CN107266076A - A kind of manufacturing process of the heat conduction pad pasting of mobile phone - Google Patents
A kind of manufacturing process of the heat conduction pad pasting of mobile phone Download PDFInfo
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- CN107266076A CN107266076A CN201710563649.8A CN201710563649A CN107266076A CN 107266076 A CN107266076 A CN 107266076A CN 201710563649 A CN201710563649 A CN 201710563649A CN 107266076 A CN107266076 A CN 107266076A
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- Prior art keywords
- pad pasting
- heat conduction
- conduction pad
- mobile phone
- manufacturing process
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims abstract description 26
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 25
- 239000010439 graphite Substances 0.000 claims abstract description 25
- 238000010792 warming Methods 0.000 claims abstract description 19
- 238000009413 insulation Methods 0.000 claims abstract description 16
- 238000003490 calendering Methods 0.000 claims abstract description 12
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 10
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 claims description 10
- 239000004014 plasticizer Substances 0.000 claims description 10
- -1 isoborneol ester Chemical class 0.000 claims description 9
- DTGKSKDOIYIVQL-MRTMQBJTSA-N Isoborneol Natural products C1C[C@@]2(C)[C@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-MRTMQBJTSA-N 0.000 claims description 6
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 claims description 6
- CKDOCTFBFTVPSN-UHFFFAOYSA-N borneol Natural products C1CC2(C)C(C)CC1C2(C)C CKDOCTFBFTVPSN-UHFFFAOYSA-N 0.000 claims description 6
- 238000013329 compounding Methods 0.000 claims description 6
- DTGKSKDOIYIVQL-UHFFFAOYSA-N dl-isoborneol Natural products C1CC2(C)C(O)CC1C2(C)C DTGKSKDOIYIVQL-UHFFFAOYSA-N 0.000 claims description 6
- 239000004575 stone Substances 0.000 claims description 6
- 229960002415 trichloroethylene Drugs 0.000 claims description 6
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 claims description 6
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 claims description 6
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 claims description 5
- 229920002239 polyacrylonitrile Polymers 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 5
- SIXWIUJQBBANGK-UHFFFAOYSA-N 4-(4-fluorophenyl)-1h-pyrazol-5-amine Chemical compound N1N=CC(C=2C=CC(F)=CC=2)=C1N SIXWIUJQBBANGK-UHFFFAOYSA-N 0.000 claims description 4
- VOWAEIGWURALJQ-UHFFFAOYSA-N Dicyclohexyl phthalate Chemical compound C=1C=CC=C(C(=O)OC2CCCCC2)C=1C(=O)OC1CCCCC1 VOWAEIGWURALJQ-UHFFFAOYSA-N 0.000 claims description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims description 4
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- 229920005573 silicon-containing polymer Polymers 0.000 claims description 4
- 230000000630 rising effect Effects 0.000 claims description 3
- AKGGYBADQZYZPD-UHFFFAOYSA-N benzylacetone Chemical compound CC(=O)CCC1=CC=CC=C1 AKGGYBADQZYZPD-UHFFFAOYSA-N 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 3
- OZXIZRZFGJZWBF-UHFFFAOYSA-N 1,3,5-trimethyl-2-(2,4,6-trimethylphenoxy)benzene Chemical compound CC1=CC(C)=CC(C)=C1OC1=C(C)C=C(C)C=C1C OZXIZRZFGJZWBF-UHFFFAOYSA-N 0.000 description 5
- SHOJXDKTYKFBRD-UHFFFAOYSA-N mesityl oxide Natural products CC(C)=CC(C)=O SHOJXDKTYKFBRD-UHFFFAOYSA-N 0.000 description 5
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005087 graphitization Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
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- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
- C04B35/524—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite obtained from polymer precursors, e.g. glass-like carbon material
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/62218—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products obtaining ceramic films, e.g. by using temporary supports
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
- C04B35/62645—Thermal treatment of powders or mixtures thereof other than sintering
- C04B35/6267—Pyrolysis, carbonisation or auto-combustion reactions
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/18—Homopolymers or copolymers of nitriles
- C09D133/20—Homopolymers or copolymers of acrylonitrile
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/48—Organic compounds becoming part of a ceramic after heat treatment, e.g. carbonising phenol resins
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- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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- C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
- C08J2433/18—Homopolymers or copolymers of nitriles
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Abstract
The invention discloses a kind of manufacturing process of the heat conduction pad pasting of mobile phone, mainly include the following steps that：Step 1：Film is pre-processed；Step 2：Smear graphite modified dose；Step 3：Pre-burned；Step 4：Calendering, is rolled the carbonized film of the pre-burned in the step 3 using calender, its thickness is calendered to 0.3 ~ 0.8mm；Step 5：Main to fire, the Kapton after step 4 is rolled is warming up to 800 ~ 900 DEG C, is incubated 30 ~ 60min, is cooled to normal temperature after 900 ~ 1100 DEG C, 10 ~ 30min of insulation are then warming up to again, produces heat conduction pad pasting.Manufacture method of the present invention is simple and easy to apply, and cost is relatively low, and obtained heat conduction pad pasting scratch resistance intensity is big, thermal conductivity factor is high, one layer graphite modified dose is uniformly smeared on Kapton two sides, is improved in heat conductivility both vertically and horizontally, the uniformity of pad pasting radiating is realized.
