CN107195761A - A kind of LED and its production method of heating power separation - Google Patents
A kind of LED and its production method of heating power separation Download PDFInfo
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- CN107195761A CN107195761A CN201710368981.9A CN201710368981A CN107195761A CN 107195761 A CN107195761 A CN 107195761A CN 201710368981 A CN201710368981 A CN 201710368981A CN 107195761 A CN107195761 A CN 107195761A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
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- H10H20/852—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
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Abstract
本发明公开了一种热力分离的LED灯及其生产方法,所述热力分离的LED灯包括透光体、LED发光模块、支架、支架正极、支架负极、连接媒介;本发明的热力分离的LED灯的LED发光模块与支架通过锡膏或者银胶烘烤连接;本发明的有益效果为:LED发光模块是通过纯锡或者银胶与支架连接,通过锡膏连接的发光模块与支架正极、支架负极之间的连接非常牢固,连接力度比传统工艺提升了4倍以上;连接力度的增加,让此种工艺的LED灯在客户端后期的机械加工中抗拉扯、挤压等接触式的外力作用下对纯锡或者银胶的两点起到完全的保护,而且解决了现有一体相连的LED产品在客户端后期的机械加工以及焊接中,LED发光模块与支架连接点出现断开不良的问题。
The invention discloses a thermally separated LED lamp and a production method thereof. The thermally separated LED lamp includes a light-transmitting body, an LED light-emitting module, a bracket, a positive pole of the bracket, a negative pole of the bracket, and a connection medium; the thermally separated LED of the present invention The LED light-emitting module of the lamp is connected to the bracket by baking solder paste or silver glue; the beneficial effects of the present invention are: the LED light-emitting module is connected to the bracket through pure tin or silver glue, and the light-emitting module connected by solder paste is connected to the positive pole of the bracket and the bracket The connection between the negative poles is very firm, and the connection force is more than 4 times higher than that of the traditional process; the increase in the connection force makes the LED lights of this process resistant to contact external forces such as pulling and extrusion in the later machining of the customer. It completely protects the two points of pure tin or silver glue, and solves the problem of poor disconnection between the LED light-emitting module and the bracket connection point during the later machining and welding of the existing integrated LED products on the client side. .
Description
技术领域technical field
本发明涉及照明装置,更具体的说是涉及一种热力分离的LED灯及其生产方法。The present invention relates to a lighting device, more specifically to a thermally separated LED lamp and a production method thereof.
背景技术Background technique
现有的LED灯,包括一个LED晶片以及用金线和银胶将LED晶片同支架一体相连,并用透光体覆盖LED晶片,LED晶片的正负极导电段从透光体延伸出,供客户端组合连接并导通使用。Existing LED lights include an LED chip and the LED chip is integrally connected to the bracket with gold wire and silver glue, and the LED chip is covered with a light-transmitting body. The positive and negative conductive segments of the LED chip extend from the light-transmitting body for customers The terminals are connected in combination and turned on for use.
随着现在的消费产品轻便化、小型化,所以需求LED产品相应的小型化,而小型化的LED产品在空间上的缩小,导致一体相连的LED产品在客户端后期的机械加工以及焊接中一体相连的LED中相连的连接点出现断开不良,并且无法避免此不良。With the lightness and miniaturization of current consumer products, corresponding miniaturization of LED products is required, and the space reduction of miniaturized LED products leads to the integration of integrated LED products in the later machining and welding of customers. There is a disconnection defect in the connected connection point among the connected LEDs, and this defect cannot be avoided.
发明内容Contents of the invention
本发明克服了现有技术的不足,提供一种热力分离的LED灯及其生产方法,解决了现有一体相连的LED产品在客户端后期的机械加工以及焊接中,LED发光模块与支架连接点出现断开不良的问题。The present invention overcomes the deficiencies of the prior art, provides a thermally separated LED lamp and its production method, and solves the problem of the connection point between the LED light-emitting module and the bracket during the machining and welding of the existing integrally connected LED products in the later stage of production. There is a problem with poor disconnection.
为解决上述的技术问题,本发明采用以下技术方案:In order to solve the above-mentioned technical problems, the present invention adopts the following technical solutions:
一种热力分离的LED灯,它包括透光体、LED发光模块及支架,所述LED发光模块位于透光体内部,所述支架的一端位于透光体内部并连接LED发光模块,所述支架的另一端穿过透光体连接电源;所述支架包括分开设置的支架正极和支架负极,所述支架正极、支架负极上均连接有连接媒介,所述支架正极、支架负极均通过连接媒介连接LED发光模块;所述连接媒介为锡膏或银胶中的一种制成。A thermally separated LED lamp, which includes a light-transmitting body, an LED light-emitting module and a bracket, the LED light-emitting module is located inside the light-transmitting body, one end of the bracket is located inside the light-transmitting body and connected to the LED light-emitting module, and the bracket The other end of the support passes through the light-transmitting body to connect to the power supply; the support includes a separate support positive pole and a support negative pole, and the support positive pole and the support negative pole are connected to a connection medium, and the support positive pole and the support negative pole are connected through the connection medium LED lighting module; the connection medium is made of one of solder paste or silver glue.
