CN107293536A - light emitting diode packaging structure and manufacturing method thereof - Google Patents

Abstract

The invention provides a light emitting diode package structure, which comprises a carrier, a light emitting diode chip, a first annular retaining wall, a second annular retaining wall and a fluorescent glue. The light emitting diode chip is electrically connected to the carrier. The first annular retaining wall and the second annular retaining wall are arranged around the light emitting diode chip, and the second annular retaining wall is arranged between the light emitting diode chip and the first annular retaining wall. The fluorescent colloid is arranged on the loader and at least covers the light-emitting diode chip and the second annular retaining wall, and the fluorescent colloid comprises at least one fluorescent powder and at least one colloid which are mixed, wherein the fluorescent powder is distributed on the surface of the light-emitting diode chip.

Description

Light-emitting diode packaging structure and manufacturing method thereof

This application was filed on June 13, 2012, with the application number "201210194908.1" and the divisional application of the Chinese invention patent application titled "Light-emitting diode packaging structure and its manufacturing method"

technical field

The present invention relates to a packaging structure and a manufacturing method thereof, and in particular to a light emitting diode packaging structure and a manufacturing method thereof.

Background technique

Light-emitting diode is a light-emitting element composed of semiconductor materials containing III-V elements, and light-emitting diodes have advantages such as long life, small size, high shock resistance, low heat generation and low power consumption, so they have been widely used Indicators or light sources in household and various equipment. In recent years, light-emitting diodes have developed towards multi-color and high brightness, so their application fields have been extended to large outdoor signage, traffic lights and related fields. In the future, light-emitting diodes may even become the main lighting source with both power saving and environmental protection functions.

For example, most of the current packaging methods for high-power white light emitting diodes use blue light emitting diodes combined with yellow phosphors. White light-emitting diodes emit white light because their light-emitting diode chips emit blue light. After the blue light passes through the yellow phosphor, it will be converted into yellow light, and the yellow light converted by the yellow phosphor is mixed with the unconverted blue light. white light. Since the blue light emitted by the light-emitting diode has a certain degree of directivity, the light intensity of the blue light that deviates from the optical axis at a larger angle is weaker, and the intensity of the yellow light that deviates from the optical axis at a larger angle is greater than that of the blue light. . In this way, a yellow halo will be produced at the edge of the illumination range of the lighting fixture. In addition, white light emitting diodes that use blue light diodes and yellow phosphor powder are often unevenly distributed on the chip due to the uneven distribution of yellow phosphor powder in the manufacturing process, which also causes a circle of yellow light around the periphery of the emitted white light, which is the yellow halo phenomenon. (yellowish halo), so as to affect the color uniformity of the light emitted by the white light emitting diode.

Therefore, in the past, in order to solve the problem of yellow halo, whitening agents were usually added to phosphors to reduce the occurrence of yellow halos. The whitening agents are white particles or glass particles, which can scatter the light beams of LEDs and reduce yellow halos. Degree. In contrast, the addition of whitening agents often sacrifices the overall light extraction efficiency of the LED, and cannot produce any improvement in the performance of color rendering.

Contents of the invention

The invention provides a light emitting diode packaging structure, which can exhibit better optical performance.

The present invention provides a method for manufacturing a light emitting diode packaging structure, which is used to manufacture the above light emitting diode packaging structure.

The invention provides a light emitting diode packaging structure, which includes a carrier, at least one light emitting diode chip, a first annular retaining wall, a second annular retaining wall and a fluorescent colloid. The carrier has a carrying area and a peripheral area surrounding the carrying area. The light emitting diode chip is arranged in the carrying area of the carrier and is electrically connected to the carrier. The first annular retaining wall is disposed in the peripheral area of the carrier and surrounds the LED chip. The second annular retaining wall is disposed inside the first annular retaining wall and surrounds the LED chip, wherein the height of the second annular retaining wall is lower than that of the first annular retaining wall. And, the fluorescent colloid is arranged on the carrier and at least covers the light-emitting diode chip and the second annular retaining wall, wherein the fluorescent colloid includes at least one phosphor powder and at least one colloid, and the phosphor powder is distributed on the on the surface of the LED chip.

In another embodiment of the present invention, there is a distance between the first annular retaining wall and the second annular retaining wall, and a groove is defined on the carrier, and the fluorescent colloid is filled in the groove.

In yet another embodiment of the present invention, the carrier is integrally formed with the first annular retaining wall or the second annular retaining wall.

In yet another embodiment of the present invention, the first annular retaining wall or the second annular retaining wall is a discontinuous annular retaining wall.

In yet another embodiment of the present invention, the LED packaging structure further includes a plurality of strip-shaped retaining walls. The strip-shaped retaining wall is arranged on the carrier and connected to the second annular retaining wall, wherein the strip-shaped retaining wall and the second annular retaining wall define a plurality of grid-shaped grooves on the carrier, and the light-emitting diodes The chip is arranged in the grid-shaped groove.

The present invention proposes another LED packaging structure, which includes a carrier, a plurality of LED chips, a ring-shaped retaining wall, a plurality of strip-shaped retaining walls, and a fluorescent colloid. The LED chip is disposed on the carrier and electrically connected to the carrier. The annular retaining wall is configured on the carrier and surrounds the LED chips. The strip-shaped retaining wall is arranged on the carrier and connected to the annular retaining wall, wherein the strip-shaped retaining wall and the annular retaining wall define a plurality of grid-shaped grooves on the carrier, and the LED chips are arranged in the lattice-shaped grooves . The fluorescent colloid is arranged on the carrier, filled in the grid-shaped grooves and covers at least the light-emitting diode chip, wherein the fluorescent colloid includes at least one phosphor powder and at least one colloid, and the phosphor powder is distributed on the light-emitting diode chip on the surface.

In yet another embodiment of the present invention, the plurality of strip-shaped retaining walls are connected to each other to define a plurality of sub-annular retaining walls, wherein the plurality of sub-annular retaining walls are arranged on the carrier and respectively surround the light-emitting diode chips .

In yet another embodiment of the present invention, the height of the annular retaining wall is the same as that of each strip retaining wall.

In yet another embodiment of the present invention, the height of each strip-shaped retaining wall is lower than that of the annular retaining wall.

In yet another embodiment of the present invention, the carrier is integrally formed with the annular retaining wall or the strip-shaped retaining wall.

In yet another embodiment of the present invention, the light-emitting diode chip is electrically connected to the carrier through flip-chip bonding technology.

In yet another embodiment of the present invention, the LED chip is electrically connected to the carrier through wire bonding technology.

In yet another embodiment of the present invention, the material of the carrier includes ceramics, polymers or metals.

In yet another embodiment of the present invention, the material of the first annular retaining wall and the second annular retaining wall include silicon, silicon oxide, boron nitride, rubber, organic polymer material or metal.

