CN107172812B - Ultrasonic sensor assembly and method of manufacture - Google Patents
Ultrasonic sensor assembly and method of manufacture Download PDFInfo
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- CN107172812B CN107172812B CN201710570888.6A CN201710570888A CN107172812B CN 107172812 B CN107172812 B CN 107172812B CN 201710570888 A CN201710570888 A CN 201710570888A CN 107172812 B CN107172812 B CN 107172812B
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- flexible circuit
- ultrasonic generator
- sensor assembly
- ultrasonic
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Pressure Sensors (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
The application discloses an ultrasonic sensor assembly and a method of manufacturing the same. The ultrasonic sensor assembly includes: a metal substrate; a flexible circuit board including a first surface and a second surface opposite to each other, the second surface being fixed on the metal substrate; and a chip fixed on the first surface of the flexible circuit board and including an ultrasonic generator and a circuit layer stacked in order, wherein the first surface of the flexible circuit board includes a first wiring and a first pad, the ultrasonic generator is adjacent to the first surface of the flexible circuit board, and the ultrasonic generator and the circuit layer are connected to the first pad via bonding wires, respectively. The ultrasonic sensor assembly adopts the bonding wire to realize the electric connection with the flexible circuit board, thereby omitting the anisotropic conductive adhesive, reducing the volume of the assembly and improving the packaging efficiency.
Description
Technical Field
The present application relates to biometric sensors, and more particularly, to ultrasonic sensor assemblies and methods of manufacture.
Background
Biometric identification is a technique for distinguishing between different biometric features, including fingerprint, palmprint, facial, DNA, voice, etc. identification techniques. The fingerprint refers to uneven lines on the skin at the front surface of the tail end of the finger of a person, and the lines are regularly arranged to form different patterns. Fingerprint identification refers to identity authentication by comparing minutiae of different fingerprints. Fingerprint recognition is increasingly used due to lifetime invariance, uniqueness and convenience.
In fingerprint recognition, a sensor is used to acquire fingerprint image information. Fingerprint sensors can be classified into optical, capacitive, pressure, ultrasonic sensors according to the difference of the working principle. The ultrasonic sensor is a third generation fingerprint sensor in which ultrasonic waves are generated using the inverse piezoelectric effect of a piezoelectric material. When the ultrasonic wave contacts the fingerprint, the ultrasonic wave shows different reflectivities and transmittances in ridges and valleys of the fingerprint. Fingerprint information can be read by scanning ultrasonic beam signals within a certain area. The ultrasonic waves generated by the ultrasonic sensor may be capable of scanning through a cell phone case made of glass, aluminum, stainless steel, sapphire, or plastic, thereby disposing the ultrasonic sensor within the cell phone case. The ultrasonic sensor is internally arranged, so that the occupied surface area of the ultrasonic sensor can be reduced, and a display screen with larger size can be installed on the surface of the mobile phone, so that the screen occupation ratio of the mobile phone can be improved.
Fig. 1 shows a schematic cross-sectional view of an ultrasonic sensor assembly according to the prior art. The ultrasonic sensor assembly 100 includes a chip 110, a flexible circuit board 120, and a metal substrate 130 stacked in this order. The chip 110 includes a reflected signal receiving layer 111, a circuit layer 112, and an ultrasonic generator 113 in this order. The ultrasonic generator 113 is connected to the flexible circuit board 120 using an anisotropic conductive adhesive 121, and the flexible circuit board 120 is fixed to the metal substrate 130 using an adhesive 131. The circuit layer 112 in the ultrasonic sensor assembly 100 is, for example, a thin film transistor array substrate including a plurality of thin film transistors formed on a glass substrate. The reflection signal receiving layer 111 is connected to the circuit layer 112 so that the ultrasonic reflection signal of the corresponding pixel unit can be selectively acquired. The circuit layer 112 includes pads 114 that are connected to the flexible circuit board 120, for example, using an anisotropic conductive adhesive. Further, the circuit layer 112 and the ultrasonic generator 113 are electrically connected to an external circuit via the flexible circuit board 120.
