CN107104083A - Fastening components with low wind pressure loss, heat dissipation components and combined structure with chipset - Google Patents

Abstract

The invention discloses a fastening component with low wind pressure loss, a cooling component and a combination structure with a chipset. The heat dissipation component includes a heat sink and a fastening component. The radiator includes a bottom plate and a plurality of radiators. The fastening component includes a rectangular frame, multiple first side panels and multiple deflectors. The rectangular frame body includes two first beam bodies, two second beam bodies, a first surface and a second surface, and the first beam body and the second beam body are connected to define a hollow area, so that multiple heat sinks can be placed on the hollow area. The plurality of first side panels are respectively extended from the two first beams of the rectangular frame. A plurality of deflectors are respectively extended from the second beam body of the rectangular frame.

Description

Fastening components with low wind pressure loss, heat dissipation components and combined structure with chipset

technical field

The present invention relates to a combined structure of a heat dissipation component and a chipset, a heat dissipation component and a fastening component thereof, in particular to a fastening component which can make the wind field passing through the radiator more concentrated and uniform, and a suitable heat dissipation component and Combination structure of cooling components and chipset.

Background technique

As the performance of electronic devices continues to improve, the waste heat generated by the chipset inside the electronic device also increases accordingly. Since the operating temperature of the chipset has a great impact on its working efficiency, how to efficiently use the chipset It is an important issue to keep the operating temperature of the chipset within an ideal range to dissipate the generated waste heat.

The heat dissipation method in the prior art is to attach a heat sink with high thermal conductivity to the surface of the chipset, and directly fix the heat sink on the motherboard, so as to prevent the heat sink from loosening and make the heat sink closely contact with the chipset. A heat transfer path with lower thermal resistance is formed, and the surface area of the heat sink in contact with the air is increased by means of multiple fins of the heat sink to achieve better heat dissipation efficiency. However, in the prior art, in order to directly install the heat sink on the motherboard, the area of the base of the heat sink must be much larger than that of the chipset, so that a fixing component is provided on the base of the heat sink so that the heat sink is directly fixed on the motherboard. This approach not only increases the raw material cost of the heat sink, but also requires an additional space for the heat sink when designing the motherboard, making it difficult for the motherboard using the heat sink in the prior art to be designed to be thinner or miniaturized.

In addition, in some existing technologies, the heat sink is first arranged on a heat conducting plate with a larger area than the base of the heat sink, and the fan is fixed on the heat conducting plate, and then the heat conducting plate is arranged on the motherboard, so that the chipset and Heat conduction plate contact, in order to further increase heat dissipation efficiency. However, in this way, more installation space must be reserved on the motherboard for the placement of heat conducting plates, radiators and fans.

On the other hand, when the heat sink of the prior art utilizes an active cooling device, such as a fan, to drive the air flow to dissipate heat from the heat sink and the chipset, since the air flow is non-directional flow, when the air flow flows through the cooling fins of the heat sink , part of the airflow tends to overflow to the outside of the radiator, which will disperse the airflow and unbalance the wind resistance, resulting in that the heat dissipation performance cannot be further improved.

In view of this, how to develop a fastening component, a heat dissipation component, and a combined structure of a heat dissipation component and a chipset to solve the deficiency of the prior art is an urgent problem for those skilled in the art.

Contents of the invention

The purpose of the present invention is to provide a fastening assembly, a heat dissipation assembly, and a combined structure of a heat dissipation assembly and a chipset. By setting deflectors on two opposite sides of the fastening assembly, the airflow passing through the heat dissipation assembly can be used to dissipate heat from the heat dissipation assembly. The body is concentrated to prevent the airflow from escaping to the outside of the heat dissipation component, so as to improve the overall heat dissipation efficiency of the heat dissipation component.

Another object of the present invention is to provide a fastening assembly, a heat dissipation assembly, and a combined structure of a heat sink and a chipset. By integrating the design of the deflector and the fastening assembly, it not only saves the cost of raw materials, but also eliminates the need for Space for fixing components or fans is reserved to achieve the advantages of reducing manufacturing costs and reducing the thickness or miniaturization of the main board and radiator.

Yet another object of the present invention is to provide a combination structure of a fastening assembly, a heat dissipation assembly, and a heat dissipation assembly and a chip set. The air deflector on the top is used to solve the problem that the airflow flowing through the heat sink is dispersed and the wind field is uneven when the bottom plate of the heat sink is enlarged, and the overall heat dissipation efficiency of the heat dissipation assembly is further improved.

According to the idea of the present invention, a broader embodiment of the present invention is to provide a fastening assembly, including a rectangular frame, a plurality of first side plates and a plurality of deflectors. The rectangular frame includes two first beams, two second beams, a first surface and a second surface. The two first beams are arranged opposite to each other, the two second beams are arranged opposite to each other, the first surface and the second surface are arranged opposite to each other, and the two first beams are connected to the two second beams to define a hollow area. A plurality of first side plates extend vertically from the first surfaces of the two first beams of the rectangular frame respectively, and the plurality of first side plates include at least one clasp, and the clasp extends from the first side plate to the hollow area. direction extension. A plurality of deflectors vertically extend from the second surface of the second beam body of the rectangular frame respectively.

According to the idea of the present invention, another broad embodiment is to provide a heat dissipation assembly, including a heat sink and a fastening assembly. The radiator includes a bottom plate and a plurality of radiators, and the plurality of radiators are arranged on the bottom plate at intervals. The fastening component includes a rectangular frame, multiple first side panels and multiple deflectors. The rectangular frame includes two first beams, two second beams, a first surface and a second surface. The two first beams are arranged opposite to each other, the two second beams are arranged opposite to each other, the first surface and the second surface are arranged opposite to each other, and the two first beams are connected to the second beams to define a hollow area, so that the radiator A plurality of radiators are disposed in the hollow area. A plurality of first side plates extend vertically from the first surfaces of the two first beams of the rectangular frame respectively, and the plurality of first side plates include at least one clasp, and the clasp extends from the first side plate to the hollow area direction extension. A plurality of deflectors respectively extend from the second surface of the second beam of the rectangular frame.

According to the idea of the present invention, another broad embodiment of the present invention is to provide a combined structure of a heat dissipation component and a chipset, including a chipset and a heat dissipation component. The chipset includes a chip substrate and chips. The heat dissipation component includes a heat sink and a fastening component. The radiator includes a bottom plate and a plurality of radiators, and the plurality of radiators are arranged on the bottom plate at intervals. The fastening component includes a rectangular frame, multiple first side panels and multiple deflectors. The rectangular frame includes two first beams, two second beams, a first surface and a second surface. The two first beams are arranged opposite to each other, the two second beams are arranged opposite to each other, the first surface and the second surface are arranged opposite to each other, and the two first beams are connected to the two second beams to define a hollow area for heat dissipation A plurality of radiators of the device are disposed in the hollow area. A plurality of first side plates extend vertically from the first surfaces of the two first beams of the rectangular frame respectively, and the plurality of first side plates include at least one clasp, and the clasp extends from the first side plate to the hollow area direction extension. A plurality of deflectors vertically extend from the second surface of the second beam body of the rectangular frame respectively. Wherein, at least one hook of the plurality of first side plates of the fastening component is fastened to at least one edge of the bottom surface of the chip substrate of the chipset.

The beneficial effect of the present invention is that: the combined structure of the fastening assembly, the heat dissipation assembly and the heat dissipation assembly and the chipset of the present invention is provided with deflectors on two opposite sides of the fastening assembly, so that the airflow passing through the heat dissipation assembly goes to the heat dissipation assembly. The heat sink is concentrated to prevent the air from escaping to the outside of the heat sink, so as to improve the overall heat dissipation efficiency of the heat sink. In addition, the integrated design of the deflector and the fastening components not only saves the cost of raw materials, but also eliminates the need to reserve space for fixing components or fans on the motherboard, thereby reducing manufacturing costs and reducing the thickness or miniaturization of the motherboard and heat sink. advantage of . Furthermore, by enlarging the size of the bottom plate of the radiator, increasing the number of radiators installed, and setting deflectors on the buckle assembly, to solve the problem of airflow dispersion that occurs when the bottom plate of the radiator is enlarged. And the problem of uneven wind field, and further improve the overall heat dissipation efficiency of the heat dissipation component.

Description of drawings

FIG. 1 is a schematic diagram of a combined structure of a heat dissipation component and a chipset according to a first embodiment of the present invention.

FIG. 2 is an exploded view of the structure of the heat dissipation assembly according to the first embodiment of the present invention.

FIG. 3A is a schematic diagram of the fastening assembly shown in FIG. 2 .

FIG. 3B is a schematic diagram of the radiator shown in FIG. 2 .

FIG. 4 is an exploded view of the structure of the heat dissipation assembly according to the second embodiment of the present invention.

FIG. 5 is a schematic diagram of a variation of the fastening assembly shown in FIG. 2 .

FIG. 6 is a schematic diagram of another variation of the fastening assembly shown in FIG. 2 .

FIG. 7 is a schematic diagram of another variation of the fastening assembly shown in FIG. 2 .

FIG. 8 is a schematic structural diagram of a heat dissipation assembly according to a third embodiment of the present invention.

FIG. 9 is a schematic structural diagram of a heat dissipation assembly according to a fourth embodiment of the present invention.

FIG. 10 is a schematic structural diagram of a heat dissipation assembly according to a fifth embodiment of the present invention.

Wherein, the reference signs are explained as follows:

1 Combination structure of cooling components and chipset

2 Cooling components

21 Radiator

211 Bottom plate

2110 upper surface

2111 Set channel

2112 lower surface

212 Radiator

2121 Top

2231 top surface

22 snap fit components

221 rectangular frame

2211 The first beam body

2212 Second Beam Body

2213 First Surface

2214 Second Surface

222 First side panel

2221 Clasp

2222 inner surface

223 deflector

224 Second side panel

225 elastic arm

2251 Reaching the top

3 chipsets

31 chip substrate

310 Bottom

310a edge

32 chips

A1 first setting area

A2 Second setting area

C1 central area

C2 extended area

D1 first direction

D2 second direction

E hollow area

θ acute angle

θ1 acute angle

θ2 acute angle

detailed description

Some typical embodiments embodying the features and advantages of the present invention will be described in detail in the description in the following paragraphs. It should be understood that the present invention can have various changes in different embodiments, all of which do not depart from the scope of the present invention, and the description and drawings therein are used as illustrations in nature, not for limiting the present invention .

Please refer to FIG. 1 . FIG. 1 is a schematic diagram of a combined structure of a heat dissipation component and a chipset according to a first embodiment of the present invention. As shown in the figure, the combination structure 1 of the heat dissipation component and the chipset includes the heat dissipation component 2 and the chipset 3 . The heat dissipation component 2 includes a heat sink 21 and a fastening component 22 . The chipset 3 includes a chip substrate 31 and a chip 32 . The chip 32 is disposed on the chip substrate 31 , wherein the chip 32 is a plate-shaped heating element. In actual application, the heat dissipation component 2 is arranged on the chipset 3, and the fastening component 22 of the heat dissipation component 2 is used as a limiting component to make the radiator 21 and the chipset 2 fit together and avoid the gap between the radiator 21 and the chipset 3. Loosen, in order to increase the surface area of the airflow in contact with the high-temperature object through the radiator 21, so as to achieve the effect of improving the heat dissipation efficiency.

Please refer to FIG. 2, FIG. 3A and FIG. 3B, wherein FIG. 2 is an exploded view of the heat dissipation assembly of the first embodiment of the present invention; FIG. 3A is a schematic diagram of the fastening assembly shown in FIG. 2; A schematic diagram of the heat sink shown. The radiator 21 includes a bottom plate 211 and a plurality of radiators 212 . In this embodiment, the plurality of radiators 212 are heat dissipation fins of a plate structure, and the plurality of radiators 212 are arranged in parallel on the upper surface 2110 of the bottom plate 211, that is, the plurality of radiators 212 are arranged linearly along the first direction D1 , and arranged at intervals along the second direction D2, and the first direction D1 is perpendicular to the second direction D2, but not limited thereto, the shape of the heat sink 212 can be changed according to actual application requirements, such as a cylindrical heat dissipation column, an ellipse The heat dissipation column of the cylinder or the heat dissipation column of other curved cylinders.

Please refer to FIG. 2 and FIG. 3A again, the fastening component 22 includes a rectangular frame body 221 , a plurality of first side plates 222 and a plurality of deflector plates 223 . The rectangular frame 221 includes two first beams 2211 , two second beams 2212 , a first surface 2213 and a second surface 2214 . The two first beams 2211 are arranged opposite to each other, the two second beams 2212 are arranged opposite to each other, and the first surface 2213 and the second surface 2214 are arranged opposite to each other. The two first beams 2211 and the two second beams 2212 of the rectangular frame 221 are connected to define a hollow area E and a first surface 2213 and a second surface 2214 opposite to each other. In this embodiment, the two first beams 2211 and the two second beams 2212 are integrally formed. The two first beams 2211 are parallel to each other, and the two second beams 2212 are parallel to each other. As a limitation, the shape of the rectangular frame 221 can be changed according to the actual arrangement of the radiators 212 of the radiator 21 .

The plurality of first side panels 222 of the fastening assembly 22 extend perpendicularly from the first surfaces 2213 of the two first beams 2211 of the rectangular frame 221 . A plurality of first side panels 222 include at least one clasp 2221, in other words, each first side panel 222 includes at least one clasp 2221, or part of the first side panel 222 includes at least one clasp 2221, part of the first side Plate 222 does not include any clasps. The clasp 2221 extends from the inner surface 2222 of the first side plate 222 toward the direction of the hollow area E. As shown in FIG. In this embodiment, there are two first side panels 222 , which are respectively disposed on the opposite first beams 2211 , and each first side panel 222 has two clasps 2221 , but it is not limited thereto. In some embodiments, the number of the first side panels 222 is four, and each first beam body 2211 is provided with two first side panels 222 , wherein each first side panel 222 has a clasp 2221 .

Please refer to FIG. 1 and FIG. 2 again. When the heat sink assembly 2 is installed on the chipset 3, the first beam body 2211 is arranged approximately parallel to the second direction D2, and the first side plate 222 and the bottom plate 211 of the heat sink 21 Cooperate with the chip substrate 31 of the chipset 3 to limit the displacement of the heat sink 21 along the first direction D1 or the opposite direction of the first direction. Similarly, when the heat dissipating component 2 is disposed on the chipset 3, the first surface 2213 of the buckling component 22 is at least partially against the upper surface 2110 of the bottom plate 211 of the heat sink 21, and the plurality of first surfaces 2213 of the buckling component 22 At least one hook 2221 of the side plate 222 is fastened to at least one edge 310a of a bottom surface 310 of the chip substrate 31 of the chip set 3, so that the bottom plate 211 of the heat sink 21 and the chip set 3 are limited to a rectangular shape by the fastening component 22. Between the frame body 221 and the plurality of first side plates 222 , the radiator 21 is prevented from being separated from the chipset 3 .

Please refer to FIG. 2 , FIG. 3A and FIG. 3B again, a plurality of radiators 212 are defined along the second direction D2 to form two first dummy areas A1 (first dummy area), and the two first blank areas A1 combine the plurality of radiators 212 is divided into a central area C1 and two extended areas C2, wherein the central area C1 is located between the two extended areas C2, that is, a plurality of radiators 212 are included between the two first blank areas A1, but this is not taken as a limit. In this embodiment, the shortest distance between the two first blank areas A1 is less than or equal to the length of the first beam body 2211 of the fastening component 22 . In this way, when the fastening component 22 and the heat sink 21 are combined to form the heat dissipation component 2, or the heat dissipation component 2 is further arranged on the chipset 3, the two second beams 2212 of the fastening component 22 are respectively accommodated in the Two first blank areas A1. In addition, the two deflectors 223 are also respectively located in the two first blank areas A1, so that when an active heat dissipation device, such as a fan, is used to drive the airflow to the radiator 21 and the heat sink 21 along the first direction D1 or the opposite direction of the first direction D1. When the chipset 3 dissipates heat, the two deflectors 223 can be used to balance the flow of air passing through each position of the radiator 21, so as to avoid the two first blank areas A1 from affecting the uniformity of the wind field passing through the radiator 21, and using The two deflectors 223 centrally guide the airflow, so that the airflow is concentrated and evenly passed through the heat sink 212 above the heat source.

As shown in Fig. 2, Fig. 3A and Fig. 3B, in this embodiment, the fastening assembly 22 also includes a plurality of second side plates 224 in addition to the first side plates 222, which are formed by the second beams of the rectangular frame body 221 respectively. The first surface 2213 of the body 2212 extends vertically to serve as a limiting component to limit the displacement of the heat sink 21 and the chipset 3 along the second direction D2, but not limited thereto. The number of the second side plate 224 is preferably two, and the bottom plate 211 of the radiator 21 includes two setting channels 2111, the two setting channels 2111 are located in the first blank area A1 of the radiator, and the two setting channels 2111 The positions are respectively set relative to the two second side plates 224 of the rectangular frame body 221, so that the two second side plates 224 are respectively passed through the two installation channels 2111, so that the cooperation between the second side plates 224 and the installation channels 2111 Restricting the position of the fastening component 22 in the second direction D2, in addition to preventing the fastening component 22 from attaching to the heat sink 212 and reducing the surface area of the fastening component 22 covering the heat sink 212, it can also be resisted by the second side plate 224. The chip substrate 31 abutting against the chipset 3 (shown in FIG. 1 ) prevents the buckling component 22 from sliding along the second direction D2.

Please refer to FIG. 2 again and cooperate with FIG. 3A and FIG. 3B. The snap-fit component 22 further includes a plurality of elastic arms 225, and the plurality of elastic arms 225 respectively extend from the two second beam bodies 2212 toward the direction of the hollow area E, and Each elastic arm 225 has an abutting portion 2251, and the abutting portion 2251 is extended from the end of the elastic arm 225, so that when the cooling assembly 2 is disposed on the chipset 3, the abutting portion 2251 abuts against the bottom plate 211 of the heat sink 21 , so that the lower surface 2112 of the bottom plate 211 of the heat sink 21 is more closely attached to the chipset 3 to improve heat conduction efficiency. In this embodiment, a plurality of radiators 212 are arranged in m columns at intervals along the second direction D2, and a plurality of radiators 212 are arranged in n rows at intervals along the first direction D1, and the radiators 212 in different rows are arranged at intervals and define n-1 second blank areas A2 (second dummy area) are formed, wherein m is a positive integer greater than or equal to 3, and n is a positive integer greater than or equal to 2, but not limited thereto. When the fastening component 22 and the heat sink 11 are combined to form the heat dissipation component 2, or the heat dissipation component 2 is further arranged on the chipset 3, the n-1 second blank areas A2 can accommodate a plurality of elastic arms 225 respectively. The corresponding second blank area A2.

Please refer to FIG. 4 . FIG. 4 is an exploded view of the heat dissipation assembly according to the second embodiment of the present invention. In this embodiment, the structure of the heat dissipation component 2 is similar to that of the heat dissipation component 2 shown in FIG. 2 , and the same component numbers represent the same structure and function of the components, which will not be repeated here. Different from the cooling assembly 2 shown in FIG. 2 , the fastening assembly 22 of this embodiment only includes a rectangular frame 221 , two first side plates 222 and two deflectors 223 , and the plurality of radiators of the radiator 21 The shape of 212 is different. When the fastening component 22 and the heat sink 21 are combined into the heat dissipation component 2, or the heat dissipation component 2 is further arranged on the chipset 3, the two second beams 2212 of the fastening component 22 are respectively arranged on the two sides of the heat sink 21. A first blank area A1, so that the two second beams 2212 are respectively located between the plurality of radiators 212, so that the plurality of radiators 212 adjacent to the second beam 2212 cooperate with the second beam 2212 , to limit the position of the fastening component 22 in the second direction D2. In addition, in this embodiment, the radiators 21 are arranged in m rows at intervals along the second direction D2, but each row of radiators 212 has only a single plate-shaped fin, that is, each row of radiators 212 is parallel to the first direction. The direction of D1 is extended, thereby increasing the surface area of the airflow in contact with the high-temperature object. In some embodiments, the form of the heat sink 21 is not limited to the embodiment shown in FIG. 4 , and the heat sink 21 shown in FIG. 2 can also be used according to actual application requirements.