Description
Technical field
The invention belongs to electronics field, and in particular to a kind of manufacturing process of the heat conduction pad pasting of mobile phone.
Background technology
Nowadays, with the development of computer technology, the trend of development of computer is to develop lighter and thinner product.Example
Such as, mobile phone becomes more and more popular, because their dexterous profiles.Due to becoming smaller in size for these products, radiating is one all the time
Individual considerable aspect, high temperature can reduce the performance, reliability and service life of electronic equipment.Therefore, Current electronic industry
Higher and higher requirement is proposed for the heat sink material as heat control system core component, in the urgent need to a kind of high-efficiency heat conduction, gently
Just material is transferred heat away from rapidly, ensures that electronic equipment is normally run.Equal backing is that one kind is handed in thermal source and auxiliary heat
The heat exchanger of heat is transmitted between parallel operation, its surface region and shape are more beneficial for radiating compared with thermal source, by equal backing, by heat
The thermal expansion that source is produced is dissipated to secondary unit, is so able to eliminate the heat accumulation in thermal source well.
Kapton is used in sticking film for mobile phone in the prior art, although have using polyimide film sintered acquisition stone
Black fin, so as to be covered on thermal source, but is constrained to very different, the shadow of the product quality and performances of Kapton
The performance for having arrived the two-sided pad pasting heat dispersion of radiating is rung, there is following technical problem：Radiating is uneven, the local mistake of adhesive tape easily occurs
Heat, the heat dispersion that improves product is unstable, reliability performance is poor, is unfavorable for product quality management control, influences the competition of product
Power.Therefore for mobile phone heat dissipation problem, the direction made great efforts as those skilled in the art.
The content of the invention
In view of the above-mentioned problems, the technical problem to be solved in the present invention is to provide the manufacturing process of the heat conduction pad pasting of mobile phone.
To achieve the above object, the technical scheme is that：A kind of manufacturing process of the heat conduction pad pasting of mobile phone, mainly
Comprise the following steps：
Step 1：Film is pre-processed, and Kapton is heated into 220 ~ 250 DEG C, is placed in 30 ~ 50min of insulation in incubator,
Then room temperature is cooled to again after rising to 300 ~ 350 DEG C again；
Step 2：Graphite modified dose is smeared, one layer of stone is uniformly smeared on the Kapton two sides after step 1 is treated
Black modifying agent；
Step 3：Pre-burned, the Kapton that step 2 is smeared into graphite modified dose is warming up to 800 ~ 900 DEG C, and insulation 60 ~
90min, is cooled to normal temperature after 1000 ~ 1200 DEG C, 70 ~ 80min of insulation are then warming up to again, obtains the carbonized film of pre-burned；
Step 4：Calendering, rolls the carbonized film of the pre-burned in the step 3 using calender, make its thickness be calendered to 0.3 ~
0.8mm；
Step 5：Main to fire, the Kapton after step 4 is rolled is warming up to 800 ~ 900 DEG C, is incubated 30 ~ 60min, then
Normal temperature is cooled to after being warming up to 900 ~ 1100 DEG C, 10 ~ 30min of insulation again, heat conduction pad pasting is produced.
Further, the smearing mode in the step 2 is smeared for atomizing.
Further, graphite modified dose of viscosity in the step 2 is 0.01 ~ 0.25Pa.s.
Further, graphite modified dose in the step 3 includes following raw material according to parts by weight：Trichloro ethylene 2 ~ 10
It is part, 6 ~ 18 parts of triethylenediamine, 3 ~ 9 parts of Mesityl oxide, 7 ~ 10 parts of compounding acetic isoborneol ester, 3 ~ 10 parts of polyacrylonitrile, poly-
1 ~ 5 part of dimethyl siloxane, 1.5 ~ 3.5 parts of plasticizer.
