CN107164748A - A kind of copper foil surface chemical passivation processing method - Google Patents
A kind of copper foil surface chemical passivation processing method Download PDFInfo
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- CN107164748A CN107164748A CN201710348309.3A CN201710348309A CN107164748A CN 107164748 A CN107164748 A CN 107164748A CN 201710348309 A CN201710348309 A CN 201710348309A CN 107164748 A CN107164748 A CN 107164748A
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- Prior art keywords
- copper foil
- processing method
- foil surface
- cobalt
- surface chemical
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 73
- 239000011889 copper foil Substances 0.000 title claims abstract description 70
- 238000003672 processing method Methods 0.000 title claims abstract description 26
- 238000006388 chemical passivation reaction Methods 0.000 title claims abstract description 24
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 32
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000010941 cobalt Substances 0.000 claims abstract description 29
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 29
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000011701 zinc Substances 0.000 claims abstract description 29
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 29
- 238000007772 electroless plating Methods 0.000 claims abstract description 28
- 238000002161 passivation Methods 0.000 claims abstract description 26
- 229940044175 cobalt sulfate Drugs 0.000 claims abstract description 17
- 229910000361 cobalt sulfate Inorganic materials 0.000 claims abstract description 17
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 claims abstract description 17
- 230000009849 deactivation Effects 0.000 claims abstract description 17
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims abstract description 16
- 239000008103 glucose Substances 0.000 claims abstract description 16
- 239000001488 sodium phosphate Substances 0.000 claims abstract description 16
- 229910000162 sodium phosphate Inorganic materials 0.000 claims abstract description 16
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims abstract description 16
- 239000011787 zinc oxide Substances 0.000 claims abstract description 16
- 239000008367 deionised water Substances 0.000 claims abstract description 8
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 239000002904 solvent Substances 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000006479 redox reaction Methods 0.000 claims abstract description 7
- 238000007747 plating Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 4
- 238000005265 energy consumption Methods 0.000 abstract description 4
- 239000003344 environmental pollutant Substances 0.000 abstract description 3
- 231100000719 pollutant Toxicity 0.000 abstract description 3
- 238000007254 oxidation reaction Methods 0.000 description 13
- 239000010410 layer Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 3
- 229910000423 chromium oxide Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000002845 discoloration Methods 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 235000009754 Vitis X bourquina Nutrition 0.000 description 1
- 235000012333 Vitis X labruscana Nutrition 0.000 description 1
- 240000006365 Vitis vinifera Species 0.000 description 1
- 235000014787 Vitis vinifera Nutrition 0.000 description 1
- KSHPUQQHKKJVIO-UHFFFAOYSA-N [Na].[Zn] Chemical compound [Na].[Zn] KSHPUQQHKKJVIO-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- 229960004643 cupric oxide Drugs 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- QNDQILQPPKQROV-UHFFFAOYSA-N dizinc Chemical compound [Zn]=[Zn] QNDQILQPPKQROV-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 231100000086 high toxicity Toxicity 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000001473 noxious effect Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Treatment Of Metals (AREA)
Abstract
The invention discloses a kind of copper foil surface chemical passivation processing method, surface chemistry replacement Treatment is carried out in the deactivation slot for having the solution of cobalt electroless plating containing zinc using deionized water as basic solvent by sending into copper foil to deposit, copper foil surface is produced metal deposit using redox reaction；Contain the 20g/L of sodium phosphate 8, the 10g/L of glucose 2, the 12g/L of zinc oxide 2 and the 8g/L of cobalt sulfate 2 in the described solution of cobalt electroless plating containing zinc.The present invention has the characteristics of can reducing energy consumption, reduction pollutant emission and good passivation effect.
Description
Technical field
The present invention relates to a kind of copper foil processing method, particularly a kind of copper foil surface chemical passivation processing method.
