CN107045253B - The device guard method of laser projection device and device - Google Patents
The device guard method of laser projection device and device Download PDFInfo
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- CN107045253B CN107045253B CN201710095747.3A CN201710095747A CN107045253B CN 107045253 B CN107045253 B CN 107045253B CN 201710095747 A CN201710095747 A CN 201710095747A CN 107045253 B CN107045253 B CN 107045253B
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- dmd chip
- laser
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000012544 monitoring process Methods 0.000 claims abstract description 95
- 230000001681 protective effect Effects 0.000 claims description 40
- 238000010586 diagram Methods 0.000 description 11
- 229920006335 epoxy glue Polymers 0.000 description 10
- 239000005357 flat glass Substances 0.000 description 10
- 238000009434 installation Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000003760 hair shine Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/16—Cooling; Preventing overheating
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2053—Intensity control of illuminating light
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Projection Apparatus (AREA)
Abstract
The embodiment of the present invention provides a kind of device guard method of laser projection device and device, the outer edge of the four edges of the window aperture region of the dmd chip of laser projection device are respectively arranged with temperature collecting device, and this method includes：According to the temperature that each temperature collecting device collects, the monitoring temperature of dmd chip is determined；If the monitoring temperature of dmd chip is more than the first preset temperature, is less than the second preset temperature, laser projection device is emitted to the brightness of laser reduces a preset gear；If the monitoring temperature of dmd chip is greater than or equal to the second preset temperature, is less than third preset temperature, the brightness that laser projection device is emitted to laser is reduced to lowest gear, and increases the brightness that laser projection device emits laser by gear；If the monitoring temperature of dmd chip is greater than or equal to third preset temperature, laser projection device is closed.For reducing the failure rate of dmd chip.
Description
Technical field
The present embodiments relate to Color Laser Projection Technology field more particularly to a kind of device protection sides of laser projection device
Method and device.
Background technology
With the continuous improvement of science and technology, laser projection system is widely used, in laser projection system,
After light beam of light source passes through a series of lens, digital micromirror device (Digital is radiated at by the opening on optics chassis
Micromirror Devices, abbreviation DMD) on chip, the display image of dmd chip is by hot spot irradiation back reflection to camera lens throwing
Shadow comes out, to form projected image.
After hot spot is radiated on dmd chip, dmd chip reflects hot spot.Since dmd chip can not be to hot spot
It carries out fully reflective so that the part luminous energy of hot spot is converted into thermal energy, and is absorbed by dmd chip.Since the energy of hot spot is higher,
So that the temperature of dmd chip increases under hot spot irradiation.And the heatproof degree of dmd chip is usually limited, it is therefore, bright when hot spot
When spending the position that high or hot spot is radiated on dmd chip and shifting, the temperature of dmd chip can be made resistance to higher than maximum
Temperature value, and then dmd chip is caused to be damaged.
In the prior art, there is no means of defences may be implemented to carry out high temperature protection to dmd chip, leads to dmd chip
Failure rate it is higher.
Invention content
The embodiment of the present invention provides device guard method and the device of a kind of laser projection device, reduces dmd chip
Failure rate.
In a first aspect, the embodiment of the present invention provides a kind of device guard method of laser projection device, the laser projection
The outer edge of the four edges of the window aperture region of the digital micro-mirror chip dmd chip of equipment is respectively arranged at least one temperature
Harvester, the method includes：
According to the temperature that each temperature collecting device collects, the monitoring temperature of the dmd chip is determined；
If the monitoring temperature of the dmd chip is more than the first preset temperature, is less than the second preset temperature, by the laser
The brightness that projection device emits laser reduces a preset gear, and second preset temperature is more than first preset temperature,
Second preset temperature is the fail temperature of the dmd chip；
If the monitoring temperature of the dmd chip is greater than or equal to second preset temperature, is less than third preset temperature,
The brightness that the laser projection device is emitted to laser is reduced to lowest gear, and increases the laser projection device by gear and send out
The brightness of laser is penetrated, until the monitoring temperature of the dmd chip is less than first preset temperature, and the temperature of the dmd chip
The difference of degree and first preset temperature is less than fiducial temperature, and the third preset temperature is more than second preset temperature；
If the monitoring temperature of the dmd chip is greater than or equal to the third preset temperature, the laser projection is closed
Equipment.
In a kind of possible embodiment, according to the temperature that each temperature collecting device collects, determine described in
The monitoring temperature of dmd chip, including：
Maximum temperature in temperature that each temperature collecting device collects is determined as to the monitoring of the dmd chip
Temperature.
