CN107093561A - A kind of temperature automatically controlled positioning plastic packaging system - Google Patents
A kind of temperature automatically controlled positioning plastic packaging system Download PDFInfo
- Publication number
- CN107093561A CN107093561A CN201710135994.1A CN201710135994A CN107093561A CN 107093561 A CN107093561 A CN 107093561A CN 201710135994 A CN201710135994 A CN 201710135994A CN 107093561 A CN107093561 A CN 107093561A
- Authority
- CN
- China
- Prior art keywords
- integrated
- touch
- screen
- temperature control
- automatically controlled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims abstract description 20
- 230000006698 induction Effects 0.000 claims abstract description 17
- 230000005693 optoelectronics Effects 0.000 claims abstract description 16
- 238000004891 communication Methods 0.000 claims abstract description 4
- 230000005622 photoelectricity Effects 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 238000005538 encapsulation Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The present invention and semiconductor plastic package apparatus field, specifically related to a kind of temperature automatically controlled positioning plastic packaging system, it is made up of touch-screen, PLC control system, integrated temperature control and optoelectronic induction system, described touch-screen, integrated temperature control and optoelectronic induction system is connected with described PLC communications respectively, and described integrated temperature control couples mouth by integrated heating rod interface and integrated thermal electric and constituted.The present invention is using touch-screen, PLC control system, integrated temperature control and optoelectronic induction system, by being pre-set in PLC control system after parameter, and being precisely controlled and can in real time be shown in touch-screen to the temperature of plastic package press mould is realized by integrated temperature control；Precise positioning between mould is realized by optoelectronic induction system.
Description
Technical field
The present invention and semiconductor plastic package apparatus field, and in particular to a kind of temperature automatically controlled positioning plastic packaging system.
Background technology
As the 4C markets using computer, network service, consumer electronics product and automotive electronics as representative and power supply drive
Dynamic field is developed towards small profile, powerful direction, as crucial core electron component, modern power device also towards
High-power, miniaturization, high frequency trend it is fast-developing, this encapsulation to power device proposes higher requirement.It is main at present
The power device package form of stream has：TO, SOP, DIP, PDFN, QFN, in order to ensure the stability and reliability of these devices,
Temperature control and positioning in encapsulation process are particularly important.
Plastic package press is as the crucial packaging process of power device package, and the stability and precision of plastic packaging system are directly affected
The performance of power device.Semiconductor plastic package encapsulation press needs to install accurate encapsulating mould to carry out hand-operated plastic encapsulation, one
Secondary mould generally requires 16-20 heating rod, press have in 32 heating rod passages, traditional plastic package press mould heating rod with
Press heating rod interface is docked one by one, and press heating rod passage is corresponded with thermocouple passage, and the docking mode is directly contributed
Press interconnector is excessive, causes potential safety hazard.
The content of the invention
The purpose of the present invention is exactly that the one kind for overcoming the deficiencies in the prior art and providing has effectively to plastic package press temperature control
With the temperature automatically controlled positioning plastic packaging system of positioning.
In order to solve the above technical problems, the present invention is adopted the following technical scheme that：
A kind of temperature automatically controlled positioning plastic packaging system, is made up of touch-screen, PLC control system, integrated temperature control and optoelectronic induction system,
Described touch-screen, integrated temperature control and optoelectronic induction system is connected with described PLC communications respectively, and described integrated temperature control is by collecting
Into heating rod interface and integrated thermal electric mouth is coupled to constitute, described integrated heating rod interface be used to connect in plastic package press mould and under
Heating rod in mould, described integrated thermal electric couples mouth and passes through thermocouple connecting line and described integrated heating rod interface and PLC
Control system is connected；Described optoelectronic induction system includes photoelectric sensor, proximity transducer and spiral measuring head, described light
Electric transducer is arranged on the outside of plastic package press guide pillar, and described proximity transducer is arranged on the inner side of plastic package press guide pillar, institute
The spiral measuring head stated is arranged on the bottom of described proximity transducer.
Described touch-screen is TPC1062KS touch-screens.
Described PLC control system CP1H-XA40DT-DPLC.
Compared with prior art, beneficial effects of the present invention are：
The present invention is using touch-screen, PLC control system, integrated temperature control and optoelectronic induction system, by pre- in PLC control system
After first arrange parameter, being precisely controlled and can in real time show in touch-screen to the temperature of plastic package press mould is realized by integrated temperature control
Show；Precise positioning between mould is realized by optoelectronic induction system.
Brief description of the drawings
Fig. 1 is the connection diagram between structure of the present invention.
