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CN107131460B - Vehicle lamps - Google Patents

Vehicle lamps Download PDF

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Publication number
CN107131460B
CN107131460B CN201710089098.6A CN201710089098A CN107131460B CN 107131460 B CN107131460 B CN 107131460B CN 201710089098 A CN201710089098 A CN 201710089098A CN 107131460 B CN107131460 B CN 107131460B
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China
Prior art keywords
heat
circuit board
heat sink
substrate
holding
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Application number
CN201710089098.6A
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Chinese (zh)
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CN107131460A (en
Inventor
安田雄治
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Koito Manufacturing Co Ltd
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Koito Manufacturing Co Ltd
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Publication of CN107131460A publication Critical patent/CN107131460A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
    • B60Q1/0029—Spatial arrangement
    • B60Q1/0041—Spatial arrangement of several lamps in relation to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/10—Arrangement of heat-generating components to reduce thermal damage, e.g. by distancing heat-generating components from other components to be protected
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
    • B60Q1/02—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments
    • B60Q1/04—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments the devices being headlights
    • B60Q1/06—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments the devices being headlights adjustable, e.g. remotely-controlled from inside vehicle
    • B60Q1/068—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments the devices being headlights adjustable, e.g. remotely-controlled from inside vehicle by mechanical means
    • B60Q1/0683—Adjustable by rotation of a screw
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F21S41/192—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/60—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution
    • F21S41/65—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources
    • F21S41/663—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources by switching light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/49—Attachment of the cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/32—Optical layout thereof
    • F21S41/321—Optical layout thereof the reflector being a surface of revolution or a planar surface, e.g. truncated
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/32—Optical layout thereof
    • F21S41/36—Combinations of two or more separate reflectors
    • F21S41/365—Combinations of two or more separate reflectors successively reflecting the light

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

本发明提供一种车辆用灯具，其能够以简单的结构将涂敷型的导热部件配置于散热部件与电路基板之间而确保绝缘性和导热性。车辆用灯具的特征在于，具有：电路基板(14)，其具备表面和背面，且在所述表面搭载有发光元件(18a)；散热部件(51)，其配置为与所述电路基板(14)对置；间隔件(26)，其位于所述电路基板(14)与所述散热部件(51)之间，且对所述电路基板(14)与所述散热部件(51)之间的间隔进行保持；以及涂敷型的导热部件(30)，其配置于所述电路基板(14)与所述散热部件(51)之间、且具有绝缘性。

Figure 201710089098

The present invention provides a vehicle lamp capable of securing insulation and thermal conductivity by arranging a coating-type thermally conductive member between a heat dissipation member and a circuit board with a simple structure. A vehicle lamp is characterized by comprising: a circuit board (14) having a front surface and a back surface, on which a light-emitting element (18a) is mounted; ) opposite; spacer (26), which is located between the circuit substrate (14) and the heat dissipation member (51), and is opposite to the space between the circuit substrate (14) and the heat dissipation member (51). space is maintained; and a coating-type thermally conductive member (30) is disposed between the circuit board (14) and the heat dissipation member (51) and has insulating properties.