Background technology
Copper foil during transport, storage and copper coated foil plate production operation, be frequently encountered steam that external environment brings,
Dust fall, oxidation, the pollution of even impression of the hand, make to produce discoloured spots etc. on copper-clad surface；In addition, the high temperature in plate is suppressed with PCB's
By after high temperature in processing, copper-clad surface occurs local discolouration, forms the spot of cupric oxide, and these change meetings of copper foil surface
The solderability of copper face, affinity, tack with ink are had influence on, and line resistance increase can be made, it is necessary to copper foil surface
It is passivated processing.Current Passivation Treatment typically carries out processing to copper foil surface using chromic acid and forms chromium oxide protective layer, oxygen
Changing chromium protective layer has many gaps, and sealing property is not fine, often also needs to one layer of zinc of plating below chromium oxide protective layer and comes
Protect copper foil.And because the hexavalent chromium in electroplating effluent has strong oxidizing property, dissolubility, migration in the environment
Greatly, with high toxicity, therefore serious pollution can be caused to environment.The enhancing realized with global environmental protection, particularly
Rohs instructions, the implementation of WEEE instructions and China《Electronics and IT products pollution control management method》Implementation, to containing chromium, arsenic etc.
Noxious material is strictly limited.Electroplating technology is big to the demand of the energy simultaneously, also there is the problem of economy is not good.
The content of the invention
It is an object of the present invention to provide a kind of copper foil surface chemical passivation processing method.It has can reduce energy consumption,
The characteristics of reducing pollutant emission and good passivation effect.
Technical scheme：A kind of copper foil surface chemical passivation processing method, by by copper foil feeding storage have with
Deionized water utilizes oxidation as surface chemistry replacement Treatment is carried out in the deactivation slot of the solution of cobalt electroless plating containing zinc of basic solvent
Reduction reaction makes copper foil surface produce metal deposit；Contain sodium phosphate 8-20g/L, grape in the described solution of cobalt electroless plating containing zinc
Sugared 2-10g/L, zinc oxide 2-12g/L and cobalt sulfate 2-8g/L.
In a kind of foregoing copper foil surface chemical passivation processing method, the solution of cobalt electroless plating containing zinc in the deactivation slot
20-50 DEG C of temperature, pH value are 6-9.
In a kind of foregoing copper foil surface chemical passivation processing method, the solution of cobalt electroless plating containing zinc in the deactivation slot
Temperature is 35 DEG C, pH value is 7.
In a kind of foregoing copper foil surface chemical passivation processing method, the passivation time is 5-8 seconds.
In a kind of foregoing copper foil surface chemical passivation processing method, contain phosphoric acid in the described solution of cobalt electroless plating containing zinc
Sodium 10-16g/L, glucose 2-7g/L, zinc oxide 3-6g/L and cobalt sulfate 3-7g/L.
In a kind of foregoing copper foil surface chemical passivation processing method, described sodium phosphate is that 10g/L, glucose are 2g/
L, zinc oxide are 3g/L and cobalt sulfate is 3g/L；Or described sodium phosphate is that 12g/L, glucose are 5g/L, zinc oxide
It is 5g/L for 4g/L and cobalt sulfate；Or described sodium phosphate be 15g/L, glucose be 6g/L, zinc oxide be 5g/L with
And cobalt sulfate 7g/L.
Compared with prior art, the present invention is passivated processing, substitution tradition to copper foil using the solution of cobalt electroless plating containing zinc
The mode being passivated with chromic acid, eliminates the discharge of hexavalent chromium, so as to greatly reduce the pollution to environment；And
And one layer of zinc layers need not be plated below chromium oxide layer, passivation flow is simplified, the efficiency of passivation is improved；While nothing of the present invention
Direct current need to be led to, be directly passivated by redox processing method, the consumption of substantial amounts of electric power resource can be saved, dropped
Low energy consumption；Copper foil is carried out by the solution of cobalt electroless plating containing zinc containing sodium phosphate, glucose, zinc oxide and cobalt sulfate
Passivation, can extend the copper foil oxidized time, additionally it is possible to improve copper foil oxidation resistance in high temperature environments, improve passivation
Effect.In summary, the present invention has the characteristics of can reducing energy consumption, reduction pollutant emission and good passivation effect.
Embodiment
With reference to embodiment, the present invention is further illustrated, but is not intended as to the foundation of the invention limited.
