CN107316846A - A kind of graphene heat-conducting plate - Google Patents
A kind of graphene heat-conducting plate Download PDFInfo
- Publication number
- CN107316846A CN107316846A CN201610265533.1A CN201610265533A CN107316846A CN 107316846 A CN107316846 A CN 107316846A CN 201610265533 A CN201610265533 A CN 201610265533A CN 107316846 A CN107316846 A CN 107316846A
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- CN
- China
- Prior art keywords
- graphene
- layer
- grid
- inner core
- resin inner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3738—Semiconductor materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Include graphene layer the invention discloses one kind, thermally conductive insulating layer and conductive layer, the graphene layer is made up of graphene platelet and graphene condensate, the thermally conductive insulating layer is made up of resin inner core and the rubber layer being wrapped in outside the resin inner core, the upper end of the resin inner core is provided with multiple metal connection posts, the metal connection post part stretches out the upper surface of the resin inner core, the conductive layer is the grid that metal wire is constituted, the grid includes multiple grid cells, the grid cell includes a plurality of Grid Edge and adjacent two Grid Edge and connected the node to be formed, the conductive layer includes induction zone and the lead district electrically connected with induction zone, the induction zone includes the first sensing pattern and the second sensing pattern, pattern is adjacent and mutually insulated for the first sensing pattern and second sensing.The present invention provides graphene heat-conducting plate, and reasonable structural arrangement, integrated level is high, excellent heat dissipation performance.
Description
Technical field
It is to be related to a kind of graphene heat-conducting plate more specifically the present invention relates to technical field of graphene.
Background technology
In recent years, grapheme material has obtained extensive concern with its excellent physical property, such as its high carrier mobility,
High conduction performance and high thermal conductivity etc., be by a kind of people very good carbon-based material, although grapheme material is shown
Many excellent physical characteristics, but the devices/circuits based on graphene how are designed, it is still that existing scientific research field is difficult to capture
Problem, especially realize integrated.
The scientist of IBM Corporation of the U.S. have developed the integrated circuit that first is made up of graphene disk, be calculated to exploitation graphene
Gone a step further before movement piece, scientists think that this breakthrough may imply that future can substitute silicon wafer with graphene disk.
At present, the heat-conducting plate being made of graphene, structure arrangement is unreasonable, and integrated level is low, and heat dispersion is not good, therefore,
Need to make it further research and improve.
The content of the invention
In view of this, it is an object of the invention to propose a kind of reasonable structural arrangement, integrated level is high, the graphene of excellent heat dissipation performance
Heat-conducting plate.
To achieve these goals, technical scheme is as follows：
A kind of graphene heat-conducting plate, including graphene layer, thermally conductive insulating layer and the conductive layer set gradually, the graphene layer by
Graphene platelet and graphene condensate composition, the thermally conductive insulating layer is by resin inner core and is wrapped in outside the resin inner core
Rubber layer is constituted, and the upper end of the resin inner core is provided with multiple metal connection posts, and the metal connection post part stretches out the resin
The upper surface of inner core, the conductive layer is the grid that metal wire is constituted, and the grid includes multiple grid cells, the grid list
Member includes a plurality of Grid Edge and adjacent two Grid Edge and connected the node to be formed, and the conductive layer includes induction zone and is electrically connected with induction zone
The lead district connect, the induction zone includes the first sensing pattern and the second sensing pattern, the first sensing pattern and described second
Sense that pattern is adjacent and mutually insulated, the grid cell in each first sensing pattern is electrically connected to each other, each second sensing pattern
Interior grid cell is electrically connected to each other.
As a kind of preferred embodiment of the present invention, the metal connection post is cylinder, and the metal connection post is in the tree
The part of in-core has annular recess in fat, the resin inner core is formed the collar flange of the embedded annular recess.
As the present invention a kind of preferred embodiment, the graphene layer be surrounded by and the graphene layer be connected
Card frame, the card frame is provided with multiple equally distributed heat conduction nails.
