CN107312456B - Composition for protecting liquid crystal circuit and preparation method thereof - Google Patents
Composition for protecting liquid crystal circuit and preparation method thereof Download PDFInfo
- Publication number
- CN107312456B CN107312456B CN201710607997.0A CN201710607997A CN107312456B CN 107312456 B CN107312456 B CN 107312456B CN 201710607997 A CN201710607997 A CN 201710607997A CN 107312456 B CN107312456 B CN 107312456B
- Authority
- CN
- China
- Prior art keywords
- parts
- liquid crystal
- crystal circuit
- solvent
- circuit protection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 37
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 22
- 238000002360 preparation method Methods 0.000 title claims abstract description 5
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229920003048 styrene butadiene rubber Polymers 0.000 claims abstract description 22
- 239000002904 solvent Substances 0.000 claims abstract description 20
- 239000003208 petroleum Substances 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 229910052582 BN Inorganic materials 0.000 claims abstract description 11
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 8
- 239000011737 fluorine Substances 0.000 claims abstract description 8
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 5
- 238000003756 stirring Methods 0.000 claims description 18
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 9
- 239000012046 mixed solvent Substances 0.000 claims description 9
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 claims description 8
- 150000002576 ketones Chemical class 0.000 claims description 8
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 claims description 6
- 239000001045 blue dye Substances 0.000 claims description 5
- 239000007822 coupling agent Substances 0.000 claims description 3
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 125000001153 fluoro group Chemical group F* 0.000 claims description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 11
- 230000004888 barrier function Effects 0.000 abstract description 9
- 230000001681 protective effect Effects 0.000 abstract description 3
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical group CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 16
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 15
- 239000000243 solution Substances 0.000 description 12
- 239000006087 Silane Coupling Agent Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 8
- 239000000741 silica gel Substances 0.000 description 8
- 229910002027 silica gel Inorganic materials 0.000 description 8
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- 229920002633 Kraton (polymer) Polymers 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000007385 chemical modification Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- PGZIKUPSQINGKT-UHFFFAOYSA-N dialuminum;dioxido(oxo)silane Chemical compound [Al+3].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O.[O-][Si]([O-])=O PGZIKUPSQINGKT-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000009396 hybridization Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002135 nanosheet Substances 0.000 description 1
- 229910052575 non-oxide ceramic Inorganic materials 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D191/00—Coating compositions based on oils, fats or waxes; Coating compositions based on derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D157/00—Coating compositions based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D157/02—Copolymers of mineral oil hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/20—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2357/00—Characterised by the use of unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2391/00—Characterised by the use of oils, fats or waxes; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2453/00—Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
- C08J2453/02—Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2457/00—Characterised by the use of unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C08J2457/02—Copolymers of mineral oil hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2491/00—Characterised by the use of oils, fats or waxes; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/14—Gas barrier composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
技术领域technical field
本发明涉及电路保护材料领域,具体地说是一种液晶电路保护用组合物及其制备方法。The invention relates to the field of circuit protection materials, in particular to a liquid crystal circuit protection composition and a preparation method thereof.
背景技术Background technique
随着世界向信息社会的发展,显示器件作为人机对话的关键部件其重要性越来越高,液晶显示、等离子PDP显示、有机发光OLED显示等多种显示器正在蓬勃发展。异方性导电胶膜(Anisotropic Conductive Film;ACF)是以化学粘接的方式将显示器与驱动电路连接起来的材料,通过表面镀有金属层的高分子聚合物微球实现Z方向导电,X-Y方向绝缘,使用简单方便,易自动化操作,是目前柔性连接所不可缺少的关键材料。但是,目前国内厂家的产品的强度、涂膜性、防湿防潮性、粘附性和可剥离性较差,容易断裂,效果不理想。With the development of the world towards an information society, display devices are becoming more and more important as a key component of human-machine dialogue. Various displays such as liquid crystal display, plasma PDP display, and organic light-emitting OLED display are booming. Anisotropic Conductive Film (ACF) is a material that connects the display and the drive circuit by chemical bonding. The Z-direction conductivity is realized through the polymer microspheres coated with a metal layer on the surface, and the X-Y direction is Insulation, easy to use, easy to automate, is an indispensable key material for flexible connections at present. However, the current domestic manufacturers' products have poor strength, film properties, moisture-proof and moisture-proof properties, adhesion and peelability, and are prone to breakage and unsatisfactory results.
发明内容SUMMARY OF THE INVENTION
本发明旨在提供一种液晶电路保护用组合物。The present invention aims to provide a liquid crystal circuit protection composition.
