CN107257618B - Communication apparatus contacting radiator - Google Patents
Communication apparatus contacting radiator Download PDFInfo
- Publication number
- CN107257618B CN107257618B CN201710699344.XA CN201710699344A CN107257618B CN 107257618 B CN107257618 B CN 107257618B CN 201710699344 A CN201710699344 A CN 201710699344A CN 107257618 B CN107257618 B CN 107257618B
- Authority
- CN
- China
- Prior art keywords
- absorbing pipe
- communication apparatus
- board
- seal case
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/202—Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of communication apparatus contacting radiators, comprising: seal case, two sides are equipped with the cooling piece for cooling down to seal case inside, and the side of seal case is fixedly connected with thermal insulation board；Absorbing pipe is mounted on board surface；First muff is socketed in one end of absorbing pipe；Second muff, is socketed in the other end of absorbing pipe, and one end of the absorbing pipe is connected with circulating fan.The present invention directly transfers heat to outside communication apparatus in radiation processes, avoids the transmitting back and forth of communication apparatus enclosure interior heat, reduces idle work energy consumption, and improve radiating efficiency；The present invention improves radiating efficiency so that absorbing pipe temperature end and the low-temperature end temperature difference are larger using the low-temperature region that seal case and cooling piece are formed；The present invention, to being inflated in absorbing pipe, is increased air pressure inside and density of gas molecules, improves the thermal conductivity of gas by inflating port, convenient for improving radiating efficiency.
Description
Technical field
The invention belongs to technical field of communication equipment, and more specifically more particularly to a kind of communication apparatus contact radiates
Device.
Background technique
Communication apparatus, which refers to, to be arranged in centainly geographically to transmit the general designation of the Communication Equipment of wave information.It is broadly divided into
Wire communication equipment and wireless telecommunications system.Wire communication equipment mainly introduces the serial communication for solving industry spot, and profession is total
The communication of line style, the conversion equipment between the communication of Industrial Ethernet and various communications protocol.Wireless telecommunications system is mainly
Wireless aps, wireless bridge, wireless network card, wireless lightning arrester, the equipment such as antenna.
Communication apparatus at work, needs long-time high power to work, and when work can radiate a large amount of heat, logical
When interrogating equipment construction, can the distance between high heating board card and specific location be preferentially rationally set according to heat dissipation problem.It is existing
For communication apparatus in heat dissipation (such as air-cooled), the partial heat having in board surrounding air is recycled into cooling system, is permitted
More idle works, waste of energy, after long-time, communication apparatus ambient temperature is excessively high, and the radiating efficiency of cooling system slows down；Often not
The cooling requirements for meeting normal use, cause the bit error rate to improve.
It is, therefore, desirable to provide one kind can be with rapid cooling, and recycle heat is avoided to enter the logical of cooling system (idle work)
Interrogate equipment contacting radiator.
Summary of the invention
The purpose of the present invention is to solve disadvantages existing in the prior art, and a kind of communication apparatus contact proposed
Radiator.
To achieve the above object, the invention provides the following technical scheme:
A kind of communication apparatus contacting radiator, comprising:
Seal case, two sides are equipped with the cooling piece for cooling down to seal case inside, and seal case
Side is fixedly connected with thermal insulation board；
Absorbing pipe is mounted on board surface, for absorbing the heat on board, and the both ends of absorbing pipe extend through in
The side of thermal insulation board and seal case simultaneously extends to inside seal case；
First muff is socketed in one end of absorbing pipe, for completely cutting off heat, prevents board outside heat from entering heat absorption
In pipe, the heat absorption efficiency of absorbing pipe on board is reduced；
Second muff is socketed in the other end of absorbing pipe, for completely cutting off heat, prevents absorbing pipe internal heat from distributing
To board near zone, so that board ambient air temperature is excessively high, it is unfavorable for board heat dissipation；
One end of the absorbing pipe is connected with circulating fan.
Preferably, the outside of communication apparatus shell is arranged in the seal case, and thermal insulation board is fixedly connected on communication and sets
The inner sidewall of standby shell.
Preferably, the side of the seal case is equipped with air gauge, and the side of seal case offers inflating port, institute
The inside for stating inflating port is equipped with valve inside.
Preferably, mounting groove and card slot that the surface of the board offers convenient for contact heat dissipation.
