CN107084550A - Semiconductor refrigerating component and ice cream maker - Google Patents
Semiconductor refrigerating component and ice cream maker Download PDFInfo
- Publication number
- CN107084550A CN107084550A CN201610087558.7A CN201610087558A CN107084550A CN 107084550 A CN107084550 A CN 107084550A CN 201610087558 A CN201610087558 A CN 201610087558A CN 107084550 A CN107084550 A CN 107084550A
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- liquid
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- heat
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- semiconductor refrigerating
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 86
- 235000015243 ice cream Nutrition 0.000 title claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 128
- 239000002184 metal Substances 0.000 claims abstract description 128
- 239000000758 substrate Substances 0.000 claims abstract description 105
- 239000007788 liquid Substances 0.000 claims abstract description 103
- 238000001816 cooling Methods 0.000 claims abstract description 68
- 239000000110 cooling liquid Substances 0.000 claims abstract description 54
- 230000005611 electricity Effects 0.000 claims abstract description 38
- 239000011159 matrix material Substances 0.000 claims abstract description 31
- 239000004411 aluminium Substances 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- 239000012530 fluid Substances 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 abstract description 13
- 229910000679 solder Inorganic materials 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000003466 welding Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000002360 explosive Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 241000270295 Serpentes Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23G—COCOA; COCOA PRODUCTS, e.g. CHOCOLATE; SUBSTITUTES FOR COCOA OR COCOA PRODUCTS; CONFECTIONERY; CHEWING GUM; ICE-CREAM; PREPARATION THEREOF
- A23G9/00—Frozen sweets, e.g. ice confectionery, ice-cream; Mixtures therefor
- A23G9/04—Production of frozen sweets, e.g. ice-cream
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Food Science & Technology (AREA)
- Polymers & Plastics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention provides a kind of semiconductor refrigerating component and ice cream maker, wherein, semiconductor refrigerating component includes：Semi-conductor electricity couple, the cold end substrate being connected with semi-conductor electricity couple cold end, the hot junction substrate and liquid cooling device being connected with semi-conductor electricity couple hot junction；Wherein, hot junction substrate includes metal substrate and the thermally conductive insulating layer being connected between metal substrate and semi-conductor electricity couple；Liquid cooling device includes：Opened up on the liquid cooling matrix being connected with metal substrate, the mounting surface that liquid cooling matrix is connected with metal substrate and put liquid bath, put the cooling liquid provided with flowing between liquid bath and metal substrate；The hot junction face that metal substrate is connected with liquid cooling matrix is provided with metallic plate；Metallic plate is provided with least two metal heat-conducting portions, and metal heat-conducting portion stretches into described put in liquid bath.The semiconductor refrigerating component and ice cream maker that the present invention is provided can improve the rate of heat dispation in semi-conductor electricity couple hot junction, can realize high-power refrigeration.
Description
Technical field
The present invention relates to semiconductor refrigerating technology, more particularly to a kind of semiconductor refrigerating component and ice cream maker.
Background technology
Semiconductor refrigeration chip (TEC, Thermoelectric Cooler) is to utilize Peltier (Peltier) effect system
Into a kind of refrigeration device, its main structure is semi-conductor electricity couple (also referred to as P-N galvanic couples to), when to semi-conductor electricity couple
Add after certain voltage, the cold end of semi-conductor electricity couple and hot junction can produce certain temperature difference.When the heat quilt in its hot junction
After distributing, its cold end can produce certain cold, realize refrigeration.The refrigeration device body being made due to semiconductor refrigeration chip
The small, high cooling efficiency of product, has begun to be promoted and apply in the small household appliances such as ice cream maker.
