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CN107195755A - A kind of flexible and transparent LED display and its processing method - Google Patents

A kind of flexible and transparent LED display and its processing method Download PDF

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Publication number
CN107195755A
CN107195755A CN201710523574.0A CN201710523574A CN107195755A CN 107195755 A CN107195755 A CN 107195755A CN 201710523574 A CN201710523574 A CN 201710523574A CN 107195755 A CN107195755 A CN 107195755A
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flexible
transparent
layer
flexible transparent
line
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王潜
王祥付
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Shenzhen Liantronics Co Ltd
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Shenzhen Liantronics Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/8506Containers
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • H10H20/854Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0362Manufacture or treatment of packages of encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0364Manufacture or treatment of packages of interconnections

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)

Abstract

本发明公开了一种柔性透明LED显示屏及其加工方法,所述柔性透明LED显示屏,包括柔性透明衬底及至少一层设置在所述柔性透明衬底的线路层,相邻的线路层之间及线路层的表面设置有柔性透明保护膜,所述线路层上设置有接触点且所述接触点从最外面一层柔性透明保护膜裸露出来,所述接触点上电性连接有LED灯,所述LED灯内部封装有R、G、B三原色的发光芯片和驱动R、G、B三原色的发光芯片发光的驱动芯片。该种柔性透明LED显示屏及其加工方法具有产品透光率高、可柔性安装、使用寿命长、外形美观、节省加工工艺、降低生产成本等现有技术所不具备的优点。

The invention discloses a flexible transparent LED display screen and a processing method thereof. The flexible transparent LED display screen includes a flexible transparent substrate and at least one circuit layer arranged on the flexible transparent substrate, and the adjacent circuit layer A flexible transparent protective film is provided between and on the surface of the circuit layer, and a contact point is provided on the circuit layer, and the contact point is exposed from the outermost layer of flexible transparent protective film, and the LED is electrically connected to the contact point The LED lamp is internally packaged with three primary color light-emitting chips of R, G, and B and a driving chip for driving the light-emitting chips of the three primary colors of R, G, and B to emit light. The flexible and transparent LED display screen and the processing method thereof have the advantages of high light transmittance, flexible installation, long service life, beautiful appearance, saving processing technology, and reducing production costs, etc., which are not available in the prior art.

Description

一种柔性透明LED显示屏及其加工方法A kind of flexible transparent LED display screen and processing method thereof

技术领域technical field

本发明涉及一种LED应用领域的技术方案,特别是一种柔性透明LED显示屏及其加工方法。The invention relates to a technical solution in the LED application field, in particular to a flexible transparent LED display screen and a processing method thereof.

背景技术Background technique

随着LED技术的越发成熟,应用于LED技术的各种产品也应运而生。发光二极管LED显示屏是一种通过控制LED 矩阵的发光而进行信息显示的器件系统。在某些特殊场合,如玻璃幕墙、商店橱窗、立体广告牌、舞台背景等环境需要LED显示模块透光性好,同时显示屏如能弯曲、伸缩等,就能便于在非平面区域安装、搬运和维修;另外,现有的显示屏需要额外增加电源驱动装置,进一步会造成显示屏的透明面积被大幅度覆盖,降低产品的透光性能,也增加产品的成本。As LED technology becomes more and more mature, various products applied to LED technology also emerge as the times require. Light-emitting diode LED display is a device system that displays information by controlling the light emission of the LED matrix. In some special occasions, such as glass curtain walls, shop windows, three-dimensional billboards, stage backgrounds and other environments, LED display modules need to have good light transmission. At the same time, if the display can be bent and stretched, it can be easily installed and transported in non-planar areas. and maintenance; in addition, the existing display screen needs to add an additional power drive device, which will further cause the transparent area of the display screen to be greatly covered, reduce the light transmission performance of the product, and increase the cost of the product.

然而,现有的显示屏普遍难以实现上述要求,具有透光率差、弯折容易断裂、使用寿命短等就技术缺陷,严重限制了本领域进一步向前发展和推广应用。However, the existing display screens are generally difficult to meet the above requirements, and have technical defects such as poor light transmittance, easy breakage when bent, and short service life, which seriously limit the further development and application of this field.