一种热力分离的LED灯的生产方法,它将LED发光模块,用连接媒介固定在支架正极及支架负极上,并进行第一次烘烤,待连接媒介完全固化之后,用透光体封装包裹发光模块,再进行第二次烘烤,烘烤成型后冷却,即制得热力分离的LED灯。A method for producing thermally separated LED lamps. The LED light-emitting module is fixed on the positive pole of the support and the negative pole of the support with a connection medium, and the first baking is performed. After the connection medium is completely cured, it is packaged with a light-transmitting body The light-emitting module is then baked for the second time, and then cooled after baking to form a thermally separated LED lamp.
优选的,所述的第一次烘烤在回流焊机中完成,所述第二次烘烤在烤箱中中完成。Preferably, the first baking is completed in a reflow soldering machine, and the second baking is completed in an oven.
优选的,所述的第一次烘烤温度为180-260℃,烘烤时间为4-6min。Preferably, the first baking temperature is 180-260° C., and the baking time is 4-6 minutes.
优选的,所述的第二次烘烤分为初烤和长烤;初烤唯独为130℃,初烤时间为1.5h,初烤结束后,调高温度至135℃进行长烤,长烤时间为6h。Preferably, the second baking is divided into initial baking and long baking; the initial baking is only at 130°C, and the initial baking time is 1.5h. After the initial baking, increase the temperature to 135°C for long baking. Baking time is 6h.
与现有技术相比,本发明的有益效果是:Compared with prior art, the beneficial effect of the present invention is:
本发明的生产的热力分离的LED灯,所述LED发光模块是通过纯锡或者银胶与支架连接,通过锡膏或者银胶连接的发光模块与支架正极、支架负极之间的连接非常牢固,连接力度比传统工艺提升了4倍以上。连接力度的增加,让此种工艺的LED在客户端后期的机械加工中抗拉扯、挤压等接触式的外力作用下对纯锡或者银胶的两点起到完全的保护。另外,因为机械加工之后的LED产品还需要组装到其他的机构间中,任何的零配件的接触式组装中相互之间都会产生干涉力,此种干涉力在波峰焊接、回流焊接条件下(最高温度270°±5°,持续时间10秒)中会得到释放,传统工艺中此种释放的干涉力会让支架与LED晶片一体式连接的连接点断开而出现功能性不良,但是在热力分离的工艺中,就完全的规避了此种干涉力的释放,因为在波峰焊接、回流焊接条件下(最高温度270°±5°,持续时间10秒)中纯锡会融化,让LED发光模块与支架正极、支架负极之间形成液态相连,在液态相连中,干涉力完全不会传导到LED发光模块上去,待自然冷却后,纯锡又能固化与支架正极、支架正极正常相连;从而解决了现有一体相连的LED产品在客户端后期的机械加工以及焊接中,LED发光模块与支架连接点出现断开不良的问题。In the thermally separated LED lamp produced by the present invention, the LED light-emitting module is connected to the support through pure tin or silver glue, and the light-emitting module connected through solder paste or silver glue is very firmly connected to the positive pole of the support and the negative pole of the support. The connection strength is more than 4 times higher than that of traditional technology. The increase in the connection strength allows the LED of this process to completely protect the two points of pure tin or silver glue under the action of contact external forces such as pulling and extrusion in the later mechanical processing of the client. In addition, because the LED products after machining need to be assembled into other mechanisms, any contact assembly of spare parts will generate interference force with each other. Temperature 270°±5°, duration 10 seconds) will be released. In the traditional process, the interference force of this release will cause the connection point of the integral connection between the bracket and the LED chip to be disconnected, resulting in poor functionality. However, in the thermal separation In the advanced process, the release of this interference force is completely avoided, because pure tin will melt under the conditions of wave soldering and reflow soldering (maximum temperature 270°±5°, duration 10 seconds), so that the LED light-emitting module and The positive pole of the bracket and the negative pole of the bracket are connected in a liquid state. In the liquid state connection, the interference force will not be transmitted to the LED light-emitting module at all. After natural cooling, the pure tin can be solidified and connected to the positive pole of the bracket and the positive pole of the bracket. In the later machining and welding of the existing integrally connected LED products, there is a problem of poor disconnection at the connection point between the LED light-emitting module and the bracket.
