CN107134421A - A kind of automated bonding equipment - Google Patents
A kind of automated bonding equipment Download PDFInfo
- Publication number
- CN107134421A CN107134421A CN201610113300.XA CN201610113300A CN107134421A CN 107134421 A CN107134421 A CN 107134421A CN 201610113300 A CN201610113300 A CN 201610113300A CN 107134421 A CN107134421 A CN 107134421A
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- Prior art keywords
- picking
- station
- bonding
- fixed support
- alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
The present invention relates to a kind of automated bonding equipment, including a fixed support；The electric rotating machine on fixed support is installed on, electric rotating machine driving fixed support rotates around vertical central shaft；3n mechanism for picking being fixed on fixed support, 3n mechanism for picking point symmetry centered on vertical central shaft is distributed on support bracket fastened bottom surface；And n pickup station, n alignment station and n bonding station, n is picked up station, n alignment station and n bonding station and is corresponding in turn to the lower section for being arranged in 3n mechanism for picking in order, wherein, n is positive integer.The present invention drives the rotation of multiple mechanism for picking by electric rotating machine, within the same time, different stations is corresponded to respectively to realize pickup chip, alignment and bond sequence, enter next station after rotation simultaneously and carry out next operation, so as to substantially increase production efficiency, and the present invention is simple in construction, cost is low, reliability is high.
Description
Technical field
The present invention relates to semiconductor packages field, more particularly to a kind of automated bonding equipment.
Background technology
Chip bonding is the critical process step during semiconductor packages, and the process of chip bonding is exactly will
A series of processing such as the bare chip of the process cutting-up sticked on blue diaphragm is bonded, plastic packaging, it is available to be formed
Semiconductor devices.For the bonding apparatus on chip bonding to wafer or substrate typically to be had at least one key
Syncephalon or pick-up head, each bonding head are sent to the precalculated position of bonding apparatus and crawl or bonding chip.
As semiconductor devices is in the extensive use of modern society, chip bonding equipment must efficiently, precisely, surely
Determine, be reliably completed chip bonding operation.In order to improve the efficiency and reliability of chip bonding equipment, bonding is set
Standby supplier has carried out continuous exploration and trial.
One way in which is to use ultrasonic vibration bonding chip mounter, and it controls pick-up head and bonding head
Extreme position and one is travelled forward backward between limit of sports record position one, and pick-up head is responsible for chip from blue diaphragm
On be moved on alignment tool, bonding head be responsible for will by alignment chip be moved to from alignment tool on substrate.But
In being this mode, no matter pick-up head or bonding head are required for the round trip on two stations to complete one
The pickup or bonding of individual chip, it is less efficient.
Another mode is to pick up piece switching mechanism using two-way, and it includes two inversion mechanisms, can make 4
Mechanism for picking is picking up reciprocating motion between piece position and alignment position and alignment position and bonding position respectively.Also
There is a kind of workpiece bonding system, it includes a workpiece transmitting device, workpiece can be connected device and workpiece are provided
Processing unit, and carry out during transmission various pretreatment operations.Both equipment have higher work
Efficiency, but its workpiece transmitting device is complicated, and cost is higher.
Therefore, how a kind of operating efficiency height and the low automated bonding equipment of cost are provided, is people in the art
Member's technical problem urgently to be resolved hurrily.
The content of the invention
The present invention provides a kind of automated bonding equipment, high to solve existing bonding apparatus inefficiency, cost
The problem of.
In order to solve the above technical problems, the present invention provides a kind of automated bonding equipment, including：
One fixed support；
The electric rotating machine on the fixed support is installed on, the electric rotating machine drives the fixed support around vertical
Central shaft rotates；
3n mechanism for picking being fixed on the fixed support, the 3n mechanism for picking with it is described it is vertical in
Point symmetry is distributed on support bracket fastened bottom surface centered on heart axle；And
N pickup station, n alignment station and n bonding station, the n pickup station, n alignment
Station and n bonding station are corresponding in turn to the lower section for being arranged in the 3n mechanism for picking in order, wherein, n
For positive integer.
It is preferred that the electric rotating machine drives the angle of the fixed support rotation to be 360 °/3n every time.