有鉴于此,本发明的目的在于提供一种新的技术方案以解决现存的技术缺陷。In view of this, the purpose of the present invention is to provide a new technical solution to solve the existing technical defects.

发明内容Contents of the invention

为了克服现有技术的不足,本发明提供一种柔性透明LED显示屏及其加工方法,解决了现有技术存在的透光率差、容易折断损伤、使用寿命短等技术缺陷。In order to overcome the deficiencies of the prior art, the present invention provides a flexible transparent LED display and its processing method, which solves the technical defects of the prior art such as poor light transmittance, easy breakage and damage, and short service life.

本发明解决其技术问题所采用的技术方案是:The technical solution adopted by the present invention to solve its technical problems is:

一种柔性透明LED显示屏,包括柔性透明衬底及至少一层设置在所述柔性透明衬底的线路层,相邻的线路层之间及线路层的表面设置有柔性透明保护膜,所述线路层上设置有接触点且所述接触点从最外面一层柔性透明保护膜裸露出来,所述接触点上电性连接有LED灯。A flexible transparent LED display screen, comprising a flexible transparent substrate and at least one circuit layer arranged on the flexible transparent substrate, a flexible transparent protective film is provided between adjacent circuit layers and on the surface of the circuit layer, the Contact points are arranged on the circuit layer and exposed from the outermost layer of flexible transparent protective film, and LED lamps are electrically connected to the contact points.

作为上述技术方案的改进,所述LED灯内部封装有R、G、B三原色的发光芯片和驱动R、G、B三原色的发光芯片发光的驱动芯片。As an improvement of the above technical solution, the LED lamp is internally packaged with three primary color light-emitting chips of R, G, and B and a driver chip for driving the light-emitting chips of the three primary colors of R, G, and B to emit light.

作为上述技术方案的进一步改进,所述柔性透明衬底的上、下表面分别设置有顶层线路层及底层线路层,所述顶层线路层表面覆盖有顶层柔性透明保护膜,所述底层柔性透明保护膜表面覆盖有底层柔性透明保护膜,所述顶层线路层上具有线路触点,顶层柔性透明保护膜上开设有配合所述线路触点的窗口,所述柔性透明衬底上开设有用于电性连接顶层线路层及底层线路层的导电过孔,所述线路触点上配合安装有所述的LED灯。As a further improvement of the above technical solution, the upper and lower surfaces of the flexible transparent substrate are respectively provided with a top layer circuit layer and a bottom layer circuit layer, the surface of the top layer circuit layer is covered with a top layer flexible transparent protective film, and the bottom layer flexible transparent protection film The surface of the film is covered with a bottom flexible transparent protective film, the top circuit layer has a circuit contact, the top flexible transparent protective film is provided with a window for matching the circuit contact, and the flexible transparent substrate is provided with a window for electrical contact. The conductive via holes connecting the top circuit layer and the bottom circuit layer, and the LED lamps are mounted on the circuit contacts.

作为上述技术方案的进一步改进,所述顶层线路层包括有DIN线、GND线及VDD线,所述底层线路层包括DIN连接线及GND连接线,所述DIN连接线通过导电过孔与顶层线路层上的DIN线电性连接,所述GND连接线通过导电过孔与顶层线路板上的GND线电性连接。As a further improvement of the above technical solution, the top circuit layer includes a DIN line, a GND line and a VDD line, the bottom circuit layer includes a DIN connection line and a GND connection line, and the DIN connection line is connected to the top layer circuit through a conductive via hole. The DIN line on the top layer is electrically connected, and the GND connection line is electrically connected to the GND line on the top layer circuit board through a conductive via hole.

作为上述技术方案的进一步改进,所述顶层线路层上的DIN线、GND线及VDD线呈相互平行设置并组构成一组顶层走线组,所述顶层线路层包括有多组顶层走线组。As a further improvement of the above technical solution, the DIN line, the GND line and the VDD line on the top layer wiring layer are arranged in parallel to each other and form a set of top layer wiring groups, and the top layer wiring layer includes multiple sets of top layer wiring groups .