Further, the plasticizer is dioctyl phthalate, di-sec-octyl phthalate, phthalic acid two
Cyclohexyl, dibutyl phthalate, diethyl phthalate, diisononyl phthalate, the isodecyl of phthalic acid two
One or more in ester.
Further, the programming rate in the step 3 is 3 ~ 10 DEG C/min.
Further, the programming rate in the step 5 is 10 ~ 20 DEG C/min.
Further, the roll draw ratio of the calender is 2.5 ~ 3.
The beneficial effects of the present invention are：The present invention provides a kind of manufacturing process of the heat conduction pad pasting of mobile phone, manufacturer
Method is simple and easy to apply, and cost is relatively low, and obtained heat conduction pad pasting scratch resistance intensity is big, and thermal conductivity factor is high, equal on Kapton two sides
It is even to smear one layer graphite modified dose, improve in heat conductivility both vertically and horizontally, it is to avoid be pasted onto mobile phone part
On the hot-spot that causes, realize the uniformity of pad pasting radiating.
In addition, graphite modified dose by trichloro ethylene, triethylenediamine, Mesityl oxide, compounding acetic isoborneol ester, poly- third
Alkene nitrile etc. is constituted, and is coated on Kapton, is filled with the pin hole in heating process, improves crystallinity simultaneously, also gram
Take thermal contraction excessive caused uneven, improve the graphite linings biaxial tension performance in pad pasting.Using pressure in manufacturing process
Prolong the carbonized film that machine rolls the pre-burned, it is to avoid the volume contraction in fold and graphitization sintering process, improve densification
Property and crystallinity, are further increased in heat conductivility both vertically and horizontally.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to embodiments, to the present invention
It is described in further detail.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, do not limit
The fixed present invention.
Embodiment 1
A kind of manufacturing process of the heat conduction pad pasting of mobile phone, is mainly included the following steps that：
Step 1：Film is pre-processed, and Kapton is heated into 220 DEG C, is placed in incubator and is incubated 30min, is then risen again
Room temperature is cooled to again after to 300 DEG C；
Step 2：Graphite modified dose is smeared, one layer of stone is uniformly smeared on the Kapton two sides after step 1 is treated
Black modifying agent；
Step 3：Pre-burned, the Kapton that step 2 is smeared into graphite modified dose is warming up to 800 DEG C, is incubated 60min, so
Normal temperature is cooled to after being warming up to 1000 DEG C, insulation 70min again afterwards, the carbonized film of pre-burned is obtained；
Step 4：Calendering, is rolled the carbonized film of the pre-burned in the step 3 using calender, its thickness is calendered to 0.3mm；
Step 5：Main to fire, the Kapton after step 4 is rolled is warming up to 800 DEG C, is incubated 30min, then heats up again
To 900 DEG C, normal temperature is cooled to after insulation 10min, heat conduction pad pasting is produced.
Smearing mode in the step 2 is smeared for atomizing.
Graphite modified dose of viscosity in the step 2 is 0.01Pa.s.
Graphite modified dose in the step 3 includes following raw material according to parts by weight：2 parts of trichloro ethylene, triethylene two
6 parts of amine, 3 parts of Mesityl oxide, 7 parts of compounding acetic isoborneol ester, 3 parts of polyacrylonitrile, 1 part of dimethyl silicone polymer, plasticizer 1.5
Part.
The plasticizer is dioctyl phthalate, di-sec-octyl phthalate, dicyclohexyl phthalate, neighbour
One kind in dibatyl phithalate, diethyl phthalate, diisononyl phthalate, diisooctyl phthalate
Or it is a variety of.
Programming rate in the step 3 is 3 DEG C/min.
Programming rate in the step 5 is 10 DEG C/min.
The roll draw ratio of the calender is 2.5.
Embodiment 2
A kind of manufacturing process of the heat conduction pad pasting of mobile phone, is mainly included the following steps that：
Step 1：Film is pre-processed, and Kapton is heated into 230 DEG C, is placed in 30 ~ 50min of insulation in incubator, then
Room temperature is cooled to again after rising to 330 DEG C again；
Step 2：Graphite modified dose is smeared, one layer of stone is uniformly smeared on the Kapton two sides after step 1 is treated
Black modifying agent；
Step 3：Pre-burned, the Kapton that step 2 is smeared into graphite modified dose is warming up to 850 DEG C, is incubated 75min, so
Normal temperature is cooled to after being warming up to 1100 DEG C, insulation 75min again afterwards, the carbonized film of pre-burned is obtained；
Step 4：Calendering, is rolled the carbonized film of the pre-burned in the step 3 using calender, its thickness is calendered to 0.6mm；
Step 5：Main to fire, the Kapton after step 4 is rolled is warming up to 850 DEG C, is incubated 50min, then heats up again
To 1000 DEG C, normal temperature is cooled to after insulation 20min, heat conduction pad pasting is produced.