The invention provides a method for manufacturing a light-emitting diode packaging structure, which includes the following steps. A carrier is provided, wherein the carrier has a carrying area and a peripheral area surrounding the carrying area. At least one light-emitting diode chip is arranged in the carrying area of the carrier, and the light-emitting diode chip is electrically connected to the carrier. A first annular retaining wall is formed in the peripheral area of the carrier. A second annular retaining wall is formed in the peripheral area of the carrier, wherein the second annular retaining wall surrounds the LED chip and is arranged inside the first annular retaining wall, and the height of the second annular retaining wall is lower than the first annular retaining wall the height of the wall. Filling a fluorescent colloid on the carrier to at least cover the light-emitting diode chip and the second annular retaining wall, wherein the fluorescent colloid includes at least one kind of fluorescent powder mixed with at least one colloid, and the fluorescent powder is dispersed on the colloid. Afterwards, a centrifugation process is performed to make the fluorescent powder in the fluorescent colloid settle on the surface of the LED chip. Finally, place the oven for baking and setting.

In another embodiment of the present invention, there is a distance between the first annular retaining wall and the second annular retaining wall, a groove is defined on the carrier, and the fluorescent colloid is filled in the groove.

In another embodiment of the present invention, the manufacturing method of the LED packaging structure further includes: forming a plurality of strip-shaped retaining walls, which are arranged on the carrier and connected to the second annular retaining wall, wherein the strip-shaped retaining walls A plurality of grid-shaped grooves are defined on the carrier together with the second annular retaining wall, and the light-emitting diode chips are arranged in the grid-shaped grooves.

In another embodiment of the present invention, the carrier is integrally formed with the first annular retaining wall or the second annular retaining wall.

In another embodiment of the present invention, the first annular retaining wall or the second annular retaining wall is a discontinuous annular retaining wall.

The present invention further proposes a method for manufacturing a light emitting diode packaging structure, which includes the following steps. A carrier is provided. A plurality of LED chips are arranged on the carrier, and the LED chips are electrically connected to the carrier. An annular retaining wall is formed on the carrier, wherein the annular retaining wall surrounds the LED chip. A plurality of strip-shaped retaining walls are formed on the carrier, wherein the strip-shaped retaining walls are connected to the annular retaining wall, and the strip-shaped retaining walls and the annular retaining wall define a plurality of grid-like grooves on the carrier, and the LED chips are arranged on In the lattice groove. Filling a fluorescent colloid in a loading area of the carrier, wherein the fluorescent colloid fills the grid-shaped grooves and at least covers the light-emitting diode chip, and the fluorescent colloid is formed by mixing at least one phosphor powder and at least one colloid, And the fluorescent powder is dispersed in the colloid. A centrifugation process is performed to settle the fluorescent powder in the fluorescent colloid on the surface of the LED chip. Finally, an oven is placed to perform a baking procedure.

In another embodiment of the present invention, the strip-shaped retaining walls are connected to each other to define a plurality of sub-annular retaining walls, wherein the plurality of sub-annular retaining walls are disposed on the carrier and respectively surround the LED chips.

In another embodiment of the present invention, the step of filling the fluorescent colloid in the carrying area of the carrier includes: filling the fluorescent colloid into the grid-shaped grooves in sequence, so that an upper surface of the fluorescent colloid is in contact with the annular groove. A top surface of the retaining wall and a top surface of each strip retaining wall have the same height.

In another embodiment of the present invention, the step of filling the fluorescent colloid in the carrying area of the carrier includes: randomly filling the fluorescent colloid into a part of the grid-shaped grooves; and performing a centrifugation procedure to make the fluorescent colloid The colloid flows to both sides to fill the grid-shaped grooves, and the fluorescent colloid covers a top surface of each bar-shaped retaining wall.

In another embodiment of the present invention, the carrier is integrally formed with the annular retaining wall or the strip-shaped retaining wall.

In another embodiment of the present invention, the annular retaining wall is a discontinuous annular retaining wall.

In another embodiment of the present invention, in the manufacturing method of the light-emitting diode packaging structure, the method of arranging each light-emitting diode chip on the carrier is electrically connected to the carrier through flip-chip welding technology.

In another embodiment of the present invention, in the manufacturing method of the light-emitting diode packaging structure, the method of arranging each light-emitting diode chip on the carrier is to electrically connect with the carrier through wire bonding technology.

In another embodiment of the present invention, the material of the carrier includes ceramics, polymers or metals.

In another embodiment of the present invention, the material of the first annular retaining wall and the second annular retaining wall include silicon, silicon oxide, boron nitride, rubber, organic polymer material or metal.

Based on the above, since the light-emitting diode packaging structure of the present invention has the design of the first annular retaining wall and the second annular retaining wall, and the phosphor powder of the fluorescent colloid is distributed on the surface of the light-emitting diode chip, it can effectively avoid the light-emitting diode The occurrence of the yellow halo phenomenon on the side wall of the packaging structure can effectively improve the overall luminous efficiency.

Description of drawings

In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, wherein:

FIG. 1A is a schematic cross-sectional view of an LED packaging structure according to an embodiment of the present invention.

FIG. 1B is a schematic top view of the LED package structure in FIG. 1A .

FIG. 1C is a schematic cross-sectional view of a light emitting diode packaging structure according to another embodiment of the present invention.

FIG. 1D is a schematic top view of a LED packaging structure according to an embodiment of the present invention.

FIG. 2A is a schematic cross-sectional view of a light emitting diode packaging structure according to another embodiment of the present invention.

FIG. 2B is a schematic top view of the LED package structure in FIG. 2A .

FIG. 2C is a schematic cross-sectional view of an LED packaging structure according to another embodiment of the present invention.

FIG. 3 is a schematic flowchart of a manufacturing method of a light emitting diode packaging structure according to an embodiment of the present invention.

FIG. 4A is a schematic cross-sectional view of a light emitting diode packaging structure according to another embodiment of the present invention.

FIG. 4B is a schematic top view of the LED package structure in FIG. 4A .

FIG. 4C is a schematic cross-sectional view of an LED packaging structure according to another embodiment of the present invention.

FIG. 4D is a schematic top view of a light emitting diode package structure according to another embodiment of the present invention.

FIG. 5 is a schematic flowchart of a method for manufacturing a light emitting diode packaging structure according to another embodiment of the present invention.

