CN107231754B - It is a kind of to improve the undesirable method of plated through-hole generated in assist side manufacturing process - Google Patents
It is a kind of to improve the undesirable method of plated through-hole generated in assist side manufacturing process Download PDFInfo
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- CN107231754B CN107231754B CN201710516409.2A CN201710516409A CN107231754B CN 107231754 B CN107231754 B CN 107231754B CN 201710516409 A CN201710516409 A CN 201710516409A CN 107231754 B CN107231754 B CN 107231754B
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- Prior art keywords
- hole
- heavy copper
- plated
- manufacturing process
- improve
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention relates to field of printed circuit board fabrication, it is specially a kind of to improve the undesirable method of plated through-hole generated in assist side manufacturing process, this improves the undesirable method of plated through-hole generated in assist side manufacturing process, dust suction processing is carried out to processing hole in drilling, the dust generated when drilling is sucked away in time, effectively prevents drilling dust plug-hole.Heating system is set in the secondary slot of heavy copper cylinder, the heavy copper liquid of secondary slot is delivered to major trough by circulated filter system, avoids the reaction caused by major trough directly heats and accelerates the case where causing copper powder plug-hole, effectively reduces the bad situation of the heavy copper in hole.In outer layer pretreatment procedure using processing before super roughening, dry film plug-hole can be effectively prevented, above-mentioned three kinds of technique can integrally improve wiring board manufacture quality, reduce scrappage, save production cost.
Description
Technical field
The present invention relates to what is generated in field of printed circuit board fabrication more particularly to a kind of improvement assist side manufacturing process
The undesirable method of plated through-hole.
Background technique
Wiring board is the supporter of electronic component, provides electrical connection for electronic component.The production technology of wiring board
Process is general are as follows: sawing sheet → inner figure transfer → internal layer etching → lamination → drilling → heavy copper → whole plate plating → outer graphics
Transfer → graphic plating → etching → welding resistance → surface treatment → processing and forming etc..
Often occurs the bad problem of plated through-hole in assist side manufacturing process, analysis reason is broadly divided into following several
Class: 1, it in figure transfer process generates dry film and enters hole situation；2, it is bad that heavy copper is generated when heavy process for copper due to bubble etc.；
3, dust plug-hole phenomenon when bore process；4, it is generated when tin plating technique tin plating bad；5, whole plate plating and when graphic plating technique
Lead to the bad phenomenon etc. of plated through-hole in copper ashes access aperture.Above-mentioned reason has caused the having no copper in the holes of the plated through-hole of wiring board
The problem of, cause wiring board scrappage high, increases the cost manufactured, influence due date.Pass through the system to scrappage
Meter analysis, dry film enter hole, drilling dust plug-hole and heavy copper it is bad be three main causes for causing wiring board to be scrapped.
Summary of the invention
The present invention enters hole, drilling dust plug-hole for dry film and heavy copper is bad causes the bad problem of plated through-hole, provides
One kind is generated by drilling dust suction, heavy copper cylinder pair slot heating and super roughening pretreatment mode to improve in assist side manufacturing process
The undesirable method of plated through-hole.
To achieve the above object, the invention adopts the following technical scheme:
It is a kind of to improve the undesirable method of plated through-hole generated in assist side manufacturing process, including work is manufactured to wiring board
The improvement of sequence, wiring board manufacturing process include drilling operating, heavy copper process, whole plate electroplating work procedure and make outer-layer circuit process,
Complete heavy copper process using heavy copper cash in heavy copper process, heavy copper cash include for sink process for copper major trough, for the pair of overflow
Heating system between major trough and secondary slot each other by circulated filter system connection is set on secondary slot by slot and heating system, into
When capable heavy copper process, heating system heats secondary slot.
Further, in heavy copper process, heavy copper cash are additionally provided with the heavy copper basket for placing production plate, and heavy copper basket is inclined
Tiltedly it is set in major trough.
Further, the side of heavy copper basket is equipped with slot, and the slot angle vertical of heavy copper basket tilts 3 °.
Further, after heavy copper process, production plate is placed in air, control time≤2 hour of placement.
It further, further include that dust suction processing is carried out to processing hole in drilling in drilling operating.
Further, in drilling operating, dust suction processing carries out dust suction using the negative pressure of 1000~1500Kpa.
Further, it in drilling operating, when processing the aperture≤0.5mm in hole, is drilled using twolip single flute drill nozzle.
It further, further include in outer layer pretreatment procedure, for processing the aperture in hole in production outer-layer circuit process
The pretreatment mode that the production plate of≤0.25mm uses is the super roughening nog plate mode that carries out by chemical method.
Further, make in outer-layer circuit process, including patch dry film and developing procedure, for process the aperture in hole≤
The production plate of 0.25mm, this period that patch dry film to developing procedure is completed need to be less than 12 hours.
It further, further include pin sensing process, for the hole in back drill hole and/or processing hole with radius-thickness ratio 8:1 or more
Diameter≤0.25mm production plate, complete wiring board manufacture in drilling operating after and whole plate electroplating work procedure after respectively device to hole into
Row Quality Detection and performance detection.
Compared with prior art, the beneficial effects of the present invention are: this improves the metal generated in assist side manufacturing process
Change the undesirable method in hole, dust suction processing is carried out to processing hole in drilling, the dust generated when drilling is inhaled in time
It walks, effectively prevents drilling dust plug-hole.Heating system is set in the secondary slot of heavy copper cylinder, the heavy copper liquid of secondary slot is by following
Ring filtration system is delivered to major trough, avoids the reaction caused by major trough directly heats and accelerates the case where causing copper powder plug-hole,
Effectively reduce the bad situation of the heavy copper in hole.In outer layer pretreatment procedure using processing before super roughening, can effectively prevent
Only dry film plug-hole, above-mentioned three kinds of technique can integrally improve wiring board manufacture quality, reduce scrappage, saved and be produced into
This.
Specific embodiment
In order to more fully understand technology contents of the invention, combined with specific embodiments below to technical solution of the present invention
It is described further and illustrates.
Embodiment
The technological process of production of wiring board is general are as follows: and sawing sheet → inner figure transfer → internal layer etching → lamination → drilling →
Heavy copper → whole plate is electroplated → makes outer-layer circuit → welding resistance → surface treatment → processing and forming etc., and the present invention provides a kind of improve
The undesirable method of the plated through-hole generated in route board manufacturing process, specially in drilling operating wherein, heavy copper process, whole plate
Electroplating work procedure and production outer-layer circuit process improve, specific as follows to solve the problems, such as that plated through-hole is bad in wiring board:
Wherein drilling operating is such that is drilled using the drilling parameter of high revolving speed, the low depth of cut, when drilling
Dust suction processing is carried out to processing hole, dust suction processing carries out dust suction using the negative pressure of 1000~1500Kpa, for for the hole for processing hole
When diameter≤0.5mm, using twolip single flute drill nozzle.After the completion of drilling operating, back drill hole for radius-thickness ratio 8:1 or more and/or
Aperture≤0.25mm production plate that person processes hole carries out pin sensing, prevents bad hole from entering the next step.
Copper process of wherein sinking is such that in heavy copper process, wherein heavy using heavy copper cash completion in heavy copper process
Copper process, heavy copper cash include for sink process for copper major trough, for the secondary slot, heavy copper basket and heating system of overflow, major trough and
Between secondary slot each other by circulated filter system connection, heating system is set in secondary slot, by being heated again to secondary slot
It is recycled to major trough by circulated filter system, major trough reaction can effectively be avoided to accelerate the phenomenon that reducing copper powder plug-hole.
It is equipped with slot in the side of heavy copper basket, the slot angle vertical of heavy copper basket tilts 3 °, i.e., by the metal aperture court of required heavy copper
To tilting down 3 °, also into once the phenomenon that reducing copper powder plug-hole.
After heavy copper process, production plate originally is placed in air using board slot is supported, and feeding board slot is a kind of special cool puts
The groove body of plate is produced, plate is produced now and is placed in air without using board slot is supported, control time≤2 hour of placement, to prevent
When placing production plate, friction causes heavy layers of copper and produces the feelings that the edges of boards substrate generation of plate falls off between production plate and heavy copper basket
Condition.
After whole plate electroplating work procedure, the aperture≤0.25mm in back drill hole and/or processing hole to radius-thickness ratio 8:1 or more
It produces plate and carries out pin sensing, prevent bad hole from entering the next step.
Wherein production outer-layer circuit process is such that in outer layer pretreatment procedure, for processing the aperture in hole
The production plate of≤0.25mm is using the super pretreatment mode being roughened.Super roughening is a kind of processing mode using chemical nog plate.It is right
Aperture≤0.25mm production plate in processing hole does not allow to produce using volcanic ash pre-treatment, can prevent dry film plug-hole.?
It pastes dry film to developing procedure and completes this period, need to be less than for processing the storage period of aperture≤0.25mm production plate in hole
12 hours, enter hole probability to reduce dry film gummosis.
The pretreatment mode for wherein surpassing roughening is such that into plate (checking supplied materials plate face quality) → pickling → overflow
Washing → nonwoven fabric polish-brush nog plate → pressurization washing → HF washing → inspection → super roughening → overflow washing → HF washing pickling →
Overflow washing → ultrasonic wave water washing → HF washing → high-pressure washing → dry plate combination → ejecting plate (the plate face quality that inspection is grinding into plate).
