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CN107148141A - Gold finger structure and flexible circuit board - Google Patents

Gold finger structure and flexible circuit board Download PDF

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Publication number
CN107148141A
CN107148141A CN201710433374.6A CN201710433374A CN107148141A CN 107148141 A CN107148141 A CN 107148141A CN 201710433374 A CN201710433374 A CN 201710433374A CN 107148141 A CN107148141 A CN 107148141A
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CN
China
Prior art keywords
curve
golden finger
finger structure
fixed end
cover layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710433374.6A
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Chinese (zh)
Inventor
时世永
梁大海
黄毅
姬晓峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anhui Jingzhuo Optical Display Technology Co Ltd
Original Assignee
Suzhou OFilm Tech Co Ltd
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Application filed by Suzhou OFilm Tech Co Ltd filed Critical Suzhou OFilm Tech Co Ltd
Priority to CN201710433374.6A priority Critical patent/CN107148141A/en
Publication of CN107148141A publication Critical patent/CN107148141A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/118Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0271Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

本发明公开的金手指结构,用于柔性电路板,金手指结构包括金手指本体、第一覆盖膜和第二覆盖膜。金手指本体包括固定端和连接端,固定端与柔性电路板连接,连接端用于与待连接元件连接。第一覆盖膜设置在固定端的一表面上,第一覆盖膜与固定端对应的一边呈第一曲线。第二覆盖膜设置在固定端上的与第一覆盖膜相背的表面上,第二覆盖膜与固定端对应的一边呈第二曲线。第一覆盖膜与固定端对应的边缘呈曲线,减小了金手指结构在第一覆盖膜与固定端对应的边缘产生的应力,第二覆盖膜与固定端对应的边缘也呈曲线,减小了金手指结构在第二覆盖膜与固定端对应的边缘产生的应力,从而提升了金手指结构的强度。本发明还公开了一种柔性电路板。

The gold finger structure disclosed by the present invention is used for a flexible circuit board, and the gold finger structure includes a gold finger body, a first covering film and a second covering film. The golden finger body includes a fixed end and a connecting end, the fixed end is connected with the flexible circuit board, and the connecting end is used for connecting with the components to be connected. The first covering film is arranged on a surface of the fixed end, and a side of the first covering film corresponding to the fixed end forms a first curve. The second covering film is arranged on the surface of the fixed end opposite to the first covering film, and a side of the second covering film corresponding to the fixed end forms a second curve. The edge corresponding to the fixed end of the first covering film is curved, which reduces the stress generated by the gold finger structure on the edge corresponding to the first covering film and the fixed end, and the edge corresponding to the second covering film and the fixed end is also curved, reducing The stress generated by the gold finger structure on the edge corresponding to the fixed end of the second covering film is reduced, thereby improving the strength of the gold finger structure. The invention also discloses a flexible circuit board.

Description

金手指结构及柔性电路板Gold finger structure and flexible circuit board

技术领域technical field

本发明涉及电路板技术领域,具体涉及一种金手指结构及柔性电路板。The invention relates to the technical field of circuit boards, in particular to a golden finger structure and a flexible circuit board.

背景技术Background technique

现有的金手指结构在运输或用于其他电子元件连接时容易断裂,从而导致金手指结构的电性不良。The existing gold finger structure is easily broken when it is transported or used for connecting other electronic components, which leads to poor electrical properties of the gold finger structure.

发明内容Contents of the invention

本发明的实施方式提供了一种金手指结构及柔性电路板。Embodiments of the present invention provide a golden finger structure and a flexible circuit board.

本发明实施方式的金手指结构,用于柔性电路板,所述金手指结构包括:The gold finger structure according to the embodiment of the present invention is used for a flexible circuit board, and the gold finger structure includes:

金手指本体,所述金手指本体包括固定端和连接端,所述固定端与所述柔性电路板连接,所述连接端用于与待连接元件连接;Gold finger body, the gold finger body includes a fixed end and a connecting end, the fixed end is connected to the flexible circuit board, and the connecting end is used to connect to the element to be connected;

第一覆盖膜,所述第一覆盖膜设置在所述固定端的一表面上,所述第一覆盖膜与所述固定端对应的一边呈第一曲线;和a first covering film, the first covering film is disposed on a surface of the fixed end, and a side of the first covering film corresponding to the fixed end forms a first curve; and

第二覆盖膜,所述第二覆盖膜设置在所述固定端上的与所述第一覆盖膜相背的表面上,所述第二覆盖膜与所述固定端对应的一边呈第二曲线。A second covering film, the second covering film is arranged on the surface of the fixed end opposite to the first covering film, and the side of the second covering film corresponding to the fixed end forms a second curve .

在某些实施方式中,所述第一曲线包括波峰与波谷,所述第二曲线包括波峰与波谷,在朝向所述金手指本体的投影中,所述第一曲线的波峰与所述第二曲线的波峰错开,所述第一曲线的波谷与所述第二曲线的波谷错开。本发明中的第一覆盖膜与所述固定端对应的一边呈第一曲线时,减小了金手指结构在第一覆盖膜与固定端对应的边缘产生的应力;第二覆盖膜与固定端对应的边缘也呈曲线,减小了金手指结构在第二覆盖膜与固定端对应的边缘产生的应力,从而提升了金手指结构的强度。In some embodiments, the first curve includes peaks and troughs, the second curve includes peaks and troughs, and in the projection toward the body of the gold finger, the peaks of the first curve and the second The crests of the curves are staggered, and the troughs of the first curve and the troughs of the second curve are staggered. In the present invention, when the side corresponding to the fixed end of the first covering film is in the first curve, the stress generated by the gold finger structure on the edge corresponding to the first covering film and the fixed end is reduced; the second covering film and the fixed end The corresponding edge is also curved, which reduces the stress generated by the gold finger structure on the edge corresponding to the fixed end of the second covering film, thereby improving the strength of the gold finger structure.

在某些实施方式中,所述第一覆盖膜在所述金手指本体上的正投影完全覆盖所述第二覆盖膜在所述金手指本体上的正投影;或In some embodiments, the orthographic projection of the first covering film on the golden finger body completely covers the orthographic projection of the second covering film on the golden finger body; or

所述第二覆盖膜在所述金手指本体上的正投影完全覆盖所述第一覆盖膜在所述金手指本体上的正投影;或The orthographic projection of the second covering film on the golden finger body completely covers the orthographic projection of the first covering film on the golden finger body; or

所述第一覆盖膜与所述固定端对应的一边在所述金手指本体上的正投影,和所述第二覆盖膜与所述固定端对应的一边在所述金手指本体上的正投影相交;或The orthographic projection of the side of the first covering film corresponding to the fixed end on the golden finger body, and the orthographic projection of the side of the second covering film corresponding to the fixed end on the golden finger body intersect; or

所述第一曲线的波峰与所述第二曲线的波谷间隔相对,所述第一曲线的波谷与所述第二曲线的波峰间隔相对。这样能够进一步减小金手指结构在第一覆盖膜与固定端对应的边缘产生的应力,及进一步减小金手指结构在第二覆盖膜与固定端对应的边缘产生的应力,进而避免金手指结构容易沿着第一曲线与固定端对应的边缘折断,或/和沿着第二曲线与固定端对应的边缘折断。The peak interval of the first curve is opposite to the valley interval of the second curve, and the valley interval of the first curve is opposite to the peak interval of the second curve. This can further reduce the stress generated by the gold finger structure on the edge corresponding to the fixed end of the first cover film, and further reduce the stress generated by the gold finger structure on the edge corresponding to the fixed end of the second cover film, thereby avoiding the It is easy to break along the edge corresponding to the fixed end along the first curve, or/and break off along the edge corresponding to the fixed end along the second curve.