Fig. 1 is a kind of existing structural representation of semiconductor refrigerating component.As shown in figure 1, existing a kind of using partly
The cooling assembly that conductor refrigerating chip is made includes cold end substrate 11, semi-conductor electricity couple 12 and hot junction substrate 13, wherein, partly lead
Body galvanic couple is connected to 12 cold end by cold terminal electrodes 14 with cold end substrate 11, and the hot junction of semi-conductor electricity couple 12 passes through hot junction electricity
Pole 15 is connected with a side surface of hot junction substrate 13, is attached especially by the mode of welding.The opposite side of hot junction substrate 13
Surface soldered has radiator structure, and the radiator structure includes heat-radiating substrate 16 and fin 17, wherein, heat-radiating substrate 16 is welded on hot junction
On substrate 13.The heat in the hot junction of semi-conductor electricity couple 12 is first conducted to hot junction substrate 13 by solder, then passes through heat-radiating substrate 16
Conduction carries out heat exchange, the heat in the hot junction of drop semi-conductor electricity couple 12 to fin 17 by fin 17 and the air of surrounding.
In above-mentioned cooling assembly, because hot junction substrate 13 and heat-radiating substrate 16 are fixed by way of welding, partly lead
Body galvanic couple sequentially passes through hot junction substrate 13, solder and heat-radiating substrate 16 to the heat in 12 hot junctions and conducted, and removes hot junction substrate
13 and the thermal resistance that itself has of heat-radiating substrate 16 outside, solder therebetween has a strong impact on there is also larger thermal resistance
The conduction velocity of heat.Also, fin and the speed that surrounding air carries out heat exchange are also very low, also largely influence
The distributing of the hot junction heat of semi-conductor electricity couple 12.Therefore, by solder there is larger thermal resistance and fin to carry out heat exchange with air
Slow influence, existing semiconductor refrigerating component is only applicable to small-power refrigeration, and can not realize high-power refrigeration.
The content of the invention
The present invention provides a kind of semiconductor refrigerating component and ice cream maker, the radiating for improving semi-conductor electricity couple hot junction
Speed, can realize high-power refrigeration.
The embodiment of the present invention provides a kind of semiconductor refrigerating component, including：It is semi-conductor electricity couple, cold with semi-conductor electricity couple
The connected cold end substrate in end, the hot junction substrate and liquid cooling device that are connected with semi-conductor electricity couple hot junction；Wherein, it is described
Hot junction substrate includes metal substrate and the thermally conductive insulating layer being connected between metal substrate and semi-conductor electricity couple；
Liquid cooling device includes：The liquid cooling matrix being connected with metal substrate, the liquid cooling matrix and metal
Opened up on the connected mounting surface of substrate and put liquid bath, the cooling liquid put provided with flowing between liquid bath and metal substrate；
The hot junction face that the metal substrate is connected with liquid cooling matrix is provided with metallic plate, the metallic plate along with it is described
The parallel direction extension in hot junction face；The metallic plate is provided with along at least two metal heat-conductings extended perpendicular to hot junction face direction
Portion, the metal heat-conducting portion stretches into described put in liquid bath.
Semiconductor refrigerating component as described above, bottom wall inner surface of the liquid cooling matrix away from metal substrate is provided with
At least one dividing plate between the bottom wall inner surface and metal substrate is supported, at least one dividing plate will put liquid bath and be divided into snake
The flow channel for liquids of shape, the cooling liquid flows in the flow channel for liquids.
Semiconductor refrigerating component as described above, the position in the metal heat-conducting portion is corresponding with the flow channel for liquids.
Semiconductor refrigerating component as described above, the area of the metallic plate is more than the aperture area for putting liquid bath.
Semiconductor refrigerating component as described above, the surface that the metal heat-conducting portion is contacted with cooling liquid is provided with recessed
Hole.
On semiconductor refrigerating component as described above, the end of bottom wall of the metal heat-conducting portion towards liquid cooling matrix
Provided with gap.
Set on semiconductor refrigerating component as described above, the liquid cooling matrix on the side wall adjacent with the bottom wall
There are inlet and liquid outlet, the inlet and liquid outlet are corresponding with the top of the flow channel for liquids and the position of end respectively；
The inlet and liquid outlet also connect to form cooling circuit with outside cooling line, and the cooling circuit is provided with liquid
Pump.