Please refer to FIG. 5 and refer to FIG. 2 , FIG. 3A and FIG. 3B , wherein FIG. 5 is a schematic diagram of a modification example of the fastening assembly shown in FIG. 2 . In this embodiment, the fastening assembly 22 includes a plurality of deflectors 223, such as but not limited to eight deflectors 223, the plurality of deflectors 223 are formed by the second beam 2212 of the rectangular frame 221 respectively. The two surfaces 2214 extend vertically. In detail, four deflectors 223 are disposed on the second surface 2214 of one of the second beams 2212, and the remaining four deflectors 223 are disposed on the second surface 2214 of the other second beam 2212, wherein The four deflectors 223 disposed on the same second beam body 2212 are spaced apart from each other. When the fastening component 22 is combined with the heat sink 11 to form the heat dissipation component 2, or the heat dissipation component 2 and the chipset 3 are further assembled into a combined structure, the second beam body 2212 is accommodated in the first blank area A1, and the deflector 223 extends from the second surface 2214 of the second beam body 2212 , and the deflector 223 and the radiator 212 of the radiator 21 are arranged at intervals along the second direction D2 . Since the radiator 21 shown in the first embodiment has two first blank areas A1, a central area C1 and two extension areas C2, and the plurality of deflectors 223 of the fastening assembly 22 are accommodated in the first blank area A1 Therefore, the arrangement of multiple deflectors 223 can increase the wind resistance of the radiator 21 in the first empty area A1, avoiding a large airflow component passing to the first empty area A1 and dispersing the airflow component flowing to the central area C1, It is used to make the overall air resistance of the heat dissipation assembly 2 relatively average, so as to effectively improve the heat dissipation efficiency of the heat dissipation assembly 2 . In addition, the extended area C2 of the heat sink 21 can also increase the heat dissipation surface area, so that the heat dissipation assembly 2 of the present invention can greatly improve the heat dissipation efficiency. It should be emphasized that the number of deflectors 223 is not limited to eight, and the number can be changed arbitrarily according to actual application requirements.

In some embodiments, each baffle 223 has a thickness variation along the direction from the second beam 2212 to its top surface 2231 , wherein the thickness of the baffle 223 is along the direction from the second beam 2212 to its top surface 2231 It is better to be thinner gradually, so that the deflector 223 can meet the light and thin design and have good mechanical properties at the same time. In some embodiments, multiple deflectors 223 on the same second beam 2212 are arranged linearly, multiple deflectors 223 on different second beams 2212 are parallel to each other, and each deflector 223 Parallel to the two second beams 2212 to form more uniform wind resistance, but not limited thereto.

Please refer to Figures 6 and 7 and with reference to Figures 2, 3A and 3B, wherein Figure 6 is a schematic diagram of another variation of the fastening assembly shown in Figure 2; and Figure 7 is a schematic diagram of the fastening assembly shown in Figure 2 A schematic diagram of another variation of . As shown in FIG. 6, in this embodiment, the structure of the snap-fit component 22 is similar to that of the snap-fit component 22 shown in FIG. . Different from the fastening assembly 22 shown in FIG. 5 , the multiple deflectors 223 of the fastening assembly 22 of this embodiment are arranged in different ways, wherein the four deflectors 223 located on the same second beam body 2212 are parallel to each other. The eight deflectors 223 located on different second beams 2212 are parallel to each other, and the second beam 2212 forms an acute angle θ with the deflectors 223 arranged on it, wherein the angle of the acute angle θ is greater than 0 degrees and less than or Equal to 5 degrees, but not limited to this. In yet another variant embodiment (not shown), the eight deflectors 223 located on different second beams 2212 are not parallel to each other and the second beam 2212 forms an acute angle θ with the deflectors 223 disposed thereon. , wherein the angles of the acute angle θ are respectively greater than 0 degrees and less than or equal to 5 degrees. As shown in FIG. 7 , in this embodiment, the four deflectors 223 located on the same second beam body 2212 form acute angles θ1 and θ2 at different angles with the second beam body 2212 respectively, wherein the angles of the acute angles θ1 and θ2 are All are greater than 0 degrees and less than or equal to 5 degrees, but not limited thereto. In this way, the plurality of deflectors 223 of the fastening component 22 can be used to adjust the distribution of the wind field flowing through the heat dissipation component 2 , and can be adjusted and changed according to actual application requirements.

In some other embodiments, as shown in FIG. 2 , the deflector 223 has a top surface 2231 , the radiator 212 has a top surface 2121 , and the top surface 2231 of each deflector 223 reaches the first end of the rectangular frame 221 The shortest distance of the surface 2213 is the first shortest distance, the shortest distance between the top surface 2121 of the plurality of radiators 212 and the upper surface 2210 of the bottom plate 211 is the second shortest distance, preferably the first shortest distance is greater than or equal to the second shortest distance , so that the wind field flowing through the cooling assembly 2 is relatively uniform.

Please refer to FIG. 8, FIG. 9 and FIG. 10, FIG. 8 is a schematic structural diagram of a heat dissipation assembly according to a third embodiment of the present invention; FIG. 9 is a schematic structural diagram of a heat dissipation assembly according to a fourth embodiment of the present invention; Schematic diagram of the structure of the heat dissipation assembly of the fifth embodiment. In the third embodiment, the fourth embodiment and the fifth embodiment, the structure of the heat dissipation assembly 2 is similar to that of the heat dissipation assembly 2 shown in FIG. 2 and the fastening assembly 22 shown in FIG. The structure and function of the components will not be repeated here, but the multiple radiators 212 shown in the third embodiment, the fourth embodiment and the fifth embodiment are all passed through the hollow area E of the fastening component 22, and many The heat sinks 212 are spaced apart from each other, that is, the heat sink 21 does not include two first blank areas A1 or extended areas C2. In the third embodiment, the plurality of heat sinks 212 are similar to the heat sink 21 shown in FIG. limit. In the fourth embodiment, the plurality of heat sinks 212 are also plate-shaped heat sink fins, and each column of heat sinks 212 along the first direction D1 includes a plurality of heat sinks 212 arranged linearly, but it is not limited thereto. . In the fifth embodiment, each heat sink 212 is a cylindrical heat dissipation column 212 , but it is not limited thereto. In addition, the fastening components 22 shown in the third embodiment, the fourth embodiment and the fifth embodiment are not limited to the implementation shown in FIG. 5 , and can also be implemented according to FIG. 6 , FIG. Replacement, and the heat dissipation assembly 2 shown in the third embodiment, the fourth embodiment and the fifth embodiment can make the air flow passing through the heat dissipation assembly 2 go to the heat source of the heat dissipation assembly 2 by means of a plurality of deflectors 223 of the fastening assembly 22 Concentrate to prevent the airflow from escaping to the outside of the cooling assembly 2.

To sum up, the combined structure of the fastening assembly, the heat dissipation assembly, and the heat dissipation assembly and the chipset of the present invention is provided with deflectors on two opposite sides of the fastening assembly, so that the airflow passing through the heat dissipation assembly goes to the heat sink of the heat dissipation assembly. Concentration prevents the airflow from escaping to the outside of the heat dissipation component, so as to improve the overall heat dissipation efficiency of the heat dissipation component. In addition, the integrated design of the deflector and the fastening components not only saves the cost of raw materials, but also eliminates the need to reserve space for fixing components or fans on the motherboard, thereby reducing manufacturing costs and reducing the thickness or miniaturization of the motherboard and heat sink. advantage of . Furthermore, by enlarging the size of the bottom plate of the radiator, increasing the number of radiators installed, and setting deflectors on the buckle assembly, to solve the problem of airflow dispersion that occurs when the bottom plate of the radiator is enlarged. And the problem of uneven wind field, and further improve the overall heat dissipation efficiency of the heat dissipation component.

The present invention can be modified arbitrarily by those skilled in the art without departing from the protection scope of the appended claims.

Claims (20)

1. a kind of buckling component, including：

One rectangular box, including two the first beam bodies, two the second beam bodies, a first surface and a second surface, this two One beam body is oppositely arranged, and two second beam bodies are oppositely arranged, and the first surface is oppositely arranged with the second surface, and this two Two the second beam bodies of first beam body and this are connected definition and form a hollow region；

Multiple first side plates, are extended vertically by the first surface of two first beam bodies of the rectangular box respectively, and should Multiple first side plates include an at least clasp, direction extension of the clasp from first side plate toward the hollow region；And

Multiple deflectors, are extended vertically by the second surface of second beam body of the rectangular box respectively.

2. buckling component as claimed in claim 1, the thickness of each of which deflector is along second beam body toward the water conservancy diversion The direction of one top surface of plate is gradually thin.

3. buckling component as claimed in claim 1, wherein the plurality of deflector is parallel to each other.

4. buckling component as claimed in claim 3, wherein two second beam bodies are parallel to each other, and the plurality of deflector is distinguished Parallel to two second beam bodies.

5. the buckling component as described in claim 1 or 3, each of which second beam body and the deflector being arranged on Press from both sides an acute angle.

6. buckling component as claimed in claim 1, it also includes multiple elastic arms, and the plurality of elastic arm is respectively by this two the The direction of two beam bodies toward the hollow region is extended, and each elastic arm has a top.

7. a kind of radiating subassembly, including：

One radiator, including a bottom plate and multiple radiators, the plurality of radiator is spaced to be arranged at the bottom plate；And

One buckling component, including：

One rectangular box, including two the first beam bodies, two the second beam bodies, a first surface and a second surface, this two One beam body is oppositely arranged, and two second beam bodies are oppositely arranged, and the first surface is oppositely arranged with the second surface, and this two Two the second beam bodies of first beam body and this are connected definition and form a hollow region, are arranged in the plurality of radiator of the radiator The hollow region；

Multiple first side plates, are extended vertically by the first surface of two first beam bodies of the rectangular box respectively, and should Multiple first side plates include an at least clasp, direction extension of the clasp from first side plate toward the hollow region；And

Multiple deflectors, are extended vertically by the second surface of second beam body of the rectangular box respectively.

8. radiating subassembly as claimed in claim 7, wherein the plurality of deflector and the radiator have a top surface respectively, this is led The beeline of the top surface of stream plate to the first surface of the rectangular box is one first beeline, the plurality of radiator The beeline of the top surface to the bottom plate is one second beeline, and to be more than or equal to this second most short for first beeline Distance.

9. radiating subassembly as claimed in claim 7, each of which radiator is a radiating fin of plate body structure, and each The radiating fin is arranged parallel to each other in the bottom plate.

10. radiating subassembly as claimed in claim 7, the wherein buckling component also include multiple elastic arms, the plurality of elastic arm The direction from two the second beam bodies toward the hollow regions is extended respectively, and each elastic arm has a top, The top is extended by an end of the elastic arm and framework is in the bottom plate for supporting the radiator.

11. radiating subassembly as claimed in claim 10, wherein the plurality of radiator defines to form two along a first direction One white space, the plurality of radiator is arranged as n rows along a second direction, and the radiator do not gone together is spaced sets and fixed Justice forms n-1 the second white spaces, the plurality of elastic arm is respectively contained in corresponding second white space, wherein n is big In or equal to 2 positive integer, the first direction is perpendicular to the second direction.

12. radiating subassembly as claimed in claim 7, the wherein buckling component also include multiple second side plates, the plurality of second Side plate is extended vertically by the first surface of two second beam bodies respectively.

13. radiating subassembly as claimed in claim 12, the wherein quantity of second side plate are two, and the bottom of the radiator Plate also includes two setting passages, and the position of this two setting channels makes two second sides relative to two second side plates Plate is arranged in this two setting passages respectively.

14. radiating subassembly as claimed in claim 7, the thickness of each of which deflector is along second beam body toward the water conservancy diversion The direction of one top surface of plate is gradually thin.

15. radiating subassembly as claimed in claim 7, wherein the plurality of deflector is parallel to each other.

16. radiating subassembly as claimed in claim 15, wherein two second beam bodies are parallel to each other, and the plurality of deflector point Not parallel to two second beam bodies.

17. the radiating subassembly as described in claim 7 or 15, each of which second beam body and the water conservancy diversion being arranged on Plate presss from both sides an acute angle.

18. radiating subassembly as claimed in claim 7, each of which radiator is a circular thermal column or an ellipse radiating Post.

19. radiating subassembly as claimed in claim 7, the wherein radiator also include two the first white spaces, this two the The plurality of radiator is divided into a middle section and two elongated areas by one white space, and the middle section is located at this two Between elongated area, two second beam bodies are located in two first white spaces respectively, the plurality of deflector is held respectively It is placed in two first white spaces.

20. the combining structure of a kind of radiating subassembly and chipset, including：

One chipset, including a chip substrate and a chip；And

One radiating subassembly, including：

One radiator, including a bottom plate and multiple radiators, the plurality of radiator is spaced to be arranged at the bottom plate；And

One buckling component, including：

One rectangular box, including two the first beam bodies, two the second beam bodies, a first surface and a second surface, this two One beam body is oppositely arranged, and two second beam bodies are oppositely arranged, and the first surface is oppositely arranged with the second surface, and this two Two the second beam bodies of first beam body and this are connected definition and form a hollow region, are arranged in the plurality of radiator of the radiator The hollow region；

Multiple first side plates, are extended vertically by the first surface of two first beam bodies of the rectangular box respectively, and should Multiple first side plates include an at least clasp, direction extension of the clasp from first side plate toward the hollow region；And

Multiple deflectors, are extended vertically by the second surface of second beam body of the rectangular box respectively；

Wherein, an at least clasp for the plurality of first side plate of the buckling component is fastened on the chip substrate of the chipset An at least edge for one bottom surface.