CN107030401A - Micropore machining device - Google Patents

Abstract

The invention discloses a micropore machining device which is used for machining a plurality of micropores on a workpiece and comprises a laser collimation module, a laser beam expansion module, a laser shaping module and a laser focusing template. The laser alignment module is used for aligning and adjusting laser; the laser beam expanding module is used for expanding the incident laser beam with smaller diameter to form a laser beam with larger diameter; the laser shaping module is arranged on the light emitting side of the laser beam expanding module and used for adjusting the light intensity distribution of incident light; the laser focusing template is arranged on the light outlet side of the laser shaping module and comprises a plate body and a plurality of micro lenses arranged on the plate body, wherein the plate body blocks incident light from penetrating, the micro lenses can penetrate and focus the incident light, and the shape of the surface of a plurality of focuses after the incident light is focused by the micro lenses is consistent with that of the surface to be processed of a workpiece. The micropore processing device can process a plurality of micropores at one time, thereby greatly improving the processing efficiency of laser micropore processing.

Description

Microhole Machining Device

technical field

The invention relates to the technical field of laser processing, in particular to a microhole processing device for processing microholes by laser.

Background technique

Laser processing technology is a technology that uses the characteristics of the interaction between laser beams and substances to cut, weld, surface treat, drill holes, and micromachining materials. Among them, laser drilling technology has the advantages of high precision, strong versatility, high efficiency, low cost and significant comprehensive technical and economic benefits, and has become one of the key technologies in the field of modern manufacturing. After the laser is focused, it is used as a high-intensity heat source to heat the material, so that the material in the laser action area is melted or gasified and then evaporated to form a laser processing process.

Since the laser beam can be focused very small, the smallest can reach a few microns. Therefore, laser drilling technology can be used to easily process micro-holes with diameters in the micron range, which cannot be achieved with traditional mechanical processing methods. However, the traditional laser processing technology can usually only process one hole at a time, and the work efficiency is low, which can no longer meet the needs of many industrial applications. For example, the antibody screening microwell plate used in the biological field has a huge number of microwells on it. , It takes a long time to process with traditional laser processing methods, and the quality is difficult to control.

The above information disclosed in this Background section is only for enhancement of understanding of the background of the disclosure and therefore it may contain information that does not form the prior art that is already known in the art to a person of ordinary skill in the art.

Contents of the invention

In order to solve the above problems of the prior art, the object of the present invention is to provide a micro-hole machining device with high machining efficiency.

According to one aspect of the present invention, a microhole machining device is used for machining a plurality of microholes on a workpiece. The microhole processing device includes a laser collimation module, a laser beam expansion module, a laser shaping module and a laser focusing template. The laser collimation module is used to collimate and adjust a laser; the laser beam expansion module is arranged on the light output side of the laser collimation module, and is used to expand the incident laser beam with a smaller diameter to form a larger diameter laser beam The laser shaping module is arranged on the light-emitting side of the laser beam expansion module, and is used to adjust the light intensity distribution of the incident light; the laser focusing template is arranged on the light-emitting side of the laser shaping module, including a plate and is arranged on the plate A plurality of microlenses on the body, wherein the board blocks the incident light from passing through, the microlenses can transmit and focus the incident light, and the incident light is focused by a plurality of microlenses The surface where the focus is located is consistent with the shape of the surface to be processed of the workpiece.

According to an embodiment of the present invention, a light-shielding film is disposed on the board to block laser light from passing through the board.

According to an embodiment of the present invention, the surface of the plate body is a rough surface, so that the incident light is scattered on the rough surface and cannot pass through the plate body.

According to an embodiment of the present invention, the multiple microlenses of the laser focusing module form a microlens array.

According to an embodiment of the present invention, each microlens in the microlens array is connected to each other.

According to an embodiment of the present invention, the laser shaping module adjusts the light intensity distribution of the incident light to a uniform distribution.

According to an embodiment of the present invention, the plate body of the laser focusing template is in the shape of a flat plate or a curved plate.

According to an embodiment of the present invention, the relative positional relationship among the laser collimating module, the laser beam expanding module, the laser shaping module and the laser focusing template is fixed.

According to an embodiment of the present invention, it further includes a workpiece platform, which is arranged on the light emitting side of the laser focusing template, and the workpiece is installed on the workpiece platform.

According to an embodiment of the present invention, the workpiece platform is a three-dimensional numerical control displacement platform.

