CN107199401A - Laser polishing machine and polishing method using same - Google Patents

Abstract

The invention relates to a laser polishing machine which comprises a laser scanning system, a high-speed vibrator and an XY moving platform. The high-speed vibrator is arranged on the XY moving platform. The laser scanning system comprises a laser light source, a scanning galvanometer and a field lens. When the device is used, the field lens is used for reciprocating to and fro to form a plurality of paths of first-turn path traces on the surface of the metal workpiece, and then the field lens is driven by the high-speed vibrator to emit a plurality of paths of second-turn path traces; the width of the second-turn path trace is larger than that of the first-turn path trace, the second-turn path trace covers a first-turn path gap formed by the first-turn path trace and the first-turn path trace, and a metal mirror surface without traces is formed. So that the surface of the metal workpiece to be polished is free from residual metal powder and the surface of the metal workpiece is not damaged. The technical scheme of the invention has the advantages of simple structure, simple processing and convenient use.

Description

Laser polishing machine and polishing method using the laser polishing machine

【Technical field】

The invention relates to a laser machine used for polishing the surface of a workpiece and a polishing method using the laser machine.

【Background technique】

With the continuous development and progress of society, the requirements for the surface of the workpiece are getting higher and higher. Today's metal polishing methods for workpiece surface treatment are divided into mechanical polishing methods and non-contact polishing methods. The metal polishing method is the most common mechanical polishing method, which uses the rotation of the polishing wheel and the addition of polishing powder and liquid to act on the surface of the workpiece. This polishing method is likely to cause metal powder to remain on the surface of the workpiece, and the surface of the polished workpiece is worn out. Electron beam metal polishing is the most common non-contact polishing method. The structure of this polishing method is relatively complicated, and it needs to be processed in a high vacuum environment, which is greatly limited in the field of application.

【Content of invention】

In view of this, the technical problem to be solved by the present invention is to provide a laser polishing machine which can not only avoid no residual metal powder on the surface of the polished metal workpiece and damage the surface of the metal workpiece, but also has a simple structure.

The technical problem to be solved by the present invention is to provide a method for using a laser polishing machine with simple processing and convenient use.

To solve the above technical problems, a laser polishing machine adopted in the technical solution of the present invention includes a laser scanning system, a high-speed vibrator, and an XY mobile platform; the high-speed vibrator is installed on the XY mobile platform, and the The XY mobile platform is provided with a switch for opening or closing the high-speed vibrator; the laser scanning system includes a laser light source, a scanning galvanometer installed at one end of the laser light source, and a field mirror installed at the upper end of the scanning galvanometer; the field mirror is used to reciprocate Move back and forth to make the field mirror form multiple first-round path traces on the surface of the metal workpiece, and then use the high-speed vibrator to drive the field mirror to emit multiple second-round path traces; the width of the second-round path traces is greater than that of the first-round path traces The width of the second-round path trace covers the first-round path gap formed by the first-round path trace and the first-round path trace, forming a metal mirror without trace.

It is further defined based on the main technical features. First, the first round of laser light is emitted from the field lens. Under the control of the scanning galvanometer, the first round of laser light emits a trace of the first round of surface melting; Under the control of the scanning galvanometer, it moves back and forth on the surface of the metal workpiece, so that a first-round path gap is formed between the adjacent first-round path traces and the first-round path traces; then, the high-speed vibrator is turned on and emitted from the field mirror. The second round of laser light is emitted, and under the control of the scanning galvanometer, the second round of laser light is vibrated and moved along the direction perpendicular to the first round of laser light, driving the second round of laser light to form a second round of path traces on the surface of the processed tool. The width of the second round of path traces is twice that of the first round of path traces; the first round of laser is under the joint control of the scanning galvanometer and the high-speed vibrator, and moves back and forth on the surface of the metal workpiece, so that the second round of path traces is covered and Smooth out first pass path gaps for a trace-free metallic mirror finish.