Preferably, the absorbing pipe is mounted in the mounting groove, and the radiating wing fixation of absorbing pipe two sides is connected in institute
It states in card slot.
Technical effect and advantage of the invention:
1, the present invention passes through the design of the first muff and the second muff, in radiation processes, directly by heat transfer
To outside communication apparatus, the transmitting back and forth of communication apparatus enclosure interior heat is avoided, reduces idle work energy consumption, and improve
Radiating efficiency.
2, the low-temperature region that the present invention is formed using seal case and cooling piece, so that absorbing pipe temperature end and low-temperature end temperature
Difference is larger, improves radiating efficiency.
3, the present invention increases air pressure inside and density of gas molecules, mentions by inflating port to being inflated in absorbing pipe
The thermal conductivity of high gas, convenient for improving radiating efficiency.
Detailed description of the invention
Fig. 1 is overlooking structure diagram of the invention；
Fig. 2 is the mounting structure schematic diagram of absorbing pipe of the present invention.
In figure: 1 seal case, 2 air gauges, 3 inflating ports, 4 cooling pieces, 5 thermal insulation boards, 6 first muffs, 7 boards, 8 are inhaled
Heat pipe, 9 second muffs, 10 circulating fans, 11 radiating wings, 12 card slots, 13 mounting grooves.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Herein
Described specific embodiment is only used to explain the present invention, is not intended to limit the present invention.Based on the embodiments of the present invention,
Every other embodiment obtained by those of ordinary skill in the art without making creative efforts, belongs to this hair
The range of bright protection.
Embodiment 1
A kind of communication apparatus contacting radiator, comprising:
Seal case 1 (when specific implementation for trapezoidal, two sides are inclined-plane), two sides are equipped with for in seal case 1
(it is semiconductor chilling plate to the cooling piece 4 that portion cools down, and during installation, hot end face is arranged outside seal case 1, cold
End face is arranged inside seal case 1), during installation, and the side of seal case 1 is fixedly connected with thermal insulation board 5；
Absorbing pipe 8 (it is heat absorption copper pipe, U-shaped), is mounted on 7 surface of board, for absorbing the heat on board 7,
And the both ends of absorbing pipe 8 extend through the side in thermal insulation board 5 (its polyurethane thermal insulation board) and seal case 1 and extend to close
Inside joint sealing body 1；
First muff 6 (it is silicon rubber thermal sleeve), is socketed in one end of absorbing pipe 8, for completely cutting off heat, prevents
Only 7 outside heat of board enters in absorbing pipe 8, reduces the heat absorption efficiency of absorbing pipe 8 on board 7；
Second muff 9 (it is silicon rubber thermal sleeve), is socketed in the other end of absorbing pipe 8, for completely cutting off heat,
It prevents 8 internal heat of absorbing pipe to be dispersed into 7 near zone of board, so that 7 ambient air temperature of board is excessively high, is unfavorable for board 7
Heat dissipation；One end of the absorbing pipe 8 is connected with circulating fan 10.
Specifically, the outside of communication apparatus shell is arranged in the seal case 1, and thermal insulation board 5 is fixedly connected on communication
The inner sidewall of apparatus casing；The side of the seal case 1 is equipped with air gauge 2, and the side of seal case 1 offers inflation
Mouth 3, the inside of the inflating port 3 is equipped with valve inside, by being inflated inside 3 pairs of inflating port internal seal cases 1, works as gas
Pressure is when reaching 0.3-0.4Mpa, stops inflation, when work, starting circulating fan 10 can make it is internal form circulating current, be convenient for
Heat dissipation；The mounting groove 13 and card slot 12 that the surface of the board 7 offers convenient for contact heat dissipation；The absorbing pipe 8 is mounted on institute
It states in mounting groove 13, and the fixation of radiating wing 11 of 8 two sides of absorbing pipe is connected in the card slot 12.
In summary: the present invention directly will be hot in radiation processes by the design of the first muff and the second muff
Amount is transmitted to outside communication apparatus, is avoided the transmitting back and forth of communication apparatus enclosure interior heat, is reduced idle work energy consumption,
And improve radiating efficiency；The low-temperature region that the present invention is formed using seal case and cooling piece so that absorbing pipe temperature end and
The low-temperature end temperature difference is larger, improves radiating efficiency；The present invention, to being inflated in absorbing pipe, increases air pressure inside by inflating port
And density of gas molecules, the thermal conductivity of gas is improved, convenient for improving radiating efficiency.
