CN107195405A - A kind of thick film plane Power Resistor - Google Patents
A kind of thick film plane Power Resistor Download PDFInfo
- Publication number
- CN107195405A CN107195405A CN201710392341.1A CN201710392341A CN107195405A CN 107195405 A CN107195405 A CN 107195405A CN 201710392341 A CN201710392341 A CN 201710392341A CN 107195405 A CN107195405 A CN 107195405A
- Authority
- CN
- China
- Prior art keywords
- substrate
- shell
- elastic component
- resistor
- thick film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 238000009434 installation Methods 0.000 claims abstract description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 1
- 238000010030 laminating Methods 0.000 abstract description 3
- 230000003139 buffering effect Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 15
- 238000005516 engineering process Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 239000007937 lozenge Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
- H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Details Of Resistors (AREA)
Abstract
A kind of thick film plane Power Resistor of the present invention, including hollow shell and the resistor assembly for being located at enclosure, resistor assembly includes substrate and intermediate, the bottom surface opening of shell, the sidepiece of intermediate be provided with upper end seal and lower ending opening groove, substrate seals the lower end of the groove so as to form neck of the opening towards side, and shell is provided with buckle, and buckle and shell can be slided up and down along chute；The resistor also includes elastic component, during installation, and extraneous heat sink props up substrate from the opening upwards of shell, and elastic component applies towards down spring to resistor assembly.Compared with prior art, elastic component of the invention applies downward active force to substrate, and operating personnel control can lock the dynamics of resistor very well, can either meet substrate laminating fin and radiate the demand of heat conduction, effectively can prevent substrate from rupturing again.In use, elastic component can the deformation expanded with heat and contract with cold of buffering substrates, therefore also can effectively prevent the rupture of substrate.
Description
Technical field
The present invention relates to technical field of electronic components, and in particular to a kind of thick film plane Power Resistor.
Background technology
With the rapid development of electronic technology, not only the function of electronic equipment is stronger and stronger, and volume is also increasingly
Small, integrated level more and more higher；This requires resistor also to develop to miniaturization and high-power direction.As shown in figure 1, being existing
The stereogram of some thick film plane Power Resistors, including shell 1 and resistor assembly 2, the bottom surface opening of shell 1, resistance group
Part 2 is from the opening in shell 1.Resistor assembly 2 includes substrate 21, intermediate 23 and resistance pulp layer 22, the resistance pulp layer
22 are arranged between substrate 21 and intermediate.
The traditional approach that resistor assembly 2 is arranged in shell 1 is that have silica gel that resistor assembly 2 is fixed in the embedding of shell 1, this
Fixed form processing technology is planted complicated, cost is high, and reduces radiating effect after filling gel in shell 1, for wanting for radiating
Ask the requirement for often not reaching radiating after the resistor of very high super high power, filling gel.Later inventor is devised such as Fig. 2
Resistor assembly 2 is fixed on shell 1 by shown buckle 4, the neck 3 that buckle 4 is combined in Fig. 1, and the design is not yet disclosed.Fig. 2 is outer
The stereogram that shell 1 is turned around, buckle 4 is fixed on the inner side of shell 1, with reference to shown in Fig. 1 and Fig. 2, and intermediate 23 is provided with and blocked
The neck 3 that button 4 is adapted, buckle 4 and shell 1 can be slided along neck 3, and the upper end 31 and lower end 32 of neck 3 are limited buckle 4
Position.Due to the limited width of intermediate 23, the groove that upper and lower side all seals is opened in the sidepiece of intermediate 23 more difficult, therefore in order to
It is easy to processing, is usually to be provided with upper end 31 in the sidepiece of intermediate and seal, then the groove that lower end 32 is open is sealed using substrate 21
The lower end 32 of neck 3, so as to form opening only towards the neck 3 of side, substrate 21 spacing can prop up buckle 4 to ensure centre
Certain distance is kept between the top surface of piece 23 and the bottom surface of shell 1, this structure is that inventor designs in practice, also in that this
Plant design and run into following problem.
Shell 1 is provided with screwed hole 11, before use, the resistor is fixed outside down through the screwed hole 11 by bolt
Enclose using in equipment, heat sink be provided with using equipment, heat sink can push up resistor assembly 2 upwards, and buckle 4 pushes substrate 21 so that
Substrate 21 is fitted heat conduction and heat radiation with heat sink.But in installation process, usually because bolt lock obtains too tight, buckle 4 and radiating
The dynamics that plate clamps substrate 21 jointly is excessive, causes substrate to rupture, but if bolt lock get Tai Song, substrate 21 is pasted with heat sink
Close not close, the heat dispersion of resistance can be influenceed, therefore be difficult that control substrate 21 is both brought into close contact with heat sink during operation, keep away again
Exempt from substrate 21 to rupture.Even if in addition install when substrate 21 do not rupture, due to substrate 21 be snapped 4 and heat sink closely clamp
, resistance pulp layer 22 can generate heat in use, and heat transfer causes the Chang Yin of substrate 21 to expand with heat and contract with cold and break to substrate 21
Split, influence the performance of resistor.