In the above-described ultrasonic sensor assembly, the two opposite surfaces of the flexible circuit board 120 are adhered to the ultrasonic generator 113 and the metal substrate 130, respectively, and the ultrasonic sensor assembly is bulky and has low assembly efficiency due to the mechanical fixing and electrical connection using the conductive adhesives of each director.
Disclosure of Invention
In view of the above, it is an object of the present application to provide an ultrasonic sensor assembly and a manufacturing method thereof, in which a chip is connected to a flexible circuit board by bonding wires to reduce the volume of the assembly and improve the packaging efficiency.
According to an aspect of the present application, there is provided an ultrasonic sensor assembly comprising: a metal substrate; a flexible circuit board including a first surface and a second surface opposite to each other, the second surface being fixed on the metal substrate; and a chip fixed on the first surface of the flexible circuit board and including an ultrasonic generator and a circuit layer stacked in order, wherein the first surface of the flexible circuit board includes a first wiring and a first pad, the ultrasonic generator is adjacent to the first surface of the flexible circuit board, and the ultrasonic generator and the circuit layer are connected to the first pad via bonding wires, respectively.
Preferably, the first surface and the second surface of the flexible circuit board are bonded to the chip and the metal substrate using a first adhesive and a second adhesive, respectively.
Preferably, the first adhesive and the second adhesive are used only to provide mechanical fixation.
Preferably, the first surface of the flexible circuit board includes a first region and a second region at different positions, wherein the first region of the first surface of the flexible circuit board is used for bonding the chip, and the second region includes the first pad as a bonding region.
Preferably, the ultrasonic generator includes a third surface adjacent to the circuit layer, the third surface of the ultrasonic generator including a second wiring and a second pad, wherein the second pad of the ultrasonic generator is connected to the first pad of the flexible circuit board via a bonding wire.
Preferably, the method further comprises: a first encapsulant at least partially covering the bond wire and a side of the sonotrode.
Preferably, the metal substrate is L-shaped, comprising a first portion extending transversely and a second portion extending longitudinally, said second portion together with the side edges of the sonotrode forming a space accommodating at least a portion of the bonding wire and the first encapsulation.
Preferably, the height of the second portion of the metal substrate reaches a position of one fifth to one half of the thickness of the ultrasonic generator.
Preferably, the method further comprises: and a reflective signal receiving layer on the circuit layer.
Preferably, the circuit layer includes a glass substrate and a plurality of thin film transistors on the glass substrate, wherein the ultrasonic generator includes a plurality of pixel units, and the plurality of thin film transistors are used for selectively acquiring ultrasonic reflection signals of the plurality of pixel units.
According to another aspect of the present application, there is provided a method of manufacturing an ultrasonic sensor assembly, comprising: forming a chip comprising an ultrasonic generator and a circuit layer stacked in sequence; fixing a flexible circuit board on a metal substrate; fixing a chip on a flexible circuit board; and connecting the chip with a flexible circuit board, wherein the flexible circuit board comprises a first surface and a second surface opposite to each other, the first surface of the flexible circuit board comprises a first wiring and a first bonding pad, the ultrasonic generator is adjacent to the first surface of the flexible circuit board, and the ultrasonic generator and the circuit layer are respectively connected to the first bonding pad via bonding wires.
Preferably, attaching the chip to the flexible circuit board includes adhering a first surface of the flexible circuit board to the chip with a first adhesive.
Preferably, the method further comprises bonding the second surface of the flexible circuit board to the metal substrate with a second adhesive.
Preferably, the first adhesive and the second adhesive are used only to provide mechanical fixation.
Preferably, the first surface of the flexible circuit board includes a first region and a second region at different positions, wherein the first region of the first surface of the flexible circuit board is used for bonding the chip, and the second region includes the first pad as a bonding region.