作为上述技术方案的进一步改进,所述顶层线路层上的第奇数组顶层走线组中的DIN线在其右端部弯折并与下一顶层走线组中的DIN线的右端电性连接;顶层线路层上的第偶数组顶层走线组中的DIN线在其左端部通过DIN连接线电性连接到下一顶层走线组中的DIN线;所述顶层线路层中的多组顶层走线组中的GND线在其左端通过GND连接线电性连接;所述顶层线路层中的多组顶层走线组中的VDD线通过VDD连接线在左端电性连接,所述VDD连接线设置在顶层线路层中。As a further improvement of the above technical solution, the DIN line in the odd-th top-level wiring group on the top-level circuit layer is bent at its right end and electrically connected to the right end of the DIN line in the next top-level wiring group; The DIN line in the even group top-level wiring group on the top-level wiring layer is electrically connected to the DIN line in the next top-level wiring group through a DIN connection line at its left end; multiple groups of top-level wiring in the top-level wiring layer The GND lines in the line group are electrically connected at their left ends through the GND connection lines; the VDD lines in the multiple top-level wiring groups in the top layer line layer are electrically connected at the left end through the VDD connection lines, and the VDD connection lines are set in the top line layer.

作为上述技术方案的进一步改进,所述柔性透明衬底、顶层柔性透明保护膜及底层柔性透明保护膜采用的材料为PI、PET、PEN、PC、PVC、PMMA、PES中的任一种;所述顶层电路层及底层电路层为覆铜铂或为含银的透明导电胶体或为由高分子透明导电材料印刷形成。As a further improvement of the above technical solution, the materials used for the flexible transparent substrate, the top flexible transparent protective film and the bottom flexible transparent protective film are any one of PI, PET, PEN, PC, PVC, PMMA, PES; The top circuit layer and the bottom circuit layer are made of copper-clad platinum or silver-containing transparent conductive colloid or printed with polymer transparent conductive material.

作为上述技术方案的进一步改进,所述LED灯通过银胶电性连接在所述线路触点上;所述柔性透明衬底、顶层柔性透明保护膜及底层柔性透明保护膜均为绝缘膜。As a further improvement of the above technical solution, the LED lamp is electrically connected to the circuit contact through silver glue; the flexible transparent substrate, the top flexible transparent protective film and the bottom flexible transparent protective film are all insulating films.

本发明还提供了一种柔性透明LED显示屏的加工方法,包括以下加工步骤:The present invention also provides a processing method for a flexible transparent LED display, comprising the following processing steps:

步骤1:准备衬底基材,选择柔性透明材质制作柔性透明衬底,所述柔性透明衬底为绝缘材料制作而成;Step 1: Prepare the substrate base material, select a flexible transparent material to make a flexible transparent substrate, and the flexible transparent substrate is made of an insulating material;

步骤2:在柔性透明衬底上设置若干图形化线路层,并在相邻的线路层之间及线路层表面设置柔性透明保护膜,覆盖在顶层的柔性透明保护膜开设有可裸露线路层上的接触点的窗口,柔性透明衬底上开设供其两侧的线路层电性连接的导电过孔,柔性透明保护膜由绝缘材料制作而成;Step 2: Set several patterned circuit layers on a flexible transparent substrate, and set a flexible transparent protective film between adjacent circuit layers and on the surface of the circuit layer, and cover the flexible transparent protective film on the top layer with an exposed circuit layer The window of the contact point, the conductive via hole for the electrical connection of the circuit layer on both sides is opened on the flexible transparent substrate, and the flexible transparent protective film is made of insulating material;

步骤3:将经过上述步骤制备的材料进行高恩热压成型并成为一体的柔性透明PCB板;Step 3: The material prepared through the above steps is subjected to high-energy hot-press molding and formed into an integrated flexible transparent PCB board;

步骤4:通过含银的透明导电胶将LED灯电性连接在线路层上的接触点上。Step 4: Electrically connect the LED lamp to the contact point on the circuit layer through silver-containing transparent conductive glue.

作为上述技术方案的改进,LED灯为具有自驱动芯片单元的LED发光件。As an improvement of the above technical solution, the LED lamp is an LED light-emitting element with a self-driven chip unit.