本发明为实现上述目的,采取以下技术方案予以实现:The present invention adopts the following technical solutions to realize the above-mentioned purpose:
一种液晶电路保护用组合物,由以下重量份的组分组成:氢化苯乙烯-丁二烯嵌段共聚物和石油树脂(以下简称SEBS)10~30份、氮化硼0.5~3.6份、环烷油10~20份、主溶剂和辅助溶剂60~70份、含氟助剂0.3~1份。A liquid crystal circuit protection composition is composed of the following components in parts by weight: 10-30 parts of hydrogenated styrene-butadiene block copolymer and petroleum resin (hereinafter referred to as SEBS), 0.5-3.6 parts of boron nitride, 10-20 parts of naphthenic oil, 60-70 parts of main solvent and auxiliary solvent, and 0.3-1 part of fluorine-containing auxiliary agent.
优选地,所述含氟助剂为含氟硅氧烷偶联剂。本发明的液晶电路保护用组合物所形成的膜是不可湿润的,加入含氟硅氧烷偶联剂后可使总平均接触角迅速增大,从而大大地提高体系的疏水性能,从而增加了制成膜的可剥性。Preferably, the fluorine-containing auxiliary agent is a fluorine-containing siloxane coupling agent. The film formed by the liquid crystal circuit protection composition of the present invention is not wettable, and the total average contact angle can be rapidly increased after adding the fluorine-containing siloxane coupling agent, thereby greatly improving the hydrophobic performance of the system, thereby increasing the Strippability of the resulting film.
优选地,所述辅助溶剂为三甲酮醇、丙烯酸羟丙酯中的一种或者两种混合物,所述主溶剂优选为所述主溶剂为甲基环己烷、环己烷或正己烷。加入三甲酮醇、丙烯酸羟丙酯后可使SEBS的甲基环己烷溶液的粘度下降明显,以改善操作性能。Preferably, the auxiliary solvent is one or a mixture of two of trimethylketone alcohol and hydroxypropyl acrylate, and the main solvent is preferably methylcyclohexane, cyclohexane or n-hexane. After adding trimethyl ketone alcohol and hydroxypropyl acrylate, the viscosity of the methylcyclohexane solution of SEBS can be significantly decreased, so as to improve the operation performance.
优选地,所述液晶电路保护用组合物还包括不超过0.5重量份的蓝色染料。这样可以调节所制成的薄膜的颜色。Preferably, the liquid crystal circuit protection composition further comprises not more than 0.5 parts by weight of blue dye. This allows the color of the resulting film to be adjusted.
本发明的另一目的在于公开上述液晶电路保护用组合物的制备方法,包括以下步骤:Another object of the present invention is to disclose the preparation method of the above-mentioned liquid crystal circuit protection composition, comprising the following steps:
S 1:按所述重量份,将氢化苯乙烯-丁二烯嵌段共聚物在65~75℃下干燥4小时以上;S1: according to the weight portion, drying the hydrogenated styrene-butadiene block copolymer at 65-75° C. for more than 4 hours;
S2:搅拌下向辅助溶剂和主溶剂的混合溶剂中加入经步骤S1处理的氢化苯乙烯-丁二烯嵌段共聚物;S2: adding the hydrogenated styrene-butadiene block copolymer processed in step S1 to the mixed solvent of the auxiliary solvent and the main solvent under stirring;
S3:向步骤S2制得混合物中加入其他原料,搅拌至均匀;S3: adding other raw materials to the mixture obtained in step S2, and stirring until uniform;
S4:滤去不溶物,脱泡后分装。S4: filter out the insoluble matter, and pack it after defoaming.
BN是一种人工合成的非氧化物陶瓷材料,它和C2是等电子体,因此和碳单质具有相似的晶体结构,BN特性也有很多,具有抗热振、耐高温、高导热率、抗氧化、高电阻率、高介电性能、自润滑、低密度、耐化学腐蚀、良好的加工性、与多种金属不浸润等优良的物理化学特性。将BN加入到复合材料中不仅可以充分发挥BN陶瓷的优势,同时可以弥补单相BN陶瓷材料机械性能偏低、抗雨蚀性差,得到具有优异综合性能的抗氧化涂层、导热耐热复合材料。BN is a synthetic non-oxide ceramic material. It is an isoelectronic body with C2, so it has a similar crystal structure to carbon. BN has many characteristics, such as thermal shock resistance, high temperature resistance, high thermal conductivity, and oxidation resistance. , High resistivity, high dielectric properties, self-lubricating, low density, chemical corrosion resistance, good processability, non-wetting with various metals and other excellent physical and chemical properties. Adding BN to composite materials can not only give full play to the advantages of BN ceramics, but also make up for the low mechanical properties and poor rain erosion resistance of single-phase BN ceramic materials, and obtain anti-oxidation coatings, thermally conductive and heat-resistant composite materials with excellent comprehensive properties. .