Figure 201710089098

Description

Vehicle lamp
Cross Reference to Related Applications
This application claims priority to japanese patent application 2016-.
Technical Field
The present invention relates to a vehicle lamp, and more particularly to a vehicle lamp in which a light emitting element is mounted on a circuit board and heat is dissipated from the circuit board by a heat dissipating member.
Background
Conventionally, there has been proposed a vehicle lamp using a Light Emitting element such as an LED (Light Emitting Diode) as a Light source. The light emitting element tends to generate heat and increase in temperature with light emission, and its light emission efficiency is affected by temperature. Therefore, in the conventional vehicle lamp, in order to control the temperature of the light emitting element in a range suitable for light emission, the heat from the light emitting element is transferred to the heat dissipating member to dissipate the heat, thereby suppressing the temperature increase.
For example, patent document 1 discloses a vehicle lamp in which a light emitting diode is mounted on a circuit board so as to face a reflector (reflector), and light is irradiated forward of a vehicle. Further, a light source support member made of aluminum for dissipating heat generated by the light emitting diode is used as a heat sink, and the heat sink is brought into contact with the back surface of the circuit board, whereby heat is dissipated from the light emitting diode to the outside through the circuit board from the heat sink.
In such a conventional technique, in order to efficiently conduct heat between the respective members, a heat-conducting member having good heat conductivity is generally interposed between the heat sink and the circuit board. In addition, since the wiring layer is also formed on the back surface side of the circuit board, it is also required to ensure insulation between the metal heat sink and the circuit board.
As such a heat conductive member having both good heat conductivity and insulation properties, a heat conductive sheet molded in advance into a sheet shape is exemplified. However, since a process of attaching the thermally conductive sheet is required, the number of assembling steps increases and workability deteriorates, and since the thermally conductive sheet is expensive, the manufacturing cost increases. In the case of using the heat conductive sheet, the heat sink and the circuit board are held in a state in which the heat conductive sheet is compressed by applying a predetermined pressure while the heat conductive sheet is sandwiched between the heat sink and the circuit board. In this case, since the resin substrate serving as the circuit substrate is pressed by the heat conductive sheet from the back side, there are problems as follows: the substrate is warped, and the position of the light emitting element is displaced from the focal point of the reflector, which makes adjustment for obtaining a desired light irradiation range complicated.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2012 and 064493
Disclosure of Invention
Problems to be solved by the invention
If an application-type member such as a thermally conductive grease or a thermally conductive adhesive is used as the thermally conductive member in order to prevent warpage of the substrate due to the thermally conductive sheet, the thermally conductive member is sandwiched between the heat sink and the circuit board and is spread thinly, and there is a possibility that the heat sink and the circuit board directly contact each other to cause conduction between the wiring layer and the heat sink. Further, if the distance between the heat sink and the circuit board is kept large in order to ensure insulation between the heat sink and the circuit board, thermal conductivity is deteriorated.
Therefore, in order to ensure thermal conductivity and insulation, it is necessary to maintain the distance between the heat sink and the circuit board appropriately. However, patent document 1 does not disclose a structure for appropriately maintaining the distance between the heat sink and the circuit board, and it is difficult to interpose a coating-type heat-conductive member such as a heat-conductive grease or a heat-conductive adhesive between the heat sink and the circuit board.
Further, since a metal material such as aluminum is used as a heat sink by press working, and a flat resin substrate is also used as a circuit board, it is difficult to perform fine working for securing a fine space of several micrometers to several millimeters between the heat sink and the circuit board.
Accordingly, an object of the present invention is to provide a vehicle lamp in which an application-type heat conductive member can be disposed between a heat dissipating member and a circuit board with a simple structure, and insulation properties and heat conductivity can be ensured.
Means for solving the problems
In order to solve the above problem, a vehicle lamp according to the present invention includes: a circuit board having a front surface and a back surface, the front surface being mounted with a light-emitting element; a heat dissipation member disposed to face the circuit substrate; a spacer that is positioned between the circuit board and the heat dissipation member and that maintains a gap between the circuit board and the heat dissipation member; and a coating-type heat-conductive member that is disposed between the circuit board and the heat-dissipating member and has an insulating property.
In the vehicle lamp according to the present invention, the spacer is provided between the circuit board and the heat radiating member to maintain the space therebetween, and the application-type heat conductive member having the insulating property is interposed therebetween, whereby the insulating property and the heat conductivity can be ensured with a simple configuration.
In one embodiment of the present invention, the coated heat conductive member is a heat conductive grease or a heat conductive adhesive.
In one aspect of the present invention, the coating-type heat conductive member contains a filler, and the distance between the circuit board and the heat dissipating member is larger than the maximum particle diameter of the filler.
In one aspect of the present invention, the circuit board holding member is provided to hold the circuit board, and the spacer is formed integrally with the circuit board holding member.
In one aspect of the present invention, the spacer is a boss formed to protrude from the circuit board holding member.
In one aspect of the present invention, the bosses have a multi-step shape including a first holding portion and a second holding portion, the first holding portion being in contact with the circuit board, and the second holding portion being in contact with the heat dissipating member.
In one embodiment of the present invention, the circuit board holding member is a reflector having a reflecting surface that reflects light from the light emitting element.
In one aspect of the present invention, the heat dissipating member is held by a heat dissipating member holding portion, and the spacer is a boss which is formed to protrude from the heat dissipating member holding portion and is in contact with the back surface.
Effects of the invention
In the present invention, it is possible to provide a vehicle lamp in which an application-type heat-conductive member is disposed between a heat-dissipating member and a circuit board with a simple structure, and insulation properties and heat conductivity are ensured.
Drawings
Fig. 1 is a schematic front view of a vehicle lamp 10 in a first embodiment.
Fig. 2 is a sectional view a-a' of the vehicular lamp 10 shown in fig. 1.
Fig. 3 is a schematic perspective view showing the top surface of the high-beam reflector unit 16 in the first embodiment.
Fig. 4 is a view showing the holding of the high-beam substrate 14 and the high-beam heat sink 51 by the heat sink holding bosses 23a and 23B in the first embodiment, and is a partially enlarged cross-sectional view schematically showing a region B surrounded by a circle in fig. 1.
Fig. 5 is a schematic diagram showing the holding of the high-beam substrate 14 and the high-beam heat sink 51 by the heat sink holding bosses 23a and 23b in the second embodiment.
Fig. 6 is a schematic diagram showing the holding of the high-beam substrate 14 and the high-beam heat sink 51 by the heat sink holding bosses 23a and 23b in the third embodiment.
Fig. 7 is a schematic view of the holding of the high-beam substrate 14 and the high-beam heat sink 51 by the heat sink holding bosses 23a and 23b in the fourth embodiment.
Fig. 8 is a schematic view of the holding of the high-beam substrate 14 and the high-beam heat sink 51 by the heat sink holding bosses 23a and 23b in the fifth embodiment.
Detailed Description
(first embodiment)
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The same or equivalent components, members and processes shown in the drawings are denoted by the same reference numerals, and overlapping descriptions will be omitted as appropriate. In the present specification, when words such as "up", "down", "front", "rear", "left", "right", "inner", "outer" and the like indicating directions are used, these words indicate directions in a posture when the vehicle lamp is mounted on a vehicle.
Fig. 1 is a schematic front view of a vehicle lamp 10 according to an embodiment of the present invention. Fig. 2 is a sectional view a-a' of the vehicle lamp 10 shown in fig. 1. The vehicle lamp 10 shown in fig. 1 is a headlamp in which one headlamp is disposed on each of the left and right sides of the front portion of the vehicle, and the structure is substantially the same on the left and right sides.