It is preferred that each mechanism for picking includes vertical motor, guide rail and pick-up head, the guide rail respectively
Vertically it is fixed on the fixed support, the vertical motor is installed on the guide rail, the pick-up head is consolidated
Due on the vertical motor, the vertical motor can drive the pick-up head to be slided along the guide rail.
It is preferred that each mechanism for picking also includes a switching mechanism, the switching mechanism is arranged at described hang down
To between motor and pick-up head, the pick-up head is driven to overturn.
It is preferred that the pickup station includes the picking up work piece platform for being used to carry blue diaphragm, and it is described for limiting
The pickup clamping device of position of the blue diaphragm on the picking up work piece platform.
It is preferred that being additionally provided with thimble between the picking up work piece platform and the blue diaphragm.
It is preferred that the alignment station includes the alignment wafer-supporting platform for being used to carry chip and abandon defective chip, and
For defects detection and the imaging mechanism of alignment.
It is preferred that the bonding station includes the bonding work stage for being used to carry wafer to be bonded or substrate, and use
In the bonding clamping device for limiting the position of the wafer or substrate to be bonded in the bonding work stage.
It is preferred that the bonding clamping device treats key according to the position deviation adjustment that the imaging mechanism is measured
Synthetic is justified or substrate is in the position being bonded in work stage.
Compared with prior art, the automated bonding equipment that the present invention is provided, multiple pickups are driven by electric rotating machine
The rotation of mechanism, within the same time, corresponds to different stations to realize pickup chip, alignment and be bonded respectively
Process, enters next station and carries out next operation simultaneously after rotation, so that production efficiency is substantially increased, and this
Inventive structure is simple, and cost is low, reliability is high.
Brief description of the drawings
Fig. 1 is the front view of the automated bonding equipment of the embodiment of the invention；
Fig. 2 is 3 mechanism for picking in the embodiment of the invention in support bracket fastened distribution schematic diagram；
Fig. 3 is electric rotating machine and support bracket fastened scheme of installation in the embodiment of the invention；
Fig. 4 is the workflow schematic diagram of 3 mechanism for picking in the embodiment of the invention.
In figure：10- fixed supports；20- electric rotating machines；
The mechanism for picking of 30a- first, the vertical motors of 31a- first, the guide rails of 32a- first, 33a- first are picked up
Head, the switching mechanisms of 34a- first；The mechanism for picking of 30b- second, the vertical motors of 31b- second, 32b-
Second guide rail, the pick-up heads of 33b- second, the switching mechanisms of 34b- second；The mechanism for picking of 30c- the 3rd,
The vertical motors of 31c- the 3rd, the guide rails of 32c- the 3rd, the pick-up heads of 33c- the 3rd, the switching mechanisms of 34c- the 3rd；
40- pickups station, the blue diaphragms of 41-, 42- picking up work piece platform, 43- pickups clamping device, 44- tops
Pin；
50- alignments station, 51- alignments wafer-supporting platform, 52- imaging mechanisms；
60- bondings station, 61- wafers to be bonded or substrate, 62- bondings work stage, 63- bonding clampings
Mechanism.
Embodiment
In order to facilitate the understanding of the purposes, features and advantages of the present invention, below in conjunction with the accompanying drawings to this
The embodiment of invention is described in detail.It should be noted that, accompanying drawing of the present invention is using simplified form
And non-accurately ratio is used, only for the purpose of facilitating and clarifying the purpose of the embodiments of the invention.
The automated bonding equipment that the present invention is provided, as shown in Figure 1 to Figure 3, including：
One fixed support 10；
The electric rotating machine 20 on the fixed support 10 is installed on, the electric rotating machine 20 drives the fixed branch
Frame 10 rotates around vertical central shaft；
3n mechanism for picking being fixed on the fixed support 10, the 3n mechanism for picking is with described perpendicular
Point symmetry is distributed on the bottom surface of fixed support 10 centered on to central shaft；And
N pickup station 40, n alignment station 50 and n bonding station 60, the n pickup station
40th, n alignment station 50 and n bonding station 60 are corresponding in turn to are arranged in the 3n pickup machine in order
The lower section of structure, wherein, n is positive integer.