Further defined based on the main technical features, the point energy of the laser light source used in the first round of laser is greater than 1.5mJ, the frequency is greater than 100KHz, the scanning speed is greater than 100mm/sec, and the melting heat energy is greater than 64KJ/Kg and less than 1577kJ/kg. The density of the line is greater than 0.005mm.

Further defined according to the main technical features, the vibration speed of the high-speed vibrator is greater than 1000 back and forth/second, and vibrates in the range of 0.5mm, widening the laser spot of the second round from the original width of 0.1mm to 0.3mm to 0.6mm To a width of 1mm, the point energy of the laser light source used in the second laser round is greater than 1.5mJ, the frequency is greater than 100KHz, and the scanning speed is greater than 1000mm/sec.

The beneficial technical effect of the technical solution of the present invention is: because the high-speed vibrator is installed on the XY mobile platform, the XY mobile platform is provided with a switch for turning on or off the high-speed vibrator; the laser scanning system includes a laser light source, The scanning galvanometer installed at one end of the laser light source, and the field mirror installed at the upper end of the scanning galvanometer. When in use, use the field mirror to move back and forth to make the field mirror form multiple first-round path traces on the surface of the metal workpiece, and then use the high-speed vibrator to drive the field mirror to emit multiple second-round path traces; the second round of path traces The width is larger than the width of the first round of path traces, and the second round of path traces covers the first round of path gap formed by the first round of path traces and the first round of path traces, forming a metal mirror without traces. This laser polishing method can directly perform repeated laser scanning and polishing on the surface of the metal workpiece. be damaged. Compared with the existing similar products, the technical scheme of the invention has the effect of simple structure. In the polishing method of the present invention, it is only necessary to use the field mirror alone or under the joint control of the high-speed vibrator and the field mirror to generate laser light to move back and forth on the surface of the metal workpiece, and adjust the width of the round path trace, so as to achieve simple processing and use. Convenient effect.

The technical solutions of the present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments.

【Description of drawings】

Fig. 1 is the appearance perspective view of the laser scanning system in the present invention;

Fig. 2 is the perspective view of high-speed vibrator in the present invention;

Fig. 3 is the structural representation of laser scanning system among the present invention;

Fig. 4 is the structural representation of high-speed vibrator in the present invention;

Fig. 5 is the schematic diagram of the first round path trace formed by a single first round laser in the present invention;

Fig. 6 is a schematic diagram of the formation of multiple first round path traces in the present invention;

Fig. 7 is a schematic diagram of the traces of the second round path formed by a single second round laser in the present invention;

8 is a schematic diagram of the formation of multiple second-round path traces and first-round path traces in the present invention;

9 is a schematic diagram of the first round of laser formation of the melting layer in the present invention;

Fig. 10 is a schematic diagram of forming a liquefied layer by laser in the first round of the present invention;

Fig. 11 is a schematic diagram of forming a liquefied layer by laser in the second round of the present invention.

【detailed description】

In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer and clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

Please refer to Fig. 1 to Fig. 11, a kind of laser polishing machine is described below in conjunction with embodiment, it comprises laser scanning system 100, high-speed vibrator 200, and XY mobile platform 300; Described high-speed vibrator 200 is installed on XY mobile platform 300 , the XY moving platform 300 is provided with a switch 400 for turning on or off the high-speed vibrator 200 . The laser scanning system 100 includes a laser light source 101, a scanning galvanometer 102 installed at one end of the laser light source 101, and a field lens 103 installed at the upper end of the scanning galvanometer 102;

A polishing method for a laser polishing machine is as follows: firstly, the first round of laser light 501 is emitted from the field mirror 103, and under the control of the scanning galvanometer 102, the first round of laser light 501 emits a first round of path traces 502 of surface melting The first round of laser light 501 moves back and forth on the surface of the metal workpiece under the control of the scanning galvanometer 102, so that the first round of path gaps are formed between the adjacent first round of path traces 502 and the first round of path traces 502 505; then, turn on the high-speed vibrator 200, emit a second round of laser light 506 from the field mirror 103, and under the control of the scanning galvanometer 102, make the second round of laser light 506 vibrate and move along the direction perpendicular to the first round of laser light 501, Drive the second round of laser light 506 to form a second round of path traces 504 on the surface of the processed tool, and the width of the second round of path traces 504 is twice the width of the first round of path traces 502; Under the joint control of 102 and high-speed vibrator 200, it reciprocates back and forth on the surface of the metal workpiece, so that the second round of path traces 504 covers and smoothes the first round of path gaps 505, forming a metal mirror surface without traces.