It is additionally provided with semiconductor refrigerating component as described above, the cooling circuit in heat exchanger, the heat exchanger
Provided with the fluid passage connected with the cooling line；
The liquid cooling device also includes the cooling fan for being used to radiate to the heat exchanger.
Semiconductor refrigerating component as described above, the metal substrate is aluminium base.
The embodiment of the present invention also provides a kind of ice cream maker, including semiconductor refrigerating component as described above.
The technical scheme that the embodiment of the present invention is used is connected by using liquid cooling matrix with the hot junction face of metal substrate,
And metallic plate is set on the face of hot junction, and metal heat-conducting portion is set on a metal plate, so that liquid cooling matrix and metal substrate
Between cooling liquid can directly be contacted with metal heat-conducting portion and metallic plate, heat exchange area is improved to a certain extent, increase
Big heat exchange amount so that cooling liquid can absorb the heat of metal substrate rapidly, reduces the temperature of metal substrate, also further fast
Speed reduces the temperature in semi-conductor electricity couple hot junction, is advantageously implemented high-power refrigeration.
Brief description of the drawings
Fig. 1 is a kind of existing structural representation of semiconductor refrigerating component；
Fig. 2 is the explosive view of semiconductor refrigerating component provided in an embodiment of the present invention；
Fig. 3 is the perspective view of metallic plate in semiconductor refrigerating component provided in an embodiment of the present invention；
Fig. 4 is the schematic diagram of Section A-A in Fig. 3；
Fig. 5 is the structural representation of semiconductor refrigerating component provided in an embodiment of the present invention；
Fig. 6 is the schematic diagram of section B-B in Fig. 5；
Fig. 7 is the structural representation in metallic plate and metal heat-conducting portion in semiconductor refrigerating component provided in an embodiment of the present invention
Figure；
Fig. 8 is the structural representation of metallic plate in semiconductor refrigerating component provided in an embodiment of the present invention；
Fig. 9 be Fig. 8 in C-C sections schematic diagram；
Figure 10 is the another structure in metallic plate and metal heat-conducting portion in semiconductor refrigerating component provided in an embodiment of the present invention
Schematic diagram；
Figure 11 is the another structural representation of semiconductor refrigerating component provided in an embodiment of the present invention.
Reference：
11- cold end substrates；12- semi-conductor electricity couples；13- hot junctions substrate；
14- cold terminal electrodes；15- hotter side electrodes；16- heat-radiating substrates；
17- fins；18- metal substrates；21- liquid cooling matrixes；
22- puts liquid bath；23- dividing plates；24- inlets；
25- liquid outlets；26- cooling lines；27- liquid pumps；
28- heat exchangers；29- cooling fans；210- seal grooves；
211- sealing rings；31- pits；32- gap；
131- metallic plates；132- metal heat-conductings portion.
Embodiment
Fig. 2 is the explosive view of semiconductor refrigerating component provided in an embodiment of the present invention, and Fig. 3 provides for the embodiment of the present invention
Semiconductor refrigerating component in metallic plate perspective view, Fig. 4 be Fig. 3 in Section A-A schematic diagram, Fig. 5 is the embodiment of the present invention
The structural representation of the semiconductor refrigerating component of offer, Fig. 6 is the schematic diagram of section B-B in Fig. 5.The present embodiment provides a kind of half
Conductor cooling assembly, including：Semi-conductor electricity couple 12, the cold end substrate 11 being connected with the cold end of semi-conductor electricity couple 12, with partly leading
Hot junction substrate and liquid cooling device that body galvanic couple 12 is connected to hot junction.
Wherein, the cold end of semi-conductor electricity couple (also referred to as P-N galvanic couples to) 12 is connected to cold end base by cold terminal electrodes 14
It is on plate 11, such as solderable on cold end substrate 11.Cold end substrate 11 can be Al2O3 ceramic substrates or aluminium base, its area
For 70mm × 50mm.The hot junction of semi-conductor electricity couple 12 is connected on the substrate of hot junction by hotter side electrode 15, for example, pass through welding
Mode be connected on the substrate of hot junction.