Preferably, the ultrasonic generator is connected to the first bonding pad by a bonding wire.
Preferably, the method further comprises at least partially covering the bonding wire and the side of the ultrasonic generator with a first encapsulant.
Preferably, the metal substrate is L-shaped, comprising a first portion extending transversely and a second portion extending longitudinally, said second portion together with the side edges of the sonotrode forming a space accommodating at least a portion of the bonding wire and the first encapsulation.
According to the ultrasonic sensor assembly and the manufacturing method thereof of the embodiment of the application, the ultrasonic generator and the circuit layer in the bonding wire chip are connected to the bonding pad on the flexible circuit board. The adhesive used on both surfaces of the flexible circuit board need only provide a mechanical fixing action and need not provide an electrical connection action. The flexible circuit board further enables external circuit electrical connections, such as external signal driving circuitry or signal processing circuitry. Therefore, the assembly can use a general adhesive on the surface of the flexible circuit board without using an anisotropic conductive paste, thereby reducing the volume of the assembly and improving the packaging efficiency.
In a preferred embodiment, the flexible circuit board is secured to an L-shaped metal substrate. The longitudinally extending portion of the metal substrate and the side edges of the ultrasonic generator define a space therebetween for at least partially receiving the bond wire and the package. The space may reduce the lateral dimensions of the solder areas on the first surface of the flexible circuit board and may reduce the amount of packaging material used and provide additional mechanical protection for the bond wires, thereby further reducing the bulk of the assembly and providing reliability of the assembly.
Drawings
The above and other objects, features and advantages of the present application will become more apparent from the following description of embodiments of the present application with reference to the accompanying drawings, in which:
FIG. 1 shows a schematic cross-sectional view of an ultrasonic sensor assembly according to the prior art;
fig. 2 shows a schematic cross-sectional view of an ultrasonic sensor assembly according to a first embodiment of the application;
fig. 3a to 3e show schematic cross-sectional views of a part of a stage in a method of manufacturing an ultrasonic sensor assembly according to a second embodiment of the application.
Detailed Description
The application will be described in more detail below with reference to the accompanying drawings. Like elements are denoted by like reference numerals throughout the various figures. For clarity, the various features of the drawings are not drawn to scale. Furthermore, some well-known portions may not be shown.
Numerous specific details of the application, such as device structures, materials, dimensions, processing techniques and technologies, are set forth in the following description in order to provide a thorough understanding of the application. However, as will be understood by those skilled in the art, the present application may be practiced without these specific details.
The application may be embodied in various forms, some examples of which are described below.
Fig. 2 shows a schematic cross-sectional view of an ultrasonic sensor assembly according to a first embodiment of the application. The ultrasonic sensor assembly 300 includes a chip 110, a flexible circuit board 120, and a metal substrate 130 stacked in this order.
The chip 110 includes a reflective signal receiving layer 111, a circuit layer 112, and an ultrasonic generator 113 stacked in this order. The ultrasonic generator 113 is connected to the flexible circuit board 120 using an adhesive 122, and the flexible circuit board 120 is fixed to the metal substrate 130 using an adhesive 131. The circuit layer 112 in the ultrasonic sensor assembly 300 is, for example, a thin film transistor array substrate including a plurality of thin film transistors formed on a glass substrate for selectively acquiring ultrasonic reflection signals of corresponding pixel units.
The ultrasonic generator 113 includes a first surface and a second surface opposite to each other, wherein the first surface abuts the circuit layer 112 and the second surface abuts the flexible circuit board 120. Wiring and pads, for example, pads 114 are formed on the first surface of the ultrasonic generator 113. Different areas of the first surface of the ultrasonic generator 113 are used to connect the circuit layer 112 and form the pads 114 so that the pads 114 can be exposed for bonding.
