CN107314258A

CN107314258A - The LEDbulb lamp of LED filament and its manufacture method and the application filament

Info

Publication number: CN107314258A
Application number: CN201710086839.5A
Authority: CN
Inventors: 江涛; 李丽琴
Original assignee: Jiaxing Super Lighting Electric Appliance Co Ltd
Current assignee: Jiaxing Super Lighting Electric Appliance Co Ltd
Priority date: 2016-04-27
Filing date: 2017-02-17
Publication date: 2017-11-03
Anticipated expiration: 2037-02-17
Also published as: CN206958642U; CN207716115U; CN207849021U; CN111550687A; CN208535603U; CN207852724U; CN107314258B

Abstract

A kind of LEDbulb lamp includes lamp housing, the lamp holder of the connection lamp housing, stem, conducting bracket, LED filament and cantilever, and stem is included at the top of relative stem bottom and stem top, stem bottom connection lamp holder, conducting bracket connection stem；LED filament includes filament body and filament electrode, and filament electrode is located at the opposite end of filament body, and two filament electrodes connect two conducting brackets respectively, and around stem, cantilever one end connection stem, the other end connects filament body to filament body.In the height direction, it is H by lamp housing bottom to distance between lamp housing top, have 0 between two filament electrodes to the first difference in height between 1/10H, and the bending of filament body rises and falls and has the second difference in height with peak and minimum point, between peak and minimum point, the first difference in height is less than the second difference in height, second difference in height is 2/10 between 4/10H, structure light-emitting effect of the present invention is good, makes simple, rising angle is big.

Description

The LEDbulb lamp of LED filament and its manufacture method and the application filament

Technical field

The present invention relates to lighting field, and in particular to a kind of LED filament and its manufacture method and the application LED filament LEDbulb lamp.

Background technology

LED has environmental protection, energy-conservation, high efficiency and long-life advantage, therefore is generally taken seriously in recent years, gradually Replace the status of traditional lighting light fixture.But the luminous of Conventional LED light sources has directive property, unlike conventional lamp can make big wide The illumination of angular region, therefore, is applied to conventional lamp by LED, depending on the species of light fixture, and has corresponding challenge.

In recent years, one kind can allow the similar conventional tungsten silk bulb lamp of LED/light source to light, and reach what 360 ° of full angles were illuminated LED filament is increasingly paid attention to by industry.The making of this LED filament be by plurality of LEDs chip concatenation be fixed on it is a piece of narrow and small On elongated glass substrate, then to wrap up whole branch glass substrate mixed with the silica gel of fluorescent material, then carry out electrical connection can be complete Into.However, such a filament is in the vertical rod in being soldered to bulb, it is necessary to respectively weld one by one, manufacture craft is cumbersome.And And, due to using spot welding mode, performance and size to material require more strict, and there is the risk of rosin joint.

In addition, also a kind of flexible LED lamp silk, it is similar with above-mentioned filamentray structure, and the part of glass substrate uses tool instead There is flexible base plate (hereinafter referred to as FPC) so that filament there can be certain bending degree.However, utilizing the soft lamp made by FPC Silk has such as FPC thermal coefficient of expansions different from the silica gel for coating filament, permanent using the displacement for causing LED chip or even de- Glue；The shortcomings of either FPC is unfavorable for the flexible change of process conditions.

A kind of disclosed filament (Chinese Patent Application No. of applicant:201610687565.0), wherein disclosing one kind Filamentray structure without bearing substrate, with have pliability and have wavelength convert effect fluorescence packaging body, substitution tradition must first by Chip is installed on substrate, then is coated the labyrinth of fluorescent material/encapsulation.

Present application is that above-mentioned application case is further optimized, further to correspond to a variety of process requirements.

The content of the invention

Present invention aims at a kind of improved filament lamp is provided, make simple to reach, rising angle is big and other effects.

To achieve the above objectives, the present invention provides a kind of LEDbulb lamp, including lamp housing the lamp holder with being connected the lamp housing, The LEDbulb lamp also includes：

Stem, the stem includes relative stem bottom and at the top of stem, the stem bottom connects the lamp holder；

At least two conducting brackets, connect the stem；

LED filament, including filament body and two filament electrodes, two filament electrode are located at the relative of the filament body Two ends, two filament electrode connects two conducting bracket respectively, and the filament body is around the stem；And

An at least cantilever, one end connects the stem and the other end connects the filament body；

Wherein, in the short transverse of the LEDbulb lamp, it is by the lamp housing bottom to distance between the lamp housing top With 0 to the first difference in height between 1/10H between H, two filament electrode, and filament body bending rises and falls and had Peak and minimum point, have the second difference in height between the peak and minimum point, first difference in height is less than described the Two differences in height, the scope of second difference in height is 2/10 between 4/10H.

Further, the filament body is more than 270 degree around the angle of the stem.

Further, in the short transverse, the peak and minimum point of the filament body are all fallen within from lamp 1/3 is started between 4/5H in shell bottom.

Further, the quantity of the filament body is one, and in the LEDbulb lamp on perspective plane, described two lead Electric support is overlapping, and the filament body crosses over the both sides of the stem, and two conducting bracket is located at the stem wherein Side.

Further, the filament body includes the LED chip that multiple formal dress configured and be in the linear alignment, the filament sheet Body corresponds to the multiple LED chip and defines relative main light-emitting surface and secondary light-emitting area, and the either segment of the main light-emitting surface exists Unspecified angle is towards the lamp housing or the lamp holder.

Further, any point of the LED filament is X, Y, Z and meets a curve side in the position of x, y, z coordinate system Formula, the origin of the x, y, z coordinate system is located at the top of the stem, and the x-y plane of the x, y, z coordinate system is located at the core Column top and the vertical short transverse, the z-axis and the stem of the x, y, z coordinate system are coaxial, two filament electrode pair Claim the both sides for being distributed in the y-axis of the x, y, z coordinate system, the fitting equation is：

X=m1*cos (t*360),

Y=m2*sin (t*360),

Z=n*cos (t*360*k),

Wherein, t is the variable between 0 to 1, and the LED filament is changed in the x, y and z directions according to t；Work as X=0, Shu Y Shu maximums are m2, Shu Z Shu maximums=n；Work as Y=0, Shu X Shu maximums are m1, and Shu Z Shu maximums are n；Work as Z=0, Shu X Shu maximums are M1, Shu Y Shu maximums are m2, wherein, m1 represents X-direction length, and m2 represents Y-direction length, and n represents the peak on z directions Apart from the height of the x-y plane, K represents the number of the peak position.

Further, m1 is more than or equal to 24 millimeters and less than or equal to 27 millimeters, and m2 is more than or equal to 24 millimeters and small In or equal to 27 millimeters, n is more than 0 and less than or equal to 14 millimeters, and k is more than or equal to 2 and less than or equal to 8.

Further, the filament body includes light conversion layer and multiple LED chips, and the light conversion layer is coated on described On at least both sides of multiple LED chips and two filament electrode, the light conversion layer exposes the one of two filament electrode Part, the light conversion layer includes top layer and basic unit, and the top layer is located at the multiple LED chip and institute respectively with the basic unit At least both sides of two filament electrodes are stated, there is closed structure between the top layer and the basic unit.

Further, the closed structure includes mat surface, and the mat surface is respectively formed in the top layer and the base On contact surface between layer.

Further, the closed structure includes wavy interface, and the wavy interface is respectively formed in On contact surface between the top layer and the basic unit.

Beneficial effect：By the LEDbulb lamp of the present invention, not only illumination effect is good, and makes simple, and rising angle is big.

Brief description of the drawings

Figure 1A is shown using the ball bulb lamp structure figure made by the LED filament of the present invention；

Figure 1B shows the structure chart that lamp housing radiator is connected in Figure 1A；

Fig. 1 C are the schematic perspective view of one embodiment of the invention LEDbulb lamp, wherein some filaments are assembled in modularity；

Fig. 2 shows the amplification assumption diagram of a-quadrant in Figure 1B；

Fig. 3 is the schematic diagram after the filament assembly expansion of an embodiment shown in Fig. 1 C；

Fig. 4 is the expanded schematic diagram of another embodiment of filament assembly；

Fig. 5 is the expanded schematic diagram of another embodiment of filament assembly；

Fig. 6 is the shaping tool schematic perspective view applied to the present invention；

Fig. 7 is the view that filament assembly is molded on shaping tool；

Fig. 8 is another embodiment schematic diagram of filament assembly, wherein not equidistant between filament；

Fig. 9 is the schematic diagram of single led filament main light-emitting surface and time light-emitting area；

Figure 10 illustrates for solid of the positive and negative electrode wire in filament assembly lower end in the embodiment of LEDbulb lamp one of the present invention Figure；

Figure 11 for the present invention another embodiment of LEDbulb lamp in positive and negative electrode filament assembly upper end schematic perspective view；

Figure 12 is the sectional view of LEDbulb lamp of the invention shown in Fig. 1 C along X-X directions, wherein auxiliary stand and filament group Part is connect with hook mode group；

Figure 13 is LED filament component described in Figure 12 and partial enlarged drawing of the auxiliary stand with unification embodiment；

Figure 14 is the positive expanded schematic diagram of the embodiment of filament support one of the present invention；

Figure 15 is the back side expanded schematic diagram of one embodiment when filament support shown in Figure 14 is electric conductor；

Figure 16 is the back side expanded schematic diagram of one embodiment when filament support shown in Figure 14 is electric conductor；

Figure 17 is the expanded schematic diagram of the embodiment of filament support one of the present invention；

Figure 18 is the circuit diagram of filament support shown in Figure 17；

During Figure 19 is one embodiment of the invention, the filament lamp stereogram of this case filament support is equiped with；

During Figure 20 is one embodiment of the invention, the filament lamp stereogram of this case filament support is equiped with；

Figure 21 is the three-dimensional partial cutaway schematic of LED filament first embodiment of the present invention；

Figure 22 is the partial cutaway schematic of 2-2 positions in Figure 21；

Figure 23,24 for LED filament first embodiment of the present invention electrode configuration corresponding with LED chip other embodiment Schematic diagram；

Figure 25 is the three-dimensional partial cutaway schematic of LED filament second embodiment of the present invention；

Figure 26 is the partial cutaway schematic of 5-5 positions in Figure 25；

Figure 27 A are the circuit film first embodiment schematic diagram not cut of LED filament second embodiment of the present invention；

Figure 27 B are covered on the schematic diagram of LED chip for the circuit film first embodiment not cut of LED filament of the present invention；

Figure 28 A are the circuit film second embodiment schematic diagram not cut of LED filament of the present invention；

Figure 28 B are covered on the schematic diagram of LED chip for the circuit film second embodiment not cut of LED filament of the present invention；

Figure 29 A are the circuit film 3rd embodiment schematic diagram not cut of LED filament of the present invention；

Figure 29 B are covered on the schematic diagram of LED chip for the circuit film 3rd embodiment not cut of LED filament of the present invention；

Figure 30 A to 30E are the preparation method first embodiment schematic diagram of LED filament of the present invention；

Figure 31 is the schematic diagram of the preparation method second embodiment of LED filament of the present invention；

Figure 32 A to 32E are the schematic diagram of the preparation method 3rd embodiment of LED filament of the present invention；

Figure 33 is the structural representation of the first embodiment of LEDbulb lamp of the present invention；

Figure 34 is the structural representation of the second embodiment of LEDbulb lamp of the present invention；

Figure 35 A are the schematic perspective view of the 3rd embodiment of LEDbulb lamp of the present invention；

Figure 35 B to illustrate the invention the embodiment of bulb lamp filament shape one vertical view projection figure；

Figure 36 A are the section close-up schematic view of dashed circle part in Figure 35 A；

Figure 36 B-36D are the schematic diagram for the various embodiments in electrode part for showing filament of the present invention；

Figure 36 E are the schematic perspective view of the fourth embodiment of LEDbulb lamp of the present invention；Figure 36 F and 36G be its side just View and the side view of side；Figure 36 H are its top view；

Figure 36 I-36K for three kinds of lamp housing of the present invention not be the same as Examples partial cross section's enlarged diagram；

Figure 36 L are the schematic perspective view of the 5th embodiment of LEDbulb lamp of the present invention；

Figure 36 M are the schematic perspective view of an embodiment of LED shell of the present invention；

Figure 36 N are the schematic perspective view of the sixth embodiment of LEDbulb lamp of the present invention；Figure 37 is LEDbulb lamp of the present invention The 7th embodiment schematic perspective view；

Figure 38 is the schematic top plan view of the circuit board of the drive circuit of the embodiment of LEDbulb lamp the 7th of the present invention；

The schematic cross-section of Figure 39 A-39E, 40-46 respectively for filament layer structure of the present invention not be the same as Example；Wherein Figure 39 B For the schematic cross-section for the filament layer structure for increasing bond strength；Figure 39 C-39E are to show to increase the filament layer of bond strength One embodiment of shape structure, wherein Figure 39 C are the stereogram for only showing basic unit, and Figure 39 D are to show top layer and the stereogram of basic unit, Figure 39 E are the sectional view of E1-E2 lines in Figure 39 D；

Figure 40 shows an embodiment schematic cross-section of LED filament layer structure, and wherein basic unit is located in two top layers Between；

Figure 41 shows another embodiment schematic cross-section of LED filament layer structure, and wherein basic unit is divided into fluorescent powder membrane And hyaline layer；

Figure 42 shows another embodiment schematic cross-section of this case filament layer structure, and the basic unit of wherein filament only has Glue；

Figure 43 shows the layer structure schematic cross-section of filament in the embodiment of this case one, wherein basic unit be divided into hard area section and Soft zone section；

Figure 44 shows each face of another embodiment schematic cross-section, wherein LED chip of this case filament layer structure Directly contacted with top layer, and basic unit does not contact with LED chip；

Figure 45 shows another embodiment schematic cross-section of filament layer structure, and wherein top layer and basic unit is comprising glimmering The double-decker of light arogel layer and glue-line；

Figure 46 shows another embodiment schematic cross-section of filament layer structure, and there is height to rise for the wherein basic unit of filament The wavy surface of volt；

Figure 47 A are the schematic perspective view of the embodiment of filament layer structure one of the present invention；

Figure 47 B are the sectional view of the embodiment of layer structure one of the present invention；

The sectional views of Figure 48-50 respectively for filament packaging structure of the present invention not be the same as Example；

Figure 51 A-51D are the filament schematic perspective view for being provided with the embodiment of filament assistant strip first to fourth of the present invention；

Schematic diagrames of Figure 51 E-51F for implementation filament assistant strip of the present invention in bulb lamp；

Figure 52 is the schematic cross-section of an embodiment of LED filament of the present invention；

Figure 53 is the schematic cross-section of another embodiment of LED filament of the present invention；

Figure 54 A to 54F are the schematic diagram of the line array of the LED chip of multiple embodiments of the invention；

Figure 55 A to 55C are respectively the transverse sectional view of the LED filament of multiple embodiments of the invention.

Embodiment

It is understandable to enable the above objects, features and advantages of the present invention to become apparent, below in conjunction with the accompanying drawings with specific real Applying example, embodiments of the present invention are described in detail.

Traditional bulb lamp is in manufacturing process, and in order to avoid tungsten filament, in combustion synthesis in air, oxidation scission fails, therefore The glass structure thing that a loudspeaker stem can be designed is enclosed at the opening of glass lamp housing and is sintered sealing, and loudspeaker core is then passed through again Air inside lamp housing is substituted into nitrogen by the port connection vavuum pump of post, it is to avoid the tungsten filament combustion oxidation inside lamp housing, again finally The port of loudspeaker stem is sintered into sealing.In addition, substituting while also aerial water can will be spread inside lamp housing by gas Mist is removed in the lump.Further, Figure 1A is refer to, Figure 1A show the LEDbulb lamp 1 using LED filament 11, LEDbulb lamp 1 Include lamp housing 12, some LED filaments 11, auxiliary stand 13 is to connect and support LED filament 11, metal mandril 14 to be used to Substitute the gas in LEDbulb lamp 1 and the function of heat conduction, the connection metal mandril 14 of radiator 157 and by metal mandril 14 are provided Transmitted be thermally conducted to outside LEDbulb lamp, plastic lamp base 17, lamp holder 16 and in lamp holder 16 drive circuit (figure Do not show).In order to which the light efficiency for improving LEDbulb lamp 1 is showed, lamp housing 12, which must possess, preferable transparency and heat-conducting effect, because This, the present embodiment is preferred using glass lamp housing, possesses high printing opacity in addition and the plastic lamp housing of high heat conduction effect also may be selected, and is examined Consider demand of the market segment to low colour temperature bulb lamp, can moderately material of the doping with golden yellow in lamp housing, or in lamp housing The golden yellow film of inner surface plating last layer, the blue light that the micro absorption part LED chip of appropriateness is sent, to downgrade LED ball Steep the colour temperature performance of lamp 1.Or lamp housing also can be the lamp housing of cloudy surface or minute surface.As it was previously stated, vavuum pump passes through metal mandril 14 can substitute the air inside lamp housing the ratio mixing for helping nitrogen or nitrogen and helium appropriateness, to improve gas in lamp housing Thermal conductivity, while also been removed the water smoke hidden in air.In addition, lacking the heat conduction auxiliary of metallic support, LED filament 11 The heat of generation is difficult to be directly transferred to outside lamp housing, but passes through metal mandril 14 to absorb the heat that LED filament 11 is radiated Source, it is possible to conduct the heat to radiator 157 to discharge outside lamp housing rapidly.If in addition, in view of improving asking for light efficiency performance Topic, can also use the glass stem of traditional not extinction, and have the stone of high heat conduction characteristic again in its surface plating last layer light-permeable Black alkene can improved heat radiation problem.Radiator 157 is slightly centered around the openend of lamp housing 12 in hollow cylinder, and inside can be placed The metal with good heat conductive effect, ceramics or high heat conduction plastics are can select in the drive circuit of LED filament 11, material, are elected to During with metal material (such as Al aluminium) come as radiator 157, because the thermal conduction characteristic of metal material is very well, but its hot spoke Characteristic is penetrated very poor (such as the radiance of aluminium only about 0.1), so surface needs coating to strengthen thermal radiation effect, such as aluminum oxide (radiance about 0.4) just has preferable thermal radiation effect.Radiator 157 is preferably provided with a lid in the open end close to lamp housing 12 Plate 1501, its surface can coat the reflecting coating of aluminum oxide or white, and one can increase the heat-conducting area of radiator 157 and improvement Thermal radiation property, fully absorb the heat of the generation of LED filament 11 and conduct extraneous to spherical shell, and two can send LED filament 11 Light reflects outside lamp housing to improve light efficiency.Passed through in addition, being provided with cover plate 1501 for metal mandril 14 with auxiliary stand 13 Hole.Drive circuit can pass through auxiliary stand 13 and some LED filaments 11 and be electrically connected with there is provided power supply to light LED LED chip on filament 11, the input lead of the drive circuit other end is then done with the lamp holder 17 of the tail end of LEDbulb lamp 1 electrically to be connected Connect.

As it was previously stated, traditional bulb lamp is in manufacturing process, it can be enclosed at the opening of glass lamp housing and added with loudspeaker stem To sinter sealing, because both materials are all glass, therefore it can mutually be melted after high temperature sintering and reach sealed purpose.But Change in embodiment using after metal mandril 14, the sintering sealing effectiveness of metal and glass can not just be reached as glass horn stem Effect, therefore the present embodiment for connection metal mandril 14 the structure of radiator 157 adjusted, to reach sealing bulb lamp The purpose of lamp housing.As shown in Figure 1B, the external form of radiator 157 is covered in the openend of lamp housing 12, its edge just as a bottle cap It is connected with kink 1572 with the openend glass of lamp housing 12, please also refer to Fig. 2, Fig. 2 is the amplification knot of a-quadrant in Figure 1B There is the depressed part 1573 of indent, the rough openend glass than lamp housing 12 of its width in the middle of composition, the port of the kink 1572 Glass thickness is a little big, therefore the whole openend of lamp housing 12 can be enveloped by the complete covering of depressed part 1573.Depressed part 1573 It is interior moderately to insert the good fluid sealant of sealing, allow the connection of radiator 157 and lamp housing 12 more to consolidate.Radiator 157 Plastic lamp base 17 can be set up again between lamp holder 16, with safety when attendant's device or removal bulb lamp.