环烷油可以用于提高体系的透光性能,增加体系的透明度。加入增塑剂后可降低SEBS的熔融粘度,利于涂布工艺;增加SEBS的初粘性并改善低温柔软性;并降低成本。Naphthenic oil can be used to improve the light transmittance of the system and increase the transparency of the system. After adding plasticizer, the melt viscosity of SEBS can be reduced, which is beneficial to the coating process; the initial viscosity of SEBS can be increased and the low temperature flexibility can be improved; and the cost can be reduced.
石油树脂起到增粘作用。由于SEBS本身无粘接性,加入石油树脂后可提高内聚力、剥离强度和剪切强度,增加永久粘接强度,降低混合物的熔体粘度,提高被粘材料的浸润性,改善操作性能。Petroleum resin acts as a tackifier. Since SEBS itself has no adhesiveness, the addition of petroleum resin can improve the cohesion, peel strength and shear strength, increase the permanent bonding strength, reduce the melt viscosity of the mixture, improve the wettability of the bonded material, and improve the operating performance.
本发明的液晶电路保护用组合物所需原料易得,在均相物质中加入非均相的物质生产界面,该界面在受到外力冲击时会吸收能力,因此提高了强度,工艺流程简单,性价比高。所使用的溶剂跟助剂环保无毒,生产高效安全,边角余料可回收利用而不影响产品的性能,顺应绿色环保潮流。制得的保护用组合物膜具有以下优点:1、良好的成膜性、适度的柔韧性。2、机械强度优良,耐大气性能卓越。3、良好的阻隔性,制成的薄膜具有优越的防潮性能。The raw materials required for the liquid crystal circuit protection composition of the present invention are easy to obtain, and a heterogeneous material is added to the homogeneous material to produce an interface, which will absorb the ability when it is impacted by external force, so the strength is improved, the technological process is simple, and the cost performance ratio is high. high. The solvents and additives used are environmentally friendly, non-toxic, efficient and safe in production, and the leftover materials can be recycled without affecting the performance of the product, conforming to the trend of green environmental protection. The prepared protective composition film has the following advantages: 1. Good film-forming property and moderate flexibility. 2. Excellent mechanical strength and excellent atmospheric resistance. 3. Good barrier property, the film made has excellent moisture-proof performance.
具体实施方式Detailed ways
本发明实施例中,氢化苯乙烯-丁二烯嵌段共聚物(SEBS)购自台橡(上海)实业有限公司,型号为Kraton G 1650;硅烷偶联剂购自广州市中杰化工科技有限公司,型号为KH-550;石油树脂购自青岛伊森化学有限公司,型号为LH100-1;甲基环己烷购自广州柏延化工有限公司;环烷油购自广州市彬豪化工有限公司。In the embodiment of the present invention, the hydrogenated styrene-butadiene block copolymer (SEBS) is purchased from Taiwan Rubber (Shanghai) Industrial Co., Ltd., the model is Kraton G 1650; the silane coupling agent is purchased from Guangzhou Zhongjie Chemical Technology Co., Ltd. Company, model is KH-550; petroleum resin is purchased from Qingdao Yisen Chemical Co., Ltd., model is LH100-1; methylcyclohexane is purchased from Guangzhou Baiyan Chemical Co., Ltd.; naphthenic oil is purchased from Guangzhou Binhao Chemical Co., Ltd. company.
本发明实施例中,粘度测试按照国标GB12005.1-89进行;力学性能的测定按照国标GB/T528-2009进行;扭矩测试为对样品进行压膜制样后用扭矩测试仪进行;红外光谱分析按照GBT21186-2007傅立叶变换红外光谱仪进行。In the embodiment of the present invention, the viscosity test is carried out according to the national standard GB12005.1-89; the measurement of mechanical properties is carried out according to the national standard GB/T528-2009; the torque test is carried out by using a torque tester after laminating the sample; According to GBT21186-2007 Fourier transform infrared spectrometer.
以下结合具体实施例来对本发明作进一步的说明。The present invention will be further described below in conjunction with specific embodiments.
