CN107088706A - Multi-point sensing laser scanning manufacturing system - Google Patents
Multi-point sensing laser scanning manufacturing system Download PDFInfo
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- CN107088706A CN107088706A CN201710369471.3A CN201710369471A CN107088706A CN 107088706 A CN107088706 A CN 107088706A CN 201710369471 A CN201710369471 A CN 201710369471A CN 107088706 A CN107088706 A CN 107088706A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000012545 processing Methods 0.000 claims abstract description 68
- 238000003384 imaging method Methods 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 20
- 230000008569 process Effects 0.000 claims abstract description 15
- 238000005259 measurement Methods 0.000 claims abstract description 5
- 230000003287 optical effect Effects 0.000 claims description 13
- 238000012937 correction Methods 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000005286 illumination Methods 0.000 claims description 4
- 238000004364 calculation method Methods 0.000 claims description 2
- 238000001514 detection method Methods 0.000 claims description 2
- 230000009897 systematic effect Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 238000009529 body temperature measurement Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 235000013372 meat Nutrition 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 241001310793 Podium Species 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000009123 feedback regulation Effects 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention relates to a kind of multi-point sensing laser scanning manufacturing system, including collimation laser light source, galvanometer system, telecentricity achromatism scanning objective, lighting source, coaxially indicates light-source system, CCD imaging systems, paraxonic calibration light source, infrared measurement of temperature unit, power detecting unit and control system；The present invention will coaxially indicate to process luminous point, paraxonic corrects auto-focusing, CCD imaging systems, ultraviolet achromatism, temperature measurer, the functional module of the aspect of power meter etc. six is incorporated into laser-processing system, to the accurate positioning occurred in laser processing procedure, working power is constant, and processing temperature is stable, telecentricity achromatism, the problems such as multiband mixed-color light is focused on has carried out systematic solution, so that changing, laser-processing system is more intelligent, reaches the purpose for being precisely controlled processing, meets the demand of high-precision laser processing.
Description
Technical field
The present invention relates to technical field of laser processing, more particularly to intelligent sensing laser scanning manufacturing system.
Background technology
With continuing to develop, it is necessary to which the medium kind processed increasingly increases for laser processing technology, it is desirable to process
Effect is also increasingly finer, is laser machined using Ultra-Violet Laser more and more extensive.Ultra-Violet Laser has focal beam spot small, plus
The features such as work heat affected area is small, is widely used in terms of hyperfine mark, special material mark and delineation.Ultraviolet
Laser processing application field, not only requires clear patterns that its scribing goes out, accurate, and more and more requirements can be to processing object
Carry out craft or image accurate contraposition or working condition is monitored in real time.It is traditionally used for the F-Theta mirrors of Ultra-Violet Laser marking
Head, only carries out anaberration design to Ultra-Violet Laser wave band, there is aberration, laser spot and imaging if for visual light imaging
Focus is misaligned, causes imaging unclear and aligns inaccurate.
In laser processing procedure, the crudy of sample and the laser power of processing, processing temperature, position positioning, to swashing
The factors such as the focusing of light beam are closely related, and the control to these factors is to realize the necessary factor that intelligent precision laser is processed.Pass
The laser-processing system of system does not have a perfect system and carries out coordinating each other control to all factors with coordinating, and deposits
Machining accuracy is high, the deficiency of product quality defect that processes.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of multi-point sensing laser scanning manufacturing system, existing to overcome
The deficiency for the product quality defect that presence machining accuracy present in technology is not high, process.