Further, the circuit layer 112 is connected to the pad 114 of the ultrasonic generator 113 via a wire, and is connected to the flexible circuit board 120 via a bonding wire 132. Bond wire 132 may be a gold wire, an alloy wire, or a copper wire. In this embodiment, both the circuit layer 112 and the ultrasonic generator 113 may be electrically connected to the flexible circuit board 120 via the bonding pads 114 and bonding wires 132 on the surface of the ultrasonic generator 113.
The flexible circuit board 120 provides a connection between the circuit layer 112 and the ultrasonic generator 113 and an external circuit. The flexible circuit board 120 includes a first surface and a second surface opposite to each other, wherein the first surface abuts the ultrasonic generator 113 and the second surface abuts the metal substrate 130. Wiring and pads are formed on the first surface of the flexible circuit board 120. Different areas of the first surface of the flexible circuit board 120 are used to connect the ultrasonic generator 113 and form pads so that the pads can be exposed for bonding. The bond wire 132 extends from the pad 114 on the first surface of the ultrasonic generator 113 to a pad on the first surface of the flexible circuit board 120 via a side edge of the ultrasonic generator 113. The bonding wire 132 is then secured and protected by covering the sides of the sonotrode 113 with an encapsulant 123, at least partially covering the bond pads 114 and the bonding wire 132.
Preferably, the metal substrate 130 is L-shaped, including a first portion 130a extending in a lateral direction and a second portion 130b extending in a longitudinal direction. The second portion 130b extends, for example, parallel to the side of the sonotrode 113, so that a space between the sonotrode 113 and the side defines a welding zone for at least partially accommodating the bonding wire 132 and the encapsulating material 123. The space may reduce the lateral size of the land on the first surface of the flexible circuit board 120 and may reduce the amount of use of the package 123 and improve the mechanical protection of the bond wires 123. Preferably, the height of the second portion 130b reaches one fifth to one half of the thickness of the ultrasonic generator 113 calculated from the second surface.
In this embodiment, bonding wires 132 are used in place of the anisotropic conductive adhesive 121 for electrical connection between the circuit layer 112 and the ultrasonic generator 113 and the flexible circuit board 120. The flexible circuit board 120 further implements external circuit electrical connections, such as external signal driving circuitry or signal processing circuitry.
The bonding process and bonding process used to form the ultrasonic sensor of this embodiment are known in the art and will not be described in detail herein.
In the above-described ultrasonic sensor assembly, the two opposite surfaces of the flexible circuit board 120 are adhered to the ultrasonic generator 113 and the metal substrate 130, respectively, and since a general adhesive may be used instead of the conductive adhesive having various directivities, the volume of the ultrasonic sensor assembly may be reduced and the assembly efficiency may be improved.
Fig. 3a to 3e show schematic cross-sectional views of a part of a stage in a method of manufacturing an ultrasonic sensor assembly according to a second embodiment of the application.
For the sake of simplicity, only the structures of the ultrasonic wave generator 113 and the flexible circuit board 120 and the connection manner thereof are shown in the drawings, and the detailed structures of the reflection signal receiving layer 111 and the circuit layer 112 are not shown. It is understood that the reflective signal receiving layer 111 and the circuit layer 112 may be connected by a wiring layer.
As shown in fig. 3a, the main structure of the chip 110 has been formed. The chip 110 includes a reflective signal receiving layer 111, a circuit layer 112, and an ultrasonic generator 113 stacked in this order. The reflective signal receiving layer 111 includes, for example, sensing electrodes of a plurality of pixel units. The circuit layer 112 is, for example, a thin film transistor array substrate including a plurality of thin film transistors formed on a glass substrate for selectively acquiring ultrasonic reflection signals of the corresponding pixel units. The ultrasonic generator 113 includes, for example, a piezoelectric layer sandwiched between two driving electrodes. Under the action of the electric field applied by the driving electrode, the piezoelectric layer converts the electric signal into mechanical vibration, thereby generating ultrasonic waves.