In alternatively possible embodiment, the brightness reduction by one that the laser projection device is emitted to laser is default
Gear, including：
Obtain the corresponding current gear of brightness that the laser projection device currently emits laser；
According to the current gear, target gear is determined；
Obtain the corresponding target drive current of the target gear；
By the drive current adjustment of the laser projection device to the target drive current.
In alternatively possible embodiment, the brightness that the laser projection device is emitted to laser is reduced to deep low gear
Position, including：
Obtain the lowest drive current of the laser projection device；
By the drive current adjustment of the laser projection device to the lowest drive current.
In alternatively possible embodiment, closes before the laser projection device, further include：
Warning information is generated, the hot spot that the warning information is used to indicate the laser projection device shifts.
Second aspect, the embodiment of the present invention provide a kind of apparatus protective device of laser projection device, the laser projection
The outer edge of the four edges of the window aperture region of the digital micro-mirror chip dmd chip of equipment is respectively arranged at least one temperature
Harvester, described device include determining module and adjustment module, wherein
The determining module is used for, and according to the temperature that each temperature collecting device collects, determines the dmd chip
Monitoring temperature；
The adjustment module is used for, and is preset more than the first preset temperature, less than second in the monitoring temperature of the dmd chip
When temperature, the laser projection device is emitted to the brightness of laser reduces a preset gear, and second preset temperature is more than
First preset temperature, second preset temperature are the fail temperature of the dmd chip；
The adjustment module is used for, and is greater than or equal to second preset temperature, small in the monitoring temperature of the dmd chip
When third preset temperature, the brightness that the laser projection device is emitted to laser is reduced to lowest gear, and is increased by gear
The brightness of the laser projection device transmitting laser, until the monitoring temperature of the dmd chip is less than first preset temperature,
And the temperature of the dmd chip and the difference of first preset temperature are less than fiducial temperature, the third preset temperature is more than
Second preset temperature；
The adjustment module is used for, when the monitoring temperature of the dmd chip is greater than or equal to the third preset temperature,
Close the laser projection device.
In a kind of possible embodiment, the determining module is specifically used for：
Maximum temperature in temperature that each temperature collecting device collects is determined as to the monitoring of the dmd chip
Temperature.
In alternatively possible embodiment, the adjustment module is specifically used for：
Obtain the corresponding current gear of brightness that the laser projection device currently emits laser；
According to the current gear, target gear is determined；
Obtain the corresponding target drive current of the target gear；
By the drive current adjustment of the laser projection device to the target drive current.
In alternatively possible embodiment, the adjustment module is specifically used for：
Obtain the lowest drive current of the laser projection device；
By the drive current adjustment of the laser projection device to the lowest drive current.
In alternatively possible embodiment, described device further includes generation module, wherein
The generation module is used for, and before the adjustment module closes the laser projection device, generates warning information,
The hot spot that the warning information is used to indicate the laser projection device shifts.
The device guard method of laser projection device provided in an embodiment of the present invention, in the dmd chip of laser projection device
The outer edge of four edges of window aperture region be respectively arranged at least one temperature collecting device, transported in laser projection device
In capable process, the temperature that can be collected according to each temperature collecting device determines the monitoring temperature of dmd chip, works as judgement
The monitoring temperature of dmd chip be more than the first preset temperature when, then to laser projection device emit laser brightness be adjusted or
Person closes laser projection device, and the monitoring temperature for avoiding dmd chip is more than the first preset temperature, avoids dmd chip due to height
Temperature and break down, thereby reduce the failure rate of dmd chip.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Some bright embodiments for those of ordinary skill in the art without having to pay creative labor, can be with
Obtain other attached drawings according to these attached drawings.
Fig. 1 is the overlooking structure diagram of dmd chip provided in an embodiment of the present invention；
Fig. 2 is the overlooking structure diagram of dmd chip provided in an embodiment of the present invention；
Fig. 3 is the flow diagram of the device guard method of laser projection device provided in an embodiment of the present invention；
Fig. 4 is the installation overlooking structure diagram of temperature collecting device provided in an embodiment of the present invention；
Fig. 5 is the installation side structure schematic view of temperature collecting device provided in an embodiment of the present invention；
Fig. 6 is the structural schematic diagram one of the apparatus protective device of laser projection device provided in an embodiment of the present invention；
Fig. 7 is the structural schematic diagram two of the apparatus protective device of laser projection device provided in an embodiment of the present invention.