本发明的有益效果是:本发明提供了一种柔性透明LED显示屏及其加工方法,所述柔性透明LED显示屏在柔性透明衬底上设置顶层线路层及底层线路层,并在顶层线路层及底层线路层表面设置有顶层柔性保护膜及底层柔性透明保护膜,最终实现整个显示屏具备柔性性能及透明性能,能够极大提升显示屏的透光率,适用于透明、柔性安装的环境中,适用范围广,不易弯折损伤,使用寿命长;另外,该种显示屏中的LED灯为具有自驱动芯片单元的LED发光件,不再需要在显示屏中额外增加驱动装置,既减少显示屏的遮光部件,提升透光率,也降低了生产成本;所述柔性透明LED显示屏的加工方法提供了一种实现上述柔性透明LED显示屏的生产制造方便,便于降低成本及提高生产率,有助于提升显示屏的透光率及产品的生产资料,间接提升生产企业的生产效益。The beneficial effects of the present invention are: the present invention provides a flexible transparent LED display screen and a processing method thereof. The flexible transparent LED display screen is provided with a top circuit layer and a bottom circuit layer on a flexible transparent substrate, and the top circuit layer And the surface of the bottom line layer is provided with a top flexible protective film and a bottom flexible transparent protective film, and finally realizes that the entire display has flexibility and transparency, which can greatly improve the light transmittance of the display, and is suitable for transparent and flexible installation environments , wide application range, not easy to bend and damage, and long service life; in addition, the LED lights in this kind of display screen are LED light-emitting parts with self-driving chip units, no need to add additional driving devices in the display screen, which reduces the display The shading part of the screen improves the light transmittance and reduces the production cost; the processing method of the flexible transparent LED display provides a method for realizing the convenience of manufacturing the above-mentioned flexible transparent LED display, which is convenient for reducing costs and improving productivity, and has It helps to improve the light transmittance of the display screen and the production materials of the product, and indirectly improves the production efficiency of the production enterprise.

总之,该种柔性透明LED显示屏及其加工方法解决了现有技术存在的透光率差、容易折断损伤、使用寿命短等技术缺陷。In a word, the flexible transparent LED display screen and its processing method solve the technical defects in the prior art such as poor light transmittance, easy breakage and damage, and short service life.

附图说明Description of drawings

下面结合附图和实施例对本发明进一步说明。The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

图1是本发明的结构示意图;Fig. 1 is a structural representation of the present invention;

图2是本发明中顶层线路层及底层线路层的布线示意图。Fig. 2 is a schematic diagram of the wiring of the top circuit layer and the bottom circuit layer in the present invention.

具体实施方式detailed description

以下将结合实施例和附图对本发明的构思、具体结构及产生的技术效果进行清楚、完整地描述,以充分地理解本发明的目的、特征和效果。显然,所描述的实施例只是本发明的一部分实施例,而不是全部实施例,基于本发明的实施例,本领域的技术人员在不付出创造性劳动的前提下所获得的其他实施例,均属于本发明保护的范围。另外,专利中涉及到的所有联接/连接关系,并非单指构件直接相接,而是指可根据具体实施情况,通过添加或减少联接辅件,来组成更优的联接结构。本发明创造中的各个技术特征,在不互相矛盾冲突的前提下可以交互组合,参照图1、图2。The idea, specific structure and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, features and effects of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative efforts belong to The protection scope of the present invention. In addition, all the connection/connection relationships involved in the patent do not simply refer to the direct connection of components, but mean that a better connection structure can be formed by adding or reducing connection accessories according to specific implementation conditions. Each technical feature in the invention can be combined interactively on the premise of not conflicting with each other, refer to Fig. 1 and Fig. 2 .

一种柔性透明LED显示屏,包括柔性透明衬底1及至少一层设置在所述柔性透明衬底1的线路层,相邻的线路层之间及线路层的表面设置有柔性透明保护膜,所述线路层上设置有接触点且所述接触点从最外面一层柔性透明保护膜裸露出来,所述接触点上电性连接有LED灯6。A flexible transparent LED display, comprising a flexible transparent substrate 1 and at least one circuit layer arranged on the flexible transparent substrate 1, a flexible transparent protective film is provided between adjacent circuit layers and on the surface of the circuit layer, The circuit layer is provided with a contact point and the contact point is exposed from the outermost layer of flexible transparent protective film, and the LED lamp 6 is electrically connected to the contact point.