在某些实施方式中,所述金手指本体包括基材和多个手指,所述多个手指设置在所述基材的相背两个侧面上,位于所述基材同一侧面上的多个手指相互间隔设置。由于位于基材同一侧面上的多个手指相互间隔设置,从而避免手指连接在一起而导致电路短路。In some embodiments, the gold finger body includes a substrate and a plurality of fingers, the plurality of fingers are arranged on two opposite sides of the substrate, and the plurality of fingers located on the same side of the substrate Fingers are set apart from each other. Since the plurality of fingers located on the same side of the base material are arranged at intervals, the circuit short circuit caused by the fingers being connected together is avoided.

在某些实施方式中,每个所述手指在所述连接端处开设有导通孔,位于所述基材同一侧面上的相邻的两个所述手指的所述导通孔的位置不同。相邻的两个手指的导通孔的位置不同,也就是说,多个导通孔的中心不在同一直线上,由于手指在开设有导通孔处的强度小于手指的其他位置上的强度,因而能够避免金手指结构沿着多个导通孔的中心连线折断。In some embodiments, each of the fingers is provided with a conduction hole at the connecting end, and the positions of the conduction holes of two adjacent fingers on the same side of the substrate are different. . The positions of the conduction holes of two adjacent fingers are different, that is to say, the centers of the plurality of conduction holes are not on the same straight line. Since the strength of the finger at the place where the conduction hole is opened is smaller than that at other positions of the finger, Therefore, the gold finger structure can be prevented from being broken along the central connection line of the plurality of via holes.

在某些实施方式中,每个所述手指在所述连接端处的端部开设有半圆形孔。开口为半圆形孔,当手指与待连接元件焊接时,焊接材料(例如,焊锡)能够扩散至开口内,使手指与待连接元件能够更好地连接。In some embodiments, a semicircular hole is formed at the end of each of the fingers at the connecting end. The opening is a semicircular hole, and when the finger is welded to the component to be connected, welding material (for example, solder) can diffuse into the opening, so that the finger and the component to be connected can be better connected.

在某些实施方式中,所述手指包括铜箔、金箔、或铜箔表面镀金中的至少一种。这样可以使手指具有较好的导电性及耐腐蚀性。In some embodiments, the finger includes at least one of copper foil, gold foil, or gold-plated copper foil. This can make the fingers have better conductivity and corrosion resistance.

在某些实施方式中,所述第一覆盖膜包括自所述第一曲线的两端沿从所述固定端至所述连接端的方向延伸的第一增强部,所述第一增强部位于所述金手指本体的两侧边缘;或/和In some embodiments, the first cover film includes a first reinforcement part extending from both ends of the first curve along the direction from the fixed end to the connection end, and the first reinforcement part is located at the the edges on both sides of the golden finger body; or/and

所述第二覆盖膜包括自所述第二曲线的两端沿从所述固定端至所述连接端的方向延伸的第二增强部,所述第二增强部位于所述金手指本体的两侧边缘。当金手指结构在力的作用下发生弯曲时,第一增强部、第二增强部能够吸收部分弯折力,从而增强了金手指结构的强度。The second cover film includes a second reinforcement part extending from both ends of the second curve along the direction from the fixed end to the connection end, and the second reinforcement part is located on both sides of the golden finger body edge. When the gold finger structure is bent under the action of force, the first reinforcement part and the second reinforcement part can absorb part of the bending force, thereby enhancing the strength of the gold finger structure.

在某些实施方式中,所述第一增强部或/和所述第二增强部的宽度大于或等于0.2mm。若第一增强部的宽度小于0.2mm,会导致第一增强部能够吸收的弯折力较小,起不到进一步增强金手指结构的强度的作用。In some embodiments, the width of the first reinforcement part and/or the second reinforcement part is greater than or equal to 0.2 mm. If the width of the first reinforcement part is less than 0.2 mm, the bending force that the first reinforcement part can absorb is relatively small, and the strength of the gold finger structure cannot be further enhanced.

在某些实施方式中,所述连接端的长度为0.1mm-3mm。因为若连接端的长度太短会不利于金手指结构与待连接元件连接,若连接端太长容易产生较大弯矩而导致金手指结构折断,所以连接端的长度为0.1mm-3mm是合适的。In some embodiments, the length of the connecting end is 0.1mm-3mm. Because if the length of the connecting end is too short, it will not be conducive to the connection between the gold finger structure and the components to be connected, and if the connecting end is too long, it will easily generate a large bending moment and cause the gold finger structure to break, so the length of the connecting end is 0.1mm-3mm is suitable.

在某些实施方式中,所述第一曲线为波浪线,所述波浪周期为0.5mm-20mm;或/和In some embodiments, the first curve is a wavy line, and the wave period is 0.5mm-20mm; or/and

所述第二曲线为波浪线,所述波浪周期为0.5mm-20mm。由于波浪线的周期过小(也就是说波峰与波谷的数量太多)时,一方面,波浪线可以视为接近直线,就起不到减少应力的作用;另一方面,制造波浪周期较小的波浪线是比较困难的、并且成本也比较高。当波浪线的周期过大,则第一曲线(或第二曲线)在金手指结构上只形成一个弧状,金手指结构容易沿着第一曲线(或第二曲线)撕裂。The second curve is a wave line, and the wave period is 0.5mm-20mm. Since the period of the wavy line is too small (that is to say, the number of peaks and troughs is too large), on the one hand, the wavy line can be regarded as close to a straight line, so it cannot reduce the stress; on the other hand, the manufacturing wave period is small The wavy lines are more difficult and costly. When the period of the wavy line is too large, the first curve (or the second curve) only forms an arc on the gold finger structure, and the gold finger structure is easily torn along the first curve (or the second curve).

本发明实施方式的柔性电路板包括:The flexible circuit board of the embodiment of the present invention includes:

基板;和substrate; and

上述任意一项实施方式所述的金手指结构,所述金手指结构与所述本体连接。In the gold finger structure described in any one of the above-mentioned embodiments, the gold finger structure is connected to the body.

本发明实施方式的柔性电路板及金手指结构通过在金手指本体的两侧分别设置第一覆盖膜和第二覆盖膜,第一覆盖膜与固定端对应的边缘呈曲线,减小了金手指结构在第一覆盖膜与固定端对应的边缘产生的应力,第二覆盖膜与固定端对应的边缘也呈曲线,减小了金手指结构在第二覆盖膜与固定端对应的边缘产生的应力,从而提升了金手指结构的强度。In the flexible circuit board and golden finger structure according to the embodiment of the present invention, a first covering film and a second covering film are respectively arranged on both sides of the golden finger body, and the edge corresponding to the first covering film and the fixed end is curved, which reduces the number of golden fingers. The stress generated by the structure on the edge corresponding to the fixed end of the first cover film, and the edge corresponding to the fixed end of the second cover film is also curved, which reduces the stress generated by the golden finger structure on the edge corresponding to the second cover film and the fixed end , thereby enhancing the strength of the gold finger structure.

本发明的实施方式的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本发明的实施方式的实践了解到。Additional aspects and advantages of embodiments of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of embodiments of the invention.