Upright symmetrical pattern arrangement can be presented in the arrangement mode of some LED filaments 11 around metal mandril 14, so And in view of all-round optical illumination demand, filament preferably using tiltedly put and non-parallel to metal mandril 14 by the way of it is preferable.LED filament LED chip in 11 moderately can be driven from jumbo chip with low current it is shinny, to reach the purpose of relatively low heating, Allow the light efficiency of LED filament 11 to exceed 180lm/W, can so allow the whole lamp brightness of LEDbulb lamp 1 to surmount 700lm easily.This Outside, for whole bulb lamp, the ornaments optimum position of lamp source is the ball immediate vicinity of lamp housing, and long filament can not All ornaments can reach more preferable all-round light effect in this region, therefore from several more shorter LED filaments, at this The length of LED chip is ideal with below 20mm in embodiment, and 15~10mm is optimal selection, but it is also possible to used The LED chip of 10x20mm, 14x34mm, 14x28mm equidimension.In addition, lamp source is dispersed into a plurality of short filament can allow thermal source It is scattered, it can not only increase the overall radiating effect of LEDbulb lamp, at the position of the top of lamp housing 12, light rate of change 50% can be far below, i.e. the brightness of lamp housing top is not less than the 50% of the most bright position brightness of LEDbulb lamp.

Foregoing metal mandril can also be changed to ceramic stem in the present embodiment into, the preferred material of ceramic material is oxygen Change aluminium or aluminium nitride, its thermal radiation absorption rate is high more than glass, therefore can more effectively absorb the heat that LED filament is sent, Outside heat derives LEDbulb lamp.In other embodiments, the material of radiator (together with the screw socket of LEDbulb lamp) also may be used From the ceramic material with good heat conductive effect, it is possible to integrally formed with ceramic stem, the spiral shell of LEDbulb lamp can be removed from Mouthful need to be glued with radiator and increase the thermal resistance of LED filament heat dissipation path, with more preferable radiating effect.

In the present embodiment, the luminous efficiency of LEDbulb lamp is, for example, 30~400lm/W, preferably 50~250lm/ W.The whole lamp brightness of LEDbulb lamp is for example up to 800lm.The colour temperature of LEDbulb lamp is 2200K~6500K, preferably 2500K~4000K.In addition, the shape of gel coated LED chip can be square or rectangular, its vertical and horizontal ratio Such as it is 1:1~1:100.

The LED filament 11 of LEDbulb lamp shown in Figure 1A and Figure 1B, processing when generally using a plurality of filament 11 respectively with The auxiliary stand 13 is welded to each other, and welding procedure is relatively complicated, and due to using spot welding mode, to the performance of material Require more strict with size, and there is the risk of rosin joint.In order to simplify technique, the process time of LED filament is saved, simultaneously In order to improve the dependence of the reliability and reduction of welding to material, the present invention provides another LEDbulb lamp 5 as shown in Figure 1 C, LEDbulb lamp 5 includes：Lamp housing 52, LED filament component 51, auxiliary stand 53, metal mandril 54, lamp holder 57, and located at lamp holder Drive circuit (not shown) in 57.Wherein, auxiliary stand 53 is to connect and support LED filament component 51.Metal mandril 54 To substitute the gas in LEDbulb lamp 5 and provide the function of heat conduction.Vertical rod 541 extends from metal mandril 54；And auxiliary stand 53 extend from vertical rod 541.

Fig. 3 is the expanded schematic diagram of the filament assembly 51 of LEDbulb lamp 5 shown in Fig. 1 C.The LED filament component 51 is one Body formed module, LED filament component 51 includes a plurality of LED filament 511, and the structure of LED filament 511 can be soft or hard LED Filament.A plurality of LED filament 511 is integrally connected by the first connecting portion 512 and second connecting portion 513 positioned at its two ends.Adding During work, a plurality of LED filament 511 and first connecting portion 512, second connecting portion 513 can in being combined as a whole in plane, without Must again individually every LED filament 511 respectively with the spot-welded of auxiliary stand 53, not only technique is simple, has saved process time, And in the absence of rosin joint the problem of.

In above-described embodiment, first connecting portion 512 and second connecting portion 513 are all the connection shape of multiple T fonts.Its The electrode 511A and 511B of the vertical portion formation LED filament 511 of middle T words.Wherein, electrode 511A first connecting portion is included 512 and the second connecting portion 512 including electrode 511B can be one of the forming.In another embodiment, electrode 511A with 511B can be initially formed in the two ends of LED filament 511, then is respectively connected with first connecting portion 512, second connecting portion 513.Herein So-called connection can be the modes such as welding, male and female shape cooperation, riveting.

The shape of LED filament component 51 can be the sector shown in Fig. 3, or before bending shown in Fig. 4 substantially Rectangular configuration.During using fan-shaped structure, the length of the first connecting elements 320 is less than the length of the second connecting elements 322, i.e., by The radius for the near circular that first connecting elements 320 is surrounded is less than the circular radius that the second connecting elements 322 is surrounded.So Design LED filament component 51 can be more stable when being hung over using hook form on auxiliary stand 53.When using the rectangle shown in Fig. 4 During structure, LED filament component 61 includes a plurality of LED filament 611 and is connected to first connection at a plurality of two ends of LED filament 611 The connecting elements 613 of component 612 and second, the length of the first connecting elements 612 is equal to the length of the second connecting elements 613.So The LED filament component 61 that setting is formed can be more regular and error is smaller.Fig. 3 and Fig. 4 two kinds of LED filament components 51,61 have There is substantially equidistantly arrangement between a common ground, i.e., a plurality of LED filament, be so more beneficial for uniform light extraction.

Fig. 8 shown when being the situation that does not arrange equidistantly between a plurality of LED filament in another embodiment, wherein LED Spacing between silk 5111 and LED filament 5112 is significantly greater than the spacing between other LED filaments.When needs are in emphasis direction hair In the case of light, this constructive embodiment can be used, it usually needs it is intensive that the luminous local LED filament of emphasis can be arranged A bit, secondary light emission direction can be selected the sparse arranged distribution of multiple LED filaments.Only with LED filament in certain Fig. 8 Component be fan-shaped as an example, in other embodiments LED filament equidistantly arrangement not may be adapted to LED filament component is square The situation of the regular figures such as shape or other irregular figures.

LED filament component 71 can also embodiment as shown in Figure 5, the reality shown in the present embodiment LED filament component 71 and Fig. 3 Apply a difference to be, LED filament component 71 includes two LED filament sub-component 71A, 71B, two filament sub-component 71A, 71B is symmetrical set, and is so easy to manufacture, improves processing efficiency, and overall structure is more attractive, certain two filament sub-components 71A, 71B can also be unsymmetric structure.Each filament sub-component 71A, 71B include at least two LED filaments 711, preferably For three.The two ends of LED filament 711 are connected to the first connecting elements 712 and the second connecting elements 713.During actual processing, often Individual filament sub-component 71A, 71B are respectively processed by integral molding techniques.It is so designed that not only to have and is easily worked, work The simple advantage of skill, and user can arbitrarily remove one of filament sub-component according to actual needs, and only leave one Filament sub-component.

The usual LED filament component forms even shape after shaping, needs to bend to specifically before lamp housing is loaded Shape, in order to which the LED filament component is shaped into predetermined shape and structure, as shown in fig. 6, the present invention also provides a kind of filament Shaping tool 109, filament shaping tool 109 includes filament shaping portion 1011, filament shaping portion 1011 can be cylindric or Irregular roundness taper.In this example example, filament shaping portion 1011 is the cylindrical-shaped structure of " big " under upper " small ", filament shaping portion 1011 top is formed with the first limited cover 1021, the other end (this of first limited cover 1021 relative to filament shaping portion 1011 It is lower end in embodiment) the second limited cover 1031 is formed with, the first limited cover 1021 and the second limited cover 1031 are used for limiting LED The first connecting elements 512 and the second connecting elements 513 of filament assembly, LED filament 511 are then covered on filament shaping portion 1011 simultaneously By pressed by external force along the surface curvature in filament shaping portion 1011, so as to form curved surface.As shown in fig. 7, being to have pressed View of the LED filament component 51 before filament shaping tool 109 is left after molded.As seen from Figure 6, first is spacing The diameter of lid 1021 is less than the diameter of the second limited cover 1031, and the diameter of the first limited cover 1021 and the second limited cover 1031 can divide Not Lve great Yu connected filament shaping portion 101 diameter.Such structure can cause limit effect more preferable.

, can be with as shown in figure 9, LED filament 511 be designed in order to adjust the illumination effect of LEDbulb lamp of the present invention Main light-emitting surface 511A and time light-emitting area 511B, LED filament 511 is provided with through the saturating of main light-emitting surface 511A and time light-emitting area 511B Unthreaded hole 5113.As shown in Fig. 9 (a), the LED chip 111 at some intervals is placed with main light-emitting surface 511A, and in Fig. 9 (b), LED chip 111 is then not provided with secondary light-emitting area 511B.Therefore main light-emitting surface 511A luminosity compares time light-emitting area 511B It is eager to excel a lot.Main light-emitting surface 511A can all be set (towards the side of stem 54), also may be used according to actual needs by we inwardly So that main light-emitting surface 511A all is set into (the dorsad side of stem 54) outwardly, or even part main light-emitting surface 511A is set inwardly, portion Point main light-emitting surface 511A is set outwardly.It is designed to freely adjust luminosity effect by these.

The positive and negative electrode wire (non-label) of LEDbulb lamp 1 shown in Figure 1A is connected to the upper of the auxiliary stand 13 End and lower end, for convenience LED filament and positive and negative electrode wire weld, the present invention also also can be as in Figure 10, positive wire 1a and negative Polar conductor 1b is connected to the lower end of LED filament component 51, the i.e. one end of the second connecting elements 513.Due to positive wire 1a and Cathode conductor 1b length has shorter length so that the wire is not easy to rock in welding, lifts soldering reliability. Alternatively, the second connecting elements 513 of LED filament component 51 also can be with stem or other supports extended from the inside of bulb Body is connected, and can now be configured flexibly positive wire 1a and cathode conductor 1b, as long as reaching electrical connection lamp holder and LED filament The purpose of component 51.

Certainly, in other embodiments can also be as shown in figure 11, positive wire 2a and cathode conductor 2b are respectively welded In the upper end of LED filament component 51, i.e. the first connecting elements 512.The advantage of this design is, passes through the positive wire 2a of lengthening Lamp holder, which is rocked, when can prevent from welding with cathode conductor 2b causes wire-break.

Figure 12 is the sectional view of LEDbulb lamp of the invention shown in Fig. 1 C along X-X directions, and Figure 13 is LED filament in Figure 12 Component and partial enlarged drawing of the auxiliary stand with unification embodiment.In embodiment, auxiliary stand 53 can (i.e. metal be led for metal Electric support), and auxiliary stand 53 connects with LED filament component 51 with hook mode group；Specifically, due to auxiliary described in existing product Help support generally to use spot welding mode with each LED filament, not only efficiency is low, and be easily caused rosin joint, influence the use of lamp Performance.To solve in these problems, the embodiment of the present invention, auxiliary stand 53 has hook 531, and LED filament component 51 is by upper First connecting elements 512 at end is hung on the hook 531 of auxiliary stand 53.To realize the connection of the two, so as to effectively solve Spot welding efficiency is low and the problem of connection reliability.

In the embodiment shown in Figure 13, auxiliary stand 53 is metal, and separated in auxiliary stand 53 and form breach 532, (conductive auxiliary stand of the prior art is conducting electric current structure, easy galvano-cautery) is so that auxiliary stand 53 is not By electric current, only it play fixed supporting role, to prevent auxiliary stand 53 because of the galvano-cautery risk of long-term use.

In addition, auxiliary stand 53 can be metal, plastics, glass or ceramic material or its combination.In an embodiment, vertical rod Between 541 and the first connecting elements 512 of filament assembly and it is not provided with auxiliary stand 53, and the top of vertical rod 541 has water The hook-shaped of extension is put down, to be combined with the first connecting elements 531.Or, the top of vertical rod 541 and the first connecting elements 541 it Between can have each other structure that male and female connects assembled with profit.

In the embodiment of above section, the first connecting elements 512 and the second connecting elements 513 are connected by LED filament 511 Connect.But the first connecting elements also can be initially i.e. integrated with the second connecting elements, such as shown in Figure 14, LED filament component It may include support 324 among 30d, multiple supports 324 are connected between the first connecting elements 320 and the second connecting elements 322, Multiple supports 324 are located at the lower section of multiple filaments 300 in Figure 15.In an embodiment, the first connecting elements 320, support 324th, the insulator that the second connecting structure 322 can be integrated, and the electricity on the first connecting elements 320, the second connecting elements 322 Pole is constructed and electrode 310, electrode 312 can form (such as printing) with known circuit, or is formed with metal implantation, And combined with the first connecting elements 320, support 324, the second connecting elements 32.

Among an embodiment, the first connecting elements 320, support 324, the second connecting structure 322 shown in Figure 14 can be The electric conductor of integration.In under this situation, front elevation can still be illustrated with Figure 14, and Figure 15 is then the back view of LED filament component. Among Figure 14, multiple filaments 300 comprising electrode 310,312 are formed at the top of support 324；Now in order to avoid short circuit, such as Shown in Figure 15, be provided with insulating segment 324i among support 324, insulating segment 324i can using extra quality shaping, metal embedment, metal- The rack integral of the heterogeneous jointing-and-forming of plastics or other similar fashions and other parts.In other embodiment, insulating segment 324i also engages the holder part of upper and lower using modes such as solids.In an embodiment, when the first connecting elements 320, When support 324, the second connecting structure 322 are electric conductor, the back side of LED filament component also can be as shown in figure 16, and support 324 breaks Open as upper bracket 324t and lower carriage 324b, to avoid short circuit.

Also can be series connection using the electric connection mode of the LED filament of LED filament component.Filament assembly 30g among Figure 17 It is similar with Fig. 3 filament assembly 51, but filament assembly 51 is sector, filament assembly 30g is rectangle.Filament assembly 30g first The connecting elements 322 of connecting elements 320 and second is presented linearly, and has insulation division 320i and insulation division 322i respectively. The insulation division 322i of the insulation division 320i of first connecting elements 320 and the second connecting elements 322 offsets one from another without standing facing each other.For example During such as the first connecting elements 320 between the first each two electrode 310 among Figure 17 as a linkage section, then the by left First, the three, the 5th linkage sections are conduction, and remaining is insulation division 322i.And now first, the 3rd, the of the second connecting elements 322 Five linkage sections be insulation division 322i, remaining be conductive.So so that electric current is turned on a direction, and between multiple filaments Form series connection.As shown in figure 18, the positive pole of filament assembly is located at below right-hand member the circuit formed, and negative pole is located at below left end. Positive charge flows through each filament from the electrode 312 below left end and is made up of filament electrode and first/second connecting elements Conductive channel arrived later high order end filament negative pole.Figure 18 filament series connection except with connecting elements set insulation division or Be the mode of disconnecting circuit beyond being formed, with to filament the mode of diode can also be set to be formed, with limit electric current with Single direction circulates.

Figure 19 and Figure 20 are shown after using Fig. 3 filament assembly formation light fixture, and structure is connected using in first/second Part makes opening or/and the height configuration of wire avoids short circuit to adjust.In Figure 19 and Figure 20, vertical rod 19a can be for insulation simultaneously Auxiliary stand 315 is connected, filament assembly is placed in auxiliary stand 315.First connecting elements has two openings respectively in front and rear, makes Obtain the first connecting elements and be divided into Part I 320l and Part II 320r.Second connecting elements 322 has an opening. Wire 14a, the 14b extended from stem up extends the Part I 320l for being respectively connected to the first connecting elements and Two part 320r.In Figure 20, the first connecting elements 320 has an opening, and the second connecting elements has two openings so that second Connecting elements is divided into Part I 322l and Part II 322r.The wire 14a and 14b extended from stem is respectively It is connected with the Part I 322l and Part II 322r of the second connecting elements.

Then the LED filament that can be applied in above-mentioned filament assembly is illustrated.Figure 21 to 22, Figure 21 be please also refer to for this hair The three-dimensional partial cutaway schematic of bright LED filament first embodiment, Figure 22 is the partial cutaway schematic of 2-2 positions in Figure 21. According to first embodiment, LED filament 100 includes multiple electrodes 110,112 of LED chip 102,104, at least two and light turns The energy of fluorescent material 124 changed in layer 120 (in a particular embodiment, light conversion layer can be referred to as glue-line or layer of silica gel), light conversion layer 120 Absorb some radiation (such as light) and emit beam.

LED filament 100 is after its electrode 110,112 is powered (voltage source or current source), you can emit beam, with Exemplified by the present embodiment, its light sent can be essentially 360 degree of the light close to spot light；By the embodiment of the present invention LED filament is applied to bulb lamp (such as, but not limited to Figure 12 A, 12B), then can send all-round light (omni-directional Light), it is detailed later.

It can be seen from figure 21 that the cross sectional shape of the LED filament 100 of the present invention is rectangle, but LED filament 100 Cross sectional shape is not limited thereto, and can also be triangle, circle, ellipse, polygon either rhombus, or even can also be Using square, but corner can use chamfering or fillet.

LED chip 102,104 can be single LEDs chip or two LEDs chips, naturally it is also possible to be to include Plurality of LEDs chip, i.e., equal to or more than three LEDs chips.The shape of LED chip can be, but not limited to long strip type, long strip type Chip can have less electrode, reduce the chance of masking LED emitted lights.In addition, on the surface of LED chip 102,104 The conductive transparent indium-tin-oxide of last layer (Indium Tim Oxide, ITO) can be plated, the indium tin oxide layer contributes to The uniform diffusion profile of electric current and improving luminous efficiency of LED chip.Specifically, LED chip 102,104 Aspect Ratios can be set in 2:1 to 10:1, such as, but not limited to 14x28 or 10x20.In addition, LED chip 102,104 can also use high-power LED core Piece, is then operated with low current, although such LED chip 102,104 is maintained under the situation of low current density, can still be protected There is enough brightness, and LED chip will not produce substantial amounts of thermal source, make overall luminous efficiency good.

LED chip 102,104 itself can use sapphire substrate, or light-permeable transparency carrier, consequently, it is possible to LED The substrate of of chip 102,104 itself will not cover the light that LED chip 102,104 is sent, that is to say, that LED chip 102, 104 itself can emit beam from its side face.

It is electrically connected with each other between described two or multiple LED chips 102,104, by taking this embodiment as an example, each LED chip 102nd, 104 be that series system is electrically connected with, but electric connection mode is not limited thereto, also can be using series system after first parallel connection It is electrically connected with, such as, but not limited to after the first parallel connection of each two LED chip 102,104, the chip 102,104 after each two parallel connections is again Series connection.

Electrode 110,112 is configured corresponding to LED chip 102,104, and is electrically connected with LED chip 102,104.According to this reality Example is applied, electrode 110,112 is the two ends for being configured at the LED chip 102,104 after series connection, a part for each electrode 110,112 Expose to outside light conversion layer 120.The mode that electrode 110,112 corresponds to the configuration of LED chip 102,104 is not limited thereto, Refer to Figure 23,24, Figure 23,24 for LED filament first embodiment of the present invention electrode it is corresponding with LED chip configure other Embodiment schematic diagram.LED chip 102,104 is can see that in Figure 23 for be configured to a reverse U shape and adjacent LED chip 102, 104 using series systems be electrically connected with, electrode 110,112 be configured at U-shaped two ends and be each respectively and electrically connected to adjacent LED chip 102,104.Figure 24 can be seen that LED chip 102,104 is substantially arranged in two parallel lines, each tandem respectively Be electrically connected with, and electrode 110,112 be configured at two parallel line two ends, and electrically connect with adjacent LED chip 102,104 Connect, formed after first going here and there and be electrically connected with.Be in embodiment in Figure 24 by taking two electrodes 110,112 as an example, but not as Limit, also can be using 3 or 4 electrodes 110,112, such as by the electrode 110,112 of one of them in figure with two single electricity Pole replace, two sub-electrodes each be respectively positive source, and retain electrode 110,112 be common ground end.Or will Two electrodes 110,112 are replaced with two sub-electrodes in figure, to be applicable different applications.

Please be arranged in pairs or groups Figure 33, and electrode 110,112 can have 111,113 (seeing Figure 21) of perforation in its exposed area, be used to When being assembled in LEDbulb lamp 10a there is provided conducting bracket 14a, 14b electric connection, it is detailed later.