优选地,所述LED灯6内部封装有R、G、B三原色的发光芯片和驱动R、G、B三原色的发光芯片发光的驱动芯片。Preferably, the LED lamp 6 is packaged with three primary color light-emitting chips of R, G, and B and a driving chip for driving the light-emitting chips of the three primary colors of R, G, and B to emit light.

优选地,所述柔性透明衬底1的上、下表面分别设置有顶层线路层2及底层线路层3,所述顶层线路层2表面覆盖有顶层柔性透明保护膜4,所述底层柔性透明保护膜3表面覆盖有底层柔性透明保护膜5,所述顶层线路层2上具有线路触点20,顶层柔性透明保护膜4上开设有配合所述线路触点20的窗口,所述柔性透明衬底1上开设有用于电性连接顶层线路层2及底层线路层3的导电过孔11,所述线路触点20上配合安装有所述的LED灯6。Preferably, the upper and lower surfaces of the flexible transparent substrate 1 are respectively provided with a top circuit layer 2 and a bottom circuit layer 3, the surface of the top circuit layer 2 is covered with a top flexible transparent protective film 4, and the bottom flexible transparent protection film The surface of the film 3 is covered with a bottom flexible transparent protective film 5, the top circuit layer 2 has a circuit contact 20, the top flexible transparent protective film 4 is provided with a window matching the circuit contact 20, and the flexible transparent substrate 1 is provided with a conductive via 11 for electrically connecting the top circuit layer 2 and the bottom circuit layer 3, and the circuit contact 20 is matched with the LED lamp 6 installed thereon.

优选地,所述顶层线路层2包括有DIN线21、GND线22及VDD线23,所述底层线路层3包括DIN连接线31及GND连接线32,所述DIN连接线31通过导电过孔11与顶层线路层2上的DIN线21电性连接,所述GND连接线32通过导电过孔11与顶层线路板2上的GND线22电性连接。Preferably, the top circuit layer 2 includes a DIN line 21, a GND line 22 and a VDD line 23, and the bottom circuit layer 3 includes a DIN connection line 31 and a GND connection line 32, and the DIN connection line 31 passes through a conductive via hole 11 is electrically connected to the DIN line 21 on the top circuit layer 2 , and the GND connection line 32 is electrically connected to the GND line 22 on the top circuit board 2 through the conductive via 11 .

优选地,所述顶层线路层2上的DIN线21、GND线22及VDD线23呈相互平行设置并组构成一组顶层走线组,所述顶层线路层2包括有多组顶层走线组。Preferably, the DIN line 21, the GND line 22 and the VDD line 23 on the top layer circuit layer 2 are arranged parallel to each other and form a set of top layer wiring groups, and the top layer circuit layer 2 includes multiple sets of top layer wiring groups .

优选地,所述顶层线路层2上的第奇数组顶层走线组中的DIN线21在其右端部弯折并与下一顶层走线组中的DIN线21的右端电性连接;顶层线路层2上的第偶数组顶层走线组中的DIN线21在其左端部通过DIN连接线31电性连接到下一顶层走线组中的DIN线21;所述顶层线路层2中的多组顶层走线组中的GND线22在其左端通过GND连接线32电性连接;所述顶层线路层2中的多组顶层走线组中的VDD线23通过VDD连接线24在左端电性连接,所述VDD连接线24设置在顶层线路层2中。Preferably, the DIN line 21 in the odd top-level wiring group on the top-level wiring layer 2 is bent at its right end and electrically connected to the right end of the DIN line 21 in the next top-level wiring group; The DIN line 21 in the even top layer wiring group on layer 2 is electrically connected to the DIN line 21 in the next top layer wiring group through a DIN connection line 31 at its left end; The GND line 22 in the top layer routing group is electrically connected at its left end through the GND connecting line 32; connection, the VDD connection line 24 is set in the top circuit layer 2 .

