明实施例具有以下优点:It can be seen from the above technical solutions that the embodiments of the present invention have the following advantages:
本发明实施例中微型激光测距模块包括壳体,所述壳体顶部设置半导体激光器发射模块,所述壳体呈长方体形状,所述壳体前端设置有凸出的激光接收模块。本发明实施例中微型激光测距模块把激光发射端与接收端集成在一起,使用方便,直接像芯片一样粘贴到指定位置就行了,不需要进行发射端与接收端位置匹配调整,发射与接收一体化可以减少工艺的复杂性。In the embodiment of the present invention, the miniature laser ranging module includes a housing, and a semiconductor laser emitting module is arranged on the top of the housing. The housing is in the shape of a cuboid, and a protruding laser receiving module is provided at the front end of the housing. In the embodiment of the present invention, the micro-laser ranging module integrates the laser transmitting end and the receiving end, which is convenient to use and can be directly pasted to the designated position like a chip. Integration reduces process complexity.
附图说明Description of drawings
图1是本发明实施例中微型激光测距模块的一个实施例示意图;Fig. 1 is a schematic diagram of an embodiment of a miniature laser ranging module in an embodiment of the present invention;
图2是本发明实施例中微型激光测距模块的前视图;Fig. 2 is the front view of the miniature laser ranging module in the embodiment of the present invention;
图3是本发明实施例中微型激光测距模块的底视图。Fig. 3 is a bottom view of the miniature laser ranging module in the embodiment of the present invention.
具体实施方式detailed description
为了使本技术领域的人员更好地理解本发明方案,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分的实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都应当属于本发明保护的范围。In order to enable those skilled in the art to better understand the solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is an embodiment of a part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.
本发明的说明书和权利要求书及上述附图中的术语“第一”、“第二”等(如果存在)是用于区别类似的对象,而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换,以便这里描述的实施例能够以除了在这里图示或描述的内容以外的顺序实施。此外,术语“包括”和“具有”以及他们的任何变形,意图在于覆盖不排他的包含,例如,包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元,而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。The terms "first", "second" and the like (if any) in the description and claims of the present invention and the above drawings are used to distinguish similar objects and not necessarily to describe a specific order or sequence. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments described herein can be practiced in sequences other than those illustrated or described herein. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive inclusion, for example, a process, method, system, product or device comprising a sequence of steps or elements is not necessarily limited to the expressly listed instead, may include other steps or elements not explicitly listed or inherent to the process, method, product or apparatus.
请参阅图1、图2、图3,本发明提供一种微型激光测距模块,所述微型激光测距模块包括壳体10,所述壳体10呈长方体形状,所述壳体10顶部设置半导体激光器发射模块20,所述壳体10前端设置有凸出的激光接收模块30。Please refer to Fig. 1, Fig. 2, Fig. 3, the present invention provides a kind of miniature laser ranging module, described miniature laser ranging module comprises housing 10, and described housing 10 is cuboid shape, and the top of described housing 10 is arranged A semiconductor laser emitting module 20 , a protruding laser receiving module 30 is provided at the front end of the housing 10 .
进一步的,所述激光接收模块30包括雪崩二极管60,所述壳体10前端左侧设置为雪崩二极管正极40,所述壳体10前端右侧为雪崩二极管负极50。Further, the laser receiving module 30 includes an avalanche diode 60 , the avalanche diode anode 40 is arranged on the left side of the front end of the housing 10 , and the avalanche diode cathode 50 is arranged on the right side of the front end of the housing 10 .
进一步的,所述壳体10后端中间为金属氧化物主体80,优选的,所述金属氧化物主体80为氧化铝主体。Further, the middle of the rear end of the housing 10 is a metal oxide body 80, preferably, the metal oxide body 80 is an alumina body.
进一步的,所述半导体激光器发射模块前端伸出100μm~500μm,使发出的光不被挡住。优选的,所述半导体激光器发射模块前端伸出200μm。Further, the front end of the semiconductor laser emitting module protrudes by 100 μm to 500 μm, so that the emitted light is not blocked. Preferably, the front end of the semiconductor laser emitting module protrudes by 200 μm.