Specific implementation mode
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
The every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
For the ease of the understanding to the application, the structure of dmd chip is described in detail first.Fig. 1 is that the present invention is real
The overlooking structure diagram of the dmd chip of example offer is provided.Fig. 2 is that the side view structure of dmd chip provided in an embodiment of the present invention is shown
It is intended to.Fig. 1 is referred to, dmd chip includes effective display area, delustring area, window aperture area, epoxy glue seal area etc..It refers to
Fig. 2 is provided with window glass on the surface of effective display area, delustring area and window aperture area, and the window glass is viscous by colloid
It is attached to epoxy glue seal area.The back side of effective display area and delustring area is provided with heat dissipation plate (not shown), the heat dissipation plate
The most of heat for being gathered in effective display area and delustring area can be dispersed.
In actual application, the range of exposures for designing qualified hot spot include whole effective display area and part or
Whole delustring areas.Hot spot can make the temperature in effective display area and delustring area increase the irradiation of effective display area and delustring area,
Under the effect that heat is transmitted, the heat transfer in effective display area and delustring area to window aperture area so that the temperature of window aperture area
Degree increases.When laser projection device emit laser brightness it is excessively high, when having exceeded the normal brightness of optical projection system specification requirement, then
The brightness that optical projection system is irradiated to the hot spot on DMD also can be excessively high so that the temperature in effective display area and delustring area is excessively high, in turn
Cause the temperature of window aperture area excessively high；Alternatively, when hot spot direct irradiation window aperture area, it can also cause the temperature of window aperture area
Spend height.When window aperture area when the temperature is excessively high, may result in the corresponding window glass in window aperture area and epoxy glue be close
Colloid between envelope area comes unglued so that window glass enters air with epoxy glue seal area, and dmd chip is caused to damage.
In this application, it in order to avoid the dmd chip damage caused by high temperature, can in real time or periodically detect
The temperature at window aperture area edge, and according to the temperature at window aperture area edge, emit laser projection device the brightness of laser
It is adjusted, to avoid laser brightness excessively high the problem of causing dmd chip to damage.
In the following, by specific embodiment, technical solution shown in the application is described in detail.It should be noted that
Several specific embodiments can be combined with each other below, and same or analogous concept is in various embodiments without repeating to retouch
It states.
Fig. 3 is the flow diagram of the device guard method of laser projection device provided in an embodiment of the present invention.It refers to
Fig. 3, this method may include：
S301, the temperature collected according to each temperature collecting device, determine the monitoring temperature of dmd chip.
In embodiments of the present invention, in the window aperture region of the digital micro-mirror chip dmd chip of laser projection device
The outer edge of four edges is respectively arranged at least one temperature collecting device.Due to effective display area, delustring area and window aperture
Area is covered by window glass, for the more acurrate temperature for measuring DMD epoxy glues, and according at epoxy glue and window glass side
Temperature characteristic is different, will be warm using slower (projection device start process) than the temperature rise speed of window glass side at epoxy glue
Degree harvester is arranged in the side of window glass, convenient for protecting epoxy glue that excess temperature is avoided to damage in advance, to further protect
DMD display devices are from damage.Optionally, temperature collecting device can be thermocouple.The small volume of thermocouple is convenient for
It is installed in dmd chip.Since the temperature control of thermocouple and accuracy are high, it can quickly be obtained by thermocouple
Take the temperature that accuracy is high.
In the following, in conjunction with Fig. 4-Fig. 5, the installation site of temperature collecting device is described in detail.Fig. 4 is that the present invention is implemented
The installation overlooking structure diagram for the temperature collecting device that example provides.Fig. 5 is temperature collecting device provided in an embodiment of the present invention
Installation side structure schematic view.
Fig. 4 is referred to, 4 temperature collecting devices are respectively set in the outer edge of the four edges of window aperture area, remember respectively
For temperature collecting device A, temperature collecting device B, temperature collecting device C and temperature collecting device D.Optionally, four temperature
Harvester can be separately positioned on the midpoint of the four edges of window aperture area.It certainly, in actual application, can be with
More temperature collecting devices are set in the outer edge of the four edges of window aperture area, the embodiment of the present invention is to temperature collecting device
Number without specifically limiting.Fig. 5 is referred to, is arranged on the side of window glass in temperature collecting device.
The executive agent of the embodiment of the present invention can be apparatus protective device (the hereinafter referred device guarantor of laser projection device
Protection unit), which can be arranged in laser projection device.Optionally, which can pass through
Software and/or software realization.
In actual application, apparatus protective device can periodically execute technical solution shown in Fig. 3 embodiments,
Optionally, which can be 0.5 second, 1 second etc..Certainly, in actual application, it can be set according to actual needs this week
Phase, the embodiment of the present invention are not especially limited this.