优选地,所述柔性透明衬底1、顶层柔性透明保护膜4及底层柔性透明保护膜5采用的材料为PI、PET、PEN、PC、PVC、PMMA、PES中的任一种;所述顶层电路层2及底层电路层3为覆铜铂或为含银的透明导电胶体或为由高分子透明导电材料印刷形成。Preferably, the material used for the flexible transparent substrate 1, the top flexible transparent protective film 4 and the bottom flexible transparent protective film 5 is any one of PI, PET, PEN, PC, PVC, PMMA, PES; the top layer The circuit layer 2 and the bottom circuit layer 3 are made of copper-clad platinum or silver-containing transparent conductive colloid or printed with polymer transparent conductive material.

优选地,所述LED灯6通过银胶电性连接在所述线路触点20上;所述柔性透明衬底1、顶层柔性透明保护膜4及底层柔性透明保护膜5均为绝缘膜。Preferably, the LED lamp 6 is electrically connected to the circuit contact 20 through silver glue; the flexible transparent substrate 1 , the top flexible transparent protective film 4 and the bottom flexible transparent protective film 5 are all insulating films.

在具体实施本发明时,由于柔性透明衬底1及顶层柔性透明保护膜4、底层柔性透明保护膜5均为柔性、透明材料制成,具有透光、可柔性安装的特点,配合顶层线路层2及底层线路层3的布线结构,能够大幅度提升显示屏的透关率;另一方面,由于所述LED灯6为具有自驱动芯片单元的LED发光件,整个显示屏不再需要额外设置驱动装置,一来可以节省成本,更重要的是能够减少显示屏的透光面积,提高透光率。When implementing the present invention, since the flexible transparent substrate 1, the top flexible transparent protective film 4, and the bottom flexible transparent protective film 5 are all made of flexible and transparent materials, they have the characteristics of light transmission and flexible installation. 2 and the wiring structure of the bottom line layer 3 can greatly improve the pass-through rate of the display screen; The driving device can save costs, and more importantly, it can reduce the light transmission area of the display screen and increase the light transmission rate.

基于上述的柔性透明LED显示屏,本发明还提供了一种柔性透明LED显示屏的加工方法,包括以下加工步骤:Based on the above-mentioned flexible transparent LED display screen, the present invention also provides a processing method for a flexible transparent LED display screen, comprising the following processing steps:

步骤1:准备衬底基材,选择柔性透明材质制作柔性透明衬底1,所述柔性透明衬底1为绝缘材料制作而成;Step 1: Prepare the substrate base material, select a flexible transparent material to make a flexible transparent substrate 1, and the flexible transparent substrate 1 is made of an insulating material;

步骤2:在柔性透明衬底1上设置若干图形化线路层,并在相邻的线路层之间及线路层表面设置柔性透明保护膜,覆盖在顶层的柔性透明保护膜开设有可裸露线路层上的接触点的窗口,柔性透明衬底1上开设供其两侧的线路层电性连接的导电过孔11,柔性透明保护膜由绝缘材料制作而成;Step 2: Set several patterned circuit layers on the flexible transparent substrate 1, and set a flexible transparent protective film between adjacent circuit layers and on the surface of the circuit layer, and the flexible transparent protective film covering the top layer has a circuit layer that can be exposed The window of the contact point on the flexible transparent substrate 1 is provided with conductive vias 11 for electrical connection of the circuit layers on both sides, and the flexible transparent protective film is made of insulating material;

步骤3:将经过上述步骤制备的材料进行高恩热压成型并成为一体的柔性透明PCB板;Step 3: The material prepared through the above steps is subjected to high-energy hot-press molding and formed into an integrated flexible transparent PCB board;

步骤4:通过含银的透明导电胶将LED灯6电性连接在线路层上的接触点上。Step 4: Electrically connect the LED lamp 6 to the contact point on the circuit layer through silver-containing transparent conductive glue.

优选地,LED灯6为具有自驱动芯片单元的LED发光件。Preferably, the LED lamp 6 is an LED lighting element with a self-driving chip unit.