As shown in fig. 1 and 2, the vehicle lamp 10 includes: a lamp body 11; and a transparent cover 12 covering the front surface opening of the lamp body 11. The lamp body 11 and the outer cover 12 form a lamp chamber 13. The cover 12 is formed in a shape that mimics the shape of a nose (slant nose) of a vehicle, and is inclined toward the rear of the vehicle from the inside to the outside of the vehicle. Therefore, the lamp chamber 13 formed by the lamp body 11 and the outer cover 12 is formed as a space inclined toward the vehicle rear from the vehicle inside to the outside.
A lamp unit 50 is accommodated in the lamp chamber 13. The lamp unit 50 is configured to irradiate a high beam light distribution pattern and a low beam light distribution pattern. The lamp unit 50 includes a high beam substrate 14, a low beam substrate 15, a high beam reflector unit 16, a low beam reflector unit 17, a high beam heat sink 51, a low beam heat sink 52, and a bracket 53.
The high beam reflector unit 16 and the low beam reflector unit 17 are arranged in the vehicle width direction. The high beam reflector unit 16 is disposed on the vehicle inner side, and the low beam reflector unit 17 is disposed on the vehicle outer side.
The high beam reflector unit 16 is a reflector group for high beam irradiation, and includes three parabolic reflectors, i.e., a high beam diffusing reflector 16a, a first high beam converging reflector 16b, and a second high beam converging reflector 16 c. The three reflectors are integrally formed. Of these three reflectors, the high beam diffusing reflector 16a is provided on the innermost side of the vehicle, the first high beam converging reflector 16b is provided on the outer side of the high beam diffusing reflector 16a, and the second high beam converging reflector 16c is provided on the outer side of the first high beam converging reflector 16 b.
The high beam diffusing reflector 16a, the first high beam converging reflector 16b, and the second high beam converging reflector 16c each have a reflection surface 19a to 19c formed with a paraboloid of revolution as a reference. The central axis of rotation of each paraboloid of revolution becomes the optical axis of each reflector. Each reflector is disposed such that the optical axis faces the vehicle front-rear direction (horizontal direction).
The low-beam reflector unit 17 is a reflector group for low-beam irradiation, and is configured to include three parabolic reflectors, i.e., a low-beam diffusing reflector 17a, a first low-beam condensing reflector 17b, and a second low-beam condensing reflector 17 c. The three reflectors are integrally formed. Among the three reflectors, the low-beam diffusing reflector 17a is provided on the innermost side of the vehicle, the first low-beam condensing reflector 17b is provided on the outer side of the low-beam diffusing reflector 17a, and the second low-beam condensing reflector 17c is provided on the outer side of the first low-beam condensing reflector 17 b.
The low-beam diffusion reflector 17a, the first low-beam condensing reflector 17b, and the second low-beam condensing reflector 17c each have a reflection surface 20a to 20c formed with a paraboloid of revolution as a reference. The central axis of rotation of each paraboloid of revolution becomes the optical axis of each reflector. Each reflector is disposed such that the optical axis faces the vehicle front-rear direction (horizontal direction).
The high beam reflector unit 16 and the low beam reflector unit 17 are formed by performing aluminum vapor deposition on the inner surface of a resin molded base material.
The high-beam substrate 14 is supported on the upper surface of the high-beam reflector unit 16. Three LEDs (the first LED18a to the third LED18c) are mounted on the high beam substrate 14 such that the light-emitting surfaces thereof face downward. The first LED18a to the third LED18c emit light upon receiving the current supplied from the high beam substrate 14. The first to third LEDs 18a to 18c are LEDs for high beam irradiation. The first LED18a is disposed at the focal point of the reflection surface 19a of the high beam diffusing reflector 16 a. The second LED18b is disposed at the focal point of the reflecting surface 19b of the first high-beam condensing reflector 16 b. The third LED18c is disposed at the focal point of the second high-beam condensing reflector 16 c. On the upper surface of the high beam reflector unit 16, holes for guiding the light from the LEDs to the reflection surfaces of the reflectors are formed.
The low beam base plate 15 is supported on the upper surface of the low beam reflector unit 17. The three LEDs (the fourth LED18d to the sixth LED18f) are mounted on the low beam substrate 15 such that the light-emitting surface faces downward. The fourth LED18d to the sixth LED18f emit light upon receiving the current supplied from the low beam substrate 15. The fourth LED18d to the sixth LED18f are LEDs for low beam irradiation. The fourth LED18d is disposed at the focal point of the reflection surface 20a of the low beam diffusing reflector 17 a. The fifth LED18e is disposed at the focal point of the reflection surface 20b of the first low beam converging reflector 17 b. The sixth LED18f is disposed at the focal point of the second low beam converging reflector 17 c. On the upper surface of the low beam reflector unit 17, holes for guiding light from the LEDs to the reflecting surfaces of the reflectors are formed.
The high beam substrate 14 and the low beam substrate 15 correspond to the circuit substrate of the present invention, and these substrates are flat plate-shaped members formed of glass epoxy resin or the like having wiring layer patterns formed on the front and rear surfaces thereof.
The high-beam heat sink 51 is supported on the back surface (surface facing the component mounting surface) of the high-beam substrate 14 via an insulating coating-type heat conductive member 30. The high-beam heat sink 51 is a heat sink made of, for example, an aluminum plate, and has a function of dissipating heat generated from the first to third LEDs 18a to 18c mounted on the high-beam substrate 14.
The low-beam heat dissipation plate 52 is supported on the rear surface side of the low-beam substrate 15 via an insulating coating-type heat conductive member 30. The low-beam heat dissipation plate 52 is also a heat dissipation member formed of, for example, an aluminum plate, and has a function of dissipating heat generated from the fourth LED18d to the sixth LED18f mounted on the low-beam substrate 15.
The high beam heat sink 51 and the low beam heat sink 52 correspond to the heat dissipation members in the present invention, and in the present embodiment, a member formed by pressing a metal plate such as aluminum is used. Here, an example in which the heat dissipation member is formed by press working of a metal plate is shown, but other materials and processing methods may be used. The high-beam heat sink 51 and the low-beam heat sink 52 are formed by press working a metal plate, and thus the high-beam heat sink 51 and the low-beam heat sink 52 as heat dissipation members can be reduced in weight and cost.
As will be described later, the heat radiation plate holding bosses 23a to 23c and 23d to 23f hold the heat radiation plate 51 for high beam and the heat radiation plate 52 for low beam so as to maintain a small gap 31 between the substrate 14 for high beam and the substrate 15 for low beam, respectively, and the heat conductive member 30 is disposed in a region corresponding to the back side of the first to third LEDs 18a to 18c and the fourth to sixth LEDs 18d to 18f in the gap 31.
The heat conductive member 30 is made of an insulating coating-type material, and is formed by coating on the front surface or the back surface of any of the high beam substrate 14, the low beam substrate 15, the high beam heat sink 51, and the low beam heat sink 52. Here, the coating type is a material that can be rolled between a substrate and a heat dissipation plate by supplying a material having fluidity onto an object by spraying, dropping, or a doctor blade, and includes a case where viscosity is increased after coating and a case where the material is solidified. The material having fluidity includes materials in liquid, gel, paste, etc., mixtures of these forms, and materials containing other fine particles. Examples of the heat conductive member 30 include a heat conductive grease and a heat conductive adhesive.
In the present embodiment, the low-beam heat sink 52 includes a partially overlapping portion 52a extending so as to overlap a part of the high-beam heat sink 51. The partial overlapping portion 52a may abut against a part of the overlapped high-beam heat-dissipating plate 51. By providing such a partial overlap portion 52a, the heat radiation area of the low-beam heat radiation plate 52 is increased, and therefore the heat radiation performance of the fourth to sixth LEDs 18d to 18f can be improved.
The bracket 53 is formed of, for example, a resin material, and includes: the frame portion 53 a; a first projecting portion 53b and a second projecting portion 53c projecting rearward from an upper portion of the frame portion 53 a; and a third projecting portion 53d projecting rearward from a lower portion of the frame portion 53 a. The frame portion 53a accommodates the high beam reflector unit 16 and the low beam reflector unit 17 therein, and supports them in a state aligned in the vehicle width direction. The frame portion 53a covers only the front portions of the high beam heat sink 51 and the low beam heat sink 52, and the other portions (except for the portions covered with the first to third projecting portions) are exposed. This is to improve heat dissipation of the high beam heat sink 51 and the low beam heat sink 52.