实施例1Example 1
将SEBS溶于甲基环己烷,制成2g/dl的溶液,测得流出时间t0=147.50s,取出0.01ml,共取10份,向各份中分别滴加乙酸乙酯、乙酸异丁酯、三甲酮醇、甲苯、丙烯酸羟丙酯、丙烯酸丁酯6种不同溶剂,每种溶剂由0.01mL滴加到0.07mL,每次增加0.01mL,测得到各组溶液的平均流出的时间,并根据下式求出溶液的流出时间变化量,其中,为平均流出时间,t0为147.50s,r为流出时间的变化量。结果如表1所示。Dissolve SEBS in methylcyclohexane to make a solution of 2g/dl, measure the outflow time t 0 =147.50s, take out 0.01ml, take a total of 10 parts, and add ethyl acetate and isoacetic acid dropwise to each part. Butyl ester, trimethyl ketone alcohol, toluene, hydroxypropyl acrylate, butyl acrylate 6 different solvents, each solvent was added dropwise from 0.01mL to 0.07mL, each time increased by 0.01mL, and the average outflow time of each group of solutions was measured. , and the outflow time change of the solution is obtained according to the following formula, where, is the average outflow time, t 0 is 147.50s, and r is the variation of outflow time. The results are shown in Table 1.
<表1><Table 1>
可以得出,在SEBS的甲基环己烷溶液中加入三甲酮醇或者丙烯酸羟丙酯后,溶液的粘度下降明显,说明这三种液体适合作为该体系的溶剂;而乙酸乙酯、乙酸异丁酯或者丙烯酸丁酯加入后,混合体系粘度变化不大,不适合作为基础溶液的溶剂;另外,加入甲苯后,混合体系粘度反而增大,起不到降粘作用,更加说明这几类溶液不适合作为基础溶液的溶剂。It can be concluded that after adding trimethyl ketone alcohol or hydroxypropyl acrylate to the methylcyclohexane solution of SEBS, the viscosity of the solution drops significantly, indicating that these three liquids are suitable as the solvent of the system; After the addition of butyl ester or butyl acrylate, the viscosity of the mixed system does not change much, and it is not suitable as a solvent for the basic solution; in addition, after the addition of toluene, the viscosity of the mixed system increases instead, which cannot reduce the viscosity. Not suitable as a solvent for base solutions.
实施例2Example 2
将石油树脂以不同的比例加入SEBS的甲基环己烷溶液中,测试制得的溶液成膜后的力学性能,结果如表2所示。可以得出,随着石油树脂用量的增大,样品断裂总伸长率增大,拉伸强度减小,弹性模量减小,最大拉伸应力减小。一方面是石油树脂的相对分子质量相对橡胶较低,石油树脂分子夹杂在橡胶分子链间起润滑作用,易于链的伸展和运动;另一方面是由于树脂分子链为线形,受到外力易于伸展取向。SEBS与石油树脂共混后变得软而韧,该种混合物成膜以后具有柔韧性强,抗刮性能好和易于整体剥离等优良性能。The petroleum resin was added into the methylcyclohexane solution of SEBS in different proportions, and the mechanical properties of the obtained solution after film formation were tested. The results are shown in Table 2. It can be concluded that with the increase of the amount of petroleum resin, the total elongation at break of the sample increases, the tensile strength decreases, the elastic modulus decreases, and the maximum tensile stress decreases. On the one hand, the relative molecular weight of petroleum resin is relatively low compared to rubber, and the petroleum resin molecules are mixed in the rubber molecular chain to play a lubricating role, which is easy to stretch and move the chain; . After blending with petroleum resin, SEBS becomes soft and tough. After the film is formed, the mixture has excellent properties such as strong flexibility, good scratch resistance and easy overall peeling.
<表2><Table 2>
实施例3Example 3
将环烷油以不同的比例加入SEBS的甲基环己烷溶液中,测试制得的溶液成膜后的力学性能,结果如表3所示。可以得出,加入环烷油后,弹性模量、最大拉伸应力、拉伸强度、断裂总伸长率均减小。当环烷油的加入量从0增大到25%时,SEBS的最大拉伸应力,拉伸强度,弹性模量下降的幅度较大,断裂总伸长率缓慢下降;当环烷油的加入量大于25%时,SEBS的断裂总伸长率从9.3%骤降到6.09%,最大拉伸应力、弹性模量跟拉伸强度呈缓慢下降趋势。The naphthenic oil was added to the methylcyclohexane solution of SEBS in different proportions, and the mechanical properties of the obtained solution after film formation were tested. The results are shown in Table 3. It can be concluded that the elastic modulus, maximum tensile stress, tensile strength and total elongation at break all decrease after adding naphthenic oil. When the addition of naphthenic oil increased from 0 to 25%, the maximum tensile stress, tensile strength and elastic modulus of SEBS decreased greatly, and the total elongation at break decreased slowly; when the addition of naphthenic oil When the amount is more than 25%, the total elongation at break of SEBS drops sharply from 9.3% to 6.09%, and the maximum tensile stress, elastic modulus and tensile strength tend to decrease slowly.