In other words, the identical mechanism for picking of 3n shape and structure is fixed on the fixed support 10, and
Lower section corresponding with each mechanism for picking is sequentially provided with pickup station 40, is directed at station 50 and bonding station respectively
60, specifically, n=1 in the present embodiment, i.e. mechanism for picking quantity are 3, pickup station 40, alignment work
Position 50 is 1 with bonding station 60, asks emphasis to refer to Fig. 2 and Fig. 4, the workflow of 3 mechanism for picking
Cheng Wei：During original state, the first mechanism for picking 30a correspondence pickup stations 40, the second mechanism for picking 30b correspondences
Station 50 is directed at, the 3rd mechanism for picking 30c correspondence bonding stations 60, the first mechanism for picking 30a picks up work
Realize the pickup of first chip in position 40；After the completion of, electric rotating machine 20 drives the fixed support 10 to rotate,
Now, the first mechanism for picking 30a alignments station 50, the second mechanism for picking 30b correspondence bonding stations 60,
3rd mechanism for picking 30c correspondence pickup stations 40, the first mechanism for picking 30a realizes first in alignment station 50
The alignment of individual chip, the 3rd mechanism for picking 30c realizes the pickup of second chip in pickup station 40；Complete
Afterwards, electric rotating machine 20 drives the fixed support 10 to rotate, now, and the first mechanism for picking 30a correspondences are bonded
Station 60, the second mechanism for picking 30b correspondence pickup stations 40, the 3rd mechanism for picking 30c alignment stations
50, the first mechanism for picking 30a realize the bonding of first chip, the second mechanism for picking 30b in bonding station 60
The pickup of the 3rd chip is realized in pickup station 40, and the 3rd mechanism for picking 30c realizes the in alignment station 50
The alignment of two chips, by that analogy, realizes that rotation can complete at least three chip to electric rotating machine 20 every time
Different step, so that production efficiency is greatly improved, and the present invention is simple in construction, cost is low, reliability is high.
It is preferred that the angle that the electric rotating machine 20 drives the fixed support 10 to rotate every time is 360 °/3n,
Likewise, in the present embodiment, n=1, i.e., the angle rotated every time is 120 °, certainly, fixed support 10
Direction of rotation is consistent with the orientation for picking up station 40, being directed at station 50 and being bonded station 60, that is, picks up work
When position 40, alignment station 50 and bonding station 60 are arranged according to clock-wise order, fixed support 10 is clockwise
Rotation；When pickup station 40, alignment station 50 and bonding station 60 are arranged according to sequence counter-clockwise, fixed branch
The rotate counterclockwise of frame 10.
It is preferred that each mechanism for picking includes vertical motor, guide rail and pick-up head, the guide rail respectively
Vertically it is fixed on the fixed support 10, the vertical motor is installed on the guide rail, the pickup
Head is fixed on the vertical motor, and the vertical motor can drive the pick-up head to be slided along the guide rail；
It is preferred that the pickup station 40 includes the picking up work piece platform 42 for being used to carry blue diaphragm 41, and for limiting
The pickup clamping device 43 of position of the blue diaphragm 41 on the picking up work piece platform 42.Please emphasis with reference to figure
1, the situation of pickup station 40 will be located at the first mechanism for picking 30a herein, illustrate mechanism for picking in pickup work
Course of work during position 40：First vertical motor 31a starts, and is moved downward along the first guide rail 32a, by the
One pick-up head 33a picks up the chip on blue diaphragm 41, it is preferred that also including the in the first mechanism for picking 30a
One switching mechanism, is arranged between the described first vertical motor 31a and the first pick-up head 33a, when necessary may be used
The first pick-up head 33a is driven to overturn, the first vertical motor 31a returns after the completion of pickup.
It is preferred that please continue to refer to Fig. 1, being additionally provided between the picking up work piece platform 42 and the blue diaphragm 41
Thimble 44, using the thimble 44 by the chip jack-up on blue diaphragm 41, is easy to picking up for the first pick-up head 33a
Take.
It is preferred that please continue to refer to Fig. 1, the alignment station 50 includes being used to carry chip and abandons defect core
The alignment wafer-supporting platform 51 of piece, and for defects detection and the imaging mechanism 52 of alignment.Herein will be with the second pickup
Mechanism 30b is located at the situation of alignment station 50, illustrates the course of work of the mechanism for picking when being directed at station 50：
Second vertical motor 31b starts, and is moved downward along the second guide rail 32b, by the chip on the second pick-up head 33b
It is placed on alignment wafer-supporting platform 51, described 52 pairs of chips of imaging mechanism carry out defects detection and position measurement,
Second vertical motor 31b returns after the completion of detection.
It is preferred that please continue to refer to Fig. 1, the bonding station 60 includes being used to carry wafer to be bonded or substrate
61 bonding work stage 62, and for limiting the wafer to be bonded or substrate 61 in the bonding work stage 62
On position bonding clamping device 63.The feelings of bonding station 60 will be located at the 3rd mechanism for picking 30c herein
Condition, illustrates the course of work of the mechanism for picking when being bonded station 60：3rd vertical motor 31c starts, along the
Three guide rail 32c are moved downward, by the chip bonding on the 3rd pick-up head 33c to wafer to be bonded or substrate 61
On, the 3rd vertical motor 31c returns after the completion of bonding.
It is preferred that the position deviation that the bonding clamping device 63 is measured according to the imaging mechanism 52 adjusts institute
State the position of wafer to be bonded or substrate 61 in the bonding work stage 62, it is ensured that chip can be bonded to and treat
On the accurate location for being bonded wafer or substrate 61.
So, by three rotations, same chip, which can be realized, picks up chip from blue diaphragm 41, band
Check that the chip whether there is defect to alignment station, and obtain the accurate location of the chip, then will not have
The chip of defect is placed on wafer to be bonded or substrate 61, so as to greatly reduce chip mounter at three
Round action between station, realizes the operating efficiency for improving equipment, and reduce the purpose of cost.
In summary, the automated bonding equipment that the present invention is provided, including a fixed support 10；It is installed on described solid
Electric rotating machine 20 on fixed rack 10, the electric rotating machine 20 drives the fixed support 10 around vertical center
Axle rotates；3n mechanism for picking being fixed on the fixed support 10, the 3n mechanism for picking is with institute
Point symmetry is distributed on the bottom surface of fixed support 10 centered on stating vertical central shaft；And n pickup station 40,
N alignment station 50 and n bonding station 60, the n pickup station 40, n alignment station 50 and
N bonding station 60 is corresponding in turn to the lower section for being arranged in the 3n mechanism for picking in order, wherein, n is
Positive integer.The present invention drives multiple mechanism for picking to be rotated around vertical central shaft by electric rotating machine 20, same
In time, different stations realizes pickup chip, alignment and bond sequence respectively, so as to substantially increase production
Efficiency, and the present invention is simple in construction, cost is low, reliability is high.
Obviously, those skilled in the art can carry out various changes and modification without departing from the present invention's to invention
Spirit and scope.So, if these modifications and variations of the present invention belong to the claims in the present invention and its equivalent
Within the scope of technology, then the present invention is also intended to including these changes and modification.
Claims (9)
1. a kind of automated bonding equipment, it is characterised in that including：
One fixed support；
The electric rotating machine on the fixed support is installed on, the electric rotating machine drives the fixed support around vertical
Central shaft rotates；
3n mechanism for picking being fixed on the fixed support, the 3n mechanism for picking with it is described it is vertical in
Point symmetry is distributed on support bracket fastened bottom surface centered on heart axle；And
N pickup station, n alignment station and n bonding station, the n pickup station, n alignment
Station and n bonding station are corresponding in turn to the lower section for being arranged in the 3n mechanism for picking in order, wherein, n
For positive integer.
2. automated bonding equipment as claimed in claim 1, it is characterised in that the electric rotating machine drives every time
The angle of the fixed support rotation is 360 °/3n.
3. automated bonding equipment as claimed in claim 1, it is characterised in that each mechanism for picking difference
Including vertical motor, guide rail and pick-up head, the guide rail is vertically fixed on the fixed support, described
Vertical motor is installed on the guide rail, and the pick-up head is fixed on the vertical motor, the vertical motor
The pick-up head can be driven to be slided along the guide rail.
4. automated bonding equipment as claimed in claim 3, it is characterised in that each mechanism for picking is also wrapped
A switching mechanism is included, the switching mechanism is arranged between the vertical motor and pick-up head, drive the pickup
Head upset.
5. automated bonding equipment as claimed in claim 1, it is characterised in that the pickup station includes being used for
The picking up work piece platform of the blue diaphragm of carrying, and for limiting position of the blue diaphragm on the picking up work piece platform
Pick up clamping device.
6. automated bonding equipment as claimed in claim 5, it is characterised in that the picking up work piece platform with it is described
Thimble is additionally provided between blue diaphragm.