After the temperature that apparatus protective device obtains that each temperature collecting device collects, optionally, device protection dress
The maximum temperature in temperature that each temperature collecting device collects can be determined as the monitoring temperature of dmd chip by setting.DMD cores
The monitoring temperature of piece refers to may be to temperature that dmd chip damages.It is adopted for example, it is assumed that being provided with 4 temperature in dmd chip
Acquisition means, the temperature which collects are respectively：65 degree, 70 degree, 68 degree, 72 degree.Then device protection dress
The monitoring temperature of dmd chip can be determined as by the temperature (72 degree) being most somebody's turn to do in four temperature by setting.
Preset in apparatus protective device there are three preset temperature, respectively the first preset temperature, the second preset temperature and
Third preset temperature.Third preset temperature is more than the second preset temperature, and the second preset temperature is more than the first preset temperature.
First preset temperature is the default maximum safe temperature of dmd chip, when the monitoring temperature of dmd chip is less than first in advance
If when temperature, dmd chip will not be damaged due to high temperature.When the monitoring temperature of dmd chip is in the first preset temperature and second
When between preset temperature, dmd chip will not be damaged, still, the side of the monitoring temperature of dmd chip already close to fail temperature
Edge.Optionally, which can be 85 degree.Certainly, in actual application, can be set according to actual needs
First preset temperature.
Second preset temperature is the fail temperature of dmd chip, when the monitoring temperature of dmd chip is more than the second preset temperature
When, dmd chip will be damaged due to high temperature.Certainly, when the monitoring temperature of dmd chip is within short time interval (such as in 3 seconds)
Temperature is greater than or equal to the second default temperature caused by hot spot brightness is excessively high or stray light shines directly on temperature collecting device
Degree, dmd chip will not cause badly damaged.Optionally, which can be 90 degree.Wherein, the second preset temperature
(fail temperature of dmd chip) is related to the specification of dmd chip.It in actual application, can be according to the specification of dmd chip
Second preset temperature is set.
Third preset temperature is the serious fail temperature of dmd chip, usually in hot spot direct irradiation temperature collecting device,
The monitoring temperature of dmd chip can just reach the third preset temperature.Optionally, third preset temperature can be 100 degree.Certainly,
In actual application, it can be set according to actual needs first preset temperature.
After apparatus protective device acquires the monitoring temperature of dmd chip, apparatus protective device determines dmd chip
Relationship between monitoring temperature and three preset temperatures, and according to the monitoring temperature of dmd chip and three preset temperatures it
Between relationship, to laser projection device emit laser brightness be adjusted.
If the monitoring temperature of S302, dmd chip is more than the first preset temperature, is less than the second preset temperature, laser is thrown
The brightness that shadow equipment emits laser reduces a preset gear.
When the monitoring temperature of dmd chip is more than the first preset temperature, is less than the second preset temperature, explanation is due to laser
The brightness of projection device transmitting laser is higher or the laser projection device working time is long makes cooling system efficiency decline and draw
The monitoring temperature for playing dmd chip is more than the first preset temperature, and laser projection device itself and fault-free.At this time, it is only necessary to will
The brightness that laser projection device emits laser reduces a preset gear.
Optionally, the corresponding temperature difference of a preset gear is greater than or equal to the second preset temperature and the first preset temperature
Temperature difference, in this way, when the brightness that laser projection device is emitted to laser reduces a preset gear, it is ensured that dmd chip
Monitoring temperature be less than the first predetermined threshold value.Such as.Assuming that the temperature difference between the second preset temperature and the first preset temperature is 5
Degree, the corresponding temperature difference of a preset gear are 5 degree, when the brightness that laser projection device is emitted to laser reduces a default shelves
When position, then the monitoring temperature of dmd chip can be reduced by 5 degree, so that the monitoring temperature of dmd chip is less than the first default threshold
Value.In actual application, it can be set according to actual needs the preset gear.
Optionally, apparatus protective device can obtain the corresponding current shelves of brightness that laser projection device currently emits laser
Position determines target gear according to current gear, the corresponding target drive current of target gear is obtained, by laser projection device
Drive current adjustment is to target drive current.Wherein, target gear subtracts one equal to current gear.In apparatus protective device by laser
After the drive current adjustment to target drive current of projection device, laser projection device emits the brightness of laser in target shift
Position, correspondingly, the temperature for being radiated at the hot spot of effective display area and delustring area then instantaneously declines so that the temperature of window aperture area
Also decline (the typically less than or equal to work period of apparatus protective device) within short time interval, so that each temperature collecting device acquires
Obtained temperature also declines within short time interval, so that the monitoring temperature of dmd chip also declines within short time interval.
Optionally, the brightness that laser projection device can be emitted to laser in advance is divided into multiple gears, different stalls
Brightness corresponds to different driving currents.Certainly, the brightness of different stalls can also correspond to the monitoring temperature of a rough dmd chip
Degree.For example, the relationship of the monitoring temperature of laser brightness, driving current and dmd chip can be as shown in table 1：
Table 1
| Laser brightness | Driving current | The monitoring temperature of dmd chip |
| / | / | 100 DEG C or more |
| B2+ | I2+ | 100℃ |
| B1+ | I1+ | 95℃ |
| B | I | 90℃ |
| B1 | I1 | 85℃ |
| B2 | I2 | 80℃ |
| B3 | I3 | 75℃ |
| B4 | I4 | 70℃ |
| B5 | I5 | 65℃ |
It should be noted that when laser projection device emits the laser of same brightness, the operating time of dmd chip is different
When, the monitoring temperature of dmd chip is also different, and the temperature of dmd chip also will be steady after laser projection device the operation is stable, but right
It is deposited in the different laser projection device of same model since the cooling system efficiency of every laser projection device is not fully identical
In minor fluctuations.Therefore, laser brightness and the correspondence of monitoring temperature shown in table 1 are a kind of ideal correspondence,
The correspondence can not represent the correspondence of laser brightness and monitoring temperature in dmd chip practical work process.
It, will if the monitoring temperature of S303, dmd chip is greater than or equal to the second preset temperature, is less than third preset temperature
The brightness of laser projection device transmitting laser is reduced to lowest gear, and increases laser projection device by gear and emit the bright of laser
Degree, until the monitoring temperature of dmd chip is less than the first preset temperature, and the difference of the temperature of dmd chip and the first preset temperature
Less than fiducial temperature.
When the monitoring temperature of dmd chip is greater than or equal to the second preset temperature, is less than third preset temperature, illustrate DMD
The monitoring temperature of chip (work period for being less than apparatus protective device) within short time interval is increased under the first preset temperature
On second preset temperature.Therefore, cause dmd chip monitoring temperature be greater than or equal to the second preset temperature the reason of be typically
Laser projection device breaks down, for example, the heat dissipation performance of the lasing fluorescence performance of laser projection device and dmd chip is not
To match, the spuious brightness of laser projection device is excessively high and shines directly on the temperature collecting device of DMD, alternatively, dmd chip
Heat dissipation failure etc..
When the monitoring temperature of dmd chip is greater than or equal to the second preset temperature, the monitoring temperature of dmd chip is already higher than
Therefore the fail temperature of dmd chip in order to ensure the safety of dmd chip, needs moment to reduce the temperature of dmd chip
To under the first preset temperature.Optionally, apparatus protective device can obtain the lowest drive current of laser projection device, and will
The drive current adjustment of laser projection device is to lowest drive current.Since lowest drive current corresponds to laser projection device transmitting
The lowest gear brightness of laser, therefore, by that by the drive current adjustment of laser projection device to lowest drive current, can incite somebody to action
The brightness of laser projection device transmitting laser is reduced to lowest gear.
After the brightness that laser projection device is emitted to laser is reduced to lowest gear, the monitoring temperature of dmd chip can
Instantaneously to drop under the first preset temperature, still, since the brightness that laser projection device emits laser is too low so that user
Viewing experience is poor.It therefore, can also be by shelves after the brightness that laser projection device is emitted to laser is reduced to lowest gear
Position increases the brightness of laser projection device transmitting laser, until the monitoring temperature of dmd chip is less than the first preset temperature, and DMD
The temperature of chip and the difference of the first preset temperature are less than fiducial temperature, and optionally, fiducial temperature can be 1 degree, 2 degree etc..This
Sample, can be under the premise of ensureing the safety of dmd chip so that laser projection device shows the picture of maximum brightness, in turn
Improve the viewing experience of user.
If the monitoring temperature of S304, dmd chip is greater than or equal to third preset temperature, laser projection device is closed.
When the monitoring temperature of dmd chip is greater than or equal to third preset temperature, illustrate the monitoring temperature of dmd chip short
(work period for being less than apparatus protective device) is increased under the first preset temperature on third preset temperature in period.Cause
This, leads to the hot spot of the reason of monitoring temperature of dmd chip is more than or equal to third preset temperature typically laser projection device
Direct irradiation temperature collecting device, that is, in laser projection device serious offset has occurred in the position of hot spot.
When the monitoring temperature of dmd chip is greater than or equal to third preset temperature, the monitoring temperature of dmd chip is already higher than
The serious fail temperature of dmd chip.Since serious offset has occurred in the position of hot spot in laser projection device,
It is not necessary to which the brightness for emitting laser projection device laser is adjusted, in order to ensure the safety of dmd chip, need to close
Laser projection device also may be used alternatively, when the lowest gear brightness that laser projection device emits laser is less than the first preset temperature
Brightness laser projection device directly to be emitted to laser is reduced to lowest gear.
Optionally, the fault message of laser projection device is obtained for the ease of collection of server, is set closing laser projection
Before standby, warning information can also be generated, the hot spot that warning information is used to indicate laser projection device shifts.
The device guard method of laser projection device provided in an embodiment of the present invention, in the dmd chip of laser projection device
The outer edge of four edges of window aperture region be respectively arranged at least one temperature collecting device, transported in laser projection device
In capable process, the temperature that can be collected according to each temperature collecting device determines the monitoring temperature of dmd chip, works as judgement
The monitoring temperature of dmd chip be more than the first preset temperature when, then to laser projection device emit laser brightness be adjusted or
Person closes laser projection device, and the monitoring temperature for avoiding dmd chip is more than the first preset temperature, avoids dmd chip due to height
Temperature and break down, thereby reduce the failure rate of dmd chip.
In the following, by specific example, technical solution shown in above method embodiment is described in detail.
Illustratively, it is assumed that the outer edge center of the four edges of the window aperture area of the dmd chip of laser projection device point
It She Zhi not be denoted as thermocouple 1- thermocouples 4 respectively there are one thermocouple.Assuming that the first preset temperature is 85 degree, the second default temperature
Degree is 90 degree, and third preset temperature is 100 degree.Assume again that the brightness that laser projection device is emitted to laser divides for 1 institute of table
8 gears shown, the corresponding standard monitoring temperature of laser brightness of the corresponding driving current of laser brightness and each gear of each gear
Degree is as shown in table 1 respectively.
After laser projection device booting, apparatus protective device then starts work.Assuming that just having been opened in apparatus protective device
When starting building to make, the brightness that laser projection device emits laser is B2 gears, at this point, according to table 1, the monitoring temperature of dmd chip is answered
It is somebody's turn to do at 80 degree or so, still, when laser projection device failure, since the heat at DMD epoxy glues is that continuous accumulation absorbs,
Therefore the temperature within the laser projection device booting short time at epoxy glue is not up to fail temperature, and at DMD window glass
Placing the temperature of temperature collecting device can rise rapidly within the booting short time so that at dmd chip temperature collecting device point
Actual monitoring temperature is much larger than 80 degree.
In the first job period of apparatus protective device, apparatus protective device obtains thermocouple 1- thermocouples 4 and acquires
The temperature difference arrived is as shown in table 2：
Table 2
| The mark of thermocouple | Temperature |
| Thermocouple 1 | 95 degree |
| Thermocouple 2 | 98 degree |
| Thermocouple 3 | 96 degree |
| Thermocouple 4 | 94 degree |
Apparatus protective device determines that the monitoring temperature of dmd chip is 98 degree according to the temperature of thermocouple 1- thermocouples 4.Device
Part protective device judges that (98 degree) of the monitoring temperature of dmd chip is more than the second preset temperature and is less than third preset temperature, then device
Part protective device needs the brightness that laser projection device is emitted to laser to be reduced to lowest gear.Specifically, apparatus protective device
It is I5 to obtain the corresponding driving current of lowest gear brightness, then apparatus protective device reduces the driving current of laser projection device
To I5.So that the temperature moment that each thermocouple collects declines.
In second work period of apparatus protective device, apparatus protective device obtains the temperature that each thermocouple collects
As shown in table 3：
Table 3
| The mark of thermocouple | Temperature |
| Thermocouple 1 | 70 degree |
| Thermocouple 2 | 76 degree |
| Thermocouple 3 | 75 degree |
| Thermocouple 4 | 74 degree |
When the driving current of laser projection device is reduced to I5, the brightness that laser projection device projects frame out is relatively low,
So that user's viewing experience is poor.Therefore, apparatus protective device needs to step up the brightness of laser projection device transmitting laser.Tool
Body：
Apparatus protective device determines that the monitoring temperature of dmd chip is 76 degree according to the temperature of each thermocouple shown in table 3,
(76 degree) of the monitoring temperature is less than the first preset temperature (85 degree), but the temperature difference between monitoring temperature and the first preset temperature
(9 degree) be more than preset temperature it is poor (being assumed to be 3 degree), therefore, apparatus protective device first by the driving current of laser projection device from
I5 is increased to I4.
In the work period of the third of apparatus protective device, it is assumed that apparatus protective device obtains the monitoring temperature of dmd chip
It it is 82 degree, apparatus protective device judges that (82 degree) of the monitoring temperature is less than the first preset temperature (85 degree), monitoring temperature and first
(3 degree) of temperature difference between preset temperature is poor (3 degree) equal to preset temperature, illustrates successfully to control the temperature of dmd chip
System.
Certainly, in the subsequent duty cycle of apparatus protective device, apparatus protective device also periodically obtains dmd chip
Monitoring temperature, and according to the monitoring temperature of dmd chip, the brightness for emitting laser projection device laser is adjusted.
Fig. 6 is the structural schematic diagram one of the apparatus protective device of laser projection device provided in an embodiment of the present invention.It is described
The outer edge of the four edges of the window aperture region of the digital micro-mirror chip dmd chip of laser projection device is respectively arranged at least
One temperature collecting device, refers to Fig. 6, and described device includes determining module 11 and adjustment module 12, wherein
The determining module 11 is used for, and according to the temperature that each temperature collecting device collects, determines the DMD cores
The monitoring temperature of piece；
The adjustment module 12 is used for, and is more than that the first preset temperature, to be less than second pre- in the monitoring temperature of the dmd chip
If when temperature, the laser projection device is emitted to the brightness of laser reduces a preset gear, and second preset temperature is big
In first preset temperature, second preset temperature is the fail temperature of the dmd chip；
The adjustment module 12 is used for, the dmd chip monitoring temperature be greater than or equal to second preset temperature,
When less than third preset temperature, the brightness that the laser projection device is emitted to laser is reduced to lowest gear, and by gear liter
The brightness of the high laser projection device transmitting laser, until the monitoring temperature of the dmd chip is less than the described first default temperature
Degree, and the temperature of the dmd chip and the difference of first preset temperature are less than fiducial temperature, the third preset temperature is big
In second preset temperature；
The adjustment module 12 is used for, and is greater than or equal to the third preset temperature in the monitoring temperature of the dmd chip
When, close the laser projection device.
The apparatus protective device of laser projection device provided in an embodiment of the present invention can execute above method embodiment institute
The technical solution shown, realization principle and advantageous effect are similar, are no longer repeated herein.
In a kind of possible embodiment, the determining module 11 is specifically used for：
Maximum temperature in temperature that each temperature collecting device collects is determined as to the monitoring of the dmd chip
Temperature.
In alternatively possible embodiment, the adjustment module 12 is specifically used for：
Obtain the corresponding current gear of brightness that the laser projection device currently emits laser；
According to the current gear, target gear is determined；
Obtain the corresponding target drive current of the target gear；
By the drive current adjustment of the laser projection device to the target drive current.
In alternatively possible embodiment, the adjustment module 12 is specifically used for：
Obtain the lowest drive current of the laser projection device；
By the drive current adjustment of the laser projection device to the lowest drive current.
Fig. 7 is the structural schematic diagram two of the apparatus protective device of laser projection device provided in an embodiment of the present invention.In Fig. 6
On the basis of illustrated embodiment, Fig. 7 is referred to, described device further includes generating mould, and 13, wherein
The generation module 13 is used for, and before the adjustment module 12 closes the laser projection device, generates alarm
Information, the hot spot that the warning information is used to indicate the laser projection device shift.
The apparatus protective device of laser projection device provided in an embodiment of the present invention can execute above method embodiment institute
The technical solution shown, realization principle and advantageous effect are similar, are no longer repeated herein.
One of ordinary skill in the art will appreciate that：Realize that all or part of step of above-mentioned each method embodiment can lead to
The relevant hardware of program instruction is crossed to complete.Program above-mentioned can be stored in a computer read/write memory medium.The journey
When being executed, execution includes the steps that above-mentioned each method embodiment to sequence；And storage medium above-mentioned includes：ROM, RAM, magnetic disc or
The various media that can store program code such as person's CD.