<表3><Table 3>
实施例4Example 4
本实施例的液晶电路保护用组合物由以下步骤制得:The liquid crystal circuit protection composition of the present embodiment is prepared by the following steps:
S1:将10g氢化苯乙烯-丁二烯嵌段共聚物在65~75℃下干燥4小时以上;S1: drying 10 g of hydrogenated styrene-butadiene block copolymer at 65-75° C. for more than 4 hours;
S2:搅拌下向40g三甲酮醇和30g甲基环己烷的混合溶剂中加入经步骤S1处理的氢化苯乙烯-丁二烯嵌段共聚物;S2: add the hydrogenated styrene-butadiene block copolymer processed in step S1 to the mixed solvent of 40 g of trimethyl ketone alcohol and 30 g of methylcyclohexane under stirring;
S3:向步骤S2制得混合物中加入16g石油树脂、10g环烷油、0.3g KH-550型硅烷偶联剂、0.5g氮化硼,搅拌至均匀;S3: add 16g petroleum resin, 10g naphthenic oil, 0.3g KH-550 type silane coupling agent, 0.5g boron nitride to the mixture obtained in step S2, and stir until uniform;
S4:滤去不溶物,脱泡后分装。S4: filter out the insoluble matter, and pack it after defoaming.
实施例5Example 5
本实施例的液晶电路保护用组合物由以下步骤制得:The liquid crystal circuit protection composition of the present embodiment is prepared by the following steps:
S1:将10g氢化苯乙烯-丁二烯嵌段共聚物在65~75℃下干燥4小时以上;S1: drying 10 g of hydrogenated styrene-butadiene block copolymer at 65-75° C. for more than 4 hours;
S2:搅拌下向30g丙烯酸羟丙酯和30g环己烷的混合溶剂中加入经步骤S1处理的氢化苯乙烯-丁二烯嵌段共聚物;S2: add the hydrogenated styrene-butadiene block copolymer processed in step S1 to a mixed solvent of 30 g of hydroxypropyl acrylate and 30 g of cyclohexane under stirring;
S3:向步骤S2制得混合物中加入20g石油树脂、20g环烷油、1g KH-550型硅烷偶联剂、1.7g氮化硼,搅拌至均匀;S3: add 20g of petroleum resin, 20g of naphthenic oil, 1g of KH-550 type silane coupling agent, and 1.7g of boron nitride to the mixture obtained in step S2, and stir until uniform;
S4:滤去不溶物,脱泡后分装。S4: filter out the insoluble matter, and pack it after defoaming.
实施例6Example 6
本实施例的液晶电路保护用组合物由以下步骤制得:The liquid crystal circuit protection composition of the present embodiment is prepared by the following steps:
S1:将10g氢化苯乙烯-丁二烯嵌段共聚物在65~75℃下干燥4小时以上;S1: drying 10 g of hydrogenated styrene-butadiene block copolymer at 65-75° C. for more than 4 hours;
S2:搅拌下向35g三甲酮醇和30g环己烷的混合溶剂中加入经步骤S1处理的氢化苯乙烯-丁二烯嵌段共聚物;S2: adding the hydrogenated styrene-butadiene block copolymer processed in step S1 to a mixed solvent of 35 g of trimethyl ketone alcohol and 30 g of cyclohexane under stirring;
S3:向步骤S2制得混合物中加入14g石油树脂、15g环烷油、0.6g KH-550型硅烷偶联剂、2.6g氮化硼、0.5g蓝色染料,搅拌至均匀;S3: add 14g petroleum resin, 15g naphthenic oil, 0.6g KH-550 silane coupling agent, 2.6g boron nitride, 0.5g blue dye to the mixture obtained in step S2, and stir until uniform;
S4:滤去不溶物,脱泡后分装。S4: filter out the insoluble matter, and pack it after defoaming.