7. automated bonding equipment as claimed in claim 1, it is characterised in that the alignment station includes being used for
Carrying chip and the alignment wafer-supporting platform for abandoning defective chip, and for defects detection and the imaging mechanism of alignment.
8. automated bonding equipment as claimed in claim 7, it is characterised in that the bonding station includes being used for
The bonding work stage of wafer to be bonded or substrate is carried, and for limiting the wafer to be bonded or substrate described
The bonding clamping device for the position being bonded in work stage.
9. automated bonding equipment as claimed in claim 8, it is characterised in that the bonding clamping device according to
The position deviation that the imaging mechanism is measured adjusts the wafer or substrate to be bonded in the bonding work stage
Position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610113300.XA CN107134421A (en) | 2016-02-29 | 2016-02-29 | A kind of automated bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610113300.XA CN107134421A (en) | 2016-02-29 | 2016-02-29 | A kind of automated bonding equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107134421A true CN107134421A (en) | 2017-09-05 |
Family
ID=59720946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610113300.XA Pending CN107134421A (en) | 2016-02-29 | 2016-02-29 | A kind of automated bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107134421A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108470698A (en) * | 2018-03-27 | 2018-08-31 | 唐人制造（宁波）有限公司 | A kind of workpiece alignment mounting device and its method |
| CN108511362A (en) * | 2017-02-28 | 2018-09-07 | 上海微电子装备（集团）股份有限公司 | A kind of chip bonding device |
| CN109911612A (en) * | 2019-04-23 | 2019-06-21 | 深圳市安思科电子科技有限公司 | A kind of chip picking-up apparatus for the high degree of automation being conveniently replaceable |
| CN110690152A (en) * | 2019-08-28 | 2020-01-14 | 苏州均华精密机械有限公司 | Large-size wafer bonding device |
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| CN103000558A (en) * | 2011-09-15 | 2013-03-27 | 株式会社日立高新技术仪器 | Die bonder and bonding method |
| CN103137502A (en) * | 2013-03-07 | 2013-06-05 | 苏州均华精密机械有限公司 | Chip seaming device |
| CN203118914U (en) * | 2013-03-07 | 2013-08-07 | 苏州均华精密机械有限公司 | Chip jointing device |
| CN103872193A (en) * | 2014-03-15 | 2014-06-18 | 深圳翠涛自动化设备股份有限公司 | Glue coating crystal solidifying method and system thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040003787A (en) * | 2002-07-04 | 2004-01-13 | 한동희 | Bonding Equipment For Anisotropic Conductive Film And Circuit Board Of Flat Panel Display |
| CN102194710A (en) * | 2010-03-04 | 2011-09-21 | 沈亚容 | Rotary die bonding apparatus and methodology thereof |
| CN103000558A (en) * | 2011-09-15 | 2013-03-27 | 株式会社日立高新技术仪器 | Die bonder and bonding method |
| CN103137502A (en) * | 2013-03-07 | 2013-06-05 | 苏州均华精密机械有限公司 | Chip seaming device |
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| CN103872193A (en) * | 2014-03-15 | 2014-06-18 | 深圳翠涛自动化设备股份有限公司 | Glue coating crystal solidifying method and system thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108511362A (en) * | 2017-02-28 | 2018-09-07 | 上海微电子装备（集团）股份有限公司 | A kind of chip bonding device |
| CN108511362B (en) * | 2017-02-28 | 2020-01-24 | 上海微电子装备（集团）股份有限公司 | Chip bonding device |
| CN108470698A (en) * | 2018-03-27 | 2018-08-31 | 唐人制造（宁波）有限公司 | A kind of workpiece alignment mounting device and its method |
| CN109911612A (en) * | 2019-04-23 | 2019-06-21 | 深圳市安思科电子科技有限公司 | A kind of chip picking-up apparatus for the high degree of automation being conveniently replaceable |
| CN110690152A (en) * | 2019-08-28 | 2020-01-14 | 苏州均华精密机械有限公司 | Large-size wafer bonding device |
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Legal Events
| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 201203 Pudong New Area East Road, No. 1525, Shanghai Applicant after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Pudong New Area East Road, No. 1525, Shanghai Applicant before: Shanghai Micro Electronics Equipment Co., Ltd. |
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| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170905 |