The piezoelectric layer is a functional layer of the ultrasonic generator 113, and is composed of, for example, an inorganic piezoelectric material including one selected from Barium Titanate (BT), lead zirconate titanate (PZT), modified lead zirconate titanate, lead metaniobate, lead barium lithium niobate (PBLN), and modified lead titanate (PT), or an organic piezoelectric material including one selected from polyvinylidene fluoride (PVDF), polyvinylidene fluoride-trifluoroethylene (PVDF-TrFe), polytetrafluoroethylene (PTFE), polyvinylidine chloride (PVDC), and diisopropylamine bromide (DIPAB).
The ultrasonic generator 113 includes a first surface and a second surface opposite to each other, wherein the first surface abuts the circuit layer 112. Wiring and pads, for example, pads 114 are formed on the first surface of the ultrasonic generator 113. Different areas of the first surface of the ultrasonic generator 113 are used to connect the circuit layer 112 and form the pads 114 so that the pads 114 can be exposed for bonding.
Further, the circuit layer 112 and the ultrasonic generator 113 may each be connected to a respective pad 114 via wiring of the first surface of the ultrasonic generator 113.
Then, the flexible circuit board 120 is fixed on the metal substrate 130 using an adhesive 131, as shown in fig. 3 b.
The flexible circuit board 120 includes a first surface and a second surface opposite to each other, wherein the first surface is to be used for supporting the ultrasonic generator 113, and the second surface abuts the metal substrate 130. Wiring and pads are formed on the first surface of the flexible circuit board 120. Different areas of the first surface of the flexible circuit board 120 are used to support the sonotrode 113 and to form pads, respectively, so that the pads can be exposed for bonding.
Preferably, the metal substrate 130 is L-shaped, including a first portion 130a extending in a lateral direction and a second portion 130b extending in a longitudinal direction. As will be described below, this second portion 130b will form together with the sonotrode 113 a space for accommodating the bond wires and the potting compound.
The chip 110 is then secured in the flexible circuit board 120 using an adhesive 122, as shown in fig. 3 c. In this step, the ultrasonic generator 113 in the chip 110 is connected to the flexible circuit board 120 using the adhesive 122. Since the adhesive 122 only needs to provide a mechanical fixing effect and no electrical connection is provided, a general adhesive is used instead of the anisotropic conductive adhesive in this step.
In a preferred embodiment, the metal substrate 130 is L-shaped. The second portion 130b of the metal substrate 130 extends in a direction parallel to, for example, the side of the ultrasonic wave generator 113, so that a space of a bonding area is defined between the side of the ultrasonic wave generator 113 and the second portion. Preferably, the height of the second portion 130b reaches one fifth to one half of the thickness of the ultrasonic generator 113 calculated from the second surface.
Bonding wires 132 are then used to connect the pads 114 of the sonotrode 113 to the flexible circuit board 120, as shown in figure 3 d. This step may be accomplished by conventional bonding processes, which are not described in detail herein.
Bond wire 132 may be a gold wire, an alloy wire, or a copper wire. In this embodiment, both the circuit layer 112 and the ultrasonic generator 113 may be electrically connected to the flexible circuit board 120 via the bonding pads 114 and bonding wires 132 on the surface of the ultrasonic generator 113.
In the above preferred embodiment, the metal substrate 130 is L-shaped. The bonding area defined between the second portion 130b of the metal substrate 130 and the side of the ultrasonic wave generator 130 is used to accommodate the bonding wire 120, not only can the lateral dimension of the bonding area on the first surface of the flexible circuit board 120 be reduced, but also the mechanical protection of the bonding wire 123 can be improved.
Then, the side of the ultrasonic generator 113 is covered with the sealing material 123, thereby forming an ultrasonic sensor assembly 200, as shown in fig. 3 e. The encapsulant 123 at least partially covers the bond pads 114 and the bond wires 132, thereby securing and protecting the bond wires 132.