The first tilting member 55 is attached to the first extension portion 53b of the bracket 53, the second tilting member 56 is attached to the second extension portion 53c, and the third tilting member 57 is attached to the third extension portion 53 d. The first tilting member 55, the second tilting member 56, and the third tilting member 57 have a function of supporting the bracket 53 on the lamp main body 11 and tilting the bracket 53 for adjusting the optical axis (aiming adjustment).
As shown in fig. 2, the first tilting member 55 includes: an aiming screw 55a attached to the rear surface portion 11a of the lamp body 11; a screw portion 55b provided to the first protruding portion 53b of the bracket 53; and an adjusting portion 55c provided outside the lamp body 11. Further, the third tilting member 57 includes: a ball joint 57a attached to the back surface portion 11a of the lamp body 11; and a socket 57b that holds a ball (ball) of the socket joint 57 a. The ball socket 57b is inserted and supported in a hole provided in the third extension 53d of the bracket 53. The second tilting member 56 also includes, in the same manner as the third tilting member 57: a ball joint attached to the back surface portion 11a of the lamp body 11; and a socket that holds the spherical body of the socket joint. The ball socket is inserted and supported in a hole provided in the second extension 53c of the bracket 53.
When the aiming screw 55a of the first tilting member 55 is rotated by the adjusting portion 55c of the first tilting member 55, the bracket 53 is tilted in the vertical direction with respect to the lamp main body 11 with the sphere of the ball joint 57a of the third tilting member 57 as a fulcrum, and the bracket 53 is tilted in the horizontal direction with respect to the lamp main body 11 with the sphere of the ball joint of the second tilting member 56 as a fulcrum. By tilting the bracket 53 vertically and horizontally with respect to the lamp body 11 in this way, the optical axis of the lamp unit 50 can be adjusted.
Fig. 3 is a schematic perspective view showing the top surface of the high-beam reflector unit 16 in the present embodiment. The low-beam reflector unit 17 has the same configuration, and redundant description thereof will be omitted. As shown in fig. 3, the top plate 21 is provided on the high-beam reflector unit 16 so as to cover the upper portions of the reflection surfaces 19a to 19c, and the top plate 21 is formed with openings 22a to 22c, heat-radiating-plate holding bosses 23a to 23c, and heat-caulking bosses 24a to 24 d.
The openings 22a to 22c are formed in regions corresponding to the first LED18a to the third LED18c, and as described above, the openings 22a to 22c are holes for guiding light from the LEDs to the reflection surfaces of the reflectors. Although the present embodiment shows an example in which three LEDs and three openings 22a to 22c are provided, the number of the LEDs is not limited. Although one LED is disposed in each of the openings 22a to 22c, a plurality of LEDs may be disposed in each opening.
The heat sink holding bosses 23a to 23c are bosses formed to protrude above the top plate 21, and are portions for holding the high-beam substrate 14 and the high-beam heat sink 51. Therefore, the heat sink holding bosses 23a to 23c function as spacers for forming the gap 31 by keeping a predetermined distance between the high-beam substrate 14 and the high-beam heat sink 51. As shown in fig. 3, the heat sink holding bosses 23a to 23c are provided at least at three locations on the top plate 21 and are arranged so as not to be aligned on a straight line, and therefore, the surfaces of the high-beam substrate 14 and the high-beam heat sink 51 held by the three heat sink holding bosses 23a to 23c are determined.
In the present embodiment, the high-beam reflector unit 16 is formed integrally with the heat-dissipating plate holding bosses 23a to 23c, and functions as both a circuit board holding member that holds a circuit board and a heat-dissipating member holding portion that holds a heat-dissipating member. The detailed structure of the heat sink holding bosses 23a to 23c and the holding of the high-beam substrate 14 and the high-beam heat sink 51 will be described later.
The thermal caulking bosses 24a to 24d are bosses formed to protrude above the top plate 21 and inserted into holes provided at corresponding positions of the high-beam substrate 14 or the high-beam heat sink 51. The bosses 24a to 24d for heat caulking are formed to have a height of a degree of protruding from the holes, and the protruding tip portions are heated and pressed to be plastically deformed, thereby heat caulking the holes to cover the holes and fixing the high beam substrate 14 or the high beam heat radiation plate 51.
Fig. 4 is a view showing the holding of the high-beam substrate 14 and the high-beam heat sink 51 by the heat sink holding bosses 23a and 23B, and is a partially enlarged cross-sectional view schematically showing a region B surrounded by a circle in fig. 1. The heat sink holding bosses 23a and 23b are formed in a multi-step shape having a plurality of steps with different diameters, and are formed from a circuit board contact step portion 25, a heat sink contact step portion 26, and a thermal caulking step portion 27 from below.
The high beam substrate 14 is provided with holes having a diameter substantially equal to the diameter of the heat sink contact stepped portion 26 at positions corresponding to the heat sink holding bosses 23a and 23b, and the heat sink contact stepped portion 26 is inserted into the holes in a position opposite to each other. Thus, the upper surface of the circuit board contact stepped portion 25 is in contact with the lower surface of the high-beam substrate 14, and the high-beam substrate 14 is held by the circuit board contact stepped portion 25. In addition, the high-beam heat sink 51 is also provided with holes having a diameter substantially equal to the diameter of the heat-caulking stepped portion 27 at positions corresponding to the heat- sink holding bosses 23a and 23b, and the heat-caulking stepped portion 27 is inserted into the holes in a confronting relationship. Thus, the upper surface of the heat sink contact step portion 26 is in contact with the lower surface of the high-beam heat sink 51, and the high-beam heat sink 51 is held by the heat sink contact step portion 26.
Here, the lateral position of the high-beam substrate 14 is determined by the hole of the high-beam substrate 14 and the heat sink contact step portion 26, and the lateral position of the high-beam heat sink 51 is determined by the hole of the high-beam heat sink 51 and the heat caulking step portion 27. Although the example in which the heat-radiating plate contact step portion 26 and the hole provided in the high-beam substrate 14 have substantially the same diameter and the heat-caulking step portion 27 and the hole provided in the high-beam heat-radiating plate 51 have substantially the same diameter is shown, the diameter may be set to have a certain degree of clearance as long as the steps of the multi-step shape can be inserted.
A part of the tip of the heat caulking stepped portion 27 protrudes from the hole of the high beam heat radiation plate 51, the protruding tip portion is heated and pressed to be plastically deformed to form a tip deformed portion 28 covering the hole, and the high beam heat radiation plate 51 is fixed in the height direction by the heat radiation plate contacting the upper surface of the stepped portion 26 and the tip deformed portion 28. The high beam substrate 14 is provided with holes at positions corresponding to the thermal caulking bosses 24a, 24b, and the high beam substrate 14 is fixed in the height direction by the upper surface of the circuit board contact step portion 25 and the thermal caulking bosses 24a, 24b by inserting the thermal caulking bosses 24a, 24b into the holes and thermally caulking the distal end portions. Interference prevention holes 51a and 51b are also formed in the high-beam heat sink 51 at positions corresponding to the heat caulking bosses 24a and 24b, thereby preventing the high-beam heat sink 51 from interfering with the heat caulking bosses 24a and 24 b.
When the lamp unit 50 is assembled, the heat sink holding bosses 23a and 23b and the heat caulking bosses 24a and 24b are inserted into the respective holes provided in the high-beam substrate 14 in a aligned manner, and the distal ends of the heat caulking bosses 24a and 24b are fixed by heat caulking. Then, the heat-conductive member 30 is applied to the back surface side of the high-beam substrate 14, the heat-caulking stepped portion 27 is inserted into the hole of the high-beam heat-radiating plate 51 in a confronting manner, and the tip end of the heat-caulking stepped portion 27 is fixed by heat caulking.
As shown in fig. 4, the top plate 21 has heat sink holding bosses 23a and 23b formed in a protruding manner, and the high-beam substrate 14 and the high-beam heat sink 51 are held by the heat sink holding bosses 23a and 23b with a gap 31 therebetween. The first LED18a is mounted on the high beam substrate 14 so as to face downward above the region of the opening 22a provided in the top plate 21, and faces the reflection surface 19a, not shown. The heat-conducting member 30 is applied to the back surface side of the region of the gap 31 where the first LED18a is mounted, and the heat-conducting member 30 is sandwiched between the high-beam substrate 14 and the high-beam heat-radiating plate 51, and the heat-conducting member 30 is rolled so as to be in contact with both of them.
As described above, in the present embodiment, the heat-radiating plate holding bosses 23a and 23b have a multi-step shape, and the height difference between the circuit-board contact step portion 25 and the heat-radiating plate contact step portion 26 corresponds to the sum of the thickness of the high-beam substrate 14 and the distance of the gap 31. Therefore, the heat sink contact step portion 26 functions as a spacer that is positioned between the high-beam substrate 14 and the high-beam heat sink 51 to maintain the gap 31. The interval of the gap 31 is preferably large enough to ensure insulation between the back surface of the high-beam substrate 14 and the high-beam heat sink 51 and small enough to improve thermal conductivity, and more specifically, preferably ranges from 0.05mm to 1.5 mm.
When a material containing a filler as fine particles of a thermally conductive material is used as the coating-type thermally conductive member 30, the interval of the gap 31 is preferably larger than the maximum particle diameter of the filler. This can avoid the problem that the height direction of the high-beam heat sink 51 becomes unstable due to the filler contained at a larger interval than the gap 31.
In the present embodiment, the heat sink holding bosses 23a to 23c are integrally molded with the top plate 21 of the high-beam reflector unit 16 by resin, so that the shape can be processed with high accuracy in units of several micrometers, and the manufacturing process and structure can be simplified to reduce the cost. Further, since the shapes of the high-beam substrate 14 and the high-beam heat sink 51 can be simplified and the heat sink can be molded by press working, the manufacturing process and the structure can be simplified and the cost can be reduced. Further, by forming the distal ends of the heat sink holding bosses 23a to 23c as the heat caulking stepped portions 27, heat caulking can be adopted as a fastening method of the heat sink 51 for high beam, and reduction in the number of components, downsizing, and simplification of the manufacturing process can be achieved.
Therefore, in the vehicle lamp 10 of the present embodiment, the gap 31 between the back surface of the high-beam substrate 14 and the high-beam heat sink 51 can be ensured with a simple configuration, and the insulating property and the thermal conductivity can be ensured by disposing the coating-type heat conductive member 30. This prevents warping of the circuit board and the heat dissipation member that occurs when using a preformed heat conductive sheet, and prevents the light distribution characteristics from deteriorating due to the light emitting element being displaced from the focal position of the reflector reflection surface.
(second embodiment)
Next, a second embodiment of the present invention will be described with reference to fig. 5. Description of portions overlapping with the first embodiment will be omitted. Fig. 5 is a schematic view showing the holding of the high-beam substrate 14 and the high-beam heat sink 51 by the heat sink holding bosses 23a and 23B in the second embodiment, and is a partially enlarged cross-sectional view schematically showing a region B surrounded by a circle in fig. 1. The present embodiment differs from the first embodiment in that a separate washer is used as a spacer to secure the gap 31 between the high-beam substrate 14 and the high-beam heat sink 51.
The heat sink holding bosses 23a and 23b are formed in a multi-step shape having a plurality of steps with different diameters, and are composed of a circuit board contact step portion 25 and a thermal caulking step portion 27 from below. Further, a spacer 29 as a spacer is disposed between the high-beam substrate 14 and the high-beam heat sink 51, so that a gap 31 is secured between the rear surface of the high-beam substrate 14 and the high-beam heat sink 51. The heat-conducting member 30 is applied to the back surface side of the region of the gap 31 where the first LED18a is mounted, and the heat-conducting member 30 is sandwiched between the high-beam substrate 14 and the high-beam heat-radiating plate 51, and the heat-conducting member 30 is rolled so as to be in contact with both of them.
The high-beam substrate 14 and the high-beam heat sink 51 are provided with holes having a diameter substantially equal to that of the heat-caulking stepped portion 27 at positions corresponding to the heat sink holding bosses 23a and 23b, and the heat-caulking stepped portion 27 is inserted into the holes and the gasket 29 in a confronting relationship. Thus, the upper surface of the circuit board contact stepped portion 25 is in contact with the lower surface of the high-beam substrate 14, and the high-beam substrate 14 is held by the circuit board contact stepped portion 25.
Here, the lateral positions of the high-beam substrate 14 and the high-beam heat sink 51 are determined by the holes of the high-beam substrate 14 and the high-beam heat sink 51 and the heat caulking stepped portion 27. Although the hole provided in the high-beam substrate 14 and the high-beam heat-radiating plate 51 and the thermally caulking stepped portion 27 have substantially the same diameter, the hole may have a diameter having a certain degree of clearance as long as the steps of the multi-step shape can be inserted.
A part of the tip of the heat caulking stepped portion 27 protrudes from the hole of the high beam heat radiation plate 51, and the protruding tip portion is heated and pressed to be plastically deformed, thereby forming a tip deformed portion 28 covering the hole. Thereby, the high-beam substrate 14, the gasket 29, and the high-beam heat sink 51 are fixed in the height direction by the upper surface of the circuit board contact step portion 25 and the distal end deforming portion 28.
As described above, in the present embodiment, the gasket 29 functions as a spacer positioned between the high-beam substrate 14 and the high-beam heat sink 51 to maintain the gap 31. The thickness of the gasket 29 that determines the interval of the gap 31 is preferably large enough to ensure insulation between the back surface of the high-beam substrate 14 and the high-beam heat sink 51 and small enough to achieve good thermal conductivity, and more specifically, preferably in the range of 0.05mm to 1.5 mm. In the present embodiment, the gap 31 for disposing the application-type heat-conductive member 30 can be ensured only by inserting the thermally caulking stepped portion 27 into the hole of the high-beam substrate 14 and inserting the washer 29 into the hole of the high-beam heat-radiating plate 51 while aligning the thermally caulking stepped portion 27, thereby simplifying the manufacturing process and the structure.
In the present embodiment, the heat sink holding bosses 23a to 23c are also integrally molded with the top plate 21 of the high-beam reflector unit 16 by resin, so that the manufacturing process and the structure can be simplified and the cost can be reduced. Further, since the shapes of the high-beam substrate 14 and the high-beam heat sink 51 can be simplified and the heat sink can be molded by press working, the manufacturing process and the structure can be simplified and the cost can be reduced. Further, by forming the distal ends of the heat sink holding bosses 23a to 23c as the heat caulking stepped portions 27, heat caulking can be adopted as a fastening method of the heat sink 51 for high beam, and reduction in the number of components, downsizing, and simplification of the manufacturing process can be achieved.
Therefore, in the vehicle lamp 10 of the present embodiment, the gap 31 between the back surface of the high-beam substrate 14 and the high-beam heat sink 51 can be ensured with a simple configuration, and the coating-type heat conductive member 30 can be disposed to ensure insulation and thermal conductivity. This prevents warping of the circuit board and the heat dissipation member that occurs when using a preformed heat conductive sheet, and prevents the light distribution characteristics from deteriorating due to the light emitting element being displaced from the focal position of the reflector reflection surface.
(third embodiment)
Next, a third embodiment of the present invention will be described with reference to fig. 6. Description of portions overlapping with the first embodiment will be omitted. Fig. 6 is a schematic view showing the holding of the high-beam substrate 14 and the high-beam heat sink 51 by the heat sink holding bosses 23a and 23B in the third embodiment, and is a partially enlarged cross-sectional view schematically showing a region B surrounded by a circle in fig. 1. In the present embodiment, the circuit board contact stepped portion 25 and the heat dissipation plate contact stepped portion 26 are formed in different regions, which is different from the first embodiment.
The heat sink holding bosses 23a and 23b are formed in a plurality of boss shapes having different heights and formed protruding above the top plate 21, and are formed by a circuit board contact step portion 25, a heat sink contact step portion 26, and a heat caulking step portion 27 from a step having a lower height. The heat radiation plate contact step portion 26 and the heat caulking step portion 27 are formed in a multi-step shape having different diameters. The circuit board contact step portion 25 is provided with the thermal caulking bosses 24a and 24b, and is formed in a multi-step shape having different diameters. Here, although the example of the multi-step shape in which the circuit board contact stepped portion 25 is provided with the thermal caulking bosses 24a, 24b is shown, the circuit board contact stepped portion 25 and the thermal caulking bosses 24a, 24b may be provided in different regions of the top plate 21.
The high beam substrate 14 is provided with holes having a diameter substantially equal to the diameter of the heat sink contact stepped portion 26 at positions corresponding to the heat sink holding bosses 23a and 23b, and the heat sink contact stepped portion 26 is inserted into the holes in a position opposite to each other. In addition, the high-beam heat sink 51 is also provided with holes having a diameter substantially equal to the diameter of the heat-caulking stepped portion 27 at positions corresponding to the heat- sink holding bosses 23a and 23b, and the heat-caulking stepped portion 27 is inserted into the holes in a confronting relationship. Thus, the upper surface of the heat sink contact step portion 26 is in contact with the lower surface of the high-beam heat sink 51, and the high-beam heat sink 51 is held by the heat sink contact step portion 26.
A part of the tip of the heat caulking stepped portion 27 protrudes from the hole of the high beam heat radiation plate 51, the protruding tip portion is heated and pressed to be plastically deformed to form a tip deformed portion 28 covering the hole, and the high beam heat radiation plate 51 is fixed in the height direction by the heat radiation plate contacting the upper surface of the stepped portion 26 and the tip deformed portion 28.
The upper surface of the circuit board contact stepped portion 25 provided on the top plate 21 so as to protrude from the heat sink contact stepped portion 26 is in contact with the lower surface of the high-beam substrate 14, and holds the high-beam substrate 14. The high beam substrate 14 is provided with holes at positions corresponding to the heat caulking bosses 24a, 24b, and the high beam substrate 14 is fixed in the height direction by the upper surface of the circuit board contact step portion 25 and the heat caulking bosses 24a, 24b by inserting the heat caulking bosses 24a, 24b into the holes and heat caulking the distal ends of the heat caulking bosses 24a, 24 b. Interference prevention holes 51a and 51b are also formed in the high-beam heat sink 51 at positions corresponding to the heat caulking bosses 24a and 24b, thereby preventing the high-beam heat sink 51 from interfering with the heat caulking bosses 24a and 24 b.
As described above, in the present embodiment, the heat-radiating- plate holding bosses 23a and 23b have a plurality of boss shapes having different heights, and the difference in height between the circuit-board contact stepped portion 25 and the heat-radiating-plate contact stepped portion 26 corresponds to the sum of the thickness of the high-beam substrate 14 and the distance of the gap 31. Therefore, the heat sink contact step portion 26 functions as a spacer that is positioned between the high-beam substrate 14 and the high-beam heat sink 51 to maintain the gap 31. The heat-conducting member 30 is applied to the back surface side of the region of the gap 31 where the first LED18a is mounted, and the heat-conducting member 30 is sandwiched between the high-beam substrate 14 and the high-beam heat-radiating plate 51, and the heat-conducting member 30 is rolled so as to be in contact with both of them.
In the present embodiment, the heat radiation plate holding bosses 23a to 23c are also integrally molded with the top plate 21 of the high beam reflector unit 16 by resin, so that the shape can be processed with high accuracy in units of several micrometers, and the manufacturing process and structure can be simplified to reduce the cost. Further, since the shapes of the high-beam substrate 14 and the high-beam heat sink 51 can be simplified and the heat sink can be molded by press working, the manufacturing process and the structure can be simplified and the cost can be reduced. Further, by forming the distal ends of the heat sink holding bosses 23a to 23c as the heat caulking stepped portions 27, heat caulking can be adopted as a fastening method of the heat sink 51 for high beam, and reduction in the number of components, downsizing, and simplification of the manufacturing process can be achieved.
Therefore, in the vehicle lamp 10 of the present embodiment, the gap 31 between the back surface of the high-beam substrate 14 and the high-beam heat sink 51 can be ensured with a simple configuration, and the insulating property and the thermal conductivity can be ensured by disposing the coating-type heat conductive member 30. This prevents warping of the circuit board and the heat dissipation member that occurs when using a preformed heat conductive sheet, and prevents the light distribution characteristics from deteriorating due to the light emitting element being displaced from the focal position of the reflector reflection surface.
(fourth embodiment)
Next, a fourth embodiment of the present invention will be described with reference to fig. 7. Description of portions overlapping with the first embodiment will be omitted. Fig. 7 is a schematic view showing the holding of the high-beam substrate 14 and the high-beam heat sink 51 by the heat sink holding bosses 23a and 23B in the fourth embodiment, and is a partially enlarged cross-sectional view schematically showing a region B surrounded by a circle in fig. 1.
As shown in fig. 7, the present embodiment includes a heat radiating member holding portion 32 that is separate from the high-beam reflector unit 16. The heat-dissipating member holding portion 32 is formed with heat-dissipating plate holding bosses 23a to 23c, and the heat-dissipating member holding portion 32 is a member for holding the high-beam substrate 14 and the high-beam heat-dissipating plate 51 from above the high-beam heat-dissipating plate 51. Although the heat dissipation member holding portion 32 is shown to cover the entire surface of the high-beam heat dissipation plate 51 in the drawing, in order to ensure the efficiency of heat dissipation from the high-beam heat dissipation plate 51, it is preferable to provide an opening in the heat dissipation member holding portion 32 in another region not shown in the drawing to expose a part of the upper surface of the high-beam heat dissipation plate 51.
The heat sink holding bosses 23a to 23c are formed in a plurality of boss shapes having different heights and protruding downward from the heat sink holding portion 32, and are formed by a heat sink contact step portion 26, a circuit board contact step portion 25, and a heat caulking step portion 27 from the step having the lower height. The circuit substrate contact step portion 25 and the thermal caulking step portion 27 are formed in a multi-step shape having different diameters. Therefore, the heat sink holding bosses 23a to 23c function as spacers for forming the gap 31 by keeping a predetermined distance between the high-beam substrate 14 and the high-beam heat sink 51.
The high-beam heat sink 51 is provided with holes having diameters substantially equal to the diameters of the heat sink contact stepped portion 26 and the circuit board contact stepped portion 25 at positions corresponding to the heat sink holding bosses 23a and 23b, respectively, and the heat sink contact stepped portion 26 and the circuit board contact stepped portion 25 are inserted into the holes in a aligned manner. Further, the high-beam substrate 14 is also provided with holes having a diameter substantially equal to the diameter of the heat-caulking stepped portion 27 at positions corresponding to the heat-radiating- plate holding bosses 23a and 23b, and the heat-caulking stepped portion 27 is inserted into the holes in a aligned manner. Thus, the lower surface of the circuit board contact stepped portion 25 is in contact with the upper surface (back surface) of the high-beam substrate 14, and the circuit board contact stepped portion 25 holds the high-beam substrate 14.
A part of the tip of the heat caulking stepped portion 27 protrudes from the hole of the high beam substrate 14, and the protruding tip portion is heated and pressed to be plastically deformed to form a tip deformed portion 28 covering the hole, whereby the distance between the low surface of the circuit board contact stepped portion 25 and the tip deformed portion 28 is fixed with respect to the heat radiating member holding portion 32. A part of the distal end of the heat sink contact step portion 26 also protrudes from the hole of the high-beam heat sink 51, and the protruding distal end portion is heated and pressed to be plastically deformed, thereby forming a distal end deforming portion 28 that covers the hole, and fixing the heat sink holding portion 32 and the high-beam heat sink 51 in contact with each other. The high beam substrate 14 is fixed in the height direction by thermally caulking the heat-caulking bosses 24a to 24d protruding from the top plate 21 at holes not shown.
Here, the lateral position of the high-beam substrate 14 is determined by the hole of the high-beam substrate 14 and the thermally caulking stepped portion 27, and the lateral position of the high-beam heat sink 51 is determined by the hole of the high-beam heat sink 51, the circuit substrate contact stepped portion 25, and the heat sink contact stepped portion 26.
As described above, in the present embodiment, the circuit board contact step portion 25 and the thermal caulking step portion 27 are formed in a multi-step shape having different diameters, and the height of the circuit board contact step portion 25 corresponds to the sum of the thickness of the high-beam heat-dissipating plate 51 and the distance of the gap 31. Therefore, the circuit board contact step portion 25 functions as a spacer that is positioned between the high-beam substrate 14 and the high-beam heat sink 51 and maintains the gap 31. The heat-conducting member 30 is applied to the back surface side of the region of the gap 31 where the first LED18a is mounted, and the heat-conducting member 30 is sandwiched between the high-beam substrate 14 and the high-beam heat-radiating plate 51, and the heat-conducting member 30 is rolled so as to be in contact with both of them.
In the present embodiment, the heat-dissipating plate holding bosses 23a to 23c are also integrally molded with the heat-dissipating member holding portion 32 by resin, so that the shape of the heat-dissipating plate holding portion can be processed with high accuracy in a unit of several micrometers, and the manufacturing process and structure can be simplified to reduce the cost. Further, since the shapes of the high-beam substrate 14 and the high-beam heat sink 51 can be simplified and the heat sink can be molded by press working, the manufacturing process and the structure can be simplified and the cost can be reduced. Further, by forming the distal ends of the heat radiation plate holding bosses 23a to 23c as the heat caulking stepped portions 27, heat caulking can be adopted as a fastening method of the high beam substrate 14, and reduction in the number of components, downsizing, and simplification of the manufacturing process can be achieved.
Therefore, in the vehicle lamp 10 of the present embodiment, the gap 31 between the back surface of the high-beam substrate 14 and the high-beam heat sink 51 can be ensured with a simple configuration, and the insulating property and the thermal conductivity can be ensured by disposing the coating-type heat conductive member 30. This prevents warping of the circuit board and the heat dissipation member that occurs when using a preformed heat conductive sheet, and prevents the light distribution characteristics from deteriorating due to the light emitting element being displaced from the focal position of the reflector reflection surface.
(fifth embodiment)
Next, a fifth embodiment of the present invention will be described with reference to fig. 8. Description of portions overlapping with the first embodiment will be omitted. Fig. 8 is a schematic view showing the holding of the high-beam substrate 14 and the high-beam heat sink 51 by the heat sink holding bosses 23a and 23B in the fifth embodiment, and is a partially enlarged cross-sectional view schematically showing a region B surrounded by a circle in fig. 1. The present embodiment is different from the first embodiment in that the high-beam heat sink 51 is disposed between the high-beam substrate 14 and the top plate 21.
The heat sink holding bosses 23a and 23b are formed in a multi-step shape having a plurality of steps with different diameters, and are formed from a lower portion thereof with a heat sink contact step portion 26, a circuit board contact step portion 25, and a thermal caulking step portion 27.
The high-beam heat sink 51 is provided with holes having a diameter substantially equal to the diameter of the circuit board contact step portion 25 at positions corresponding to the heat sink holding bosses 23a and 23b, and the circuit board contact step portion 25 is inserted into the holes in a confronting relationship. Thus, the upper surface of the heat sink contact step portion 26 is in contact with the lower surface of the high-beam heat sink 51, and the high-beam heat sink 51 is held by the heat sink contact step portion 26. The high-beam heat sink 51 has an opening in a region corresponding to the opening 22a of the top plate 21, and the first LED18a is mounted on the high-beam substrate 14 so as to face the reflection surface 19a, not shown, in a downward direction above the region of the opening 22 a.
The rear end side (right side in fig. 2) of the high-beam heat sink 51 may be formed to extend rearward from the high-beam substrate 14 to improve heat dissipation efficiency (not shown). In this case, the extended region of the high-beam heat sink 51 can be bent in the vertical direction by press working to be used as a heat sink fin.
The high beam substrate 14 is also provided with holes having a diameter substantially equal to the diameter of the heat-caulking stepped portion 27 at positions corresponding to the heat-radiating- plate holding bosses 23a and 23b, and the heat-caulking stepped portion 27 is inserted into the holes in a aligned manner. Thus, the upper surface of the circuit board contact stepped portion 25 is in contact with the lower surface of the high-beam substrate 14, and the high-beam substrate 14 is held by the circuit board contact stepped portion 25.
Here, the lateral position of the high-beam substrate 14 is determined by the hole of the high-beam substrate 14 and the heat-caulking stepped portion 27, and the lateral position of the high-beam heat-dissipating plate 51 is determined by the hole of the high-beam heat-dissipating plate 51 and the heat-dissipating plate contact stepped portion 26. Although the example in which the thermally caulking stepped portion 27 and the hole provided in the high-beam substrate 14 have substantially the same diameter and the heat sink contact stepped portion 26 and the hole provided in the high-beam heat sink 51 have substantially the same diameter is shown, the diameter may be set to have a certain degree of clearance as long as the steps of the multi-step shape can be inserted.
A part of the tip of the heat caulking stepped portion 27 protrudes from the hole of the high beam substrate 14, and the protruding tip portion is heated and pressed to be plastically deformed to form a tip deformed portion 28 covering the hole, whereby the high beam substrate 14 is fixed in the height direction by the upper surface of the circuit substrate contact stepped portion 25 and the tip deformed portion 28. The high-beam heat sink 51 is heat-caulked by the heat-caulking bosses 24a to 24d, and the high-beam heat sink 51 is fixed in the height direction by the heat-caulked bosses 24a to 24d contacting the upper surface of the stepped portion 26.
As shown in fig. 8, the heat sink holding bosses 23a, 23b are formed protruding from the top plate 21, and the high-beam substrate 14 and the high-beam heat sink 51 are held by the heat sink holding bosses 23a, 23b with a gap 31 provided therebetween. The heat-conducting member 30 is provided in the gap 31, and the heat-conducting member 30 is held between the high-beam substrate 14 and the high-beam heat sink 51 and is rolled so as to be in contact with both of them.
As described above, in the present embodiment, the heat sink holding bosses 23a and 23b have a multi-step shape, and the height difference between the heat sink contact step portion 26 and the circuit board contact step portion 25 corresponds to the sum of the thickness of the high-beam heat sink 51 and the distance of the gap 31. Therefore, the circuit board contact step portion 25 functions as a spacer that is positioned between the high-beam substrate 14 and the high-beam heat sink 51 and maintains the gap 31.
In the present embodiment, the heat radiation plate holding bosses 23a to 23c are also integrally molded with the top plate 21 of the high beam reflector unit 16 by resin, so that the shape can be processed with high accuracy in units of several micrometers, and the manufacturing process and structure can be simplified to reduce the cost. Further, since the shapes of the high-beam substrate 14 and the high-beam heat sink 51 can be simplified and the heat sink can be molded by press working, the manufacturing process and the structure can be simplified and the cost can be reduced. Further, by forming the distal ends of the heat radiation plate holding bosses 23a to 23c as the heat caulking stepped portions 27, heat caulking can be adopted as a fastening method of the high beam substrate 14, and reduction in the number of components, downsizing, and simplification of the manufacturing process can be achieved.
Therefore, in the vehicle lamp 10 of the present embodiment, the gap 31 between the surface of the high-beam substrate 14 and the high-beam heat sink 51 can be ensured with a simple configuration, and the insulating property and the thermal conductivity can be ensured by disposing the coating-type heat conductive member 30. This prevents warping of the circuit board and the heat dissipation member that occurs when using a preformed heat conductive sheet, and prevents the light distribution characteristics from deteriorating due to the light emitting element being displaced from the focal position of the reflector reflection surface.
(sixth embodiment)
Although the multi-lamp type lamp is exemplified as the vehicle lamp 10 in the first to fifth embodiments, even if a configuration of another optical system such as a projection type, a PES type, or a parabolic type is adopted, it is possible to secure a gap between the surface of the circuit board and the heat radiating member with a simple configuration, and to secure insulation and thermal conductivity by disposing a heat conductive member of a coating type. Further, warping of the circuit board and the heat radiating member, which occurs when a preformed heat conductive sheet is used, can be prevented, and deterioration of the light distribution characteristics due to deviation of the light emitting element from the focal position of the reflector can be prevented.
The present invention is not limited to the above embodiments, and various modifications can be made within the scope of the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments are also included in the technical scope of the present invention.
Description of the symbols
10 vehicle lamp
11 Lamp body
11a back surface portion
12 outer cover
13 Lamp chamber
14 substrate for high beam
15 near light substrate
16 high beam reflector unit
16a reflector for high beam diffusion
16b, 16c reflector for collecting high beam
17 reflector unit for low beam
17a reflector for diffusing low beam
17b, 17c reflector for collecting low beam
18a～18f LED
19a to 19c, 20a to 20c reflecting surfaces
21 Top plate
22a to 22c openings
Bosses for holding radiating plates 23a to 23f
24 a-24 d boss for hot riveting
25 circuit substrate contact step
26 radiator plate contact step part
27 thermally riveted step
28 front end deformation part
29 gasket
30 Heat conduction member
31 gap
32 Heat-radiating Member holding part
50 Lamp unit
Heat radiation plate for 51 high beam
51a, 51b interference prevention holes
52 near light heat radiation plate

