CN107249257A - The IC support plate preparation methods of novel environment friendly - Google Patents

Abstract

The invention discloses the IC support plate preparation methods of novel environment friendly, ion implanting surface metalation is carried out on its surface after being cleaned to substrate, layers of copper is plated to obtain in injection layer surface with electroless copper and copper plating technology by two methods progress；One layer of positive/negative property photoresist is coated in layers of copper, mask is recycled and obtains circuitous pattern through the processing such as overexposure, development；Finally the elements such as chip are mounted on support plate and encapsulated, then whole IC support plates are inlayed on circuit boards.Electroplating process and electrolytic process are constituted a circulation in the method that the present invention is provided, or only circuitous pattern part is injected and electroplated, therefore greatly reduces the pollution to environment and improves the utilization rate of metallic copper.High-accuracy, small size, the design of ultra-thin IC support plates not only optimize circuitous pattern and further increase circuit board overall performance simultaneously, also due to the flat smooth of ceramic substrate, so as to solve the problem of elements such as chip, resistance and electric capacity are high to substrate planarization requirement well.

Description

New environmentally friendly IC substrate preparation method

technical field

The invention relates to the technical field of IC carrier board preparation.

Background technique

Printed circuit boards (also known as PCBs) appear almost everywhere in electronic equipment, and vary in size, function, and complexity. The development of the electronics industry, especially the industrial revolution brought about by the development of electronic terminal industries such as 3G smartphones and tablet computers in recent years, has continued to heat up, making the demand for PCBs for such electronic products continue to increase. my country's PCB manufacturers are constantly increasing investment and expansion, but there is still a lack of high-end circuit boards. Any layer HDI, soft and hard boards, and IC carrier boards are the fastest growing today. They are currently used in communications and electronics. The most high-end printed circuit board variety in scientific and technological products.

In recent years, my country's electronics industry has developed rapidly, and the output of printed circuit boards (PCBs) has also increased day by day, resulting in the generation and discharge of a large number of circuit board corrosion waste liquids. According to literature reports, a printed circuit board factory with an annual production of 100,000 square meters consumes about 600,000 tons of water and produces at least 480,000 tons of sewage. Among them, the waste liquid of etching circuit boards contains a large amount of copper ions, which cannot be well recycled, resulting in the loss and waste of a large amount of copper. At present, my country's copper resource reserves are small, and there are few large-scale copper mines. However, due to the development of the copper industry With rapid development, the demand for copper is very large, and its own copper production can no longer meet the needs, so it needs to import a large amount from Peru, Chile and other foreign countries.

In the method proposed in the present invention, copper is treated by permanent electrolysis in the first preparation process, and the electrolysis process and the electroplating process form a cycle, and the electrolyte can be recycled. The second process only electroplates the circuit pattern area, directly saving the etching process. Both methods greatly reduce environmental pollution and effectively save copper metal resources.

Contents of the invention

In the process of circuit board preparation, the design of the IC carrier board makes the entire circuit board miniaturized, high-density, and more powerful, making up for the current domestic deficiencies in the field of high-end printed boards. At the same time, the first preparation process uses The electrolysis process replaces the traditional etching process, and the electrolysis step and the copper electroplating step are combined into a cycle. The second preparation process adopts the method of directly plating copper on the circuit pattern area, omitting the etching process. In the current environmental pollution and resource shortage problems caused by the rapid development of the circuit board industry, the purpose of reducing environmental pollution and saving copper resources is achieved.

In view of this, the present invention provides a novel environment-friendly IC substrate preparation method, which includes two different preparation processes:

The first preparation process includes the following steps: S110, making a standard PCB circuit board, and the IC substrate is based on ceramics; S120, cleaning the substrate and performing ion implantation on its surface. The copper layer is plated on the surface of the injection layer; S130, coat a layer of positive photoresist on the copper layer, and then use the mask plate to obtain the circuit pattern through exposure, development, etc.; S140, and then use the electrolytic method to process the sample Copper other than circuit graphics, and finally the processed IC substrate is embedded on the PCB circuit board.

The second preparation process includes the following steps: S110, making a standard PCB circuit board, and the IC substrate is based on ceramics; S120, coating a layer of negative photoresist on the substrate, and then using a mask plate to expose and develop Wait for the treatment to obtain the circuit pattern; S130, clean the sample and perform ion implantation on its surface; S140, after implantation, use electroless copper plating and electroplating copper plating technology to plate a copper layer on the surface of the implanted layer, and finally place the processed IC The carrier board is embedded on the PCB circuit board.

Preferably, the method according to claim 1, characterized in that, the sample surface is cleaned ultrasonically in acetone.

Further preferably, the method according to claim 1, characterized in that the IC carrier board is based on ceramics, and ion implantation is performed on the surface thereof using a Metal Vacuum Vapor Ion Source (MEVVA) ion implantation device.

Preferably, the method according to claim 1, characterized in that the implantation element of the ion implantation

The elements are metal elements Ni, Cu, Fe, Au, Ti or Ag.

Preferably, the method according to claim 1, characterized in that ion implantation is performed on the surface of the ceramic substrate by using metal vacuum vapor ion source (MEVVA) ion implantation equipment, the implantation voltage is 0-50kV, and the beam intensity is 0-50kV. 10mA, the injection dose is 1×10 ¹⁵ -1×10 ¹⁷ /cm ² .

Preferably, the method according to claim 1, characterized in that ion implantation is performed on the surface of the ceramic substrate by using metal vacuum vapor ion source (MEVVA) ion implantation equipment, and the implantation depth is 0-300 nm.

Preferably, a novel environment-friendly IC carrier preparation method is characterized in that: using a metal vacuum vapor ion source to carry out surface metallization treatment on the system-in-package ceramic substrate;

Further preferably, a novel environment-friendly method for preparing an IC carrier board is characterized in that the circuit pattern is first obtained and then ion implanted and then thickened, or the ion implanted and then thickened before obtaining the pattern.

Preferably, the method according to claim 2, characterized in that, after the substrate is cleaned, ion implantation is carried out on its surface, and after completion, a copper layer is plated on the surface of the implanted layer with electroless copper plating and electroplating copper technology; Coating a layer of positive photoresist on the layer, and then using the mask plate to obtain the circuit pattern through exposure, development, etc.; then electrolytically treat the copper on the sample plate except for the circuit pattern, and finally inlay the processed IC substrate on the PCB circuit board.

Preferably, the method according to claim 2, characterized in that it is a novel environment-friendly IC substrate preparation method, characterized in that: a layer of negative photoresist is coated on the substrate, and then the mask plate is used and passed through Exposure, development and other treatments are used to obtain circuit patterns; after the sample is cleaned, ion implantation is carried out on its surface; after implantation, a copper layer is plated on the surface of the implanted layer by electroless copper plating and electroplating copper technology, and finally the processed IC is loaded The board is embedded on the PCB circuit board.

Preferably, the method according to claim 1, characterized in that the implanted element of the ion implantation is metal element Ni, Cu, Fe, Au, Ti or Ag.

Preferably, the method according to claim 1, characterized in that the equipment for ion implantation treatment is a continuous wide-beam treatment equipment, with a treatment diameter of 300-900 mm, a beam current of 10-50 mA, and a treatment capacity of 2 m/min.

Preferably, the method according to claim 1, characterized in that ion implantation is performed on the surface of the ceramic substrate by using metal vacuum vapor ion source (MEVVA) ion implantation equipment, the implantation voltage is 0-50kV, and the implantation dose is 1×10 ¹⁵ to 1×10 ¹⁷ /cm ² .

Preferably, the method according to claim 1, characterized in that ion implantation is performed on the surface of the ceramic substrate by using metal vacuum vapor ion source (MEVVA) ion implantation equipment, and the implantation depth is 0-300 nm.

Preferably, the method according to claim 2, characterized in that the copper layer electroplated by the copper electroplating has a thickness of 10-20 um.

Preferably, the method according to claim 3, characterized in that the electrolytic treatment and electroplating treatment constitute a cycle in the process, the copper-clad plate is used as the anode, and the template after implantation and electroless copper plating is used as the cathode.

Compared with the prior art, the embodiments of the present invention have the following advantages:

1. The metal vacuum vapor ion source (MEVVA) ion implantation equipment proposed by the present invention is used to perform ion implantation on the surface of the ceramic substrate to change the electrical properties of the substrate material. The ion concentration and depth distribution of the MEVVA ion implantation implanted on the surface of the ceramic substrate can be accurately controlled. There is a wide range of options for injecting metal elements.

2. In the first preparation process proposed by the present invention, the electrolytic method is used to electrolyze the copper on the copper clad plate except the circuit pattern, wherein the electrolyte can be recycled, compared with the traditional etching process that will produce a large amount of polluted etching waste, Greatly reduce the pollution to the environment.

3. In the first preparation process proposed by the present invention, the electrolysis process and the copper electroplating process are formed into a cycle, and these coppers are used for the copper electroplating process while the copper on the electrolytic copper clad plate except the circuit pattern is used for the copper electroplating process, thereby greatly improving Utilization of copper metal.

4. During copper plating in the second preparation process proposed by the present invention, since only the circuit pattern part is copper-plated, an etching process is not required to etch excess copper, thus no pollution to the environment and difficult to handle The etching waste liquid reduces the pollution to the environment.

5. During copper plating in the second preparation process proposed by the present invention, since only the circuit pattern part is copper-plated, compared with the traditional technology that needs to copper-plate the entire board surface, copper is largely saved. metal resources.

6. The IC carrier board on which the chip and other components produced in the present invention are located is small in volume, thin in board layer, has higher precision, and improves the overall performance of the circuit board.

7. In the present invention, the IC carrier board where the produced chips and other components are located is embedded on the matching PCB circuit board. The traditional PCB circuit board base is rough epoxy resin, etc., while chips and other components have higher requirements for flatness , the carrier substrate of the present invention is a ceramic with a smooth and even surface, so it is optimized in terms of flatness.

8. In the present invention, ceramics are used as the substrate, the material cost is low, and it has good thermal conductivity and air tightness. At the same time, the ceramic material of alumina in the present invention also has a thermal expansion coefficient, high thermal stability, chemical stability and low dielectric constant.

Description of drawings

The accompanying drawings constituting a part of the embodiments of the present invention are used to provide a further understanding of the embodiments of the present invention. The accompanying drawings and their descriptions of the present invention are used to explain the present invention and do not constitute improper limitations to the present invention. In the attached picture:

Fig. 1 is a schematic flow diagram of a novel environmentally friendly IC carrier preparation method provided by an embodiment of the present invention;

Fig. 2 is a schematic diagram of the surface of a circuit board provided by an embodiment of the present invention;

FIG. 3 is a schematic diagram of circuit board structural components provided by an embodiment of the present invention;

Fig. 4 is the structural representation of the MEVVA injection system provided by the embodiment of the present invention;

Fig. 5 is the structural representation of the electrolysis process and electroplating copper process that the first kind of preparation process embodiment provides among the present invention;

Explanation of reference signs

100 PCB circuit boards

110 IC carrier board

120 chips and other components

200 ceramic base

210 Injection - diffusion layer

220 copper layers

300 MEVVA ion source

310 beam spots

320 film outlet

330 sample loading position

340 conveyor track

350 drive shaft

360 vacuum system

370 Ion Source Cathode

400 power

410 electrolytic cell

420 anode

430 Electrolyte

440 Cathode

Specific implementation steps

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

Below in conjunction with accompanying drawing, each preferred embodiment of the present invention is described further:

method embodiment

In recent years, the electronics industry has developed rapidly and has been widely used in people's daily life, and almost all electronic products have circuit board components, which bring more and more serious problems of polluting waste liquid and metal copper consumption. The two preparation processes in the method proposed by the invention can greatly reduce environmental pollution, and at the same time can effectively improve the utilization rate of metal copper so as to save copper metal resources.

The first preparation process, Figure 1 is a schematic flow diagram of a new environmentally friendly IC substrate preparation method provided by the embodiment of the present invention, and its specific process is shown in Figure 1:

S110, making standard PCB circuit boards, IC substrates are based on ceramics;

In this step, a standard PCB circuit board is made first, and ceramics are selected as the substrate of the IC carrier board.

S120, performing ion implantation on the surface of the substrate after cleaning, and successively using electroless copper plating and electroplating copper plating techniques to form a copper layer on the surface of the implanted layer;

In this step, the surface cleaning of the ceramic substrate of the IC carrier board is carried out in order to remove other impurities such as dust and large particles on the surface of the substrate. Ion source (MEVVA) ion implantation equipment is implanted on its surface, the equipment structure is as shown in Figure 4, implantation forms the implantation in Figure 3-diffusion layer, wherein optionally, the implanted elements can be all metal elements, It is preferably Ni, Fe, Au, Ti, Cu or Ag. The implanted element selected in the present invention is Ni, the implantation voltage is 0-50kV, the beam current intensity is 0-10mA, and the implantation dose is 1×10 ¹⁵ ～ 1×10 ¹⁷ /cm ² , and the implantation depth is 0-300nm. After the injection is completed, the template is firstly cleaned to remove oil and other impurities. Optionally, it is ultrasonically cleaned in absolute ethanol or acetone, and then the template is placed in the PtCl ₄ solution. Due to the strength of the activity , the implanted Ni will replace Pt ⁴⁺ ions to form Pt simple substance, Pt simple substance can catalyze and activate the ceramic surface, which is conducive to the further progress of electroless copper plating, and then put the sample into the electroless plating bath to plate a layer of thin copper. Then, a layer of copper is electroplated on the thin copper layer by electroplating copper technology to form the copper layer shown in FIG. 3 , wherein optionally, the thickness of the electroplating copper layer is 10-20 um. In this step, the copper electroplating process and the electrolytic process in the last step are actually a cycle, that is, the copper electroplating process is also performed during the electrolytic process.

S130, coating a layer of positive photoresist on the copper layer, and then using a mask plate to obtain a circuit pattern through exposure and development;

In this step, the sample plate after copper plating is first coated with a positive photoresist, and optionally, the ceramic sample plate after the above coating is completed is pre-baked (soft baked) to remove most of the solvent in the photoresist And stabilize the photosensitive properties of the photoresist, then cover the photoresist with the mask plate with the circuit pattern as shown in Figure 2, then expose the template, and put the template into the developing solution after exposure for development, for this implementation The positive photoresist in the example is to dissolve the photoresist in the exposed area in the developer, that is, the part with photoresist after exposure and development is the transferred circuit pattern, and the sample after the above treatment is post-baked (hard baking, hard film) treatment to harden the remaining film.

S140, and then electrolytically process the copper on the sample board except for the circuit pattern, and finally embed the processed IC carrier board on the PCB circuit board.

In the different steps, as shown in Figure 5, as described in the S120 process, the electrolysis process and the copper electroplating process form a cycle. The main components of the electrolyte are copper sulfate and sulfuric acid, and there are other activators such as Cl- ions And additives are used to assist electrolysis and electroplating. The copper clad plate after the above steps is used as the anode, and the sample that needs to be electroplated in the S120 process is used as the cathode. The copper other than the circuit pattern is electrolyzed on the anode, and the copper is used Electroplating on the cathode. Finally, remove the remaining photoresist on the board. Then install chips, resistors, capacitors and other components on the processed IC carrier board, and embed the IC carrier board on the PCB substrate made in the S110 process, as shown in Figure 2.

The second preparation process, Figure 1 is a schematic flow diagram of a new environmentally friendly IC substrate preparation method provided by the embodiment of the present invention, and its specific process is shown in Figure 1:

S110, making standard PCB circuit boards, IC substrates are based on ceramics;

In this step, a standard PCB circuit board is made first, and ceramics with good insulation and heat resistance are selected as the substrate of the IC carrier board.

S120, coating a layer of negative photoresist on the substrate, and then using a mask plate to obtain a circuit pattern through exposure, development and other treatments;

In this step, the ceramic substrate is first dehydrated and baked, the main purpose is to remove the moisture that may be adsorbed on the surface of the ceramic substrate, and then the ceramic substrate is treated to increase the adhesion between the board surface and the photoresist, and after the treatment, the ceramic surface Apply a layer of negative photoresist. Carry out pre-baking (soft baking) treatment to the above-mentioned coated ceramic template to remove most of the solvent in the photoresist and stabilize the photosensitive properties of the photoresist, then cover the photoresist with a mask plate with a circuit pattern, and then Expose the sample, put the sample into the developing solution after exposure, and for the negative photoresist in this preparation process, the photoresist in the unexposed area is dissolved in the developing solution, that is, there is no photoresist after exposure and development. The part of the photoresist is the transferred circuit pattern, and the sample after the above treatment is subjected to post-baking (hard baking, hard film) treatment to harden the remaining film.