Referring again to Figure 21 to 22, according to the present embodiment, foregoing electric connection is to be electrically connected with phase by wire 140 Adjacent LED chip 102,104 and electrode 110,112, wire 140 can be gold thread, the routing that wire 140 can be encapsulated using LED Gold thread is connected adjacent LED chip 102,104 and electrode 110,112 by processing procedure.The processing procedure of this routing can use Q-type side Formula carries out routing, can be seen that from Figure 22, and the profile of the wire 140 is in M fonts, and this M fonts wire 140 causes the wire 140 are in non-tight state there is provided buffering effect, and when LED filament 100 is bent, wire 140 will not be broken.Outside wire 140 Shape is also not limited to M fonts, can slow down the shape of tight state using any, such as S-shaped.M fonts herein are simultaneously not used to The shape for limiting wire 140 is in M fonts, but to represent that any shape of buffering effect can be provided, for example, when wire 140 Length be longer than the length of the routing arched upward naturally between two adjacent electrodes 110,112, i.e., buffering effect can be provided, now, The shape that wire 140 is in may have multiple wavy bendings in arched part.

Light conversion layer 120 includes glue and wavelength convert particle, and it is respectively silica gel 122 and fluorescent material 124 in an embodiment, Light conversion layer 120 is covered in LED chip 102,104 and electrode 110,112, and makes a part for two electrodes 110,112 respectively It is exposed.In the present embodiment, each surface in six faces of LED chip 102,104 is covered with light conversion layer 120, i.e., described Six faces are covered and can be described as light conversion layer 120 and wrapped up LED chip 102,104 by light conversion layers 120, and this covering or parcel can To be but not limited to directly contact, preferably, in the present embodiment, each surface in six faces of LED chip 102,104 Directly contact light conversion layer 120.However, implement when, light conversion layer 120 can only cover each LED chip 102,104 6 Two surfaces in surface, imply that light conversion layer 120 directly contacts two surfaces, this two surface directly contacted can be but The top surface being not limited in Figure 22 or bottom surface.Likewise, light conversion layer 120 can directly contact two tables of two electrodes 110,112 Face.Fluorescent material 124 can use the fluorescent material 124 of metal oxide-type, and such fluorescent material 124 has preferably thermal conductivity.It is glimmering Light powder 124 can be harder than silica gel 122, and the granular size of fluorescent material 124 is about 1 to 30 micron (μm), also can be about 5 using size To 20 μm of fluorescent material 124, the size of identical fluorescent material 124 is roughly the same, the fluorescent material 124 shown in Figure 22 because of section relation, The position analysed is different, just makes the sectional area of section and has size not.In other embodiments, foregoing silica gel 122 can be with Polyimides Polyimide is used, or otherwise known as resin material substitution or a substitution part or as additive, with more preferable Toughness, reduction cracking or brittle probability.Supplementary notes, each surface in six faces of LED chip 102,104 is at least Some directly contacts light conversion layer 120 and/or the wherein one~two sides of LED chip 102,104 and changed through crystal-bonding adhesive and light Layer between be bonded, fall within six foregoing faces by light conversion layer coat and/or LED chip directly contact light conversion layer etc. Same concept.Foregoing crystal-bonding adhesive can also mix fluorescent material in other embodiments, to increase overall light conversion efficiency, crystal-bonding adhesive Generally also it is silica gel, is that crystal-bonding adhesive often mixes silver powder or radiating powder is led to improve with the silica gel difference of mixed fluorescent powder Thermal effect.

Fluorescent material 124 in light conversion layer 120 can absorb some form of radiation syndrome and go out light, such as fluorescent material 124 Absorb shorter wavelength light and luminous longer wavelength light.In one embodiment, fluorescent material 124 absorbs blue light and sends Huang Light, this gold-tinted is with after unabsorbed blue light, that is, forming white light.And six surfaces of foregoing LED chip 102,104 are all covered In the embodiment for being covered with light conversion layer 120, fluorescent material 124 absorbs sends longer after the light of the shorter wavelength sent from each surface The light of wavelength, due to fluorescent material 124 around each outer surface of LED chip 102,104 to form LED filament 100 Body, therefore, each outer surface of LED filament 100 can send mixing light.

The composition of fluorescent material 124 and silica gel 122 is 1 than (composition ratio):1 to 99:1, preferably ratio is 1:1 to 50:1, this ratio can be weight ratio or volume ratio.Figure 22 is refer to, in this embodiment, fluorescent material 124 compares Example is more than silica gel 122 so that the density of fluorescent material 124 is improved and then contacted with each other, arranged together as shown in the straight line in Figure 22 The formation thermally conductive pathways of fluorescent material 124 (thermally conductive pathways as shown in arrow in Figure 22) being in contact, enter one and say, light conversion layer 120 With the thermally conductive pathways formed by fluorescent material 124 that is adjacent and being in contact, the thermally conductive pathways are from LED chip 102,104 tables Face to the outer surface of LED filament 100, therefore the heat that LED chip 102,104 is produced can be transmitted to the outer of light conversion layer 120 Portion so that LED filament 100 has more preferable radiating effect, the problem of light conversion layer 120 has also postponed yellow.And fluorescent material 124 Coloured light conversion ratio can so improve the overall light efficiency of LEDbulb lamp to 30% to 70%, LED filament can also be increased 100 hardness, lifts the pliability of LED filament 100, it is not necessary to support LED filament in addition with framework.In addition, general After silica gel shaping, its surface is more smooth, is unfavorable for the light that LED chip 102,104 produces with fluorescent material 124 and penetrates away. In the present embodiment, because the ratio of fluorescent material 124 in silica gel 122 is improved, the surface roughness of LED filament 100 can be effectively increased The overall surface area with filament, that is to say, that be effectively increased the overall area of dissipation of LED filament 100 so that LED filament 100 possess more preferably radiating effect.In addition, also due to the overall surface area increase of LED filament 100, therefore add filament table The spot light of the light of face fluorescent material 124 conversion, and then lift the overall luminous efficiency of LEDbulb lamp.In addition, light conversion layer surface Can be various lens shapes, with different optical effects；Or moderately retain space in light conversion layer, it can promote scattered Heat.

Furthermore, in the present embodiment, LED chip 102,104 can be using the LED chip for sending blue light, and fluorescent material 124 is It can correspond to using yellow fluorescent powder (for example:Garnet series phosphor powders, YAG fluorescent powder), whereby so that LED filament 100 is sent White light, during implementation, can suitably allocate the ratio of fluorescent material 124 and silica gel 122, so that the spectrum of white light more meets traditional white The spectrum of vehement lamp, in addition, fluorescent material 124 also can be converted into green-yellow light or feux rouges of further arranging in pairs or groups using that can absorb blue light Fluorescent material 124, by fully absorbing the blue light that LED chip 102,104 is sent by substantial amounts of fluorescent material 124, can fit light tune Ratio with different fluorescent material 124, green-yellow light is converted into by most blue light, and least a portion of blue light is then all converted to red Light so that the Integral luminous colour temperature of LED filament 100 is expected closer to 2400 to 2600K (spectrum of conventional incandescent).

In the ratio of suitably allotment fluorescent material 124 and silica gel 122, you can the adjustment pliability of LED filament 100 (deflection), imply that young's modulus (Yong ' s Modulus) Y of LED filament 100 can be between 0.1 to 0.3x10¹⁰Handkerchief (Pa) between, it is considered to the application of bulb lamp, the young's modulus of LED filament 100 is can adjust to 0.15 to 0.25x10¹⁰Handkerchief (Pa) it Between, the problem of so improving conventional LED light bulb filament easy fracture, but still with enough rigidity and pliability.

It please continue refering to the three-dimensional partial cutaway schematic that Figure 25-26, Figure 25 is LED filament second embodiment of the present invention；Figure 26 be the partial cutaway schematic of 5-5 positions in Figure 25.

According to LED filament second embodiment, LED filament 200 includes multiple electrodes of LED chip 202,204, at least two 210th, 212 and light conversion layer 220.It is electrically connected with each other between LED chip 202,204, electrode 210,212 corresponds to LED chip 202nd, 204 configuration, and it is electrically connected with LED chip 202,204.Light conversion layer 220 cover LED chip 202,204 and electrode 210, 212, and make a part of exposed of two electrodes 210,212 respectively, wherein light conversion layer 220 includes silica gel 222, oxidation nanometer grain Sub (Nanoparticle) 226 and fluorescent material 224.

Oxidation nanometer particle 226 can be (such as inorganic oxide nano-particle), and its size belongs to nano level particle, its chi Very little to be less than fluorescent material 224, the material of oxidation nanometer particle can be but not limited to the oxidation nanometer particle 226 for having heat-conducting effect, Such as, but not limited to aluminum oxide (Al₂O₃), silica (SiO₂), zirconium oxide (ZrO₂), titanium oxide (TiO₂), calcium oxide (CaO), oxygen Change the nano-particle that the materials such as strontium (SrO) and barium monoxide (BaO) are formed.These oxidation nanometer particle mean sizes be about 10 to 300nm, most of particle size falls within 20 to 100nm.

It can see that in fig. 26, silica gel 222 is inner to add oxidation nanometer particle 226 and fluorescent material 224, due to oxidation nanometer The hardness of particle 226 and cost and fluorescent material 224 are different, therefore, oxidation nanometer particle 226, fluorescent material 224 and silica gel 222 The visual cost of ratio, thermal conductivity and overall pliability etc. consider and changed.Secondly as the size of oxidation nanometer particle 226 is small In fluorescent material 224, therefore the space that oxidation nanometer particle 226 can be filled up between the particle of fluorescent material 224, increase mutual contact surface Product, forms more thermally conductive pathways, as shown in the straight line in Figure 26, the overall heat-conducting effect of lifting LED filament 200.Meanwhile, oxygen Changing nano-particle 226 can also allow light to produce deviation scattering, and the coloured light conversion efficiency for improving fluorescent material 224 is simultaneously sufficiently uniform mixed Light, allow LED filament 200 the characteristics of luminescence more preferably.

In other embodiments, fluorescent material is evenly distributed on polyimides Polyimide, or otherwise known as in resin material, Under the best circumstances, each fluorescent material is coated by polyimides Polyimide, or resin material, can solve fluorescence The problem of bisque is cracked or is brittle.During practical application, it is extremely difficult to each fluorescent material and is wrapped by, and/or in polyimides In Polyimide, or otherwise known as in resin material, still must mixed with part silica gel.In this case, it should be considered as Fluorescent material is by polyimides Polyimide, or under the equivalents coated otherwise known as resin material.

LED filament 200 also includes multichip circuit film 240 (can also claim printing opacity circuit film), LED chip 202,204 and electrode 210th, 212 it is electrically connected with each other through circuit film 240, light conversion layer 220 is covered in circuit film 240.

LED filament can for hard filament (such as shore hardness may be greater than D50, young's modulus can be between 0.02 to 20x10⁹Between handkerchief) or soft filament (such as shore hardness may be less than D50, and young's modulus be situated between can be in 0.1 to 0.3x10¹⁰Between handkerchief).When application filament assembly of this filament in Fig. 3, two electrodes 110,112 in Figure 21 can be by the One connecting portion 512 and second connecting portion 513 replace, and now electrode 511A and electrode 511B are electrically connected with filament, it is preferable that electricity Pole 511A and electrode 511B at least a portion can be embedded in filament.In in this case, because the demand for supportive is higher than Pliability, therefore by the selection of glue or using processing procedure is toasted the hardness of filament can be made ideal higher than D50.

Please refer to Figure 27 A, Figure 27 A are the signal of the circuit film first embodiment not cut of LED filament of the present invention Figure.Circuit film 240 includes the first film 242 and the conducting wire 244 positioned at the first film surface.First film 242 can be but not limit In film, below for convenience of description, the first film 242 is illustrated by embodiment of film, but and the non-limiting present invention First film 242 only can be film.In this embodiment, conducting wire 244 is arranged in parallel respectively in strip, and each.It is conductive Circuit 244 can also use the second embodiment of different forms, such as Figure 28 A circuit films, and circuit film 240a includes film 242a It is each adjacent to lead and conducting wire 244a, wherein conducting wire 244a are to be distributed in the pattern of oblique parallel line on film 242a Spacing between electric wire can be less than or wait 70 μm, with preferably electrical characteristic.And the 3rd in Figure 29 A circuit film is real Apply in example, circuit film 240b includes film 242b and conducting wire 244b, wherein conducting wire 244b is in staggeredly grid lines Pattern is distributed on film 242b, and its line width can be about 10 μm, and thickness can be about 2 μm.Conducting wire 244,244a, 244b shape State is not limited, if between electric connection LED chip 202,204 can be reached, or LED chip 202,204 and electrode 210,212 it Between.

The material of film 242 can be but be not limited to Kapton (Polyimide Film, PI film), its light transmittance About more than 92%.The material of conducting wire 244 on film 242 can be but be not limited to indium tin oxide (ITO), nano-silver thread electricity Road, metal grill or CNT make.For LED chip it is luminous for, silver-colored (Au) itself has quite good Reflecting effect will not extinction, and nano-silver thread is constituted netting twine shape branch with the line width of nano-scale, while with low resistance With the characteristic of high printing opacity, therefore nano-silver thread is highly suitable for conducting wire 244,244a, 244b.In order to increase nano-silver thread with The gluing effect of LED core plate electrode, can be golden (Au) in nano-silver thread doping.

The production method of circuit film 240 can be prior to forming conducting wire 244 on a film 242；Secondly, there is conduction in this Slotted eye 246 is formed on the film 242 of circuit 244.

Figure 27 A are referred to, because the conducting wire 244 on circuit film 240 is not covered with the surface of whole circuit film 240, Therefore, the light that LED chip 202,204 is sent will not be covered or be absorbed by conducting wire 244.The LED filament of first embodiment 100 be to be electrically connected with using gold thread, and the LED filament 200 of second embodiment is then electrically connected using circuit film 240 Connect, circuit film 240 has the advantages that the line width being electrically connected with is wider, flexible preferable, not easy to break compared to wire 140.

Circuit film 240 and LED chip 202,204, the electric connection of electrode 210,212, can in advance chip 202, 204th, the position to be electrically connected with of electrode 210,212 is coated in advance with conducting paste, e.g. elargol, tin cream or doped with conductive gold The conducting resinl of metal particles, after circuit film 240 is configured with, can use heating or with UV light irradiations, you can reach electric connection Effect.

It please continue refering to Figure 30 A to 30E, it is the preparation method first embodiment schematic diagram of LED filament 200 of the present invention.LED The preparation method of filament includes：

S20：LED chip 202,204 and at least two electrodes 210,212 are configured in (such as Figure 30 A) on carrier 280；

S22：It is electrically connected with LED chip 202,204 and electrode 210,212 (such as Figure 30 B)；And

S24：Light conversion layer 220 is set on LED chip 202,204 and electrode 210,212, wherein, light conversion layer 220 covers Lid LED chip 202,204 and electrode 210,212, and a part for electrode 210,212 at least two is exposed outside, wherein, light conversion Layer 220 includes silica gel 222 and fluorescent material 224 (such as Figure 30 C to 30E).

Wherein, the mode (such as Figure 30 A) of LED chip 202,204 is configured in step S20, according to this embodiment, to be configured to square Each file on figurate number group shape, figure, therefore after processing procedure is finished, single LED filament 200 can be each formed respectively.In configuration During LED chip 202,204, series-parallel correspondence positive and negative electrode configuration during follow-up be electrically connected with need to be considered.Carrier 280 can be but It is not limited to glass substrate or metal substrate.The shape of carrier can be such as the reeded tabular of tool of Figure 30 A flat board, or Figure 31 Thing, the groove is that can be used to configure basic unit 120b.

Step S22 electric connection (such as Figure 30 B), in this embodiment, be using Figure 28 A do not cut circuit film 240a as Example, is electrically connected with LED chip 202,204 and electrode 210,212.In addition, not cutting such as Figure 27 A or 29A can also be used Circuit film 240,240b are electrically connected with, or are to use the wire 140 such as Figure 24 to be electrically connected with.

Step S24 setting light conversion layer during practical operation, can be adopted in LED chip 202,204 and electrode 210,212 Carried out, first, illustrated by taking Figure 30 C to 30E as an example, it includes with various ways：

S240：Light conversion layer (top layer 220a) is coated with LED chip 202,204 and electrode 210,212 not in contact with carrier 280 Side；

S242：Upset has been coated with the LED chip 202,204 and electrode 210,212 of light conversion layer (top layer 220a)；And

S244：Light conversion layer (basic unit 220b) is coated with the another of the LED chip and the uncoated light conversion layer of the electrode Side.

Wherein, for ease of describing and distinguishing, top layer 220a is named as in step S240 light conversion layer 220, in step S244 light conversion layer 220 is named as basic unit 220b.

In step S240, top layer 220a is coated on after LED chip 202,204 and electrode 210,212, silica gel 222 and fluorescence The gap that powder 224 can be filled up between LED chip 202,204 and electrode 210,212, then to having been coated with top layer 220a LED core Piece 202,204 is solidified (or solidification) program with electrode 210,212, so that top layer solidifies and coats the LED core above carrier Piece 202,204 and electrode 210,212, while exposing outside in electrode 210,212 at least two subregion.This program curing is for example But it is not limited to heating or ultraviolet (UV) irradiation.

Step S242 upset, which has been coated with the LED chip 202,204 of light conversion layer (top layer 220a) and electrode 210,212, to be had Several ways, one is that LED chip 202,204 is only configured on carrier 280 with electrode 210,212, and the relation of sticking together is had no therebetween, It can directly overturn, and the semi-finished product after upset can be again placed on the carrier.

Another way, can have to stick together between carrier 280 and LED chip 202,204, the electrode 210,212 The crystal-bonding adhesive that photoresistance that colloid substance, such as manufacture of semiconductor are used or be easy to is removed, this colloid substance after appropriate baking, There is temporary fixed LED chip 202,204, electrode 210,212 in the effect on carrier 280.Therefore, had been coated with upset Before or after top layer 220a LED chip 202,204, electrode 210,212, the light being coated on substrate can be cleaned with acetone Resistance, or the crystal-bonding adhesive with corresponding solvent cleaning on substrate, you can by have been coated with top layer 220a LED chip 202,204, Electrode 210,212 is separated with carrier 280, forms LED filament semi-finished product (such as Figure 30 D).In addition, also can further clean described LED filament semi-finished product, to remove the photoresistance or crystal-bonding adhesive of residual.

Finally, step S244 for coating light conversion layer (basic unit 220b) in LED chip 202,204 and electrode 210,212 not Light conversion layer 220a opposite side is coated with, and basic unit 220b is solidified (such as Figure 30 E).

Top layer 220a in Figure 30 C is slightly larger than the circuit film 240a not cut, but is not limited thereto when implementing.And in figure Top layer 220a in 30E is slightly identical (due to overlapping relation) with basic unit 220b size, but is not limited thereto when implementing, Its size optionally can have large and small difference.

After step S24, it separately may include that step S26 cutting covers the LED chip 202,204 and electricity of light conversion layer Pole 210,212, i.e., such as the cutting position that Figure 30 E chain lines are drawn, consequently, it is possible to which the strip component after cutting is LED filament 200.Step S24 cutting mode is not limited with Figure 30 E, also can each two adjacent columns file LED chip 202nd, 204 it is cut into single LED filament.

Figure 27 A, 28A and 29A do not cut circuit film 240,240a, 240b are covered on LED chip 202,204 and electrode 210th, the chain-dotted line that 212 corresponding relation is each found in Figure 27 B, 28B and 29B, figure respectively is line of cut, is detailed later.

In Figure 30 A to 30E processing procedure, arranged in rectangular array mode, but preparation method is not limited thereto, in step Rapid S20 configuration mode, also can only configure the LED chip 202,204 of single file, consequently, it is possible to which step S26 need not be carried out Cutting process.

On the second embodiment of the preparation method of LED filament 200, Figure 31, the preparation method bag of second embodiment are referred to Include：

S20A：Light conversion layer (basic unit 120b) is coated with carrier 180；

S20B：LED chip 102,104 is configured with electrode 110,112 in the light conversion layer (basic unit 120b) on carrier 180 On；

S22：It is electrically connected with LED chip 102,104 and electrode 110,112；And

S24：Light conversion layer (top layer 120a) is coated with LED chip 102,104 and electrode 110,112 not in contact with light conversion layer The side of (basic unit 120b), wherein, light conversion layer 120 is covered in LED chip 102,104 and electrode 110,112, and makes two respectively A part of exposed 110, the 112 of individual electrode 110,112, wherein, light conversion layer 120 includes silica gel 122 and fluorescent material 124.

As can be seen from Figure 31, it is also light conversion layer that a basic unit 120b, this basic unit 120b are first set on carrier 180 A part, implies that and includes silica gel 122 and fluorescent material 124, in this preparation method, though first basic unit 120b is arranged on carrier 180, But it is not limited thereto, can also be without using carrier 180 during implementation, and directly carry out step S20B direct configuration LED chip 102nd, 104 with electrode 110,112 on basic unit 120b.