In order to solve the above technical problems, the multi-point sensing laser scanning manufacturing system that the present invention is provided, including collimation laser
Light source, galvanometer system, scanning objective, lighting source, it is characterised in that indicate light-source system including coaxial, CCD imaging systems,
Paraxonic calibration light source and control system；
The scanning objective is telecentricity achromatism scanning objective, for the light of a variety of different wave lengths to be focused to one
Point, and the light incident to different angles realize telecentricity achromatism；
The coaxial instruction light-source system includes indicating light source and the coaxial device of light, and the coaxial device of light is used to make instruction light source
Light and collimation laser light source light it is coaxial；The light of the light and collimation laser light source for indicating light source, passes through the galvanometer system
Workpiece to be processed surface is focused on after system, again by the telecentricity achromatism scanning objective, the coaxial instruction light source is to be added
Work workpiece surface formation processing luminous point；
The lighting source is located at below the telecentricity achromatism scanning objective, and the illumination that it sends is to be processed
Workpiece surface；
The paraxonic calibration light source is located above the side of workpiece to be processed, and its outgoing light direction various dimensions is adjustable, and is treating
Process workpiece surface formation correction luminous point；
The multi-wavelength reflected light on the workpiece to be processed surface is passed through after telecentricity achromatism scanning objective, galvanometer system by institute
The seizure of CCD imaging systems is stated, the image that the CCD imaging systems are caught is sent to control system calculation process；
When the processing luminous point that the CCD imaging systems are captured and misaligned correction luminous point, the control system passes through
The height of processing platform is adjusted, makes processing luminous point keep overlapping in real time with correction luminous point.
The scheme further optimized is that this multi-point sensing laser scanning manufacturing system also includes infrared measurement of temperature unit, described
Infrared measurement of temperature unit includes infrared sensor and the first optical mirror slip, and the infrared sensor connects control system；Described first
Optical mirror slip receives the multi-wavelength reflected light on workpiece to be processed surface from galvanometer system, projects on infrared sensor, control system
System receives the signal of the infrared sensor, calculates the temperature on workpiece to be processed surface.
Further, the control system connection collimation laser light source；When the temperature on workpiece to be processed surface is higher than setting
During value, the control system adjusts the collimation laser light source.
Further, this multi-point sensing laser scanning manufacturing system also includes power detecting unit, the power detection
Unit includes power meter and the second optical mirror slip, and the power meter connects the control system；Second optical mirror slip is from shaking
Mirror system receives the multi-wavelength reflected light on workpiece to be processed surface, projects on the power meter, and control system receives the work(
The signal of rate meter, calculates the laser power on workpiece to be processed surface.
Further, the control system connection collimation laser light source；When the laser power in process is higher than setting
During value, the control system adjusts the collimation laser light source.
Optimal, this multi-point sensing laser scanning manufacturing system also includes display system, connects with the CCD imaging systems
Connect, the image that the CCD imaging systems are captured is sent to the display system, the display system is used to supply operating personnel's meat
Eye observation.
The present invention will coaxially indicate to process luminous point, paraxonic correction auto-focusing, CCD imaging systems, ultraviolet achromatism, thermometric
Instrument, the functional module of the aspect of power meter etc. six is incorporated into laser-processing system, to the positioning accurate occurred in laser processing procedure
Standard, working power is constant, and processing temperature is stable, and telecentricity achromatism, the problems such as multiband mixed-color light is focused on has carried out systematicness
Solution so that change that laser-processing system is more intelligent, reach the purpose for being precisely controlled processing, meet high-precision laser processing
Demand.
Brief description of the drawings
Technical scheme is further described in detail with reference to the accompanying drawings and detailed description.
Fig. 1 is the structure principle chart of multi-point sensing laser scanning manufacturing system.
Fig. 2 is the object construction outline drawing of multi-point sensing laser scanning manufacturing system.
Embodiment
Fig. 1 represents multi-point sensing laser scanning manufacturing systematic schematic diagram, it may be seen that each function from schematic diagram
Position and orthofunction relation between module, the dotted line frame indicated by label 1 are the work at workpiece to be processed and its place
Platform, the workbench can adjusting position up and down.
Dotted line frame indicated by label 2 is lighting source and the camera lens being installed together with it, produced illumination light
Source wavelength is 850nm.
Dotted line frame indicated by label 3 represents F- θ telecentricity achromatism scanning objectives, and telecentricity achromatism scanning objective 3 is main
For the light of a variety of different wave lengths to be focused into a bit, and the light incident to different angles realizes a telecentricity colour killing
The function of difference.