Description of main component symbols:

100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h: LED packaging structure

110, 110a: carrier

112: Bearing area

114: Surrounding area

120a, 120b: LED chips

125: wire

130a: First circular retaining wall

130b: Secondary ring retaining wall

130c: Ring retaining wall

131: top surface

132: top surface

140a, 140b: second annular retaining wall

140c, 140d, 140e: strip retaining wall

141, 143: top surface

150: fluorescent colloid

151: upper surface

152: fluorescent powder

154: colloid

C, C': lattice groove

D: Spacing

H1, H2, H3, H4: Height

S10～S16, S20～S26: steps

U: Groove

detailed description

FIG. 1A is a schematic cross-sectional view of an LED packaging structure according to an embodiment of the present invention. FIG. 1B is a schematic top view of the LED package structure in FIG. 1A . Please refer to FIG. 1A and FIG. 1B at the same time. In this embodiment, the LED packaging structure 100a includes a carrier 110, at least one LED chip 120a (only one is schematically shown in FIG. 1A and FIG. 1B ), a first The annular retaining wall 130 a , a second annular retaining wall 140 a and a fluorescent glue 150 .

In detail, the carrier 110 has a carrying area 112 and a peripheral area 114 surrounding the carrying area 112 . Here, the material of the carrier 110 is, for example, ceramics, high molecular polymer, silicon, silicon carbide, insulating material or metal, wherein when the material of the carrier 110 is metal, the carrier 110 can be a copper substrate or a metal core Printed circuit board (Metal Core Printed Circuit Board, MCPCB), but not limited thereto.

The LED chip 120 a is disposed in the carrying area 112 of the carrier 110 and is electrically connected to the carrier 110 . In this embodiment, the LED chip 120a is electrically connected to the carrier 110 through the flip-chip bonding technique. That is to say, the LED packaging structure 100 of this embodiment is a surface mounted device type (SMD type) LED packaging structure. Here, the LED chip 120a is illustrated by taking a blue LED chip as an example, but not limited thereto.

The first annular retaining wall 130a is disposed in the peripheral region 114 of the carrier 110 and surrounds the LED chip 120a. The second annular retaining wall 140 a is disposed inside the first annular retaining wall 130 a, is also located in the peripheral area 114 of the carrier 110 , and surrounds the LED chips 120 . In particular, in this embodiment, the second annular retaining wall 140a is disposed between the LED chip 120a and the first annular retaining wall 130a, and the height H2 of the second annular retaining wall 140a is lower than that of the first annular retaining wall 130a. Height H1. In addition, the material of the first annular retaining wall 130a and the material of the second annular retaining wall 140a are, for example, silicon, silicon oxide, boron nitride, rubber, organic polymer material or metal, wherein the material of the first annular retaining wall 130a can be the same as The materials of the second annular retaining wall 140a are the same or different, which is not limited here. Furthermore, both the first annular retaining wall 130 a and the second annular retaining wall 140 a in this embodiment have the property of not absorbing light and having a reflective function. Here, the first annular retaining wall 130a and the second annular retaining wall 140a are both a continuous annular retaining wall.

The fluorescent glue 150 is disposed on the carrier 110 and covers at least the LED chip 120a and the second annular retaining wall 140a. In particular, the fluorescent colloid 150 of this embodiment includes at least one phosphor 152 and at least one colloid 154, that is, the fluorescent colloid 150 of this embodiment is composed of at least one phosphor 152 and at least one The colloid 154 is mixed, and the phosphor powder 152 is distributed on the surface of the LED chip 120a. Here, the fluorescent powder 152 is, for example, yellow fluorescent powder, red fluorescent powder, green fluorescent powder or any combination of the above fluorescent powders, but not limited thereto. In addition, a light diffusing agent (not shown) may also be added to the fluorescent gel 150 to adjust optical effects such as color or uniformity of the light emitted by the LED packaging structure 100a.

More specifically, in this embodiment, as shown in FIG. 1A , there is a distance D between the second annular retaining wall 140 a and the first annular retaining wall 130 a, and a groove U is defined on the carrier 110 . In this embodiment, the fluorescent colloid 150 is filled in the groove U, and the phosphor powder 152 is distributed on the bottom surface of the groove U and the top surface of the second annular retaining wall 140a.

Since the light emitting diode packaging structure 100a of this embodiment has the design of the first annular retaining wall 130a and the second annular retaining wall 140a, and the phosphor powder 152 of the fluorescent colloid 150 is distributed on the surface of the light emitting diode chip 120a, part of the phosphor The light powder 152 is distributed on the bottom surface of the groove U and the top surface of the second annular retaining wall 140a. Therefore, the surrounding area of the light emitting diode chip 120a (that is, the peripheral area 114 of the carrier 110) will not accumulate too much phosphor 152, and the idle space in the peripheral area 114 of the carrier 110 can be reduced, so that more phosphors can be used. The light powder 152 is distributed on the surface of the LED chip 120a. Therefore, when the colored light (such as blue light or ultraviolet light) emitted by the directional light-emitting diode chip 120a irradiates the phosphor powder 152 distributed thereon, the fluorescent powder 152 is excited to emit colored light (such as yellow light or red light). When mixed with the colored light (such as blue light or ultraviolet light) emitted by the LED chip 120a, it can effectively prevent the phosphor powder 152 stacked more in the peripheral area 114 from being excited by the LED chip 120a to produce a yellow halo phenomenon. .

Moreover, since both the first annular retaining wall 130a and the second annular retaining wall 140a have the characteristics of not absorbing light and having a reflective function, when the colored light (for example, blue light) emitted by the LED chip 120a is irradiated onto the groove U When the fluorescent powder 152 is inside, the first annular retaining wall 130a and the second annular retaining wall 140a can cause the colored light to reflect and scatter, and then make the reflected colored light and scattered colored light irradiate into the carrying area 112, which can effectively improve the LED package. The light output brightness of the structure 100a. In short, the light emitting diode packaging structure 100a of this embodiment can exhibit better optical performance.

It is worth mentioning that this embodiment does not limit the connection form of the light-emitting diode chip 120a and the carrier 110, although the light-emitting diode chip 120a mentioned here is embodied to be electrically connected to the carrier 110 through flip-chip bonding. sexual connection. However, in other embodiments, please refer to FIG. 1C , the light emitting diode chip 120b of the light emitting diode package structure 100b can also be electrically connected to the carrier 110 by wire bonding through a plurality of wires 125, which still belongs to the present invention. The technical solutions that can be adopted do not depart from the scope of protection intended by the present invention. Furthermore, although the carrier 110, the first annular retaining wall 130a and the second annular retaining wall 140a are independent components in this embodiment, in other unillustrated embodiments, the carrier 110 and the first annular retaining wall The retaining wall 130a can also be an integrally formed structure, wherein the material of the carrier 110 and the first annular retaining wall 130a are all made of metal, for example; or, the carrier 110 and the second annular retaining wall 140a are integrally formed. The material of the carrier 110 and the material of the second annular retaining wall 140a are, for example, metal.