实施例7Example 7
本实施例的液晶电路保护用组合物由以下步骤制得:The liquid crystal circuit protection composition of the present embodiment is prepared by the following steps:
S1:将10g氢化苯乙烯-丁二烯嵌段共聚物在65~75℃下干燥4小时以上;S1: drying 10 g of hydrogenated styrene-butadiene block copolymer at 65-75° C. for more than 4 hours;
S2:搅拌下向30g三甲酮醇和35g正己烷的混合溶剂中加入经步骤S1处理的氢化苯乙烯-丁二烯嵌段共聚物;S2: add the hydrogenated styrene-butadiene block copolymer processed in step S1 to a mixed solvent of 30 g of trimethyl ketone alcohol and 35 g of n-hexane under stirring;
S3:向步骤S2制得混合物中加入10g石油树脂、13g环烷油、0.7g KH-550型硅烷偶联剂、1.5g氮化硼、0.08g蓝色染料,搅拌至均匀;S3: add 10g petroleum resin, 13g naphthenic oil, 0.7g KH-550 type silane coupling agent, 1.5g boron nitride, 0.08g blue dye to the mixture obtained in step S2, stir until uniform;
S4:滤去不溶物,脱泡后分装。S4: filter out the insoluble matter, and pack it after defoaming.
实施例8Example 8
本实施例的液晶电路保护用组合物由以下步骤制得:The liquid crystal circuit protection composition of the present embodiment is prepared by the following steps:
S1:将10g氢化苯乙烯-丁二烯嵌段共聚物在65~75℃下干燥4小时以上;S1: drying 10 g of hydrogenated styrene-butadiene block copolymer at 65-75° C. for more than 4 hours;
S2:搅拌下向32g三甲酮醇和35g正己烷的混合溶剂中加入经步骤S1处理的氢化苯乙烯-丁二烯嵌段共聚物;S2: add the hydrogenated styrene-butadiene block copolymer processed in step S1 to the mixed solvent of 32 g of trimethyl ketone alcohol and 35 g of n-hexane under stirring;
S3:向步骤S2制得混合物中加入15g石油树脂、18g环烷油、0.9g KH-550型硅烷偶联剂、3.6g氮化硼、0.08g蓝色染料,搅拌至均匀;S3: add 15g petroleum resin, 18g naphthenic oil, 0.9g KH-550 silane coupling agent, 3.6g boron nitride, 0.08g blue dye to the mixture obtained in step S2, and stir until uniform;
S4:滤去不溶物,脱泡后分装。S4: filter out the insoluble matter, and pack it after defoaming.
对比例1Comparative Example 1
本实施例的液晶电路保护用组合物由以下步骤制得:The liquid crystal circuit protection composition of the present embodiment is prepared by the following steps:
S1:将10g氢化苯乙烯-丁二烯嵌段共聚物在65~75℃下干燥4小时以上;S1: drying 10 g of hydrogenated styrene-butadiene block copolymer at 65-75° C. for more than 4 hours;
S2:搅拌下向30g丙烯酸羟丙酯和30g环己烷的混合溶剂中加入经步骤S1处理的氢化苯乙烯-丁二烯嵌段共聚物;S2: add the hydrogenated styrene-butadiene block copolymer processed in step S1 to a mixed solvent of 30 g of hydroxypropyl acrylate and 30 g of cyclohexane under stirring;
S3:向步骤S2制得混合物中加入20g石油树脂、20g环烷油、1g KH-550型硅烷偶联剂、搅拌至均匀;S3: add 20g petroleum resin, 20g naphthenic oil, 1g KH-550 type silane coupling agent to the mixture obtained in step S2, and stir until uniform;
S4:滤去不溶物,脱泡后分装。S4: filter out the insoluble matter, and pack it after defoaming.
对比例2Comparative Example 2
本实施例的液晶电路保护用组合物由以下步骤制得:The liquid crystal circuit protection composition of the present embodiment is prepared by the following steps:
S1:将10g氢化苯乙烯-丁二烯嵌段共聚物在65~75℃下干燥4小时以上;S1: drying 10 g of hydrogenated styrene-butadiene block copolymer at 65-75° C. for more than 4 hours;
S2:搅拌下向30g丙烯酸羟丙酯和30g环己烷的混合溶剂中加入经步骤S1处理的氢化苯乙烯-丁二烯嵌段共聚物;S2: add the hydrogenated styrene-butadiene block copolymer processed in step S1 to a mixed solvent of 30 g of hydroxypropyl acrylate and 30 g of cyclohexane under stirring;
S3:向步骤S2制得混合物中加入20g石油树脂、20g环烷油、1g KH-550型硅烷偶联剂、1.7g硅酸铝(Al2SiO5),搅拌至均匀;S3: add 20g petroleum resin, 20g naphthenic oil, 1g KH-550 type silane coupling agent, 1.7g aluminum silicate (Al 2 SiO 5 ) to the mixture obtained in step S2, and stir until uniform;
S4:滤去不溶物,脱泡后分装。S4: filter out the insoluble matter, and pack it after defoaming.