Finally it should be noted that：The above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Present invention has been described in detail with reference to the aforementioned embodiments for pipe, it will be understood by those of ordinary skill in the art that：Its according to
So can with technical scheme described in the above embodiments is modified, either to which part or all technical features into
Row equivalent replacement；And these modifications or replacements, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of laser projection device guard method, which is characterized in that the digital micromirror device DMD cores of the laser projection device
The outer edge of the four edges of the window aperture region of piece is respectively arranged at least one temperature collecting device, the method includes：
According to the temperature that each temperature collecting device collects, the monitoring temperature of the dmd chip is determined；
If the monitoring temperature of the dmd chip is more than the first preset temperature, is less than the second preset temperature, by the laser projection
The brightness that equipment emits laser reduces a preset gear, and second preset temperature is more than first preset temperature, described
Second preset temperature is the fail temperature of the dmd chip；
If the monitoring temperature of the dmd chip is greater than or equal to second preset temperature, is less than third preset temperature, by institute
The brightness for stating laser projection device transmitting laser is reduced to lowest gear, and increases the laser projection device transmitting by gear and swash
The brightness of light, until the dmd chip monitoring temperature be less than first preset temperature, and the temperature of the dmd chip with
The difference of first preset temperature is less than fiducial temperature, and the third preset temperature is more than second preset temperature；
If the monitoring temperature of the dmd chip is greater than or equal to the third preset temperature, the laser projection device is closed.
2. according to the method described in claim 1, it is characterized in that, the temperature collected according to each temperature collecting device
Degree, determines the monitoring temperature of the dmd chip, including：
Maximum temperature in temperature that each temperature collecting device collects is determined as to the monitoring temperature of the dmd chip
Degree.
3. method according to claim 1 or 2, which is characterized in that the laser projection device is emitted to the brightness of laser
A preset gear is reduced, including：
Obtain the corresponding current gear of brightness that the laser projection device currently emits laser；
According to the current gear, target gear is determined；
Obtain the corresponding target drive current of the target gear；
By the drive current adjustment of the laser projection device to the target drive current.
4. method according to claim 1 or 2, which is characterized in that the laser projection device is emitted to the brightness of laser
It is reduced to lowest gear, including：
Obtain the lowest drive current of the laser projection device；
By the drive current adjustment of the laser projection device to the lowest drive current.
5. method according to claim 1 or 2, which is characterized in that close before the laser projection device, further include：
Warning information is generated, the hot spot that the warning information is used to indicate the laser projection device shifts.
6. a kind of apparatus protective device of laser projection device, which is characterized in that the digital micro-mirror core of the laser projection device
The outer edge of the four edges of the window aperture region of piece dmd chip is respectively arranged at least one temperature collecting device, described to swash
The apparatus protective device of light projecting device includes determining module and adjustment module, wherein
The determining module is used for, and according to the temperature that each temperature collecting device collects, determines the prison of the dmd chip
Testing temperature；
The adjustment module is used for, and is more than the first preset temperature, less than the second preset temperature in the monitoring temperature of the dmd chip
When, the laser projection device is emitted to the brightness of laser reduces a preset gear, and second preset temperature is more than described
First preset temperature, second preset temperature are the fail temperature of the dmd chip；
The adjustment module is used for, and is greater than or equal to second preset temperature in the monitoring temperature of the dmd chip, is less than the
When three preset temperatures, the brightness that the laser projection device is emitted to laser is reduced to lowest gear, and by described in gear raising
Laser projection device emits the brightness of laser, until the monitoring temperature of the dmd chip is less than first preset temperature, and institute
The temperature for stating dmd chip and the difference of first preset temperature are less than fiducial temperature, and the third preset temperature is more than described
Second preset temperature；
The adjustment module is used for, and when the monitoring temperature of the dmd chip is greater than or equal to the third preset temperature, is closed
The laser projection device.
7. device according to claim 6, which is characterized in that the determining module is specifically used for：
Maximum temperature in temperature that each temperature collecting device collects is determined as to the monitoring temperature of the dmd chip
Degree.
8. the device described according to claim 6 or 7, which is characterized in that the adjustment module is specifically used for：
Obtain the corresponding current gear of brightness that the laser projection device currently emits laser；
According to the current gear, target gear is determined；
Obtain the corresponding target drive current of the target gear；
By the drive current adjustment of the laser projection device to the target drive current.
9. the device described according to claim 6 or 7, which is characterized in that the adjustment module is specifically used for：
Obtain the lowest drive current of the laser projection device；
By the drive current adjustment of the laser projection device to the lowest drive current.
10. the device described according to claim 6 or 7, which is characterized in that described device further includes generation module, wherein
The generation module is used for, and before the adjustment module closes the laser projection device, generates warning information, described
The hot spot that warning information is used to indicate the laser projection device shifts.
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Effective date of registration: 20200818 Address after: No.17, Donghai West Road, Shinan District, Qingdao City, Shandong Province Patentee after: Qingdao Hisense Laser Display Co.,Ltd. Address before: Donghai West Road 266071 Shandong city of Qingdao province No. 17 Patentee before: HISENSE Co.,Ltd. |