The content of the invention
There is above-mentioned technical problem for prior art, the present invention provides a kind of guarantee substrate and closely pasted with peripheral heat sink
Close, with excellent heat dispersion performance, and the thick film plane Power Resistor for effectively preventing substrate from rupturing.
To achieve the above object, the present invention provides following technical scheme：
A kind of thick film plane Power Resistor, including hollow shell and the resistor assembly for being located at enclosure, resistance are provided
Component includes substrate, intermediate and resistance pulp layer, and resistance pulp layer is arranged between substrate and intermediate, the bottom surface opening of shell,
The sidepiece of intermediate be provided with upper end seal and lower ending opening groove, substrate seals the lower end of the groove to form opening towards side
Neck, shell be provided with buckle, buckle and shell can be slided up and down along chute；The resistor also includes elastic component, installs
When, extraneous heat sink props up substrate from the opening upwards of shell, and elastic component applies towards down spring to resistor assembly.
Wherein, the top surface of the middleware is fixed with the installed part for installing elastic component.
Wherein, the elastic component is deformed spring.
Wherein, the elastic component is provided with positioning hole, and the bottom of the shell is provided with lead, and positioning hole can be towards upper and lower
To being actively enclosed on lead.
Wherein, the elastic component is located between the shell and resistor assembly.
Wherein, the intermediate is ceramics.
Beneficial effects of the present invention：
Compared with prior art, elastic component of the invention applies downward active force to substrate, and operating personnel being capable of control very well
The dynamics of resistor is locked, the demand that substrate laminating fin carries out radiating heat conduction can either be met, base can be effectively prevented again
Piece ruptures.In use, elastic component can the deformation expanded with heat and contract with cold of buffering substrates, therefore also can effectively prevent substrate
Rupture.
Brief description of the drawings
Fig. 1 is the stereogram of existing thick film plane Power Resistor.
Fig. 2 be background technology in shell stereogram.
Fig. 3 be embodiment in a kind of thick film plane Power Resistor exploded view.
Fig. 4 be embodiment in a kind of thick film plane Power Resistor shell stereogram.
Fig. 5 be embodiment in a kind of thick film plane Power Resistor resistor assembly stereogram.
Reference：
Shell 1, screwed hole 11, lead 12；
Resistor assembly 2, substrate 21, resistance pulp layer 22, intermediate 23, pin 24, installed part 25；
Neck 3, the upper end 31 of neck, the lower end 32 of neck；
Buckle 4, lozenges 41；
Elastic component 5, positioning hole 51.
Embodiment
Below in conjunction with specific embodiment and accompanying drawing, the present invention is described in detail.
A kind of thick film plane Power Resistor of the present embodiment, as shown in figure 3, including hollow shell 1 and being located at outer
Resistor assembly 2 inside shell 1, as shown in figure 5, resistor assembly 2 includes substrate 21, intermediate 23 and resistance pulp layer 22, resistance slurry
Layer 22 is arranged between substrate 21 and intermediate 23.When manufacturing resistor assembly 2, the first printed resistor pulp layer 22 on substrate 21（Base
Piece is 95% aluminium oxide ceramics）, and resistance pulp layer 22 is transferred to by the way of laser resistor trimming the resistance of reservation, then to substrate 21
Fixation is sintered with resistance pulp layer 22, provided with one layer of glass glaze as resistance pulp layer in the resistance pulp layer 22 that printing is sintered
22 protective layer, then two pins 24 in the both sides welding of resistance pulp layer 22, then using high temperature inorganic glue by intermediate
23 and substrate 21 bond, that is, complete resistor assembly 2 as shown in Figure 5.As shown in Figure 3 and Figure 4, shell 1 is to be turned in Fig. 4
View after coming, the sidepiece of intermediate be provided with upper end seal and lower ending opening groove, substrate 21 seals the lower end of the groove so as to shape
Into opening towards the neck 3 of side.The bottom surface of shell 1 is opening-like, and shell 1 is provided with buckle 4, and buckle 4 is provided with lozenges 41, card
It is recessed to form inclined plane inwardly at the upper end 31 of groove 3, during installation, resistor assembly 2 is installed from the opening of shell 1, the wedge shape of buckle 4
Face 41 loads in neck 3 along the inclined plane of neck 3, and buckle 4 and shell 1 can be slided up and down along chute after assembling.
