CN107180778A - A kind of wafer jig for capillary processing - Google Patents

Abstract

The invention discloses a wafer fixture for micro-hole processing, which comprises an annular support seat, an air inlet channel, an air outlet channel, and a fixing piece. A suspended hole is set in the middle of the annular support seat, and the edge of the wafer is supported by the annular support seat. When the middle of the wafer is placed against the suspended hole, the center of the wafer is suspended for etching, which can be used for laser etching to process micro-holes; the air inlet channel and the air outlet channel are respectively opened on the circumference of the ring support seat On the side wall, the suspension hole is kept in transverse communication with the outside world, and the air outlet channel and the air inlet channel are arranged opposite to each other; the fixing piece contacts the edge of the wafer, and the wafer is press-fitted and fixed on the upper surface of the ring-shaped support seat. An air blowing device is set directly above the wafer. When the micropores are opened, the debris in the micropores on the wafer is blown downward into the suspended hole. The debris enters the airflow from the air inlet channel and is discharged from the air outlet channel to avoid debris. The debris accumulates at the micro-hole processing of the wafer, thereby preventing the debris from producing a sputtering layer and improving the micro-hole depth-to-diameter ratio.

Description

A wafer fixture for micro-hole processing

technical field

The invention relates to the technical field of semiconductor processing, and further relates to a wafer fixture for microhole processing.

Background technique

At present, the processing methods of micro-holes in three-dimensional packaging chips are mainly divided into dry etching, wet etching and laser drilling and etching. Laser micro-hole processing is non-contact drilling, and the equipment has high portability. Widespread concern. Laser micro-hole processing is used in many occasions, such as micro-hole processing of PCB boards, laser cutting holes, etc. In the microhole processing of three-dimensional chip packaging, it is often necessary to process three-dimensional microholes on the material chip, and the microholes are required to have a high diameter-to-depth ratio, good roundness, almost no recasting layer, and minimal thermal influence The area and the hole wall are smooth without taper, etc.

However, the quality of laser microhole forming is generally not high at present, and there are problems such as low diameter-to-depth ratio of microholes, low roundness of entrance and exit, and through-hole taper. In the traditional laser micro-hole processing process, the wafer is carried out on a mechanically fixed or chuck-fixed fixture, as shown in Figure 1, which is a schematic structural diagram of a wafer fixture in the prior art, and the wafer is placed on the base 01 , The limit and fixation are realized through the limit ring 02 around. In a large number of laser high-depth-diameter ratio micro-hole machining experiments, it was found that the removal of machining debris has a key influence on the machining quality. The debris absorbs the laser energy, and the laser energy cannot be transmitted to the bottom of the microhole, so it is impossible to process a high-depth microhole; the debris can only be discharged upward in the traditional processing process, and the debris splashed upward absorbs the subsequent laser during the process The energy makes the machining process slow, and the energy accumulates above the hole, increasing the hole diameter. At the same time, the debris absorbs the energy and makes the debris sputter onto the hole wall, increasing the roughness of the hole wall, and increasing the recasting layer.

For those skilled in the art, how to design a device that can remove debris generated during the machining process in time is a technical problem that needs to be solved at present.

Contents of the invention

The present invention provides a wafer fixture for micro-hole processing, which can discharge the debris generated by etching in time, thereby improving the processing quality. The specific scheme is as follows:

A wafer fixture for microvia machining, comprising:

A ring-shaped support seat with a suspension hole in the middle; the middle of the wafer is placed in the air facing the suspension hole, and its edge is supported by the ring-shaped support seat;

The air intake channel is opened on the circumferential side wall of the annular support seat, so that the suspended hole is kept in lateral communication with the outside world;

The air outlet channel is opened on the circumferential side wall of the annular support seat, so that the suspended hole is kept in lateral communication with the outside world, the air outlet channel is arranged opposite to the air inlet channel; an air blowing device is arranged directly above the wafer , blowing the debris in the micropores on the wafer downwards into the suspended holes, and discharging the airflow from the air outlet channel along with the air inlet channel;

The fixing part is in contact with the edge of the wafer, and press-fits and fixes the wafer on the upper surface of the ring-shaped support seat.

Optionally, the fixing member includes a rubber layer and a metal layer that are fixedly connected to each other, and the rubber layer in the lower layer is used for crimping with the wafer; the rubber layer and the metal layer are correspondingly provided with fixing holes, through which the The fixing hole and the annular support seat are fixed by bolt connection.