S130, performing ion implantation on the surface of the sample after cleaning;

In this step, the surface of the above sample is first cleaned, and optionally, ultrasonic cleaning is performed in a solvent such as acetone, the purpose is to remove dust, large particles and other impurities on the surface of the substrate. After cleaning, the structure is shown in Figure 4. Metal Vacuum Vapor Ion Source (MEVVA) ion implantation equipment performs ion implantation on its surface, wherein optionally, wherein optionally, the implanted elements can be all metal elements, preferably Ni, Fe, Au, Ti , Cu or Ag, the implanted element selected in the present invention is Ni, the implantation voltage is 0-50kV, the beam intensity is 0-10mA, the implantation dose is 1×10 ¹⁵ ～1×10 ¹⁷ /cm ² , and the implantation depth is 0 ~ 300nm, the implantation process is actually to inject metal Ni into the part with circuit pattern on the template to form the implantation-diffusion layer in Figure 3.

S140, after injection, the copper layer is plated on the surface of the injection layer by electroless copper plating and electroplating copper technology successively, and finally the processed IC carrier board is embedded on the PCB circuit board.

In this step, the template after the injection is initially cleaned to remove oil and other impurities. Optionally, it is ultrasonically cleaned in absolute ethanol or acetone, and then the template is put into the PtCl solution _. The strength of the activity, the implanted Ni will replace Pt ⁴⁺ ions to form Pt element, Pt element has a catalytic activation effect on the ceramic surface, which is conducive to the further progress of electroless copper plating, and then put the sample into the electroless plating A thin layer of copper is plated in the solution. Then electroplating is performed on the thin copper layer by electroplating copper technology, that is, the copper layer shown in FIG. 3 is formed, wherein optionally, the thickness of the electroplated copper layer is 10-20 um. After the copper layer is plated, the remaining photoresist is removed, and the IC carrier board with chips and other components is embedded on the PCB circuit board, as shown in Figure 2.

Claims (10)

1. A novel environment-friendly method for preparing an IC carrier plate, characterized in that: a metal vacuum vapor ion source is used to carry out surface metallization treatment to a system-level packaging ceramic substrate. 2. A novel environment-friendly method for preparing an IC carrier plate, characterized in that the circuit pattern is first obtained and then ion-implanted and then thickened or first ion-implanted and then thickened before obtaining the pattern. 3. The method according to claim 2, characterized in that, ion implantation is carried out on the surface of the substrate after cleaning, and after completion, the copper layer is plated on the surface of the injection layer with electroless copper plating and electroplating copper technology; Coat a layer of positive photoresist on the surface, and then use the mask plate to obtain the circuit pattern through exposure, development, etc.; then use the electrolytic method to treat the copper on the sample plate except the circuit pattern, and finally inlay the processed IC carrier on the PCB circuit board. 4. The method according to claim 2, characterized in that, a novel environment-friendly IC carrier preparation method, characterized in that: a layer of negative photoresist is coated on the substrate, and then a mask plate is used and exposed , development and other treatments to obtain the circuit pattern; after cleaning the sample, ion implantation is performed on its surface; after implantation, a copper layer is plated on the surface of the implanted layer with electroless copper plating and electroplating copper technology, and finally the processed IC carrier board Embedded on the PCB circuit board. 5. The method according to claim 1, characterized in that, the implanted element of the ion implantation is a metal element Ni, Cu, Fe, Au, Ti or Ag. 6. The method according to claim 1, wherein the equipment for ion implantation treatment is a continuous wide-beam treatment equipment, with a treatment diameter of 300-900 mm, a beam current of 10-50 mA, and a treatment capacity of 2 m/min. 7. The method according to claim 1, characterized in that ion implantation is performed on the surface of the ceramic substrate by using metal vacuum vapor ion source (MEVVA) ion implantation equipment, the implantation voltage is 0-50kV, and the implantation dose is 1×10 ¹⁵ ~1×10 ¹⁷ /cm ² . 8 . The method according to claim 1 , characterized in that ion implantation is performed on the surface of the ceramic substrate by using Metal Vacuum Vapor Ion Source (MEVVA) ion implantation equipment, and the implantation depth is 0-300 nm. 9. The method according to claim 2, characterized in that the thickness of the copper layer electroplated by the copper electroplating is 10-20 um. 10. The method according to claim 3, wherein the electrolytic treatment and the electroplating treatment form a cycle in the process, the copper clad plate is used as the anode, and the sample plate after injection and electroless copper plating is used as the cathode.