During the first round, the point energy of the laser light source 101 generating the first round of laser light 501 is greater than 1.5mJ, the frequency is greater than 100KHz, the scanning speed is greater than 100mm/sec, and the melting heat energy is greater than 64KJ/Kg and less than 1577kJ/kg, The density of scanning lines is greater than 0.005mm, that is, the width between adjacent scanning lines is greater than 0.005mm. Between the first round of laser light 501 and the surface of the metal workpiece, because the energy of the first round of laser light 501 generated by the laser light source 101 is relatively large, the scanning speed is slow, and it is easy to melt the surface of the metal workpiece, but the speed cannot be too slow, and the density of the scanning path It should not be too dense, so as to prevent surface gasification from causing pits, so the energy of the first round of laser 501 should be controlled so that a melting layer 600 and a thermal effect layer 601 can be produced on the surface of the metal workpiece to achieve the purpose of melting. In this process, due to the processing time of the two adjacent first-round path traces 502 successively and the rapid cooling of the metal workpiece surface, it is easy to make the two adjacent first-round path traces 502 and the first-round path traces 502 A first round path gap 505 is generated in between.

In order to flatten the path gap 505 in the first round, when the high-speed vibrator 200 is turned on, the scanning width of the laser light 506 in the second round is increased to drive the generated trace width of the path trace 504 in the second round to increase. The first-round path gap 505 formed between the first-round path trace 502 and the first-round path trace 502 is smoothed out.

In the second round process, the energy of the second round of laser light 506 generated by the laser light source 101 causes the molten layer on the surface of the metal workpiece to expand. layer; the point energy of the laser light source 101 is greater than 1.5mJ, the frequency is greater than 100KHz, and the scanning speed is greater than 1000mm/sec. When the second round of laser 506 scans, the high-speed vibrator 200 starts to widen the spot of the second round of laser 506, so that the energy per square area is reduced, and the average laser energy is received in a wider range; One round of path traces 502 are connected into one piece, and the melting layer 600 and thermal effect layer 601 can be evenly distributed over a larger area; after cooling, a metal surface without traces is formed. During the second round of laser 506 scanning, the vibration speed of the high-speed vibrator 200 is greater than 1000 back and forth/second, and vibrates in the range of 0.5mm, back and forth refers to the number of round trips; the spot of the second round of laser 506 is widened, from the original The width of 0.1mm to 0.3mm is expanded to the width of 0.6mm to 1mm, and the range of receiving average laser energy method is expanded. During the scanning process of the second round of laser 506, the energy is small and the scanning speed is fast, and the scanning speed must be faster than the cooling speed of the molten layer 600 formed by the scanning speed of the first round of laser 501; to avoid direct vaporization of the surface and the generation of pits . The wider melting layer 600 and thermal effect layer 601 produced by the second round of laser 506 also liquefy the previous melting layer 600; due to the second round of laser 506, the energy is small and the melting layer 600 cannot be deepened and thickened, which can avoid excessive Melting affects the size and shape of the original workpiece.

When working, the field mirror 103 is used to move back and forth, so that the field mirror 103 forms multiple first-round path traces 502 on the surface of the metal workpiece, and then the high-speed vibrator 200 is used to drive the field mirror 103 to emit multiple second-round path traces 504; The width of the second-round path trace 504 is greater than the width of the first-round path trace 502, and the second-round path trace 504 covers the first-round path gap 505 formed by the first-round path trace 502 and the first-round path trace 502, Forms a trace-free metallic mirror finish. The laser polishing machine scans the first and second rounds of laser 501,506, and turns on the high-speed vibrator 200, and cooperates with each other to realize the repeated laser scanning and polishing process on the surface of the metal workpiece to form a pollution-free, residue-free and loss-free workpiece surface.

In summary, because the high-speed vibrator 200 is installed on the XY mobile platform 300, the XY mobile platform 300 is provided with a switch 400 for turning on or off the high-speed vibrator; the laser scanning system 100 includes a laser light source 101 , the scanning vibrating mirror 102 installed at one end of the laser light source 101 , and the field mirror 103 installed at the upper end of the scanning vibrating mirror 102 . During use, the field lens 103 is used to move back and forth, so that the field lens 103 forms multiple first-round path traces 502 on the surface of the metal workpiece, and then the high-speed vibrator 200 is used to drive the field mirror to emit multiple second-round path traces 504; The width of the second-round path trace 504 is greater than the width of the first-round path trace 502, and the second-round path trace 504 covers the first-round path gap 505 formed by the first-round path trace 502 and the first-round path trace 502, forming Non-marking metal mirror. This laser polishing method can directly perform repeated laser scanning and polishing on the surface of the metal workpiece. be damaged. Compared with the existing similar products, the technical scheme of the invention has the effect of simple structure. In the polishing method of the present invention, only by using the field mirror 103 alone or under the control of the high-speed vibrator 200 and the field mirror 103, the laser light is generated to move back and forth on the surface of the metal workpiece, and the width of the round path trace can be adjusted, so as to achieve processing Simple, easy-to-use effects.

The above is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present invention. Should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims (4)

1. a kind of laser polishing machine, it includes laser scanning system, high-speed vibrator, and XY mobile platforms；It is characterized in that： The high-speed vibrator is arranged on XY mobile platforms, and described XY mobile platforms are provided with for being turned on and off vibration at high speed The switch of device；Described laser scanning system includes LASER Light Source, the scanning galvanometer installed in LASER Light Source one end, installed in sweeping Retouch the field lens of galvanometer upper end；Back and forth moved back and forth using field lens, make field lens on surface of workpiece formation multichannel first leg road Footpath vestige, recycles high-speed vibrator to drive field lens to launch multichannel second leg path vestige；Second leg path vestige Width is more than the width of first leg path vestige, and second leg path vestige is covered in first leg path vestige and the The first leg path clearance of bout path vestige formation, forms traceless metallic mirror surface.

2. a kind of polishing method of laser polishing machine as claimed in claim 1, it is characterised in that：First, launch from field lens First leg laser, under scanning galvanometer control, the first leg laser projects the first leg path of a surface melting Vestige；The first leg laser is moved back and forth under the control of scanning galvanometer in surface of workpiece, makes adjacent First leg path clearance is formed between bout path vestige and first leg path vestige；Then, high-speed vibrator is opened, Launch second leg laser from field lens, under scanning galvanometer control, second leg laser is swashed along perpendicular to first leg The direction vibration movement of light, drives second leg laser in processed tool surfaces formation second leg path vestige, this second Bout path trace width is two times of first leg path trace width；The first leg laser is in scanning galvanometer and high speed Under vibrator co- controlling, moved back and forth in surface of workpiece, second leg path vestige is covered and smooth first Bout path clearance, forms traceless metallic mirror surface.

3. a kind of polishing method of laser polishing machine as claimed in claim 2, it is characterised in that：The first leg laser institute The point energy of the LASER Light Source used is more than 1.5mJ, and frequency is more than 100KHz, and sweep speed is more than 100mm/sec, melting heat energy More than 64KJ/Kg, and less than 1577kJ/kg, the density of scan line is more than 0.005mm.

4. a kind of polishing method of laser polishing machine as claimed in claim 2, it is characterised in that：High-speed vibrator vibration velocity Back and forth/second more than 1000, and vibrated in 0.5mm scope, the hot spot of second leg laser is widened, by original 0.1mm extremely 0.3mm width, is expanded to 0.6mm to 1mm width, and the point energy of LASER Light Source used in the second leg laser is big In 1.5mJ, frequency is more than 100KHz, and sweep speed is more than 1000mm/sec.