附图说明Description of drawings

本发明的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解,其中:The above and/or additional aspects and advantages of the present invention will become apparent and comprehensible from the description of the embodiments in conjunction with the following drawings, wherein:

图1是本发明某些实施方式的金手指结构的平面示意图;1 is a schematic plan view of a golden finger structure in some embodiments of the present invention;

图2是本发明某些实施方式的金手指结构的剖视图;2 is a cross-sectional view of a gold finger structure in some embodiments of the present invention;

图3是本发明某些实施方式的金手指结构的平面示意图;3 is a schematic plan view of a gold finger structure in some embodiments of the present invention;

图4是本发明某些实施方式的金手指结构的平面示意图;4 is a schematic plan view of a gold finger structure in some embodiments of the present invention;

图5是本发明某些实施方式的金手指结构的平面示意图;5 is a schematic plan view of a gold finger structure in some embodiments of the present invention;

图6是本发明某些实施方式的金手指结构的剖视图;和6 is a cross-sectional view of a gold finger structure in some embodiments of the present invention; and

图7是本发明某些实施方式的金手指结构的平面示意图。Fig. 7 is a schematic plan view of a gold finger structure in some embodiments of the present invention.

主要元件符号说明:Description of main component symbols:

金手指结构100、金手指本体10、固定端11、连接端12、基体13、手指14、导通孔142、端部144、第一覆盖膜20、第一曲线22、第一增强部24、第二覆盖膜30、第二曲线32、第二增强部34。Gold finger structure 100, gold finger body 10, fixed end 11, connecting end 12, base body 13, finger 14, via hole 142, end portion 144, first covering film 20, first curve 22, first reinforcing part 24, The second covering film 30 , the second curved line 32 , and the second reinforcing part 34 .

具体实施方式detailed description

下面详细描述本发明的实施方式,所述实施方式的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的,仅用于解释本发明,而不能理解为对本发明的限制。Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

在本发明的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as limiting the invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

在本发明的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接或可以相互通讯;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明中的具体含义。In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected, or electrically connected, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction of two components relation. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

在本发明中,除非另有明确的规定和限定,第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触,也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且,第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方,或仅仅表示第一特征水平高度小于第二特征。In the present invention, unless otherwise clearly specified and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

下文的公开提供了许多不同的实施方式或例子用来实现本发明的不同结构。为了简化本发明的公开,下文中对特定例子的部件和设置进行描述。当然,它们仅仅为示例,并且目的不在于限制本发明。此外,本发明可以在不同例子中重复参考数字和/或参考字母,这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施方式和/或设置之间的关系。此外,本发明提供了的各种特定的工艺和材料的例子,但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, components and arrangements of specific examples are described below. Of course, they are only examples and are not intended to limit the invention. Furthermore, the present disclosure may repeat reference numerals and/or reference letters in different instances, such repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, various specific process and material examples are provided herein, but one of ordinary skill in the art may recognize the use of other processes and/or the use of other materials.

请参阅图1,本发明实施方式的金手指结构100用于柔性电路板(图未示),金手指结构100包括金手指本体10、第一覆盖膜20和第二覆盖膜30。金手指本体10包括固定端11和连接端12,固定端11与柔性电路板的基板(图未示)连接,连接端12用于与待连接元件(图未示)连接。第一覆盖膜20设置在固定端11的一表面上,第一覆盖膜20与固定端11对应的一边呈第一曲线22。第二覆盖膜30设置在固定端11上的与第一覆盖膜20相背的一表面上,第二覆盖膜30与固定端11对应的一边呈第二曲线32。Please refer to FIG. 1 , a gold finger structure 100 according to an embodiment of the present invention is used in a flexible circuit board (not shown), and the gold finger structure 100 includes a gold finger body 10 , a first cover film 20 and a second cover film 30 . The golden finger body 10 includes a fixed end 11 and a connecting end 12. The fixed end 11 is connected to the substrate (not shown) of the flexible circuit board, and the connecting end 12 is used to connect to the component to be connected (not shown). The first cover film 20 is disposed on a surface of the fixed end 11 , and a side of the first cover film 20 corresponding to the fixed end 11 forms a first curve 22 . The second cover film 30 is disposed on a surface of the fixed end 11 opposite to the first cover film 20 , and a side of the second cover film 30 corresponding to the fixed end 11 forms a second curve 32 .

请参阅图1-3,当第一覆盖膜20与固定端11对应的一边为直线时,第二覆盖膜30与固定端11对应的一边也为直线时,若金手指结构100在力的作用下发生弯曲,弯折力集中在第一覆盖膜20与固定端11对应的边缘处,弯折力还集中在第二覆盖膜30与固定端11对应的边缘处,也就是说,金手指结构100在第一覆盖膜20与固定端11对应的边缘会产生应力集中的现象,第二覆盖膜30与固定端11对应的边缘也会产生应力集中的现象,此时,金手指结构100容易沿着第一覆盖膜20与固定端11对应的边缘折断,也容易沿着第二覆盖膜30与固定端11对应的边缘折断。1-3, when the side of the first cover film 20 corresponding to the fixed end 11 is a straight line, and the side of the second cover film 30 corresponding to the fixed end 11 is also a straight line, if the gold finger structure 100 is under the action of force Bending occurs at the bottom, the bending force is concentrated on the edge corresponding to the fixed end 11 of the first cover film 20, and the bending force is also concentrated on the edge corresponding to the fixed end 11 of the second cover film 30, that is to say, the gold finger structure 100, stress concentration will occur at the edge corresponding to the fixed end 11 of the first covering film 20, and stress concentration will also occur at the edge corresponding to the fixed end 11 of the second covering film 30. At this time, the golden finger structure 100 is easy to When the edge of the first cover film 20 corresponding to the fixed end 11 is broken, it is also easy to break along the edge of the second cover film 30 corresponding to the fixed end 11 .

当第一覆盖膜20与固定端11对应的一边为曲线时,若金手指结构100在力的作用下沿第一覆盖膜20与固定端11对应的边缘处弯折,第一曲线22的波谷处的弯折力会沿着波谷向第一覆盖膜20扩散(或传递),第一曲线22的波峰处的弯折力会沿着波峰向金手指本体10的连接端12扩散(或传递),也就是说,金手指结构100在第一覆盖膜20与固定端11对应的边缘产生的应力集中显著降低,此时,金手指结构100不易沿着第一覆盖膜20与固定端11对应的边缘折断。当第二覆盖膜30与固定端11对应的一边为曲线时,若金手指结构100在力的作用下沿第二覆盖膜30与固定端11对应的边缘处弯折,第二曲线32的波谷处的弯折力会沿着波谷向第二覆盖膜30扩散(或传递),第二曲线32的波峰处的弯折力会沿着波峰向金手指本体10的连接端12扩散(或传递),也就是说,金手指结构100在第二覆盖膜30与固定端11对应的边缘产生的应力集中显著降低,此时,金手指结构100不易沿着第二覆盖膜30与固定端11对应的边缘折断。需要注意的是,本文中提到的波峰与波谷均是相对于待连接元件(或连接端12)而言,如图1所示,最接近待连接元件(或连接端12)的位置为波峰,最远离待连接元件(或连接端12)的位置为波谷。When the side of the first covering film 20 corresponding to the fixed end 11 is a curved line, if the gold finger structure 100 is bent along the edge corresponding to the first covering film 20 and the fixed end 11 under the action of force, the trough of the first curve 22 The bending force at the peak of the first curve 22 will diffuse (or transmit) along the trough to the first cover film 20, and the bending force at the crest of the first curve 22 will diffuse (or transmit) along the crest to the connecting end 12 of the gold finger body 10 That is to say, the stress concentration generated by the gold finger structure 100 on the edge corresponding to the first cover film 20 and the fixed end 11 is significantly reduced. At this time, the gold finger structure 100 is not easy to Edges snap off. When the side of the second covering film 30 corresponding to the fixed end 11 is a curved line, if the gold finger structure 100 is bent along the edge corresponding to the second covering film 30 and the fixed end 11 under the action of force, the trough of the second curve 32 The bending force at the peak of the second curve 32 will diffuse (or transmit) along the trough to the second cover film 30, and the bending force at the crest of the second curve 32 will diffuse (or transmit) along the crest to the connecting end 12 of the gold finger body 10 That is to say, the stress concentration generated by the golden finger structure 100 on the edge corresponding to the fixed end 11 of the second cover film 30 is significantly reduced. At this time, the gold finger structure 100 is not easy to Edges snap off. It should be noted that the crests and troughs mentioned in this article are relative to the components to be connected (or the connection end 12), as shown in Figure 1, the position closest to the components to be connected (or the connection end 12) is the peak , the position farthest from the element to be connected (or the connection end 12) is the valley.

本发明实施方式的金手指结构100通过在金手指本体10的两侧分别设置第一覆盖膜20和第二覆盖膜30,第一覆盖膜20与固定端11对应的边缘呈曲线,减小了金手指结构100在第一覆盖膜20与固定端11对应的边缘产生的应力,第二覆盖膜30与固定端11对应的边缘也呈曲线,减小了金手指结构100在第二覆盖膜30与固定端11对应的边缘产生的应力,从而提升了金手指结构100的强度。In the gold finger structure 100 according to the embodiment of the present invention, the first covering film 20 and the second covering film 30 are respectively arranged on both sides of the gold finger body 10, and the edge corresponding to the first covering film 20 and the fixed end 11 is curved, which reduces the The stress generated by the gold finger structure 100 on the edge corresponding to the fixed end 11 of the first cover film 20, and the edge corresponding to the fixed end 11 of the second cover film 30 is also curved, which reduces the pressure of the gold finger structure 100 on the second cover film 30. The stress generated by the edge corresponding to the fixed end 11 improves the strength of the golden finger structure 100 .

请参阅图1,本发明实施方式的金手指结构100用于柔性电路板,金手指结构100包括金手指本体10、第一覆盖膜20和第二覆盖膜30。Referring to FIG. 1 , a gold finger structure 100 according to an embodiment of the present invention is used for a flexible circuit board. The gold finger structure 100 includes a gold finger body 10 , a first cover film 20 and a second cover film 30 .

本发明实施方式的柔性电路板包括基板和与基板连接的金手指结构100。The flexible circuit board in the embodiment of the present invention includes a substrate and a gold finger structure 100 connected to the substrate.

请参阅图4,金手指本体10包括固定端11和连接端12,固定端11与基板连接,连接端12用于与待连接元件连接,待连接元件可以包括输入端口、输出端口、LED导光膜等。连接端12的长度L1可以为0.1mm-3mm,例如,连接端12的长度L1可以为:0.1mm、0.5mm、0.8mm、1mm、1.2mm、1.4mm、1.6mm、1.8mm、2mm、2.2mm、2.4mm、2.6mm、2.8mm、3mm中的任意一个。若连接端12的长度太短会不利于金手指结构100与待连接元件连接,若连接端12太长容易产生较大弯矩而导致金手指结构100折断。Please refer to Fig. 4, the gold finger body 10 includes a fixed end 11 and a connecting end 12, the fixed end 11 is connected to the substrate, and the connecting end 12 is used to connect with the components to be connected, the components to be connected may include input ports, output ports, LED light guides film etc. The length L1 of the connection end 12 can be 0.1mm-3mm, for example, the length L1 of the connection end 12 can be: 0.1mm, 0.5mm, 0.8mm, 1mm, 1.2mm, 1.4mm, 1.6mm, 1.8mm, 2mm, 2.2 Any one of mm, 2.4mm, 2.6mm, 2.8mm, 3mm. If the length of the connecting end 12 is too short, it will be unfavorable to connect the gold finger structure 100 with the components to be connected, and if the connecting end 12 is too long, a large bending moment may be generated and the gold finger structure 100 will be broken.

请参阅图4、图5及图6,金手指本体10包括基材13和多个手指14,多个手指14设置在基材13的相背两个侧面上,位于基材13两侧上的手指14一一对应(位置、形状及长度分别对应),位于基材13同一侧面上的多个手指14相互间隔设置,从而避免手指14连接在一起而导致电路短路。每个手指14基本呈矩形片状。每个手指14在连接端12处开设有导通孔142,位于基材13两侧对应的手指14上的导通孔142对应且相互连通,也就是说,导通孔142依次贯穿位于基材13一侧的手指14、基材13和位于基材13另一侧的手指14。导通孔142可呈圆形,位于导通孔142处的手指部分呈环形且外圆环的直径大于手指14的宽度。每个手指14在连接端12的端部144开设有连接口,连接口可呈半圆形,端部144可呈半圆环形,且半圆环的外圆的直径大于手指14的宽度。每个手指14在连接端12的端部144与基材13在连接端12的端部基本齐平且连接在一起。手指14包括铜箔、金箔、或铜箔表面镀金中的至少一种,使手指14具有较好的导电性及耐腐蚀性。基材13的材料包括聚酰亚胺薄膜(PolyimideFilm,PI)。Referring to Fig. 4, Fig. 5 and Fig. 6, the gold finger body 10 includes a base material 13 and a plurality of fingers 14, and the plurality of fingers 14 are arranged on two opposite sides of the base material 13, and the two sides on both sides of the base material 13 The fingers 14 correspond one to one (positions, shapes and lengths correspond respectively), and multiple fingers 14 located on the same side of the substrate 13 are spaced apart from each other, so as to prevent the fingers 14 from being connected together to cause a short circuit. Each finger 14 is substantially in the shape of a rectangular sheet. Each finger 14 is provided with a conduction hole 142 at the connecting end 12, and the conduction holes 142 on the corresponding fingers 14 on both sides of the base material 13 correspond to and communicate with each other, that is to say, the conduction holes 142 sequentially penetrate through the base material 14. Finger 14 on one side of 13, substrate 13 and finger 14 on the other side of substrate 13. The via hole 142 may be circular, and the portion of the finger located at the via hole 142 is circular, and the diameter of the outer ring is larger than the width of the finger 14 . Each finger 14 has a connection opening at the end 144 of the connection end 12 . The connection opening can be semicircular, and the end 144 can be semicircular. The end 144 of each finger 14 at the connecting end 12 is substantially flush with the end of the substrate 13 at the connecting end 12 and connected together. The finger 14 includes at least one of copper foil, gold foil, or gold-plated copper foil, so that the finger 14 has better electrical conductivity and corrosion resistance. The material of the substrate 13 includes polyimide film (PolyimideFilm, PI).

请参阅图4,第一覆盖膜20设置在固定端11一表面上,具体地,第一覆盖膜20覆盖固定端11一侧上的手指14的一端并露出连接端12一侧上的手指14的一端(也就是端部144),第一覆盖膜20与固定端11对应的一边呈第一曲线22。第一曲线22包括波峰和波谷,第一曲线22可为波浪线,波浪线的周期为0.5mm-20mm,例如,波浪线的周期可以为:0.5mm、0.8mm、1mm、1.2mm、1.4mm、1.6mm、1.8mm、2mm、2.2mm、2.4mm、5mm、10mm、15mm、20mm中的任意一个,优选的,波浪线的周期为1.2mm。Referring to Fig. 4, the first covering film 20 is arranged on one surface of the fixed end 11, specifically, the first covering film 20 covers one end of the finger 14 on the fixed end 11 side and exposes the finger 14 on the connecting end 12 side One end (that is, the end 144 ), the side of the first cover film 20 corresponding to the fixed end 11 forms a first curve 22 . The first curve 22 includes crests and troughs, the first curve 22 can be a wavy line, and the period of the wavy line is 0.5mm-20mm, for example, the period of the wavy line can be: 0.5mm, 0.8mm, 1mm, 1.2mm, 1.4mm , any one of 1.6mm, 1.8mm, 2mm, 2.2mm, 2.4mm, 5mm, 10mm, 15mm, 20mm, preferably, the period of the wavy line is 1.2mm.

请参阅图5-7,第二覆盖膜30设置在固定端11上的与第一覆盖膜20相背的一表面上,具体地,第二覆盖膜30也覆盖固定端11一侧上的手指14的一端并露出连接端12一侧上的手指14的一端(也就是端部144),第二覆盖膜30与固定端11对应的一边呈第二曲线32。第二曲线32包括波峰和波谷,第二曲线32可为波浪线,波浪线的周期为0.5mm-20mm,例如,波浪线的周期可以为0.5mm、0.8mm、1mm、1.2mm、1.4mm、1.6mm、1.8mm、2mm、2.2mm、2.4mm、5mm、10mm、15mm、20mm中的任意一个,优选的,波浪线的周期为1.2mm。5-7, the second covering film 30 is arranged on a surface opposite to the first covering film 20 on the fixed end 11, specifically, the second covering film 30 also covers the fingers on one side of the fixed end 11. 14 and exposes one end of the finger 14 (that is, the end 144 ) on the side of the connecting end 12 , and the side of the second cover film 30 corresponding to the fixed end 11 is in a second curve 32 . The second curve 32 includes crests and troughs, the second curve 32 can be a wavy line, the period of the wavy line is 0.5mm-20mm, for example, the period of the wavy line can be 0.5mm, 0.8mm, 1mm, 1.2mm, 1.4mm, Any one of 1.6mm, 1.8mm, 2mm, 2.2mm, 2.4mm, 5mm, 10mm, 15mm, 20mm, preferably, the period of the wavy line is 1.2mm.

具体地,若波浪线的周期过小(也就是说波峰与波谷的数量太多),则波浪线可以视为接近直线,就起不到减少应力的作用。波浪线的周期过大,则第一曲线22(或第二曲线32)在金手指结构100上只形成一个弧状,金手指结构100容易沿着第一曲线22(或第二曲线32)撕裂。波浪线的周期受到用于制造(切割)波浪线的刀具的影响,通常来讲,制造波浪周期较小的波浪线是比较困难的、并且成本也比较高。由于金手指结构100一般包括两个以上手指14,优选为六个手指14,且金手指结构100的宽度W1一般在5mm-6mm之间,当波浪线的周期为1.2mm时,因此,金手指结构100至少会有两个波峰与波谷使得金手指结构100的强度得以增加,而且波峰与波谷的数量又不会太多,不会增加加工难度。Specifically, if the period of the wavy line is too small (that is, the number of crests and troughs is too large), the wavy line can be regarded as close to a straight line, and the effect of reducing stress cannot be achieved. If the period of the wavy line is too large, the first curve 22 (or the second curve 32) will only form an arc on the gold finger structure 100, and the gold finger structure 100 will be easily torn along the first curve 22 (or the second curve 32). . The period of the wavy line is affected by the tool used to manufacture (cut) the wavy line. Generally speaking, it is difficult and expensive to manufacture a wavy line with a small wave period. Since the gold finger structure 100 generally includes more than two fingers 14, preferably six fingers 14, and the width W1 of the gold finger structure 100 is generally between 5 mm and 6 mm, when the period of the wavy line is 1.2 mm, the gold finger The structure 100 has at least two crests and troughs so that the strength of the gold finger structure 100 can be increased, and the number of crests and troughs will not be too many, which will not increase the processing difficulty.

请参阅图1-3,当第一覆盖膜20与固定端11对应的一边为直线时,第二覆盖膜30与固定端11对应的一边也为直线时,若金手指结构100在力的作用下发生弯曲,弯折力集中在第一覆盖膜20与固定端11对应的边缘处,弯折力还集中在第二覆盖膜30与固定端11对应的边缘处,也就是说,金手指结构100在第一覆盖膜20与固定端11对应的边缘会产生应力集中的现象,第二覆盖膜30与固定端11对应的边缘也会产生应力集中的现象,此时,金手指结构100容易沿着第一覆盖膜20与固定端11对应的边缘折断,也容易沿着第二覆盖膜30与固定端11对应的边缘折断。1-3, when the side of the first cover film 20 corresponding to the fixed end 11 is a straight line, and the side of the second cover film 30 corresponding to the fixed end 11 is also a straight line, if the gold finger structure 100 is under the action of force Bending occurs at the bottom, the bending force is concentrated on the edge corresponding to the fixed end 11 of the first cover film 20, and the bending force is also concentrated on the edge corresponding to the fixed end 11 of the second cover film 30, that is to say, the gold finger structure 100, stress concentration will occur at the edge corresponding to the fixed end 11 of the first covering film 20, and stress concentration will also occur at the edge corresponding to the fixed end 11 of the second covering film 30. At this time, the golden finger structure 100 is easy to When the edge of the first cover film 20 corresponding to the fixed end 11 is broken, it is also easy to break along the edge of the second cover film 30 corresponding to the fixed end 11 .

当第一覆盖膜20与固定端11对应的一边为曲线时,若金手指结构100在力的作用下沿第一覆盖膜20与固定端11对应的边缘处弯折,第一曲线22的波谷处的弯折力会沿着波谷向第一覆盖膜20扩散(或传递),第一曲线22的波峰处的弯折力会沿着波峰向金手指本体10的连接端12扩散(或传递),也就是说,金手指结构100在第一覆盖膜20与固定端11对应的边缘产生的应力集中显著降低,此时,金手指结构100不易沿着第一覆盖膜20与固定端11对应的边缘折断。当第二覆盖膜30与固定端11对应的一边为曲线时,若金手指结构100在力的作用下沿第二覆盖膜30与固定端11对应的边缘处弯折,第二曲线32的波谷处的弯折力会沿着波谷向第二覆盖膜30扩散(或传递),第二曲线32的波峰处的弯折力会沿着波峰向金手指本体10的连接端12扩散(或传递),也就是说,金手指结构100在第二覆盖膜30与固定端11对应的边缘产生的应力集中显著降低,此时,金手指结构100不易沿着第二覆盖膜30与固定端11对应的边缘折断。When the side of the first covering film 20 corresponding to the fixed end 11 is a curved line, if the gold finger structure 100 is bent along the edge corresponding to the first covering film 20 and the fixed end 11 under the action of force, the trough of the first curve 22 The bending force at the peak of the first curve 22 will diffuse (or transmit) along the trough to the first cover film 20, and the bending force at the crest of the first curve 22 will diffuse (or transmit) along the crest to the connecting end 12 of the gold finger body 10 That is to say, the stress concentration generated by the gold finger structure 100 on the edge corresponding to the first cover film 20 and the fixed end 11 is significantly reduced. At this time, the gold finger structure 100 is not easy to Edges snap off. When the side of the second covering film 30 corresponding to the fixed end 11 is a curved line, if the gold finger structure 100 is bent along the edge corresponding to the second covering film 30 and the fixed end 11 under the action of force, the trough of the second curve 32 The bending force at the peak of the second curve 32 will diffuse (or transmit) along the trough to the second cover film 30, and the bending force at the crest of the second curve 32 will diffuse (or transmit) along the crest to the connecting end 12 of the gold finger body 10 That is to say, the stress concentration generated by the golden finger structure 100 on the edge corresponding to the fixed end 11 of the second cover film 30 is significantly reduced. At this time, the gold finger structure 100 is not easy to Edges snap off.

本发明实施方式的金手指结构100通过在金手指本体10的两侧分别设置第一覆盖膜20和第二覆盖膜30,第一覆盖膜20与固定端11对应的边缘呈曲线,减小了金手指结构100在第一覆盖膜20与固定端11对应的边缘产生的应力,第二覆盖膜30与固定端11对应的边缘也呈曲线,减小了金手指结构100在第二覆盖膜30与固定端11对应的边缘产生的应力,从而提升了金手指结构100的强度。In the gold finger structure 100 according to the embodiment of the present invention, the first covering film 20 and the second covering film 30 are respectively arranged on both sides of the gold finger body 10, and the edge corresponding to the first covering film 20 and the fixed end 11 is curved, which reduces the The stress generated by the gold finger structure 100 on the edge corresponding to the fixed end 11 of the first cover film 20, and the edge corresponding to the fixed end 11 of the second cover film 30 is also curved, which reduces the pressure of the gold finger structure 100 on the second cover film 30. The stress generated by the edge corresponding to the fixed end 11 improves the strength of the golden finger structure 100 .

本发明实施方式的金手指结构100还具有以下有益效果:第一,当手指14与待连接元件连接时,手指14上的焊接材料(例如,焊锡)能够流入导通孔142使焊接材料与手指14的接触面积更大,从而使手指14的连接效果较好。同时导通孔142呈圆形,且位于导通孔142处的手指部分呈环形且外圆环的直径大于手指14的宽度,从而能够减小手指14在导通孔142处产生应力,进而提升手指14的强度。The gold finger structure 100 of the embodiment of the present invention also has the following beneficial effects: first, when the finger 14 is connected to the component to be connected, the soldering material (for example, solder) on the finger 14 can flow into the via hole 142 to make the soldering material and the finger 14 has a larger contact area, so that the connection effect of the fingers 14 is better. Simultaneously, the conduction hole 142 is circular, and the finger part at the conduction hole 142 is annular and the diameter of the outer ring is greater than the width of the finger 14, thereby reducing the stress generated by the finger 14 at the conduction hole 142, thereby improving Finger 14 Strength.

第二,手指14的端部144设置开口,开口为半圆形孔,当手指14与待连接元件焊接时,焊接材料(例如,焊锡)能够扩散至开口内,使手指14与待连接元件能够更好地连接。Second, the end 144 of the finger 14 is provided with an opening, and the opening is a semicircular hole. When the finger 14 is welded with the component to be connected, the welding material (for example, solder) can diffuse into the opening, so that the finger 14 and the component to be connected can be connected. Connect better.

在某些实施方式中,上述实施方式的基材13同一侧面上的相邻的两个手指14的导通孔142的位置不同,也就是说,相邻的两个导通孔142的中心到端部144的距离D1不相同。相邻的两个手指14的导通孔142的位置不同,也就是说,多个导通孔142的中心不在同一直线上,由于手指14在开设有导通孔142处的强度小于手指14的其他位置上的强度,因而能够避免金手指结构100沿着多个导通孔142的中心连线折断。In some embodiments, the positions of the via holes 142 of two adjacent fingers 14 on the same side of the base material 13 in the above embodiment are different, that is, the centers of the two adjacent via holes 142 to The distance D1 of the ends 144 is different. The positions of the conducting holes 142 of two adjacent fingers 14 are different, that is to say, the centers of a plurality of conducting holes 142 are not on the same straight line. The strength at other positions can prevent the golden finger structure 100 from being broken along the central connection line of the plurality of via holes 142 .

在其他实施方式中,在朝向所述金手指本体10的投影中,上述实施方式的第一曲线22的波峰与第二曲线32的波峰错开,第一曲线22的波谷与第二曲线32的波谷错开,从而能够进一步减小金手指结构100在第一覆盖膜20与固定端11对应的边缘产生的应力,及进一步减小金手指结构100在第二覆盖膜30与固定端11对应的边缘产生的应力,进而避免金手指结构100容易沿着第一曲线22与固定端11对应的边缘折断,或/和沿着第二曲线32与固定端11对应的边缘折断。具体地,第一曲线22的波峰在朝向所述金手指本体10的投影的波峰可以与第二曲线32的波谷在朝向所述金手指本体10的投影的波谷完全相对;或者,第一曲线22的波峰在朝向所述金手指本体10的投影的波峰的一部分与第二曲线32的波谷在朝向所述金手指本体10的投影的波峰对应,另一部分与第二曲线32的波谷在朝向所述金手指本体10的投影的波谷对应。In other embodiments, in the projection toward the golden finger body 10, the peaks of the first curve 22 and the peaks of the second curve 32 in the above embodiment are staggered, and the troughs of the first curve 22 and the troughs of the second curve 32 are Staggering, so as to further reduce the stress generated by the golden finger structure 100 on the edge corresponding to the fixed end 11 of the first covering film 20, and further reduce the stress generated by the golden finger structure 100 on the edge corresponding to the fixed end 11 of the second covering film 30 stress, so as to prevent the gold finger structure 100 from easily breaking along the edge corresponding to the fixed end 11 of the first curve 22 , or/and breaking along the edge corresponding to the fixed end 11 along the second curve 32 . Specifically, the peak of the first curve 22 projected toward the gold finger body 10 may be completely opposite to the trough of the second curve 32 projected toward the gold finger body 10; or, the first curve 22 A part of the peak of the projection of the crest toward the golden finger body 10 corresponds to the peak of the projection of the trough of the second curve 32 toward the golden finger body 10, and the other part corresponds to the trough of the second curve 32 toward the crest of the projection of the golden finger body 10. The trough of the projection of the golden finger body 10 corresponds.

请参阅图1及图6,在某些实施方式中,在朝向所述金手指本体10的投影面中,上述实施方式的第一曲线22的波峰与第二曲线32的波峰错开,第一曲线22的波谷与第二曲线32的波谷错开,且上述实施方式的第二覆盖膜30在金手指本体10上的正投影完全覆盖第一覆盖膜20在金手指本体10上的正投影,从而能够进一步减小金手指结构100在第一覆盖膜20与固定端11对应的边缘产生的应力,及进一步减小金手指结构100在第二覆盖膜30与固定端11对应的边缘产生的应力,进而避免金手指结构100容易沿着第一曲线22与固定端11对应的边缘折断,或/和沿着第二曲线32与固定端11对应的边缘折断。当然,在其他实施方式中,第一覆盖膜20在金手指本体10上的正投影可完全覆盖第二覆盖膜30在金手指本体10上的正投影。Please refer to Fig. 1 and Fig. 6, in some embodiments, in the projected plane toward the gold finger body 10, the peak of the first curve 22 and the peak of the second curve 32 in the above embodiment are staggered, the first curve 22 and the trough of the second curve 32 are staggered, and the orthographic projection of the second cover film 30 in the above embodiment on the gold finger body 10 completely covers the orthographic projection of the first cover film 20 on the gold finger body 10, so that Further reduce the stress generated by the gold finger structure 100 on the edge corresponding to the fixed end 11 of the first cover film 20, and further reduce the stress generated by the gold finger structure 100 on the edge corresponding to the fixed end 11 of the second cover film 30, and then Avoid breaking the golden finger structure 100 easily along the edge of the first curve 22 corresponding to the fixed end 11 , or/and along the edge of the second curve 32 corresponding to the fixed end 11 . Certainly, in other implementation manners, the orthographic projection of the first covering film 20 on the golden finger body 10 may completely cover the orthographic projection of the second covering film 30 on the golden finger body 10 .

在某些实施方式中,在朝向所述金手指本体10的投影中,上述实施方式的第一曲线22的波峰与第二曲线32的波峰错开,第一曲线22的波谷与第二曲线32的波谷错开,且上述实施方式的第一覆盖膜20与固定端11对应的一边在金手指本体10上的正投影,和第二覆盖膜30与固定端11对应的一边在金手指本体10上的正投影相交,从而能够进一步减小金手指结构100在第一覆盖膜20与固定端11对应的边缘产生的应力,及进一步减小金手指结构100在第二覆盖膜30与固定端11对应的边缘产生的应力,进而避免金手指结构100容易沿着第一曲线22与固定端11对应的边缘折断,或/和沿着第二曲线32与固定端11对应的边缘折断。In some embodiments, in the projection toward the gold finger body 10, the peak of the first curve 22 and the peak of the second curve 32 in the above embodiment are staggered, and the trough of the first curve 22 is different from the peak of the second curve 32. The troughs are staggered, and the orthographic projection of the side of the first cover film 20 in the above embodiment corresponding to the fixed end 11 on the gold finger body 10 is the same as the orthographic projection of the side of the second cover film 30 corresponding to the fixed end 11 on the gold finger body 10 Orthographic projections intersect, so as to further reduce the stress generated by the golden finger structure 100 on the edge corresponding to the first covering film 20 and the fixed end 11, and further reduce the stress of the golden finger structure 100 on the second covering film 30 corresponding to the fixed end 11. The stress generated by the edge can prevent the golden finger structure 100 from easily breaking along the edge corresponding to the fixed end 11 along the first curve 22 , or/and the edge corresponding to the fixed end 11 along the second curve 32 .

请参阅图1,在某些实施方式中,在朝向所述金手指本体10的投影中,上述实施方式的第一曲线22的波峰与第二曲线32的波峰错开,第一曲线22的波谷与第二曲线32的波谷错开,且上述实施方式的第一曲线22的波峰与第二曲线32的波谷间隔相对,第一曲线22的波谷与第二曲线32的波峰间隔相对,从而能够进一步减小金手指结构100在第一覆盖膜20与固定端11对应的边缘产生的应力,及在第二覆盖膜30与固定端11对应的边缘产生的应力,进而避免金手指结构100容易沿着第一曲线22与固定端11对应的边缘折断,或/和沿着第二曲线32与固定端11对应的边缘折断。此处的间隔相对是指:第一曲线22的波峰在朝向所述金手指本体10的投影与第二曲线32的波谷在朝向所述金手指本体10的投影是间隔相对的。Please refer to FIG. 1 , in some embodiments, in the projection toward the gold finger body 10, the peak of the first curve 22 and the peak of the second curve 32 in the above embodiment are staggered, and the trough of the first curve 22 and the peak of the second curve 32 are staggered. The troughs of the second curve 32 are staggered, and the peaks of the first curve 22 in the above-mentioned embodiment are opposite to the troughs of the second curve 32, and the troughs of the first curve 22 are opposite to the peaks of the second curve 32, so that it can be further reduced The stress generated by the gold finger structure 100 on the edge corresponding to the fixed end 11 of the first covering film 20 and the stress generated on the edge corresponding to the fixed end 11 of the second covering film 30, thereby preventing the gold finger structure 100 from easily moving along the first The edge corresponding to the fixed end 11 of the curve 22 is broken off, or/and the edge corresponding to the fixed end 11 along the second curve 32 is broken off. Here, the relative interval means that the projection of the crest of the first curve 22 toward the golden finger body 10 and the projection of the trough of the second curve 32 toward the golden finger body 10 are opposite at intervals.

请参阅图4,在某些实施方式中,上述实施方式的第一覆盖膜20包括自第一曲线22的两端沿从固定端11至连接端12的方向延伸的第一增强部24,第一增强部24位于金手指本体10的两侧边缘。当金手指结构100在力的作用下发生弯曲时,第一增强部24能够吸收部分弯折力,从而增强了金手指结构100的强度。在某些实施方式中,第一增强部24的宽度W2大于或等于0.2mm。若第一增强部24的宽度W2小于0.2mm,会导致第一增强部24能够吸收的弯折力较小,起不到进一步增强金手指结构100的强度的作用。Please refer to FIG. 4 , in some embodiments, the first covering film 20 of the above embodiment includes a first reinforcing portion 24 extending from both ends of the first curve 22 along the direction from the fixed end 11 to the connecting end 12 , A reinforcing portion 24 is located on two side edges of the golden finger body 10 . When the gold finger structure 100 is bent under the action of force, the first reinforcement part 24 can absorb part of the bending force, thereby enhancing the strength of the gold finger structure 100 . In some embodiments, the width W2 of the first reinforcing portion 24 is greater than or equal to 0.2 mm. If the width W2 of the first reinforcement part 24 is less than 0.2 mm, the bending force that the first reinforcement part 24 can absorb is small, and the strength of the golden finger structure 100 cannot be further enhanced.

请参阅图7,在某些实施方式中,上述实施方式的第二覆盖膜30包括自第二曲线32的两端沿从固定端11至连接端12的方向延伸的第二增强部34,第二增强部34位于金手指本体10的两侧边缘。当金手指结构100在力的作用下发生弯曲时,第二增强部34能够吸收部分弯折力,从而增强了金手指结构100的强度。在某些实施方式中,第二增强部34的宽度W3大于或等于0.2mm。若第二增强部34的宽度W3小于0.2mm,会导致第二增强部34能够吸收的弯折力较小,起不到进一步增强金手指结构100的强度的作用。Please refer to FIG. 7 , in some embodiments, the second cover film 30 of the above embodiment includes a second reinforcing portion 34 extending from both ends of the second curve 32 along the direction from the fixed end 11 to the connecting end 12 , The two reinforcing parts 34 are located on two side edges of the golden finger body 10 . When the gold finger structure 100 is bent under the action of force, the second reinforcement part 34 can absorb part of the bending force, thereby enhancing the strength of the gold finger structure 100 . In some embodiments, the width W3 of the second reinforcement portion 34 is greater than or equal to 0.2 mm. If the width W3 of the second reinforcement part 34 is less than 0.2 mm, the bending force that the second reinforcement part 34 can absorb is relatively small, and the strength of the golden finger structure 100 cannot be further enhanced.

请参阅图1,在某些实施方式中,上述实施方式的第一覆盖膜20包括自第一曲线22的两端沿从固定端11至连接端12的方向延伸的第一增强部24,第一增强部24位于金手指本体10的两侧边缘,且上述实施方式的第二覆盖膜30包括自第二曲线32的两端沿从固定端11至连接端12的方向延伸的第二增强部34,第二增强部34位于金手指本体10的两侧边缘。当金手指结构100在力的作用下发生弯曲时,第一增强部24及第二增强部34均能够吸收部分弯折力,从而进一步增强了金手指结构100的强度。在某些实施方式中,第一增强部24的宽度W2大于或等于0.2mm,第二增强部34的宽度W3大于或等于0.2mm。若第一增强部24的宽度W2和第二增强部34的宽度W3小于0.2mm,会导致第一增强部24及第二增强部34能够吸收的弯折力较小,则起不到进一步增强金手指结构100的强度的作用。Please refer to FIG. 1 , in some embodiments, the first covering film 20 of the above embodiment includes a first reinforcing portion 24 extending from both ends of the first curve 22 along the direction from the fixed end 11 to the connecting end 12 , A reinforced part 24 is located on both sides of the gold finger body 10, and the second cover film 30 of the above embodiment includes a second reinforced part extending from both ends of the second curve 32 in the direction from the fixed end 11 to the connecting end 12 34 . The second reinforcing portion 34 is located on both side edges of the golden finger body 10 . When the gold finger structure 100 is bent under the action of force, both the first reinforcement part 24 and the second reinforcement part 34 can absorb part of the bending force, thereby further enhancing the strength of the gold finger structure 100 . In some embodiments, the width W2 of the first reinforcement part 24 is greater than or equal to 0.2 mm, and the width W3 of the second reinforcement part 34 is greater than or equal to 0.2 mm. If the width W2 of the first reinforcement part 24 and the width W3 of the second reinforcement part 34 are less than 0.2mm, the bending force that the first reinforcement part 24 and the second reinforcement part 34 can absorb will be small, and no further reinforcement will be achieved. The effect of the strength of the gold finger structure 100 .

具体地,本发明实施方式可以只满足上述其中一个实施方式或同时满足上述多个实施方式,也就是说,上述一个或多个实施方式组合而成的实施方式也属于本发明实施方式的保护范围。Specifically, the embodiments of the present invention may only satisfy one of the above-mentioned embodiments or satisfy multiple of the above-mentioned embodiments at the same time, that is to say, an embodiment formed by combining one or more of the above-mentioned embodiments also belongs to the protection scope of the embodiments of the present invention. .

在本说明书的描述中,参考术语“某些实施方式”、“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施方式或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。In the description of this specification, reference is made to the terms "certain embodiments," "one embodiment," "some embodiments," "exemplary embodiments," "examples," "specific examples," or "some examples," etc. The description means that a specific feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个所述特征。在本发明的描述中,“多个”的含义是至少两个,例如两个,三个等,除非另有明确具体的限定。In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of said features. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

尽管上面已经示出和描述了本发明的实施方式,可以理解的是,上述实施方式是示例性的,不能理解为对本发明的限制,本领域的普通技术人员在本发明的范围内可以对上述实施方式进行变化、修改、替换和变型,本发明的范围由权利要求及其等同物限定。Although the embodiment of the present invention has been shown and described above, it can be understood that the above embodiment is exemplary and should not be construed as a limitation of the present invention, and those skilled in the art can make the above-mentioned The embodiments are subject to changes, modifications, substitutions and variations, the scope of the present invention is defined by the claims and their equivalents.

Claims (12)

1. a kind of golden finger structure, for flexible PCB, it is characterised in that the golden finger structure includes:
Golden finger body, the golden finger body includes fixing end and connection end, and the fixing end connects with the flexible PCB Connect, the connection end is used to be connected with element to be connected;
First cover layer, first cover layer is arranged on a surface of the fixing end, first cover layer with it is described The corresponding one side of fixing end is in the first curve;With
Second cover layer, second cover layer is arranged on the surface opposite with first cover layer in the fixing end On, second cover layer one side corresponding with the fixing end is in the second curve.
2. golden finger structure according to claim 1, it is characterised in that first curve includes crest and trough, institute Stating the second curve includes crest and trough, in the projection towards the golden finger body, the crest of first curve and institute The crest for stating the second curve staggers, and the trough of the trough of first curve and second curve staggers.
3. golden finger structure according to claim 2, it is characterised in that first cover layer is in the golden finger body On orthographic projection orthographic projection of second cover layer on the golden finger body is completely covered;Or
First cover layer is completely covered in the golden hand in orthographic projection of second cover layer on the golden finger body Refer to the orthographic projection on body;Or
Orthographic projection of first cover layer one side corresponding with the fixing end on the golden finger body, and described second Orthographic projection of the cover layer one side corresponding with the fixing end on the golden finger body is intersected;Or
The crest of first curve is relative with the trough interval of second curve, the trough of first curve and described the The peak separation of two curves is relative.
4. golden finger structure according to claim 1, it is characterised in that the golden finger body includes base material and multiple hands Refer to, the multiple finger is arranged on opposite two sides of the base material, multiple hands on the base material same side Refer to spaced set.
5. golden finger structure according to claim 4, it is characterised in that each finger is opened up at the connection end There is via hole, the position of the via hole of adjacent two finger on the base material same side is different.
6. golden finger structure according to claim 4, it is characterised in that each end of the finger at the connection end Portion offers semi-circular hole.
7. golden finger structure according to claim 4, it is characterised in that the finger includes copper foil, goldleaf or copper foil table Face is at least one of gold-plated.
8. golden finger structure according to claim 1, it is characterised in that first cover layer includes bent from described first The two ends of line are located at institute along the first enhanced portion extended from the fixing end to the direction of the connection end, first enhanced portion State the both sides of the edge of golden finger body;Or/and
Second cover layer includes from the fixing end to the direction of the connection end prolonging from the two ends edge of second curve The second enhanced portion stretched, second enhanced portion is located at the both sides of the edge of the golden finger body.
9. golden finger structure according to claim 8, it is characterised in that first enhanced portion or/and second increasing The width in strong portion is more than or equal to 0.2mm.
10. golden finger structure according to claim 1, it is characterised in that the length of the connection end is 0.1mm-3mm.
11. golden finger structure according to claim 1, it is characterised in that first curve is wave, the wave Cycle is 0.5mm-20mm;Or/and
Second curve is wave, and the wave period is 0.5mm-20mm.
12. a kind of flexible PCB, it is characterised in that including:
Substrate;With
Golden finger structure described in claim 1-11 any one, the golden finger structure is connected with the body.
CN201710433374.6A 2017-06-09 2017-06-09 Gold finger structure and flexible circuit board Pending CN107148141A (en)

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CN110602868A (en) * 2019-08-16 2019-12-20 武汉光迅信息技术有限公司 Flexible circuit board and corresponding optical module
TWI722625B (en) * 2019-10-28 2021-03-21 健鼎科技股份有限公司 Gold finger structure and manufacturing method thereof
CN113873751A (en) * 2020-06-30 2021-12-31 广东美的厨房电器制造有限公司 Circuit board structure and household appliance

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CN104968139A (en) * 2015-06-03 2015-10-07 昆山国显光电有限公司 FPC bonding structure
CN106211569A (en) * 2016-09-06 2016-12-07 京东方科技集团股份有限公司 A kind of backlight golden finger structure and display device
CN206948710U (en) * 2017-06-09 2018-01-30 苏州欧菲光科技有限公司 Golden finger structure and flexible PCB

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US5917149A (en) * 1997-05-15 1999-06-29 Daimlerchrysler Corporation Flexible circuit board interconnect with strain relief
CN104968139A (en) * 2015-06-03 2015-10-07 昆山国显光电有限公司 FPC bonding structure
CN104955270A (en) * 2015-06-22 2015-09-30 安徽方兴科技股份有限公司 Flexible printed circuit (FPC) board
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CN110602868A (en) * 2019-08-16 2019-12-20 武汉光迅信息技术有限公司 Flexible circuit board and corresponding optical module
TWI722625B (en) * 2019-10-28 2021-03-21 健鼎科技股份有限公司 Gold finger structure and manufacturing method thereof
CN113873751A (en) * 2020-06-30 2021-12-31 广东美的厨房电器制造有限公司 Circuit board structure and household appliance

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