The circuit layer 112 and the ultrasonic generator 113 in the chip 110 are each connected to the flexible circuit board 120 via a bonding pad 114 on the first surface of the ultrasonic generator 113 and a bonding wire 132. The flexible circuit board 120 further realizes external circuit electrical connection, for example, connection to an external signal driving circuit or signal processing circuit.
The adhesive 122 between the ultrasonic generator 113 and the flexible circuit board 120 in the chip 110 need only provide a mechanical fixing action, and does not need to provide an electrical connection, so that a common adhesive is used instead of the anisotropic conductive adhesive in this embodiment.
It should be noted that in this document relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Embodiments in accordance with the present application, as described above, are not intended to be exhaustive or to limit the application to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the application and the practical application, to thereby enable others skilled in the art to best utilize the application and various modifications as are suited to the particular use contemplated. The application is limited only by the claims and the full scope and equivalents thereof.
Claims (18)
1. An ultrasonic sensor assembly comprising:
a metal substrate;
a flexible circuit board including a first surface and a second surface opposite to each other, the second surface being fixed on the metal substrate; and
a chip fixed on the first surface of the flexible circuit board and including an ultrasonic generator and a circuit layer stacked in order,
wherein the first surface of the flexible circuit board includes a first wiring and a first pad, the ultrasonic generator is adjacent to the first surface of the flexible circuit board,
the ultrasonic generator and the circuit layer are respectively connected to the first bonding pad via bonding wires;
the metal substrate is L-shaped and comprises a first part extending transversely and a second part extending longitudinally, and the second part and the side edge of the ultrasonic generator limit the space of the welding area.
2. The ultrasonic sensor assembly of claim 1, wherein the first and second surfaces of the flexible circuit board are bonded to the chip and the metal substrate with first and second adhesives, respectively.
3. The ultrasonic sensor assembly of claim 2, wherein the first adhesive and the second adhesive are used only to provide mechanical securement.
4. The ultrasonic sensor assembly of claim 2, wherein the first surface of the flexible circuit board comprises first and second regions at different locations, wherein the first region of the first surface of the flexible circuit board is for bonding the chip and the second region comprises the first pad as a bonding region.
5. The ultrasonic sensor assembly of claim 4, wherein the ultrasonic generator comprises a third surface adjacent to the circuit layer, the third surface of the ultrasonic generator comprising a second wire and a second pad,
wherein the second bonding pad of the ultrasonic generator is connected to the first bonding pad of the flexible circuit board via a bonding wire.
6. The ultrasonic sensor assembly of claim 5, further comprising: a first encapsulant at least partially covering the bond wire and a side of the sonotrode.
7. The ultrasonic sensor assembly of claim 6, wherein the second portion, together with the side edge of the ultrasonic generator, forms a space that accommodates the bond wire and at least a portion of the first encapsulant.
8. The ultrasonic sensor assembly of claim 7, wherein the second portion of the metal substrate has a height that is one fifth to one half of the thickness of the ultrasonic generator.
9. The ultrasonic sensor assembly of claim 1, further comprising: and a reflective signal receiving layer on the circuit layer.
10. The ultrasonic sensor assembly of claim 1, wherein the circuit layer comprises a glass substrate and a plurality of thin film transistors on the glass substrate,
the ultrasonic generator comprises a plurality of pixel units, and the thin film transistors are used for selectively acquiring ultrasonic reflection signals of the pixel units.
11. A method of manufacturing an ultrasonic sensor assembly, comprising:
forming a chip comprising an ultrasonic generator and a circuit layer stacked in sequence;
fixing a flexible circuit board on a metal substrate;
fixing a chip on a flexible circuit board; and
the chip is connected to a flexible circuit board,
wherein the flexible circuit board includes a first surface and a second surface opposite to each other, the first surface of the flexible circuit board includes a first wiring and a first pad, the ultrasonic generator is adjacent to the first surface of the flexible circuit board,
the ultrasonic generator and the circuit layer are respectively connected to the first bonding pad via bonding wires; the metal substrate is L-shaped and comprises a first part extending transversely and a second part extending longitudinally, and the second part and the side edge of the ultrasonic generator limit the space of the welding area.