Embodiment 1.A kind of copper foil surface chemical passivation processing method, copper foil feeding storage is had using deionized water and is used as base
Surface chemistry replacement Treatment is carried out in the deactivation slot of the solution of cobalt electroless plating containing zinc of this solvent, makes copper foil using redox reaction
Surface produces metal deposit；Contain sodium phosphate 8-20g/L, glucose 2-10g/L, oxidation in the described solution of cobalt electroless plating containing zinc
Zinc 2-12g/L and cobalt sulfate 2-8g/L；20-50 DEG C of the temperature of the solution of cobalt electroless plating containing zinc in the deactivation slot, pH
It is worth for 6-9.The passivation time is 5-8 seconds.
Embodiment 2.In a kind of copper foil surface chemical passivation processing method, by copper foil feeding storage have using deionized water as
Surface chemistry replacement Treatment is carried out in the deactivation slot of the solution of cobalt electroless plating containing zinc of basic solvent, makes copper using redox reaction
Paper tinsel surface produces metal deposit；Contain sodium phosphate 10-16g/L, glucose 2- in the described described solution of cobalt electroless plating containing zinc
7g/L, zinc oxide 3-6g/L and cobalt sulfate 3-7g/L；The temperature 30- of the solution of cobalt electroless plating containing zinc in the deactivation slot
40 DEG C, pH value be 7-8.
Embodiment 3.A kind of copper foil surface chemical passivation processing method, is made by the way that copper foil feeding storage is had with deionized water
To carry out surface chemistry replacement Treatment in the deactivation slot of the solution of cobalt electroless plating containing zinc of basic solvent, made using redox reaction
Copper foil surface produces the deposition of metal；Containing sodium phosphate it is that 10g/L, glucose are 2g/ in the described solution of cobalt electroless plating containing zinc
L, zinc oxide are that 3g/L, cobalt sulfate are 3g/L；The temperature of the solution of cobalt electroless plating containing zinc in the deactivation slot is 35 DEG C, pH
It is worth for 7.The passivation time is 6 seconds.
Copper foil after passivation is tested：Copper foil after passivation is placed in the case where temperature is 140 DEG C of experimental situation
30min, copper foil will not change colour, and will not occur oxidation reaction；Copper foil after passivation is in temperature under 160 DEG C of experimental situation
30min is placed, discoloration and oxidation reaction can occur for copper foil；Copper foil after passivation is placed in the case where temperature is 180 DEG C of experimental situation
Discoloration and oxidation reaction can occur for 30min, copper foil.
Embodiment 4.A kind of copper foil surface chemical passivation processing method, is made by the way that copper foil feeding storage is had with deionized water
To carry out surface chemistry replacement Treatment in the deactivation slot of the solution of cobalt electroless plating containing zinc of basic solvent, made using redox reaction
Copper foil surface produces metal deposit；The sodium phosphate contained in the described solution of cobalt electroless plating containing zinc is that 12g/L, glucose are 5g/
L, zinc oxide are 4g/L；Cobalt sulfate is 5g/L；The temperature of the solution of cobalt electroless plating containing zinc in the deactivation slot is 35 DEG C, PH
It is worth for 7.The passivation time is 7 seconds.
Copper foil after passivation is tested：Copper foil after passivation is placed in the case where temperature is 140 DEG C of experimental situation
30min, copper foil will not change colour, and will not also occur oxidation reaction；Copper foil after passivation is in the experimental situation that temperature is 160 DEG C
Lower placement 30min, copper foil will not change colour, and will not also occur oxidation reaction；Copper foil after passivation is in the reality that temperature is 180 DEG C
Test and 30min is placed under environment, discoloration and oxidation reaction can occur for copper foil.
Embodiment 5.A kind of copper foil surface chemical passivation processing method, is made by the way that copper foil feeding storage is had with deionized water
To carry out surface chemistry replacement Treatment in the deactivation slot of the solution of cobalt electroless plating containing zinc of basic solvent, made using redox reaction
Copper foil surface produces metal deposit；The sodium phosphate contained in the described solution of cobalt electroless plating containing zinc is that 15g/L, glucose are 6g/
L, zinc oxide are 5g/L, cobalt sulfate 7g/L；The temperature of the solution of cobalt electroless plating containing zinc in the deactivation slot is 35 DEG C, pH value
For 7.The passivation time is 8 seconds.