Although the shape of the second annular retaining wall 140a in this embodiment is the same as that of the first annular retaining wall 130a, they are both a continuous annular retaining wall. However, in other embodiments, please refer to FIG. 1D, the second annular retaining wall 140b of the LED package structure 100c can also be a discontinuous annular retaining wall, and the first annular retaining wall 130a can also be It is a discontinuous annular retaining wall (not shown), which still belongs to the applicable technical solution of the present invention and does not depart from the intended protection scope of the present invention. In addition, in other unillustrated embodiments, those skilled in the art can refer to the description of the above-mentioned embodiments, and select the above-mentioned components, materials of the components, types and configurations of the components according to actual needs, so as to achieve desired technical effect.

FIG. 2A is a schematic cross-sectional view of a light emitting diode packaging structure according to another embodiment of the present invention. FIG. 2B is a schematic top view of the LED package structure in FIG. 2A . The present embodiment follows the reference numerals and partial contents of the previous embodiments, wherein the same reference numerals are used to denote the same or similar components, and descriptions of the same technical contents are omitted. For the description of the omitted part, reference may be made to the foregoing embodiments, and this embodiment will not be repeated.

Please refer to FIG. 2A and FIG. 2B at the same time. The LED packaging structure 100d in FIG. 2A and FIG. 2B is similar to the LED packaging structure 100a in FIG. 1A and FIG. 100d includes a plurality of LED chips 120a, wherein the LED chips 120a are electrically connected to the carrier 110 through flip-chip bonding technology. The LED package structure 100d here is, for example, a chip-on-board (COB) type LED package structure. In addition, the phosphor powder 152 of the fluorescent colloid 150 is distributed on the surfaces of the LED chips 120a and in the gaps between the LED chips 120a. Certainly, as shown in FIG. 2A , the fluorescent gel 150 can also be filled in the groove U defined on the carrier 110 , and the phosphor powder 152 is distributed in the groove U and the top surface of the second annular retaining wall 140 a.

Since the light-emitting diode chip 120a of this embodiment is electrically connected to the carrier 110 by flip-chip bonding technology, the reserved wiring area between multiple light-emitting diode chips 120a can be saved, so it can be placed on the carrier 110 per unit area. More light-emitting diode chips 120a are configured, so that a larger number of chips can be configured, which can effectively improve the light output brightness of the light-emitting diode package structure 100d. Furthermore, since the LED packaging structure 100a of this embodiment has the design of the first annular retaining wall 130a and the second annular retaining wall 140a, and the fluorescent powder 152 of the fluorescent colloid 150 is distributed on the LED chip 120a In the gap between the surface and each chip 120a, and in the gap between the top surface of the second annular barrier 140a and the first annular barrier 130a and the second annular barrier 140a. Therefore, the surrounding area of the LED chip 120a (that is, the peripheral area 114 of the carrier 110) will not accumulate too much phosphor 152, which not only reduces the idle space in the peripheral area 114 of the carrier 110, but also due to the first Both the annular retaining wall 130a and the second annular retaining wall 140a have the characteristics of not absorbing light and having a reflective function, so the top surface of the second annular retaining wall 140a and the gap between the first annular retaining wall 130a and the second annular retaining wall 140a The fluorescent powder 152 accumulated in the interior is less likely to be excited by the LED chip 120a, which can effectively avoid the yellow halo phenomenon in the peripheral area 114.

In addition, because both the first annular retaining wall 130a and the second annular retaining wall 140a have the characteristics of not absorbing light and having a reflective function, so reflecting and scattering the colored light generated by the LED chip 120a into the carrying area 112 can effectively improve The light output brightness of the LED packaging structure 100d. In short, the LED packaging structure 100d of this embodiment can exhibit better optical performance.

It is worth mentioning that this embodiment does not limit the connection form of the light emitting diode chip 120a and the carrier 110, although the light emitting diode chip 120a mentioned here is embodied in the way of flip chip bonding and The carrier 110 is electrically connected. However, in other embodiments, please refer to FIG. 2C , the light emitting diode chip 120b of the light emitting diode package structure 100e can also be electrically connected to the carrier 110 by wire bonding through a plurality of wires 125, which still belongs to The technical solutions that can be adopted in the present invention do not depart from the scope of protection intended by the present invention.

In addition, although the carrier 110, the first annular retaining wall 130a and the second annular retaining wall 140a are independent components in this embodiment, in other unillustrated embodiments, the carrier 110 and the first annular retaining wall The wall 130a can also be an integral structure, wherein the material of the carrier 110 and the first annular retaining wall 130a are all made of metal, for example; or, the carrier 110 and the second annular retaining wall 140a can also be an integral structure , wherein the material of the carrier 110 and the material of the second annular retaining wall 140a are, for example, metal.

Although the shape of the second annular retaining wall 140a shown in FIG. 2B of this embodiment is the same as that of the first annular retaining wall 130a, that is, both are a continuous annular retaining wall. However, in other unillustrated embodiments, the second annular retaining wall can also be a discontinuous annular retaining wall (please refer to FIG. 1D ), and the first annular retaining wall 130a can also be It may be a discontinuous annular retaining wall (not shown), which still belongs to the applicable technical solution of the present invention, and does not depart from the intended protection scope of the present invention.

The above only introduces the structures of the LED packaging structures 100a, 100b, 100c, 100d, and 100e of the present invention, but does not introduce the manufacturing methods of the LED packaging structures 100a, 100b, 100c, 100d, and 100e of the present invention. In this regard, an embodiment will be used to describe the fabrication method of the structures of the LED packaging structures 100 a , 100 b , 100 c , 100 d , and 100 e in detail.

FIG. 3 is a schematic flowchart of a manufacturing method of a light emitting diode packaging structure according to an embodiment of the present invention. Please refer to FIG. 3 , and refer to the diagrams of FIGS. 1A to 1D and FIGS. 2A to 2C at the same time.

According to the manufacturing method of the light emitting diode package structure of this embodiment, firstly, step S10 , providing a carrier 110 , wherein the carrier 110 has a carrying area 112 and a peripheral area 114 surrounding the carrying area 112 . Here, the material of the carrier 110 is, for example, ceramics, high molecular polymer, silicon, silicon carbide, insulating material or metal, wherein when the material of the carrier 110 is metal, the carrier 110 can be a copper substrate or a metal core Printed circuit board (Metal Core Printed Circuit Board, MCPCB), but not limited thereto.

Next, step S11 , disposing at least one LED chip 120 a (or 120 b ) in the carrying area 112 of the carrier 110 , and the LED chip 120 a (or 120 b ) is electrically connected to the carrier 110 . Here, the LED chip 120a (or 120b ) is electrically connected to the carrier 110 through flip-chip (or wire bonding) technology.

Next, step S12 , forming a first annular retaining wall 130 a in the peripheral area 114 of the carrier 110 .