Hot junction substrate includes metal substrate 18 and the heat conduction being connected between metal substrate 18 and semi-conductor electricity couple 12
Insulating barrier (not shown).Specifically, cold end face will be referred to as towards the surface of semi-conductor electricity couple 12 in metal substrate 18, carry on the back
Surface from semi-conductor electricity couple 12 is referred to as hot junction face.Thermally conductive insulating layer is laid in the cold end face of metal substrate 18.Semi-conductor electricity
The hot junction of couple 12 is connected in thermally conductive insulating layer by hotter side electrode 15, in addition, hotter side electrode 15 and thermally conductive insulating layer it
Between be additionally provided with conductive layer, for example with copper into.
Liquid cooling device includes：The liquid cooling matrix 21 being connected with the hot junction face of metal substrate 18, the liquid cooling
Matrix 21 is mounting surface towards the surface of metal substrate 18, and the mounting surface is connected with metal substrate 18, and opens up and put on mounting surface
Liquid bath 22, puts the cooling liquid provided with flowing between liquid bath 22 and metal substrate 18, then cooling liquid can be with metal substrate 18
Hot junction face directly contact.Cooling liquid can be cooling agent commonly used in the prior art, the liquid of such as water or good fluidity
Compound etc., the present embodiment uses deionized water, and its specific heat is larger, and without any metal ion, it is to avoid to metal substrate
18 produce corrosion.
Metallic plate 131 is provided with the hot junction face of metal substrate 18, metallic plate 131 is laid on the face of hot junction, namely along with
The parallel direction extension in hot junction face.Metallic plate 131 is provided with least two metal heat-conducting portions 132, and metal heat-conducting portion 132 is along vertical
Extend to stretch into the direction in hot junction face and put in liquid bath 22, contacted with cooling liquid.Metal heat-conducting portion 132 is illustrated for convenience
Structure, metallic plate 131 shown in Fig. 2 is perspective view, and metal heat-conducting portion 132 is located at the lower section of metallic plate 131.
In above-mentioned technical proposal, the heat exchange amount Q between metal substrate 18 and cooling liquid can be obtained by the formula that exchanges heat as follows
Arrive：
Q=hA (Th-Tw),
Wherein, h is the coefficient of heat transfer between metal substrate 18 and cooling liquid, A be metal substrate 18 and cooling liquid it
Between heat exchange area, ThFor the temperature in the hot junction face of metal substrate 18, TwFor the temperature of cooling liquid.
It can be released by above-mentioned heat exchange formula：
As the heat exchange amount Q and temperature T for cooling liquidwOne timing, can using improve metal substrate 18 and cooling liquid it
Between coefficient of heat transfer h and heat exchange area A mode reach the temperature T in reduction metal substrate 18 hot junction facehPurpose.Due to gold
Category substrate 18 limited area of itself, and in order to ensure heat-conducting effect, the thickness of metal substrate 18 is also limited, therefore, this implementation
Example sets the scheme in metallic plate 131 and metal heat-conducting portion 132 using the above-mentioned hot junction face in metal substrate 18, can increase metal
Substrate 18 and the contact area of cooling liquid, have also just reached the purpose for improving heat exchange area A and improving coefficient of heat transfer h.
Specifically, above-mentioned formula is further entered into line translation, obtain：
I.e.：By heat exchanging part thermal resistance between metal substrate 18 and cooling liquidIt is decomposed into two parts：Thermal-conduction resistance RTWith
New heat exchanging part thermal resistanceWherein, thermal-conduction resistance RTIncluding metal substrate 18 and metallic plate 131, metallic plate 131 and metal
Thermal-conduction resistance between heat-conducting part 132 and metal heat-conducting portion 132 and cooling liquid, h' be metal substrate 18, metallic plate 131,
The coefficient of heat transfer between metal heat-conducting portion 132 and cooling liquid, A be metal substrate 18, metallic plate 131, metal heat-conducting portion 132 with
Heat exchange area between cooling liquid.