Wire frame representation galvanometer system 4 indicated by label 4, the inside of galvanometer system 4 is respectively X, Y mirrors containing two panels eyeglass
Piece, position adjustments are carried out on X, Y-direction to hot spot.The light of F- θ telecentricity achromatisms scanning objective 3 enters galvanometer first 4, galvanometer system
The first multiwave length spectro mirror 11 and the second multiwave length spectro mirror 12 are successively provided with the light path of system 4.
Dotted line frame indicated by label 5 is power monitoring system, laser power in process can in real time be monitored, exceeded
Preset range (30w--200w preferably) can then feed back to control system, and control system takes appropriate measures.
Dotted line frame indicated by label 6 is CCD imaging systems, work piece surface can be imaged, and be shown to computer
Desktop is operated, man-machine interaction is realized, observation process is more convenient, to realize the purpose monitored in real time.
Dotted line frame indicated by label 7 is infrared radiation thermometer, in real time the temperature change in monitoring process, feedback regulation
Temperature (100-600 DEG C again of control temperature range preferably) in process, to be unlikely to because of the too high damage work of processing temperature
Part causes security incident etc..
The light splitting all the way of first multiwave length spectro mirror 11 enters infrared radiation thermometer 7, and the second tunnel light splitting enters the second multi-wavelength
Spectroscope 12, the 3rd tunnel light splitting enters the 3rd multiwave length spectro mirror 14.The two-way light splitting of second multiwave length spectro mirror 12 is entered respectively
Enter CCD imaging systems 6, infrared temperature measurement system 7.
3rd multiwave length spectro mirror 14, the 4th multiwave length spectro mirror 13 are respectively in the light path of F45 collimating mirrors；
Dotted line frame indicated by label 8 is F45 collimating mirrors, and F45 collimating mirrors 8 are connected as processing workpiece by transmitting optical fiber and carried
Energize the LASER Light Source of driving source.
Dotted line frame indicated by label 9 indicates optical generator for processing stand, and processing stand indicates the processing that optical generator 9 is sent
Point indicates light path coaxial of the light by the 4th multiwave length spectro mirror 13 and F45 collimating mirrors 8, and processing stand indicates that optical generator 9 is sent
Light and Laser Processing light source light successively by the 3rd multiwave length spectro mirror 14, the first multiwave length spectro mirror 11, galvanometer first 4, remote
Heart achromatism scanning objective is reached on processing workpiece.Processing stand indicates light in one red location spot of workpiece surface formation, meat
Eye is visible, convenient to adjust Working position and inform the information such as Working position.
First multiwave length spectro mirror 11, the second multiwave length spectro mirror 12, the 3rd multiwave length spectro mirror 14, the 4th multi-wavelength point
Light microscopic 13, realizes and carries out light splitting to different color light or close the function of beam respectively.
Dotted line frame indicated by label 10 is a paraxonic laser generator, for being moved in Laser Processing, workpiece
During, judge to be processed point whether on the focal plane of telecentricity achromatism scanning objective.The verification of paraxonic laser generator 10 adds
Whether principle on the focal plane of telecentricity achromatism scanning objective is as follows for work point：
The light spot position of the first step, correction paraxonic laser generator 10：
First, before processing, the height of processing platform is adjusted, makes Laser Processing point on processing platform to telecentricity achromatism
The distance between scanning objective is telecentricity achromatism scanning objective focal length；
Then, open processing stand and indicate optical generator 9, processing stand indicates that the processing stand that optical generator 9 is sent indicates that light falls
On Laser Processing point on work platform；
Paraxonic laser generator 10 is opened, makes its Laser Processing point direction on directive that emits beam, a paraxonic is formed
Laser generator luminous point；
The orientation of paraxonic laser generator 10 is adjusted, paraxonic laser generator luminous point is indicated 2 points of light luminous point with processing stand
Overlap；
The position of fixed paraxonic laser generator 10.