12. The method of claim 11, wherein connecting the chip to a flexible circuit board comprises bonding a first surface of the flexible circuit board to the chip with a first adhesive.
13. The method of claim 12, further comprising bonding the second surface of the flexible circuit board to a metal substrate with a second adhesive.
14. The method of claim 13, wherein the first adhesive and the second adhesive are used only to provide mechanical fixation.
15. The method of claim 14, wherein the first surface of the flexible circuit board comprises first and second regions at different locations, wherein the first region of the first surface of the flexible circuit board is for bonding the chip and the second region comprises the first pad as a bonding region.
16. The method of claim 15, further comprising connecting the sonotrode to the first pad with a bond wire.
17. The method of claim 16, further comprising at least partially covering the bond wire and a side of the sonotrode with a first encapsulant.
18. The method of claim 17, wherein the second portion and the side of the sonotrode together form a space that accommodates the bond wire and at least a portion of the first encapsulant.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710570888.6A CN107172812B (en) | 2017-07-13 | 2017-07-13 | Ultrasonic sensor assembly and method of manufacture |
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| CN201710570888.6A CN107172812B (en) | 2017-07-13 | 2017-07-13 | Ultrasonic sensor assembly and method of manufacture |
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| CN107172812A CN107172812A (en) | 2017-09-15 |
| CN107172812B true CN107172812B (en) | 2023-08-11 |
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| CN108423632A (en) * | 2018-05-04 | 2018-08-21 | 李扬渊 | A kind of electronic equipment and its manufacturing method that can realize supersonic sensing |
| CN110948072B (en) * | 2019-11-25 | 2021-10-19 | 广东奥迪威传感科技股份有限公司 | Production process of closed ultrasonic sensor |
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| WO2015150385A2 (en) * | 2014-03-31 | 2015-10-08 | Koninklijke Philips N.V. | Ic die, ultrasound probe, ultrasonic diagnostic system and method |
| CN106886333A (en) * | 2017-01-13 | 2017-06-23 | 麦克思商务咨询(深圳)有限公司 | Sensing device further |
| CN206993486U (en) * | 2017-07-13 | 2018-02-09 | 杭州士兰微电子股份有限公司 | Supersonic sensing device assembly |
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| US7730785B2 (en) * | 2006-04-26 | 2010-06-08 | Denso Corporation | Ultrasonic sensor and manufacture method of the same |
| JP4752715B2 (en) * | 2006-10-13 | 2011-08-17 | 株式会社デンソー | Ultrasonic sensor |
| JP4412367B2 (en) * | 2007-08-21 | 2010-02-10 | 株式会社デンソー | Ultrasonic sensor |
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| JP2004179954A (en) * | 2002-11-27 | 2004-06-24 | Matsushita Electric Ind Co Ltd | Matching material, its manufacturing method, and ultrasonic sensor using the same |
| JP2006003278A (en) * | 2004-06-18 | 2006-01-05 | Funai Electric Co Ltd | Ultrasonic sensor system |
| CA2856917A1 (en) * | 2013-07-19 | 2015-01-19 | University Of Windsor | Ultrasonic sensor microarray and method of manufacturing same |
| WO2015150385A2 (en) * | 2014-03-31 | 2015-10-08 | Koninklijke Philips N.V. | Ic die, ultrasound probe, ultrasonic diagnostic system and method |
| CN106886333A (en) * | 2017-01-13 | 2017-06-23 | 麦克思商务咨询(深圳)有限公司 | Sensing device further |
| CN206993486U (en) * | 2017-07-13 | 2018-02-09 | 杭州士兰微电子股份有限公司 | Supersonic sensing device assembly |
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