The material of metallic plate 131 in the present embodiment can be aluminium, copper or the preferable metal of other heat conductivilitys.Metal
The connected mode of plate 131 and metal substrate 18 can be using the means welded.Then thermal-conduction resistance RTIt can be obtained by equation below：
Wherein, δ is the thickness of solder, and κ is the thermal conductivity factor of solder, R "TFor metallic plate 131 and metal heat-conducting portion 132
Thermal-conduction resistance.Due to R "TIt is much smaller thanThenTherefore it may only be necessary to meetI.e.：The heat exchange property between metal substrate 18 and cooling liquid can just be improved.For example：Reduce solder layer
Thickness δ, improves the thermal conductivity factor κ of solder, the area A' in increase metal heat-conducting portion 132, improves coefficient of heat transfer h'.
The technical scheme that the present embodiment is used is connected by using liquid cooling matrix with the hot junction face of metal substrate, and
Metallic plate is set on the face of hot junction, and metal heat-conducting portion is set on a metal plate, so that between liquid cooling matrix and metal substrate
Cooling liquid can directly be contacted with metal heat-conducting portion and metallic plate, heat exchange area is improved to a certain extent, increase is changed
Heat so that cooling liquid can absorb the heat of metal substrate rapidly, reduces the temperature of metal substrate, also further rapid to drop
The low temperature in semi-conductor electricity couple hot junction, is advantageously implemented high-power refrigeration.
It will be appreciated by those skilled in the art that, need to use necessarily between metal substrate 18 and liquid cooling matrix 21
Seal means, it is ensured that cooling liquid will not be spilt from connection gap of the metal substrate 18 with liquid cooling matrix 21.For example adopt
With sealing glue bond, the mode such as sealing ring or sealing gasket is set.In the present embodiment, as shown in Fig. 2 in liquid cooling matrix 21
Seal groove 210 is set on mounting surface, and seal groove 210, which is located in the edge for putting liquid bath 22, seal groove 210, sets sealing ring 211, uses
Gap between sealing liquid cooling matrix 21 and metal substrate 18.
The structure of matrix is cooled down for aforesaid liquid, there can be a variety of implementations, for example, can use such a way：
Supported as shown in Fig. 2 being provided with bottom wall inner surface of the liquid cooling matrix 21 away from metal substrate 18 in bottom wall
At least one dividing plate 23 between surface and metal substrate 18, at least one dividing plate 23 is divided into snakelike liquid by liquid bath 22 is put
Runner or multiple branch flow passages, cooling liquid flow in flow channel for liquids.The position in metal heat-conducting portion 132 is corresponding with flow channel for liquids.
For example in Fig. 2 flow channel for liquids is divided into the passage of multiple strips, and the end of adjacency channel is connected by forniciform passage.
The passage of each strip is corresponding with one, two or more than two metal heat-conducting portions 132 position, so that the metal heat-conducting portion
132 can contact with flowing through the cooling liquid in this passage and be exchanged heat.The length in metal heat-conducting portion 132, highly can basis
The length of strip passage, depth are set, increase and the contact area of cooling liquid as far as possible.
Further, if metallic plate 131 and metal substrate 18 are connected by the way of welding, in order to avoid cooling liquid with
Solder contact produces corrosion, the area of metallic plate 131 can be set greater than putting to the aperture area of liquid bath 22 so that coolant
Body can only be contacted with metallic plate 131 and metal heat-conducting portion 132, without touching solder, and will not also increase the heat of solder
Resistance.
In addition, by the integral solder of metallic plate 131 to metal substrate 18 so that each metal heat-conducting portion 132 with flowing
Cooling liquid contact when the stress that is subject to can be dispersed on whole metallic plate 131, can avoid metal heat-conducting portion 132 because
Stress is excessive and deforms.
