CN107039733B - Laminated sheet type power distribution module and manufacturing method thereof - Google Patents
Laminated sheet type power distribution module and manufacturing method thereof Download PDFInfo
- Publication number
- CN107039733B CN107039733B CN201610402227.8A CN201610402227A CN107039733B CN 107039733 B CN107039733 B CN 107039733B CN 201610402227 A CN201610402227 A CN 201610402227A CN 107039733 B CN107039733 B CN 107039733B
- Authority
- CN
- China
- Prior art keywords
- electrode
- power distribution
- dielectric layer
- inner electrode
- coupling capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention provides a laminated sheet type power distribution module which comprises an input electrode, an output electrode, an upper cover, a lower cover and an intermediate layer, wherein the intermediate layer comprises a bypass capacitor inner electrode, power distribution coils and a coupling capacitor inner electrode, and the number of the power distribution coils is at least two and the power distribution coils are mutually connected in parallel; one end of the bypass capacitor inner electrode is connected with the common end of the power distribution coil, and the other end of the bypass capacitor inner electrode is grounded; the common end of each power distribution coil is connected with an input electrode, and the non-common end of each power distribution coil is connected with an output electrode; and a coupling capacitor inner electrode and an isolation resistor are connected between the non-common ends of every two parallel power distribution coils, and the isolation resistor is arranged in the mounting groove of the upper cover and is connected with the output electrode. The bypass capacitor inner electrode, the power distribution coil and the coupling capacitor inner electrode are manufactured between the upper cover and the lower cover in a laminated mode, the product is highly integrated, the welding performance is good, the high-density surface mounting is suitable, the insertion loss is small, the phase and amplitude balance is excellent, and the requirements of assembly and electrical performance are met.
Description
Technical Field
The invention belongs to the technical field of electronics, and particularly relates to a laminated sheet type power distribution module and a manufacturing method thereof.
Background
With the rapid development of electronic equipment towards miniaturization, light weight and integration, the volumes of electronic complete machines and systems are smaller and smaller, and the installation density of components is also larger and larger, so that the corresponding components are required to be continuously developed towards miniaturization. The microwave power distribution module is a component which divides one path of input signal energy into two paths or multiple paths of output equal or unequal energy. Traditional power distribution module is mostly the equipment type device, and is bulky, and the mounting means is complicated, and insertion loss is big, and the isolation is not high, can not satisfy the demand in performance and assembly type, consequently need provide a neotype power distribution module in order to solve above-mentioned problem.
Disclosure of Invention
The invention mainly aims to provide a laminated sheet type power distribution module, and aims to solve the problems of large occupied space, inconvenience in assembly, low isolation and large insertion loss of the traditional power distribution module.
The invention is realized in this way, the laminated sheet type power distribution module comprises an input electrode, an output electrode, an upper cover, a lower cover and an intermediate layer positioned between the upper cover and the lower cover, wherein the intermediate layer comprises a bypass capacitor inner electrode, a power distribution coil and a coupling capacitor inner electrode which are laminated, and the number of the power distribution coils is at least two and the power distribution coils are mutually connected in parallel; one end of the bypass capacitor inner electrode is connected with the common end of the power distribution coil, and the other end of the bypass capacitor inner electrode is grounded; the common end of the power distribution coil is connected with the input electrode, and the non-common end of each power distribution coil is connected with one output electrode; every two parallelly connected connect one between power distribution coil's the non-common terminal coupling capacitance inner electrode and an isolation resistor, coupling capacitance inner electrode and isolation resistor are parallelly connected, the upper cover is equipped with the mounting groove, isolation resistor set up in the mounting groove, and pass through in the mounting groove predetermine the connecting piece with output electrode connects, isolation resistor's top packing sealant.
Another object of the present invention is to provide a method for manufacturing a stacked chip power distribution module, including the steps of:
fully ball-milling and mixing the matrix material, an adhesive, a solvent, a dispersant and a plasticizer to form slurry;
manufacturing the slurry into a lower cover and an upper cover, arranging an installation groove on the upper cover, and arranging a connecting piece at the bottom of the groove, wherein the connecting piece extends out of the side surface of the upper cover;
and (3) laminating and manufacturing between the upper cover and the lower cover:
a first dielectric layer, and manufacturing a bypass capacitor inner electrode on the first dielectric layer;
a second dielectric layer, at least two parallel power distribution coils are manufactured on the second dielectric layer, and the common end of the power distribution coils is connected with one end of the inner electrode of the bypass capacitor;
a third dielectric layer, wherein a coupling capacitor inner electrode is manufactured on the third dielectric layer, and the non-common ends of two power distribution coils which are mutually connected in parallel are respectively connected with the two ends of the coupling capacitor inner electrode to form a semi-finished product;
cutting, chamfering, glue discharging, sintering and separating the semi-finished product to obtain a semi-finished product monomer; arranging an input electrode, an output electrode and a grounding electrode on the outer surface of the semi-finished product monomer, respectively connecting the input electrode and the output electrode with the common end and the non-common end of the power distribution coil, and connecting the other end of the inner electrode of the bypass capacitor with the grounding electrode;
and arranging an isolation resistor in the mounting groove, connecting the isolation resistor with the output electrode through the connecting piece, and sealing the mounting groove to obtain the laminated sheet type power distribution module.
The invention replaces the traditional structure of assembling the coupling capacitor device, the bypass capacitor device and the power distribution device into a module whole, and the bypass capacitor inner electrode, the power distribution coil and the coupling capacitor inner electrode are manufactured between the upper cover and the lower cover in a laminated manner. Meanwhile, the isolation resistor is integrated between the output ends, and the device can be widely applied to signal energy distribution of satellite communication systems, antenna systems, vehicle-mounted information systems, wireless communication systems and the like.
Drawings
Fig. 1 is a perspective view of a stacked chip power distribution module provided by an embodiment of the present invention;
fig. 2 is an exploded schematic view of a stacked chip power distribution module according to an embodiment of the present invention;
fig. 3 is another structural diagram of a power distribution coil provided in the embodiment of the present invention;
fig. 4 is an equivalent circuit diagram of a stacked chip power distribution module provided by an embodiment of the invention;
fig. 5 is an overall external view of a stacked chip power distribution module provided in an embodiment of the present invention;
fig. 6 is a flowchart of a method for manufacturing a stacked chip power distribution module according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It should be noted that the terms of orientation such as left, right, up and down in the embodiments of the present invention are only relative to each other or are referred to the normal use state of the product, and should not be considered as limiting.
Referring to fig. 1 to 4, the present invention provides a stacked chip power distribution module, including an input electrode 01, an output electrode 02, an upper cover 03, a lower cover 04, and an intermediate layer located between the upper cover 03 and the lower cover 04, where the intermediate layer includes a bypass capacitor inner electrode 05, a power distribution coil 06, and a coupling capacitor inner electrode 07, which are stacked in sequence, and the number of the power distribution coils 06 is at least two and are connected in parallel; one end of the bypass capacitor inner electrode 05 is connected with the common end 061 (namely the input end) of the power distribution coil 06, and the other end is grounded; the common end 061 of the power distribution coils 06 is connected with the input electrode 01, and the non-common end 062 (i.e., the output end) of each power distribution coil 06 is connected with an output electrode 02; a coupling capacitor inner electrode 07 is connected between the non-common ends 062 of the two power distribution coils 06 which are connected in parallel, and an isolation resistor 17 is also connected, wherein the isolation resistor 17 is connected in parallel with the coupling capacitor inner electrode 07, that is, the two non-common ends 062 are respectively connected with two pole pieces of the coupling capacitor inner electrode 07 and two ends of the isolation resistor 17. Specifically, the upper cover is provided with a mounting groove 18, the isolation resistor 17 is disposed in the mounting groove 18 and connected to the output electrode 02 through a connecting member 19 preset in the mounting groove 18, and a sealant is filled above the isolation resistor 17.
Specifically, the upper cover 03 may be composed of two sheet-like media, one of which is provided with a through groove, i.e., a mounting groove 18, and the other surface of which is provided with a connecting member 19, the connecting member 19 extends to the side surface of the sheet-like media, and then the two parts are attached to each other, so that the connecting member 19 is located at the bottom of the mounting groove 18. Of course, an integrally formed member may be used, in which the connecting member 19 is embedded and the mounting groove 18 is opened, and the embodiment is not limited. The isolation resistor 17 is located in the mounting groove 18 and connected to the output electrode 02 through a connecting member 19.
It is to be understood that when the number of the power distribution coils 06 is two, the number of the output electrodes 02 is two, the number of the coupling capacitor inner electrodes 07 and the number of the isolation resistors 17 are each one and connected in parallel, when the number of the power distribution coils 06 is three, the number of the output electrodes 02 is three, each two power distribution coils 06 are connected in parallel, the number of the isolation resistors 17 and the number of the coupling capacitor inner electrodes 07 are also three, and one isolation resistor 17 and one coupling capacitor inner electrode 07 are connected in parallel and connected to two output electrodes 02. Similarly, when there are more power distribution coils 06, more parallel circuits can be formed, that is, one input is distributed as multiple outputs. This embodiment is not illustrated one by one.
Specifically, the upper cover 03 and the lower cover 04 are outermost structures of the multilayer chip power distribution module, and an intermediate layer is sandwiched between the upper cover 03 and the lower cover 04, and the intermediate layer is formed by the bypass capacitor inner electrode 05, the power distribution coil 06, and the coupling capacitor inner electrode 07, and the three layers are stacked. The bypass capacitor inner electrode 05 and the coupling capacitor inner electrode 07 naturally each include two pole pieces, i.e., a double-layer structure, and the power distribution coil 06 is a multi-layer structure, and is usually spirally wound by a plurality of turns of the conducting wire 063 to form the power distribution coil 06. In this embodiment, the bypass capacitor inner electrode 05, the power distribution coil 06, and the coupling capacitor inner electrode 07 are all supported by a sheet-shaped dielectric layer, that is, each capacitor pole piece and each circle of conducting wire 063 are supported by a sheet-shaped dielectric layer, and a part of the dielectric layer is further provided with a conductive through hole for communicating the corresponding electrodes or coils above and below the dielectric layer, so as to implement a circuit connection relationship.
With further reference to fig. 2, the bypass capacitor inner electrode 05 includes a bypass capacitor upper electrode 051 and a bypass capacitor lower electrode 052, and is carried by a first dielectric layer 08, and the first dielectric layer 08 includes two first sub-dielectric layers 081, which respectively carry the bypass capacitor upper electrode 051 and the bypass capacitor lower electrode 052; the power distribution coil 06 is carried by a second dielectric layer 09, the second dielectric layer 09 includes a plurality of second sub-dielectric layers 091, and each second sub-dielectric layer 091 carries a loop of conducting wire 063; the coupling capacitor inner electrode 07 comprises a coupling capacitor upper electrode 071 and a coupling capacitor lower electrode 072, which are carried by a third dielectric layer 10, and the third dielectric layer 10 comprises two third sub-dielectric layers 101, which respectively carry the coupling capacitor upper electrode 071 and the coupling capacitor lower electrode 072. A first intermediate dielectric layer 11 is further disposed between the first dielectric layer 08 and the second dielectric layer 09, and a second intermediate dielectric layer 12 is further disposed between the second dielectric layer 09 and the third dielectric layer 10.
With continued reference to fig. 2, a first connection point 13, which may be in particular a conductive via, is provided on each of the two third sub-dielectric layers 101 and the second intermediate dielectric layer 12, which first connection point 13 connects the non-common end 062 of one power distribution coil 06 to the coupling capacitor upper electrode 071. A second connection point 14, which may be a conductive through hole, is respectively disposed on the third sub-dielectric layer 101 and the second intermediate layer carrying the coupling capacitor lower electrode 072, and the second connection point 14 connects the non-common end 062 of another power distribution coil 06 with the coupling capacitor lower electrode 072, so as to connect the non-common ends 062 of the two power distribution coils 06 connected in parallel with each other with two electrode pieces of one coupling capacitor inner electrode, respectively. In addition, the common terminal 061 and the non-common terminal 062 of the power distribution coil 06 may be led out to the side of the second dielectric layer 09 for connecting the input electrode 01 and the output electrode 02, respectively. Further, a third connection point 15, which may be a conductive through hole, is respectively disposed on the first intermediate dielectric layer 11 and the first sub-dielectric layer 081 carrying the bypass capacitor upper electrode 051, and the third connection point 15 connects the bypass capacitor upper electrode 051 and the common end 061 of the power distribution coil 06, so as to connect one end of the bypass capacitor inner electrode 05 with the common end 061 of the power distribution coil 06 and the input electrode 01.
Further, the power distribution coil of the present embodiment may also adopt other structures, for example, fig. 3 is an implementable structure, and the specific shape thereof is not necessarily limited.
Further referring to fig. 1, the input electrode 01 and the output electrode 02 are disposed at the side of the upper cover 03, the lower cover 04, and the intermediate layer, or at the side of the upper cover 03, the lower cover 04, and the intermediate layer and extend to the upper surface of the upper cover 03 and the lower surface of the lower cover 04, which is the structure shown in fig. 1. The capacitor may further include a ground electrode 16 disposed on a side surface of the upper cover 03, the lower cover 04, and the intermediate layer, or disposed on a side surface of the upper cover 03, the lower cover 04, and the intermediate layer and extending to an upper surface of the upper cover 03 and a lower surface of the lower cover 04, or disposed on a bottom of the lower cover 04, and one end of the bypass capacitor inner electrode 05 is connected to the ground electrode 16. The number of the input electrodes 01 may be one, and the input electrodes are disposed at one side of the upper cover 03, the lower cover 04, and the intermediate layer, and connected to the common terminal 061 of the power distribution coil 06, and the number of the output electrodes 02 is the same as the number of the power distribution coils 06, and preferably disposed at opposite sides of the input electrodes 01, and connected to the non-common terminals 062 of the power distribution coils 06 one-to-one. One or more connection terminals 053 may be led out of the bypass capacitor lower electrode 052 to be connected to the ground electrode 16.
In this embodiment, the base materials of the upper cover 03, the lower cover 04 and the sheet-shaped dielectric layer for carrying the inner electrodes and the coil are preferably dielectric ceramics, and specifically, microwave dielectric ceramics which can be used in a microwave frequency band, such as NPO, C0G, and the like, may be used. When the material is adopted, the power distribution module is a microwave power distribution module. Of course, materials suitable for other frequency bands may also be adopted, so that the power distribution module is suitable for power distribution of other frequency bands.
In this embodiment, the bypass capacitor inner electrode 05, the power distribution coil 06, and the coupling capacitor inner electrode 07 are made of pure silver, silver-palladium alloy, or gold. Silver of silver palladium alloy: the ratio of palladium is 100-0: 0-100.
As shown in fig. 5, the whole power distribution module may be in a cube shape, and integrates the coupling capacitor inner electrode 07, the power distribution coil 06, the bypass capacitor inner electrode 05, the upper cover 03 and the lower cover 04, so that the power distribution module is small in size, convenient to assemble, good in weldability, high in reliability, suitable for high-density surface mounting, high in installation efficiency, small in insertion loss, high in isolation, excellent in phase balance and amplitude balance, and capable of achieving organic matching of each part, realizing signal energy distribution serialization, and ensuring that a product meets power distribution requirements of different frequency bands. Meanwhile, the isolation resistor is integrated between the output ends, and the device can be widely applied to signal energy distribution of satellite communication systems, antenna systems, vehicle-mounted information systems, wireless communication systems and the like.
The present invention further provides a method for manufacturing the above laminated chip power distribution module, as shown in fig. 6, the method includes the following steps:
in step S101, the base material is sufficiently ball-milled and mixed with a binder, a solvent, a dispersant, and a plasticizer to form a slurry.
In this step, the base material may be a microwave dielectric ceramic such as NPO and C0G, which can be used in the microwave band, or a dielectric material suitable for other bands may be used. The viscosity of the mixed slurry is preferably 10 to 500Pa S.
In step S102, the slurry is made into the lower cover 04 and the upper cover 03. Specifically, the slurry can be cast into a film belt, the film belt is laminated to form a lower cover 04 and an upper cover 03, an installation groove 18 is formed in the upper cover 03, a connecting piece 19 is arranged at the bottom of the groove, and the connecting piece 19 extends out of the side face of the upper cover 03.
Specifically, the upper cover 03 may be composed of two parts, one of the sheet media is provided with an installation groove 18, the installation groove is a through groove, the surface of the other sheet media is provided with a connecting member 19, the two sheet media are attached to each other, and the connecting member 19 is located at the bottom of the installation groove 18. The upper cover 03 may also be an integrally formed part, and the connecting member 19 is embedded in the upper cover and provided with the mounting groove 18, which is not limited in this embodiment.
In step S103, the following are laminated between the upper cover 03 and the lower cover 04:
a first dielectric layer 08, and manufacturing a bypass capacitor inner electrode 05 on the first dielectric layer 08;
a second dielectric layer 09, at least two parallel power distribution coils 06 are manufactured on the second dielectric layer 09, and a common end 061 of the power distribution coils 06 is connected with one end of the bypass capacitor inner electrode 05;
and a third dielectric layer 10, wherein a coupling capacitor inner electrode 07 is formed on the third dielectric layer 10, and the non-common ends 062 of two power distribution coils 06 which are connected in parallel are respectively connected with two ends of the coupling capacitor inner electrode 07 to form a semi-finished product.
Steps S102 and S103 may be performed in chronological order, that is, the upper cover 03 and the lower cover 04 are first fabricated, then the middle layer is fabricated on the lower cover 04, and then the upper cover 03 is covered on the middle layer. Or alternatively, the manufacturing process may be performed in a cross manner, for example, the lower cover 04 is manufactured first, the middle layer is manufactured on the lower cover 04, and then the upper cover 03 is manufactured and covered on the middle layer, and of course, the manufacturing process of the upper cover 03 and the lower cover 04 in the same process is more beneficial to resource utilization and efficiency improvement.
In step S103, a first dielectric layer 08, a bypass capacitor inner electrode 05, a second dielectric layer 09, a power distribution coil 06, a third dielectric layer 10, and a coupling capacitor inner electrode 07 may be fabricated in order from bottom to top with the lower cover 04 as a substrate, and optionally, the lower cover 04 may be directly used as the first dielectric layer 08. When the first, second and third dielectric layers are manufactured, conductive through holes can be formed in the corresponding dielectric layers as required, so that the upper and lower circuits of the dielectric layers can be conducted conveniently, for example, the power distribution coil 06 and the inner electrode 05 of the bypass capacitor, the power distribution coil 06 and the inner electrode 07 of the coupling capacitor, and the like. In addition, when each internal electrode and the power distribution coil 06 are manufactured, it is necessary to lead out a part of the electrodes to the side surface of each dielectric layer according to design so as to be connected with the terminal electrodes (the input electrode 01, the output electrode 02, and the ground electrode 16) manufactured later.
In a specific implementation process, as described below, a first sub-dielectric layer 081 is formed on the lower cover 04, a bypass capacitor lower electrode 052 is formed on the first sub-dielectric layer 081, and a plurality of leads are led out from the bypass capacitor lower electrode 052 to the side surface of the first sub-dielectric layer 081 for connecting with a grounding electrode 16 which is formed subsequently. Another first sub-dielectric layer 081 is formed on the bypass capacitor lower electrode 052, and a bypass capacitor upper electrode 051 is formed thereon. Then, a first intermediate dielectric layer 11 is manufactured and provided with conductive through holes, then a plurality of second sub-dielectric layers 091 are continuously manufactured and provided with conductive through holes, a lead 063 is manufactured on each layer, the leads 063 are communicated through the conductive through holes of the second sub-dielectric layers 091 to form a power distribution coil 06, more than two power distribution coils 06 can be manufactured at different positions of the second dielectric layer 09, the plurality of power distribution coils 06 have a common end 061 on the second sub-dielectric layer 091 at the lowest layer and serve as an input end, and the bypass capacitor upper electrode 051 also penetrates through the first intermediate dielectric layer 11 and the second sub-dielectric layers 091 upwards to be connected with the common end 061. On the second sub-dielectric layer 091 on the uppermost layer, the non-common ends 062 of different power distribution coils 06 are respectively led out for connecting with the end electrodes manufactured subsequently. Then, a second intermediate dielectric layer 12 is manufactured and provided with conductive through holes, then two third sub-dielectric layers 101 are manufactured and coupling capacitor lower electrodes 072 and coupling capacitor upper electrodes 071 are manufactured on the third sub-dielectric layers, the number of the coupling capacitor lower electrodes 072 and the number of the coupling capacitor upper electrodes 071 is reduced by 1 of the number of the power distribution coils 06, and the coupling capacitor upper electrodes 071 and the coupling capacitor lower electrodes 072 are respectively connected with the non-common end 062 of the parallel power distribution coils 06 through the conductive through holes on the second intermediate dielectric layer 12 and the third sub-dielectric layers 101. After the intermediate layer is manufactured, the upper cover 03 is covered on the upper surface of the intermediate layer.
In step S104, the semi-finished product is cut, chamfered, de-glued, sintered and separated to obtain a semi-finished product single body.
In step S105, an input electrode 01, an output electrode 02 and a ground electrode 16 are disposed on the outer surface of the semi-finished product, the input electrode 01 and the output electrode 02 are respectively connected to the common end and the non-common end of the power distribution coil 06, and the other end of the internal electrode 05 of the bypass capacitor is connected to the ground electrode 16; in this step, the monomer semi-finished product is placed on a special-purpose special-shaped silver coating machine, a proper silver coating roller is selected according to the shapes of the input electrode 01 and the output electrode 02, the shapes of the input electrode 01 and the output electrode 02 are pad-printed on the monomer semi-finished product, and then the grounding electrode 16 is manufactured by silver burning.
In step S106, the isolation resistor 17 is provided in the mounting groove 18 so as to be connected to the output electrode 02 via the connecting member 19, and the mounting groove 18 is sealed, so that the multilayer chip power distribution module is obtained.
Specifically, a resin seal may be employed, the upper surface of which is flush with the upper surface of the upper cover.
Further, the products on which the input electrode 01, the output electrode 02 and the grounding electrode 16 are arranged are subjected to end processing and sorting to obtain a finished product of the laminated microwave power distribution module.
The embodiment of the invention adopts the LTCC technology (low temperature co-fired ceramic technology) to manufacture the power distribution module, replaces the traditional structure that the coupling capacitor device, the bypass capacitor device and the power distribution device are assembled into a module whole, and manufactures the bypass capacitor inner electrode 05, the power distribution coil 06 and the coupling capacitor inner electrode 07 in a laminated way between the upper cover 03 and the lower cover 04. And all parts are organically matched, so that signal energy distribution serialization is realized, and the product is ensured to meet the power distribution requirements of different frequency bands. Meanwhile, the isolation resistor is integrated between the output ends, and the device can be widely applied to signal energy distribution of satellite communication systems, antenna systems, vehicle-mounted information systems, wireless communication systems and the like.
The present invention is not limited to the above preferred embodiments, and any modification, equivalent replacement or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The laminated sheet type power distribution module is characterized by comprising an input electrode, an output electrode, an upper cover, a lower cover and an intermediate layer positioned between the upper cover and the lower cover, wherein the intermediate layer comprises a bypass capacitor inner electrode, power distribution coils and a coupling capacitor inner electrode which are laminated, and the number of the power distribution coils is at least two and the power distribution coils are mutually connected in parallel; one end of the bypass capacitor inner electrode is connected with the common end of the power distribution coil, and the other end of the bypass capacitor inner electrode is grounded; the common end of the power distribution coil is connected with the input electrode, and the non-common end of each power distribution coil is connected with one output electrode; the power distribution circuit comprises a coupling capacitor inner electrode, an isolation resistor, an upper cover and an output electrode, wherein the coupling capacitor inner electrode and the isolation resistor are connected in parallel, an installation groove is formed in the upper cover, the isolation resistor is arranged in the installation groove and is connected with the output electrode through a connecting piece preset in the installation groove, and a sealing material is filled above the isolation resistor;
the bypass capacitor inner electrode, the power distribution coil and the coupling capacitor inner electrode are all carried by a dielectric layer, and part of the dielectric layer is provided with a conductive through hole for conducting circuits above and below the dielectric layer;
the bypass capacitor inner electrode is carried by a first dielectric layer, and the first dielectric layer comprises two first sub-dielectric layers which respectively carry a bypass capacitor upper electrode and a bypass capacitor lower electrode of the bypass capacitor inner electrode; the power distribution coil is carried by a second medium layer, the second medium layer at least comprises a plurality of second sub-medium layers which respectively carry each circle of conducting wire of the power distribution coil, and conducting wires on different second sub-medium layers are electrically connected through the connection points of the second sub-medium layers to form the power distribution coil; the coupling capacitor inner electrode is carried by a third medium layer, the third medium layer comprises two third sub-medium layers respectively carrying a coupling capacitor upper electrode and a coupling capacitor lower electrode of the coupling capacitor inner electrode, a first intermediate medium layer is arranged between the first medium layer and the second medium layer, a second intermediate medium layer is arranged between the second medium layer and the third medium layer, a first conductive through hole is respectively arranged on the two third sub-medium layers and the second intermediate medium layer and used for communicating the non-common end of one power distribution coil with the coupling capacitor upper electrode, a second conductive through hole is respectively arranged on the third sub-medium layer carrying the coupling capacitor lower electrode and the second intermediate medium layer and used for communicating the non-common end of the other power distribution coil with the coupling capacitor lower electrode, and a third conductive through hole is respectively arranged on the first intermediate medium layer and the first sub-medium layer carrying the bypass capacitor upper electrode, the third conductive via connects the bypass capacitor upper electrode and the common terminal of the power distribution coil.
2. The stacked chip power distribution module as claimed in claim 1, wherein the input and output electrodes are disposed at sides of the upper cover, the lower cover, and the intermediate layer, or disposed at sides of the upper cover, the lower cover, and the intermediate layer and extended toward upper surfaces of the upper cover and lower surfaces of the lower cover.
3. The stacked slice power distribution module of claim 1 wherein the dielectric layer is a microwave ceramic dielectric layer.
4. The laminated chip type power distribution module as claimed in claim 1, further comprising a ground electrode disposed at a side surface of the upper cover, the lower cover and the intermediate layer, or disposed at a side surface of the upper cover, the lower cover and the intermediate layer and extending toward an upper surface of the upper cover and a lower surface of the lower cover, or disposed at a bottom portion of the lower cover, wherein one end of the bypass capacitor inner electrode is connected to the ground electrode.
5. A method of manufacturing a stacked chip power distribution module, comprising the steps of:
fully ball-milling and mixing the matrix material, an adhesive, a solvent, a dispersant and a plasticizer to form slurry;
manufacturing the slurry into a lower cover and an upper cover, arranging an installation groove on the upper cover, and arranging a connecting piece at the bottom of the groove, wherein the connecting piece extends out of the side surface of the upper cover;
and (3) laminating and manufacturing between the upper cover and the lower cover:
a first dielectric layer, wherein a bypass capacitor inner electrode is manufactured on the first dielectric layer, the first dielectric layer comprises two first sub-dielectric layers, a bypass capacitor lower electrode is manufactured on the first sub-dielectric layer, another first sub-dielectric layer is manufactured on the bypass capacitor lower electrode, and a bypass capacitor upper electrode is manufactured on the other first sub-dielectric layer;
the conductive through hole is formed in the first middle medium layer;
the second dielectric layer is provided with at least two power distribution coils which are connected in parallel, the second dielectric layer comprises a plurality of second sub-dielectric layers, conducting wires on different second sub-dielectric layers are electrically connected through conducting through holes of the second sub-dielectric layers to form a power distribution coil, and the common end of the power distribution coil is connected with the upper electrode of the bypass capacitor through the conducting through hole on the first middle dielectric layer;
a second intermediate dielectric layer, wherein a conductive through hole is formed in the second intermediate dielectric layer;
a third dielectric layer, wherein a coupling capacitor inner electrode is manufactured on the third dielectric layer, the third dielectric layer comprises two third sub-dielectric layers which respectively bear a coupling capacitor upper electrode and a coupling capacitor lower electrode of the coupling capacitor inner electrode, and non-common ends of two power distribution coils which are mutually connected in parallel are respectively connected with the coupling capacitor upper electrode and the coupling capacitor lower electrode through conductive through holes formed in a second middle dielectric layer to form a semi-finished product;
cutting, chamfering, glue discharging, sintering and separating the semi-finished product to obtain a semi-finished product monomer; arranging an input electrode, an output electrode and a grounding electrode on the outer surface of the semi-finished product monomer, respectively connecting the input electrode and the output electrode with the common end and the non-common end of the power distribution coil, and connecting the other end of the inner electrode of the bypass capacitor with the grounding electrode;
and arranging an isolation resistor in the mounting groove, connecting the isolation resistor with the output electrode through the connecting piece, and sealing the mounting groove to obtain the laminated sheet type power distribution module.
6. The method of claim 5, wherein the substrates of the upper cover, the lower cover, the first dielectric layer, the second dielectric layer, and the third dielectric layer are all microwave dielectric ceramics.
7. The manufacturing method according to claim 5, wherein the step of providing the input electrode, the output electrode, and the ground electrode on the outer surface of the semi-finished single body comprises: and placing the semi-finished product monomer on a special-shaped silver coating machine, selecting a proper silver coating roller according to the shapes of the input electrode and the output electrode, pad-printing the shapes of the input electrode and the output electrode on the semi-finished product monomer, and then burning silver to finish the manufacturing of the grounding electrode.