Optionally, the side wall of the fixing member close to the wafer is an arc surface, and the arc diameter of the arc surface is greater than or equal to the diameter of the suspension hole.

Optionally, a positioning groove is defined on the upper surface of the annular support seat along the circumference of the suspension hole, the size of the positioning groove is slightly larger than the circumference of the wafer, and its depth is less than or equal to the thickness of the wafer.

Optionally, marking lines are set on the positioning grooves, and the marking lines are the same in shape and size as the positioning notches on the wafer.

Optionally, the upper surface of the annular support seat is further provided with a pick-and-place groove, and the pick-and-place groove is located outside the circumferential direction of the positioning groove and has a depth greater than that of the positioning groove.

Optionally, the air inlet passage is a threaded hole for connecting an air nozzle; the air outlet passage is a through hole with a rectangular longitudinal section, and its size is larger than that of the air inlet passage.

Optionally, the distance between the upper end of the air inlet channel and the lower surface of the placed wafer is 0.5-1.5 mm.

Optionally, the annular support seat is provided with fixing screw holes along the vertical direction, and the fixing screw holes are distributed along the circumferential direction.

Optionally, the blowing device above the wafer blows nitrogen downward, and the gas nozzle connected to the air inlet channel blows air.

The invention provides a wafer fixture for micro-hole processing, which includes structures such as an annular support seat, an air inlet channel, an air outlet channel, and a fixing piece. A suspended hole is set in the middle of the annular support seat, and the edge of the wafer is supported by an annular shape. Seat support, when the middle of the wafer is placed directly against the suspended hole, the center of the wafer is suspended for etching, which can be used for laser etching to process micro-holes; the air inlet channel and the air outlet channel are respectively opened on the ring support On the circumferential side wall of the seat, the suspension hole is kept in transverse communication with the outside world, and the air outlet channel and the air intake channel are arranged oppositely; the fixing member contacts the edge of the wafer, and the wafer is press-fitted and fixed on the upper surface of the ring-shaped support seat.

An air blowing device is set directly above the wafer. When the micropores are opened, the debris in the micropores on the wafer is blown downward into the suspended hole. The debris enters the airflow from the air inlet channel and is discharged from the air outlet channel to avoid debris. Chips accumulate at the micro-hole processing of the wafer, thereby avoiding the sputtering layer generated by the chips and improving the depth-to-diameter ratio of the micro-holes.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.

FIG. 1 is a schematic structural diagram of a wafer fixture in the prior art;

FIG. 2 is a structural schematic diagram of a specific embodiment of a wafer fixture for microhole processing provided by the present invention;

Fig. 3 is the schematic diagram of gas circulation;

Fig. 4 is a specific structural diagram of the fixing member.

These include:

Annular support base 1, suspension hole 11, air intake channel 12, air outlet channel 13, positioning groove 14, marking line 15, access groove 16, fixing screw hole 17, fixing piece 2, rubber layer 21, metal layer 22, fixing Hole 23.

detailed description

The core of the present invention is to provide a wafer fixture for micro-hole processing, which can discharge debris generated by etching in time, thereby improving processing quality.

In order to enable those skilled in the art to better understand the technical solutions of the present invention, the wafer holder of the present invention will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

As shown in FIG. 2 , it is a structural schematic diagram of a specific embodiment of a wafer fixture for micro-hole processing provided by the present invention. It includes structures such as an annular support seat 1, an air inlet passage 12, an air outlet passage 13, and a fixing member 2. The annular support seat 1 is the supporting structure of the main body for placing wafers, and the annular support seat 1 is used for connecting with other structure connected. A suspension hole 11 is provided in the middle of the ring-shaped support base 1, and the suspension hole 11 is vertically connected. The wafer is placed on the suspension hole 11, and its edge is supported by the ring-shaped support base 1.

The air inlet channel 12 is opened on the circumferential side wall of the annular support seat 1, and is arranged horizontally through, so that the suspended hole 12 is kept in transverse communication with the outside world; the air outlet channel 13 is opened on the circumferential side wall of the annular support seat 1, Keep the suspended hole 11 in horizontal communication with the outside world; the gas outlet channel 13 is arranged opposite to the inlet channel 12, and the gas entering from the inlet channel 12 can be directly discharged from the outlet channel 13 without hindrance.