Smearing mode in the step 2 is smeared for atomizing.
Graphite modified dose of viscosity in the step 2 is 0.15Pa.s.
Graphite modified dose in the step 3 includes following raw material according to parts by weight：6 parts of trichloro ethylene, triethylene two
10 parts of amine, 6 parts of Mesityl oxide, 8 parts of compounding acetic isoborneol ester, 7 parts of polyacrylonitrile, 2 parts of dimethyl silicone polymer, plasticizer
2.5 part.
The plasticizer is dioctyl phthalate, di-sec-octyl phthalate, dicyclohexyl phthalate, neighbour
One kind in dibatyl phithalate, diethyl phthalate, diisononyl phthalate, diisooctyl phthalate
Or it is a variety of.
Programming rate in the step 3 is 6 DEG C/min.Programming rate in the step 5 is 15 DEG C/min.The pressure
The roll draw ratio for prolonging machine is 2.5.
Embodiment 3
A kind of manufacturing process of the heat conduction pad pasting of mobile phone, is mainly included the following steps that：
Step 1：Film is pre-processed, and Kapton is heated into 250 DEG C, is placed in incubator and is incubated 50min, is then risen again
Room temperature is cooled to again after to 350 DEG C；
Step 2：Graphite modified dose is smeared, one layer of stone is uniformly smeared on the Kapton two sides after step 1 is treated
Black modifying agent；
Step 3：Pre-burned, the Kapton that step 2 is smeared into graphite modified dose is warming up to 900 DEG C, is incubated 90min, so
Normal temperature is cooled to after being warming up to 1200 DEG C, insulation 80min again afterwards, the carbonized film of pre-burned is obtained；
Step 4：Calendering, is rolled the carbonized film of the pre-burned in the step 3 using calender, its thickness is calendered to 0.8mm；
Step 5：Main to fire, the Kapton after step 4 is rolled is warming up to 900 DEG C, is incubated 60min, then heats up again
To 1100 DEG C, normal temperature is cooled to after insulation 30min, heat conduction pad pasting is produced.
Smearing mode in the step 2 is smeared for atomizing.
Graphite modified dose of viscosity in the step 2 is 0.25Pa.s.
Graphite modified dose in the step 3 includes following raw material according to parts by weight：10 parts of trichloro ethylene, triethylene two
18 parts of amine, 9 parts of Mesityl oxide, 10 parts of compounding acetic isoborneol ester, 10 parts of polyacrylonitrile, 5 parts of dimethyl silicone polymer, plasticizer
3.5 part.
The plasticizer is dioctyl phthalate, di-sec-octyl phthalate, dicyclohexyl phthalate, neighbour
One kind in dibatyl phithalate, diethyl phthalate, diisononyl phthalate, diisooctyl phthalate
Or it is a variety of.
Programming rate in the step 3 is 10 DEG C/min.Programming rate in the step 5 is 20 DEG C/min.It is described
The roll draw ratio of calender is 3.
Performance test
Thermal conductivity factor, the test of scratch resistance strength character are carried out to the present embodiment 1, embodiment 2, embodiment 3, and is made with prior art
It is compared for control group, the following form of test result：
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Control group | |
| Thermal conductivity factor（W/m·k） | 0.50 | 0.61 | 0.55 | 0.37 |
| Scratch resistance intensity（%） | 70 | 75 | 81 | 60 |
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, although with reference to the foregoing embodiments
The present invention is described in detail, for those skilled in the art, it still can be to foregoing embodiments institute
The technical scheme of record is modified, or carries out equivalent substitution to which part technical characteristic.It is all the present invention spirit and
Within principle, any modification, equivalent substitution and improvements made etc. should be included in the scope of the protection.
Claims (8)
1. the manufacturing process of the heat conduction pad pasting of a kind of mobile phone, it is characterised in that mainly include the following steps that：
Step 1：Film is pre-processed, and Kapton is heated into 220 ~ 250 DEG C, is placed in 30 ~ 50min of insulation in incubator,
Then room temperature is cooled to again after rising to 300 ~ 350 DEG C again；
Step 2：Graphite modified dose is smeared, one layer of stone is uniformly smeared on the Kapton two sides after step 1 is treated
Black modifying agent；
Step 3：Pre-burned, the Kapton that step 2 is smeared into graphite modified dose is warming up to 800 ~ 900 DEG C, and insulation 60 ~
90min, is cooled to normal temperature after 1000 ~ 1200 DEG C, 70 ~ 80min of insulation are then warming up to again, obtains the carbonized film of pre-burned；
Step 4：Calendering, rolls the carbonized film of the pre-burned in the step 3 using calender, make its thickness be calendered to 0.3 ~
0.8mm；
Step 5：Main to fire, the Kapton after step 4 is rolled is warming up to 800 ~ 900 DEG C, is incubated 30 ~ 60min, then
Normal temperature is cooled to after being warming up to 900 ~ 1100 DEG C, 10 ~ 30min of insulation again, heat conduction pad pasting is produced.