附图说明Description of drawings
下面结合附图和具体实施方式对本发明作进一步详细说明。The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.
图1为本发明结构示意图。Fig. 1 is a schematic diagram of the structure of the present invention.
图中的标号为:1、透光体;2、LED发光模块;3、支架;31、支架正极;32、支架负极;4、连接媒介。The numbers in the figure are: 1. light-transmitting body; 2. LED light-emitting module; 3. bracket; 31. positive pole of the bracket; 32. negative pole of the bracket; 4. connection medium.
具体实施方式detailed description
下面结合附图对本发明作进一步的说明。本发明的实施方式包括但不限于下列实施例。The present invention will be further described below in conjunction with the accompanying drawings. Embodiments of the present invention include, but are not limited to, the following examples.
[实施例1][Example 1]
如图1所示的一种热力分离的LED灯,它包括透光体1、LED发光模块2及支架3,所述LED发光模块2位于透光体1内部,所述支架3的一端位于透光体1内部并连接LED发光模块2,所述支架3的另一端穿过透光体1连接电源;所述支架3包括分开设置的支架正极31和支架负极32,所述支架正极31、支架负极32上均连接有连接媒介4,所述支架正极31、支架负极32均通过连接媒介4连接LED发光模块2。As shown in Figure 1, a thermally separated LED lamp includes a light-transmitting body 1, an LED light-emitting module 2 and a support 3, the LED light-emitting module 2 is located inside the light-transmitting body 1, and one end of the support 3 is located in the light-transmitting body The inside of the light body 1 is connected to the LED light-emitting module 2, and the other end of the support 3 passes through the light-transmitting body 1 to connect to the power supply; Both the negative poles 32 are connected with a connection medium 4 , and the support positive pole 31 and the support negative pole 32 are both connected to the LED light emitting module 2 through the connection medium 4 .
本实施例中连接媒介4由锡膏制成,本实施例中的热力分离的LED灯的生产方法为:将LED发光模块2,用锡膏固定在支架正极31及支架负极32上,并在回流焊机进行第一次烘烤,烘烤曲线温度为180℃-260℃,烘烤时间为4min;待锡膏或者银胶完全固化之后,用透光体1封装包裹发光模块2,再在烤箱中进行第二次烘烤,第二次烘烤分为初烤和长烤,初烤温度为130℃,烘烤时间为1.5h,初烤结束后升高温度至135℃,进行长烤,长烤时间为6h,烘烤成型后冷却,即制得热力分离的LED灯。In this embodiment, the connection medium 4 is made of solder paste. The production method of the thermally separated LED lamp in this embodiment is as follows: the LED light emitting module 2 is fixed on the support positive pole 31 and the support negative pole 32 with solder paste, and the The reflow soldering machine performs the first baking, the baking curve temperature is 180°C-260°C, and the baking time is 4 minutes; after the solder paste or silver glue is completely cured, wrap the light-emitting module 2 with the transparent body 1, and then The second baking is carried out in the oven. The second baking is divided into initial baking and long baking. The initial baking temperature is 130°C, and the baking time is 1.5h. After the initial baking, the temperature is raised to 135°C for long baking. , the long-baking time is 6h, and cooling after baking to form a thermally separated LED lamp.
[实施例2][Example 2]
如图1所示的一种热力分离的LED灯,它包括透光体1、LED发光模块2及支架3,所述LED发光模块2位于透光体1内部,所述支架3的一端位于透光体1内部并连接LED发光模块2,所述支架3的另一端穿过透光体1连接电源;所述支架3包括分开设置的支架正极31和支架负极32,所述支架正极31、支架负极32上均连接有连接媒介4,所述支架正极31、支架负极32均通过连接媒介4连接LED发光模块2。As shown in Figure 1, a thermally separated LED lamp includes a light-transmitting body 1, an LED light-emitting module 2 and a support 3, the LED light-emitting module 2 is located inside the light-transmitting body 1, and one end of the support 3 is located in the light-transmitting body The inside of the light body 1 is connected to the LED light-emitting module 2, and the other end of the support 3 passes through the light-transmitting body 1 to connect to the power supply; Both the negative poles 32 are connected with a connection medium 4 , and the support positive pole 31 and the support negative pole 32 are both connected to the LED light emitting module 2 through the connection medium 4 .