8. The production method according to any one of claims 5 to 7, wherein the viscosity of the slurry is 10 to 500 Pa-S.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610402227.8A CN107039733B (en) | 2016-06-08 | 2016-06-08 | Laminated sheet type power distribution module and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610402227.8A CN107039733B (en) | 2016-06-08 | 2016-06-08 | Laminated sheet type power distribution module and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107039733A CN107039733A (en) | 2017-08-11 |
| CN107039733B true CN107039733B (en) | 2022-04-29 |
Family
ID=59532184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610402227.8A Active CN107039733B (en) | 2016-06-08 | 2016-06-08 | Laminated sheet type power distribution module and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107039733B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1551720A (en) * | 2000-06-27 | 2004-12-01 | ���µ�����ҵ��ʽ���� | Ceramic laminated device |
| CN103560312A (en) * | 2013-11-15 | 2014-02-05 | 苏州博海创业微系统有限公司 | Multi-path unequal-power LTCC power divider |
| CN104332687A (en) * | 2014-09-29 | 2015-02-04 | 中国电子科技集团公司第五十五研究所 | Improved 2.4GHz LTCC power divider |
| CN104966879A (en) * | 2015-06-29 | 2015-10-07 | 南京理工大学 | Ultra-small power divider with built-in snubber resistor |
| CN105187026A (en) * | 2015-10-12 | 2015-12-23 | 深圳振华富电子有限公司 | Laminated filter network and manufacturing method thereof |
| CN205828624U (en) * | 2016-06-08 | 2016-12-21 | 深圳振华富电子有限公司 | Lamination sheet type power distribution module |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003124771A (en) * | 1996-02-27 | 2003-04-25 | Hitachi Metals Ltd | Demultiplexer for dual-band mobile phone terminal |
| US6201439B1 (en) * | 1997-09-17 | 2001-03-13 | Matsushita Electric Industrial Co., Ltd. | Power splitter/ combiner circuit, high power amplifier and balun circuit |
| CN102856621A (en) * | 2012-09-24 | 2013-01-02 | 中国兵器工业集团第二一四研究所苏州研发中心 | LTCC (Low Temperature Co-Fired Ceramic) broadband power divider |
-
2016
- 2016-06-08 CN CN201610402227.8A patent/CN107039733B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1551720A (en) * | 2000-06-27 | 2004-12-01 | ���µ�����ҵ��ʽ���� | Ceramic laminated device |
| CN103560312A (en) * | 2013-11-15 | 2014-02-05 | 苏州博海创业微系统有限公司 | Multi-path unequal-power LTCC power divider |
| CN104332687A (en) * | 2014-09-29 | 2015-02-04 | 中国电子科技集团公司第五十五研究所 | Improved 2.4GHz LTCC power divider |
| CN104966879A (en) * | 2015-06-29 | 2015-10-07 | 南京理工大学 | Ultra-small power divider with built-in snubber resistor |
| CN105187026A (en) * | 2015-10-12 | 2015-12-23 | 深圳振华富电子有限公司 | Laminated filter network and manufacturing method thereof |
| CN205828624U (en) * | 2016-06-08 | 2016-12-21 | 深圳振华富电子有限公司 | Lamination sheet type power distribution module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107039733A (en) | 2017-08-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107039732B (en) | Laminated sheet type power distribution module and manufacturing method thereof | |
| US6778058B1 (en) | Embedded 3D coil inductors in a low temperature, co-fired ceramic substrate | |
| KR101462769B1 (en) | Multi layered ceramic capacitor, fabricating method thereof and circuit board for mounting the same | |
| US5892668A (en) | Noise-cut filter for power converter | |
| CN103858276B (en) | Antenna element and Anneta module | |
| KR101215303B1 (en) | Electronic device comprising ltcc inductor | |
| US20120313743A1 (en) | Laminated electronic component equipped with inductor | |
| CN107210268A (en) | High-frequency model | |
| US20080005890A1 (en) | Transformer and associated method of making using liquid crystal polymer (lcp) material | |
| US10418181B2 (en) | Single layer capacitors | |
| CN107039735B (en) | Laminated sheet type power distribution module and manufacturing method thereof | |
| CN107039736B (en) | Laminated sheet type power distribution module and manufacturing method thereof | |
| CN107039733B (en) | Laminated sheet type power distribution module and manufacturing method thereof | |
| KR20160141561A (en) | Hybrid inductor and electronic component module having the same | |
| CN107039734B (en) | Laminated sheet type power distribution module and manufacturing method thereof | |
| CN109194299B (en) | Ultra-miniature LTCC low-pass filter | |
| US20010054472A1 (en) | Manufacturing method for a laminated ceramic electronic component | |
| CN108010722A (en) | Composite electronic component | |
| CN205828621U (en) | A kind of lamination sheet type power distribution module | |
| CN205828624U (en) | Lamination sheet type power distribution module | |
| CN105515545B (en) | Laminated type high-pass filter and preparation method thereof | |
| CN205828623U (en) | A kind of lamination sheet type power distribution module | |
| CN114641840B (en) | Ceramic microelectronic device and method for manufacturing the same | |
| CN205828622U (en) | Lamination sheet type power distribution module | |
| KR20090053584A (en) | Multilayer Printed Circuit Board with Passive Device and Manufacturing Method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |