CN107121846A - The manufacture method of thermosetting sealing material, display device and display device - Google Patents

Abstract

According to an embodiment of the present invention, a thermosetting sealing material for a display device, a display device, and a method for manufacturing a display device are provided. The thermosetting sealing material for a display device is characterized in that the array substrate and the counter substrate constituting the display device are hollow The thermosetting sealing material for a display device bonded with a gap therebetween includes a thermosetting resin and a filler having a diameter larger than the width of the gap. The above-mentioned filler has elasticity, and has heat shrinkability to shrink by heat applied during curing of the above-mentioned thermosetting resin.

Description

Thermosetting sealing material, display device and method for manufacturing display device

This application is based on Japanese patent application 2016-034188 (filing date: 2/25/2016), and priority is given to this application. This application incorporates the entire content of this application by reference.

technical field

Embodiments of the present invention relate to a thermosetting sealing material, a display device, and a method for manufacturing the display device.

Background technique

Display devices, such as liquid crystal display devices, take advantage of features such as light weight, thin shape, and low power consumption, and are also used as display devices for OA equipment such as personal computers, televisions, portable terminal equipment, car navigation devices, and game machines.

As one of the steps of manufacturing a liquid crystal display device, there is a step of filling a liquid crystal material in a liquid crystal display panel constituting the liquid crystal display device. As a method of filling the liquid crystal material, a method of drop filling (ODF) is put into practical use. In this ODF method, a sealing material is provided in a frame shape on one of a pair of substrates constituting a liquid crystal display panel, and a liquid crystal material is dropped in an area surrounded by the sealing material, and one substrate is superimposed on the other substrate. Thereafter, the sealing material is cured to bond the pair of substrates together, and a liquid crystal material can be filled between them. Curing of the sealing material is performed, for example, by ultraviolet irradiation. However, in recent years, liquid crystal display devices have been required to have narrower frames. In a liquid crystal display panel with a narrow frame area, the wiring density in the frame area is high, and the irradiated ultraviolet rays are blocked by the wiring, and it becomes difficult for ultraviolet rays to irradiate the sealing material. curing becomes insufficient.

Then, a thermosetting sealing material is used to cure the sealing material only by heat. However, when the sealing material is cured by heat, the viscosity of the sealing material decreases due to heat during heating, and the volume of the liquid crystal material expands. The sealing material cannot withstand the expansion of the liquid crystal material, and liquid crystal material may intrude into the sealing material. The so-called sealed passage (seal pass) that leaks to the outside of the liquid crystal panel. As a countermeasure against this, by adding an elastic filler having a diameter larger than the width of the cell gap of the liquid crystal display device to the sealing material, when the upper and lower substrates are stacked and pressed to bond the upper and lower substrates, the filler will The upper and lower substrates are reduced in diameter in the thickness direction and expanded in their planar direction to function as walls to prevent the occurrence of sealed passages.

Contents of the invention

However, the filler whose diameter is larger than the width of the cell gap may not be completely reduced in the thickness direction of the upper and lower substrates when the upper and lower substrates are bonded together, and may not only be placed in the region where the sealing material is arranged, but also in the width near the sealing material. The width of the cell gap in the region also becomes larger than expected, resulting in uneven gaps. Such gap unevenness leads to deterioration of display quality such as display unevenness.

An object of the present invention is to provide a thermosetting sealing material, a display device, and a method for manufacturing a display device capable of preventing the occurrence of sealed passages and suppressing the occurrence of gap unevenness.

According to an embodiment of the present invention, a thermosetting sealing material for a display device is provided, which is characterized in that it is a thermosetting sealing material for a display device that is bonded with an array substrate and a counter substrate constituting the display device with a gap, and includes a thermosetting A resin, and a filler having a diameter larger than the width of the aforementioned gap. The above-mentioned filler has elasticity, and has heat shrinkability to shrink by heat applied during curing of the above-mentioned thermosetting resin.

According to the thermosetting sealing material configured as described above, it is possible to prevent occurrence of a sealed passage and suppress occurrence of gap unevenness.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a liquid crystal display device according to an embodiment.

2 is a flowchart illustrating a method of manufacturing a liquid crystal display device including a step of forming a liquid crystal layer by an ODF method.

Figure 3 is a plan view of the test unit.

Fig. 4 is a sectional view taken along line IV-IV of Fig. 3 .

5 is a graph showing the results of measuring the width of the cell gap of the test cells using the sealing materials described in the experimental example and the comparative experimental example.

detailed description

Embodiments will be described below with reference to the drawings. In addition, in order to clarify the description, the drawings sometimes schematically show the width, thickness, shape, etc. of each part compared with the actual form, and are merely examples and do not limit the scope of the present invention. In addition, in this specification and each figure, the same reference numeral is attached|subjected to the component which performs the same or similar function as the component demonstrated about the previous figure, and redundant detailed description may be omitted suitably.

Hereinafter, the liquid crystal display device according to the embodiment will be described.

FIG. 1 is a schematic cross-sectional view of a liquid crystal display device DSP according to an embodiment. In this embodiment, the liquid crystal display device DSP is configured to be applicable to a mode mainly using a transverse electric field, such as an IPS (In-Plane Switching) mode and an FFS (Fringe Field Switching: Fringe Field Switching) mode. The device may also be configured in a mode that mainly utilizes a longitudinal electric field, such as TN (Twisted Nematic) mode, OCB (Optically Compensated Bend: Optically Compensated Bend) mode, and VA (Vertical Aligned: Vertically Aligned) mode.

The liquid crystal display device DSP according to the embodiment includes an array substrate AR, a counter substrate CT, a sealing material SE, and a liquid crystal layer LC.

The liquid crystal display device DSP is an active matrix liquid crystal display device in a transverse electric field drive mode, and includes an array substrate AR, a counter substrate CT, and a gap (cell gap CG) disposed between the array substrate AR and the counter substrate CT. ) within the liquid crystal layer LC. The liquid crystal display device DSP includes an image display area DA for displaying an image in an area surrounded by a cured product CSE of a sealing material described later. The image display area DA has, for example, a substantially rectangular shape in plan view, and is constituted by a plurality of pixels arranged in a matrix. In addition, the image display area DA may have other polygonal shapes, and its edges may be formed in a curved shape.

The array substrate AR includes a first substrate 1 and a first alignment film 3 . The first substrate 1 is a transparent insulating substrate and can be formed of a glass material.

The first alignment film 3 is arranged on the liquid crystal layer LC side surface of the first substrate 1 . The first alignment film 3 can be formed by a method known to those skilled in the art as a method of forming an alignment film. For example, the first alignment film 3 can be formed by applying an organic material such as polyimide to the surface of the first substrate 1 to form an organic thin film, and then irradiating the organic thin film with ultraviolet light. In addition, the first alignment film 3 can also be formed by rubbing with a rubbing cloth without using ultraviolet light.

In addition, although not shown, a first polarizing plate is provided on the surface of the first substrate 1 opposite to the liquid crystal layer LC. The first polarizing plate polarizes light from a light source (not shown) in a specific direction and enters the liquid crystal layer LC. In addition, although not shown, the surface of the first substrate 1 on the liquid crystal layer LC side includes pixel electrodes, scanning lines, signal lines, thin film transistors (TFTs), and the like. Since the liquid crystal display device DSP is a liquid crystal display device in a transverse electric field driving mode, the array substrate AR further includes opposing electrodes, and each opposing electrode is electrically insulated from the pixel electrodes. The counter electrode, pixel electrode, scanning line, signal line, TFT, and the like can be formed by a known method as a method of forming the counter electrode, pixel electrode, scanning line, signal line, TFT, and the like. For example, the pixel electrode can be formed of a light-transmitting conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO), or a reflective conductive material containing Ag, Al, or Al alloy. In addition, the counter electrode can be formed of a light-transmitting conductive material such as ITO or IZO, for example.

The counter substrate CT includes a second substrate 2 , a color filter CF, and a second alignment film 4 . The second substrate 2 is arranged to face the first substrate 1 . The second substrate 2 is a transparent insulating substrate and can be formed of a glass material.

A color filter CF is arranged on the surface of the second substrate 2 on the liquid crystal layer LC side. The color filter CF includes a black matrix BM, filter segments CFR, CFG, CFB, and an overcoat layer OC.

In the color filter CF, red (R), green (G), and blue (B) filter segments (sub-pixels) CFR, CFG, and CFB are periodically arranged. The sub-pixels of the three colors described above constitute one pixel as a group.

A black matrix BM is arranged between the red, green, and blue filter sections CFR, CFG, and CFB. The black matrix BM is formed in a lattice form in a plan view, and distinguishes the red, green, and blue filter sections CFR, CFG, and CFB to prevent color mixing between adjacent filter sections.

The overcoat layer OC is arranged so as to cover these filter segments CFR, CFG, CFB, and black matrix BM, and covers and flattens the surface irregularities of the filter segments CFR, CFG, CFB, and black matrix BM.

The second alignment film 4 is arranged on the liquid crystal layer LC side surface of the color filter CF. The second alignment film 4 can be formed by a method known to those skilled in the art as a method of forming an alignment film. For example, the second alignment film 4 can be formed by applying an organic material such as polyimide to an upper portion of the color filter CF to form an organic thin film, and then irradiating the organic thin film with ultraviolet light. In addition, the second alignment film 4 may be formed by rubbing with a rubbing cloth without using ultraviolet light.

In addition, although not shown, a second polarizing plate is disposed on the surface of the second substrate 2 opposite to the liquid crystal layer LC.

The array substrate AR and the counter substrate CT are bonded together through a cured product CSE of a sealing material to be described in detail later with a cell gap CG formed therebetween. The cell gap CG can be formed by columnar spacers (not shown) formed on the array substrate AR or the counter substrate CT.

The cured product CSE of the sealing material includes a cured product 6 of a thermosetting resin containing a filler 5 having elasticity and heat shrinkability. As the thermosetting resin, for example, phenolic resin, epoxy resin, acrylic resin, bismaleimide-triazine resin, polyimide resin, etc. can be used, and these may be used alone or in combination.

The filler 5 has a diameter (diameter in the thickness direction of the cell gap CG) larger than the width of the cell gap CG in the (uncured) sealing material before curing of the sealing material. The aforementioned diameter of the filler 5 preferably has a diameter that is twice to four times the width of the cell gap CG. As described above, the filler 5 has heat shrinkability, and shrinks by the heat applied when the thermosetting resin 6 is cured. The filler 5 preferably has a heat shrinkage rate of 30% or more. The filler 5 is made of elastic heat-shrinkable material. As such materials, for example, silicone rubber, polytetrafluoroethylene (PTFE), tetrafluoroethylene-perfluoroalkoxyethylene copolymer (PFA), perfluoroethylene-perfluoroethylene known to those skilled in the art can be used. Propylene copolymer, polyolefin, polyvinylidene fluoride, nylon elastomer, etc. In addition, as the heat-shrinkable material having elasticity, a material having rubber elasticity at room temperature is preferably used, for example, silicone rubber is preferably used. The filler 5 can be obtained by pulverizing an elastic heat-shrinkable material.

The amount of the filler 5 added is preferably 1 PHR to 10 PHR relative to the thermosetting resin.

Since the filler 5 has elasticity, when the array substrate AR and the counter substrate CT are stacked and pressed in their thickness direction in order to bond them together, the filler 5 elastically deforms and the filler 5 moves along the thickness direction of the array substrate AR and the counter substrate CT. The diameter is reduced, and at the same time, the diameter is enlarged along the plane direction of the array substrate AR and the counter substrate CT. Since the filler 5 functions as a wall when the diameter of the filler 5 is enlarged in the plane direction of the array substrate AR and the counter substrate CT, it is possible to prevent liquid crystal material from penetrating into the sealing material SE to form a sealing path. In addition, the filler 5 is shrunk by heat when thermosetting the thermosetting resin in the sealing material as described later, so that the diameter (the cell gap CG) is larger than the width of the cell gap CG in diameter reduction by elasticity. The diameter in the width direction) is reduced to the width of the cell gap CG or below.

In FIG. 1 , a filler whose diameter is reduced by elasticity and further reduced by thermal shrinkage to have a diameter equal to the width of the cell gap CG is shown as a spherical filler. In addition, although an example of a spherical filler is shown in FIG. 1 , the shape of the filler is not limited to a spherical shape, and may be, for example, an ellipsoid, a flake, or an irregular crushed shape.

FIG. 2 is a flowchart illustrating a method of manufacturing a liquid crystal display device including a step of forming a liquid crystal layer LC by an ODF method. In the ODF method, first, the array substrate AR and the counter substrate CT constituting the liquid crystal display device DSP are prepared (step S1 ). Next, a sealing material is applied in a frame shape on the surface of the prepared array substrate AR or counter substrate CT (step S2 ). Next, a liquid crystal material is dropped on the region surrounded by the sealing material (step S3). Next, the array substrate AR and the counter substrate CT are overlapped through the sealing material and the liquid crystal material, the array substrate AR and the counter substrate CT are pressed along their thickness direction, and the filler 5 is placed along the array substrate AR and the counter substrate CT. Expand the diameter in the plane direction (step S4). By heating the sealing material, the filler 5 is thermally shrunk, and the thermosetting resin is cured, so that the array substrate AR and the counter substrate CT are bonded together (step S5).

In the liquid crystal display device DSP according to the embodiment, in the bonding process of the array substrate AR and the counter substrate CT, the filler 5 is thermally shrunk by heat when the sealing material is heated and cured. For example, in the state before the sealing material is cured, the diameter of the filler 5 is not completely reduced in the thickness direction of the upper and lower substrates, and the area where the sealing material SE is arranged in the liquid crystal display device DSP and the wide area near the sealing material SE may be The width of the middle cell gap becomes larger than expected, and gap unevenness may occur in these regions. However, even in this case, in the liquid crystal display device DSP described in the embodiment, the diameter of the cell gap CG in the width direction of the filler 5 is reduced to the cell gap CG due to thermal shrinkage of the filler 5 in the sealing material SE. width or less, thereby suppressing the occurrence of gap unevenness.

As described above, in the liquid crystal display device DSP according to the embodiment, even when the sealing material is cured by heat, it is possible to prevent the occurrence of sealed passages, suppress the occurrence of gap unevenness, and provide excellent display quality. Liquid crystal display device.

(experimental example)

The test cell 10 shown in FIGS. 3 and 4 was produced, and the cell gap was measured. FIG. 3 is a plan view of the test unit 10 . Fig. 4 is a sectional view taken along line IV-IV of Fig. 3 . The test unit 10 includes a first substrate 11 , a second substrate 12 , a cured product 13 of the first sealing material, a cured product 14 of the second sealing material, a sealing material 15 , and a liquid crystal layer LC.

The first substrate 11 is a rectangular glass substrate having a short side of 30 mm and a long side of 40 mm. Similarly, the second substrate 12 is also a rectangular glass substrate having a short side of 30 mm and a long side of 40 mm. The 1st board|substrate 11 and the 2nd board|substrate 12 are mutually shifted and arrange|positioned so that the overlapped part may become the square shape of 30 mm in one side.

The cured product 13 of the first sealing material is formed in a frame shape in an edge portion of a portion where the first substrate 11 and the second substrate 12 overlap each other. As the first sealing material, an acrylic epoxy resin that is a UV-curable sealing material is used. In addition, the cured product 13 of the first sealing material has an injection port for injecting a liquid crystal material.

A sealing material 15 is disposed in the injection port of the cured product 13 of the first sealing material. The sealing material 15 prevents the liquid crystal from leaking out from the injection port. As a material of the sealing material, acrylic resin is used.

A liquid crystal LC is filled in a region surrounded by the cured product 13 of the first sealing material between the first substrate 11 and the second substrate 12 . A spacer (not shown) was disposed between the first substrate 11 and the second substrate 12 , and was adjusted so that the width of the cell gap of the test cell was 3.3 μm.

The cured product 14 of the second sealing material was formed to extend along the short axis direction of the test unit 10 at the center of the overlapping portion of the first substrate 11 and the second substrate 12 with a width of 1 mm and a length of 10 mm. The second sealing material contains an acrylic epoxy resin (thermosetting resin) and a filler.

The test units 10 of Experimental Example, Comparative Experimental Example 1, and Comparative Experimental Example 2 are equipped with cured products 14 of the second sealing material, and the cured products 14 of the second sealing material respectively include diameters with maximum diameters of 10 μm, 15 μm, and 10 μm. filler. In the second sealing material used in the test unit 10 of the experimental example, the comparative experimental example 1, and the comparative experimental example 2, a filler of 3PHR was added to the thermosetting resin.

The filler used in the test unit 10 of Experimental Example 1 had a heat shrinkage rate of 50%, and silicone rubber was used as a material. The filler used in the test cell 10 of Comparative Experiment Example 1 used an acrylic resin as a material. In addition, the filler used in the test cell 10 of Comparative Experiment Example 2 used ABS resin as a material.

The test unit 10 was produced by the following method. First, the first substrate 11 and the second substrate 12 are prepared. Then, a first sealing material and a second sealing material are applied to one of the first substrate 11 and the second substrate 12 . In addition, at this time, the first sealing material is applied in a frame shape while leaving the portion to be the injection port of the liquid crystal material, and the second sealing material is applied in the center of the area where the first substrate 11 and the second substrate 12 overlap according to Coated so as to extend along the short axis direction of the test unit 10 .

Next, the first substrate 11 and the second substrate 12 are overlapped through the coated first sealing material and the second sealing material, and only the first sealing material is irradiated with ultraviolet rays to cure the first sealing material, and the first substrate 11 is sealed. and the second substrate 12.

Next, a liquid crystal material is injected by a vacuum injection method into a region surrounded by the cured product 13 of the first sealing material of the superimposed body of the first substrate 11 and the second substrate 12 . After the liquid crystal material is sufficiently injected into the test cell 10, the sealing material 15 is applied to the injection port. Then, the sealing material 15 is cured by irradiating ultraviolet rays, whereby the liquid crystal material is sealed. Next, the test cell 10 was produced by heating and curing the second sealing material 14, and the width of the cell gap was measured. The results are shown in FIG. 5 .

FIG. 5( a ) is a diagram showing the results of measuring the width of the cell gap of the test cell using the sealing material of the experimental example. In addition, FIG. 5( b ) is a diagram showing the results of measuring the width of the cell gap of the test cell using the sealing material of the comparative experiment example. In addition, in FIG. 5( b ), Comparative Experiment Example 1 is indicated by a dotted line, and Comparative Experiment Example 2 is indicated by a long chain line. In Comparative Experiment 1 of FIG. 5( b ), the width of the cell gap becomes larger than 3.3 μm in the range of about 10 mm from the center of the cured product 14 of the second sealing material. Gap unevenness occurs within about 10 mm of the central portion of 14 . In addition, in Comparative Experiment 2, the width of the cell gap becomes larger than 3.3 μm in the range of about 6 mm from the center portion of the cured product 14 of the second sealing material, and it is found that the distance from the cured product 14 of the second sealing material is greater than 3.3 μm. Gap unevenness occurs within a range of about 6mm in the center. On the other hand, as shown in FIG. 5( a ), it was found that in the test cell using the sealing material of the experimental example, the region where the width of the cell gap becomes larger than 3.3 μm ends at a distance from the solidification of the second sealing material. In the range of about 1 mm in the central portion of the object 14 , the region where gap unevenness occurs is narrow compared to Comparative Experiment Example 1 and Comparative Experiment Example 2, and the occurrence of gap unevenness is suppressed. That is, in the liquid crystal display device including the cured product 14 of the second sealing material of the experimental example, the range where gap unevenness occurs is reduced, and excellent display performance can be expected even in the vicinity of the sealing material.

In addition, the above-described embodiments are summarized into the following technical solutions.

Technical solution 1

A thermosetting sealing material for a display device, characterized in that it is a thermosetting sealing material for a display device that is bonded with an array substrate and an opposite substrate constituting the display device with a gap, and includes:

thermosetting resins, and

fillers having a diameter greater than the width of the aforementioned gap,

The above-mentioned filler has elasticity, and has heat shrinkability to shrink by heat applied during curing of the above-mentioned thermosetting resin.

Technical solution 2

The thermosetting sealing material according to claim 1, wherein the filler is formed along the array substrate and the counter substrate when they are stacked and pressed in their thickness direction in order to bond the array substrate and the opposing substrate together. The diameter of the opposite substrate is reduced in the thickness direction, and at the same time, the diameter is expanded along the plane direction of the array substrate and the opposite substrate, so as to prevent the liquid crystal material from intruding into the thermosetting sealing material.

Technical solution 3

The thermosetting sealing material according to claim 1 or claim 2, wherein the cured product of the thermosetting resin shrinks the width of the gap due to the shrinkage of the filler by heat applied during curing of the thermosetting resin. uniform.

Technical solution 4

The thermosetting sealing material according to any one of Claims 1 to 3, wherein the filler has a diameter that is 2 to 4 times the width of the gap.

Technical scheme 5

According to any one of technical solution 1 to technical solution 4, the thermosetting sealing material is characterized in that the above-mentioned filler has a thermal shrinkage rate of 30% or more.

Technical scheme 6

According to the thermosetting sealing material according to any one of technical solution 1 to technical solution 5, it is characterized in that the above-mentioned filler contains silicone rubber.

Technical scheme 7

The thermosetting sealing material according to any one of technical solution 1 to technical solution 6 is characterized in that, relative to the above-mentioned thermosetting sealing material, 1 PHR to 10 PHR of the aforementioned filler is contained.

Technical scheme 8

A display device, characterized in that it has:

array substrate,

a counter substrate disposed opposite to the above-mentioned array substrate,

a sealing material layer disposed between the array substrate and the counter substrate and bonding the array substrate and the counter substrate at their edges; and

a liquid crystal layer disposed between the array substrate and the opposing substrate and in a region surrounded by the sealing material layer,

The aforementioned sealing material layer is a cured product of the thermosetting sealing material described in any one of Technical Solution 1 to Technical Solution 7.

Technical scheme 9

A method of manufacturing a display device, comprising the following steps:

Prepare the array substrate and the opposite substrate constituting the display device;

Coating the thermosetting sealing material described in any one of technical solutions 1 to 7 in a frame shape on the surface of the above-mentioned array substrate or the above-mentioned opposite substrate;

Dropping a liquid crystal material into the area surrounded by the above-mentioned thermosetting sealing material;

overlapping the above-mentioned array substrate and the above-mentioned opposite substrate through the above-mentioned thermosetting sealing material and the above-mentioned liquid crystal material;

Pressing the stacked array substrate and the opposing substrate along their thickness direction, reducing the diameter of the filler along the thickness direction of the array substrate and the opposing substrate, and simultaneously expansion;

By heating the thermosetting sealing material, the filler is thermally shrunk, and the thermosetting resin is cured, so that the array substrate and the counter substrate are bonded together.

Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in other various forms, and various omissions, substitutions, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope or spirit of the invention, and are also included in the invention described in the claims and its equivalent scope.

Claims (9)

1. A thermosetting sealing material for a display device, characterized in that, it is a thermosetting sealing material for a display device that will form an array substrate of a display device and an opposite substrate with a gap and bonded together, and it comprises: thermosetting resins, and a filler having a diameter larger than the width of the gap, The filler has elasticity and has thermal shrinkage to shrink by heat applied at the time of curing of the thermosetting resin. 2. The thermosetting sealing material according to claim 1, wherein the filler is formed by overlapping the array substrate and the opposing substrate and pressing them along their thickness direction in order to bond them together. The diameter is reduced along the thickness direction of the array substrate and the opposite substrate, and the diameter is expanded along the plane direction of the array substrate and the opposite substrate, thereby preventing the liquid crystal material from intruding into the thermosetting sealing material. 3. The thermosetting sealing material according to claim 1, wherein the cured product of the thermosetting resin shrinks the width of the gap due to the shrinkage of the filler by heat applied during curing of the thermosetting resin. become even. 4 . The thermosetting sealing material according to claim 1 , wherein the filler has a diameter that is 2 to 4 times the width of the gap. 5. The thermosetting sealing material according to claim 1, wherein the filler has a thermal shrinkage rate of more than 30%. 6. The thermosetting sealing material according to claim 1, wherein the filler comprises silicone rubber. 7 . The thermosetting sealing material according to claim 1 , wherein 1 PHR to 10 PHR of the filler is contained relative to the thermosetting sealing material. 8. A display device, characterized in that it has: array substrate, a counter substrate disposed opposite to the array substrate, a sealing material layer disposed between the array substrate and the counter substrate and bonding the array substrate and the counter substrate at their edges; and a liquid crystal layer arranged between the array substrate and the opposing substrate and in a region surrounded by the sealing material layer, The sealing material layer is a cured product of the thermosetting sealing material described in any one of claims 1 to 7. 9. A method of manufacturing a display device, comprising the following steps: Prepare the array substrate and the opposite substrate constituting the display device; Coating the thermosetting sealing material described in any one of claims 1 to 7 in a frame shape on the surface of the array substrate or the opposite substrate; dropping a liquid crystal material into the area enclosed by the thermosetting sealing material; overlapping the array substrate and the opposite substrate via the thermosetting sealing material and the liquid crystal material; Pressing the stacked array substrate and the opposite substrate along their thickness direction, reducing the diameter of the filler along the thickness direction of the array substrate and the opposite substrate, and simultaneously The planar diameter expansion of the opposing substrate; and By heating the thermosetting sealing material, the filler is thermally shrunk, and the thermosetting resin is cured, so that the array substrate and the opposite substrate are bonded together.