As a kind of preferred embodiment of the present invention, the thickness of the graphene layer is 2~2.5um.
As a kind of preferred embodiment of the present invention, the thickness of the thermally conductive insulating layer is 75~150um.
As a kind of preferred embodiment of the present invention, the thickness of the conductive layer is 40~120um.
Compared with prior art, beneficial effects of the present invention are as follows：Present invention offer graphene heat-conducting plate, reasonable structural arrangement,
Integrated level is high, excellent heat dissipation performance.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, the accompanying drawing used required in being described below to embodiment
It is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, general for this area
For logical technical staff, on the premise of not paying creative work, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is structural representation of the invention；
Fig. 2 is the structural representation of thermally conductive insulating layer in the present invention.
Reference：1st, graphene layer, 2, thermally conductive insulating layer, 3, conductive layer, 21, resin inner core, 22, rubber layer,
23rd, groove, 24, metal connection post, 25, flange.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely retouched
State, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.Based on the present invention
In embodiment, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made,
Belong to the scope of protection of the invention.
As shown in Fig. 1~2, a kind of graphene heat-conducting plate, including graphene layer 1, thermally conductive insulating layer 2 and the conduction set gradually
Layer 3, the graphene layer 1 is made up of graphene platelet and graphene condensate, and the thermally conductive insulating layer 2 is by resin inner core 21
Constituted with the rubber layer 22 being wrapped in outside the resin inner core 21, the upper end of the resin inner core 21 connects provided with multiple metals
The upper surface of the resin inner core 21 is stretched out in terminal 24, the part of metal connection post 24, and the conductive layer 3 is metal wire structure
Into grid, the grid includes multiple grid cells, and the grid cell includes a plurality of Grid Edge and adjacent two Grid Edge and connected
The node of formation, the conductive layer 3 includes induction zone and the lead district electrically connected with induction zone, and the induction zone includes the first sense
Pattern and second is answered to sense pattern, pattern is adjacent and mutually insulated, each first for the first sensing pattern and second sensing
Grid cell in sensing pattern is electrically connected to each other, and the grid cell in each second sensing pattern is electrically connected to each other.
In the present embodiment, the metal connection post 24 is cylinder, and the metal connection post 24 is in the resin inner core 21
Part there is annular recess 23, the resin inner core is formed the collar flange 25 of the embedded annular recess 23.
In the present embodiment, the card frame being surrounded by with the graphene layer 1 mating connection of the graphene layer 1, the card frame
Provided with multiple equally distributed heat conduction nails.
In the present embodiment, the thickness of the graphene layer 1 is 2~2.5um.
In the present embodiment, the thickness of the thermally conductive insulating layer 2 is 75~150um.
In the present embodiment, the thickness of the conductive layer 3 is 40~120um.
The present invention constitutes heat sink, reasonable structural arrangement using graphene layer 1, thermally conductive insulating layer 2 and conductive layer 3, and leads
Thermal insulation layer 2 is made up of resin inner core 21 and outside rubber layer 22, sets ingenious, the upper end of resin inner core 21 sets multiple
Metal connection post 24, meanwhile, multiple metal wires are provided with conductive layer 3, according to region division, and the surrounding of graphene layer 1
Close arrangement has multiple heat conduction to follow closely, and around setting, so rationally distributed, radiating effect is greatly improved, and integrated level is high.
The foregoing is only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all the spirit and principles in the present invention it
Interior, any modification, equivalent substitution for being made etc. should be included in the scope of the protection.