Basic unit 120b thickness can be 50 to 100 microns (μm), and depending on fluorescent material 124 and the ratio of silica gel 122, its thickness can be 60 to 80 μm., can be using heating or with UV light irradiations come slightly solidification basic unit 120b after step S20 has been carried out, and dropping After temperature condenses, LED chip 102,104 gets adhered with electrode 110,112 is fixed on basic unit 120b.In addition, it can also use Crystal-bonding adhesive sticks together fixed LED chip 102,104 and electrode 110,112 on basic unit 120b.

After S22 electric connection is completed, S24 configuration top layer 120a can be directly carried out in LED chip 102,104 and electricity Pole 110,112 and solidifies top layer 120a not in contact with basic unit 120b side.Thus, you can save overturning step or removal To stick together carrier 180, LED chip 102,104, with the colloid substance of electrode 110,112 the step of.

According to Figure 31 embodiment, after step S24 has been carried out, the cutting that can also carry out step S26 covers light turn Change the LED chip 102,104 and electrode 110,112 of layer.

Foregoing basic unit 120b can be 0.5 to 3mm (milli to carry LED chip 102,104 and electrode 110,112, its thickness Rice) or 1 to 2mm, after configuration is complete, can be to the appropriate heating of basic unit so that basic unit 120b surfaces are slightly melted, in basic unit 120b Cooling can make LED chip 102,104 stick together fixation with electrode 110,112 after condensing.

Secondly, basic unit 120b fluorescent material 124 can be adjusted suitably with the doping ratio of silica gel 122, to cause its hardness to obtain It is suitable for follow-up electric connection program, such as, but not limited to, the hardness after adulterating and solidifying can be in shore hardness (HS) 60HD More than.Consequently, it is possible to except causing LED filament 100,200 is overall there is appropriate hardness, also may be such that wire (gold thread) routing The stability of processing procedure is improved, and after finished goods, LED filament 100,200 is either pressurized or bent, and can maintain good electricity Property connection.

In Figure 31 embodiment, basic unit 120b need to carry LED chip 102,104 and electrode 110,122, therefore, and it solidifies Hardness before hardness afterwards, or solidification need to be appropriately designed, so that follow-up electric connection (such as needs harder basic unit during routing 120b supports LED chip 102,104 and electrode 110,122), and top layer 120a then no this item demands, therefore, top layer 120a and base Layer 120b silica gel 122 can be different from the ratio of fluorescent material 124, visual global design demand and change.Certainly, Figure 31's In embodiment, light conversion layer 120 can also include the (not shown) of aforementioned oxidation nano-particle 224.

Then, Figure 32 A to 32E are referred to, it is the schematic diagram of the preparation method 3rd embodiment of LED filament of the present invention.

LED wire production method 3rd embodiment includes：

S202：Configure conductive foil 130 on light conversion layer (basic unit 120b) (as shown in fig. 32 a)；

S204：Configure LED chip 102,104 and electrode 110,112 on conductive foil 130 (as shown in fig. 32b)；

S22：It is electrically connected with LED chip 102,104 and electrode 110,112 (as shown in fig. 32 c)；And

S24：Light conversion layer (top layer 120a) is coated with LED chip 102,104 and electrode 110,112 not in contact with conductive foil 130 side, wherein, light conversion layer 120 is covered in LED chip 102,104 and electrode 110,112, and makes two electrodes respectively 110th, 112 it is a part of exposed, wherein, light conversion layer 120 includes silica gel 122 and fluorescent material 124.

Figure 32 A are referred to, step S202 light conversion layers, as foregoing, can be described as basic unit 120b, and conductive foil 130 can have There are multiple openings (132), the width of opening 132 is less than the length of LED chip 102,104, and opening 132 is each corresponded to respectively The luminous zone of LED chip 102,104, will not be by the institute of conductive foil 130 when being emitted beam in favor of LED chip 102,104 by driving Masking.

Conductive foil 130 can be the copper foil of electroplate, but be not limited thereto, and the formation of opening 132 can led Formed on electric paper tinsel 130 with impact style.

It before step S202, can also increase a step, be that basic unit 120b is first configured on a support plate, or be straight Connect and basic unit 120b is configured on a workbench.

Step S204, refers to Figure 32 B, and it is that LED chip 102,104 and electrode 110,112 are configured at into conductive foil 130 On, as foregoing, the light-emitting zone of LED chip 102,104 can be corresponded to the opening 132 of conductive foil 130 during configuration.

With continued reference to Figure 32 C, step S22 electric connection is carried out, each is led using routing mode in the present embodiment Two ends of line (such as gold thread) are connection conductive foil 130 and adjacent LED chip 102,104 or adjacent electrode 110,112, to be formed It is electrically connected with, in the present embodiment, is electrically connected with connecting.

Then, Figure 32 D are referred to.Such as Figure 31 embodiment, step S24 light conversion layer system can be described as top layer 120a, When configuring top layer 120a on LED chip 102,104 and electrode 110,112, top layer 120a material (silica gel 122 with it is glimmering Light powder 124) it can fill to the gap of beneath chips.

Top layer 120a configuration mode, can be directly coated at LED by the fluorescent material 124 of deployed ratio and silica gel 122 Chip 102,104 in LED chip 102,104 and electrode 110,112 with that on electrode 110,112, in addition, also first can be coated with one Layer phosphor powder layer, is then coated silica gel, carries out program curing again thereafter.Another way is, by fluorescent material and silica gel Multi-level alternately coating (or spraying) is changed in LED chip 102,104 and electrode 110,112, in this way, more uniform point can be obtained The effect of cloth.

Complete step S24 after, cutting process can be carried out again, also will each LED filament 100 cut down, such as Figure 32 E It is shown.

In Figure 32 A to 32E embodiment, LED chip 102,104 and the electric connection of electrode 110,112 are via gold Belong to paper tinsel 130 with wire 140 to complete so that the annexation between LED chip 102,104 and electrode 110,112 has more can Flexibility, when whole LED filament 100 is being bent, the relation of electric connection is also difficult to be destroyed.

Finally, Figure 33 and 34 is referred to, it is the first embodiment of LEDbulb lamp 10a, 10b of the foregoing LED filament of application And the structural representation of second embodiment.It can be seen from the figure that, LEDbulb lamp 10a, 10b includes lamp housing 12, lamp holder 16, is located at At least two conducting bracket 14a, 14b, the drive circuit 18 in lamp holder and single bar LED filament 100 in lamp housing 12.

Conducting bracket 14a, 14b are for electrically connecting to two electrodes 110,112 of LED filament 100, also available for supporting The weight of LED filament 100.Drive circuit 18 is is electrically connected with conducting bracket 14a, 14b and lamp holder 16, and lamp holder 16 is connected to tradition Bulb lamp lamp socket when, lamp socket for provide the power supply of lamp holder 16, drive circuit 18 be from lamp holder 16 obtain power supply after to drive The LED filament 100 lights.Due to lighting for the all-round face of the energy of LED filament 100, therefore, whole LEDbulb lamp 10a, 10b can Produce foregoing all-round light.

The definition of all-round light described herein, depending on specification of the every country to certain bulb, this definition also can be with Time and change, therefore, the citing of the described all-round light of this exposure, and be not used to limit the scope of the present invention.All-round light is determined Star plan (the US Energy Star Program Requirements for Lamps (Light of justice, such as american energy Bulbs)) the light shape to bulb lamp (all-round smooth bulb) is to have corresponding definition, and with pedestal upper, mode configures ball to bulb down It is that, for 0 degree, it requires the brightness (luminous of each angle position between 0-135 degree when steeping lamp, above vertical below 180 degree, vertical Intensity (cd)) 25% difference should not be had more than with mean flow rate, and 135 to the total light flux between 180 degree (total flux (lm)) will at least account for the 5% of whole lamp.For another example the specifications of JEL 801 of Japan are required at 120 degree LED In the interval of scope, its luminous flux need to be less than the 70% of total light flux.

In the present embodiment, conducting bracket 14a, 14b is exemplified by two, but to be not limited thereto, visual LED filament 100 conduction or supportive demand and accelerate.

Lamp housing 12 is can or thermal conductivity preferably lamp housing preferable using translucency, such as, but not limited to glass or plastic lantern Shell.During implementation, also doping last layer yellow film can be plated with golden yellow material or lamp housing surface in lamp housing 12, to inhale in right amount The blue light that receiving portions LED chip 102,104 is sent, adjusts the colour temperature of LEDbulb lamp 10a, 10b emitted light.During production, The gaseous mixture that the gas in lamp housing 12 can be replaced by into nitrogen or nitrogen and helium or hydrogen and helium using vavuum pump is (appropriate Mixed proportion), to cause the heat transfer of the air in lamp housing 12 more preferably, and remove the aqueous vapor of air in lamp housing.It is filled in lamp housing Air in 12 can be mainly selected from least one in the group being made up of helium, hydrogen, and hydrogen accounts for total in lamp housing 12 The percent by volume of capacity can be 5% to 50%, and the air pressure in lamp housing 12 can be 0.4 to 1.0 atmospheric pressure.

In Figure 33,34 embodiment, LEDbulb lamp 10a, 10b also includes stem 19 and radiating subassembly 17, and stem 19 is set In in lamp housing 12, radiating subassembly 17 is located between lamp holder 16 and lamp housing 12 and connection stem 19, and LED filament 100 is propped up via conduction Frame 14a, 14b connect stem 19.Stem 19 can be used to the gas substituted in LEDbulb lamp 10b and provide the function of heat conduction, radiating What component 17 connected stem 19 and lamp holder 16 and transmitted it is thermally conducted to outside LEDbulb lamp 10b.Radiating subassembly 17 is located at Between lamp holder 16 and lamp housing 12 and connection stem 19, LED filament 100 connection stem 19.

The material of stem 19 of LEDbulb lamp 10a, 10b can be the metal or ceramics that possess preferable heat-conducting effect, ceramic material Material can be aluminum oxide or aluminium nitride, and its thermal radiation absorption rate is high more than glass, therefore can more effectively absorb the institute of LED filament 100 The heat sent, can be by lamp housing through stem 74 with vavuum pump by outside heat derives LEDbulb lamp 10b during practical operation Air inside 12 substitutes the ratio mixing for helping nitrogen or nitrogen and helium or hydrogen and helium appropriateness, to improve lamp housing The thermal conductivity of gas in 12, while also been removed the water smoke hidden in air.Radiating subassembly 17 can slightly be in hollow cylinder It is centered around in the openend of lamp housing 12, material and can select the metal with good heat conductive effect, ceramics or high heat conduction plastics.Radiating The material of component 17 (together with the screw socket of LEDbulb lamp) is alternatively the ceramic material with good heat conductive effect, radiating subassembly 17 Also the component that can be one of the forming with ceramic stem 19, the screw socket that can so remove LEDbulb lamp 10b from need to be with radiating subassembly 17 It is glued and increase the thermal resistance of the heat dissipation path of LED filament 100, with more preferable radiating effect.

Figure 33 is referred to, the height of radiating subassembly 17 is L1, and the height at the bottom of radiating subassembly 17 to the top of lamp housing 12 is The scope of L2, L1 and L2 ratio (L1/L2) is 1/30 to 1/3.The ratio is smaller, then the beam angle of LEDbulb lamp 10a, 10b The degree light that i.e. bigger, LEDbulb lamp 10a, 10b is sent by radiating subassembly 17 hide we i.e. less and LEDbulb lamp 10a, The distribution for the light that 10b is sent is i.e. closer to all-round light.

In Figure 33 embodiment, LED filament 100 is to be bent into about 270 degree of circle, and the body of LED filament 100 is in wave Shape it is convex with it is recessed, and be to maintain its wavy shape, LEDbulb lamp 10b separately may include cantilever 15 to be supported in LED filament At 100 wavy body crests and trough, consequently, it is possible to which LEDbulb lamp 10b can more be held by the LED filament suitably bent The illumination of all-round light is easily provided, in addition, the LED filament structure processing of one and assembly technology are more simple and convenient, while cost It can reduce a lot.In Figure 34 embodiment, the arc angle for the arc that LED filament 100 is formed is about 270 degree, but in other realities Apply in example, the arc angle that LED filament 100 is formed can close to 360 degree, or, single LEDbulb lamp 10b can include at least Two LED filaments 100, and each LED filament 100 is bent to form the arc angle of about 180 degree so that two LED filaments 100 are suitably matched somebody with somebody Postpone, about 360 degree of arc angle can be formed.

In certain embodiments, cantilever 15 and/or stem 19 can be coated with the material of high reflection property, for example but not limit In white material.Further, it is contemplated that heat dissipation characteristics, the material of the high reflection property can be selected with high-heating radiation absorption characteristic Material, such as, but not limited to graphene (Graphene), in other words, the surface of cantilever 15 and/or stem 19 can be coated with Graphene film.

It refer to the schematic perspective view for the 3rd embodiment that Figure 35 A and Figure 37, Figure 35 A are LEDbulb lamp；Figure 36 E and figure 36L, Figure 36 N are respectively for the 4th, the 5th of LEDbulb lamp the, the schematic perspective view of sixth embodiment；Figure 37 is LEDbulb lamp The 7th embodiment schematic perspective view.According to 3rd embodiment, LEDbulb lamp 10c includes lamp housing 12, connects the lamp of lamp housing 12 First 16, at least two conducting bracket 14a, 14b, drive circuit 18, cantilever 15, stem 19 and the single LED in lamp housing 12 Silk 100.Drive circuit 18 is electrically connected to conducting bracket 14a, 14b and lamp holder 16.And the 4th to sixth embodiment LED ball Bubble lamp is similar to 3rd embodiment, and the LEDbulb lamp 10d of the 7th embodiment includes two LED filaments 100a, 100b, from top Overlook, described two LED filaments 100a, 100b are to bend to close to circular (complete or tool breach ring-type), and are regarded from side, Two LED filament 100a, 100b are to be located at different plumb heights.

LED filament 100,100a, 100b area of section are less than the sectional area of filament 100 in Figure 33,34 embodiments, LED Filament 100,100a, 100b electrode 110,112 are electrically connected to conducting bracket 14a, 14b, and driving circuit is carried out to receive 18 power supply,

Similar to Figure 33,34 second embodiment, Figure 35 and 37 LED filament 100,100a, 100b are bent into from top Portion overlooks rounded, meanwhile, LED filament 100,100a, 100b can also be bent into wavy (from side), and this is wavy Structure not only novel appearance, and can ensure that LED filament 100,100a, 100b are luminous uniform.Meanwhile, single LED Silk 100 is less compared to the binding site that many LED filaments need when being connected with conducting bracket 14a, 14b, in practice single LED Silk 100 only needs two basic change point as shown in figure 35, effectively reduces the risk of failure welding or reduces machinery pressure and is close to Process when connecing.In an embodiment (such as Figure 35 B), LED filament bendable be converted under the top view of top with wave-like Mode surrounds bulb center or stem.In different embodiments, from the LED filament under the top view of top can in similar round or U-like shape.Stem 19 separately has a vertical rod 19a for extending perpendicularly to the center of lamp housing 12, and a first end of each cantilever 15 is connected to Vertical rod 19a, and one second end of each cantilever 15 is connected to LED filament 100,100a, the 100b, refers to Figure 36 A, figure 36A is the section close-up schematic view of dashed circle part in Figure 35 A, and the second end of each cantilever 15 has a pincers portion 15a, Pincers portion 15a fixes LED filament 100,100a, 100b, and pincers portion 15a can be to fixed LED filament 100,100a, 100b ripple The crest or trough of wave-like, but be not limited thereto, i.e. pincers portion 15a may also be used for fixing the wavy crest of LED filament with Part between trough.Pincers portion 15a shape can be matched with LED filament 100, the profile of 100a, 100b truncation surface, and pincers portion 15a hole sizes can be slightly less than LED filament 100, the size of the profile of 100a, 100b truncation surface, therefore, during fabrication, can LED filament 100,100a, 100b are passed through pincers portion 15a endoporus (non-label), to form tight fit.Another fixation side Formula is that the pincers portion is formed via bending program, furthermore, it is understood that being that LED filament 100,100a, 100b first are placed in into cantilever 15 Free end, followed by tool by free end around LED filament 100,100a, 100b and bend, to form pincers portion 15a.Not The second end of cantilever 15 can extend directly into the inside of LED filament 100 and as auxiliary in LED filament 100 in be the same as Example Bar is helped, to strengthen the mechanical strength of LED filament 100, related embodiment is as be described hereinafter.

The material of cantilever 15 can be but not limited to carbon spring steel, to provide appropriate rigidity and elasticity, so as to reduce Impact of the external vibration to LED filament, it is ensured that LED filament is unlikely to deform.Because vertical rod 19a is the center that extends to lamp housing 12, And cantilever 15 is connected near vertical rod 19a top, therefore, the plumb height of LED filament 100 is close in lamp housing 12 The heart, thus LEDbulb lamp 10c the characteristics of luminescence close to traditional bulb lamp the characteristics of luminescence so that it is luminous more uniform, simultaneously Luminosity can also reach the luminance level of traditional bulb lamp.In addition, in the present embodiment, the cantilever 15 first of LED filament 100 End is connected with the vertical rod 19a of stem 19, and the second end of cantilever 15 is connected to LED filament 100,100a, the 100b by pincers portion 15a External insulation face so that cantilever 15 is non-conductive, it is to avoid when conventional cantilever is conductive because by electric current produce heat cause Wire in cantilever 15 expands with heat and contract with cold, and is burst so as to avoid glass stem 19.

Electrode 110,112 and the annexation between conducting bracket 14a, 14b can be that mechanical compress connects, and also may be used To be to be welded to connect, the mechanical connection can be first conducting bracket 14a, 14b through electrode 110,112 perforation 111, 113, then reflexed conducting bracket 14a, 14b free end so that conducting bracket 14a, 14b clamp electrode 110,112 and form electricity Property connection.Welded type connection can be using modes such as silver-base alloy weldering, silver soldering, WU welderings conducting bracket 14a, 14b and Electrode 110,112 is connected.In addition, similar to the relation in Figure 36 A between cantilever 15 and filament 100, filament and conducting bracket Electrode with filament can also be with Figure 36 A mode in a wherein side for conducting bracket (not shown) or electrode (such as Figure 36 C) Pincers portion is formed to fix.In addition, as shown in figure 36b, electrode 5061 can be bound to conducting bracket to be hook-shaped.Implement in one In example, as shown in Figure 36 D, filament has the groove 5066 of accommodating electrode to house electrode 5064, so that electrode is hidden in filament body In without exposed, filament is reached more preferably light-out effect.

In an embodiment, the bulb shown in Figure 35 A can be the bulb of A dimensions.Two conducting brackets and LED Two contact points of silk 100, the i.e. two end electrodes of filament, the distance on horizontal plane can be within 3 centimetres, preferably 2 lis Within rice.Wavy due to filament is surround so that filament lamp is being reached outside the effect of all-round light, moreover it is possible to reach two contacts Point it is close to each other so that conducting bracket is substantially at the lower section of filament, it is visually excessively noticeable not lofty and can be whole with filament Body forms the curve of grace.When being observed by side, the peak of filament wave and the distance of minimum point are excellent at 2.2-3.8 centimetres It is selected in 2.2-2.8 centimetres.Thereby ensuring that possessing certain heat-dissipating space above filament.

As shown in Figure 35 A, filament shape can outline be considered as fitting equation：Filament spatial is located at shown in Figure 35 A Cartesian coordinate system；X-y plane is located at vertical rod 19a top plans, and (when bulb lamp without core rod/vertical rod, origin can be considered that ball steeps The spherical portion centers point of shell), and x-y plane is perpendicular to LEDbulb lamp 10c short transverse.Two filament electrodes (are welded Point, that is, the contact point or fusion point) it is symmetrically distributed in y-axis both sides；Z-axis and stem (or LEDbulb lamp 10c Planar central axle) it is coaxial.Change of the shape of LED filament 100 according to t (t is the variable between 0 to 1) in x, y and z directionss, Namely any point of LED filament is X, Y, Z in the position of x, y, z coordinate system and meets fitting equation, as follows：

X=m1*cos (t*360)；

Y=m2*sin (t*360)；

Z=n*cos (t*360*k)；

LED filament 100 is changed in the x, y and z directions according to t, works as X=0, Shu Y Shu max (Shu Y Shu maximum)=m2, Shu Z Shu max (Shu Z Shu maximum)=n；Work as Y=0, Shu X Shu max (Shu X Shu maximum)=m1, Shu Z Shu max=n；Work as Z=0, Shu X Shu max= M1, Shu Y Shu max=m2；M1 represents X-direction length, 24≤m1≤27 (unit mm)；M2 represents Y-direction length, 24≤m2≤27 (unit mm)；So that filament environment and with good luminous flux in cell-shell, n represents filament apogee distance on z directions The height of x-y plane, 0 ＜ n≤14, unit mm；Filament turning point is less also easy to produce the situation of gold thread fracture under the conditions of this；K The number of peak position is represented, to avoid strut (or cantilever/transverse direction assistant strip) more, is unfavorable for processing, and sets k values and is 2≤k≤8.The curve that aforesaid equation is described, can be considered the benchmark of filament spatial distribution.In the bar of some techniques and equipment Under part, its filament actual disposition result, it will have 0 to 25% spatial diversity value with situation described by the fitting equation.And Can be the relative highest or relative minimum of Z axis in the filament areas for possessing fulcrum, its space difference value is smaller, perhaps It can be considered 0 to 20%.Or, when lamp housing radius is r, r herein is constantly to cut off the circle to be formed from lamp housing bottom up to cut The value when radius in face is maximum, can be set as 0.8*r≤m1≤0.9*r by above-mentioned m1, m2, n values；0.8r≤m2≤0.9r；0 ＜ n≤0.47*r.And more can further it set when the radius using lamp holder joints is p value, during filament length G, then filament is long Degree is between 1.2*p≤G≤5.6r.Set by this, filament can be made in the case of the effect above is maintained, moreover it is possible to will be required Filament length/LED chip suppress in minimum zone, not only save filament material, also inhibits the heating in bulb.

In another embodiment, as shown in Figure 35 B, filament can be considered a similar round in the projection of x-y plane, if center The planar projective point distance of point to filament can be considered filament projection distance r, and the circular arc angle that filament planar projective is formed is visual θ=0 is can be considered for the incident point (subpoint of i.e. one of filament electrode) of θ and filament end point.Its arc angle θ is about Between 180 ° to 360 °, under the status of implementation of part, the height that filament can pass through Z axis adjusts to be formed>360 ° of circular arc.Filament is thrown Radius r is penetrated according to different process meanses and equipment making, ± 20% variation is might have, if each incident point is linked, Can outline be considered as a similar round.In addition, the filament is associated in the change of Z axis and with θ, it is rough can be considered function z=nXcos (k θ+π), n represents the height of filament apogee distance x-y plane on z directions；0 ＜ n≤14, unit mm；K represents peak position Number, 2≤k≤8, and according to different technique and equipment making process, might have ± 20% variation.

Furthermore, because pincers portion 15a interior shape (shape in hole) is matched with the outer shape in the section of LED filament 100, because This, as long as being suitably designed, you can so that the orientation in the section of LED filament 100 is both facing to particular orientation, by taking Figure 36 A as an example, LED The top layer 120a of filament 100 is fixed in the about 10 o'clock direction towards schema, so as to ensure the hair of whole LED filament 100 Smooth surface is along the direction being substantially the same, it is ensured that visually the exiting surface of LED filament 100 is consistent.If many in LED filament 100 Individual LED chip is to be configured with formal dress and is in the linear alignment, then one sides of the top layer 120a away from basic unit 120b is main light-emitting surface, and base One sides of the layer 120b away from top layer 120a is time light-emitting area, and main light-emitting surface and time light-emitting area are relative to each other.Main light-emitting surface is LED When silk 100 is luminous, the most one side of light throughput；And secondary light-emitting area is when to be then LED filament 100 light, light throughput time Many one sides.In the present embodiment, conductive foil 130 is formed between top layer 120a and basic unit 120b, to allow multiple LED chips It is electrically connected with, but not limited to this.In the present embodiment, the zigzag of LED filament 100 but its main light-emitting surface is remained out, also The either segment for being main light-emitting surface all can be towards lamp housing 12 or lamp holder 16 in unspecified angle, and secondary light-emitting area is then all towards stem 19 (or can keep inside towards the top of stem 19, that is, secondary light-emitting area), thereby, when LED filament 100 lights, steeps LED ball Generally speaking lamp 10c can produce the all-round light close to 360 degree of illumination effects.

Figure 36 E are refer to, Figure 36 E are the schematic perspective view of the fourth embodiment of LEDbulb lamp of the present invention.Figure 36 E LED Bulb lamp 10d and Figure 35 A LEDbulb lamp 10c is substantially the same, and Main Differences are filament portion.As shown in Figure 36 E, LED Bulb lamp 10d include lamp housing 12, connect the lamp holder 16 of lamp housing 12, it is at least two conducting bracket 14a in lamp housing 12,14b, outstanding Arm 15, stem 19 and single LED filament 100d.Stem 19 includes relative stem bottom and stem top, the stem bottom Connect and extended at the top of the lamp holder 16, stem inside lamp housing 12, such as centered on being located at the top of stem inside lamp housing 12 about Position.In the present embodiment, stem 19 includes vertical rod 19a, and vertical rod 19a is considered as into the part of the whole of stem 19 herein, Therefore the top of stem 19 is vertical rod 19a top.Conducting bracket 14a, 14b connect the stem 19.LED filament 100d bags Filament body and two filament electrodes 110,112 are included, two filament electrode 110,112 is located at relative the two of the filament body End, filament body is that LED filament 100d does not include the other parts of filament electrode 110,112.Two filament electrodes 110,112 points Two conducting bracket 14a, 14b are not connected, and the filament body is around the stem 19.Cantilever 15 one end connection stem 19 and it is another One end connects filament body.

Referring to Figure 36 E and Figure 36 F to 36H, Figure 36 F are the fourth embodiment side of LEDbulb lamp of the present invention Schematic elevation view, Figure 36 G are the schematic side view of the fourth embodiment side of LEDbulb lamp of the present invention, and Figure 36 H are the present invention The schematic top plan view of the fourth embodiment of LEDbulb lamp.In the short transverse of the LEDbulb lamp 10d (i.e. z directions), by The bottom of lamp housing 12 is to have the first difference in height Δ H1 between H, two filament electrode 110,112 to distance between the top of lamp housing 12, First difference in height Δ H1 can be for 0 between 1/10H.In other words, the difference in height minimum between filament electrode 110,112 can be 0, that is to say, that both are located at same level to filament electrode 110,112, and the difference in height between filament electrode 110,112 is maximum Can be 1/10H.Preferably, the first difference in height Δ H1 scope 0 between 1/20H.In an embodiment, the first difference in height Δ H1 scope is between 0 millimeter to 5 millimeters.Further, the first difference in height Δ H1 scope is between 1 millimeter to 5 millimeters.More Further, the first difference in height Δ H1 scope is between 1 millimeter to 2 millimeters.

In an embodiment, the most short straight line distance between two filament electrodes 110,112 is less than 3 centimetres.Also, in height On direction, two filament electrodes 110,112 are located at by the bottom of lamp housing 12 1/2 between 3/4H.

As shown in Figure 36 F, filament body bending rise and fall and with peak and minimum point, the peak with it is minimum There is the second difference in height Δ H2 between point.In the present embodiment, the minimum point of the filament body is adjacent filament electrode 110 Endpoint location；In other embodiments, if filament body downward bending place (towards lamp holder 16 bend part) in a z-direction Less than filament electrode 110,112, then minimum point is the downward bending place of the filament body.Wherein, the first difference in height Δ H1 is small In the second difference in height Δ H2, the second difference in height Δ H2 scope is 2/10 between 4/10H.In an embodiment, second Difference in height Δ H2 scope is between 2.2 centimetres to 3.8 centimetres, it is preferable that the second difference in height Δ H2 scope at 2.2 centimetres extremely Between 2.8 centimetres.Not only illumination effect is good by above structure by the present invention, and makes simple, and rising angle is big.

In an embodiment, in the height direction (i.e. z directions), the peak and minimum point of filament body are all fallen within from lamp 1/3 is started between 4/5H in the bottom of shell 12.Also, the filament body between two filament electrodes 110,112 is luminescence segment, the hair More than the 50% of light section is higher than the position of two filament electrodes 110,112 in the height direction.Preferably, the 30% of the luminescence segment Above in the height direction higher than the position of the top of stem 19 (i.e. vertical rod 19a tops).

In an embodiment, the filament body on the lateral projection face of the LEDbulb lamp 10d be in a filament lateral projection (can refer to the LED filament 100d shown in Figure 36 F and 36G), height of the lateral projection face parallel to the LEDbulb lamp 10d Spend direction (z directions), the filament lateral projection have between peak and minimum point, and the peak and the minimum point In the short transverse have difference in height, the difference in height for lamp housing 12 height H 1/8 to 3/8 between.

In an embodiment, the filament body on the horizontal plane of the LEDbulb lamp in (can refer to Figure 36 H's The top view of filament body), in a filament floor projection, the filament floor projection can be similar round or the shape of U-like shape.Institute Horizontal plane is stated perpendicular to z directions and parallel to x-y plane.In the present embodiment, as shown in Figure 36 H, filament body is in institute State on horizontal plane is in U-like shape.In addition, the two ends (i.e. two filament electrodes 110,112) of the filament floor projection it Between beeline can be 0 to 3 centimetre between.

In an embodiment, the filament body is more than 270 degree around the angle of the stem.For example, such as Figure 35 B and figure Shown in 36H, filament body is more than 270 degree in the arc angle θ of the projection of x-y plane, so can reach preferable illuminating effect. In different embodiments, as shown in Figure 35 B, the central point of the filament floor projection to the distance of the filament floor projection is R, the arc angle that the filament floor projection is formed is θ, arc angle θ scope be more than or equal to 30 degree and be less than or Equal to 360 degree.(with reference to Figure 36 G) in an embodiment, the quantity of the filament body is one, and in the LEDbulb lamp 10d In (i.e. side view) on the perspective plane of special angle, described two conducting brackets 14a, 14b can overlapping (the conductive branch shown in Figure 36 G Frame 14a, 14b only show conducting bracket 14a because overlapping), and the filament body can cross over the both sides of stem 19, and it is described Two conducting bracket 14a, 14b can then be located at the wherein side of stem 19.Because conducting bracket 14a, 14b are only located at the same of stem 19 Side, that is to say, that the opposite side of stem 19 does not have any conducting bracket, therefore less likely blocks LED filament 100d and sent out The light gone out, and also easily proofread the position of two conducting bracket.

In an embodiment, the filament body include multiple formal dress configure and be in the linear alignment LED chip (scheme not Show), the filament body corresponds to the multiple LED chip and defines relative main light-emitting surface and secondary light-emitting area.Such as Figure 36 A institutes Show, one sides of the top layer 120a away from basic unit 120b is main light-emitting surface, and one sides of the basic unit 120b away from top layer 120a is secondary luminous Face, main light-emitting surface and time light-emitting area are relative to each other.Main light-emitting surface is LED filament 100 when lighting, light throughput it is most one Face；And secondary light-emitting area is when to be then LED filament 100 light, many one sides of light throughput time.Such as Figure 36 E and Figure 36 F to 36H institutes Show, the filament body includes main light-emitting surface 1001 and time light-emitting area 1002.The either segment of main light-emitting surface 1001 is in unspecified angle Towards lamp housing 12 or lamp holder 16, it is towards outside LEDbulb lamp 10d or towards outside lamp housing 12, and secondary light-emitting area 1002 Either segment in unspecified angle towards stem 19 or the top of stem 19, be towards within LEDbulb lamp 10d or towards lamp housing 12 center.In other words, when user is by external observation LEDbulb lamp 10d, LED filament 100d mainly can preferentially be seen Main light-emitting surface 1001, can thereby improve the effect of illumination.

In the present embodiment, as shown in Figure 36 E and Figure 36 F to 36H, LED filament 100d shape meets foregoing curve Equation：X=m1*cos (t*360)；Y=m2*sin (t*360)；Z=n*cos (t*360*k).On the curvilinear equation Formula, can refer to foregoing explanation, is repeated no more in this.

In addition, LED filament 100d is defined with outward appearance, as shown in Figure 36 E, LED filament 100d filament body bag At least one first bending section (not indicating) and at least 2 second bending sections (not indicating) are included, the first bending section is located at 2 second bendings Between section, two filament electrode 110,112 is located at the described one end of 2 second bending sections away from first bending section respectively. In the present embodiment, many cantilevers 15 are respectively connecting to the bending place of the first bending section and the second bending section, so as to more preferable twelve Earthly Branches Support the filament body differently curved section.First bending section is bent towards first direction, and the second bending section is bent towards second direction, And first bending section and 2 second bending sections form wavy loop configuration.

As shown in Figure 36 E, in the present embodiment, first direction is that, towards the direction of lamp holder 16, second direction is away from lamp First 16 direction, that is to say, that from the point of view of Figure 36 E direction, (i.e. bending place can be closer to lamp towards being bent downwardly for the first bending section It is first 16), and 2 second bending sections are towards being bent upwards (i.e. bending place can be further from lamp holder 16).In various embodiments, first Direction is alternatively the direction away from lamp holder 16, and second direction can be then towards the direction of lamp holder 16, that is to say, that the first bending section Also can be towards being bent upwards, and 2 second bending sections then can be towards being bent downwardly.

In the present embodiment, the first bending section and 2 second bending sections in being on LEDbulb lamp 10d the first lateral projection face Inverted U-shaped, the first bending section and 2 second bending sections take the shape of the letter U or M shapes on LEDbulb lamp 10d the second lateral projection face, and described The short transverse (z directions) of 10d lamps, and first side are steeped parallel to LED ball with second lateral projection face in side perspective plane Perpendicular to one another with second lateral projection face on perspective plane.Wherein, the first lateral projection face can refer to the side view shown in Figure 36 G, figure Filament body in 36G is inverted U shape；And the second lateral projection face can refer to the filament sheet in the front view shown in Figure 36 F, Figure 36 F Body is in M shapes.If the bending place minimum point of the first bending section 1003 of filament body is close with the height of filament electrode 110,112, Then the filament body in Figure 36 F can take the shape of the letter U.In the present embodiment, as shown in Figure 36 H, the first bending section and 2 second bending sections In can be taken the shape of the letter U on LEDbulb lamp 10d horizontal plane or inverted U-shaped (depending on the direction according to observation, in U in Figure 36 H Shape), the horizontal plane perpendicular to the LEDbulb lamp 10d short transverse (z directions) and parallel to x-y plane.

Figure 38 is referred to, Figure 38 shows for the vertical view of the circuit board of the drive circuit of LEDbulb lamp fourth embodiment of the present invention It is intended to.Drive circuit 18 includes the circuit board 18a for being fixed on lamp socket 16, and conducting bracket 14a, 14b are to be electrically connected to circuit board 18a, and the electric connection of electrode 110,112 by vertical rod 19a with LED filament 100a, 100b, circuit board 18a include L-shaped groove Hole 18b, L-shaped slotted eye 18b are in hook, and the sectional area for being dimensioned slightly smaller than conducting bracket 14a, 14b of the tip of its hook Size, therefore, when conducting bracket 14a, 14b are inserted along L-shaped slotted eye 18b, L-shaped slotted eye 18b can be easy to fix in conduction Support 14a, 14b, and this structure is more beneficial for circuit board 18a and is welded to each other with conducting bracket 14a, 14b.Need explanation It is that in the embodiment as shown in Figure 35 and Figure 37, conducting bracket 14a, 14b length L settings want relatively reasonable and are just unlikely to lead Causing two conducting brackets 14a, 14b can not be electrically connected with circuit board 18a respectively because of oversize and short-circuit or too short.It is described to lead Met the need for length L (unit is mm) science of electric support：

Constant 3.2 is safe electrical appliance spacing in this formula.Wherein described A is the thickness of circuit board 18a vertical direction Expose the length of circuit board 18a part with described conducting bracket 14a, 14b；The B is that two conducting brackets 14a, 14b are parallel Partial spacing；The H is that conducting bracket 14a, 14b are cast into the position of stem 19 to the length inserted between circuit board 18a.Need Illustrate, the scope of the length L of heretofore described conducting bracket between 0.5L~2L all can be used, preferably Scope between 0.75L~1.5L.The L values obtained by above formula are only a kind of embodiment, are not constituted to this hair Bright conducting bracket size sole limitation.

Figure 37 specifically is refer to, for having the situation that there is two LED filaments along vertical direction in Figure 37, is located at The length Z=L+Y, Z of the conducting bracket of the LED filament of the top long measure are mm.Wherein described Y is two LED filaments Conducting bracket spacing.

Institute's drawings is only one of which embodiment, can also use it in the silica gel of mixed fluorescent powder in previous embodiment He is glue class such as polyimides Polyimide, or the substitution of other resin materials or a substitution part, to improve the tortoise of light conversion layer Split or the problem of embrittlement.

Further, the top layer of LED filament and basic unit can have different structure and composition, to be combined into a variety of differences The LED filament of property.Illustrate the layer structure of the LED filament of this case below.Figure 39 A are LED filament layer structure of the invention An embodiment sectional schematic diagram, LED filament 400a has：Light conversion layer 420；LED chip 402,404；Electrode 410,412； And for electrically connecting the gold thread 440 of LED chip and LED chip (or electrode).Light conversion layer 420 is coated on LED chip/electrode At least both sides on.Light conversion layer 420 exposes a part for electrode 410,412.Light conversion layer 420 can at least have a top layer A 420a and basic unit 420b, respectively as the upper layer and lower layer of filament, top layer 420a and basic unit in this embodiment 420b is located at the both sides of LED chip/electrode respectively.Among processing procedure, basic unit 420b can be formed in advance, secondly by LED chip 402,404 and electrode 410,412 basic unit 420b is connected to by crystal-bonding adhesive 450.Gold thread 440 can be formed at LED chip each other it Between；Or between LED chip and electrode.The shape of gold thread 440 can have bending shape (such as in Figure 39 A slightly be in M fonts) with Slow down impulsive force, also can be more typical arcuation or linear.Thereafter top layer 420a is coated in LED chip and electrode.Top Layer 420a size is not required to identical with basic unit 420b.In an embodiment, top layer 420a area is slightly less than basic unit 420b. In an embodiment, basic unit upper surface；It it is 1nm-200 μm i.e. with 10 mean roughness (Rz) of the contact surface of top layer；And push up The upper table surface roughness of layer, that is, the Rz for contacting the opposing face in basic unit face can be 1 μm of -2mm.

When between top layer and basic unit only to contact on a single plane, the bond strength between top layer and basic unit is limited.For Bond strength between increase top layer and basic unit, can moderately increase the contact area between top layer and basic unit；Or moderately adjust Both whole shapes；Or the interface moderately adjusted between the two makes obvious boundary interface is not present between the two.

The way for increasing both contact area between top layer and basic unit, and adjustment shapes is as described below.Such as Figure 39 B institutes Show and (LED chip and electrode are omitted in figure), top layer 420a and basic unit 420b is included in filament 420.On both mutual contact surfaces The surface that at least part of formation is fitted together to mutually, in this embodiment, LED chip is configured at the centre in filament width The top layer 420a and basic unit 420b in region are plane engagement, but the side area of intermediate region both sides is chimeric shape engagement.Example Wavy interface 420i in correspondence with each other as shown in Figure 39 B.Between top layer and basic unit be only plane engagement situation Compare, the area of engagement interface increases and improves bond strength between the two.But the stage casing region of configuration LED chip also may not be used Plane need to be defined to, and can also have heaving of the sea (as shown in figure 46), and being used between top layer and basic unit increases composition surface Long-pending surface is also not required to stick to wavy, also can be zigzag etc..In an embodiment, in basic unit upper surface (namely with The contact surface of top layer) set larger roughness to reach similar effect.

Another way can be for example, in an embodiment, (omitting LED chip and electrode in figure) as shown in Figure 39 C, base Layer 420b has multiple perforations 466 so that top layer 420a penetrates among basic unit 420b and increased between top layer 420a and basic unit 420b Contact area；Can further it be extended into for being formed after top layer 420a phosphor gel penetrates into basic unit 420b perforation 466 Basic unit 420a opposite side, as shown in Figure 39 E, Figure 30 E are Figure 39 D E1-E2 line sectional drawings.Now due to top layer 420a at least The relation for causing similar riveting is presented between the two by upper and lower double team basic unit.

In an embodiment, between top layer and bottom and without clear composition surface.Preparation method does not limit but can example Such as carry out it is foregoing " after step S20 has been carried out, can be using heating or with UV light irradiations come slightly solidification basic unit 120b " Curing process when, can only first solidification basic unit it is unilateral after put to LED chip, then configure top layer after in LED chip again It is secondary to be solidified, so so that be intermediate zone warm each other between top layer and bottom, there is top layer and bottom simultaneously in intermediate zone The composition of layer, due to not having sharply divided engagement interface between top layer and bottom so that both shell mutually from interface is engaged From situation be avoided.For example when applied to filament hierarchy shown in Figure 39 B, top layer 420a and bottom in Figure 39 B Layer 420b interface 420i substantially will not the substitute is while having the intermediate zone of top layer and bottom composition.

420 top layer 420a and basic unit 420b can be respectively at least one layer of layer structure in light conversion layer.It is layered Structure may be selected from：Shapeable high phosphor gel, shapeable low fluorescent powder membrane, hyaline layer or the random layer of this three Shape is combined.Phosphor gel/the fluorescent powder membrane includes following component：Glue 422/422 ', fluorescent material 424/424 ', inorganic oxide Nano-particle 426/426 '.Glue 422/422 ' can be but be not limited to silica gel.In an embodiment, it can be included in glue 422/422 ' 10%Wt or lower polyimides (Polyimide, hereinafter referred to as PI) is steady to increase the overall hardness of filament, insulating properties, heat Qualitative and mechanical strength, PI solid contents can be 5-40%Wt, and viscosity can be 5-20Pa.S.Such as the glue 422 ' in Figure 39 A There can be higher hardness with sharp die bond and routing.Inorganic oxide nano-particle 426/426 ' can be but be not limited to aoxidize aluminum shot Son, particle can be 100-600 nanometers, and it act as the radiating for promoting filament.Top layer 420a can be identical with basic unit 420b, also may be used Suitably be adjusted, make both hardness (for example being adjusted by packaging plastic composition or fluorescent material ratio), Wavelength-converting, Situation differentiation is regarded in the features such as constituent particle granules size, thickness, light transmittance.And for example fluorescent powder membrane and phosphor gel can Optionally it is adjusted to be more than 20%, 50% or 70%.The shore hardness of phosphor gel can be D40-70；And Shao of fluorescent powder membrane Family name's hardness can be D20-70.The thickness of fluorescent powder membrane can be 0.1-0.5 millimeters；Refractive index is 1.4 or higher；Light transmittance is 40%-95%.Hyaline layer (glue-line, insulating barrier) can be by high light-transmissive resin such as silica gel, polyimides (Polyimide, below letter Claim PI) or its combination and constitute.In an embodiment, hyaline layer can be as refractive index matching layers, with adjustment filament light extraction The effect of efficiency.

Figure 40 shows another embodiment of LED filament layer structure.In this embodiment, LED chip 402,404, gold Line 440, top layer 420a are configured at basic unit 420b both sides, that is to say, that basic unit 420b is located at two top layer 420a centre.Electricity Pole 410,412 is respectively configured at basic unit 420b two ends.LED chip 402,404 above and below in figure in two top layer 420a can Same electrode 410/412 is connected to by gold thread.In this way, light extraction can be more uniformly distributed.

Figure 41 shows another embodiment of LED filament layer structure.In this embodiment, filament 400c basic unit 420b It is further divided into the fluorescent powder membrane 4201b and hyaline layer 4202b of different hardness.Harder fluorescent powder membrane 4201b be located at compared with Between soft hyaline layer 4202b and top layer 420a.LED chip 402,402 and electrode 410,412 are configured at harder fluorescent material On film 4201b.Because fluorescent powder membrane 4201b has higher hardness so that LED chip 402,404, electrode 410,412, gold Line 440 has more stable configuration basis.And because hyaline layer 4202b has larger pliability so that light conversion layer 420 is whole Body has more preferable suppleness.In this embodiment, fluorescent powder membrane 4201b has the glue 422 ' for being mixed into PI.Film layer 4202b is only With glue 422 ".Glue 422 " is silica gel.Hyaline layer 4202b has highest light transmittance.Preferably, hyaline layer 4202b shore Hardness number can be D20-40, and fluorescent powder film layer 4201b Shore durometer number can be higher than hyaline layer 4202b about 40.Optionally, Hyaline layer 4202b can be the effect with adjustment filament rising angle as refractive index matching layers.Such as hyaline layer 4202b's Thickness is the optical thickness of 1/4 wavelength, and hyaline layer 4202b thickness can be different according to actual wavelength of light, makes light Line produces interference because being reflected in multiple interfaces such as LED chip/fluorescent powder membrane, fluorescent powder membrane/hyaline layer, hyaline layer/air Phenomenon, can reduce reflected light.In other embodiments, hyaline layer does not limit only one layer, if for example, setting upper two layers Or three layers of hyaline layer, make reflectivity lower.For example with three layers of hyaline layer that thickness is 1/4,1/2,1/4 wavelength optical When, it can obtain the effect of wide wavestrip antiradar reflectivity.In embodiments of the present invention, the thickness of hyaline layer can be according to different wave length Such as LED chip/fluorescent powder membrane/phosphor gel adjusts, transparent as long as can meet the ratio that interference reduces reflection The thickness of layer is positive and negative 20% integral multiple of 1/2,1/4 wave optical thickness.And the thickness of hyaline layer can according to its internal layer LED Chip/fluorescent powder membrane/phosphor gel adjusts, and refers to that to account for all wavelengths luminous intensity ratio big to project light luminous intensity In 60% wave band based on adjust, preferably adjusted based on the wave band more than 80%.Hyaline layer can select refractive index Opened for its internal layer refractive index in the material of radical sign positive and negative 20%, such as Figure 41, when the fluorescent powder membrane of hyaline layer 4202b internal layers When 4201b refractive indexes are 2, hyaline layer 4202b refractive index is about 1.414 ± 20%.In this way, light reflection damage can be reduced effectively Lose.

Among an embodiment (not shown), basic unit 420b is divided into two layers, its can have different hardness/thickness/ The characteristics such as Wavelength-converting.

Figure 42 shows another embodiment of this case filament layer structure.In this embodiment, filament 400d basic unit 420b only has glue 422 '.Glue 422 ' is silica gel and has been mixed into PI, is configured with being installed with higher hardness in favor of component.In This, basic unit 420b compares other layers with higher light transmittance.

Figure 43 shows that basic unit 420b points in the layer structure figure of filament in the embodiment of this case one, figure are hard area section 4203b And soft zone section 4204b, hard area section 4203b and soft zone section 4204b are alternately configured.Hard area section 4203b and soft zone section 4204b The fluorescent material 424 ' being had can be identical with organic oxygen compound particle 426 ', and hard area section 4203b glue 422 ' is to be mixed into PI Silica gel；Soft zone section 4204b glue 422 " is the silica gel for not adding PI.Therefore section 4203b in hard area has higher compared with soft zone section Hardness and beneficial to component install configuration.Among another embodiment, filament can be according to allocation position closest to the bottom of lamp socket/stem Portion, which rises, is divided into three sections such as bottom, pars intermedia, leading section.Required filament shape bending degree be sequentially low kink, in Bending degree, high bending degree, and demand to form proportion of composing used in each section of filament to adjust according to this.In addition, with curved The filament for rolling over shape can be comprising the hard substrate for not having bendable folding endurance.In an embodiment, filament has line part and kink, directly Have in line portion and carry the hard substrate of LED chip, can be coated by phosphor gel around it.And kink can have carrying LED The FPC of chip, can be coated around it, or do not have any substrate only by phosphor gel coating chip by phosphor gel.Hard substrate It can be formed by the material such as ceramics, glass, sapphire, BT, FR4, metal, aluminum oxide.

Figure 44 shows another embodiment of this case filament layer structure.As shown in figure 44, filament 400f light conversion layer Including top layer 420a and basic unit 420b.Each face of LED chip 402,404 is directly contacted with top layer 420a；And basic unit 420b is not contacted with LED chip 402,404.In manufacturing process, basic unit 420b can be pre-formed, LED chip is secondly formed 402,404 and top layer 420a.

Figure 45 shows another embodiment of filament layer structure.Wherein top layer 420a and basic unit 420b is comprising fluorescence The double-decker of arogel layer and glue-line.Top layer 420a includes fluorescent material glue-line 4201a and glue-line 4202a；Basic unit 420b is included Fluorescent material glue-line 4201b and glue-line 4202b, and glue-line 4202a, 4202b are located at the outermost layer of filament layer structure, glue-line 4202a, 4202b can be formed only by glue 422 ".The (not shown) in an embodiment, top layer 420a can be divided into multiple fluorescent material glue-lines Or multiple fluorescent powder film layers.Among another embodiment (not shown), glue-line 4202a, 4202b extend and wrapped outside filament Cover fluorescent material glue-line 4201a, 4201b includes all faces of side.Now glue-line 4202a, 4202b preferably can be high printing opacity Transparent heat shrinkage film, in addition to protecting fluorescent material glue-line, with more the effect of reinforcing filament bar structure.

In another embodiment, as shown in figure 46, filament 400l basic unit 420b is formed as the wave risen and fallen with height Shape surface, LED chip 402,404 is configured thereon that and there is height to rise and fall and in tilting state.Thus filament 400l have compared with Wide rising angle.If that is, using the contact surface of the bottom surface of basic unit and table surface as horizontal plane, LED chip is matched somebody with somebody Put and do not need and plane-parallel, but there is the mode of certain angle to configure between horizontal plane, and each LED chip Between configuration height/angle/direction also can for difference.In other words, if concatenating multiple LED chips with LED chip central point When, the lines formed can not be straight line.In this way, filament can be made to have been provided with increase in the state of no bending, just The effect of rising angle and uniform in light emission.

Figure 47 shows the another embodiment of this case.LED filament 400h has：LED chip 402,404；Electrode 410,412； Gold thread 440, and light conversion layer 420.Wherein 420 points of light conversion layer is top layer 420a and basic unit 420b, wherein first with The accommodating ditch of chip for being located at filament axial direction is formed in phosphor gel formation the basic unit 420c, basic unit 420c of fluorescent material 424 and glue 422 428, LED chip can be fixed on the bottom that chip houses ditch 428 by crystal-bonding adhesive 450 (can also be used only and dissolve mode).Secondly In configuring gold thread 440 on filament axial direction, filled up again with another phosphor gel 420d with fluorescent material 424 and glue 422 thereafter Chip houses ditch 428 and forms top layer 420a.In this embodiment, top layer 420a is only configured at the centre of filament radially, And the both sides of filament radially are all basic unit 420b.The width that chip houses ditch 428 is more than LED chip 402,404, makes in LED It is more than at least two faces among six faces of chip that (the present embodiment is five faces) contacts and coated by top layer 420d.When When LED chip is engaged on basic unit 420c in formal dress mode, the top layer 420d contacted with LED chip main light-emitting surface phosphor gel There can be the fluorescent material (or the higher fluorescent material of light conversion efficiency) of larger proportion, so that filament has good light extraction；And Basic unit 420c is due to that must maintain must have larger proportion in the pliability of filament, therefore basic unit 420c phosphor gel Glue.Preferably, fluorescent material accounts for 60-85%WT in top layer 420d phosphor gel；And fluorescent material in basic unit 420b phosphor gel Account for 40-65%WT.

Figure 47 B are refer to, Figure 47 B are the schematic cross-section of the LED filament of yet another embodiment of the invention.Implement according to one Example, can send the LED filament 100 of all-round light includes operationally interconnecting and can excite the wire of luminous LED chip 102 Array, electrode 112, multiple wires 140 of the line array for being for electrically connecting to LED chip 102 and electrode 112 and surround The line array of LED chip 102 and the light conversion layer 120 of electrode 112.Wherein, light conversion layer 120 includes the first fluorescent glue-line 2402 (can be considered basic unit), the second fluorescent glue-line 2404 and hyaline layer 2406 (both can be considered top layer for this).First fluorescent glue-line 2402 include the chondritic of the tangent two-by-two of wire consecutive, and LED chip 102 is enclosed in the center of the first fluorescent glue-line 2402 Part.The outer layer of the formation LED filament 100 of hyaline layer 2406, the second fluorescent glue-line 2404 fills up the fluorescent of hyaline layer 2406 and first Gap between glue-line 2402.Fluorescent material amount in first fluorescent adhesive layer 2402 can be more than the second fluorescent adhesive layer 2404, to be formed Enough amount of light and ensure the continuity of light extraction.Glue content ratio in second fluorescent adhesive layer 2404 can be more than the first fluorescence Glue-line 2402, or the second fluorescent adhesive layer 2402 using softer glue after solidification (for example the second fluorescent adhesive layer 2404 uses silica gel, First fluorescent adhesive layer 2402 uses PI) so that the hardness of the second fluorescent adhesive layer 2402 be less than the first fluorescent adhesive layer 2404, now by The second fluorescent adhesive layer 2404 of intermediate point is more than the first fluorescent adhesive layer 2402 between chip so that filament 100 can have good Bending.

Figure 48-50 shows three kinds of LED core chip packages.The filament multilayer knot of this applicable this case of three kinds of encapsulating structures Structure.In this, because stressing LED chip and packaged type, therefore basic unit is only illustrated with insulating barrier 460, it is understood that, Basic unit is also not excluded for including the possibility of the sandwich construction of fluorescent material glue-line or fluorescent powder film layer.

Among LED filament encapsulating structure shown in Figure 48, filament 400i has：LED chip 402,404；Electrode 410, 412；Gold thread 440；Light conversion layer 420, and insulating barrier 460.After insulating barrier 460 are configured, thereon by pasting with many The copper foil 430 of individual radial opening.Copper foil upper surface can further have silver coating, and the copper foil positioned at filament two ends end to end is used as electricity Pole 410,412 simultaneously extends beyond insulating barrier 460.Secondly LED chip can be fixed on by insulating barrier 460 by modes such as crystal-bonding adhesives On.Thereafter, apply phosphor gel or fluorescent powder membrane, it is coated LED chip 402,404, gold thread 440, and electrode 410,412 A part, to form light conversion layer 420.The width and/or length of opening are more than LED chip, limit the position of LED chip, And make more than at least two faces among six faces of LED chip (the present embodiment is five faces) contact and by overlayer fluorescent powder Glue is coated.In this embodiment, the filament that is combined as of the collocation of copper foil 430 gold thread 440 brings firm and maintenance pliability lead Electric structure；Also there is the effect of increase light reflection in addition to the electric conductivity good except bringing of silver coating 431.

Among LED filament encapsulating structure shown in Figure 49, filament 400j is similar to the filament 400i disclosed by Figure 48, and it is not It is that the LED chip that (1) filament 400j is used is foot welding height identical flip-chip with part, is directly connected on leg silver-plated The length (length i.e. on filament axial direction) of (2) filament 400i openings noted earlier must for LED chip to be accommodated on layer 431 LED chip must be more than, and the filament 400j of the present embodiment LED chip 402,404 corresponding openings 432 are simultaneously plated positioned at copper foil 430/ The top of silver layer 431, therefore the length of LED chip 402,404 is more than opening.The present embodiment is eliminated compared to previous embodiment The step of beating gold thread.

Among LED filament encapsulating structure shown in Figure 50, filament 400k is similar to the filament 400j disclosed by Figure 49.It is different Part is, has used positive cartridge chip carrying out flip-chip configuration, highly different leg will be processed as originally after identical height (being usually that relatively low N poles extension is processed as with P extremely with height) carries out flip-chip configuration.

Figure 51 shows the stereogram of the embodiment of a filament lamp supplementary structure of this case.Among filament 100a, light conversion layer 120 at least coat LED chip 102,104 and gold thread 140.There is fluorescent material 124 and glue 122 in light conversion layer 120.The envelope of filament Any mode or the packaged type of the filament of other conventional approaches that dress mode can be disclosed by this specification.In the present embodiment In, the configuration of top layer portion can be similar Figure 39 A configuration, i.e., connected among positive cartridge chip, light conversion layer 120 and had by gold thread Have multiple along the configuration of filament axial direction but electric property is not connected with electrode/LED chip/gold thread, and be predominantly located at multiple The assistant strip 170 of the both sides of chip.Assistant strip 170 can be copper wire, be electrically connected due to not having with electrode/LED chip/gold thread, Therefore assistant strip 170 is only used as reinforcement filamentray structure, and external force can be prevented for the damage of LED chip.Assistant strip can Thickness and quantity are adjusted depending on LED chip/filament size/weight/required filament shape, and then reaches the effect of filament supports Really.Among another embodiment, 120 points of light conversion layer is top layer and basic unit, and top layer has phosphor gel or fluorescent powder membrane；Basic unit From flexible safety glass, its thickness is 0.1-0.5mm, and hardness 1H, transmitance is 90 or higher.

The shape of assistant strip is not limited to along axially extending linear of filament.Can also be axially extending along filament Spiral-shaped or bending shape, the different sections of same assistant strip are discriminably located at the different layers of filament.In addition, auxiliary It can also be laterally to help bar.In an embodiment, filament has the two longitudinal assistant strips and multiple horizontal strokes axially extended To horizontal assistant strip.Horizontal assistant strip extends beyond the width of filament and is connected with vertical rod.Now horizontal assistant strip It may replace the cantilever 15 in Figure 35.Or horizontal assistant strip can not be also placed, longitudinal assistant strip of multistage is only configured, and will be vertical Be bent into L fonts at least one end of assistant strip and extend beyond the width range of filament, and further can with vertical rod or Be in bulb other end points with anchored filament.

In an embodiment, when assistant strip is metal or the preferable material of other thermal conductivity, it can be extended out to enter outside filament It is connected with the radiator of stem or bulb to one step, or extends outside bulb and contacted with extraneous air, with profit radiating.

When filament is with less angle folding, bending place may expanded by heating and heated stress influence and become fragile. Hole or breach can be suitably set in filament near bending place, to slow down this influence.In an embodiment, such as Figure 52 (figures Middle omission LED chip and electrode) shown in, it is predetermined bending place between space D 1-D2.Top layer 420a is formed by phosphor gel, Basic unit 420b is fluorescent powder membrane.Multiple holes 468 are set in top layer 420a, and preferably hole 468 is from the outside of bending place (in figure Top) rise, closer to curved inner side place (lower section in figure), hole is bigger, and such embodiment Hole 468 is triangle.Carry out curved When rolling over filament, exerted a force upward bending filament by F directions, now because multiple holes 468 between space D 1-D2 make it that filament is easy Bending, the hole 468 of bending place can buffer thermal stress, and be planned according to appropriate void shape and bending angle, after bending A certain size hole can still be retained to exist, now hole also has the effect for improving radiating.

In an embodiment, there is heat emission hole in filament.It is preferred that, heat emission hole can be formed along the axial arrangement of filament The radiating aperture of strip.When filament is linear filament, filament can be to erect or oblique line configuration, now the two of filament End is divided into end portion and high end, (being preferably the end points of high end) can have opening, opening near the high end of filament It is connected with radiating aperture with profit radiating.And nearby (being preferably the end points of end portion) can also have and radiating aperture company end portion Logical opening, so that the colder air in lower section is flowed into from the opening of low side.When filament is the filament with flexure type shape, according to Different flexure type shapes, which is likely to result in filament, has multiple high ends/multiple end portions, now still has along filament in filament Axially extending radiating aperture, can all have the opening connected with radiating aperture near multiple high ends of filament, and Can all have the opening connected with radiating aperture near multiple end portions.It can be formed close to high open-ended part in lamp housing Radiating area, radiating area can be that ventilation mouth or the higher transparency material formation of optional thermal conductivity (for example first make opening to fill out again Enter the transparent resin for being mixed with radiating particle, radiating particle citing can be graphite, ceramics, carbon fiber, aluminum oxide, magnesia, nanometer The translucency such as silver preferably highly heat-conductive material).Further, foregoing filling the doing selected from nitrogen/helium/hydrogen gas among bulb Method also can set the way of ventilation mouth to be combined with lamp housing.For example in an embodiment, high on filament open-ended is opened with end portion Mouth is connected with multiple ventilation mouths of lamp housing respectively so that the radiating aperture in filament is directly contacted with extraneous air.When multiple When gas port is connected with filament, closed state is still maintained in lamp housing.Now inserted in closed lamp housing selected from nitrogen/helium/ Hydrogen gas, can further promote the radiating in lamp housing.This way is applied to the filament lamp that hard filament or soft filament are formed.

Figure 36 I to 36K are refer to, Figure 36 I are partial cross section's enlarged diagram of the first embodiment of the lamp housing of the present invention, Figure 36 K are partial cross section's enlarged diagram of the second embodiment of the lamp housing of the present invention, and Fig. 2 F are the 3rd of the lamp housing of the present invention Partial cross section's enlarged diagram of embodiment.As shown in Figure 36 I, lamp housing 12 includes glue-line 12a and diffusion barrier 12b, glue-line 12a Between lamp housing 12 and diffusion barrier 12b, the fastness that glue-line 12a can be between enhanced diffustion film 12b and lamp housing 12.Diffusion barrier 12b It then can be used for diffusion to penetrate the light of lamp housing 12, make LEDbulb lamp 10c, 10d can be with lighting effect evenly.Except this it Outside, diffusion barrier 12b can be also attached directly on lamp housing 12 without glue-line 12a, and diffusion barrier 12b can be attached to the outer of lamp housing 12 Side or inner side.In other embodiments, diffusion barrier 12b can also be substituted with toning film, the adjustable LEDbulb lamp 10c of toning film, The colour temperature for the light that 10d is sent；Or, diffusion barrier 12b can have the function of adjustment colour temperature concurrently, for example, add light in diffusion barrier 12b Transformational substance, the smooth transformational substance can be wavelength convert particle.