In the present embodiment, the installed part 25 that the top surface of middleware 23 is fixed with, installed part 25 is equipped with elastic component 5, the elasticity
Part 5 is deformed spring, and elastic component 5 is provided with positioning hole 51, and the bottom of shell 1 is provided with lead 12, and positioning hole 51 can be living up and down
It is enclosed on dynamicly on lead 12.Before use, shell 1 is locked at periphery using in equipment, extraneous heat sink is opened from shell 1
Substrate 21 is propped up at mouthful upwards so that substrate 21 is brought into close contact carry out heat conduction and heat radiation with heat sink.As for what is applied to substrate 21
Power has two kinds of situations, and the first situation is：Lifting force of the heat sink to substrate 21 is less than to the lower pressure of substrate 21 in elastic component 5
In the case of, elastic component 5 and buckle 4 push substrate 21 and reach dynamic balance jointly；Second of situation be：In elastic component 5 to substrate
In the case of 21 lower pressure is equal to heat sink to the lifting force of substrate 21, elastic component 5 and heat sink reach power to the power of substrate 21
Balance, buckle 4 does not exert a force to substrate 21.No matter which kind of situation, during fixed resister, elastic component 5 is all the time to substrate 21
Apply downward active force, operating personnel control can lock the dynamics of resistor very well, can either meet the laminating of substrate 21 scattered
Backing carries out the demand of radiating heat conduction, can effectively prevent substrate 21 from rupturing again.In use, elastic component 5 can be buffered
The deformation that substrate 21 expands with heat and contract with cold, therefore also can effectively prevent the rupture of substrate 21.
Finally it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than to present invention guarantor
The limitation of scope is protected, although being explained with reference to preferred embodiment to the present invention, one of ordinary skill in the art should
Work as understanding, technical scheme can be modified or equivalent substitution, without departing from the reality of technical solution of the present invention
Matter and scope.
Claims (6)
1. a kind of thick film plane Power Resistor, including hollow shell and the resistor assembly for being located at enclosure, resistance group
Part includes substrate, intermediate and resistance pulp layer, and resistance pulp layer is arranged between substrate and intermediate, the bottom surface opening of shell, its
It is characterized in：
The sidepiece of intermediate be provided with upper end seal and lower ending opening groove, substrate seals the lower end of the groove to form opening direction
The neck of side, shell is provided with buckle, and buckle can be slided up and down together with shell along chute；
The resistor also includes elastic component, and during installation, extraneous heat sink props up substrate from the opening upwards of shell, and elastic component is to electricity
Hinder component and apply elastic force directed downwardly.
2. a kind of thick film plane Power Resistor according to claim 1, it is characterized in that：The top surface of the middleware is consolidated
Surely there is the installed part for installing the elastic component.
3. a kind of thick film plane Power Resistor according to claim 1, it is characterized in that：The elastic component is special-shaped bullet
Spring.
4. a kind of thick film plane Power Resistor according to claim 1, it is characterized in that：The elastic component is provided with positioning
Hole, the bottom of the shell is provided with lead, and positioning hole can be actively enclosed on lead towards above-below direction.
5. a kind of thick film plane Power Resistor according to claim 1, it is characterized in that：The elastic component is located at described
Between shell and resistor assembly.