进一步的,所述壳体前端,所述雪崩二极管负极50和所述雪崩二极管正极40之间设置有避免焊接时正负极短路的隔离区域70。Further, an isolation area 70 is provided between the front end of the housing, the avalanche diode cathode 50 and the avalanche diode anode 40 to avoid short circuit between the positive and negative poles during welding.
进一步的,所述雪崩二极管采用负极镀金设计,避免使用时正负极短路。Further, the avalanche diode adopts a gold-plated negative electrode design to avoid short-circuiting of the positive and negative electrodes during use.
本发明实施例中微型激光测距模块包括壳体,所述壳体顶部设置半导体激光器发射模块,所述壳体前端设置有凸出的激光接收模块,所述激光接收模块包括雪崩二极管,所述壳体左侧设置为雪崩二极管正极,所述壳体左侧为雪崩二极管负极,所述壳体后端中间为氧化铝主体。本发明实施例中微型激光测距模块把激光发射端与接收端集成在一起,使用方便,直接像芯片一样粘贴到指定位置就行了,不需要进行发射端与接收端位置匹配调整,发射与接收一体化可以减少工艺的复杂性。In the embodiment of the present invention, the miniature laser ranging module includes a housing, a semiconductor laser emitting module is arranged on the top of the housing, and a protruding laser receiving module is provided at the front end of the housing, and the laser receiving module includes an avalanche diode. The left side of the housing is set as the positive pole of the avalanche diode, the left side of the housing is the negative pole of the avalanche diode, and the middle of the rear end of the housing is an alumina body. In the embodiment of the present invention, the micro-laser ranging module integrates the laser transmitting end and the receiving end, which is convenient to use and can be directly pasted to the designated position like a chip. Integration reduces process complexity.
本发明实施例中还提供一种激光测距装置,该装置包括如上述实施例中任一实施例中所描述的微型激光测距模块。An embodiment of the present invention also provides a laser distance measuring device, which includes the miniature laser distance measuring module as described in any one of the above embodiments.
在本申请所提供的几个实施例中,应该理解到,所揭露的系统,装置可以通过其它的方式实现。例如,以上所描述的装置实施例仅仅是示意性的,例如,所述单元的划分,仅仅为一种逻辑功能划分,实际实现时可以有另外的划分方式,例如多个单元或组件可以结合或者可以集成到另一个系统,或一些特征可以忽略,或不执行。另一点,所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口,装置或单元的间接耦合或通信连接,可以是电性,机械或其它的形式。In the several embodiments provided in this application, it should be understood that the disclosed systems and devices may be implemented in other ways. For example, the device embodiments described above are only illustrative. For example, the division of the units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components can be combined or May be integrated into another system, or some features may be ignored, or not implemented. In another point, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or units may be in electrical, mechanical or other forms.
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的,作为单元显示的部件可以是或者也可以不是物理单元,即可以位于一个地方,或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place, or may be distributed to multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.
以上所述,以上实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still understand the foregoing The technical solutions recorded in each embodiment are modified, or some of the technical features are replaced equivalently; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.