In addition to the annular support base 1 and its accessories, a gas blowing device is also provided directly above the wafer, as shown in Figure 3, which is a schematic diagram of gas circulation. The air flow of the gas blowing device above the wafer is A, and the blowing direction is along the The opening direction of the microholes blows the debris in the microholes on the wafer downward into the suspended hole 11, and the airflow entering the air inlet channel 12 is discharged from the air outlet channel 13, which is B, through the intersecting airflow , to discharge the debris generated during the laser etching process to the outside in time.

The fixing member 2 is in contact with the edge of the wafer, and press-fits and fixes the wafer on the upper surface of the ring-shaped support seat 1 to play the role of fixing the wafer. With the wafer fixture provided by the present invention, when the wafer fixture is positioned, its middle part is in a suspended state; before the micropores are etched through, the debris generated is blown out in time through the blowing device above the wafer. Chips are discharged from the top of the wafer, reducing the accumulation of chips and providing relatively good processing conditions; when the micro-holes are penetrated, under the blowing of the upper airflow, the chips will be discharged from the bottom along the micro-holes, and the air intake channel 12 into the air flow, after entering the suspension hole 11, along the path of the air inlet passage 12 and the air outlet passage 13 to be discharged outwards.

Compared with the chip removal method that can only be discharged upward, the present invention places the wafer in the air, and sets the chip discharge channel below. When the micropores are just formed, the chips can be discharged downward, which accelerates the chip removal efficiency. Increase the diameter of the outlet and reduce the taper of the through hole.

On the basis of the above scheme, as shown in Figure 4, it is a specific structural diagram of the fixing part 2, the fixing part 2 includes a rubber layer 21 and a metal layer 22 fixedly connected to each other, the rubber layer 21 is on the bottom, and the metal layer 22 is on the top , the lower rubber layer 21 is used for crimping with the wafer, and the rubber can be flexibly deformed to avoid crushing the wafer; the rubber layer 21 and the metal layer 22 are correspondingly opened with a fixing hole 23, and the fixing hole 23 runs through the rubber layer 21 and the metal layer 22 , through the fixing hole 23 and the ring-shaped support seat 1 adopting bolt connection and fixing, the bolt is inserted in the fixing hole 23, and connected with the corresponding threaded hole on the ring-shaped support seat 1, and then the fixing can be realized.

The fixing part 2 is preferably provided with two pieces, of course, if it is a complete circular structure, it is also possible. The side wall of the fixing member 2 close to the wafer is an arc surface, and this side wall can be called the inner wall, which is the side close to the center of the circle. The arc diameter of the arc surface is greater than or equal to the diameter of the suspension hole 11. After the support bases 1 are fixedly connected to each other, the inner surface of the fixing member 2 coincides with the outer periphery of the floating hole 11 or has a small distance from the outer periphery of the floating hole 11, so as to avoid pressing on the floating part of the wafer.

In order to facilitate the positioning of the wafer, a positioning groove 14 is provided on the upper surface of the annular support seat 1 along the circumference of the suspension hole 11, and the size of the positioning groove 14 is slightly larger than the circumference of the wafer, so that the wafer can be completely put in; positioning The depth of the groove 14 is less than or equal to the thickness of the wafer. When the wafer is placed, it can be just flush with or slightly higher than the upper surface of the annular support base 1, so as to facilitate the clamping of the fixture 2. position. Preferably, the width of the annular structure of the positioning groove 14 may be 10 mm, so that all wafer processing locations are in a suspended state.

The positioning groove 14 has a circular shape as a whole, and a marking line 15 is set on the circumferential direction of the positioning groove 14. The marking line 15 has the same shape and size as the positioning notch on the wafer, so that the wafer position can be accurately positioned. The positioning process is as follows: the wafer is placed in the positioning groove 14, the size of the positioning groove 14 is slightly larger than the wafer, and the wafer can be shaken; at this time, the positioning gap on the wafer is closely fitted with the marking line 15, and the process can be realized. precise positioning.

The upper surface of the annular support seat 1 is also provided with a pick-and-place groove 16, which is located outside the positioning groove 14 in the circumferential direction, and is in communication with the positioning groove 14. The depth of the pick-and-place groove 16 is greater than the positioning groove 14, which can facilitate the clamping of the wafer. . Generally, two pick-and-place slots 16 should be set up opposite to each other, so as to facilitate grabbing wafers from both sides.