Claims (6)

1. A lamp for a vehicle, characterized in that,
the vehicle lamp includes:
a circuit board having a front surface and a back surface, the front surface being mounted with a light-emitting element;
a heat dissipation member disposed to face the circuit substrate;
a spacer that is positioned between the circuit board and the heat dissipation member and that maintains a gap between the circuit board and the heat dissipation member; and
a coating-type heat-conductive member which is disposed between the circuit board and the heat-dissipating member and has an insulating property,
the vehicle lamp includes a circuit board holding member that holds the circuit board, the spacer is a boss that is formed to protrude from the circuit board holding member and that is in contact with the heat dissipation member,
the spacer has a tip portion protruding from a hole formed in the heat dissipating member, and a tip deformation portion is formed so as to cover the hole.
2. The vehicular lamp according to claim 1,
the coating-type heat-conductive member is a heat-conductive grease or a heat-conductive adhesive.
3. The vehicular lamp according to claim 1 or 2,
the coated heat-conductive member contains a filler, and the distance between the circuit board and the heat-dissipating member is larger than the maximum particle diameter of the filler.
4. The vehicular lamp according to claim 1,
the boss has a multi-step shape including a first holding portion and a second holding portion, the first holding portion being in contact with the circuit board, the second holding portion being in contact with the heat dissipation member.
5. The vehicular lamp according to claim 1 or 4,
the circuit board holding member is a reflector having a reflecting surface that reflects light from the light emitting element.
6. A lamp for a vehicle, characterized in that,
the vehicle lamp includes:
a circuit board having a front surface and a back surface, the front surface being mounted with a light-emitting element;
a heat dissipation member disposed to face the circuit substrate;
a spacer that is positioned between the circuit board and the heat dissipation member and that maintains a gap between the circuit board and the heat dissipation member; and
a coating-type heat-conductive member which is disposed between the circuit board and the heat-dissipating member and has an insulating property,
the vehicle lamp includes a heat dissipating member holding portion that holds the heat dissipating member, the spacer is a boss that is formed to protrude from the heat dissipating member holding portion and that contacts the back surface of the circuit board,
a part of the front end of the spacer protrudes from a hole formed in the circuit board, and a front end deformation portion is formed so as to cover the hole.
CN201710089098.6A 2016-02-26 2017-02-20 Vehicle lamps Active CN107131460B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-035194 2016-02-26
JP2016035194A JP6691792B2 (en) 2016-02-26 2016-02-26 Vehicle lighting

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CN107131460A CN107131460A (en) 2017-09-05
CN107131460B true CN107131460B (en) 2020-04-21

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CN (1) CN107131460B (en)

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CN107131460A (en) 2017-09-05
US20170248287A1 (en) 2017-08-31
US10150404B2 (en) 2018-12-11
JP2017152285A (en) 2017-08-31
JP6691792B2 (en) 2020-05-13

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