This improves the undesirable method of plated through-hole generated in assist side manufacturing process, carries out in drilling to processing hole
Dust suction processing, enables the dust generated when drilling to be timely sucked away, and effectively prevents drilling dust plug-hole.It will heating
System is set in the secondary slot of heavy copper cylinder, and the heavy copper liquid of secondary slot is delivered to major trough by circulated filter system, is avoided in major trough
The case where causing copper powder plug-hole, is accelerated in the reaction as caused by heat when system heats, and effectively reduces the undesirable feelings of heavy copper
Condition.In outer layer pretreatment procedure using processing before super roughening, and after the completion of pasting dry film to developing procedure, production plate is stopped
Put the time can reduce dry film gummosis and enters hole probability less than 12 hours, and be effectively prevented dry film plug-hole, whole to improve route
Plate manufactures quality, reduces scrappage, has saved production cost.
It is described above that technology contents of the invention are only further illustrated with embodiment, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (7)
1. a kind of improve the undesirable method of plated through-hole generated in assist side manufacturing process, including to wiring board manufacturing process
Improvement, the wiring board manufacturing process includes drilling operating, heavy copper process, whole plate electroplating work procedure and production outer-layer circuit work
Sequence, which is characterized in that complete heavy copper process using heavy copper cash in the heavy copper process, the heavy copper cash include for sinking coppersmith
The major trough of skill, secondary slot and heating system for overflow, between the major trough and secondary slot each other by circulated filter system connection,
The heating system is set on secondary slot, when carrying out heavy copper process, heating system heats secondary slot；The production outer layer
In route process, including patch dry film and developing procedure, for processing aperture≤0.25mm production plate in hole, patch dry film to development
This period that process is completed need to be less than 12 hours；It further include being inhaled in drilling to processing hole in the drilling operating
Dirt processing, dust suction processing carry out dust suction using the negative pressure of 1000~1500Kpa.
2. according to claim 1 improve the undesirable method of plated through-hole generated in assist side manufacturing process, spy
Sign is: in the heavy copper process, the heavy copper cash are additionally provided with the heavy copper basket for placing production plate, and heavy copper basket is inclined
Tiltedly it is set in major trough.
3. according to claim 2 improve the undesirable method of plated through-hole generated in assist side manufacturing process, spy
Sign is: the side of the heavy copper basket is equipped with slot, and the slot angle vertical of the heavy copper basket tilts 3 °.
4. as claimed in any of claims 1 to 3 improve the plated through-hole generated in assist side manufacturing process not
Good method, it is characterised in that: after the heavy copper process, production plate is placed in air, and control time≤2 of placement are small
When.
5. according to claim 1 improve the undesirable method of plated through-hole generated in assist side manufacturing process, spy
Sign is: in the drilling operating, when processing the aperture≤0.5mm in hole, being drilled using twolip single flute drill nozzle.
6. according to claim 1 improve the undesirable method of plated through-hole generated in assist side manufacturing process, spy
Sign is: in the production outer-layer circuit process, further include in outer layer pretreatment procedure, for process hole aperture≤
The pretreatment mode that the production plate of 0.25mm uses is the super roughening nog plate mode that carries out by chemical method.
7. according to claim 1 improve the undesirable method of plated through-hole generated in assist side manufacturing process, spy
Sign is: further include pin sensing process, for radius-thickness ratio 8:1 or more back drill hole and/or process hole aperture≤
The production plate of 0.25mm, device to hole carries out product respectively after completing the drilling operating in wiring board manufacture and after whole plate electroplating work procedure
Quality detection and performance detection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710516409.2A CN107231754B (en) | 2017-06-29 | 2017-06-29 | It is a kind of to improve the undesirable method of plated through-hole generated in assist side manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710516409.2A CN107231754B (en) | 2017-06-29 | 2017-06-29 | It is a kind of to improve the undesirable method of plated through-hole generated in assist side manufacturing process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107231754A CN107231754A (en) | 2017-10-03 |
| CN107231754B true CN107231754B (en) | 2019-10-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710516409.2A Active CN107231754B (en) | 2017-06-29 | 2017-06-29 | It is a kind of to improve the undesirable method of plated through-hole generated in assist side manufacturing process |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109587968A (en) * | 2018-12-11 | 2019-04-05 | 深圳崇达多层线路板有限公司 | One kind preventing consent or the undesirable PCB production method of plated hole |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6947283B2 (en) * | 2002-10-01 | 2005-09-20 | Intel Corporation | Heat sink and retaining clip assembly |
| KR100846318B1 (en) * | 2007-01-30 | 2008-07-15 | 삼성전기주식회사 | Electroless Plating Apparatus and Electroless Plating Method |
| CN202610378U (en) * | 2011-12-21 | 2012-12-19 | 北大方正集团有限公司 | System for filtering metallic coating of printed circuit board |
| CN103290395B (en) * | 2013-06-04 | 2016-04-27 | 中国电子科技集团公司第四十五研究所 | Film belt chemical plating device with heating function and method thereof |
| CN104684266B (en) * | 2015-02-04 | 2018-03-09 | 江门崇达电路技术有限公司 | A kind of preparation method of the mute golden circuit of wiring board |
| CN105163521B (en) * | 2015-08-26 | 2017-11-17 | 昆山苏杭电路板有限公司 | Aperture hole metallization processing method |
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| CN107231754A (en) | 2017-10-03 |
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