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Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09251663A (en) * | 1996-03-15 | 1997-09-22 | Toshiba Corp | Optical element unit and production therefor |
CN1299171A (en) * | 1999-12-01 | 2001-06-13 | 夏普公司 | Semi-conductive laser device, its mfg. method and optical pick-up device using same |
CN2457763Y (en) * | 2000-11-17 | 2001-10-31 | 赵俊祥 | Packaging structure of semiconductor laser |
JP2007189030A (en) * | 2006-01-12 | 2007-07-26 | Sumitomo Electric Ind Ltd | Semiconductor laser device |
CN201797230U (en) * | 2010-01-22 | 2011-04-13 | 上海高意激光技术有限公司 | Miniature TO-packaged wide-temperature-range solid-state laser |
CN102025111A (en) * | 2010-11-19 | 2011-04-20 | 无锡亮源激光技术有限公司 | Small-divergence-angle solid laser pumping module encapsulating structure |
CN102157883A (en) * | 2010-12-20 | 2011-08-17 | 福州大学 | Terahertz transmitter based on surface plasma resonance |
CN102981129A (en) * | 2012-12-11 | 2013-03-20 | 华为技术有限公司 | Testing tool for power supply |
CN103368065A (en) * | 2012-03-29 | 2013-10-23 | 山东华光光电子有限公司 | Solid state laser device array packaging structure and solid state laser device array packaging method |
CN103959086A (en) * | 2011-12-01 | 2014-07-30 | 莱卡地球系统公开股份有限公司 | Distance measuring device |
CN204128541U (en) * | 2014-10-15 | 2015-01-28 | 北京国科欣翼科技有限公司 | Miniature laser range finder |
CN205880219U (en) * | 2016-07-29 | 2017-01-11 | 北京凯波兰特科技发展有限公司 | Erbium glass laser distance measuring equipment |
CN205899021U (en) * | 2016-04-12 | 2017-01-18 | 北京国科欣翼科技有限公司 | Minitype laser range finder |
CN205899025U (en) * | 2016-04-12 | 2017-01-18 | 北京国科欣翼科技有限公司 | Minitype laser range finder |
CN205899023U (en) * | 2016-04-12 | 2017-01-18 | 北京国科欣翼科技有限公司 | Minitype laser range finder |
CN205899024U (en) * | 2016-04-12 | 2017-01-18 | 北京国科欣翼科技有限公司 | Minitype laser range finder |
CN207263154U (en) * | 2017-08-16 | 2018-04-20 | 深圳市杰普特光电股份有限公司 | A kind of miniature laser range finder module and range unit |
-
2017
- 2017-08-16 CN CN201710703504.3A patent/CN107329144A/en active Pending
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09251663A (en) * | 1996-03-15 | 1997-09-22 | Toshiba Corp | Optical element unit and production therefor |
CN1299171A (en) * | 1999-12-01 | 2001-06-13 | 夏普公司 | Semi-conductive laser device, its mfg. method and optical pick-up device using same |
CN2457763Y (en) * | 2000-11-17 | 2001-10-31 | 赵俊祥 | Packaging structure of semiconductor laser |
JP2007189030A (en) * | 2006-01-12 | 2007-07-26 | Sumitomo Electric Ind Ltd | Semiconductor laser device |
CN201797230U (en) * | 2010-01-22 | 2011-04-13 | 上海高意激光技术有限公司 | Miniature TO-packaged wide-temperature-range solid-state laser |
CN102025111A (en) * | 2010-11-19 | 2011-04-20 | 无锡亮源激光技术有限公司 | Small-divergence-angle solid laser pumping module encapsulating structure |
CN102157883A (en) * | 2010-12-20 | 2011-08-17 | 福州大学 | Terahertz transmitter based on surface plasma resonance |
CN103959086A (en) * | 2011-12-01 | 2014-07-30 | 莱卡地球系统公开股份有限公司 | Distance measuring device |
US20140327902A1 (en) * | 2011-12-01 | 2014-11-06 | Leica Geosystems Ag | Distance measuring device |
CN103368065A (en) * | 2012-03-29 | 2013-10-23 | 山东华光光电子有限公司 | Solid state laser device array packaging structure and solid state laser device array packaging method |
CN102981129A (en) * | 2012-12-11 | 2013-03-20 | 华为技术有限公司 | Testing tool for power supply |
CN204128541U (en) * | 2014-10-15 | 2015-01-28 | 北京国科欣翼科技有限公司 | Miniature laser range finder |
CN205899021U (en) * | 2016-04-12 | 2017-01-18 | 北京国科欣翼科技有限公司 | Minitype laser range finder |
CN205899025U (en) * | 2016-04-12 | 2017-01-18 | 北京国科欣翼科技有限公司 | Minitype laser range finder |
CN205899023U (en) * | 2016-04-12 | 2017-01-18 | 北京国科欣翼科技有限公司 | Minitype laser range finder |
CN205899024U (en) * | 2016-04-12 | 2017-01-18 | 北京国科欣翼科技有限公司 | Minitype laser range finder |
CN205880219U (en) * | 2016-07-29 | 2017-01-11 | 北京凯波兰特科技发展有限公司 | Erbium glass laser distance measuring equipment |
CN207263154U (en) * | 2017-08-16 | 2018-04-20 | 深圳市杰普特光电股份有限公司 | A kind of miniature laser range finder module and range unit |
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Application publication date: 20171107 |