Specifically, the air intake channel 12 is a threaded hole, which is used to connect the air nozzle, and it is sufficient to directly screw the air nozzle with the thread to fix it. As shown in Figure 2, two air intake channels 12 are set, and the specific number can be set The choice is made according to the application, and the present invention is not specifically limited here. The air outlet passage 13 is a through hole with a rectangular longitudinal section, and its size is larger than that of the air inlet passage 12, which can integrate the airflow in the suspended hole 11, thereby discharging debris.

Preferably, the distance between the upper end of the air inlet channel 12 and the lower surface of the wafer placed in place is 0.5-1.5mm, which can not only carry out the flow circulation of the gas, but also ensure that the gas is not directly blown to the wafer, preventing the wafer from being blown by the air pressure.

The annular support base 1 is vertically provided with fixing screw holes 17, and the fixing screw holes 17 are distributed along the circumferential direction, which can fix the annular support base 1 and the processing device.

The blowing device above the wafer blows nitrogen downward. In addition to blowing debris, nitrogen can also prevent oxidation of the laser processing due to high temperature and protect the micropores. Air is blown by the air nozzle connected to the air intake channel 12, and the composition of the gas entering from the air intake channel 12 is not strictly limited, and ordinary compressed air can be used.

The above description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention will not be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. a kind of wafer jig for capillary processing, it is characterised in that including：

Circumferential support seat (1), centre opens up hanging hole (11)；The centre of wafer is just vacantly placed to the hanging hole (11), its Edge is supported by circumferential support seat (1)；

In inlet channel (12), the circumferential side wall for being opened in the circumferential support seat (1), the hanging hole (12) is set to be protected with extraneous Hold cross connection；

In outlet passageway (13), the circumferential side wall for being opened in the circumferential support seat (1), the hanging hole (11) is set to be protected with extraneous Cross connection is held, the outlet passageway (13) is oppositely arranged with the inlet channel (12)；Wafer is arranged above blowning installation, Chip in micropore on wafer is blowed downwards to the hanging hole (11), and the air-flow entered with the inlet channel (12) Discharged from the outlet passageway (13)；

Fixture (2), the EDGE CONTACT with wafer press-fits wafer the upper surface for being fixed on the circumferential support seat (1).

2. the wafer jig according to claim 1 for capillary processing, it is characterised in that the fixture (2) includes The rubber layer (21) and metal level (22) being mutually permanently connected, the rubber layer (21) of lower floor are used to crimp with wafer；It is described Rubber layer (21) and the metal level (22) correspondence insertion open up fixing hole (23), pass through the fixing hole (23) and the ring-type Support base (1) is fixed with bolts.

3. the wafer jig according to claim 2 for capillary processing, it is characterised in that the fixture (2) is close The side wall of wafer is arc surface, and the arc diameter of arc surface is more than or equal to the diameter of the hanging hole (11).

4. the wafer jig according to claim 1 for capillary processing, it is characterised in that the circumferential support seat (1) Circumference of the upper surface along the hanging hole (11) open up locating slot (14), the size of the locating slot (14) is slightly larger than wafer Circumference, and its depth is less than or equal to the thickness of wafer.

5. the wafer jig according to claim 4 for capillary processing, it is characterised in that set on the locating slot (14) Markings (15) are put, the marking line is identical with the shape and size of the locating notch on wafer.

6. the wafer jig according to claim 4 for capillary processing, it is characterised in that the circumferential support seat (1) Upper surface also set up and pick and place groove (16), the groove (16) that picks and places is outside the locating slot (14) circumference, and depth is more than The locating slot (14).

7. the wafer jig according to claim 1 for capillary processing, it is characterised in that the inlet channel (12) is Screwed hole, for connecting valve；The outlet passageway (13) is the rectangular through hole in longitudinal section, and size is more than the inlet channel (12)。

8. the wafer jig according to claim 7 for capillary processing, it is characterised in that the inlet channel (12) The spacing for the wafer lower surface that upper end distance is in place is 0.5~1.5mm.

9. the wafer jig according to claim 1 for capillary processing, it is characterised in that the circumferential support seat (1) Along vertical to fixing threaded hole (17) is set, the fixing threaded hole (17) is circumferentially distributed.

10. the wafer jig according to claim 1 for capillary processing, it is characterised in that the air blowing dress above wafer Put and blow nitrogen downwards, the valve being connected with the inlet channel (12) blows air.