本实施例中,连接媒介4为银胶制成,本实施例中的热力分离的LED灯的生产方法为:将LED发光模块2,用锡膏固定在支架正极31及支架负极32上,并在回流焊机进行第一次烘烤,烘烤曲线温度为180℃-260℃,烘烤时间为5min;待银胶完全固化之后,用透光体1封装包裹发光模块2,再在烤箱中进行第二次烘烤,第二次烘烤分为初烤和长烤,初烤温度为130℃,烘烤时间为1.5h,初烤结束后升高温度至135℃,进行长烤,长烤时间为6h,烘烤成型后冷却,即制得热力分离的LED灯。In this embodiment, the connection medium 4 is made of silver glue. The production method of the thermally separated LED lamp in this embodiment is as follows: fix the LED light-emitting module 2 on the support positive pole 31 and the support negative pole 32 with solder paste, and Carry out the first baking in the reflow soldering machine, the temperature of the baking curve is 180°C-260°C, and the baking time is 5min; Carry out the second baking. The second baking is divided into initial baking and long baking. The initial baking temperature is 130°C, and the baking time is 1.5h. The baking time is 6 hours, and after baking and forming, it is cooled to obtain a thermally separated LED lamp.
[实施例3][Example 3]
如图1所示的一种热力分离的LED灯,它包括透光体1、LED发光模块2及支架3,所述LED发光模块2位于透光体1内部,所述支架3的一端位于透光体1内部并连接LED发光模块2,所述支架3的另一端穿过透光体1连接电源;所述支架3包括分开设置的支架正极31和支架负极32,所述支架正极31、支架负极32上均连接有连接媒介4,所述支架正极31、支架负极32均通过连接媒介4连接LED发光模块2。As shown in Figure 1, a thermally separated LED lamp includes a light-transmitting body 1, an LED light-emitting module 2 and a support 3, the LED light-emitting module 2 is located inside the light-transmitting body 1, and one end of the support 3 is located in the light-transmitting body The inside of the light body 1 is connected to the LED light-emitting module 2, and the other end of the support 3 passes through the light-transmitting body 1 to connect to the power supply; Both the negative poles 32 are connected with a connection medium 4 , and the support positive pole 31 and the support negative pole 32 are both connected to the LED light emitting module 2 through the connection medium 4 .
本实施例连接媒介4由锡膏制成中本实施例中的热力分离的LED灯的生产方法为:将LED发光模块2,用锡膏固定在支架正极31及支架负极32上,并在回流焊机进行第一次烘烤,烘烤曲线温度为180℃-260℃,烘烤时间为6min;待锡膏完全固化之后,用透光体1封装包裹发光模块2,再在烤箱中进行第二次烘烤,第二次烘烤分为初烤和长烤,初烤温度为130℃,烘烤时间为1.5h,初烤结束后升高温度至135℃,进行长烤,长烤时间为6h,烘烤成型后冷却,即制得热力分离的LED灯。In this embodiment, the connection medium 4 is made of solder paste. The production method of the thermally separated LED lamp in this embodiment is as follows: fix the LED light-emitting module 2 on the positive pole 31 of the support and the negative pole 32 of the support with solder paste, and reflow The welding machine performs the first baking, the baking curve temperature is 180°C-260°C, and the baking time is 6 minutes; after the solder paste is completely cured, wrap the light-emitting module 2 with the light-transmitting body 1, and then carry out the second baking in the oven. The second baking, the second baking is divided into initial baking and long baking, the initial baking temperature is 130°C, and the baking time is 1.5h. After the initial baking, the temperature is raised to 135°C for long baking and long baking time 6h, after baking and cooling, the thermally separated LED lamp is obtained.
如上所述即为本发明的实施例。本发明不局限于上述实施方式,任何人应该得知在本发明的启示下做出的结构变化,凡是与本发明具有相同或相近的技术方案,均落入本发明的保护范围之内。The foregoing is an embodiment of the present invention. The present invention is not limited to the above embodiments, and anyone should know that any structural changes made under the inspiration of the present invention, and any technical solutions that are the same as or similar to the present invention, all fall within the protection scope of the present invention.
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CN102299248A (en) * | 2010-06-25 | 2011-12-28 | 惟昌企业股份有限公司 | Improved manufacturing method of LED packaging support and packaging structure manufactured by improved manufacturing method |
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CN202523756U (en) * | 2012-04-18 | 2012-11-07 | 浙江金仕朗光电科技有限公司 | Bracket of light-emitting diode (LED) |
CN104752597A (en) * | 2013-12-30 | 2015-07-01 | 展晶科技(深圳)有限公司 | Light-emitting diode packaging structure and packaging method thereof |
CN103824906A (en) * | 2014-03-04 | 2014-05-28 | 深圳市智讯达光电科技有限公司 | LED (light-emitting diode) encapsulating method and LED device |
CN205282504U (en) * | 2016-01-05 | 2016-06-01 | 厦门光莆电子股份有限公司 | A patch type white light LED package body |
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