Second step, using the light spot position of paraxonic laser generator 10 as calibration standard, adjust workbench height：
In laser processing procedure, keep the paraxonic laser generator 10 after correction position open-minded；
When processing stand indicates that luminous point is misaligned with paraxonic laser generator luminous point, the adjustment processing of processing platform control system
Podium level, overlaps the two, i.e. focal point of the Laser Processing point in telecentricity achromatism scanning objective.
It is above-mentioned to judge that processing stand indicates whether luminous point overlaps with paraxonic laser generator luminous point, it is by CCD imaging systems 6
Take pictures in real time, processing platform control system is obtained after carrying out image procossing.
Processing platform control system indicates luminous point and paraxonic laser generator luminous point by triangulation according to processing stand
Relative position, judge to the adjustment direction (heighten or turn down) of processing platform and adjustment amplitude.
When multi-point sensing laser scanning manufacturing system operation, all parts co-ordination simultaneously feeds back to master control system in time
System, realizes intelligent and safe processing in high precision, and this system has been manufactured that corresponding product, and systematic function has obtained testing for reality
Card, operational excellence obtains the consistent favorable comment of user.
Fig. 2 is by the object construction outline drawing made of Fig. 1 schematic diagrams, and it is mutually corresponding that all parts mark unit with Fig. 1.
Coupling part between part 4,5,6,7,8,9 is spectroscope combined utensil, spectroscope combined utensil realize in Fig. 1 each is more
The function of measuring spectroscope 11,12,13,14.
The present invention the method for operation be：It is that lighting source is irradiated to workpiece surface first, is caught and laser machined by CCD systems
Dot image, sending control system, and human-computer interaction interface is shown to there is provided the observation to workpiece surface, manual adjustment, control is dry
In advance.Control system automatically analyzes image, and by triangulation, luminous point and paraxonic laser generator luminous point are indicated according to processing stand
Relative position, judge adjustment direction (heighten or turn down) to processing platform, calculate adjustment amplitude；Adjust the height of processing platform
Degree, makes work piece surface constantly be maintained on the scanning objective focal length of processing laser.Infrared temperature measurement system ensures in process
Processing temperature, for example, 100 DEG C of processing temperature in process -- 600 DEG C.Power monitoring system ensures power in controlled range
It is interior, for example, working power control is in 30--200w, in order to avoid workpiece is caused to damage or cause danger.
The laser-processing system of the present invention realizes automatic focusing, and laser power, processing temperature, to multiwave are monitored in real time
Light is focused realizes real time human-machine interaction with telecentricity achromatism, real-time capture workpiece surface image so that control processing is more square
Just, accurately.
It should be noted last that, above embodiment is merely illustrative of the technical solution of the present invention and unrestricted,
Although the present invention is described in detail with reference to preferred embodiment, it will be understood by those within the art that, can be right
Technical scheme is modified or equivalent substitution, and without departing from the spirit and scope of technical solution of the present invention, its is equal
It should cover among scope of the presently claimed invention.
Claims (6)
1. a kind of multi-point sensing laser scanning manufacturing system, including collimation laser light source, galvanometer system, scanning objective, illumination light
Source, it is characterised in that indicate light-source system, CCD imaging systems, paraxonic calibration light source and control system including coaxial；
The scanning objective is telecentricity achromatism scanning objective, for the light of a variety of different wave lengths to be focused into a bit, with
And incident light realizes telecentricity achromatism to different angles；
The coaxial instruction light-source system includes indicating light source and the coaxial device of light, and the coaxial device of light is used to make the light of instruction light source
Light with collimation laser light source is coaxial；The light of light and the collimation laser light source for indicating light source, by after the galvanometer system,
Workpiece to be processed surface is focused on by the telecentricity achromatism scanning objective again, the coaxial instruction light source is in workpiece to be processed
Surface forms processing luminous point；
The lighting source is located at below the telecentricity achromatism scanning objective, and the illumination that it sends is in workpiece to be processed
Surface；
The paraxonic calibration light source is located above the side of workpiece to be processed, and its outgoing light direction various dimensions is adjustable, and to be processed
Workpiece surface formation correction luminous point；
The multi-wavelength reflected light on the workpiece to be processed surface is passed through after the telecentricity achromatism scanning objective, galvanometer system by institute
The seizure of CCD imaging systems is stated, the image that the CCD imaging systems are caught is sent to control system calculation process；
When the processing luminous point that the CCD imaging systems are captured and misaligned correction luminous point, the control system passes through adjustment
The height of processing platform, makes processing luminous point keep overlapping in real time with correction luminous point.
