CN107204265B - Lead interior crossing type multi-level depressurization collector - Google Patents
Lead interior crossing type multi-level depressurization collector Download PDFInfo
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- CN107204265B CN107204265B CN201710319454.9A CN201710319454A CN107204265B CN 107204265 B CN107204265 B CN 107204265B CN 201710319454 A CN201710319454 A CN 201710319454A CN 107204265 B CN107204265 B CN 107204265B
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- 229910052573 porcelain Inorganic materials 0.000 claims abstract description 108
- 229910000679 solder Inorganic materials 0.000 claims abstract description 39
- 239000000919 ceramic Substances 0.000 claims abstract description 19
- 230000000712 assembly Effects 0.000 claims description 4
- 238000000429 assembly Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 238000009413 insulation Methods 0.000 abstract description 157
- 230000004308 accommodation Effects 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 12
- 238000001192 hot extrusion Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000013461 design Methods 0.000 description 7
- 230000005611 electricity Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000001465 metallisation Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 229910015371 AuCu Inorganic materials 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 229910052593 corundum Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 238000001291 vacuum drying Methods 0.000 description 4
- 229910001845 yogo sapphire Inorganic materials 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 230000000994 depressogenic effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
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- 239000000126 substance Substances 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
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- 230000000737 periodic effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J23/00—Details of transit-time tubes of the types covered by group H01J25/00
- H01J23/02—Electrodes; Magnetic control means; Screens
- H01J23/027—Collectors
- H01J23/0275—Multistage collectors
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- Insulators (AREA)
Abstract
本公开提供了一种引线内穿式多级降压收集极。该引线内穿式多级降压收集极包括：依次设置的M级收集极；以及N瓣绝缘瓷瓣，该N瓣绝缘瓷瓣共同围成内筒结构，其内侧形成容置空间，M级收集极容置于该容置空间内。其中，N瓣绝缘瓷瓣中至少其中之一绝缘瓷瓣中具有电极引线孔，M级收集极中其中一级收集极的电极引线通过该电极引线孔连接至引线内穿式多级降压收集极的尾部，M和N均为大于1的整数。本公开收集极电极引线从绝缘瓷中间引线孔引出，不仅增加了极与极之间、各极与地之间的绝缘性能，而且节省了空间；电极与绝缘瓷之间，绝缘瓷与外筒之间均用焊料焊接，增加了牢固性。
The present disclosure provides a lead-through multi-stage step-down collector. The lead-through multi-stage depressurization collector includes: M-level collectors arranged in sequence; and N-lobed insulating ceramic petals, the N-lobed insulating ceramic petals together form an inner cylinder structure, and the inner side forms an accommodation space, M-level The collector is accommodated in the accommodating space. Wherein, at least one of the N-lobed insulating ceramic petals has an electrode lead hole, and the electrode lead of one of the M-level collectors is connected to the lead-through multi-stage depressurization collector through the electrode lead hole. At the tail of the pole, both M and N are integers greater than 1. The collector electrode lead of the present disclosure is drawn out from the middle lead hole of the insulating porcelain, which not only increases the insulation performance between the poles and between the poles and the ground, but also saves space; between the electrode and the insulating porcelain, between the insulating porcelain and the outer cylinder Solder is used between them to increase the firmness.
Description
Technical field
This disclosure relates to microwave electron tube technical field more particularly to it is a kind of miniaturization, light weight lead in wear
Formula multi-level depressurization collector.
Background technique
Travelling-wave tubes (can be easy to get several as highly important microwave power device because its individual devices working frequency is wide
The bandwidth of a octave is suitable for electronic warfare use), it is output power, high-efficient, therefore be widely used in electronic countermeasure, electricity
The fields such as sub- war, radar, meteorological observation, space measurement and satellite communication.In general, various applications are to devices such as travelling-wave tubes
It is required that being not quite similar.But generally speaking, higher power and higher efficiency be it is various apply showed become jointly
Gesture.Travelling-wave tubes effect is improved due to the finiteness of energy supply especially for space measurement and satellite communication space travelling wave tube
Rate becomes travelling-wave tubes development and production first has to the problem of paying close attention to.
The basic principle of travelling-wave tubes is electromagnetic wave interaction synchronous with electronics note, converts microwave energy for electronics note energy
Amount.
Travelling-wave tubes generally comprises electron gun, magnetic focusing system, slow-wave structure, delivery of energy coupled structure, single-stage or multilevel decompression
Five parts of collector.
The electronics gone out from emission of cathode, accelerates in electron gun, is compressed into electron beam, and maintained by Periodic magnetic focusing system
At thin electron beam, helix radio frequency system is passed through；Slow wave system reduces controlling electromagnetic wave phase velocity, realizes that electronics is dynamic in radio frequency system
It can be converted into microwave energy, amplify signal；The microwave being amplified enters antenna transmission systems by delivery of energy coupled system；?
The electron beam for surrendering portion of energy, finally enters multi-level depressurization collector, is decelerated before reaching collector, portion of energy obtains
To recycling；Remaining electron energy is converted into thermal energy in collector.Wherein, the effect of multi-level depressurization collector is that recycling is passed through
The remaining kinetic energy in electronics note after Beam and wave interaction, to greatly improve the gross efficiency of device.
Multi-level depressurization collector can greatly improve the efficiency of the vacuum electron devices such as travelling-wave tubes.Series is more, and ability is returned
Fruit of producing effects is better.But series is more, and the volume and weight of collector is bigger.Therefore, design easily assembly, high efficiency, miniaturization, gently
The multi-level depressurization collector of weight is the important link in entire travelling-wave tubes design.
In addition, in recent years, there is a kind of concept of the Microwave Power Module of new integrated, modularization and miniaturization,
And practical level has been rapidly reached it.The main feature of Microwave Power Module is exactly to minimize.For example, Northrop Grumman
The volume of the Microwave Power Module of the 6-18GHz of Corporation is only 175mm × 140mm × 20mm.This means that installation
Traveling wave pipe diameter in the Microwave Power Module should be less than 20mm.
And as well known to the industry, traveling wave pipe diameter the best part is usually multi-level depressurization collector portion
Point.Because the diameter of multi-level depressurization collector is bigger, high efficiency more easy to accomplish, therefore efficient multi-level depressurization collector
Diameter often reaches 40mm~60mm.Such collector size limits its application in microwave and millimeter wave power module.
Summary of the invention
(1) technical problems to be solved
Present disclose provides a kind of miniaturizations, the lead interior crossing type multi-level depressurization collector of light weight, at least partly to solve
Technical problem certainly set forth above.
(2) technical solution
Disclosure lead interior crossing type multi-level depressurization collector includes: the M grade collector set gradually；And N valve insulation porcelain
Valve, the N valve insulation porcelain valve surround inner tube structure jointly, and inside forms accommodating space, and M grades of collectors are placed in the accommodating space
It is interior.Wherein, there is electrode lead hole, wherein level-one in M grades of collectors in N valve insulation porcelain valve at least one insulation porcelain valve
The contact conductor of collector is connected to the tail portion of lead interior crossing type multi-level depressurization collector by the electrode lead hole, and M and N are equal
For the integer greater than 1.
In some embodiments of the present disclosure, N valve insulation porcelain valve is circumferentially uniformly distributed；Have between adjacent two insulation porcelains valve 8 °-
10 ° of gap.
In some embodiments of the present disclosure, N≤M-1, wherein the M-1 in M grades of collectors in addition to most end level-one collector
Grade collector is corresponding with one of the insulation porcelain valve of M-1 valve respectively, the electricity of one of the M-1 grades of collector collector
Pole lead is connected to the tail portion of lead interior crossing type multi-level depressurization collector by the electrode lead hole in corresponding insulation porcelain valve.
In some embodiments of the present disclosure, N=M；The contact conductor of most end level-one collector directly connects in M grades of collectors
It is connected to the tail portion of lead interior crossing type multi-level depressurization collector.
In some embodiments of the present disclosure, for any collector in M grades of collectors comprising: collector ontology is in
The tubular that upper end is collapsed；Collector positions ridge, is arranged around the outside of collector ontology；The open solder bath of collector, by
Collector position ridge intermediate position concave shape at；Wherein, the position that each collector is corresponded in the insulation porcelain valve of N valve offers
Locating slot, the locating slot pass through metalized, and collector is welded in outside by the solder in the open solder bath of collector
Insulation porcelain valve on.
In some embodiments of the present disclosure, for any collector in M-1 grades of collectors, in the open weldering of collector
The position that hopper corresponds to lead opens up fairlead, and the front end of respective electrode lead is welded in the fairlead.
In some embodiments of the present disclosure, on each insulation porcelain valve, it is provided between adjacent collector locating slot
Insulation tank.
In some embodiments of the present disclosure, further includes: outer cylinder is sheathed on the outside of inner tube structure；Wherein, inner cylinder is constituted
The N valve insulation porcelain valve of structure and the contact surface of outer cylinder metallize, and the N valve insulation porcelain valve after metallizing is welded on outer cylinder.
In some embodiments of the present disclosure, further includes: tail-hood component is covered on the tail end of outer cylinder；And output end cap
Component is covered on the output end of outer cylinder
In some embodiments of the present disclosure, tail-hood component includes: collector tail-hood ontology；And M stem group
Part draws outer cylinder for the contact conductor of M grades of collectors, and each lead column assembly includes: the lead porcelain knob ontology that outside is metallized；
And the closure under closure on the lead porcelain knob of lead porcelain knob ontology top and bottom and lead porcelain knob is respectively welded.
(3) beneficial effect
It can be seen from the above technical proposal that disclosure lead interior crossing type multi-level depressurization collector at least have it is beneficial below
One of effect:
(1) collectors at different levels are clamped using more valve insulating ceramicses and be assemblied within collector outer cylinder, more valve insulation potteries
Porcelain surrounds insulation system jointly, reduces the assembly difficulty of multi-level depressurization collector.
(2) there is 8 ° -10 ° of gap between two adjacent insulation porcelain valves.In every valve insulation porcelain inner surface, for each collection
A locating slot is arranged in pole electrode, so that collector electrodes at different levels are successively positioned at respective design position.
(3) collector contact conductors at different levels are drawn from insulation porcelain middle leads hole, are not only increased between pole and pole, each pole
Insulation performance between ground, and save space；Between electrode and insulation porcelain, welded with solder between insulation porcelain and outer cylinder
It connects, increases fastness.
(4) correspond to crossover position between the first and second collector in every valve insulation porcelain and one insulation tank is set, to enhance the
One, the insulation performance between two poles；Correspond to crossover position between second and third pole in every valve insulation porcelain and one insulation tank be set,
To enhance the insulation performance between second and third pole；Correspond to crossover position between third and fourth pole in every valve insulation porcelain and is arranged one
Insulation tank, to enhance the insulation performance between third and fourth pole；It is arranged in insulation porcelain valve tail end (i.e. close to the 4th collector) appearance
One circle vertical slot, to increase the pressure resistance between the contact conductor being pierced by among insulation porcelain valve and collector outer cylinder, vertical slot depth view
Collector is over the ground depending on maximum voltage.
(5) except each collector electrode gabarit, respective positioning ridge is set, they and be arranged on insulating ceramics
Corresponding locating slot cooperation, enables each electrode to be positioned on their scheduled design positions.A circle is carved between positioning chi chung to open
Formula solder bath is put to place solder, corresponding detent groove surface metallizes on insulating ceramics, can make in this way insulation porcelain with
It is securely welded between electrode.
(6) each contact conductor of collector self-insulating porcelain middle leads hole is drawn, last pole is directly led out, and all leads are worn
It crosses collector tail-hood and corresponds to lead column assembly.Tail portion by a tail-hood, several lead-in wire sealing parts and equivalent amount lead wire insulation
The quantity of porcelain composition collector tail-hood component, lead-in wire sealing part and lead wire insulation porcelain is identical as collector series.
(7) the above-mentioned miniaturization lead interior crossing type multi-level depressurization collector assembled is welded using appropriate mold
Hot extrusion is connect and carried out, lead interior crossing type miniaturized multi-stage depressed collector finished product is ultimately formed.
Detailed description of the invention
Fig. 1 is the cross-sectional view according to embodiment of the present disclosure lead interior crossing type multi-level depressurization collector.
Fig. 2A, Fig. 2 B, Fig. 2 C and Fig. 2 D are respectively collector component in the multi-level depressurization collector of lead interior crossing type shown in Fig. 1
The first collector, the second collector, third collector and the 4th collector cross-sectional view.
Fig. 3 is the schematic diagram of insulation system component in lead interior crossing type multi-level depressurization collector shown in Fig. 1.
Fig. 4 A, Fig. 4 B, Fig. 4 C and Fig. 4 D are respectively insulation system group in the multi-level depressurization collector of lead interior crossing type shown in Fig. 1
First insulation porcelain valve of part, the second insulation porcelain valve, third insulation porcelain valve and the 4th insulation porcelain valve schematic diagram.
Fig. 5 is the schematic diagram of the insulation porcelain valve metallization in lead interior crossing type multi-level depressurization collector shown in Fig. 1.
Fig. 6 A~Fig. 6 D is collector in lead interior crossing type multi-level depressurization collector shown in Fig. 1 and corresponding insulation porcelain valve group
The schematic diagram of dress.
Fig. 7 is that assembled collector and insulation porcelain valve are looked up in lead interior crossing type multi-level depressurization collector shown in Fig. 1
Figure.
Fig. 8 is the collector component hot extrusion installation diagram in multi-level depressurization collector shown in Fig. 1.
Fig. 9 A is the signal of collector lead porcelain knob base metal in lead interior crossing type multi-level depressurization collector shown in Fig. 1
Figure.
Fig. 9 B is the schematic diagram of collector lead porcelain knob component in lead interior crossing type multi-level depressurization collector shown in Fig. 1.
Figure 10 be shown in Fig. 1 in lead interior crossing type multi-level depressurization collector by lead column assembly and collector tail-hood ontology into
The schematic diagram of row welding.
Figure 11 A and Figure 11 B are respectively the collector tail-hood after welding in the multi-level depressurization collector of lead interior crossing type shown in Fig. 1
The bottom view and cross-sectional view of component.
[embodiment of the present disclosure main element symbol description in attached drawing]
100- collector component；
110- first order collector；
111- the first collector ontology；112- the first collector entrance；
The first collector of 113- inner cavity；The first collector of 114- positions ridge；
The open solder bath of the first collector of 115-；116- first electrode lead.
The second level 120- collector；
121- the second collector ontology；122- the second collector entrance；
The second collector of 123- inner cavity；The second collector of 124- positions ridge；
The open solder bath of the second collector of 125-；126- second electrode lead.
130- third level collector；
131- third collector ontology；132- third collector entrance；
133- third collector inner cavity；134- third collector positions ridge；
The open solder bath of 135- third collector；136- third contact conductor；
137- third collector baffle；138- third collector tail portion.
140- fourth stage collector
The 4th collector ontology of 141-；The 4th collector entrance of 142-；
The 4th collector inner cavity 143-；The 4th collector of 144- positions ridge；
The 4th open solder bath of collector of 145-；The 4th collector tail-hood of 147-；
The 4th contact conductor of 146-.
200- insulation system component；
210- the first insulation porcelain valve；
211- the first collector locating slot；Insulation tank between the first and second collector of 212-；
213- the second collector locating slot；Insulation tank between second and third collector of 214-；
215- third collector locating slot；Insulation tank between third and fourth collector of 216-；
The 4th collector locating slot of 217-；Insulation tank between the 4th collector of 218- and outer cylinder；
219- insulation vertical slot；P1- first electrode fairlead.
220- the second insulation porcelain valve；
221- the first collector locating slot；Insulation tank between the first and second collector of 222-；
223- the second collector locating slot；Insulation tank between second and third collector of 224-；
225- third collector locating slot；Insulation tank between third and fourth collector of 226-；
The 4th collector locating slot of 227-；Insulation tank between the 4th collector of 228- and outer cylinder；
229- insulation vertical slot；P2- second electrode fairlead.
230- third insulation porcelain valve；
231- the first collector locating slot；Insulation tank between the first and second collector of 232-；
233- the second collector locating slot；Insulation tank between second and third collector of 234-；
235- third collector locating slot；Insulation tank between third and fourth collector of 236-；
The 4th collector locating slot of 237-；Insulation tank between the 4th collector of 238- and outer cylinder；
239- insulation vertical slot；P3- third electrode lead hole.
The 4th insulation porcelain valve of 240-；
241- the first collector locating slot；Insulation tank between the first and second collector of 242-；
243- the second collector locating slot；Insulation tank between second and third collector of 244-；
245- third collector locating slot；Insulation tank between third and fourth collector of 246-；
The 4th collector locating slot of 247-；Insulation tank between the 4th collector of 248- and outer cylinder；
249- insulation vertical slot.
300- outer cylinder；
400- collector tail-hood component；
410 lead column assemblies
411- lead porcelain knob ontology；412- stem weldment；
413- stem weldment；
A1- collector tail-hood component cushion block；A2- and collector tail-hood component briquetting.
420- collector tail-hood ontology
500- exports end-cap assembly.
Specific embodiment
The disclosure reduces assembly difficulty, further, collectors at different levels are electric by the way that insulation porcelain is designed as more valve structures
Pole lead is drawn from insulation porcelain valve medial small hole, is not only increased insulation performance and is saved space, in identical collector electricity
Minimize collector outer diameter in the case of the internal diameter of pole to realize the high efficiency under miniaturization.
For the purposes, technical schemes and advantages of the disclosure are more clearly understood, below in conjunction with specific embodiment, and reference
The disclosure is further described in attached drawing.
In an exemplary embodiment of the disclosure, a kind of lead interior crossing type multi-level depressurization collector is provided.Fig. 1 is
According to the cross-sectional view of embodiment of the present disclosure lead interior crossing type multi-level depressurization collector.As shown in Figure 1, the present embodiment lead interior crossing type
Multi-level depressurization collector includes: collector component 100, insulation system component 200, outer cylinder 300,400 and of collector tail-hood component
Export end-cap assembly 500.
Wherein, insulation system component 200 includes: the insulation porcelain valve of N valve, and the insulation porcelain valve of the N valve surrounds inner cylinder knot jointly
Structure, inside form accommodating space.Collector component 100 includes: the M grade collector set gradually, and it is empty to be fixed on the accommodating
In.Outer cylinder 300 is sheathed on the outside of the inner tube structure.Tail-hood component 400 is covered on the tail end of the outer cylinder.Output end
Cap assemblies 500 are covered on the output end of the outer cylinder.
Each component part of the present embodiment multi-level depressurization collector is described in detail individually below.
In the present embodiment, M=4, i.e. collector component 100 include the 4 grades of collectors set gradually, are respectively as follows: the first order
Collector 110, second level collector 120, third level collector 130 and fourth stage collector 140.
Fig. 2A is the cross-sectional view of the first collector of collector component in multi-level depressurization collector shown in Fig. 1.Such as Fig. 1 and figure
Shown in 2A, which includes: the first collector ontology 111, the tubular collapsed in upper end；First collector entrance
112, positioned at the upper end of the first collector ontology；First collector inner cavity 113 is formed in the first collector ontology
Inside；First collector positions ridge 114, is arranged around the outside of the first collector ontology；First collector is open
Solder bath 115, by the first collector positioning ridge intermediate position concave shape at.It is right in the open solder bath 115 of the first collector
The position of lead is answered to open up fairlead.First electrode lead 116 is welded in the fairlead by solder.
Fig. 2 B is the cross-sectional view of the second collector of collector component in multi-level depressurization collector shown in Fig. 1.Such as Fig. 1 and figure
Shown in 2B, which includes: the second collector ontology 121, the tubular collapsed in upper end；Second collector entrance
122, positioned at the upper end of the second collector ontology；Second collector inner cavity 123 is formed in the second collector ontology
Inside；Second collector positions ridge 124, is arranged around the outside of the second collector ontology；Second collector is open
Solder bath 125, by the second collector positioning ridge intermediate position concave shape at.It is right in the open solder bath 125 of the second collector
The position of lead is answered to open up fairlead.Second electrode lead 126 is welded in the fairlead by solder.
Fig. 2 C is the cross-sectional view of the third collector of collector component in multi-level depressurization collector shown in Fig. 1.Such as Fig. 1 and figure
Shown in 2C, which includes: third collector ontology 131, the tubular collapsed in upper end；Third collector entrance
132, positioned at the upper end of the third collector ontology；Third collector inner cavity 133 is formed in the third collector ontology
Inside；Third collector positions ridge 134, is arranged around the outside of the third collector ontology；Third collector is open
Solder bath 135, by third collector positioning ridge intermediate position concave shape at；Third collector baffle 137 is set to described
The outlet side of three collector inner cavities；Third collector tail portion 138 is formed in the middle part of the third collector baffle 137.
Fairlead is opened up in the position of the corresponding lead of the open solder bath 135 of third collector.Third contact conductor 136 is logical
Solder is crossed to be welded in the fairlead.
Fig. 2 D is the cross-sectional view of the third collector of collector component in multi-level depressurization collector shown in Fig. 1.Such as Fig. 1 and figure
Shown in 2D, the 4th collector 140 includes: the 4th collector ontology 141, the tubular collapsed in upper end；4th collector entrance
142, positioned at the upper end of the 4th collector ontology；4th collector inner cavity 143 is formed in the 4th collector ontology
Inside；4th collector positions ridge 144, is arranged around the outside of the 4th collector ontology；4th collector is open
Solder bath 145, by the 4th collector positioning ridge intermediate position concave shape at；4th collector tail-hood 147 is set to described
The outlet side of four collector inner cavities；4th contact conductor 146 is welded on the outside of the 4th collector tail-hood by solder.
For the collector of level Four, it is using the methods of vehicle, milling processing collector ontology, positions ridge, open
Solder bath, inner cavity etc. after machining, detect whether the obtained each dimensional parameters of structure meet design requirement, and laggard
Row chemical cleaning is with spare.
Fig. 3 is the structural schematic diagram of insulation system component in multi-level depressurization collector shown in Fig. 1, view directions be along
The axial direction of multi-level depressurization collector.As shown in figure 3, N=4, i.e. insulation system component 200 include: the exhausted of 4 valves in the present embodiment
Edge porcelain the-the first insulation porcelain of valve valve 210, the second insulation porcelain valve 220, third insulation porcelain valve 230, the 4th insulation porcelain valve 240.4 valve
Insulation porcelain valve it is circumferentially uniformly distributed, surround inner tube structure, inside forms accommodating space.Have between two adjacent insulation porcelain valves
8 ° -10 ° of gap.
It will be apparent to those skilled in the art that the value of N and M is not limited with this embodiment.In other implementations of the disclosure
In example, N and M can also take other values, and N is also not necessarily equal to M.For example, in another embodiment of the disclosure, N
=3, M=3.
Further, it is to be appreciated that the electrode for being also possible to the collector of a part draws in disclosure other embodiments
Line is connected to the tail portion of lead interior crossing type multi-level depressurization collector by the electrode lead hole in insulation porcelain.
Referring to figure 3., in the first insulation porcelain valve 210, position corresponding with the first collector has and draws for first electrode
The first electrode fairlead P1 that line passes through.In the second insulation porcelain valve 220, position corresponding with the second collector has for the
The second electrode fairlead P2 that two contact conductors pass through.In third insulation porcelain valve 230, position corresponding with third collector,
With the third electrode lead hole P3 passed through for third contact conductor.
Fig. 4 A is the schematic diagram of the first insulation porcelain valve of insulation system component in multi-level depressurization collector shown in Fig. 1.Referring to
Fig. 3 and Fig. 4 A, the first insulation porcelain valve 210 use BeO 99%, Al2O399%, the materials such as AlN or BN manufacture, and on it according to
Insulation tank 212 between the first collector locating slot 211 of secondary processing, the first and second collector, the second collector locating slot 213, the
Two, the insulation tank 214 between three collectors, third collector locating slot 215, the insulation tank 216 between third and fourth collector,
4th collector locating slot 217.In addition, being additionally provided with insulation on the first insulation porcelain valve between the 4th collector and outer cylinder
Slot 218.In the first insulation porcelain between each collector and outer cylinder, it is additionally provided with insulation vertical slot 219.
Referring to figure 3. with Fig. 4 A, in the first insulation porcelain valve 210, position corresponding with the first collector has and supplies first
The first electrode fairlead P1 that contact conductor passes through.
Fig. 4 B is the schematic diagram of the second insulation porcelain valve of insulation system component in multi-level depressurization collector shown in Fig. 1.Referring to
Fig. 3 and Fig. 4 B, using BeO 99%, Al2O399%, the materials such as AlN or BN manufacture the second insulation porcelain valve 220, and add on it
Insulation tank 222 between the first collector of work locating slot 221, the first and second collector, the second collector locating slot 223, second,
Insulation tank 224 between three collectors, third collector locating slot 225, the insulation tank 226 between third and fourth collector,
Four collector locating slots 227, the insulation tank 228 between the 4th collector and outer cylinder.In addition, between each collector and outer cylinder
In first insulation porcelain, insulation vertical slot 229 is also set up.
Referring to figure 3. with Fig. 4 B, in the second insulation porcelain valve 220, position corresponding with the second collector has and supplies second
The second electrode fairlead P2 that contact conductor passes through.
Fig. 4 C is the schematic diagram of the third insulation porcelain valve of insulation system component in multi-level depressurization collector shown in Fig. 1, depending on
Angular direction is along the axial direction perpendicular to multi-level depressurization collector.Referring to Fig. 3 and Fig. 4 C, using BeO 99%, Al2O399%, AlN
Or the materials such as BN manufacture third insulation porcelain valve 230, and process the first collector locating slot 231 on it；First and second collector it
Between insulation tank 232；Second collector locating slot 233；Insulation tank 234 between second and third collector；The positioning of third collector
Slot 235；Insulation tank 236 between third and fourth collector；4th collector locating slot 237；Between 4th collector and outer cylinder
Insulation tank 238.In addition, being additionally provided with insulation vertical slot 239 and third electricity in third insulation porcelain valve between each collector and outer cylinder
Pole fairlead P3.
Referring to figure 3. with Fig. 4 C, in third insulation porcelain valve 230, position corresponding with third collector has for third
The third electrode lead hole P3 that contact conductor passes through.
Fig. 4 D is the schematic diagram of the 4th insulation porcelain valve of insulation system component in multi-level depressurization collector shown in Fig. 1, depending on
Angular direction is along the axial direction perpendicular to multi-level depressurization collector.Referring to Fig. 3 and Fig. 4 D, using BeO 99%, Al2O399%, AlN
Or the materials such as BN manufacture the 4th insulation porcelain valve 240, and process the first collector locating slot 241 on it；First and second collector it
Between insulation tank 242；Second collector locating slot 243；Insulation tank 244 between second and third collector；The positioning of third collector
Slot 245；Insulation tank 246 between third and fourth collector；4th collector locating slot 247；Between 4th collector and outer cylinder
Insulation tank 248；Insulation vertical slot 249 between each pole and outer cylinder.
A~Fig. 4 D referring to figure 4., in the first insulation porcelain valve 210, the second insulation porcelain valve 220, third insulation porcelain valve 230,
In four insulation porcelain valves 240, the first collector locating slot 211,221,231,241 is away from endface position and of same size, and first and second
Insulation tank 212,222,232,242 between collector away from endface position and of same size, the second collector locating slot 213,
223,233,243 away from endface position and of same size, and the insulation tank 214,224,234,244 between second and third collector is away from end
Face position and of same size, third collector locating slot 215,225,235,245 away from endface position and of same size, third and fourth
Insulation tank 216,226,236,246 between collector away from endface position and of same size, the 4th collector locating slot 217,
227,237,247 away from endface position and of same size, the insulation tank 218,228,238,248 between the 4th collector and outer cylinder away from
Endface position and of same size, the insulation vertical slot 219,229,239,249 between each pole and outer cylinder is identical.Unlike unique
First electrode fairlead P1, second electrode fairlead P2, third electrode lead hole P3 are different, and the first insulation porcelain valve 210 is along lead
Hole vertical slot is opened to the first collector locating slot 211, and so on the second insulation porcelain valve 220 open to the second collector locating slot
At 223, third insulation porcelain valve 230 is opened to third collector locating slot 235.4th insulation porcelain valve 240 is without fairlead.
When making each collector, the first, second, third and fourth contact conductor is inserted into the first, second, third and fourth collector respectively
Corresponding fairlead, and be close to place a circle AuCu solder circle on the outside of respective fairlead, solder circle by φ 0.2mm solder
Silk production, inside radius, which is subject to, to be passed through for lead.First collector 110, the second collector 120,130 phase of third collector
The position for the fairlead answered can be found in Fig. 1, Fig. 2A~Fig. 2 C, Fig. 3 and Fig. 4 A~Fig. 4 C.Respective lead will be inserted into and in corresponding positions
The first collector 110, the second collector 120, third collector 130, the 4th collector 140 of placement location solder wire are placed in hydrogen furnace
Or welded in vacuum drying oven, so that lead is welded on collector.Welding technique is well-known technique, and details are not described herein again.
Referring to Fig. 5, by the first insulation porcelain valve 210, the second insulation porcelain valve 220, third insulation porcelain valve 230, the 4th insulation porcelain
Each collector locating slot metallization in valve 240.Insulation porcelain valve and outer cylinder contact surface are metallized, metallization technology is known skill
Art.
Referring to Fig. 6 A~Fig. 6 D, the solder ring having had been formed is put into each open solder bath, and is fixed.Take
One insulation porcelain valve, the second insulation porcelain valve, third insulation porcelain valve, the 4th insulation porcelain valve each one, successively by first electrode lead 116
It is pierced by from the first electrode fairlead P1 of the first insulation porcelain valve, as shown in Figure 6A；Second electrode lead 126 insulate from second
It is pierced by the second electrode fairlead P2 of porcelain valve, as shown in Figure 6B；Third electricity of the third contact conductor 136 from third insulation porcelain valve
It is pierced by the fairlead P3 of pole, as shown in Figure 6 C；4th contact conductor 146 is welded on the outside of the 4th collector tail-hood, stretches downwards
Out, as shown in Figure 6 D.
Then, each collector and insulation porcelain valve are assembled counterclockwise, Fig. 7 is assembled collector and insulation porcelain valve
Bottom view.Fig. 7 is please referred to, first electrode lead 116, second electrode lead 126, third contact conductor 136 pass through first respectively
Electrode lead hole P1, second electrode fairlead P2 and third electrode lead hole P3 are introduced to the bottom of collector component.And the 4th
Contact conductor 146 directly stretches to the bottom of collector component.
Referring to Fig. 8, solder skin is placed at position of metallizing on the outside of insulation system component 200, and entire component is put into outer cylinder
300, as hot extrusion component.Measurement first electrode entrance away from outer cylinder Edge Distance and is adjusted to meeting the requirements, will be assembled
Hot extrusion component is put on the second hot-extrusion mold, by materials systems such as steel, stainless steels with higher hardness and thermal expansion coefficient
The six valve hot extrusion collector internal models (third hot-extrusion mold) made are close to outer cylinder 300 and are placed, by the lower molybdenum of thermal expansion coefficient
The collector hot extrusion outer cylinder (the first hot-extrusion mold) of manufacture is inserted in outside six valve internal models.It then will entire assembled hot extrusion
Component and hot-extrusion mold are put into hydrogen furnace or vacuum drying oven and are welded.Welding technique is well-known technique, and details are not described herein again.
Using one of materials such as 4J29,4J33 or 4J34, the technique of vehicle is combined to process collector tail-hood ontology using milling
420, closure 413 under closure 412 and lead porcelain knob on lead porcelain knob, after examining size qualification, carries out chemical cleaning, surface layer
It is 3~5 μm of nickel plating, spare.
The outside of the lead porcelain knob ontology 411 of collector is metallized, metallization technology is well-known technique, such as Fig. 9 A institute
Show.Lead porcelain knob 411 after metallization is with closure 413 under closure 412 on lead porcelain knob and lead porcelain knob in metallization
A circle Ag or Au solder wire is placed in position, is put into hydrogen furnace or vacuum drying oven and is welded using related die, obtained stem
Component 410 is as shown in Figure 9 B.Lead column assembly 410 obtained must pass through airtight inspection.Obtain the finished product for meeting airtight requirement
It is spare.
Referring to Figure 10, four lead column assemblies 410 are put into the corresponding slot of collector tail-hood ontology 420, in stem
AgCu the or AuCu solder wire of 4- φ 0.4 is placed in component 410 and 420 junction of collector tail-hood ontology respectively, utilizes respective mode
Tool (collector tail-hood component cushion block A1 and collector tail-hood component briquetting A2) is assembled and is welded in vacuum drying oven or hydrogen furnace, is welded
Technology is well-known technique, and collector tail-hood component 400 is made.Figure 11 A and Figure 11 B are respectively the multistage of lead interior crossing type shown in Fig. 1
The bottom view and cross-sectional view of collector tail-hood component after being welded in depressed collector.
It (include: collector component 100, insulation system component 200, outer cylinder by the collector hot extrusion component after welding
300) each pole lead once penetrates in collector tail-hood stem, fixes a circle AgCu/AuCu solder wire in commissure, will be defeated
Out in end cap insertion collector outer cylinder, and a circle AgCu/AuCu solder wire is fixed in commissure, the component side of solder will be fixed
It is pressed on mold, and with collector tail-hood component briquetting.Collector component after welding is as shown in Figure 1.
In addition, output end-cap assembly 500 is the common design in this field, and different collectors is also to output end cap group
Part has special requirement, and those skilled in the art can know how to design, and details are not described herein again.
So far, attached drawing is had been combined the embodiment of the present disclosure is described in detail.It should be noted that in attached drawing or saying
In bright book text, the implementation for not being painted or describing is form known to a person of ordinary skill in the art in technical field, and
It is not described in detail.In addition, the above-mentioned definition to each element and method be not limited in mentioning in embodiment it is various specific
Structure, shape or mode, those of ordinary skill in the art simply can be changed or be replaced to it.
According to above description, those skilled in the art should have clearly disclosure lead interior crossing type multi-level depressurization collector
The understanding of Chu.
It is worn in a kind of lead for the miniaturization light weight of the electron tubes such as travelling-wave tubes in conclusion the disclosure provides
Formula multi-level depressurization collector, its main feature is that: it is collected using lead interior crossing type proposed by the present invention miniaturization, light weight multilevel decompression
Miniaturization and light weight may be implemented in the electron tubes such as the travelling-wave tubes of pole, can satisfy Microwave Power Module to electricity such as travelling-wave tubes
Vacuum device miniaturization and integrated application demand, have stronger popularization and application foreground.
It should also be noted that, the direction term mentioned in embodiment, for example, "upper", "lower", "front", "rear", " left side ",
" right side " etc. is only the direction with reference to attached drawing, not is used to limit the protection scope of the disclosure.Through attached drawing, identical element by
Same or similar appended drawing reference indicates.When may cause understanding of this disclosure and cause to obscure, conventional structure will be omitted
Or construction.
And the shape and size of each component do not reflect actual size and ratio in figure, and only illustrate the embodiment of the present disclosure
Content.In addition, in the claims, any reference symbol between parentheses should not be configured to the limit to claim
System.
It unless there are known entitled phase otherwise anticipates, the numerical parameter in this specification and appended claims is approximation, energy
Enough bases pass through the resulting required characteristic changing of content of this disclosure.Specifically, all be used in specification and claim
The middle content for indicating composition, the number of reaction condition etc., it is thus understood that repaired by the term of " about " in all situations
Decorations.Under normal circumstances, the meaning expressed refers to include by specific quantity ± 10% variation in some embodiments, some
± 5% variation in embodiment, ± 1% variation in some embodiments, in some embodiments ± 0.5% variation.
Furthermore word "comprising" does not exclude the presence of element or step not listed in the claims.It is located in front of the element
Word "a" or "an" does not exclude the presence of multiple such elements.
The word of ordinal number such as " first ", " second ", " third " etc. used in specification and claim, with modification
Corresponding element, itself simultaneously unexpectedly contains and represents the element and have any ordinal number, does not also represent a certain element and another element
Sequence or manufacturing method on sequence, the use of those ordinal numbers is only used to enable the element and separately with certain name
One element with identical name can make clear differentiation.
Particular embodiments described above has carried out further in detail the purpose of the disclosure, technical scheme and beneficial effects
Describe in detail it is bright, it is all it should be understood that be not limited to the disclosure the foregoing is merely the specific embodiment of the disclosure
Within the spirit and principle of the disclosure, any modification, equivalent substitution, improvement and etc. done should be included in the guarantor of the disclosure
Within the scope of shield.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710319454.9A CN107204265B (en) | 2017-05-08 | 2017-05-08 | Lead interior crossing type multi-level depressurization collector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710319454.9A CN107204265B (en) | 2017-05-08 | 2017-05-08 | Lead interior crossing type multi-level depressurization collector |
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| CN107204265A CN107204265A (en) | 2017-09-26 |
| CN107204265B true CN107204265B (en) | 2019-03-15 |
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| CN113921355B (en) * | 2021-10-09 | 2024-02-06 | 中国科学院空天信息创新研究院 | Collector and preparation method thereof |
| CN114914136B (en) * | 2022-04-11 | 2025-03-28 | 中国电子科技集团公司第十二研究所 | Traveling wave tube body collector assembly structure, traveling wave tube and assembly method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6653787B2 (en) * | 2002-03-05 | 2003-11-25 | L-3 Communications Corporation | High power density multistage depressed collector |
| CN101447384B (en) * | 2008-12-29 | 2010-09-15 | 电子科技大学 | A multi-stage step-down collector for traveling wave tube |
| CN102059538B (en) * | 2009-11-17 | 2012-09-05 | 中国科学院电子学研究所 | Non-welding assembly method of multistage depressed collector assembly |
| CN102103960B (en) * | 2009-12-16 | 2013-02-20 | 中国科学院电子学研究所 | Outer cylinder side opening type multistage depressed collector component and manufacturing method thereof |
| CN102110564A (en) * | 2009-12-24 | 2011-06-29 | 中国科学院电子学研究所 | Four-stage depressed collector for space traveling-wave tube |
| CN103681174B (en) * | 2013-10-31 | 2016-06-29 | 中国科学院电子学研究所 | A kind of flat multi-level depressurization collector |
| CN206931551U (en) * | 2017-05-08 | 2018-01-26 | 中国科学院电子学研究所 | Lead interior crossing type multi-level depressurization collector |
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