CN107145265A - Contact panel and display device - Google Patents
Contact panel and display device Download PDFInfo
- Publication number
- CN107145265A CN107145265A CN201710425857.1A CN201710425857A CN107145265A CN 107145265 A CN107145265 A CN 107145265A CN 201710425857 A CN201710425857 A CN 201710425857A CN 107145265 A CN107145265 A CN 107145265A
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- Prior art keywords
- electrode
- substrate
- contact panel
- conducting
- lead wire
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- 239000000758 substrate Substances 0.000 claims abstract description 117
- 239000003292 glue Substances 0.000 claims abstract description 12
- 238000010030 laminating Methods 0.000 claims abstract description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 66
- 239000004568 cement Substances 0.000 claims description 12
- 230000003287 optical effect Effects 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 230000005611 electricity Effects 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000003754 machining Methods 0.000 abstract description 11
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000012528 membrane Substances 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 238000003486 chemical etching Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a kind of contact panel, the contact panel includes first substrate, second substrate, first electrode, second electrode, conducting end and conducting resinl, the first substrate is relative with the second substrate to be stacked, the first electrode and the conducting end are located at the surface that the first substrate faces the second substrate, the conducting end is located at the both sides of the first electrode, the second electrode is located at the surface that the second substrate faces the first substrate, the first electrode is relative with the second electrode to form capacitance structure, conducting end described in the conductive glue laminating and the second electrode, the conducting resinl electrically connects the conducting end and the second electrode.The present invention also disclosed a kind of display device.The requirement on machining accuracy to first substrate and second substrate is reduced, product yield is improved, and greatly reduce production cost.
Description
Technical field
The present invention relates to display technology field, more particularly, to a kind of contact panel and display device.
Background technology
With the development of science and technology, the touch technology of display screen has also obtained development at full speed, and touch-screen is extensive
Applied in the electronic equipments such as mobile phone, computer, e-book, tablet personal computer, it has also become essential part in people's life.With
It is various can the numerous and confused of display device of touch-control emerge, consumer is to touching the requirements of each side such as the attractive in appearance of screen, performance
More and more higher.Capacitive touch screen is a kind of touch-control structure for being widely used in display device, the condenser type of external hanging type structure
Touch-screen is mainly GF (Glass-Film) structures or GFF (Glass-Film-Film) structure, i.e. glass cover-plate-membrane electrode
Structure or glass cover-plate-membrane electrode-membrane electrode structure, and membrane electrode need with positioned at contact panel one end
Flexible PCB (Flexible Printed Circuit, FPC) is bound, so as to realize other electronic devices with display device
Electrical connection.
In the prior art, the center section of contact panel is viewing area, and the edge of viewing area passes through opaque gold
Category lead by membrane electrode with the top of the contact panel or the flexible PCB binding of bottom is connected, realize flexible PCB and
The electrical connection of membrane electrode, then by flexible PCB around rolling over and be connected on mainboard.The touch-screen of GFF structures is needed in two layers of thin
Double-layer filmses electrode is combined again after each self-forming metal lead wire in edge of membrane electrode and flexible PCB is tied to, in order to ensure
Double layer of metal lead mutually staggers after double-layer filmses electrode combination, to the pitch requirements of the metal lead wire of each layer film electrode edge
Height, the requirement on machining accuracy of metal lead wire is strict, and production cost is substantially increased to improve product yield.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of contact panel and display device, to solve in the prior art
The requirement on machining accuracy of metal lead wire is strict, the problem of substantially increasing production cost to improve product yield.
In order to solve the above technical problems, the present invention provides a kind of contact panel, the contact panel includes first substrate, the
Two substrates, first electrode, second electrode, conducting end and conducting resinl, first substrate stacking relative with the second substrate are set
Put, the first electrode and the conducting end are located at the surface that the first substrate faces the second substrate, the conduction
End is located at the table that the second substrate faces the first substrate positioned at the both sides of the first electrode, the second electrode
Face, the first electrode is relative with the second electrode to form capacitance structure, conducting end described in the conductive glue laminating with it is described
Second electrode, the conducting resinl electrically connects the conducting end and the second electrode.In this way, because conducting resinl electrically connects conducting end
With second electrode, first electrode and conducting end are located on first substrate, therefore can will connect conducting end and flexible PCB
Conductive lead wire is formed at first substrate, and the conductive lead wire of connection first electrode and flexible PCB is also formed in first substrate,
The conductive lead wire of first electrode will be connected and the conductive lead wire of connection second electrode is all disposed within the same surface of first substrate
On, therefore need not consider that the position of two kinds of conductive lead wires is staggered during first substrate assembling relative with second substrate and wait smart
Degree problem, reduces the requirement on machining accuracy to first substrate and second substrate, improves product yield, and greatly reduce
Production cost.
Further, the surface of the first substrate is additionally provided with the first binding point, the second binding point, the first conductive lead wire and
Two conductive lead wires, first binding point and second binding point are used to electrically connect flexible PCB, and first conduction is drawn
Line electrically connects the first electrode and first binding point, so that the first electrode is electrically connected to the flexible circuit
Plate, second conductive lead wire electrically connects second binding point and the conducting end, so that the second electrode is electrically connected
To the flexible PCB.In this way, conducting end, the first conductive lead wire, the second conductive lead wire, the first binding point and the second binding point
First substrate is may be contained within, the first conductive lead wire can be controlled during the first conductive lead wire and the second conductive lead wire is formed
With the relative position of the second conductive lead wire, without first substrate it is relative with second substrate assembling during consider further that first leads
The position of electrical lead and the second conductive lead wire is mutually staggered equally accurate problem, reduces the processing to first substrate and second substrate
Required precision.
Further, the quantity of the second electrode is multiple, and the second electrode includes relative first end and second
End, the second electrode electrically connects the conducting resinl by one of the first end and described the second end.In this way, can keep away
Exempt from the second conductive lead wire and concentrate on the side of contact panel to cause the wide situation of a side frame to occur.
Further, the conducting resinl is located between the conducting end and the second electrode, described in the conductive glue laminating
Second electrode faces a side surface of the conducting end.So with the width dimensions by contact panel is reduced, it is to avoid frame is excessive,
Increase visible area area, improve screen accounting.
Further, each conductive multiple second electrodes of gemel connection.Processing procedure can be so simplified, life is reduced
Produce cost.
Further, the conducting resinl is anisotropic conductive adhesive paste.Because anisotropic conductive adhesive paste is not only led in longitudinal conduction lateral
Lead to, therefore be not turned between multiple second electrodes by same conductive gemel connection, realize that second electrode is electrically connected to flexibility
While circuit board, it is to avoid the electrical connection between second electrode.
Further, each conducting resinl correspondence one second electrode of connection.Can so ensure second electrode it
Between mutually insulated, be independent of each other, and conducting resinl can select common conducting resinl, reduce the cost of contact panel.
Further, the conducting resinl is located between the conducting end and the second substrate, and the first end includes a left side
Sideways, the second end includes right flank, and the left surface and right flank connect the second electrode and face first base
The surface of plate faces the surface of the second substrate, left surface and right side described in the conductive glue laminating with the second electrode
Face.In this way, due to conducting resinl be located between conducting end and second substrate, reduce between first substrate and second substrate away from
From reducing the thickness of contact panel, be conducive to the lightening design of contact panel and display device.
Further, the contact panel also includes optical cement, and the optical cement is located at the first electrode and described second
Between electrode, the optical cement is fixedly connected with the first electrode and the second electrode.In this way, transparent optical cement firmly glues
Paste first electrode and second electrode, it is ensured that while touch panel structure provided stability, the light transmission rate of contact panel is not influenceed.
Present invention also offers a kind of display device, the display device is included described in display panel and any of the above one
Contact panel, the display panel is stacked with the contact panel, and the display panel output image is simultaneously through described
The transparent region of contact panel is shown.
Beneficial effects of the present invention are as follows：Because conducting resinl electrically connects conducting end and second electrode, first electrode and conduction
End is located on first substrate, therefore the conductive lead wire for connecting conducting end and flexible PCB can be formed at into first substrate, and
The conductive lead wire of connection first electrode and flexible PCB is also formed in first substrate, will connect the conductive lead wire of first electrode
It is all disposed within the conductive lead wire of connection second electrode on the same surface of first substrate, therefore in first substrate and second substrate
It need not consider that the position of two kinds of conductive lead wires is staggered equally accurate problem during relative assembling, reduce to first substrate and the
The requirement on machining accuracy of two substrates, improves product yield, and greatly reduce production cost.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other substantially modes of texturing are obtained according to these accompanying drawings.
Fig. 1 is the stepped construction schematic diagram for the contact panel that the embodiment of the present invention one is provided.
Fig. 2 is the structural representation for the first substrate that the embodiment of the present invention one is provided.
Fig. 3 is the structural representation for the second substrate that the embodiment of the present invention one is provided.
Fig. 4 is the surface schematic diagram for the contact panel that the embodiment of the present invention one is provided.
Fig. 5 is the structural representation for the second substrate that the embodiment of the present invention two is provided.
Fig. 6 is the surface schematic diagram for the contact panel that the embodiment of the present invention two is provided.
Fig. 7 is the stepped construction schematic diagram for the contact panel that the embodiment of the present invention three is provided.
Fig. 8 is the structural representation for the second substrate that the embodiment of the present invention three is provided.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
Fig. 1, Fig. 2 and Fig. 3 are referred to, the contact panel that the embodiment of the present invention one is provided includes first substrate 12, the second base
Plate 14, first electrode 22, second electrode 24, conducting end 32 and conducting resinl 40, first substrate 12 is relative with second substrate 14 to be laminated
Set, specifically, first substrate 12 and second substrate 14 are transparency carrier, in a kind of preferably embodiment, first substrate
12 and second substrate 14 be glass substrate or plastic base etc..First electrode 22 and conducting end 32 are located at first substrate 12 in face of the
One surface of two substrates 14, further, first electrode 22 are transparent conductive film by the side such as chemical etching or laser-induced thermal etching
Formula patterns the electrode to be formed, the characteristics of first electrode 22 has high transparency, good conductivity.A kind of preferably embodiment
In, first electrode 22 is the thin-film patterning rear formation of tin indium oxide (Indium tin oxide, ITO).Further, the first electricity
The quantity of pole 22 is multiple, and width array arrangement of the first electrode 22 along contact panel.Conducting end 32 is located at first
In the both sides of the edge of the both sides of electrode 22, i.e. first substrate 12, the present embodiment, conducting end 32 is metal contact, such as metal
Piece etc., specifically, conducting end 32 is the elargol layer of chemical etching or laser-induced thermal etching, with good conductive characteristic.
Second electrode 24 is located at the surface that second substrate 14 faces first substrate 12, and further, second electrode 24 is
Transparent conductive film patterns the electrode to be formed by modes such as chemical etching or laser-induced thermal etchings, and second electrode 24 has transparency
The characteristics of height, good conductivity.In a kind of preferably embodiment, second electrode 24 be tin indium oxide (Indium tin oxide,
ITO) thin-film patterning rear formation.Further, the quantity of second electrode 24 is multiple, and second electrode 24 is along contact panel
Length direction array arrangement.In a kind of preferably embodiment, first electrode 22 and second electrode 24 are strip, and
The placement direction of second electrode 24 is vertical with first electrode 22.
The relative capacitive touch panels for forming capacitance structure, i.e. GFF structures with second electrode 24 of first electrode 22.It is conductive
Glue 40, which is fitted, conducting end 32 and second electrode 24 and electrically connects 24 layers of conducting end 32 and second electrode, specifically, conducting resinl 40 is
On the one hand solid colloid with certain viscosity and with good conductive characteristic, conducting resinl 40 fit conducting end 32, another aspect
Laminating second electrode 24, so that second electrode 24 is electrically connected into conducting end 32.Conducting end 32 is located at the first base by electrical connection
Binding point on plate 12 and be electrically connected to flexible PCB so that second electrode 24 is electrically connected to flexible PCB.
Due to the electrical connection conducting end 32 of conducting resinl 40 and second electrode 24, first electrode 22 and conducting end 32 are located at the first base
On plate 12, therefore the conductive lead wire that can will connect conducting end 32 and flexible PCB is formed at first substrate 12, connection first
The conductive lead wire of electrode 22 and flexible PCB is also formed in first substrate 12, in first substrate 12 and the relative dress of second substrate 14
It need not consider that the position of two kinds of conductive lead wires is mutually staggered equally accurate problem during matching somebody with somebody, reduce to first substrate 12 and
The requirement on machining accuracy of two substrates 14, while reducing cabling space limit caused by first electrode 22 and the combined tolerances of second electrode 24
System, improves product yield, and greatly reduce production cost.
Specific to Fig. 2, in the present embodiment, the surface of first substrate 12 is additionally provided with the first binding point 342, the second binding point
344th, the first conductive lead wire 362 and the second conductive lead wire 364, the first binding point 342 and the second binding point 344 are soft for electrically connecting
Property circuit board, in a kind of preferably embodiment, the first binding point 342 and the second binding point 344 are that chemical etching or laser lose
The elargol layer at quarter, with good conductive characteristic.First conductive lead wire 362 electrically connects the binding point of first electrode 22 and first
342, so that first electrode 22 is electrically connected to flexible PCB, the second conductive lead wire 364 electrically connects the second binding point 344 with leading
Electric end 32, so that second electrode 24 is electrically connected to flexible PCB.In the present embodiment, the first conductive lead wire 362 and second is led
Electrical lead 364 is metal lead wire, and to improve the conductive characteristic of conductive lead wire, further, the first conductive lead wire 362 and second is led
Electrical lead 364 is elargol line, and elargol line conducts electricity very well.It is preferred that, the first conductive lead wire 362 and the second conductive lead wire 364 are not
Intersecting, the first binding point 342 and the second binding point 344 are non-intersect, so that first electrode 22 passes through the first conductive lead wire 362, the
One binding point 342 is independently electrically connected to flexible PCB, and second electrode 24 passes through conducting resinl 40, the second conductive lead wire 364, second
Binding point 344 is independently electrically connected to flexible PCB, and first electrode 22 mutually completely cuts off with second electrode 24.
Conducting end 32, the first conductive lead wire 362, the second conductive lead wire 364, the first binding point 342 and the second binding point 344
First substrate 12 is may be contained within, first can be controlled during the first conductive lead wire 362 and the second conductive lead wire 364 is formed
The relative position of the conductive lead wire 364 of conductive lead wire 362 and second, without what is assembled relatively in first substrate 12 and second substrate 14
During consider further that the position of the first conductive lead wire 362 and the second conductive lead wire 364 is mutually staggered equally accurate problem, reduce pair
The requirement on machining accuracy of first substrate 12 and second substrate 14, improves product yield, and greatly reduce production cost.
In a kind of preferably embodiment, conducting end 32, the first conductive lead wire 362, the second conductive lead wire 364, first are tied up
The binding point 344 of fixed point 342 and second is integrally formed, i.e., pass through on one layer of elargol layer by a laser-induced thermal etching or chemical etching
Same procedure is processed to be formed, so as to obtain conducting end 32, the first conductive lead wire 362, the binding of the second conductive lead wire 364, first
Accurate position matching between the binding point 344 of point 342 and second.Further, touch surface provided in an embodiment of the present invention
Plate can form all the first conductive lead wires 362 and the second conductive lead wire after only needing one layer of elargol layer of printing on elargol layer
364, reduce the consumption of elargol layer, domestic elargol cost is basic in 5000RMB/KG, and the unit price members up to ten thousand easily of import,
So as to greatly reduce the cost of contact panel.
Specific to Fig. 3, in the present embodiment, the quantity of second electrode 24 is multiple, and second electrode 24 includes relative first
End 242 and the second end 244, second electrode 24 electrically connect conducting resinl by one of first end 242 and the second end 244
40.Specifically, second electrode 24 is strip, conducting resinl 40 connects the end of first end 242 and second of each second electrode 24
One of portion 244, to avoid the side that the second conductive lead wire 364 concentrates on contact panel from causing the wide situation of a side frame to send out
It is raw.Further, conducting resinl 40 connects the formation electrode group of first end 242 of second electrode 24, conducting resinl by first end 242
40 connect the formation electrode group of the second end 244 of second electrode 24, the electrode group of first end 242 and second by the second end 244
The electrode group of end 244 is alternately arranged, so that the second uniformly arrangement, a side frame of conductive lead wire 364 of contact panel both sides of the edge
Wide situation occurs.
In the present embodiment, with reference to Fig. 1 and Fig. 4, wherein Fig. 4 is the A directions part-structure schematic diagram of Fig. 1 contact panel,
Conducting resinl 40 is located between conducting end 32 and second electrode 24, and the laminating second electrode 24 of conducting resinl 40 faces the side of conducting end 32
Surface.Specifically, conducting resinl 40 is nontransparent material, conducting resinl 40 is laminated in the surface of second electrode 24, will reduce touch-control
The width dimensions of panel, it is to avoid frame is excessive, increase visible area area, improve screen accounting.
In the present embodiment, each conducting resinl 40 connects multiple second electrodes 24.Multiple second electrodes 24 are led by same
Electric glue 40 is pasted, and simplifies processing procedure, reduces production cost.Further, conducting resinl 40 is anisotropic conductive adhesive paste
(Anisotropic Conductive Film, ACF), anisotropic conductive adhesive paste is fitted between second electrode 24 and conducting end 32,
Second electrode 24 is electrically connected with conducting end 32, because anisotropic conductive adhesive paste is only not turned in longitudinal conduction lateral, therefore pass through
It is not turned between multiple second electrodes 24 that same conducting resinl 40 is connected, realizes that second electrode 24 is electrically connected to flexible PCB
While, it is to avoid the electrical connection between second electrode 24.
Due to the electrical connection conducting end 32 of conducting resinl 40 and second electrode 24, first electrode 22 and conducting end 32 are located at the first base
On plate 12, therefore the conductive lead wire that can will connect conducting end 32 and flexible PCB is formed at first substrate 12, connection first
The conductive lead wire of electrode 22 and flexible PCB is also formed in first substrate 12, in first substrate 12 and the relative dress of second substrate 14
It need not consider that the position of two kinds of conductive lead wires is mutually staggered equally accurate problem during matching somebody with somebody, reduce to first substrate 12 and
The requirement on machining accuracy of two substrates 14, while reducing cabling space limit caused by first electrode 22 and the combined tolerances of second electrode 24
System, improves product yield, and greatly reduce production cost.
Fig. 5 and Fig. 6 are referred to, the contact panel and the difference of embodiment one that the embodiment of the present invention two is provided are, each
Correspondence one second electrode 24 of connection of conducting resinl 40.Specifically, the quantity of conducting resinl 40 is identical with the quantity of second electrode 24, and
And be mutually not in contact with each other between each conducting resinl 40.Each second electrode 24 passes through correspondence one conducting end of laminating of conducting resinl 40
32, it is electrically connected to so as to pass sequentially through the second conductive lead wire 364, the second binding point 344 between flexible PCB, second electrode 24
Mutually insulated, is independent of each other, and conducting resinl 40 can select common conducting resinl 40, reduce the cost of contact panel.
Second electrode 24 is electrically connected to the conducting end 32 on first substrate 12 by conducting resinl 40, connection conducting end 32 with it is soft
Property circuit board conductive lead wire be formed at first substrate 12, connection first electrode 22 and the conductive lead wire of flexible PCB are also formed
In first substrate 12, the position of two kinds of conductive lead wires need not be considered during first substrate 12 and the relative assembling of second substrate 14
The equally accurate problem that mutually staggers is put, the requirement on machining accuracy to first substrate 12 and second substrate 14 is reduced, improves product
Yields, and greatly reduce production cost.
Fig. 7 and Fig. 8 are referred to, the contact panel and the difference of embodiment two that the embodiment of the present invention three is provided are, conductive
Glue 40 is located between conducting end 32 and second substrate 14, and the first end 242 of second electrode 24 includes left surface 245, the second end
Portion 244 includes right flank 246, and left surface 245 and the connection second electrode 24 of right flank 246 are in face of the surface of first substrate 12 and the
Two electrodes 24 face the surface of second substrate 14, and conducting resinl 40 is fitted left surface 245 and right flank 246 respectively.Specifically, second
Electrode 24 is strip, and left surface 245 and right flank 246 are respectively first end 242 and the second end 244 perpendicular to the second base
The surface of plate 14.The one side of conducting resinl 40 fits in conducting end 32, on the other hand fits in left surface 245 or right flank 246, from
And realize the electrical connection of second electrode 24 and conducting end 32.Because conducting resinl 40 is located between conducting end 32 and second substrate 14,
The distance between first substrate 12 and second substrate 14 are reduced, that is, reduces the thickness of contact panel, is conducive to contact panel
And the lightening design of display device.
Due to the electrical connection conducting end 32 of conducting resinl 40 and second electrode 24, first electrode 22 and conducting end 32 are located at the first base
On plate 12, therefore the conductive lead wire that can will connect conducting end 32 and flexible PCB is formed at first substrate 12, connection first
The conductive lead wire of electrode 22 and flexible PCB is also formed in first substrate 12, in first substrate 12 and the relative dress of second substrate 14
It need not consider that the position of two kinds of conductive lead wires is mutually staggered equally accurate problem during matching somebody with somebody, reduce to first substrate 12 and
The requirement on machining accuracy of two substrates 14, while reducing cabling space limit caused by first electrode 22 and the combined tolerances of second electrode 24
System, improves product yield, and greatly reduce production cost.
Contact panel provided in an embodiment of the present invention also include optical cement 50 (Optically Clear Adhesive,
OCA), optical cement 50 is transparent adhesive, and optical cement 50 is located between first electrode 22 and second electrode 24, and optical cement 50 is consolidated
Surely first electrode 22 and second electrode 24 are connected.Transparent optical cement 50 firmly pastes first electrode 22 and second electrode 24, protects
While demonstrate,proving touch panel structure provided stability, the light transmission rate of contact panel is not influenceed.Further, the embodiment of the present invention is provided
Contact panel also include cover plate 60, cover plate 60, first electrode 22 and second electrode 24 are stacked, on the one hand, the side of cover plate 60
Edge printing frame is used to block the first conductive lead wire 362 and the second conductive lead wire 364, on the other hand, and cover plate 60, which is used to contact, to be used
Family finger carries out touch control operation.In a kind of preferably embodiment, also by optical cement 50 between cover plate 60 and first electrode 22
Realize and mutually paste.
The embodiment of the present invention also provides a kind of display device, including display panel and above-described contact panel, display
Panel is stacked with contact panel, and display panel output image simultaneously passes through the transparent region of contact panel to show.The present embodiment
In, display device includes mobile phone, tablet personal computer, TV etc..
Further, display device also includes system board, housing and battery, and system board electrically connects contact panel and aobvious
Show panel and control electrical connection contact panel and display panel work, battery is used for main board power supply, and housing houses mainboard, electricity
Pond, contact panel and display panel, play protection display device device and effect attractive in appearance.
Due to the electrical connection conducting end 32 of conducting resinl 40 and second electrode 24, first electrode 22 and conducting end 32 are located at the first base
On plate 12, therefore the conductive lead wire that can will connect conducting end 32 and flexible PCB is formed at first substrate 12, connection first
The conductive lead wire of electrode 22 and flexible PCB is also formed in first substrate 12, in first substrate 12 and the relative dress of second substrate 14
It need not consider that the position of two kinds of conductive lead wires is mutually staggered equally accurate problem during matching somebody with somebody, reduce to first substrate 12 and
The requirement on machining accuracy of two substrates 14, while reducing cabling space limit caused by first electrode 22 and the combined tolerances of second electrode 24
System, improves product yield, and greatly reduce production cost.
Above disclosed is only several preferred embodiments of the invention, can not limit the power of the present invention with this certainly
Sharp scope, one of ordinary skill in the art will appreciate that all or part of flow of above-described embodiment is realized, and according to present invention power
Profit requires made equivalent variations, still falls within and invents covered scope.
Claims (10)
1. a kind of contact panel, it is characterised in that the contact panel includes first substrate, second substrate, first electrode, second
Electrode, conducting end and conducting resinl, the first substrate is relative with the second substrate to be stacked, the first electrode and described
Conducting end is located at the surface that the first substrate faces the second substrate, and the conducting end is located at the two of the first electrode
Side, the second electrode is located at the surface that the second substrate faces the first substrate, the first electrode and described the
Two electrodes are relative to form capacitance structure, and conducting end described in the conductive glue laminating and the second electrode, the conducting resinl are electrically connected
Connect the conducting end and the second electrode.
2. contact panel according to claim 1, it is characterised in that the surface of the first substrate is additionally provided with the first binding
Point, the second binding point, the first conductive lead wire and the second conductive lead wire, first binding point and second binding point are used for electricity
Flexible PCB is connected, first conductive lead wire electrically connects the first electrode and first binding point, so that described
First electrode is electrically connected to the flexible PCB, and second conductive lead wire electrically connects second binding point and the conduction
End, so that the second electrode is electrically connected to the flexible PCB.
3. contact panel according to claim 2, it is characterised in that the quantity of the second electrode be it is multiple, described the
Two electrodes include relative first end and the second end, and the second electrode passes through the first end and the second end
One of the electrical connection conducting resinl.
4. contact panel according to claim 3, it is characterised in that the conducting resinl is located at the conducting end and described the
Between two electrodes, second electrode described in the conductive glue laminating faces a surface of the conducting end.
5. contact panel according to claim 4, it is characterised in that each conductive multiple second electricity of gemel connection
Pole.
6. contact panel according to claim 5, it is characterised in that the conducting resinl is anisotropic conductive adhesive paste.
7. contact panel according to claim 4, it is characterised in that each conducting resinl correspondence connection one described the
Two electrodes.
8. contact panel according to claim 3, it is characterised in that the conducting resinl is located at the conducting end and described the
Between two substrates, the first end includes left surface, and the second end includes right flank, and the left surface and right flank are equal
Connect the surface that the second electrode faces the second substrate in face of the surface of the first substrate with the second electrode, institute
State left surface or right flank described in conductive glue laminating.
9. the contact panel according to claim 1 to 8 any one, it is characterised in that the contact panel also includes light
Glue is learned, the optical cement is located between the first electrode and the second electrode, and the optical cement is fixedly connected with described first
Electrode and the second electrode.
10. a kind of display device, it is characterised in that the display device includes display panel and claim 1 to 9 any one
Described contact panel, the display panel is stacked with the contact panel, and the display panel output image is simultaneously passed through
The transparent region of the contact panel is shown.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710425857.1A CN107145265A (en) | 2017-06-08 | 2017-06-08 | Contact panel and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710425857.1A CN107145265A (en) | 2017-06-08 | 2017-06-08 | Contact panel and display device |
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| CN107145265A true CN107145265A (en) | 2017-09-08 |
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ID=59780751
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710425857.1A Pending CN107145265A (en) | 2017-06-08 | 2017-06-08 | Contact panel and display device |
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| CN111522467A (en) * | 2020-04-26 | 2020-08-11 | 南昌欧菲显示科技有限公司 | Touch panel, preparation method thereof and touch panel assembly |
| CN113391723A (en) * | 2021-06-02 | 2021-09-14 | 业成科技（成都）有限公司 | Touch panel |
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Address after: 518106 oufeiguang Science Park, HUAFA section of Songbai highway, Gongming street, Guangming New District, Shenzhen City, Guangdong Province Applicant after: Ophiguang Group Co.,Ltd. Address before: 518106 oufeiguang Science Park, HUAFA section of Songbai highway, Gongming street, Guangming New District, Shenzhen City, Guangdong Province Applicant before: OFilm Tech Co.,Ltd. Address after: 518106 oufeiguang Science Park, HUAFA section of Songbai highway, Gongming street, Guangming New District, Shenzhen City, Guangdong Province Applicant after: OFilm Tech Co.,Ltd. Address before: 518106 oufeiguang Science Park, HUAFA section of Songbai highway, Gongming street, Guangming New District, Shenzhen City, Guangdong Province Applicant before: Shenzhen OFilm Tech Co.,Ltd. |
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Effective date of registration: 20210223 Address after: 231323 Building 1, precision electronics industrial park, Hangbu Town, Shucheng County, Lu'an City, Anhui Province Applicant after: Anhui jingzhuo optical display technology Co.,Ltd. Address before: 518106 oufeiguang Science Park, HUAFA section of Songbai highway, Gongming street, Guangming New District, Shenzhen City, Guangdong Province Applicant before: Ophiguang Group Co.,Ltd. |