Copper foil after passivation is tested：Copper foil after passivation is placed in the case where temperature is 140 DEG C of experimental situation
30min, copper foil will not change colour, and will not also occur oxidation reaction；Copper foil after passivation is in the experimental situation that temperature is 160 DEG C
Lower placement 30min, copper foil will not change colour, and will not also occur oxidation reaction；Copper foil after passivation is in the reality that temperature is 180 DEG C
Test and 30min is placed under environment, copper foil will not change colour, and will not also occur oxidation reaction.
Claims (8)
1. a kind of copper foil surface chemical passivation processing method, it is characterised in that：By the way that copper foil feeding storage is had with deionized water
As surface chemistry replacement Treatment is carried out in the deactivation slot of the solution of cobalt electroless plating containing zinc of basic solvent, redox reaction is utilized
Copper foil surface is set to produce metal deposit；Contain sodium phosphate 8-20g/L, glucose 2-10g/ in the described solution of cobalt electroless plating containing zinc
L, zinc oxide 2-12g/L and cobalt sulfate 2-8g/L.
2. a kind of copper foil surface chemical passivation processing method according to claim 1, it is characterised in that：In the deactivation slot
20-50 DEG C of the temperature of the solution of cobalt electroless plating containing zinc, pH value be 6-9.
3. a kind of copper foil surface chemical passivation processing method according to claim 2, it is characterised in that：In the deactivation slot
The solution of cobalt electroless plating containing zinc temperature be 35 DEG C, pH value be 7.
4. a kind of copper foil surface chemical passivation processing method according to claim 1, it is characterised in that：The passivation time
For 5-8 seconds.
5. a kind of copper foil surface chemical passivation processing method according to claim 1, it is characterised in that：Described cobalt containing zinc
Contain sodium phosphate 10-16g/L, glucose 2-7g/L, zinc oxide 3-6g/L and cobalt sulfate 3-7g/L in chemical plating solution.
6. a kind of copper foil surface chemical passivation processing method according to claim 5, it is characterised in that：Described sodium phosphate
For 10g/L, glucose be 2g/L, zinc oxide is 3g/L and cobalt sulfate is 3g/L.
7. a kind of copper foil surface chemical passivation processing method according to claim 5, it is characterised in that：Described sodium phosphate
For 12g/L, glucose be 5g/L, zinc oxide is 4g/L and cobalt sulfate is 5g/L.
8. a kind of copper foil surface chemical passivation processing method according to claim 5, it is characterised in that：Described sodium phosphate
For 15g/L, glucose be 6g/L, zinc oxide is 5g/L and cobalt sulfate is 7g/L.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710348309.3A CN107164748A (en) | 2017-05-17 | 2017-05-17 | A kind of copper foil surface chemical passivation processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710348309.3A CN107164748A (en) | 2017-05-17 | 2017-05-17 | A kind of copper foil surface chemical passivation processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107164748A true CN107164748A (en) | 2017-09-15 |
Family
ID=59816435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710348309.3A Pending CN107164748A (en) | 2017-05-17 | 2017-05-17 | A kind of copper foil surface chemical passivation processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107164748A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110042438A (en) * | 2019-04-24 | 2019-07-23 | 福建清景铜箔有限公司 | The preparation method of electrolytic copper foil |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1295426A (en) * | 1993-03-29 | 2001-05-16 | 日本能源株式会社 | Copper foil for printed circuit and its manufacture |
-
2017
- 2017-05-17 CN CN201710348309.3A patent/CN107164748A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1295426A (en) * | 1993-03-29 | 2001-05-16 | 日本能源株式会社 | Copper foil for printed circuit and its manufacture |
Non-Patent Citations (1)
| Title |
|---|
| 黄永发等: ""一种新型环保铜箔表面钝化处理工艺研究"", 《有色金属科学与工程》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110042438A (en) * | 2019-04-24 | 2019-07-23 | 福建清景铜箔有限公司 | The preparation method of electrolytic copper foil |
| CN110042438B (en) * | 2019-04-24 | 2021-02-05 | 福建清景铜箔有限公司 | Method for preparing electrolytic copper foil |
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Application publication date: 20170915 |
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