Cooling liquid flows in snakelike flow channel for liquids to be flowed along the direction of setting, then cooling liquid is in flow process
In, can fully it be contacted with the various pieces of metal heat-conducting portion 132 and metallic plate 131, to fully absorb metal substrate 18
Heat, further improves the caloric receptivity of cooling liquid.
In addition to the such scheme that the present embodiment is provided, semiconductor cooling assembly can also be improved：
Fig. 7 is the structural representation in metallic plate and metal heat-conducting portion in semiconductor refrigerating component provided in an embodiment of the present invention
Figure.As shown in fig. 7, cooling liquid flows through from the both sides in metal heat-conducting portion 132.Gap 32 is opened up in metal heat-conducting portion 132, often
The quantity of the gap 32 opened up in individual metal heat-conducting portion 132 can be at least two.Cooling liquid can be changed by opening up gap 32
The state flowed in flow channel for liquids, such as turbulization, increases the heat exchange system of cooling liquid and metal heat-conducting portion 132
Number, it is possible to increase heat transfer effect.
Pit 31 can also be set on the surface that metal heat-conducting portion 132 is contacted with cooling liquid, equivalent to increasing gold
The area that category heat-conducting part 132 is contacted with cooling liquid, increases heat exchange area, is conducive to improving heat exchange efficiency.
Fig. 8 is the structural representation of metallic plate in semiconductor refrigerating component provided in an embodiment of the present invention, and Fig. 9 is in Fig. 8
C-C sections schematic diagram.Above-mentioned metal heat-conducting portion 132 can also be led using structure as shown in Figure 8 and Figure 9, a metal
Hot portion 132 is divided into multistage.Cooling liquid flows through from the both sides in metal heat-conducting portion.When cooling liquid flows in flow channel for liquids
By metal heat-conducting portion 132 disturbance can turbulization etc., increase the coefficient of heat transfer of cooling liquid and metal heat-conducting portion 132, energy
Enough improve heat transfer effect.
Figure 10 is the another structure in metallic plate and metal heat-conducting portion in semiconductor refrigerating component provided in an embodiment of the present invention
Schematic diagram.Or, metal heat-conducting portion 132 can also be set to the structure of at least two needle-likes, as shown in Figure 10, metal heat-conducting
The root in portion 132 is fixed on metallic plate 131, and its tip is stretched into put in liquid bath 22 and contacted with cooling liquid.Cooling liquid is from gold
Flowed through around category heat-conducting part.Disturbance when cooling liquid flows in flow channel for liquids by metal heat-conducting portion 132 can turbulization
Deng increasing the coefficient of heat transfer of cooling liquid and metal heat-conducting portion 132, it is possible to increase heat transfer effect.
Or, above-mentioned acicular texture can also be column structure, structure of irregular shape etc..Those skilled in the art
Other structures can be designed, the present embodiment will not enumerate.
Further, the implementation flowed for cooling liquid in flow channel for liquids, it is possibility to have a variety of implementations,
The present embodiment provides a kind of specific mode：
Figure 11 is the another structural representation of semiconductor refrigerating component provided in an embodiment of the present invention.Such as Fig. 2 and Figure 11 institutes
Show, be provided with inlet 24 and liquid outlet 25 on the side wall adjacent with bottom wall on liquid cooling matrix 21, inlet 24 and go out
Liquid mouthful 25 is corresponding with the top of flow channel for liquids and the position of end respectively.Also, inlet 24 and liquid outlet 25 also with it is outside
The connection of cooling line 26 forms cooling circuit, and cooling circuit is provided with liquid pump 27, and liquid pump 27 can use direct current supply or friendship
Stream power supply.Then in the presence of liquid pump 27, cooling liquid can be in cooling line 26 and flow channel for liquids internal circulation flow.Liquid
Pump 27 can use centrifugal pump or immersible pump, and its flow is (1-5) L/min, and its flow is bigger, and the flowing velocity of cooling liquid is got over
It hurry up, radiating effect is better.
Further, it can also set in heat exchanger 28, heat exchanger 28 and be provided with and cooling line on cooling circuit
Multiple heat emission holes are provided with the fluid passage of 26 connections, heat exchanger 28.When cooling liquid is flowed through in liquid cooling matrix 21
Flow channel for liquids when, absorb metal substrate 18 heat；When cooling liquid flows through the liquid in cooling line 26 and heat exchanger 28
During body passage, heat exchange is carried out with extraneous air, extraneous air is transferred heat to.Heat exchanger 28 can specifically use existing skill
The water row's radiator commonly used in art, its area of dissipation can be set according to the heat exchange amount needed for semi-conductor electricity couple 12.
In order to strengthen heat exchange, it can also be provided for dissipating heat exchanger 28 at the heat emission hole of heat exchanger 28
The cooling fan 29 of heat, the air-out direction of cooling fan 29 can also deviate from heat exchanger 28 towards heat exchanger 28, with
Accelerate for the purpose of the air flow around heat exchanger 28, improve the speed that cooling liquid carries out heat exchange with surrounding air.It is cold
But the big I of fan 29 and radiator water row area match, its air quantity, wind pressure parameter selection can be according to semi-conductor electricity
Heat exchange amount and water needed for couple 12 arrange the heat dissipation capacity of radiator to be set.
On the basis of above-mentioned technical proposal, the present embodiment also provides a kind of implementation, can further improve and partly lead
The heat exchange efficiency of body cooling assembly.
Metal substrate 18 is set to aluminium base, the area of aluminium base is 80mm × 90mm, thickness be 1.3mm to 1.7mm,
Preferably 1.5mm.It can be attached between aluminium base and liquid cooling matrix 21 by the way of being spirally connected.In aluminium base towards partly
Conductor galvanic couple can be using chemistry and physical method in aluminium base to laying thermally conductive insulating layer, thermally conductive insulating layer on 12 cold end face
Surface coating form or using one layer obtained from chemical treatment very thin metal heat-conducting and the material of insulation.Also, lead
Thermal insulation layer is engaged by means such as chemistry with hotter side electrode 15.Thermal resistance therefore, between hotter side electrode 15 and thermally conductive insulating layer,
And the thermal resistance of aluminium base itself is relatively small, it is possible to increase heat conduction efficiency.
The heat that then semi-conductor electricity couple 12 is produced on hotter side electrode 15 can be Jing Guo smaller thermal resistance thermally conductive insulating layer
Aluminium base is directly conducted to, using the good heat conduction of aluminium base, average temperature performance, heat is rapidly transferred to aluminium base towards liquid
The surface of matrix 21, and cooled liquid absorption are cooled down, the diffuser efficiency of heat can be significantly improved, be advantageously implemented high-power
Refrigeration.
The present embodiment also provides a kind of ice cream maker, the semiconductor refrigerating group provided using any of the above-described kind of embodiment
Part, can quickly reduce the temperature in semi-conductor electricity couple hot junction, be advantageously implemented high-power refrigeration.
Finally it should be noted that：Various embodiments above is merely illustrative of the technical solution of the present invention, rather than its limitations；To the greatest extent
The present invention is described in detail with reference to foregoing embodiments for pipe, it will be understood by those within the art that：Its according to
The technical scheme described in foregoing embodiments can so be modified, or which part or all technical characteristic are entered
Row equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the present invention technology
The scope of scheme.
Claims (10)
1. a kind of semiconductor refrigerating component, it is characterised in that including：Semi-conductor electricity couple, it is connected with semi-conductor electricity couple cold end
Cold end substrate, the hot junction substrate and liquid cooling device that are connected with semi-conductor electricity couple hot junction；Wherein, the hot junction base
Plate includes metal substrate and the thermally conductive insulating layer being connected between metal substrate and semi-conductor electricity couple；
Liquid cooling device includes：The liquid cooling matrix being connected with metal substrate, the liquid cooling matrix and metal substrate
Opened up on connected mounting surface and put liquid bath, the cooling liquid put provided with flowing between liquid bath and metal substrate；
The hot junction face that the metal substrate is connected with liquid cooling matrix is provided with metallic plate, the metallic plate edge and the hot junction
The parallel direction extension in face；The metallic plate is provided with along at least two metal heat-conducting portions extended perpendicular to hot junction face direction,
The metal heat-conducting portion stretches into described put in liquid bath.