通过该种柔性透明LED显示屏的加工方法可大幅度简化现有的加工工艺,降低生产成本哼生产难度,为企业降低生产成本。The processing method of the flexible transparent LED display can greatly simplify the existing processing technology, reduce production cost and production difficulty, and reduce production cost for enterprises.

以上是对本发明的较佳实施进行了具体说明,但本发明创造并不限于所述实施例,熟悉本领域的技术人员在不违背本发明精神的前提下还可做出种种的等同变形或替换,这些等同的变形或替换均包含在本申请权利要求所限定的范围内。The above is a specific description of the preferred implementation of the present invention, but the invention is not limited to the described embodiments, those skilled in the art can also make various equivalent deformations or replacements without violating the spirit of the present invention , these equivalent modifications or replacements are all within the scope defined by the claims of the present application.

Claims (7)

1. a kind of flexible and transparent LED display, it is characterised in that:Including flexible transparent substrate(1)And at least one layer is arranged on institute State flexible transparent substrate(1)Line layer, between the adjacent line layer and surface of line layer is provided with flexible and transparent diaphragm, Setting has point of contact on the line layer and the contact point exposes from one layer of flexible and transparent diaphragm of outermost, described to connect LED is electrically connected with contact(6).
2. a kind of flexible and transparent LED display according to claim 1, it is characterised in that:The LED(6)Inside envelope Equipped with the trichromatic luminescence chip of R, G, B and the luminous driving chip of the trichromatic luminescence chip of driving R, G, B.
3. a kind of flexible and transparent LED display according to claim 1, it is characterised in that:The flexible transparent substrate(1) Upper and lower surface be respectively arranged with top line layer(2)And wiring underlayer layer(3), the top line layer(2)Surface covered with Top layer flexible and transparent diaphragm(4), the bottom flexible transparent protective film(3)Surface is covered with bottom flexible transparent protective film (5), the top line layer(2)It is upper that there is line contact(20), top layer flexible and transparent diaphragm(4)On to offer cooperation described Line contact(20)Window, the flexible transparent substrate(1)On offer for be electrically connected with top line layer(2)And bottom Line layer(3)Conductive via(11), the line contact(20)Upper cooperation is provided with described LED(6).
4. a kind of flexible and transparent LED display according to claim 3, it is characterised in that:The flexible transparent substrate (1), top layer flexible and transparent diaphragm(4)And bottom flexible transparent protective film(5)The material used for PI, PET, PEN, PC, Any of PVC, PMMA, PES;The top layer circuit layer(2)And bottom circuit layer(3)To cover copper platinum or being the transparent of argentiferous Conductive rubber is formed to be printed by macromolecule transparent conductive material.
5. a kind of flexible and transparent LED display according to claim 3, it is characterised in that:The LED(6)Pass through silver Glue is electrically connected at the line contact(20)On;The flexible transparent substrate(1), top layer flexible and transparent diaphragm(4)And bottom Layer flexible and transparent diaphragm(5)It is dielectric film.
6. a kind of processing method of flexible and transparent LED display, it is characterised in that:Including following procedure of processing:
Step 1:Preparing substrate base material, selection flexible and transparent material makes flexible transparent substrate(1), the flexible transparent substrate (1)It is made for insulating materials;
Step 2:In flexible transparent substrate(1)It is upper that some graphical line layers are set, and between adjacent line layer and circuit Layer surface sets flexible and transparent diaphragm, be covered in the flexible and transparent diaphragm of top layer offer can be on exposed line layer contact The window of point, flexible transparent substrate(1)On open up for its both sides line layer electric connection conductive via(11), flexible and transparent Diaphragm is made by insulating materials;
Step 3:The material prepared by above-mentioned steps is subjected to the flexible and transparent pcb board that high grace is hot-forming and is integrally formed;
Step 4:By the electrically conducting transparent glue of argentiferous by LED(6)It is electrically connected on the contact point on line layer.
7. a kind of processing method of flexible and transparent LED display according to claim 6, it is characterised in that:LED(6) For the LED illuminating parts with self-driven chip unit.
CN201710523574.0A 2017-06-30 2017-06-30 A kind of flexible and transparent LED display and its processing method Pending CN107195755A (en)

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Application publication date: 20170922