效果实施例Effect Example
将实施例5、对比例1和对比例2的组合物制成薄膜,然后封住装有变色硅胶的瓶子,放置150天,观察瓶中变色硅胶的颜色变化,结果如表4所示。The compositions of Example 5, Comparative Example 1 and Comparative Example 2 were made into films, and then the bottle containing the color-changing silica gel was sealed and placed for 150 days to observe the color change of the color-changing silica gel in the bottle. The results are shown in Table 4.
表4无机填料对保护膜水蒸气阻隔性的影响Table 4 Influence of inorganic fillers on water vapor barrier properties of protective films
通过表4可以看出,未增强的SEBS薄膜对自然条件下的水蒸气阻隔性较差,30天内,已有少量水蒸气透过薄膜进入瓶内,硅胶颜色由深蓝变为蓝,90天后,进入瓶内的水蒸气增多,硅胶变为浅蓝色,到150天时,硅胶由原来的深蓝变为浅紫红,说明薄膜的水蒸气透过性好,不利于起到阻隔保护的作用。当加入填料增强后,薄膜的水蒸气阻隔性明显变好,加入硅酸铝后,经过90天,硅胶颜色才由深蓝变为蓝,150天后变为浅蓝,与原来相比,硅胶颜色变化时间增加,说明大大提升了材料的阻隔性;而当加入氮化硼后,薄膜的阻隔性得到了更为显著的提升,硅胶从深蓝变为蓝,经过了150天的长时间跨度,效果比前两者都要好。这主要得益于氮化硼特殊的纳米片状结构,经表面化学修饰改性后,加入到体系中与SEBS进行有机-无机杂化,依靠其片层结构所表现出来的阻隔性大大降低材料对湿气的透过率。由于氮化硼的直径非常小,达到纳米级别,填充到高聚物材料中会利用其纳米效应提高材料的综合性能。It can be seen from Table 4 that the unreinforced SEBS film has poor water vapor barrier properties under natural conditions. Within 30 days, a small amount of water vapor penetrated the film and entered the bottle, and the color of the silica gel changed from dark blue to blue. After 90 days, The water vapor entering the bottle increased, and the silica gel turned light blue. At 150 days, the silica gel changed from the original dark blue to light purple, indicating that the water vapor permeability of the film was good, which was not conducive to the role of barrier protection. When the filler is added to enhance, the water vapor barrier of the film is obviously improved. After adding aluminum silicate, the color of the silica gel changed from dark blue to blue after 90 days, and changed to light blue after 150 days. Compared with the original, the color of the silica gel changed. The increase of time indicates that the barrier property of the material is greatly improved; and when boron nitride is added, the barrier property of the film is more significantly improved, and the silica gel changes from dark blue to blue. After a long time span of 150 days, the effect is better than The first two are better. This is mainly due to the special nano-sheet structure of boron nitride. After chemical modification on the surface, it is added to the system for organic-inorganic hybridization with SEBS. The barrier properties of the lamellar structure greatly reduce the material. Transmittance to moisture. Since the diameter of boron nitride is very small, reaching the nanometer level, filling it into the polymer material will use its nanometer effect to improve the overall performance of the material.