6. a kind of thick film plane Power Resistor according to claim 1, it is characterized in that：The intermediate is ceramics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710392341.1A CN107195405A (en) | 2017-05-27 | 2017-05-27 | A kind of thick film plane Power Resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710392341.1A CN107195405A (en) | 2017-05-27 | 2017-05-27 | A kind of thick film plane Power Resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107195405A true CN107195405A (en) | 2017-09-22 |
Family
ID=59875157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710392341.1A Pending CN107195405A (en) | 2017-05-27 | 2017-05-27 | A kind of thick film plane Power Resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107195405A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5208576A (en) * | 1990-05-02 | 1993-05-04 | Draloric Electronic Gmbh | Electrical external resistance |
| CN1198244A (en) * | 1995-04-20 | 1998-11-04 | 卡杜克电子有限公司 | Heatsink-mountable power resistor having improved heat-transfer interface with the heatsink |
| CN202758689U (en) * | 2012-04-17 | 2013-02-27 | 深圳意杰（Ebg）电子有限公司 | Thick-film super-power planar resistor of composite base plate |
| CN203300350U (en) * | 2013-05-31 | 2013-11-20 | 章波 | High-power non-inductive thick film precision module resistor |
| CN203690029U (en) * | 2014-01-26 | 2014-07-02 | 深圳意杰（Ebg）电子有限公司 | Mounting type planar thick-film high-power resistor |
| CN104021900A (en) * | 2014-06-23 | 2014-09-03 | 上海鹰峰电子科技有限公司 | Plane thick-film large-power non-inductive resistor |
| CN105101735A (en) * | 2014-04-23 | 2015-11-25 | 鸿富锦精密工业(武汉)有限公司 | heat sink |
| CN204859858U (en) * | 2015-07-20 | 2015-12-09 | 联想(北京)有限公司 | A heat conduction structure and electronic equipment |
| CN207116144U (en) * | 2017-05-27 | 2018-03-16 | 广东福德电子有限公司 | A Thick Film Planar High Power Resistor |
-
2017
- 2017-05-27 CN CN201710392341.1A patent/CN107195405A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5208576A (en) * | 1990-05-02 | 1993-05-04 | Draloric Electronic Gmbh | Electrical external resistance |
| CN1198244A (en) * | 1995-04-20 | 1998-11-04 | 卡杜克电子有限公司 | Heatsink-mountable power resistor having improved heat-transfer interface with the heatsink |
| CN202758689U (en) * | 2012-04-17 | 2013-02-27 | 深圳意杰（Ebg）电子有限公司 | Thick-film super-power planar resistor of composite base plate |
| CN203300350U (en) * | 2013-05-31 | 2013-11-20 | 章波 | High-power non-inductive thick film precision module resistor |
| CN203690029U (en) * | 2014-01-26 | 2014-07-02 | 深圳意杰（Ebg）电子有限公司 | Mounting type planar thick-film high-power resistor |
| CN105101735A (en) * | 2014-04-23 | 2015-11-25 | 鸿富锦精密工业(武汉)有限公司 | heat sink |
| CN104021900A (en) * | 2014-06-23 | 2014-09-03 | 上海鹰峰电子科技有限公司 | Plane thick-film large-power non-inductive resistor |
| CN204859858U (en) * | 2015-07-20 | 2015-12-09 | 联想(北京)有限公司 | A heat conduction structure and electronic equipment |
| CN207116144U (en) * | 2017-05-27 | 2018-03-16 | 广东福德电子有限公司 | A Thick Film Planar High Power Resistor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7486516B2 (en) | Mounting a heat sink in thermal contact with an electronic component | |
| CN104170079B (en) | Semiconductor device, for semiconductor device installation thermal component method and semiconductor device manufacturing method | |
| US11439042B2 (en) | Heat exchange assembly for a communication system | |
| CN103117275B (en) | A kind of chip-packaging structure and chip packaging method | |
| US7518219B2 (en) | Integrated heat spreader lid | |
| US9054023B1 (en) | Flip chip overmold package | |
| US6563213B1 (en) | Integrated circuit heat sink support and retention mechanism | |
| CN102686086B (en) | Heat abstractor and be provided with the electronic building brick of this heat abstractor | |
| KR101762502B1 (en) | Techniques and configurations associated with a package load assembly | |
| WO2021227862A1 (en) | Chip module and electronic device | |
| US10796978B2 (en) | TIM strain mitigation in electronic modules | |
| JP2017513226A (en) | Sealed phase change material heat sink and method | |
| TW201530703A (en) | Encapsulation housing and power module having same | |
| JP2009026870A (en) | Electronic device and manufacturing method thereof | |
| JP2008047920A (en) | Plastic overmolded package with molded lid attachment | |
| US20110090649A1 (en) | Tilt-type heat-dissipating module for increasing heat-dissipating efficiency and decreasing length of solder pin | |
| CN107195405A (en) | A kind of thick film plane Power Resistor | |
| US20090052139A1 (en) | Heat-Dissipation Apparatus For Communication Device With Card Slot | |
| JP2014045087A (en) | Semiconductor device | |
| CN207116144U (en) | A Thick Film Planar High Power Resistor | |
| US6977434B2 (en) | Semiconductor assembly and spring member therefor | |
| CN213752689U (en) | Chip packaging structure, metal frame and electronic equipment | |
| US20060043553A1 (en) | Chip package having a heat spreader and method for packaging the same | |
| CN2914602Y (en) | Fixing structure of heat dissipation module | |
| CN111490019B (en) | Integrated circuit structure and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170922 |