Claims (6)
1. a kind of graphene heat-conducting plate, it is characterised in that including the graphene layer set gradually, thermally conductive insulating layer and conductive layer,
The graphene layer is made up of graphene platelet and graphene condensate, and the thermally conductive insulating layer is by resin inner core and is wrapped in described
Rubber layer composition outside resin inner core, the upper end of the resin inner core is provided with multiple metal connection posts, the metal connection post portion
Divide the upper surface for stretching out the resin inner core, the conductive layer is the grid that metal wire is constituted, and the grid includes multiple grid lists
Member, the grid cell includes a plurality of Grid Edge and adjacent two Grid Edge and connected the node to be formed, and the conductive layer includes induction zone
With the lead district electrically connected with induction zone, the induction zone includes the first sensing pattern and the second sensing pattern, first sensing
Pattern is adjacent and mutually insulated for pattern and second sensing, and the grid cell in each first sensing pattern is electrically connected to each other, often
Grid cell in individual second sensing pattern is electrically connected to each other.
2. graphene heat-conducting plate as claimed in claim 1, it is characterised in that the metal connection post is cylinder, the gold
Category binding post part of in-core in the resin has annular recess, the resin inner core is formed the embedded annular recess
Collar flange.
3. graphene heat-conducting plate as claimed in claim 1, it is characterised in that the graphene layer is surrounded by and the stone
The card frame that black alkene layer is connected, the card frame is provided with multiple equally distributed heat conduction nails.
4. graphene heat-conducting plate as claimed in claim 1, it is characterised in that the thickness of the graphene layer is 2~2.5um.
5. graphene heat-conducting plate as claimed in claim 1, it is characterised in that the thickness of the thermally conductive insulating layer is
75~150um.
6. graphene heat-conducting plate as claimed in claim 1, it is characterised in that the thickness of the conductive layer is 40~120um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610265533.1A CN107316846A (en) | 2016-04-27 | 2016-04-27 | A kind of graphene heat-conducting plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610265533.1A CN107316846A (en) | 2016-04-27 | 2016-04-27 | A kind of graphene heat-conducting plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107316846A true CN107316846A (en) | 2017-11-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610265533.1A Pending CN107316846A (en) | 2016-04-27 | 2016-04-27 | A kind of graphene heat-conducting plate |
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| CN (1) | CN107316846A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109373239A (en) * | 2018-10-30 | 2019-02-22 | 赣州市众恒光电科技有限公司 | A kind of LED lamp structure |
| CN109439291A (en) * | 2018-11-23 | 2019-03-08 | 大同新成新材料股份有限公司 | A kind of graphite plate and its manufacturing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101950639A (en) * | 2010-09-25 | 2011-01-19 | 卢大庆 | Insulator |
| CN202584956U (en) * | 2012-04-28 | 2012-12-05 | 卢秋华 | Insulator device |
| CN203178962U (en) * | 2013-03-20 | 2013-09-04 | 南昌欧菲光科技有限公司 | Touch screen and conducting layer thereof |
| CN203504880U (en) * | 2013-04-22 | 2014-03-26 | 江苏悦达墨特瑞新材料科技有限公司 | Graphene heat conduction circuit substrate |
-
2016
- 2016-04-27 CN CN201610265533.1A patent/CN107316846A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101950639A (en) * | 2010-09-25 | 2011-01-19 | 卢大庆 | Insulator |
| CN202584956U (en) * | 2012-04-28 | 2012-12-05 | 卢秋华 | Insulator device |
| CN203178962U (en) * | 2013-03-20 | 2013-09-04 | 南昌欧菲光科技有限公司 | Touch screen and conducting layer thereof |
| CN203504880U (en) * | 2013-04-22 | 2014-03-26 | 江苏悦达墨特瑞新材料科技有限公司 | Graphene heat conduction circuit substrate |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109373239A (en) * | 2018-10-30 | 2019-02-22 | 赣州市众恒光电科技有限公司 | A kind of LED lamp structure |
| CN109373239B (en) * | 2018-10-30 | 2024-02-09 | 赣州市众恒光电科技有限公司 | LED lamp structure |
| CN109439291A (en) * | 2018-11-23 | 2019-03-08 | 大同新成新材料股份有限公司 | A kind of graphite plate and its manufacturing method |
| CN109439291B (en) * | 2018-11-23 | 2020-12-22 | 大同新成新材料股份有限公司 | Graphite plate and manufacturing method thereof |
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Application publication date: 20171103 |