上述实施例为本发明较佳的实施方式,但本发明的实施方式并不受上述实施例的限制,其他的任何未背离本发明的精神实质与原理下所作的改变、修饰、替代、组合、简化,均应为等效的置换方式,都包含在本发明的保护范围之内限制本发明之权利范围。The above-mentioned embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited by the above-mentioned embodiments, and any other changes, modifications, substitutions, combinations, The simplification should be an equivalent replacement manner, and all are included within the protection scope of the present invention to limit the scope of the right of the present invention.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710607997.0A CN107312456B (en) | 2017-07-24 | 2017-07-24 | Composition for protecting liquid crystal circuit and preparation method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710607997.0A CN107312456B (en) | 2017-07-24 | 2017-07-24 | Composition for protecting liquid crystal circuit and preparation method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107312456A CN107312456A (en) | 2017-11-03 |
CN107312456B true CN107312456B (en) | 2020-08-18 |
Family
ID=60178526
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710607997.0A Expired - Fee Related CN107312456B (en) | 2017-07-24 | 2017-07-24 | Composition for protecting liquid crystal circuit and preparation method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107312456B (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102757709A (en) * | 2011-04-26 | 2012-10-31 | 奇美实业股份有限公司 | Moisture-proof insulating paint and application thereof |
CN103571125A (en) * | 2012-07-31 | 2014-02-12 | 中国石油化工股份有限公司 | Elastomer nylon coating material as well as preparation method thereof |
CN104650687A (en) * | 2013-11-21 | 2015-05-27 | 奇美实业股份有限公司 | Moisture-proof Insulating Paint And Application Thereof |
CN105980505A (en) * | 2014-01-22 | 2016-09-28 | 株式会社钟化 | Polyolefin resin composition for hot melt adhesive, hot melt adhesive film, and laminate |
CN106318101A (en) * | 2015-06-30 | 2017-01-11 | 奇美实业股份有限公司 | moisture-proof insulating paint and application thereof |
-
2017
- 2017-07-24 CN CN201710607997.0A patent/CN107312456B/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102757709A (en) * | 2011-04-26 | 2012-10-31 | 奇美实业股份有限公司 | Moisture-proof insulating paint and application thereof |
CN103571125A (en) * | 2012-07-31 | 2014-02-12 | 中国石油化工股份有限公司 | Elastomer nylon coating material as well as preparation method thereof |
CN104650687A (en) * | 2013-11-21 | 2015-05-27 | 奇美实业股份有限公司 | Moisture-proof Insulating Paint And Application Thereof |
CN105980505A (en) * | 2014-01-22 | 2016-09-28 | 株式会社钟化 | Polyolefin resin composition for hot melt adhesive, hot melt adhesive film, and laminate |
CN106318101A (en) * | 2015-06-30 | 2017-01-11 | 奇美实业股份有限公司 | moisture-proof insulating paint and application thereof |
Also Published As
Publication number | Publication date |
---|---|
CN107312456A (en) | 2017-11-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN110591371A (en) | High-adhesion heat-conducting silica gel capable of being formed in situ and preparation method thereof | |
TWI518155B (en) | Visible light with a hidden temperature insulation coating | |
CN106554728A (en) | Pressure-sensitive Protection glue band of a kind of butyl rubber base and preparation method thereof | |
WO2017070921A1 (en) | Two-component, addition-type, anti-sedimenttation conductive silicone rubber and preparation method thereof | |
CN102993893B (en) | Coating composition and application thereof | |
JP5791623B2 (en) | Moisture-proof insulation material | |
CN116376491A (en) | High-toughness epoxy sealant and preparation method thereof | |
CN107312456B (en) | Composition for protecting liquid crystal circuit and preparation method thereof | |
CN111777993B (en) | Silicon-free heat-conducting paste and preparation method thereof | |
JP5623094B2 (en) | Moisture-proof insulating paint for mounting circuit boards and electronic components | |
CN101307132B (en) | Epoxy resins modified by silanol hydroxyl or alkoxyl blocking silicone resin and method for preparing same | |
JP2009263448A (en) | Inorganic particle-containing resin composition and inorganic layer using the same | |
CN107501852A (en) | Composition for protecting liquid crystal circuit and preparation method thereof | |
CN109890118B (en) | Static suppressor with static protection function | |
TWI512062B (en) | Moisture-proof and insulating coating material and uses thereof | |
CN114907804A (en) | High-temperature-resistant high-thermal-conductivity high-reflection flame-retardant structural adhesive and application thereof | |
CN103102696B (en) | Impregnating and encapsulating wax for circuit board of water meter and preparation method and application thereof | |
JP2011162576A (en) | Moisture-proof insulation coating for packaging circuit board | |
WO2015098424A1 (en) | Method of temporary protection of substrate including wiring formed with transparent conductive film | |
CN118755447B (en) | A kind of wiring harness cement and preparation method thereof | |
CN108587560B (en) | Resinated organic silicon electronic packaging adhesive composition | |
CN115449323B (en) | High-performance magnetic steel bonding epoxy adhesive and preparation method thereof | |
CN107345112B (en) | A kind of thermal interface material and preparation method thereof | |
CN108690550A (en) | A kind of formula and preparation method thereof of weaving high temperature resistant water washing polyamide hot-melt adhesive | |
CN118755426A (en) | A kind of hot and cold shock resistant epoxy potting glue and preparation method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200818 |