Embodiment
Plastic packaging system is positioned referring to shown in accompanying drawing 1, one kind is temperature automatically controlled, by touch-screen, PLC control system, integrated temperature control
Constituted with optoelectronic induction system, described touch-screen, integrated temperature control and optoelectronic induction system is communicated with described PLC respectively to be connected
Connect, described integrated temperature control couples mouth by integrated heating rod interface and integrated thermal electric and constituted, described integrated heating rod interface is used
In connection plastic package press upper die and lower die in heating rod, described integrated thermal electric couple mouth by thermocouple connecting line with it is described
Integrated heating rod interface be connected with PLC control system；Described optoelectronic induction system includes photoelectric sensor, proximity transducer
With spiral measuring head, described photoelectric sensor is arranged on the outside of plastic package press guide pillar, and described proximity transducer is arranged on
The inner side of plastic package press guide pillar, described spiral measuring head is arranged on the bottom of described proximity transducer.
Preferably, described touch-screen is TPC1062KS touch-screens.
Preferably, described PLC control system CP1H-XA40DT-DPLC.
The present invention is the accessory system of plastic package press, in use, first by the integrated heating rod interface of integrated temperature control and modeling
Heating rod in pressing machine upper die and lower die is connected, and by thermocouple connecting line by integrated heating rod interface and integrated thermal electric
Couple mouth connection after with PLC control system carry out communication be connected；Entirety is changed to because system connects traditional a plurality of single line
Interface is connected so that plastic semiconductor encapsulation press line is simple, cannot be easily caused Connecting line joint comes off, and changes plastic package die just
It is prompt.
Then the photoelectric sensor of optoelectronic induction system is arranged on to the outside of plastic package press guide pillar, proximity transducer is installed
In the inner side of plastic package press guide pillar, spiral measuring head is arranged on the bottom of described proximity transducer；Spiral measuring head has height
The regulation of precision size, the data that can be read by spiral measuring head adjust the cooperation of proximity transducer and workbench, connect
After nearly sensor adjustment, plastic package press operationally, the proximity transducer and photoelectricity in outside in plastic package press guide pillar
Sensor is capable of the position of monitoring work platform in real time, can also in real time be shown in touch-screen by optoelectronic induction system when breaking down
The data shown judge out-of-the way position, are easy to processing in time, it is possible to prevente effectively from burn failure or scrapping.Present system is set
Meter is reasonable, meets the production needs of integrated circuit plastic packaging, energy effective guarantee product quality, and the safety used for equipment and maintenance
Provide a great convenience.
Claims (3)
1. a kind of temperature automatically controlled positioning plastic packaging system, it is characterised in that：By touch-screen, PLC control system, integrated temperature control and photoelectricity
Induction system is constituted, and described touch-screen, integrated temperature control and optoelectronic induction system is connected with described PLC communications respectively, described
Integrated temperature control mouth coupled by integrated heating rod interface and integrated thermal electric constituted, described integrated heating rod interface, which is used to connect, to be moulded
Heating rod in pressing machine upper die and lower die, described integrated thermal electric couple mouth by thermocouple connecting line with it is described integrated plus
Hot pin interface is connected with PLC control system；Described optoelectronic induction system includes photoelectric sensor, proximity transducer and spiral and surveyed
Head is tried, described photoelectric sensor is arranged on the outside of plastic package press guide pillar, and described proximity transducer is arranged on plastic package press
The inner side of guide pillar, described spiral measuring head is arranged on the bottom of described proximity transducer.
2. the temperature automatically controlled positioning plastic packaging system of one kind according to claim 1, it is characterised in that：Described touch-screen is
TPC1062KS touch-screens.
3. the temperature automatically controlled positioning plastic packaging system of one kind according to claim 1, it is characterised in that：Described PLC controls system
Unite CP1H-XA40DT-DPLC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710135994.1A CN107093561A (en) | 2017-03-08 | 2017-03-08 | A kind of temperature automatically controlled positioning plastic packaging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710135994.1A CN107093561A (en) | 2017-03-08 | 2017-03-08 | A kind of temperature automatically controlled positioning plastic packaging system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107093561A true CN107093561A (en) | 2017-08-25 |
Family
ID=59649336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710135994.1A Pending CN107093561A (en) | 2017-03-08 | 2017-03-08 | A kind of temperature automatically controlled positioning plastic packaging system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107093561A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007090845A2 (en) * | 2006-02-07 | 2007-08-16 | I.R.C.A. S.P.A. Industria Resistenze Corazzate E Affini | Heating element temperature control system |
| CN202862460U (en) * | 2012-11-01 | 2013-04-10 | 江阴苏阳电子股份有限公司 | Intelligent positioning system of semiconductor packaging mold |
| CN203210645U (en) * | 2013-04-28 | 2013-09-25 | 江南大学 | Intelligent temperature switching system for semiconductor plastic packaging press |
-
2017
- 2017-03-08 CN CN201710135994.1A patent/CN107093561A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007090845A2 (en) * | 2006-02-07 | 2007-08-16 | I.R.C.A. S.P.A. Industria Resistenze Corazzate E Affini | Heating element temperature control system |
| CN202862460U (en) * | 2012-11-01 | 2013-04-10 | 江阴苏阳电子股份有限公司 | Intelligent positioning system of semiconductor packaging mold |
| CN203210645U (en) * | 2013-04-28 | 2013-09-25 | 江南大学 | Intelligent temperature switching system for semiconductor plastic packaging press |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170825 |