2. a kind of manufacturing process of the heat conduction pad pasting of mobile phone according to claim 1, it is characterised in that the step 2
In smearing mode be atomizing smear.
3. a kind of manufacturing process of the heat conduction pad pasting of mobile phone according to claim 1, it is characterised in that the step 2
In graphite modified dose of viscosity be 0.01 ~ 0.25Pa.s.
4. a kind of manufacturing process of the heat conduction pad pasting of mobile phone according to claim 1, it is characterised in that the step 3
In graphite modified dose according to parts by weight include following raw material：2 ~ 10 parts of trichloro ethylene, 6 ~ 18 parts of triethylenediamine, different sub- third
3 ~ 9 parts of benzylacetone, 7 ~ 10 parts of compounding acetic isoborneol ester, 3 ~ 10 parts of polyacrylonitrile, 1 ~ 5 part of dimethyl silicone polymer, plasticizer 1.5 ~
3.5 part.
5. a kind of manufacturing process of the heat conduction pad pasting of mobile phone according to claim 4, it is characterised in that the plasticizer
For dioctyl phthalate, di-sec-octyl phthalate, dicyclohexyl phthalate, dibutyl phthalate, neighbour
One or more in diethyl phthalate, diisononyl phthalate, diisooctyl phthalate.
6. a kind of manufacturing process of the heat conduction pad pasting of mobile phone according to claim 1, it is characterised in that the step 3
In programming rate be 3 ~ 10 DEG C/min.
7. a kind of manufacturing process of the heat conduction pad pasting of mobile phone according to claim 1, it is characterised in that the step 5
In programming rate be 10 ~ 20 DEG C/min.
8. a kind of manufacturing process of the heat conduction pad pasting of mobile phone according to claim 1, it is characterised in that the calender
Roll draw ratio be 2.5 ~ 3.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710563649.8A CN107266076A (en) | 2017-07-12 | 2017-07-12 | A kind of manufacturing process of the heat conduction pad pasting of mobile phone |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710563649.8A CN107266076A (en) | 2017-07-12 | 2017-07-12 | A kind of manufacturing process of the heat conduction pad pasting of mobile phone |
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| CN107266076A true CN107266076A (en) | 2017-10-20 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109370470A (en) * | 2018-09-15 | 2019-02-22 | 上海清研新材料科技有限公司 | A kind of mobile phone temperature lowering film and preparation method |
| CN109401313A (en) * | 2018-10-31 | 2019-03-01 | 株洲时代新材料科技股份有限公司 | A kind of Kapton and preparation method thereof |
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| CN106118517A (en) * | 2014-01-26 | 2016-11-16 | 苏州斯迪克新材料科技股份有限公司 | High compactness heat conduction pad pasting |
| CN106318251A (en) * | 2014-01-26 | 2017-01-11 | 斯迪克新型材料（江苏）有限公司 | Manufacture method of thermal transfer film |
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2017
- 2017-07-12 CN CN201710563649.8A patent/CN107266076A/en not_active Withdrawn
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106118517A (en) * | 2014-01-26 | 2016-11-16 | 苏州斯迪克新材料科技股份有限公司 | High compactness heat conduction pad pasting |
| CN106318251A (en) * | 2014-01-26 | 2017-01-11 | 斯迪克新型材料（江苏）有限公司 | Manufacture method of thermal transfer film |
| CN106413340A (en) * | 2014-01-26 | 2017-02-15 | 斯迪克新型材料（江苏）有限公司 | Heat conducting adhesive film for electronic product |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109370470A (en) * | 2018-09-15 | 2019-02-22 | 上海清研新材料科技有限公司 | A kind of mobile phone temperature lowering film and preparation method |
| CN109401313A (en) * | 2018-10-31 | 2019-03-01 | 株洲时代新材料科技股份有限公司 | A kind of Kapton and preparation method thereof |
| CN109401313B (en) * | 2018-10-31 | 2021-06-15 | 株洲时代华鑫新材料技术有限公司 | A kind of polyimide film and preparation method thereof |
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Application publication date: 20171020 |