As shown in Figure 36 J, in order to lift the security of lamp housing, in an embodiment, lamp housing 12 may include gluing film 12c, The gluing film 12c can be attached to the outside or inner side of lamp housing 12, in the present embodiment, and the gluing film 12c is located at lamp housing 12 Inner side.Adhesive film 12c material can be calcium carbonate or strontium phosphate, the selection of adhesive film 12c thickness and LEDbulb lamp 10c, 10d weight is relevant.If LEDbulb lamp 10c, 10d is provided with radiator (such as radiating of the position between lamp housing 12 and lamp holder 16 Fins group), and when the gross weight of radiator is more than 100 grams, the 0.7 of at least 70% to 0.9W/m*K heat conduction is contained in radiator Glue, now adhesive film 12c thickness will be at 200 microns (μm) between 300 microns (μm).When radiator is not injected into heat-conducting glue When, when weight is about below 80 grams, adhesive film 12c thickness can play explosion-proof for 40 microns (μm) to 90 microns (μm) The effect of lifting, the lower limit of thickness is relevant with the weight of lamp, must consider explosion-proof sex chromosome mosaicism, and the upper limit can make printing opacity more than 300 μm Rate is not enough, increases material cost, adhesive film 12c combination of materials be mainly arrange in pairs or groups among calcium carbonate or strontium phosphate, process it is organic Solvent carries out appropriate mediation, and after lamp housing 12 is broken, adhesive film 12c can link together the fragmentation of lamp housing 12, be difficult production Raw broken hole, to avoid user from accidentally coming in contact internally charged body, occurs electric shock accidents..

The colour temperature of filament lamp can be adjusted by LED chip with the collocation of the fluorescent material in phosphor gel/film.Except this it Outside, lamp housing/stem/vertical rod can also have effects that colour temperature adjustment, such as when the main material of lamp housing is glass (with reference to Figure 36 K) When, light transformational substance 12d can be added in glass sintering, to form the lamp housing 12 with light transformational substance 12d；Or transparent The toning film mixed with light transformational substance is coated with glass inner side or outside；Stem/vertical rod is also such.

Filament lamp can be roughly divided into two kinds of main Types of decoration and illumination according to colour temperature, when filament lamp to decorate to be main During purposes, colour temperature can be adjusted to 1700-2700K, it can be 70-100, preferably 90-100 averagely to drill color evaluation number (Ra). During when filament lamp to illuminate as main application, colour temperature can be adjusted to 2500-3500K, luminous efficiency can for 80-100 lumens/ Watt, it can be 60-100, preferably 80-100 averagely to drill color evaluation number (Ra).Light transformational substance can be such as fluorescent material, dyestuff (coating the nano-particle of gold, golden coated with silver such as silver compound, gold, titanium, silver).

In addition it is also possible on the inside of lamp housing (diffusion barrier 12b or coating as shown in Figure 36 I) or outside, or stem, Diffusion barrier is coated with vertical rod, increases the diffusion of light.For example, when the main component of diffusion barrier can be calcium carbonate, calcium halophosphate activated by antimony andmanganese And aluminum oxide is wherein any, or wherein wantonly two kinds of combination, or three kinds of combination.It is main material when utilizing calcium carbonate The diffusion coating that the appropriate solution of collocation is formed, by the effect with excellent diffusion and printing opacity (having an opportunity to reach more than 90%) Really.When diffusion barrier is coated on the outer surface of lamp housing, radiator below diffusion coating and lamp housing (or lamp holder, plastic lantern Seat) between frictional force increase, and significantly solve the problem of lamp housing comes off.

In the present embodiment, in allotment, the constituent of diffusion coating include calcium carbonate, strontium phosphate (such as CMS-5000, White powder), thickener, and ceramics activated carbon (such as ceramic active carbon SW-C, colourless liquid).Specifically, when diffusion is applied Layer is using calcium carbonate as main material, and arrange in pairs or groups thickener, ceramic active carbon and deionized water are coated on the inner peripheral surface of lamp housing after mixing , preferably can be between 20-30 μm or on outer peripheral face, the thickness of coating falls between 20 to 300 μm.Using the formation of this material Diffusion barrier, the light transmittance can with about 90%, it is however generally that, the scope of light transmittance is about 85% to 96%.In addition, this expand Film is dissipated in addition to the effect with diffusion light, moreover it is possible to play a part of electric isolution, so that when glass lamp ruptures, Reduce the risk that user gets an electric shock；This diffusion barrier can cause light source when luminous, allow light to produce diffusion, toward penetrating from all directions Go out, so that dark space is avoided the formation of, the illumination comfort of room for promotion.In addition, when the diffusion coating of selection different materials composition, or When being the diffusion barrier by adjusting different-thickness, different illuminating effects can be obtained.

In other embodiments, diffusion coating can also calcium carbonate be main material, a small amount of reflecting material (such as strontium phosphate of arranging in pairs or groups Or barium sulfate), thickener, ceramic active carbon and deionized water, be coated on after mixing on lamp housing, the average thickness of coating falls Between 20 to 30 μm.Because the purpose of diffusion barrier is to allow light to produce diffusion, diffusion phenomenon is light through particle for microcosmic The grain diameter size of the reflecting materials such as reflex, strontium phosphate or barium sulfate can be much larger than the particle diameter of calcium carbonate, therefore, and selection exists A small amount of reflecting material is added in diffusion coating, can effectively increase the diffusion effect of light.

Certainly, can also be the main material of diffusion coating, carbonic acid from calcium halophosphate activated by antimony andmanganese or aluminum oxide in other embodiment The particle diameter of the particle of calcium about falls between 2 to 4 μm, and the particle diameter of the particle of calcium halophosphate activated by antimony andmanganese and aluminum oxide about respectively falls in 4 Between to 6 μm between 1 to 2 μm, by taking calcium carbonate as an example, when the claimed range of light transmittance falls 85% to 92%, it is overall with Calcium carbonate for main material the average thickness that need to coat of diffusion coating about at 20 to 30 μm, in identical light transmittance requirement scope Under (85% to 92%), calcium halophosphate activated by antimony andmanganese can fall in 25 to 35 μm, oxygen for the average thickness that the diffusion coating of main material need to be coated Changing aluminium can fall at 10 to 15 μm for the average thickness that the diffusion coating of main material need to be coated.If light transmittance demand is higher, example Such as more than 92%, then the diffusion coating thickness by main material of calcium carbonate, calcium halophosphate activated by antimony andmanganese or aluminum oxide then needs thinner.

Figure 36 L are refer to, Figure 36 L are the schematic perspective view of the 5th embodiment of LEDbulb lamp of the present invention.Shown in Figure 36 L LEDbulb lamp 10e and Figure 36 E shown in LEDbulb lamp 10d difference be, Figure 36 L LEDbulb lamp 10e lamp housing 12 also include multiple air-vent 12e, and these air-vents 12e is distributed in the top of lamp housing 12 and correspondence LED filament 100d place Position, so that heat produced when allowing LED filament 100d to operate can be shed through cross-ventilation by air-vent 12e.Not In be the same as Example, lamp housing 12 may also include the air-vent positioned at the bottom of lamp housing 12.

Figure 36 M are refer to, Figure 36 M are the stereogram of the lamp housing of LEDbulb lamp in one embodiment of the invention.Except LED Outside the silk radiator structure of itself, radiator structure also can be set on the lamp housing of LEDbulb lamp.In previous embodiment, lamp housing There can be air-vent near the high end of filament (peak), and the setting of the air-vent of lamp housing is not limited thereto.In In one embodiment, the top or bottom of lamp housing 12 may also set up air-vent 1201a, 1201b.In an embodiment, such as figure institute Show, the top air-vent 1201a of lamp housing 12 perforated area can be 100 to 500 square millimeters, preferably 150 to 450 squares Millimeter；The bottom air-vent 1201b of shell perforated area can be 200 to 1200 square millimeters, and preferably 450 to 1000 is flat Square millimeter.When the less air-vent of setting area, human contact can be avoided to the danger at the internally charged position of bulb lamp.

Figure 36 N are refer to, Figure 36 N are the schematic side view of the sixth embodiment of LEDbulb lamp of the present invention.Shown in Figure 36 N LEDbulb lamp 10f and Figure 36 E shown in LEDbulb lamp 10d difference be LED filament 100d, 100f shape not Together, but LED filament 100d, 100f change in shape all meet foregoing fitting equation.In the present embodiment, LED filament There are 100f more bendings to rise and fall.In other embodiments, LED filament can have variously-shaped change.As long as can meet described The shape of LED filament in fitting equation, LEDbulb lamp, is not limited to the example shown in this case schema.

Fig. 5 A to 5E are refer to, adoptable LED filament in the LEDbulb lamp of multiple embodiments of the invention is illustrated below Thin portion structure.Wherein, the top layer of LED filament and basic unit can have different structure and composition, to be combined into a variety of dissimilarities The LED filament of matter, will be described below the layer structure of the LED filament of the present invention.Fig. 5 A are LED filament layer structure of the invention An embodiment schematic cross-section, LED filament 400a has：Light conversion layer 420；LED chip 402,404；Filament electrode 410, 412；And gold thread 440.Gold thread 440 is used to electrically connect LED chip 402,404, and for electrically connecting LED chip 402,404 With filament electrode 410,412.Light conversion layer 420 is coated at least both sides of LED chip 402,404 and filament electrode 410,412 On.Light conversion layer 420 exposes a part for filament electrode 410,412.Light conversion layer 420 can at least have a top layer 420a and One basic unit 420b, respectively as the upper layer and lower layer of filament, the top layer 420a and basic unit 420b difference in this embodiment Positioned at LED chip 402,404 and the both sides of filament electrode 410,412.Among processing procedure, basic unit 420b can be formed in advance, its It is secondary that LED chip 402,404 and filament electrode 410,412 are connected to basic unit 420b by crystal-bonding adhesive 450.Gold thread 440 can be formed Between LED chip 402,404；Or between LED chip 402,404 and filament electrode 410,412.The shape of gold thread 440 Shape can have bending shape (such as being slightly in M fonts in Fig. 5 A) to slow down impulsive force, also can be more typical arcuation or linear. Thereafter top layer 420a is coated in LED chip 402,404 and filament electrode 410,412.Top layer 420a size is not required to It is identical with basic unit 420b.In an embodiment, top layer 420a area is slightly less than basic unit 420b.Basic unit 420b upper surface, i.e., 10 mean roughness (Rz) of basic unit 420b and top layer 420a contact surface are 1nm to 200 μm；And top layer 420a upper surface Roughness, that is, the Rz for contacting the opposing face in basic unit face can be 1 μm to 2mm.

Figure 39 A to 39E are refer to, adoptable LED filament in the LEDbulb lamp of multiple embodiments of the invention is illustrated below Thin portion structure.Wherein, the top layer of LED filament and basic unit can have different structure and composition, to be combined into a variety of differences The LED filament of property, will be described below the layer structure of the LED filament of the present invention.Figure 39 A are LED filament stratiform of the invention One embodiment schematic cross-section of structure, LED filament 400a has：Light conversion layer 420；LED chip 402,404；Filament electrode 410、412；And gold thread 440.Gold thread 440 is used to electrically connect LED chip 402,404, and for electrically connect LED chip 402, 404 with filament electrode 410,412.Light conversion layer 420 is coated at least the two of LED chip 402,404 and filament electrode 410,412 On side.Light conversion layer 420 exposes a part for filament electrode 410,412.Light conversion layer 420 can at least have a top layer 420a And a basic unit 420b, respectively as the upper layer and lower layer of filament, top layer 420a and basic unit 420b points in this embodiment Wei Yu not LED chip 402,404 and the both sides of filament electrode 410,412.Among processing procedure, basic unit 420b can be formed in advance, Secondly LED chip 402,404 and filament electrode 410,412 are connected to basic unit 420b by crystal-bonding adhesive 450.Gold thread 440 can shape Into between LED chip 402,404；Or between LED chip 402,404 and filament electrode 410,412.Gold thread 440 Shape can have bending shape (such as being slightly in M fonts in Fig. 5 A) to slow down impulsive force, also can be more typical arcuation or straight line Shape.Thereafter top layer 420a is coated in LED chip 402,404 and filament electrode 410,412.Top layer 420a size is not Need to be identical with basic unit 420b.In an embodiment, top layer 420a area is slightly less than basic unit 420b.Basic unit 420b upper surface, That is 10 mean roughness (Rz) of basic unit 420b and top layer 420a contact surface are 1nm to 200 μm；And top layer 420a upper table Surface roughness, that is, the Rz for contacting the opposing face in basic unit face can be 1 μm to 2mm.

In an embodiment, there is closed structure between basic unit 420b and top layer 420a, closed structure can strengthen basic unit Bond strength between 420b and top layer 420a.Because when between top layer and basic unit only to contact on a single plane, Bond strength between top layer and basic unit is limited.In order to increase the bond strength between top layer and basic unit, can moderately increase top layer with Contact area between basic unit；Or moderately adjust both shapes；Or the interface moderately adjusted between the two makes between the two In the absence of obvious boundary interface.In one embodiment, the closed structure includes mat surface, and the mat surface is respectively formed in On contact surface between basic unit 420b and top layer 420a, thereby increase basic unit 420b and top layer 420a bond strength.In addition, close Other kind of embodiment and way for closing structure are as described below.

The way for increasing both contact area between top layer and basic unit, and adjustment shapes is as described below.Such as Figure 39 B institutes Show and (LED chip and filament electrode are omitted in figure), top layer 420a and basic unit 420b is included in filament 420.Both mutual contacts The surface that at least part of formation is fitted together to mutually on face, in this embodiment, LED chip is configured at LED filament 400a width The top layer 420a and basic unit 420b of intermediate region in direction are plane engagement, but the side area of intermediate region both sides is chimeric Shape is engaged.Wavy interface 420i in correspondence with each other for example shown in Figure 39 B.Between top layer 420a and basic unit 420b The situation of only plane engagement is compared, and the area of engagement interface increases and improves bond strength between the two.But configure LED core The stage casing region of piece can also be not required to be defined to plane, and can also have a heaving of the sea (as shown in Figure 39 F), and top layer 420a and base The surface that being used between layer 420b increases bonding area is also not required to stick to wavy, also can be zigzag etc..Implement in one In example, larger roughness is set to reach similar effect in basic unit 420b upper surfaces (namely with top layer 420a contact surface) Really.

Another way can be for example, in an embodiment, (LED chip and filament electricity are omitted in figure as shown in Figure 39 C Pole), basic unit 420b has multiple perforations 466 so that top layer 420a penetrates among basic unit 420b and increases top layer 420a and basic unit Contact area between 420b；Being penetrated into for forming top layer 420a phosphor gel can be further after basic unit 420b perforation 466 Basic unit 420a opposite side is extended into, as shown in Figure 39 E, Figure 39 E are Figure 39 D E1-E2 line sectional views.Now due to top layer 420a is at least caused the relation that similar riveting is presented between the two by upper and lower double team basic unit 420b.

In an embodiment, between top layer 420a and basic unit 420b and without clear composition surface.Preparation method is not limited It is fixed but can be such as：Light conversion layer (basic unit 420b) is being coated on carrier, and is configuring LED chip 402,404 and filament electricity Pole 410,412 after on the light conversion layer (basic unit 420b) on carrier, and using heating or with UV light irradiations come slightly During solidification basic unit 120b curing process, only elder generation solidification basic unit 420b unilateral (such as the side in figure downward) can it put afterwards To LED chip 402,404, then configure top layer 420a and solidified again after in LED chip 402,404, so so that top Particular range between floor 420a and basic unit 420b, which can be formed, overlaps area, and it is that top layer 420a and basic unit 420b melts each other that this, which overlaps area, The intermediate zone of sum.There is top layer 420a and basic unit 420b composition in intermediate zone simultaneously, due to top layer 420a and basic unit 420b it Between do not have sharply divided engagement interface so that both are avoided from interfaces situation about peeling off mutually is engaged.For example when should During for LED filament 400a hierarchies shown in Fig. 5 B, the interface 420i of the top layer 420a and basic unit 420b in Fig. 5 B will Not substantially, it the substitute is while having the intermediate zone of top layer 420a compositions and basic unit's 420b compositions.

In addition, the LED filament with bending shape can include the hard substrate for not having bendable folding endurance.In an embodiment, LED Filament, which has to have in line part and kink, line part, carries the hard substrate of LED chip, can be by phosphor gel bag around it Cover.Can be coated and kink can have the FPC of carrying LED chip, around it by phosphor gel, or do not have any substrate only by Phosphor gel coating chip.Hard substrate can be the material institute shape such as ceramics, glass, sapphire, BT, FR4, metal, aluminum oxide Into.

Figure 51 A to 51D are refer to, Figure 51 A-51D are the solid of the embodiment of LED filament assistant strip first to fourth of the present invention Schematic diagram.Among Figure 51 A LED filament 100a, light conversion layer 120 at least coats LED chip 102,104 and gold thread 140.Light turns Changing has fluorescent material 124 and glue 122 in layer 120.LED filament 100a packaged type can be any side disclosed by this specification The packaged type of the filament of formula or other conventional approaches.In the present embodiment, the configuration of top layer portion can matching somebody with somebody for similar Figure 39 A Put, i.e., being connected by gold thread 140 has multiple assistant strips 170 among packed LED chip 102,104, light conversion layer 120, auxiliary Bar 170 is configured along LED filament 100a axial directions, but assistant strip 170 and filament electrode 110,112/LED chips 102,104/ Electric property is not connected gold thread 140, and assistant strip 170 is predominantly located at the both sides of multiple LED chips 102,104.Assistant strip 170 can For such as metal (such as copper), glass, nm pipe.Due to filament electrode 110,112/LED chips 102,104/ gold thread 140 not With electrical connection, therefore assistant strip 170 is only used as reinforcement filamentray structure, and can prevent external force for LED chip 102, 104 damage.The visual LED chip 102 of assistant strip 170,104/LED filaments 100a size and weight/required LED filament 100a Shape adjust thickness and quantity, and then reach support LED filament 100a effect.Among another embodiment, light turns It is top layer and basic unit to change 120 points of layer, and top layer has phosphor gel or fluorescent powder membrane；Basic unit is from flexible safety glass, its thickness For 0.1 to 0.5mm, hardness 1H, transmitance is 90 or higher.In addition, assistant strip can also be laterally.

In other embodiments, the shape of assistant strip is not limited to along axially extending linear of filament.Can also be Along the axially extending spiral-shaped or bending shape of filament, the different sections of same assistant strip are discriminably located at filament Different layers.If the assistant strip in Figure 51 B is wave-like；And Figure 51 C assistant strip is spiral-shaped；This both assistant strip All it is present in simultaneously in the top layer and basic unit of filament, therefore with the effect of the different interlayer engagement of reinforcing filament.Assistant strip 170a is only Used as reinforcement filamentray structure, and external force can be prevented for the damage of LED chip 102,104.The visual LED of assistant strip 170a The shape of chip 102,104/LED filaments 100a size and weight/required LED filament 100a adjusts thickness and quantity, And then reach support LED filament 100a effect.

As illustrated in figure 5 1d, in an embodiment, there are multiple assistant strip 170b, these assistant strips in LED filament 100a 170b is similarly transversely arranged, is with assistant strip 170a difference, and assistant strip 170b also enters an extension and passes LED filament 100a, also, assistant strip 170b passes LED filament 100a part to be further attached to stem 19 as cantilever 15 (with reference to Figure 35 A and Figure 35 E).In the case, assistant strip 170b is in addition to it can strengthen filament overall structure, moreover it is possible to by LED Filament 100a is affixed directly on stem 19, simplifies processing procedure.That is, the cantilever 15 (i.e. assistant strip 170b) of the present embodiment can Directly shaped together with LED filament 100a, eliminating is needed first to complete after LED filament 100a, then cantilever 15 is connected into LED Silk 100a additional process.