Finally, it should be noted that the foregoing is only a preferred embodiment of the present invention, it is not intended to restrict the invention,
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art, still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features,
All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in of the invention
Within protection scope.
Claims (5)
1. a kind of communication apparatus contacting radiator, it is characterised in that: include:
Seal case (1), two sides are equipped with the cooling piece (4) for cooling down to seal case (1) inside, and seal box
The side of body (1) is fixedly connected with thermal insulation board (5)；
Absorbing pipe (8) is mounted on board (7) surface, for absorbing the heat on board (7), and the both ends of absorbing pipe (8) point
Not through the side of thermal insulation board (5) and seal case (1) and to extend to seal case (1) internal；
First muff (6), is socketed in one end of absorbing pipe (8), for completely cutting off heat, prevent board (7) outside heat into
Enter in absorbing pipe (8), reduces the heat absorption efficiency of absorbing pipe (8) on board (7)；
Second muff (9), is socketed in the other end of absorbing pipe (8), for completely cutting off heat, prevents the internal heat of absorbing pipe (8)
Amount is dispersed into board (7) near zone, so that board (7) ambient air temperature is excessively high, is unfavorable for board (7) heat dissipation；
One end of the absorbing pipe (8) is connected with circulating fan (10).
2. a kind of communication apparatus contacting radiator according to claim 1, it is characterised in that: the seal case
(1) outside of communication apparatus shell is set, and thermal insulation board (5) is fixedly connected on the inner sidewall of communication apparatus shell.
3. a kind of communication apparatus contacting radiator according to claim 1, it is characterised in that: the seal case
(1) side is equipped with air gauge (2), and the side of seal case (1) offers inflating port (3), the inflating port (3) it is interior
Portion is equipped with valve inside.
4. a kind of communication apparatus contacting radiator according to claim 1, it is characterised in that: the board (7)
The mounting groove (13) and card slot (12) that surface offers convenient for contact heat dissipation.
5. a kind of communication apparatus contacting radiator according to claim 4, it is characterised in that: the absorbing pipe (8)
It is mounted in the mounting groove (13), and the radiating wing (11) of absorbing pipe (8) two sides is fixed and is connected in the card slot (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710699344.XA CN107257618B (en) | 2017-08-16 | 2017-08-16 | Communication apparatus contacting radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710699344.XA CN107257618B (en) | 2017-08-16 | 2017-08-16 | Communication apparatus contacting radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107257618A CN107257618A (en) | 2017-10-17 |
| CN107257618B true CN107257618B (en) | 2019-05-03 |
Family
ID=60026625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710699344.XA Active CN107257618B (en) | 2017-08-16 | 2017-08-16 | Communication apparatus contacting radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107257618B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109455671A (en) * | 2018-12-29 | 2019-03-12 | 河南迪诺环保科技股份有限公司 | A kind of cooling radiator structure of ozone generator |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004232900A (en) * | 2003-01-28 | 2004-08-19 | Denso Corp | Cooling structure of heating part |
| CN1759643B (en) * | 2003-03-12 | 2011-06-08 | 富士通株式会社 | Cooling structure for electronic equipment |
| CN102012728A (en) * | 2010-11-26 | 2011-04-13 | 中山市锐盈电子有限公司 | A centralized cooling computer case |
| CN103677188A (en) * | 2013-12-29 | 2014-03-26 | 苏州市峰之火数码科技有限公司 | Self-power-generation cooling type host case |
| CN106440601A (en) * | 2015-08-11 | 2017-02-22 | 卡孚特能源技术（深圳）有限公司 | Freezing type multistage semiconductor refrigeration refrigerator |
-
2017
- 2017-08-16 CN CN201710699344.XA patent/CN107257618B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN107257618A (en) | 2017-10-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190411 Address after: 230031 No. 388 Qianshan Road, Shushan District, Hefei City, Anhui Province Applicant after: Anhui Communication Industry Service Co., Ltd. Address before: 230088 G08, 3rd floor, Hefei Software Park, Hefei High-tech Zone, Hefei City, Anhui Province Applicant before: Hefei Qing Bang Network Technology Co., Ltd. |
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| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |