CN107141724A - It is a kind of for the Halogen of automobile copper-clad plate, resistance to CAF, high Tg, high heat resistant resin composition - Google Patents
It is a kind of for the Halogen of automobile copper-clad plate, resistance to CAF, high Tg, high heat resistant resin composition Download PDFInfo
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- CN107141724A CN107141724A CN201710544593.1A CN201710544593A CN107141724A CN 107141724 A CN107141724 A CN 107141724A CN 201710544593 A CN201710544593 A CN 201710544593A CN 107141724 A CN107141724 A CN 107141724A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/04—Epoxynovolacs
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
- C08K2003/3045—Sulfates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/22—Halogen free composition
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention discloses a kind of for the Halogen of automobile copper-clad plate, resistance to CAF, high Tg, high heat resistant resin composition, and said composition is in terms of solid content parts by weight, including following component：5~35 parts of biphenyl type epoxy resin, 5~30 parts of phenol aralkyl epoxy resin, 10~65 parts of novolac epoxy resin, 5~40 parts of phosphorus containing phenolic resin, 5~40 parts of phenolic resin, 10~40 parts of barite, 0.05~1 part of accelerator.The made copper-clad plate of the present invention has the excellent combination properties such as high Tg, high-fire resistance, agent of low hygroscopicity, good resistance to CAF, and reach halogen-free flameproof requirement, with good processing characteristics, in new-energy automobile field, electronic product production industry has broad application prospects.
Description
Technical field
The present invention relates to copper-clad plate technical field, and in particular to a kind of Halogen, resistance to CAF, height for automobile copper-clad plate
Tg, high heat resistant resin composition.
Background technology
Current copper-clad plate is widely used in the print manufactured used in all kinds of household electrical appliance, electronics and IT products and industrial electronics
Circuit board (abbreviation PCB) processed, it plays carrying dress connection electronic component, forms conductive as the baseplate material of printed circuit board
Line pattern and the three zones insulated between interlayer and circuit, are a kind of important basic electronic materials.
Over nearly twenty or thirty year, with the fast development and the continuous change of auto manufacturing of electronic information technology, automobile electricity
The application and innovation of sub- technology have greatly promoted the progress and development of auto industry, and this has driven the city of automobile circuit plate indirectly
Field development.2015, Global Auto wiring board accounted for the industry gross output value 9%, about 5,300,000,000 dollars；Expect the year two thousand twenty, global vapour
Car wiring board occupation rate is up to 15%.
The part that automobile line plate reliability ensures as automobile reliability, it is desirable to very strict, supply is not required nothing more than
Producer will also carry out harsh assessment by car mass management system QS9000 certifications to its quality control capability.Existing automobile
Property copper-clad plate material being used circuit panel products, it is desirable to which copper-clad plate has high Tg, high-fire resistance, agent of low hygroscopicity, good more
Resistance to CAF performances.Vehicle power control system and braking control system automobile line plate, it is designed and process requirements are higher
Reliability, such as automotive control system, Partial key requirement on devices carry out up to 500~2000 times high/low temperature circulation (car-mounted devices
It is required that 200 circulations), this requires automobile copper-clad plate to have high-fire resistance；For automobile PCB, its engine section and periphery
Position heat resistant requirements are higher, therefore it is required that automobile copper-clad plate has high-fire resistance and high Tg.
In terms of automobile copper-clad plate, high Tg materials, the material of resistance to CAF, high heat proof material are produced as applied to automotive electronics
The main special material of product, the nearly research and development focus for being increasingly becoming extraordinary PCB for 2 years and profit bright spot.Such developing material phase at home
To relatively slower, also substantially it is invisible on a large scale, and because technology is immature, product combination property is not high, makes its promotion and application model
Enclose limited.
On the other hand, the anti-flammability of copper-clad plate is also one of important security performance of electronic product.Halogen fire proofing
(containing Cl, Br), with its economy and reliability, has been employed for many years, however, with global in printed circuit base material industry
Environmental protection cry is grown to even greater heights, and the carrying capacity of environment of halogen fire proofing and the influence to health just closed closely
Note.Smoke amount is very big in combustion for halogen product, can discharge extremely toxic substance hydrogen halides, seriously threaten health.Cause
This researches and develops and applied halogen-free type fire proofing, produces environment-friendly type printed circuit base material, it has also become copper-clad plate technology develops in recent years
New trend.
The content of the invention
The problem of existing for prior art, the present invention is intended to provide a kind of Halogen for automobile copper-clad plate, resistance to
CAF, high Tg, high heat resistant resin composition, to realize the technical purpose, the present invention uses following technical scheme：
It is a kind of for the Halogen of automobile copper-clad plate, resistance to CAF, high Tg, high heat resistant resin composition, with solid content parts by weight
Meter, including following component：
Preferably, said composition is in terms of solid content parts by weight, including following component：
Preferably, the biphenyl type epoxy resin is selected from one of the epoxy resin of chemical constitution as shown in (1), (2), (3)
Plant or several mixtures：
It is highly preferred that the biphenyl type epoxy resin in trade mark YX4000, trade mark YL612, trade mark NC3000 one
Plant or several mixtures.
Preferably, the phenol-aralkyl base epoxy is phenol-biphenylene type epoxy resin, phenol-paraxylene
One or more of mixtures in type epoxy resin.
It is highly preferred that the phenol-biphenylene type epoxy resin chemistry structure is such as shown in (4), the phenol-to diformazan
Benzene-type epoxy resin chemistry structure is such as shown in (5)：
Preferably, the novolac epoxy resin is orthoresol type novolac epoxy resin, bisphenol A-type novolac epoxy resin, benzene
Phenolic novolac epoxy resin, adjacent first linear phenolic epoxy resin, linear bisphenol-A novolac epoxy resin, nitrogenous novolac epoxy resin,
One or more of mixtures in hydrogenated bisphenol A type novolac epoxy resin.
Preferably, the phosphorus containing phenolic resin phosphorus content is 2%~10%；The phosphorus containing phenolic resin has luxuriant and rich with fragrance type to be phosphorous
Compound, including：The corresponding phenolic resin of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10- (2,5- dihydroxy
Phenyl) one or more of mixtures in the corresponding phenolic resin of -10- hydrogen -9- oxa- -10- phospho hetero phenanthrene -10- oxides.
Preferably, the phenolic resin is orthoresol type phenolic resin, linear phenolic resin, bisphenol A type phenolic resin, benzene
One or more of mixtures in phenolic phenolic resin.
Preferably, the barite particle size range is 0.2~0.6 μm.
Preferably, the accelerator is 2-ethyl-4-methylimidazole, 2- ethyl imidazol(e)s, 2- phenylimidazoles, 2- methyl miaows
One or more of mixtures in azoles, 1 benzyl 2 methyl imidazole, undecyl imidazole.
Present invention applicant is directed to the performance deficiency that orthodox car copper-clad plate is present, by continuous Improvement, research and development
Go out a novel resin composition for being exclusively used in automobile-used copper-clad plate, in the composition：Biphenyl type epoxy resin is in epoxy resin
The biphenyl group of high rigidity is introduced in skeleton, heat resistance, the toughness of copper-clad plate can be significantly improved, hygroscopicity is reduced, improved resistance to
CAF；Phenol-aralkyl base epoxy has high-fire resistance, agent of low hygroscopicity, self flame retardance characteristic, is risen with phosphorus containing phenolic resin
To cooperative flame retardant effect, without addition filling aluminium hydrate, so as to avoid, to add the copper-clad plate that a large amount of aluminium hydroxides bring resistance to
The problem of hot decline, the halogen-free flameproof copper-clad plate made without halogen resin is in processing, using, fire, waste treatment (bag
Include recovery, burial, burning etc.) during will not produce the material harmful to human body and environment, beneficial to environmental protection and the whole world
Sustainable development；Barite heat resisting temperature itself is up to 800 DEG C, and without the crystallization water, in thermal histories will not as aluminium hydroxide or
The filler containing the crystallization water such as boehmite is the same because dehydration makes copper-clad plate plate bursting occur.Proved through performance test, resin group of the present invention
Biphenyl type epoxy resin, phenol in compound-aralkyl base epoxy, barite combination novolac epoxy resin, phosphorus-containing phenolic aldehyde tree
Fat, phenolic resin, collaboration performance effect after compound according to specific proportioning, made copper-clad plate has high Tg, high-fire resistance, low
Excellent combination properties such as hygroscopicity, good resistance to CAF, and reach halogen-free flameproof requirement, with good processing characteristics,
New-energy automobile field electronic product production industry has broad application prospects.
Embodiment
Describe the specific embodiment of the present invention in detail below by embodiment, but the claim to the present invention does not do any
Limit.
Embodiment 1
The present embodiment Halogen, resistance to CAF, high Tg, high heat resistant resin composition, in terms of solid content parts by weight, including such as the following group
Part：10 parts of YX4000 biphenyl type epoxy resins, phenol -10 parts of paraxylene type epoxy resin, bisphenol A-type novolac epoxy resin
30 parts, 25 parts of phosphorus containing phenolic resin, 10 parts of bisphenol A type phenolic resin, 15 parts of barite, 0.5 part of 2- phenylimidazoles.
Embodiment 2
The present embodiment Halogen, resistance to CAF, high Tg, high heat resistant resin composition, in terms of solid content parts by weight, including such as the following group
Part：10 parts of YL612 biphenyl type epoxy resins, phenol -15 parts of biphenylene type epoxy resin, orthoresol type novolac epoxy resin
25 parts, 30 parts of phosphorus containing phenolic resin, 10 parts of phenol type phenolic resin, 10 parts of barite, 2-ethyl-4-methylimidazole is some, 2-
0.6 part of methylimidazole.
Embodiment 3
The present embodiment Halogen, resistance to CAF, high Tg, high heat resistant resin composition, in terms of solid content parts by weight, including such as the following group
Part：8 parts of NC3000 biphenyl type epoxy resins, phenol -20 parts of paraxylene type epoxy resin, phenol type novolac epoxy resin 20
Part, 25 parts of phosphorus containing phenolic resin, 15 parts of orthoresol type phenolic resin, 12 parts of barite, 2- phenylimidazoles, 2-methylimidazole 0.7
Part.
Comparative example 1
This comparative example resin composition, in terms of solid content parts by weight, including following component：Orthoresol type novolac epoxy resin
40 parts, 20 parts of phosphorus containing phenolic resin, 20 parts of phenol type phenolic resin, 20 parts of barite, 2-ethyl-4-methylimidazole is some, 2-
0.4 part of methylimidazole.
Comparative example 2
This comparative example resin composition, in terms of solid content parts by weight, including following component：YX4000 biphenyl type epoxy trees
10 parts of fat, phenol -10 parts of paraxylene type epoxy resin, 20 parts of orthoresol type novolac epoxy resin, 20 parts of phosphorus containing phenolic resin,
20 parts of phenol type phenolic resin, 20 parts of aluminium hydroxide, 0.8 part of 2-methylimidazole.
1~embodiment of embodiment 3 and the resin combination each group distribution ratio of 1~comparative example of comparative example 2 are referring specifically to table 1.
1~the embodiment of embodiment 3 of table 1 and the resin combination each group distribution ratio of 1~comparative example of comparative example 2 are (with solid content
Parts by weight meter)
| Ingredient names | Embodiment 1 | Embodiment 2 | Embodiment 3 | Comparative example 1 | Comparative example 2 |
| YX4000 trade mark biphenyl type epoxy resins | 10 | 0 | 0 | 0 | 10 |
| YL612 trade mark biphenyl type epoxy resins | 0 | 10 | 0 | 0 | 0 |
| NC3000 trade mark biphenyl type epoxy resins | 0 | 0 | 8 | 0 | 0 |
| Phenol-paraxylene type epoxy resin | 10 | 0 | 20 | 0 | 10 |
| Phenol-biphenylene type epoxy resin | 0 | 15 | 0 | 0 | 0 |
| Bisphenol A-type novolac epoxy resin | 30 | 0 | 0 | 0 | 0 |
| Orthoresol type novolac epoxy resin | 0 | 25 | 0 | 40 | 20 |
| Phenol type novolac epoxy resin | 0 | 0 | 20 | 0 | 0 |
| Phosphorus containing phenolic resin | 25 | 30 | 25 | 20 | 20 |
| Bisphenol A type phenolic resin | 10 | 0 | 0 | 0 | 0 |
| Phenol type phenolic resin | 0 | 10 | 0 | 20 | 20 |
| Orthoresol type phenolic resin | 0 | 0 | 15 | 0 | 0 |
| Barite | 15 | 10 | 12 | 20 | 0 |
| Accelerator | 0.5 | 0.6 | 0.7 | 0.4 | 0.8 |
| Aluminium hydroxide | 0 | 0 | 0 | 0 | 20 |
Above-mentioned resin combination is respectively used to make copper-clad plate, preparation method comprises the following steps：
(1) at room temperature, weigh each composition by weight by formula and add appropriate solvent, stirring is well mixed it, obtains glue；
(2) resin adhesive liquid after dilution is coated uniformly on electronic grade glass cloth, then the glass-fiber-fabric of dipped glue leads to
Vertical or horizontal type is crossed containing dipping machine, 185 DEG C are toasted 4 minutes, and prepreg is made；
(3) 6 prepregs are stacked, a copper foil is respectively covered up and down, be put into vacuum hotpressing machine and be laminated, be laminated bar
Part is 210 DEG C, 180 minutes, and copper-clad plate is made.
1~embodiment of embodiment 3 and the made copper-clad plate the performance test results of the resin combination of 1~comparative example of comparative example 2
Referring to table 2.
1~the embodiment of embodiment 3 of table 2 and the made copper-clad plate performance of the resin combination of 1~comparative example of comparative example comparative example 2
Test result
| Test event | Test condition | Embodiment 1 | Embodiment 2 | Embodiment 3 | Comparative example 1 | Comparative example 2 |
| Tg(℃) | DSC | 175 | 168 | 173 | 155 | 149 |
| Td 5%loss (DEG C) | TGA | 364 | 353 | 361 | 342 | 330 |
| T288(min) | TMA | ＞ 60 | ＞ 60 | ＞ 60 | 27 | 23 |
| Resistance to dip solderability (s) | 288 DEG C of limit, band copper | ＞ 600 | ＞ 600 | ＞ 600 | ＜ 300 | ＜ 300 |
| Thermal shock number of times (secondary) | 288 DEG C/10s is circulated | ＞ 20 | ＞ 20 | ＞ 20 | 8 | 6 |
| PCT water absorption rates (%) | 105 DEG C are dried 2h, 120 DEG C of boiling 2h | 0.20 | 0.24 | 0.22 | 0.36 | 0.38 |
| Flammability (s) | UL94 | V-0 | V-0 | V-0 | V-0 | V-0 |
| Processability | Drilling | Well | Well | Well | Typically | Typically |
From the test data of table 2, compared with 1~comparative example of comparative example 2, the resin combination system of 1~embodiment of embodiment 3
Standby copper-clad plate has excellent comprehensive such as high Tg, high-fire resistance, good toughness, agent of low hygroscopicity, good resistance to CAF
Can, and halogen-free flameproof requirement is reached, with good processing characteristics.
Unless otherwise specified, each raw material involved by above example and comparative example is commercially available general commodity.
It is understood that above with respect to the specific descriptions of the present invention, being merely to illustrate the present invention and being not limited to this
Technical scheme described by inventive embodiments.It will be understood by those within the art that, still can be to present invention progress
Modification or equivalent substitution, to reach identical technique effect；As long as meet use needs, all protection scope of the present invention it
It is interior.
Claims (10)
1. it is a kind of for the Halogen of automobile copper-clad plate, resistance to CAF, high Tg, high heat resistant resin composition, it is characterised in that：With solid
Shape thing parts by weight meter, including following component：
2. it is used for Halogen, resistance to CAF, high Tg, the high heat resistant resin composition of automobile copper-clad plate as claimed in claim 1, its
It is characterised by：In terms of solid content parts by weight, including following component：
3. it is used for Halogen, resistance to CAF, high Tg, the high heat resistant resin composition of automobile copper-clad plate as claimed in claim 1, its
It is characterised by：The biphenyl type epoxy resin is selected from one kind or several of the epoxy resin of chemical constitution as shown in (1), (2), (3)
The mixture planted：
4. it is used for Halogen, resistance to CAF, high Tg, the high heat resistant resin composition of automobile copper-clad plate as claimed in claim 3, its
It is characterised by：One or more of the biphenyl type epoxy resin in trade mark YX4000, trade mark YL612, trade mark NC3000
Mixture.
5. it is used for Halogen, resistance to CAF, high Tg, the high heat resistant resin composition of automobile copper-clad plate as claimed in claim 1, its
It is characterised by：The phenol-aralkyl base epoxy is phenol-biphenylene type epoxy resin, phenol-paraxylene type epoxy
One or more of mixtures in resin.
6. it is used for Halogen, resistance to CAF, high Tg, the high heat resistant resin composition of automobile copper-clad plate as claimed in claim 1, its
It is characterised by：The novolac epoxy resin is orthoresol type novolac epoxy resin, bisphenol A-type novolac epoxy resin, phenol type phenol
Formaldehyde epoxy resin, adjacent first linear phenolic epoxy resin, linear bisphenol-A novolac epoxy resin, nitrogenous novolac epoxy resin, hydrogenation are double
One or more of mixtures in phenol A type novolac epoxy resins.
7. it is used for Halogen, resistance to CAF, high Tg, the high heat resistant resin composition of automobile copper-clad plate as claimed in claim 1, its
It is characterised by：The phosphorus containing phenolic resin phosphorus content is 2%~10%；The phosphorus containing phenolic resin has luxuriant and rich with fragrance type chemical combination to be phosphorous
Thing, including：The corresponding phenolic resin of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10- (2,5- dihydroxy benzenes
Base) one or more of mixtures in the corresponding phenolic resin of -10- hydrogen -9- oxa- -10- phospho hetero phenanthrene -10- oxides.
8. it is used for Halogen, resistance to CAF, high Tg, the high heat resistant resin composition of automobile copper-clad plate as claimed in claim 1, its
It is characterised by：The phenolic resin is orthoresol type phenolic resin, linear phenolic resin, bisphenol A type phenolic resin, phenol type phenol
One or more of mixtures in urea formaldehyde.
9. it is used for Halogen, resistance to CAF, high Tg, the high heat resistant resin composition of automobile copper-clad plate as claimed in claim 1, its
It is characterised by：The barite particle size range is 0.2~0.6 μm.
10. it is used for Halogen, resistance to CAF, high Tg, the high heat resistant resin composition of automobile copper-clad plate as claimed in claim 1, its
It is characterised by：The accelerator is 2-ethyl-4-methylimidazole, 2- ethyl imidazol(e)s, 2- phenylimidazoles, 2-methylimidazole, 1- benzyls
One or more of mixtures in base -2-methylimidazole, undecyl imidazole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710544593.1A CN107141724A (en) | 2017-07-05 | 2017-07-05 | It is a kind of for the Halogen of automobile copper-clad plate, resistance to CAF, high Tg, high heat resistant resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710544593.1A CN107141724A (en) | 2017-07-05 | 2017-07-05 | It is a kind of for the Halogen of automobile copper-clad plate, resistance to CAF, high Tg, high heat resistant resin composition |
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| Publication Number | Publication Date |
|---|---|
| CN107141724A true CN107141724A (en) | 2017-09-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710544593.1A Pending CN107141724A (en) | 2017-07-05 | 2017-07-05 | It is a kind of for the Halogen of automobile copper-clad plate, resistance to CAF, high Tg, high heat resistant resin composition |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101039546A (en) * | 2007-03-16 | 2007-09-19 | 广东生益科技股份有限公司 | Lead-free compatible high frequency copper clad laminate and its preparing method |
| CN106496935A (en) * | 2016-10-17 | 2017-03-15 | 无锡宏仁电子材料有限公司 | A kind of halogen-free flameproof superelevation CTI high withstand voltage resin combination for copper-clad plate |
-
2017
- 2017-07-05 CN CN201710544593.1A patent/CN107141724A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101039546A (en) * | 2007-03-16 | 2007-09-19 | 广东生益科技股份有限公司 | Lead-free compatible high frequency copper clad laminate and its preparing method |
| CN106496935A (en) * | 2016-10-17 | 2017-03-15 | 无锡宏仁电子材料有限公司 | A kind of halogen-free flameproof superelevation CTI high withstand voltage resin combination for copper-clad plate |
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Application publication date: 20170908 |
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