In an embodiment, LED filament has the two longitudinal assistant strips axially extended and multiple transverse directions simultaneously Horizontal assistant strip.Horizontal assistant strip extends beyond the width of LED filament and is connected with stem (vertical rod).Now laterally Assistant strip 170b of the assistant strip as shown in Figure 51 D, it may replace the cantilever 15 in Figure 34 and Figure 35 A.Or, it can not also place Horizontal assistant strip, only configures longitudinal assistant strip of multistage, and at least one end of longitudinal assistant strip is bent into L fonts and extended Can be with other end points (examples in stem (vertical rod) or LEDbulb lamp beyond the width range of LED filament, and further Such as:The interface of lamp housing, lamp housing and lamp holder) to fix LED filament.In an embodiment, as shown in Figure 51 E and 51F, in lamp housing Without stem, vertical rod, the head and centre of filament have the electrode formed by light transmitting electro-conductive glue；Filament 100r head and Afterbody is connected to form ring-type；Longitudinal assistant strip with copper material is with supportive and shapeable in filament 100r；Lamp Silk 100r two electrodes are connected with glass fibre and form horizontal assistant strip 170b, and horizontal assistant strip 170b extends filament 100r And it is connected on lamp housing (such as being connected with sintering processing) there is provided the power source path to filament electrode by transparent conductive coat It is formed on horizontal assistant strip 170b and (not shown) in lamp holder can be extended downward into along lamp housing.Now due to filament supports Stem/vertical rod；And the cantilever of anchored filament is replaced by assistant strip 170b, and can by being formed comprising materials such as glass fibres, plus Upper conducting bracket is replaced by the assistant strip 170b and electrically conducting transparent film of printing opacity, therefore can be greatly decreased and be in the light；And promote lamp The overall aesthetic feeling of silk lamp.In an embodiment, on the outside of the electrode of LED filament or/and the assistant strip end extended from filament Junction surface with glass material, to be sintered to fix to lamp housing.In an embodiment, the electricity of upper and LED filament on the inside of lamp housing Pole or/and the assistant strip end extended from filament are respectively formed with male female junction surface, and a such as side is pin or hook-shaped, one Side is perforation, and both again can be fixed both with sintering processing after combining.

In an embodiment, when assistant strip is metal or other thermal conductivity preferably materials, assistant strip can be extended out Radiator outside filament further with stem or LEDbulb lamp is connected, or extends outside LEDbulb lamp and empty with outside Gas is contacted, with profit radiating.

Figure 52 is refer to, Figure 52 is the schematic cross-section of an embodiment of LED filament.Figure 52 LED filament 400a and figure 39A LED filament 400a difference is that Figure 52 LED filament 400a also includes heat dissipation channel 480 and multiple heat emission holes 481. In the present embodiment, heat dissipation channel 480 along LED filament 400a axially through LED filament 400a, and positioned at top layer 420a, But not limited to this.In other embodiments, heat dissipation channel 480 also can lateral direction penetrating LED filament 400a；Or, heat dissipation channel 480 Basic unit 420b can be located at；Or, heat dissipation channel 480 has multiple, and can be distributed in top layer 420a or basic unit 420b.In the present embodiment In, as shown in figure 52, heat emission hole 481 then perpendicular to LED filament 400a axial direction and is opened on LED filament 400a upper surfaces, tool For body, one end of heat emission hole 481 connection heat dissipation channel 480, and the other end of heat emission hole 481 then insertion top layer 420a away from base Layer 420b surface.But heat emission hole opening direction is not limited to this, the side of filament can be also opened on；Or when heat dissipation channel is set When basic unit 420b, heat emission hole also may be disposed at the lower surface of filament, and heat dissipation channel 480 contributes to LED with multiple heat emission holes 481 Filament 400a radiating, for example, in LED filament 400a continuous firings, the air of relative low temperature can be by the two of heat dissipation channel 480 End opening is flowed among LED filament 400a, and carries out heat exchange with LED chip 402,404 and filament electrode 410,412, and The air of relatively-high temperature can be then flowed to outside LED filament 400a by heat emission hole 481, thereby, and air can be inside LED filament 400a With outer loop and convection current, LED filament 400a can be helped efficiently to radiate.In the present embodiment, multiple heat emission holes 481 can Correspond respectively to LED chip 402,404 and set, because LED chip 402,404 is heat production highest group in LED filament 400a Part, is arranged such and is able to preferably improve radiating effect.The generation type of radiating channel/heat emission hole does not limit but can be by such as photetching The mode for carving minus sense rotation optical activity resin forms, with forming thinner heat dissipation channel heat emission hole on arbitrary section.This Outside, configuration/position of radiating channel and heat emission hole can be with bending shape/direction of matched with filaments and the ventilative hole site of lamp housing To adjust, if be for example implemented in Fig. 3 filament, radiating channel can only be configured at the first bending section or the second bending section, And the heat emission hole of filament is configured at the extreme higher position point of filament, and the air-vent of lamp housing is configured in the surface of heat emission hole；Also The installation direction of filament bulb can be taken into account, filament heat emission hole is configured to the extreme higher position point of the filament after installing, this When lamp housing air-vent can fit the installation direction of bulb and be provided close to lamp holder side/lamp housing top/lamp housing side.In an embodiment In, air-vent can be replaced with the radiating area of lamp housing, and radiating area can select the higher transparency material formation of thermal conductivity and (for example first make Opening, which is further filled with, is mixed with the light transmissive materials such as the resin or glass of radiating particle, and the citing of radiating particle can be fine for graphite, ceramics, carbon The translucency such as dimension, aluminum oxide, magnesia, Nano Silver preferably highly heat-conductive material).It is foregoing in LEDbulb lamp in an embodiment Central way of the filling selected from nitrogen/helium/hydrogen gas also can set the way of ventilation mouth to be combined with lamp housing.For example, with radiating The LED filament of passage sets heat emission hole in two ends, and the heat emission hole at two ends is connected with two ventilation mouths on lamp housing respectively so that Heat dissipation channel in LED filament is directly contacted with extraneous air, but closed state is still maintained in lamp housing.Now in closed Inserted in lamp housing selected from nitrogen/helium/hydrogen gas, can further promote the radiating in lamp housing.In addition, heat dissipation channel can be with prerequisite Determine to re-form after filament bending shape, in an embodiment, filament have from lower to upper with multiple helical rings up crossover and Into conveyor screw, and in multiple helical rings at least side to contact with each other, the side now contacted with each other in multiple helical rings It is upper to form a heat dissipation channel linear and through multiple helical rings.

Figure 53 is refer to, Figure 53 is the schematic cross-section of another embodiment of LED filament of the present invention.In the present embodiment, Because the LED filament in LEDbulb lamp is in yo-yo pattern is bent, when LED filament is with less angle folding, bending Place may expanded by heating and heated stress influence and become fragile.Therefore, can also suitably it be set near bending place in LED filament Hole or breach are put, to slow down this influence.In an embodiment, shown in such as Figure 53 (LED chip and filament electrode are omitted in figure), Space D 1 is to being predetermined bending place between D2.Top layer 420a is formed by phosphor gel, and basic unit 420b is fluorescent powder membrane.In top layer Multiple holes 468 are set in 420a, it is preferable that hole 468 (top in figure) on the outside of the bending place rises, on the inside of curved at (lower section in figure) hole is bigger, and such embodiment Hole 468 is triangle.When carrying out bending LED filament, by F directions upward Force bending filament, now because space D 1 to multiple holes 468 between D2 causes LED filament easily to bend, the hole of bending place Hole 468 can buffer thermal stress, and be planned according to appropriate void shape and bending angle, can still retain a certain size after bending Hole exist, now hole also have improve radiating effect.In other embodiments, this hole 468 also can with shown in Fig. 7 Heat emission hole 481 and heat dissipation channel 480 combine；Or, the heat emission hole 481 shown in Figure 52 also can be using two ends pore size not Deng structure so that LED filament is easily bent.

Figure 54 A to 54F are refer to, Figure 54 A to 54F show for the line array of the LED chip of multiple embodiments of the invention It is intended to.In an embodiment, LED filament can be sealed the line array of body cladding LED chip and be formed by tubulose, wherein, the pipe Shape envelope body can be that the top layer 420a and basic unit 420b as shown in Figure 39 A is constituted, and LED chip can then include LED grain And positive contact and negative contacts in LED grain, but not limited to this.When tubulose seals liquid adhesive of the body by distribution (polymer being such as coated in LED chip 504) is formed directly on the line array of LED chip 504, has a variety of situations may The quality of LED filament that can be to being made with routing is adversely affected.In routing, using downward pressure, ultrasonic energy with And the combination of hot (in some cases), the two ends that closing line 514 is attached to the Ohmic contact of LED chip 504 are molten to make Contact.LED chip 504 unexpected fragmentation or may be burnt out in routing, if also, surface is dirty or out-of-flatness, LED chip 504 Ohmic contact will include bond strength and LED filament can be made to be damaged by possible.Further, liquid polymeric is worked as Thing is appropriate or is inadequately distributed in and is attached on the closing line of adjacent LED chip 504, may result in engagement dislocation.One It is to pass through tree lace to reduce the connection between this problem, LED chip 504, tree lace is by being continuously coated on phase in a little embodiments Made by conducting resinl between the positive contact and negative contacts of adjacent LED chip 504.Conducting resinl is mixed by by conducting particles Elastic adhesive and formed, conducting particles can be gold or silver.Preferably, conducting particles is by light transmissive material such as Nano Silver, received Made by rice carbon pipe and graphene.In certain embodiments, wavelength convert particle is mixed in conducting resinl to strengthen light conversion.Bullet Property adhesive can be silica gel (silicone), epoxy resin (epoxy) or polyimide resin (ploymide).Preferably, Material for the elastic adhesive of conducting resinl is identical with the material for making tubulose envelope body.Thus, this tree lace is seamlessly to integrate To tubulose Feng Tizhong and can fully with tubulose envelope body it is synchronous extension or compression.Tree lace can with but do not limit for example by possessing three-dimensional shifting The glue sprayer of kinetic force is made.Figure 10 A and 10B is the side view of the line array of LED chip 504, wherein, positive pole A Contact and negative pole C contacts are, for example, the same side for being arranged on LED grain 510.

In Figure 54 A, the tree lace 516 of connection adjacent LED chip 504 generally covers positive pole A contacts and negative pole C contacts All surfaces.In fig. 1 ob, the part of the tree lace 516 covering positive pole A contacts and negative pole C contacts of connection adjacent LED chip 504.Figure 54C and Figure 54 D are the top view of the line array of LED chip 504, wherein, it is brilliant that positive pole A contacts are arranged on LED with negative pole C contacts The same side of grain 510.In Figure 54 A and 54B, tree lace 516 connects adjacent LED chip 504 along straight line.In some embodiments In, tree lace 516 includes the curve of any form, and it is due to absorb possible destructive mechanical energy.Preferably, curve Camber (sinuosity) is 3 to 8.Further, the camber of curve is 2 to 6.

In Figure 54 C, since it is expected that LED filament can be deformed after being stretched or compressed, thus tree lace 516 is designed as Definition has a sigmoid curve between the LED chip 504 of its connection.In Figure 54 D, when positive pole A contacts and negative pole C contacts not Along the major axis of the line array of LED chip 504 it is perfectly aligned when, tree lace 516 for example can LED chip 504 corner turn To complete the electric connection of adjacent LED chip 504.In Figure 10 E, the line array of LED chip 504 includes plural platform 518 To fill up the gap between adjacent LED chip 504.Preferably, platform 518 is made by the identical material for sealing body as making tubulose 's.The upper surface of platform 518 provides continuity passage, allows tree lace 516 to extend to LED core by the positive pole A contacts of LED chip 504 The negative pole C contacts of piece 504.Or, in Figure 54 F, mould 520 is the positive pole A contacts and negative pole C contacts for shining LED chip 504 Profile and make.Under appropriate arrange, the definition of mould 520 has a gap, its be located at mould 520 and LED chip 504 line array it Between.Tree lace 516 is formed by conducting resinl is filled up into this gap.In certain embodiments, LED grain 510 can remove positive pole A Contact and negative pole C contacts (light may be blocked when it is arranged on diode region), thus, tree lace 516 is set to connect LED The p junctions (p-junction) of chip 504 and the n junctions (n-junction) of LED chip 504.In an embodiment, filament Electrode (such as the electrode 110 and 112 in Figure 36 L) is also formed by conducting resinl, and can mixed with wavelength convert particle so that The electrode at filament two ends is no longer in the light, and the overall outward appearance of filament is more consistent.

Figure 55 A to 55C are refer to, Figure 55 A to 55C illustrate for the lateral cross section of the LED filament of multiple embodiments of the invention Figure, the thin portion structure of wherein LED filament refers to aforesaid plurality of embodiment.In one embodiment, the outer surface of tubulose envelope body is set It is equipped with polishing layer.LED filament with glossy surface processing has aesthetic feeling in appearance, however, such a LED filament can be met with entirely The problem of internal reflection (total internal reflection) is with radiating bad.In other embodiments, tubulose envelope body is outer Surface is provided with lines layer (texturized layer), and lines layer can reduce total internal reflection to improve the extraction of light, lines layer Also allowing tubulose to seal body has the surface area bigger than polishing layer to strengthen radiating.In addition, when logical with foregoing radiating in LED filament During road, also lines layer can be formed in the surface of the heat dissipation channel in filament and reach same effect.

Figure 55 A, 55B and 55C are the view in transverse section that tubulose seals body, and wherein Figure 55 A also show that tubulose seals the inside of body, LED chip 1106 is located at the inside that tubulose seals body, and tubulose envelope body includes wavelength conversion layer 1402, clear binder 1404 and turned with light Change particle 1406.For example, in Figure 55 A, lines layer (being located on wavelength conversion layer 1402) is turned by the enough light of closeness Particle 1406 is changed to approach and protrude the outer surface of wavelength conversion layer 1402 and formed.In contrast, in Figure 55 B and 55C, pipe Such as shape envelope body includes exclusive lines layer, and these lines layer respectively has different forms, wedge-shaped or cube shaped.

The various embodiment features of present invention described above, can in the case where not having to be mutually exclusive free combined change, It is not limited in a kind of specific embodiment.Described in embodiment for example shown in Figure 1A, although these features are not in Fig. 1 C Illustrate that LEDbulb lamp also may include to have the component such as plastic lamp base, radiator in shown embodiment, it will be apparent that ability These features without creative can be applied to Fig. 1 C by domain those of ordinary skill according to Figure 1A explanation；In another example, this hair Although bright various creation schemes are illustrated by taking LEDbulb lamp as an example, these obvious designs can be without creation Property be applied in the lamp of other shapes or type, such as LED candle lamp, will not enumerate herein.

The realization of LED filament of the present invention and its each embodiment of manufacture method and LEDbulb lamp is as described above, it is necessary to carry It is awake, for same LED filament or for using the LEDbulb lamp of the LED filament, each implementation described above In example such as " light conversion layer " that is related to, " light conversion layer wraps up the mode of electrode and/or LED chip ", " wire ", " silica gel and/ Or polyimides and/or resin ", " fluorescent material constitutes ratio ", " filament lamp layer structure ", " Wavelength-converting of phosphor gel/film/ Particle size/thickness/light transmittance/hardness/shape ", " hyaline layer ", " fluorescent material composition thermally conductive pathways ", " circuit film ", " oxidation Nano-particle ", " crystal-bonding adhesive ", " LED filament body is wavy ", " stem ", " gas in lamp housing ", " filament assembly ", " conduction The length of support ", " length of the conducting bracket of LED filament ", " it is thin that the surface of cantilever and/or stem can be coated with graphene Film ", " air pressure in lamp housing ", " young's modulus of filament ", " shore hardness of filament basic unit ", " assistant strip ", " lamp housing surface painting Cloth gluing film, diffusion barrier, toning film ", " mixed with light transformational substance in lamp housing/stem/vertical rod ", " lamp housing tool radiating area ", " filament Tool hole or breach ", " there is heat dissipation path in filament ", " curve equation of filament shape ", " air-vent of lamp housing ", " filament Wavy chimeric surface between top layer and basic unit ", " chimeric surface is zigzag ", " perforation of basic unit ", " light conversion layer include first Fluorescent adhesive layer, the second fluorescent adhesive layer and hyaline layer ", " assistant strip is wave-like ", " assistant strip for spiral-shaped ", " multiple auxiliary Help bar laterally and longitudinally to arrange ", " at least one end of longitudinal assistant strip is bent into L fonts ", " LED filament has bending place " and Features such as " hole or breach are suitably set near bending place " in the case where not colliding with each other can include one, two, Multiple or all technical characteristics.Relevant corresponding content system can be selected from one of the technical characteristic included in correspondence embodiment Or its combination.

The present invention has hereinbefore been disclosed with preferred embodiment, and so being familiar with the technology person should be understood that the embodiment It is only used for describing the present invention, and is not construed as limiting the scope of the present invention.It should be noted that such as equivalent with the embodiment Change and displacement, all should be set to be covered by scope of the invention.Therefore, protection scope of the present invention is wanted when with appended right The scope for asking book to be defined is defined.

Claims

1. a kind of LEDbulb lamp, including lamp housing the lamp holder with being connected the lamp housing, it is characterised in that the LEDbulb lamp is also wrapped Include：

At least two conducting brackets, connect the stem；

LED filament, including filament body and two filament electrodes, two filament electrode are located at relative the two of the filament body End, two filament electrode connects two conducting bracket respectively, and the filament body is around the stem；And

Wherein, it is H, institute by the lamp housing bottom to distance between the lamp housing top in the short transverse of the LEDbulb lamp Stating between two filament electrodes has 0 to the first difference in height between 1/10H, and filament body bending rise and fall and with highest Point and minimum point, have the second difference in height, it is high that first difference in height is less than described second between the peak and minimum point Degree is poor, and the scope of second difference in height is 2/10 between 4/10H.

2. LEDbulb lamp as claimed in claim 1, it is characterised in that the filament body is big around the angle of the stem In 270 degree.

3. LEDbulb lamp as claimed in claim 1, it is characterised in that in the short transverse, the institute of the filament body State peak and minimum point all falls within from lamp housing bottom and starts at 1/3 between 4/5H.

4. LEDbulb lamp as claimed in claim 1, it is characterised in that the quantity of the filament body is one, and described LEDbulb lamp is on perspective plane, and two conducting bracket is overlapping, and the filament body crosses over the both sides of the stem, and described Two conducting brackets are located at the wherein side of the stem.

5. LEDbulb lamp as claimed in claim 1, it is characterised in that the filament body configures including multiple formal dress and is in The LED chip of the linear alignment, the filament body corresponds to the multiple LED chip and defines relative main light-emitting surface and secondary hair Smooth surface, the either segment of the main light-emitting surface is in unspecified angle towards the lamp housing or the lamp holder.

6. LEDbulb lamp as claimed in claim 1, it is characterised in that any point of the LED filament is in x, y, z coordinate system X, Y, Z is in position and meet a fitting equation, the origin of the x, y, z coordinate system is located at the top of the stem, the x, Y, the x-y plane of z coordinate system are located at the top of the stem and the vertical short transverse, the z-axis of the x, y, z coordinate system and institute State stem coaxial, two filament electrode is symmetrically distributed in the both sides of the y-axis of the x, y, z coordinate system, the fitting equation For：

X=m1*cos (t*360),

Y=m2*sin (t*360),

Z=n*cos (t*360*k),

Wherein, t is the variable between 0 to 1, and the LED filament is changed in the x, y and z directions according to t；Work as X=0, Shu Y Shu are most Big value is m2, Shu Z Shu maximums=n；Work as Y=0, Shu X Shu maximums are m1, and Shu Z Shu maximums are n；Work as Z=0, Shu X Shu maximums are m1, Shu Y Shu maximums are m2, wherein, m1 represents X-direction length, and m2 represents Y-direction length, and n represents the apogee distance on z directions The height of the x-y plane, K represents the number of the peak position.

7. LEDbulb lamp as claimed in claim 6, it is characterised in that m1 is more than or equal to 24 millimeters and less than or equal to 27 Millimeter, m2 is more than or equal to 24 millimeters and less than or equal to 27 millimeters, and n is more than 0 and less than or equal to 14 millimeters, and k is more than or waited In 2 and less than or equal to 8.

8. LEDbulb lamp as claimed in claim 1, it is characterised in that the filament body includes light conversion layer and multiple LED Chip, the light conversion layer is coated on the multiple LED chip and at least both sides of two filament electrode, the light is changed Layer exposes a part for two filament electrode, and the light conversion layer includes top layer and basic unit, the top layer and the basic unit It is located at the multiple LED chip and at least both sides of two filament electrode respectively, has between the top layer and the basic unit Closed structure.

9. LEDbulb lamp as claimed in claim 8, it is characterised in that the closed structure includes mat surface, the mat surface It is respectively formed on the contact surface between the top layer and the basic unit.

10. LEDbulb lamp as claimed in claim 9, it is characterised in that the closed structure includes wavy interface, The wavy interface is respectively formed on the contact surface between the top layer and the basic unit.