2. multi-point sensing laser scanning manufacturing system according to claim 1, it is characterised in that also including infrared measurement of temperature list
Member, the infrared measurement of temperature unit includes infrared sensor and the first optical mirror slip, and the infrared sensor connects control system；Institute
The multi-wavelength reflected light that the first optical mirror slip receives workpiece to be processed surface from the galvanometer system is stated, infrared sensor is projected
On, control system receives the signal of the infrared sensor, calculates the temperature on workpiece to be processed surface.
3. multi-point sensing laser scanning manufacturing system according to claim 2, it is characterised in that the control system connection
Collimation laser light source；When the temperature on workpiece to be processed surface is higher than setting value, the control system adjusts the collimation laser
Light source.
4. the multi-point sensing laser scanning manufacturing system according to one of claims 1 to 3, it is characterised in that also including work(
Rate detection unit, the power detecting unit includes power meter and the second optical mirror slip, the power meter connection control system
System；Second optical mirror slip receives the multi-wavelength reflected light on workpiece to be processed surface from the galvanometer system, projects described
On power meter, control system receives the signal of the power meter, calculates the laser power on workpiece to be processed surface.
5. multi-point sensing laser scanning manufacturing system according to claim 4, it is characterised in that the control system connection
Collimation laser light source；When the laser power in process is higher than setting value, the control system adjusts the collimation laser
Light source.
6. multi-point sensing laser scanning manufacturing system according to claim 1, it is characterised in that also including display system,
It is connected with the CCD imaging systems, the image that the CCD imaging systems are captured is sent to the display system, the display
System is used to visually observe for operating personnel.
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| CN201710369471.3A CN107088706B (en) | 2017-05-23 | 2017-05-23 | Multipoint sensing laser scanning processing system |
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| CN201710369471.3A CN107088706B (en) | 2017-05-23 | 2017-05-23 | Multipoint sensing laser scanning processing system |
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| CN107088706B CN107088706B (en) | 2023-03-14 |
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| CN107953028A (en) * | 2017-12-28 | 2018-04-24 | 东莞市盛雄激光设备有限公司 | A kind of monitoring device of bessel beam |
| CN109068034A (en) * | 2018-08-31 | 2018-12-21 | 上海集成电路研发中心有限公司 | A kind of number paraxonic structure, camera and macula lutea focusing method |
| CN109317821A (en) * | 2017-07-24 | 2019-02-12 | 北京中科镭特电子有限公司 | A kind of laser welding system |
| CN110340516A (en) * | 2019-06-21 | 2019-10-18 | 苏州市长峰激光技术有限公司 | A kind of laser process equipment and processing method based on temperature detection |
| CN111730214A (en) * | 2020-07-15 | 2020-10-02 | 广州三义激光科技有限公司 | A special device for laser cutting diamond material |
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| CN112484657A (en) * | 2019-08-23 | 2021-03-12 | 松下知识产权经营株式会社 | Laser processing device, laser processing method, and correction data generation method |
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| CN111730214A (en) * | 2020-07-15 | 2020-10-02 | 广州三义激光科技有限公司 | A special device for laser cutting diamond material |
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| CN112393744B (en) * | 2020-11-17 | 2022-11-22 | 中国航空工业集团公司西安飞行自动控制研究所 | MEMS gyroscope online laser trimming system with frequency measurement function and method |
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| CN112828452B (en) * | 2020-12-31 | 2022-07-01 | 武汉华工激光工程有限责任公司 | Two-dimensional laser point cloud scanning imaging processing device and processing method |
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