2. semiconductor refrigerating component according to claim 1, it is characterised in that the liquid cooling matrix is away from Metal Substrate
The bottom wall inner surface of plate, which is provided with, supports at least one dividing plate between the bottom wall inner surface and metal substrate, at least one every
Plate will put liquid bath and be divided into snakelike flow channel for liquids, and the cooling liquid flows in the flow channel for liquids.
3. semiconductor refrigerating component according to claim 2, it is characterised in that the position in the metal heat-conducting portion with it is described
Flow channel for liquids correspondence.
4. semiconductor refrigerating component according to claim 1, it is characterised in that the area of the metallic plate is more than described put
The aperture area of liquid bath.
5. semiconductor refrigerating component according to claim 1, it is characterised in that the metal heat-conducting portion connects with cooling liquid
Tactile surface is provided with pit.
6. semiconductor refrigerating component according to claim 1, it is characterised in that the metal heat-conducting portion is towards liquid cooling
The end of the bottom wall of matrix is provided with gap.
7. the semiconductor refrigerating component according to claim any one of 2-6, it is characterised in that on the liquid cooling matrix
The side wall adjacent with the bottom wall be provided with inlet and liquid outlet, the inlet and liquid outlet respectively with the liquid flow
The top in road is corresponding with the position of end；The inlet and liquid outlet also are connected to be formed and cooled back with outside cooling line
Road, the cooling circuit is provided with liquid pump.
8. semiconductor refrigerating component according to claim 7, it is characterised in that be additionally provided with heat exchange on the cooling circuit
Provided with the fluid passage connected with the cooling line in device, the heat exchanger；
The liquid cooling device also includes the cooling fan for being used to radiate to the heat exchanger.
9. the semiconductor refrigerating component according to claim any one of 1-6, it is characterised in that the metal substrate is aluminium base
Plate.
10. a kind of ice cream maker, it is characterised in that including the semiconductor refrigerating component as described in claim any one of 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610087558.7A CN107084550A (en) | 2016-02-16 | 2016-02-16 | Semiconductor refrigerating component and ice cream maker |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610087558.7A CN107084550A (en) | 2016-02-16 | 2016-02-16 | Semiconductor refrigerating component and ice cream maker |
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| CN107084550A true CN107084550A (en) | 2017-08-22 |
Family
ID=59614456
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610087558.7A Pending CN107084550A (en) | 2016-02-16 | 2016-02-16 | Semiconductor refrigerating component and ice cream maker |
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| CN (1) | CN107084550A (en) |
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| CN108719570A (en) * | 2018-05-10 | 2018-11-02 | 湖北赛格瑞新能源科技有限公司 | A kind of Machine for making ice-sucker using semiconductor refrigerating |
| CN108775732A (en) * | 2018-08-31 | 2018-11-09 | 厦门帕尔帖电子科技有限公司 | A kind of semiconductor refrigerating module |
| CN109489299A (en) * | 2019-01-08 | 2019-03-19 | 广东富信科技股份有限公司 | The board-like cold source of semiconductor refrigerating low temperature and its control method |
| CN111595055A (en) * | 2019-02-21 | 2020-08-28 | 佛山市顺德区美的饮水机制造有限公司 | Double-chip circulating liquid refrigerating system and refrigerating equipment |
| CN113063238A (en) * | 2021-03-11 | 2021-07-02 | 深圳荆虹科技有限公司 | Temperature adjusting device and adjusting method |
| CN113125881A (en) * | 2021-03-11 | 2021-07-16 | 深圳荆虹科技有限公司 | Electronic product detection system and electronic product detection device |
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