Next, step S13 , forming a second annular retaining wall 140 a (or 140 b ) in the peripheral area 114 of the carrier 110 . In particular, the second annular retaining wall 140a (or 140b) surrounds the LED chip 120a (or 120b) and is disposed inside the first annular retaining wall 130a. Between 130a. The height H2 of the second annular retaining wall 140a (or 140b ) is lower than the height H1 of the first annular retaining wall 130a. Here, more specifically, there is a distance D between the second annular retaining wall 140 a (or 140 b ) and the first annular retaining wall 130 a, and a groove U is defined on the carrier 110 . The material of the first annular retaining wall 130a and the material of the second annular retaining wall 140a (or 140b) have the characteristics of not absorbing light and having a reflective function, such as silicon, silicon oxide, boron nitride, rubber, organic polymer material or metal , wherein the material of the first annular retaining wall 130a may be the same as or different from that of the second annular retaining wall 140a (or 140b ), which is not limited here. In this embodiment, the first annular retaining wall 130a and the second annular retaining wall 140a (or 140b ) can be a continuous annular retaining wall, or can be changed into discontinuous annular retaining walls.

It should be noted that, in this embodiment, the formation order of the first annular retaining wall 130 a and the second annular retaining wall 140 a (or 140 b ) is not limited. That is to say, the first annular retaining wall 130a can be formed first, and then the second annular retaining wall 140a (or 140b); The retaining wall 140a (or 140b ) is on the carrier 110 ; or, the first annular retaining wall 130a is formed after the second annular retaining wall 140a (or 140b ) is formed first, which is not limited here. In addition, the method of forming the first annular retaining wall 130a and the second annular retaining wall 140a (or 140b) may include performing a dispensing process through a glue dispenser (not shown) (at this time, the first annular retaining wall 130a and The material of the second annular retaining wall 140a (or 140b) is, for example, rubber) or formed through photolithography, etching and electroplating procedures (at this time, the first annular retaining wall 130a and the second annular retaining wall 140a (or 140b) material such as metal).

Afterwards, step S14, filling a fluorescent colloid 150 on the carrier 110 to at least cover the LED chip 120a (or 120b) and the second annular retaining wall 140b, wherein the fluorescent colloid 150 includes at least one phosphor 152 and at least one A colloid 154 is mixed, and the fluorescent powder 152 is dispersed in the colloid 154 . It should be noted that, the method of filling the fluorescent gel 150 is, for example, a dispensing process through a dispensing machine (not shown). In order to avoid the inconsistency of the sedimentation speed of the fluorescent powder 152 in the fluorescent colloid 150 during the dispensing process, the fluorescent colloid 150 is usually doped with an anti-precipitation agent, such as silicon dioxide (SiO ₂ ) (not shown). ). Furthermore, a light diffusing agent (not shown) may also be added to the fluorescent colloid 150 to adjust optical effects such as the color or uniformity of the light emitted by the LED packaging structure 100a.

Next, in step S15 , a centrifugation process is performed so that the fluorescent powder 152 in the fluorescent colloid 150 settles on the surface of the LED chip 120 (or 120 b ). Here, the centrifugation process is implemented by using a centrifuge (not shown), and the fluorescent powder 152 dispersed in the colloid 154 is distributed on the surface of the LED chip 120 (or 120b) through the centrifugal force of the centrifuge. The phosphor powder 152 is evenly distributed on the surface of the light-emitting diode chip 120 (or 120b), so as to avoid the uneven thickness of the phosphor powder 152 accumulation, which will affect the optical effect, or cause excessive phosphor powder 152 accumulation to the carrier 110 The peripheral area 114 of the wall produces a yellow halo phenomenon on the side wall. Of course, during the centrifugal process, the phosphor powder 152 may also be filled in the groove U due to the centrifugal force.

Finally, in step S16 , place an oven to perform a baking process to cure the fluorescent glue 150 , and complete the fabrication of the LED packaging structures 100 a , 100 b , 100 c , 100 d , 100 e.

In this embodiment, after the centrifugation process is performed first, that is, the phosphor powder 152 in the fluorescent colloid 150 is distributed on the surface of the LED chip 120 (or 120 b ), the baking process is performed. Compared with the known baking process after the fluorescent colloid is filled, the chromaticity coordinates of the LED packaging structures 100a, 100b, 100c, 100d, and 100e in this embodiment are not easy to shift or increase (elongated). ), which can be more concentrated and have better chroma performance. In addition, air bubbles in the fluorescent colloid 150 can also be detached through the centrifugation process, so that the formed LED packaging structures 100a, 100b, 100c, 100d, 100e have better optical performance.

FIG. 4A is a schematic cross-sectional view of a light emitting diode packaging structure according to another embodiment of the present invention. FIG. 4B is a schematic top view of the LED package structure in FIG. 4A . The present embodiment follows the reference numerals and partial contents of the previous embodiments, wherein the same reference numerals are used to denote the same or similar components, and descriptions of the same technical contents are omitted. For the description of the omitted part, reference may be made to the foregoing embodiments, and this embodiment will not be repeated.

Please refer to FIG. 4A and FIG. 4B at the same time. The light emitting diode packaging structure 100f of this embodiment includes a carrier 110a, a plurality of light emitting diode chips 120a, an annular retaining wall 130c, a plurality of strip retaining walls 140c and a fluorescent colloid 150 . The material of the carrier 110a is, for example, ceramics, polymer or metal. When the material of the carrier 110a is metal, the carrier 110a can be a copper substrate or a metal core printed circuit board (Metal Core Printed CircuitBoard, MCPCB). , but not limited to this. In this embodiment, the LED chip 120a is disposed on the carrier 110a and electrically connected to the carrier 110a, wherein the LED chip 120a is electrically connected to the carrier 110a through flip-chip bonding technology. The annular retaining wall 130c is disposed on the carrier 110a and surrounds the LED chips 120a.

The strip-shaped retaining wall 140c is disposed on the carrier 110a and connected to the annular retaining wall 130c, wherein the strip-shaped retaining wall 140c and the annular retaining wall 130c define a plurality of grid-shaped grooves C on the carrier 110a, and the LED chips 120a are respectively Set in the lattice groove C. In another embodiment, please refer to FIG. 4D , the strip-shaped retaining walls 140e of the LED packaging structure 100h can also be connected to each other to define a plurality of sub-annular retaining walls 130b, and the sub-annular retaining walls 130b are disposed on the carrier 110a And they respectively surround each light emitting diode chip 120a, and define a plurality of grid-like grooves C'. Please refer to FIG. 4A and FIG. 4B again, the fluorescent colloid 150 is disposed on the carrier 110a, and is filled in the grid-shaped groove C and covers at least the LED chip 120a, wherein the fluorescent colloid 150 includes at least one phosphor 152 and at least one colloid 154, and the phosphor powder 152 is distributed on the surface of the LED chip 120a. More specifically, in this embodiment, the height H3 of the ring-shaped retaining wall 130c is substantially the same as the height H4 of each strip-shaped retaining wall 140c, wherein the strip-shaped retaining wall 140c is composed of continuous strip-shaped retaining walls ( That is, the retaining wall in the vertical axis direction in FIG. 4B) and discontinuous bar-shaped retaining walls (ie, the retaining wall in the horizontal axis direction in FIG. 4B), but it is not limited thereto. The material of the annular retaining wall 130c and the material of each strip retaining wall 140c is, for example, silicon, silicon oxide, boron nitride, rubber, organic polymer material or metal.

Since the light-emitting diode chip 120a of this embodiment is electrically connected to the carrier 110a by flip-chip bonding technology, the reserved wiring area between multiple light-emitting diode chips 120a can be saved, so it can be placed on the carrier 110a in a unit area. More light-emitting diode chips 120a are configured, so that a larger number of chips can be configured, which can effectively improve the light output brightness of the light-emitting diode package structure 100h. Furthermore, since the light emitting diode packaging structure 100f of this embodiment has a collocation design of the ring-shaped retaining wall 130c and the strip-shaped retaining wall 140c, the idle space on the carrier 110a can be reduced, thereby reducing the accumulation of excess phosphor 152 The gap between the ring-shaped retaining wall 130c and the strip-shaped retaining wall 140c makes it less likely to be excited by the light-emitting diode chip 120a, so that the yellow halo phenomenon on the side wall can be effectively avoided. In addition, since the ring-shaped retaining wall 130c and the strip-shaped retaining wall 140c in this embodiment have the characteristics of not absorbing light and having a reflective function, they can reflect and scatter the colored light generated by the LED chip 120a, which can effectively improve the performance of the LED. The light output brightness of the package structure 100h. In short, the LED packaging structure 100h of this embodiment can exhibit better optical performance.

It is worth mentioning that this embodiment does not limit the connection form of the light emitting diode chip 120a and the carrier 110a, although the light emitting diode chip 120a mentioned here is embodied in the way of flip chip bonding and The carrier 110a is electrically connected. However, in other unillustrated embodiments, the light emitting diode chip of the light emitting diode packaging structure can also be electrically connected to the carrier by wire bonding, which still belongs to the technical solution that can be adopted in the present invention, and does not Deviating from the intended protection scope of the present invention. Furthermore, although the carrier 110a, the annular retaining wall 130c and the bar-shaped retaining wall 140c are independent components in this embodiment, in other unillustrated embodiments, the carrier 110a and the annular retaining wall 130c can also be An integrally formed structure, wherein the material of the carrier 110a and the material of the first annular retaining wall 130c are all made of metal; or, the carrier 110a and the strip-shaped retaining wall 140c can also be an integrally formed structure, wherein The material of the device 110a and the strip-shaped retaining wall 140c are all made of metal, for example. In addition, although the height H4 of the bar-shaped retaining wall 140c in this embodiment is substantially the same as the height H3 of the annular retaining wall 130c, in other embodiments, please refer to FIG. The height H5 of the retaining wall 140d may also be lower than the height H3 of the annular retaining wall 130a, which still belongs to the applicable technical solution of the present invention and does not depart from the intended protection scope of the present invention. In addition, in other unillustrated embodiments, those skilled in the art may refer to the description of the above-mentioned embodiments, and select the above-mentioned elements, materials of the elements, types of elements and their configurations according to actual needs, so as to achieve desired technical effect.

The above only introduces the structures of the LED packaging structures 100h and 100i of the present invention, but does not introduce the manufacturing method of the LED packaging structures 100h and 100i of the present invention. In this regard, an embodiment will be used to describe the fabrication method of the structures of the LED packaging structures 100h and 100i in detail below.

FIG. 5 is a schematic flowchart of a method for manufacturing a light emitting diode packaging structure according to another embodiment of the present invention. Please refer to FIG. 5 and refer to the diagrams of FIGS. 4A to 4C at the same time. According to the manufacturing method of the light emitting diode packaging structure of this embodiment, firstly, in step S20, a carrier 110a is provided. Here, the material of the carrier 110a is, for example, ceramics, polymer or metal. When the material of the carrier 110a is metal, the carrier 110a can be a copper substrate or a metal core printed circuit board (Metal Core Printed Circuit Board). Board, MCPCB), but not limited to this.

Next, step S21 , disposing a plurality of LED chips 120 a on the carrier 110 , and the LED chips 120 a are electrically connected to the carrier 110 a. Here, the LED chips 120a are electrically connected to the carrier 110a through the flip-chip bonding technique. Certainly, in other unillustrated embodiments, these LED chips are electrically connected to the carrier through wire bonding technology.

Next, step S22, forming an annular retaining wall 130c on the carrier 110a, wherein the annular retaining wall 130c surrounds the LED chip 120a.

Next, step S23 , forming a plurality of bar-shaped retaining walls 140c (or 140d ) on the carrier 110a. The strip-shaped retaining wall 140c (or 140d) is connected to the annular retaining wall 130c, and the strip-shaped retaining wall 140c (or 140d) and the annular retaining wall 130c define a plurality of grid-shaped grooves C on the carrier 110a, and the LED chips 120a Set in the lattice groove C. Here, the height H4 (or H5) of the bar-shaped retaining wall 140c (or 140d) is the same as (or lower than) the height H3 of the annular retaining wall 130c. The material of the ring-shaped retaining wall 130c and the material of the bar-shaped retaining wall 140c (or 140d ) have characteristics of non-absorbing and reflective properties, such as silicon, silicon oxide, boron nitride, rubber, organic polymer material or metal. In this embodiment, the material of the ring-shaped retaining wall 130c may be the same as or different from that of the bar-shaped retaining wall 140c (or 140d ), which is not limited here. Here, the annular retaining wall 130c is a continuous annular retaining wall, and the strip-shaped retaining wall 140c (or 140d) may be a combination of a continuous strip-shaped retaining wall and a discontinuous strip-shaped retaining wall.

It should be noted that, in this embodiment, the forming order of the ring-shaped retaining wall 130c and the strip-shaped retaining wall 140c (or 140d ) is not limited. That is to say, the annular retaining wall 130c can be formed first, and then the bar-shaped retaining wall 140c (or 140d) can be formed; ) on the carrier 110a; or, after forming the bar-shaped retaining wall 140c (or 140d) and the carrier 110a integrally, and then forming the annular retaining wall 130c, it is not limited here. In addition, the method of forming the ring-shaped retaining wall 130c and the strip-shaped retaining wall 140c (or 140d) may include performing a dispensing process through a glue dispenser (not shown) (at this time, the annular retaining wall 130c and the strip-shaped retaining wall 140c (or 140d ) is made of rubber, for example) or formed by photolithography, etching and electroplating (in this case, the material of the ring-shaped retaining wall 130c and the bar-shaped retaining wall 140c (or 140d ) is, for example, metal).

Afterwards, step S24, filling a fluorescent gel 150 in a carrying area of the carrier 110a (that is, the area where the LED chip 120a is disposed), wherein the fluorescent gel 150 fills the grid-shaped groove C and at least covers the LED chip 120a. The fluorescent colloid package 150 is formed by mixing at least one phosphor powder 152 and at least one colloid 154 , and the phosphor powder 152 is dispersed in the colloid 154 . It should be noted that, the method of filling the fluorescent gel 150 is, for example, a dispensing process through a dispensing machine (not shown). In order to avoid the inconsistency of the sedimentation speed of the fluorescent powder 152 in the fluorescent colloid 150 during the dispensing process, the fluorescent colloid 150 is usually doped with an anti-precipitation agent, such as silicon dioxide (SiO ₂ ) (not shown). ). Furthermore, a light diffusing agent (not shown) may also be added to the fluorescent gel 150 to adjust optical effects such as color or uniformity of the light emitted by the LED packaging structure 100a.

More specifically, in this embodiment, when the height H4 of these strip-shaped retaining walls 140c is the same as the height H3 of the annular retaining wall 130c, the step of filling the carrying area of the carrier 110a with the fluorescent gel 150 may include: Fill the fluorescent colloid 150 into the grid-shaped groove C in sequence, so that an upper surface 151 of the fluorescent colloid 150 is at the same height as a top surface 131 of the annular retaining wall 130a and a top surface 141 of each bar-shaped retaining wall 140a , please refer to Figure 4A. In another embodiment, when the height H5 of these bar-shaped retaining walls 140d is lower than the height H3 of the annular retaining wall 130c, the step of filling the carrying area of the carrier 110a with the fluorescent gel 150 includes: placing the fluorescent gel 150 Fill a part of the grid-shaped groove C arbitrarily, and then directly perform the centrifugation procedure of the subsequent step S23, so that the fluorescent colloid 150 flows to both sides to fill the grid-shaped groove C, and the fluorescent colloid 150 covers each strip Please refer to FIG. 4C for a top surface 143 of the retaining wall 140d.

Next, in step S25 , a centrifugation procedure is performed to settle the fluorescent powder 152 in the fluorescent colloid 150 on the surfaces of the LED chips 120 a. Here, the centrifugation process is realized by using a centrifuge (not shown). The centrifugal force of the centrifuge will settle the fluorescent powder 152 dispersed in the colloid 154 on the surface of these LED chips 120, so as to avoid excessive The fluorescent powder 152 accumulated on the idle space of the carrier 110a produces a yellow halo phenomenon on the side wall.

Finally, in step S26 , an oven is placed to perform a baking process to cure the fluorescent glue 150 , and complete the fabrication of the LED packaging structures 100f , 100g , 100h , 100i .

In this embodiment, after the centrifugation process is performed first, that is, the phosphor powder 152 in the fluorescent colloid 150 is distributed on the surfaces of the LED chips 120a, and then the baking process is performed. Compared with the known baking process after the fluorescent colloid is filled, the chromaticity coordinates of the light emitting diode packaging structures 100f, 100g, 100h, and 100i of this embodiment are not easy to shift or increase (elongate), That is, it can be more concentrated and have better chroma performance. Furthermore, when the ring-shaped retaining wall 130c has the same height as the strip-shaped retaining walls 140c, the phenomenon of concave glue can be effectively avoided during the centrifugation process. In addition, the air bubbles in the fluorescent colloid 150 can also be removed through the centrifugation process, so that the formed LED packaging structures 100f, 100g, 100h, and 100i have better optical performance.

To sum up, the light emitting diode chip of the present invention can be electrically connected to the carrier by flip-chip welding technology, so more light emitting diode chips can be placed on the carrier per unit area, that is, there are more chips, The light output brightness of the light emitting diode packaging structure can be effectively improved. Furthermore, since the light emitting diode packaging structure of this embodiment has the matching design of the first annular retaining wall and the second annular retaining wall, the collocation design of the annular retaining wall, the annular retaining wall and the strip retaining wall, and the fluorescent colloid The light powder is distributed on the surface of the LED chip. Therefore, too much fluorescent powder will not gather around the LED packaging structure, and the idle space on the carrier can be reduced, so that more fluorescent powder can be distributed on the surface of the LED chip, so that the edge can be effectively avoided. The wall produces a yellow halo phenomenon. In addition, since the first annular retaining wall, the second annular retaining wall, the annular retaining wall and the bar-shaped retaining wall all have the characteristics of not absorbing light and having a reflective function, they can reflect and scatter the colored light generated by the LED chip, which can effectively improve The light output brightness of the light emitting diode package structure. In short, the LED packaging structure of the present invention can exhibit better optical performance.

In addition, the present invention settles the fluorescent powder dispersed in the colloid of the fluorescent colloid onto the surface of the light-emitting diode chip through the centrifugal force of the centrifuge, so that the fluorescent powder can be evenly distributed on the surface of the light-emitting diode chip, To avoid the uneven thickness of the phosphor accumulation and distribution, which will affect the optical effect, or cause the yellow halo phenomenon on the side wall due to excessive phosphor accumulation in the idle space of the carrier. Furthermore, in this embodiment, after the centrifugation process is performed first, that is, the phosphor powder in the fluorescent colloid is distributed on the surface of the LED chip, and then the baking process is performed. Compared with the known baking process after filling the fluorescent colloid, the chromaticity coordinates of the light emitting diode packaging structure of the present invention are not easy to shift or increase (elongate), that is, it can be more concentrated, and can have more Good color performance. In addition, when the annular retaining wall and the strip retaining wall have the same height, the phenomenon of concave glue can be effectively avoided during the centrifugation process. In addition, the air bubbles in the fluorescent colloid can also be detached through the centrifugation process, so that the formed LED packaging structure has better optical performance.

It is worth mentioning that, in the above-mentioned embodiment, the retaining wall can be a closed ring or a non-closed ring, wherein the closed ring is, for example, a quadrangle, a circle, an ellipse, an egg, a star or other polygons , and the non-closed loop is, for example, an arc, a line or a random changing curve. In particular, the shape of the wall can correspond to the shape of the LED chip, that is, the shape of the wall is conformal to the shape of the LED.

In the above embodiment, the first annular retaining wall is a continuous annular retaining wall, and its height can be equal or unequal.

In the above embodiment, the second annular retaining wall is a continuous annular retaining wall, and its height can be equal or unequal.

In the above embodiment, the first annular retaining wall may be a discontinuous annular retaining wall, and the height may be equal or unequal. In an embodiment, the second annular retaining wall may be a discontinuous annular retaining wall, and the height may be of equal or unequal height.

In the above embodiments, the first annular retaining wall may be a reflective material, or a non-reflective material coated with a reflective material.

In the above embodiments, the second annular retaining wall may be a reflective material, or a non-reflective material coated with a reflective material.

In the above-mentioned embodiment, the phosphor concentration distribution will vary with the height of the LED chip, the height of the first annular barrier, the height of the second annular barrier, the distance between the LED chip and the first annular barrier, the first annular barrier The distance between the retaining wall and the second annular retaining wall varies.

In the above embodiments, the concentration of phosphor powder increases or decreases gradually from the surface of the fluorescent colloid to the surface of the LED chip.

In the above embodiments, the concentration of phosphor powder gradually increases or decreases from the surface of the LED chip to the side of the LED chip.

In the above embodiment, when the concentration of phosphor powder gradually increases or decreases from the surface of the fluorescent colloid to the surface of the LED chip, the concentration of phosphor powder gradually increases or decreases from the surface of the LED chip to the side of the LED chip.

Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection should be defined by the claims.

Claims (21)

1. A light-emitting diode packaging structure, comprising: A carrier having a carrying area and a peripheral area surrounding the carrying area; A plurality of light emitting diode chips are arranged in the carrying area of the carrier and electrically connected to the carrier; A first annular retaining wall is disposed in the peripheral area of the carrier and surrounds the light emitting diode chips; A second annular retaining wall is arranged inside the first annular retaining wall and surrounds the light emitting diode chips, wherein the height of the second annular retaining wall is lower than the height of the first annular retaining wall and higher than the height of the first annular retaining wall the height of the LED chip; and a glue, arranged on the carrier and covering at least the LED chip and the second annular retaining wall; Wherein the first annular retaining wall and the second annular retaining wall both have the characteristics of not absorbing light and having a reflective function. 2 . The LED packaging structure according to claim 1 , wherein there is a distance between the first annular retaining wall and the second annular retaining wall, and a groove is defined on the carrier. 3 . The LED packaging structure according to claim 1 , wherein the carrier is integrally formed with the first annular retaining wall or the second annular retaining wall. 4 . 4. The light emitting diode packaging structure according to claim 1, wherein the first annular barrier wall or the second annular barrier wall is a discontinuous annular barrier wall. 5. The LED packaging structure according to claim 1, further comprising: A plurality of strip-shaped retaining walls are arranged on the carrier and connected to the second annular retaining wall, wherein the strip-shaped retaining walls and the second annular retaining wall define a plurality of lattice-shaped grooves on the carrier, The light emitting diode chips are arranged in the grid-shaped grooves. 6. A light-emitting diode packaging structure, comprising: A carrier having a carrying area and a peripheral area surrounding the carrying area; At least one light emitting diode chip is arranged in the carrying area of the carrier and electrically connected to the carrier; A first annular retaining wall is disposed in the peripheral area of the carrier and surrounds the LED chip; A second annular retaining wall is disposed on the inner side of the first annular retaining wall, there is a gap between the second annular retaining wall and the first annular retaining wall, and a groove is defined on the carrier; and A fluorescent colloid is arranged on the carrier and covers at least the LED chip, wherein the fluorescent colloid includes at least one phosphor powder and at least one colloid, and the phosphor powder is distributed in the gap. 7 . The light emitting diode packaging structure according to claim 6 , wherein the carrier is integrally formed with the first annular retaining wall or the second annular retaining wall. 8 . The light emitting diode packaging structure according to claim 6 , wherein the first annular retaining wall or the second annular retaining wall is a discontinuous annular retaining wall. 9. The light emitting diode packaging structure according to claim 6, wherein the height of each strip-shaped retaining wall is lower than the height of the annular retaining wall. 10. The LED packaging structure according to claim 6, further comprising: A plurality of strip-shaped retaining walls are arranged on the carrier and connected to the second annular retaining wall, wherein the strip-shaped retaining walls and the second annular retaining wall define a plurality of lattice-shaped grooves on the carrier, The light emitting diode chips are arranged in the grid-shaped grooves. 11. The light emitting diode package structure according to any one of claims 1 to 10, wherein each light emitting diode chip is electrically connected to the carrier through a flip-chip soldering technique. 12. The light emitting diode package structure according to any one of claims 1 to 10, wherein each light emitting diode chip is electrically connected to the carrier through a wire bonding technique. 13. The LED package structure according to any one of claims 1-10, wherein the material of the carrier includes ceramics, polymers or metals. 14. The LED packaging structure according to any one of claims 1 to 5, wherein the material of the first annular retaining wall and the material of the second annular retaining wall include silicon, silicon oxide, boron nitride , organic polymer materials or metals. 15. A method for manufacturing a light emitting diode packaging structure, comprising: providing a carrier, wherein the carrier has a carrying area, and a peripheral area surrounding the carrying area; configuring at least one light emitting diode chip in the carrying area of the carrier, and the light emitting diode chip is electrically connected to the carrier; forming a first annular retaining wall in the peripheral area of the carrier; A second annular retaining wall is formed in the peripheral area of the carrier, the second annular retaining wall surrounds the LED chip and is arranged inside the first annular retaining wall, wherein the first annular retaining wall and the second annular retaining wall There is a space between the annular retaining walls, and a groove is defined on the carrier; Filling a fluorescent colloid on the carrier to at least cover the light-emitting diode core, wherein the fluorescent colloid includes at least one phosphor powder mixed with at least one colloid, and the phosphor powder is dispersed in the colloid and filling the groove; And place an oven to carry out a baking procedure. 16. The manufacturing method of the LED packaging structure according to claim 15, wherein the carrier is integrally formed with the first annular retaining wall or the second annular retaining wall. 17. The manufacturing method of the LED packaging structure according to claim 15, wherein the first annular barrier wall or the second annular barrier wall is a discontinuous annular barrier wall. 18. The method for manufacturing a light emitting diode packaging structure as claimed in any one of claims 15 to 17, wherein the method of arranging each light emitting diode chip on the carrier is through flip-chip welding technology and the carrier electrical connection. 19. The method of manufacturing a light emitting diode packaging structure as claimed in any one of claims 15 to 17, wherein the method of arranging each light emitting diode chip on the carrier is to connect the carrier with the wire bonding technique electrical connection. 20. The method for manufacturing a light-emitting diode package structure according to any one of claims 15-17, wherein the material of the carrier includes ceramics, polymers or metals. 21. The method for manufacturing a light-emitting diode packaging structure according to any one of claims 15 to 17, wherein the material of the first annular retaining wall and the material of the second annular retaining wall include silicon, silicon oxide, Boron nitride, organic polymer materials or metals.