It can be seen from the above technical solution that the advantages and beneficial technical effects of the present invention are: the microhole processing device of the present invention includes a laser beam expansion module capable of expanding a laser beam with a smaller diameter into a laser beam with a larger diameter, and includes A laser focusing template with a plate and multiple microlenses, the number of microlenses and the arrangement on the plate are consistent with the number and arrangement of the finished product or a unit of the product, and the plate is opaque, The micro-lens can split and focus the incident light, and the focused multi-beams can process the workpiece. Therefore, the micro-hole processing device of the present invention can produce qualified products, and can process multiple micro-holes at one time, thereby greatly improving Processing efficiency of laser microhole machining.

The above and other objects, features and advantages of the present invention will be more apparent through the following description of preferred embodiments of the present invention with reference to the accompanying drawings.

Description of drawings

Fig. 1 is the schematic diagram of an embodiment of the microhole machining device of the present invention;

FIG. 2 is a schematic structural view of a plate-shaped laser focusing template in the microhole processing device shown in FIG. 1 .

In the figure: 100, workpiece; 1, laser collimation module; 2, laser beam expansion module; 3, laser shaping module; 4, laser focusing template; 41, plate body; 42, microlens; 5, workpiece platform; 10, The first laser beam; 20, the second laser beam; 30, the third laser beam; 40, the fourth laser beam.

detailed description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted.

Referring to FIG. 1 , FIG. 1 is a schematic diagram of an embodiment of the microhole processing device of the present invention. As shown in Figure 1, an embodiment of the microhole processing device of the present invention is used to process a plurality of microholes on a workpiece 100, wherein the microholes can be through holes or blind holes, and the diameter of the microholes It can be in the range of 1-1000 microns, for example, the pore diameter is 1 micron, 10 microns, 20 microns, 50 microns, 100 microns, 500 microns, 800 microns, 900 microns, etc. The microhole processing device includes a laser collimation module 1 , a laser beam expansion module 2 , a laser shaping module 3 and a laser focusing template 4 .

The laser collimation module 1 is used for collimating and adjusting a laser to output parallel light. The laser collimation module 1 can adopt an existing structure.

The laser beam expansion module 2 is arranged on the light-emitting side of the laser collimation module 1, and is used to expand the incident laser beam, so that the laser beam with a smaller diameter can be expanded into a laser beam with a smaller diameter, and can usually form a laser beam with a specified spot size. Laser beam. The laser beam expander module 2 can adopt an existing structure.

The laser shaping module 3 is arranged on the light output side of the laser beam expanding module 2, and is used for adjusting the light intensity distribution of the incident light. Laser shaping module 3 comprises a beam shaper, and this beam shaper can adopt existing structure, and beam shaper can adjust the laser beam of incident energy distribution into the laser beam of energy distribution uniformity, for example, light intensity is The Gaussian distribution of the incident laser beam is adjusted to a laser beam with an even distribution of light intensity.

Referring to Fig. 1 and Fig. 2, Fig. 2 is the schematic structural view of a flat laser focusing template 4 in the microhole processing device of the present invention, and it comprises a flat plate body 41, and this plate body 41 is provided with multi- A microlens array composed of microlenses 42.

The laser focusing template 4 is arranged on the light-emitting side of the laser shaping module 3, and includes a plate body 41 and a plurality of microlenses 42 arranged on the plate body 41. In the embodiment shown in FIG. 2, a plurality of microlenses 42 form a micro lens array. Further, the microlenses 42 in the microlens array are connected to each other, that is, the adjacent microlenses in any direction of the front, rear, left, and right are connected together, so that the microlenses 42 in the laser focusing template 4 are concentrated in one area, and No microlenses are provided in other areas (ie, the plate body 41 ). In other embodiments, it is not limited thereto, and the plurality of microlenses 42 may be arranged in an array or in a non-array arrangement, and adjacent microlenses may be connected to each other, or may be separated from each other by a certain distance. In short, the number and arrangement of the microlenses in the laser focusing template 4 are determined according to the design requirements of the specific workpiece to be processed.

The plate body 41 can block the laser light from passing through, and the microlens 42 can pass through and focus the incident light, and the surface where the multiple focal points of the laser beam with a larger diameter is focused by a plurality of microlenses is consistent with the shape of the surface to be processed of the workpiece 100 For example, on a plane or a curved surface, during processing, the workpiece 100 to be processed is placed on the surface where multiple focal points are located.

The laser focus template 4 whole can be made by the material such as optical glass, plastics etc. that can pass through the laser; The light-tight structure avoids or minimizes the amount of light passing through the plate body 41 .

The shape of the plate body 41 of the laser focus template 4 can be consistent with the shape of the workpiece to be processed, especially with the shape of the surface to be processed of the workpiece to be processed, for example, when the workpiece to be processed or its surface to be processed is a planar shape, then the plate The body 41 may be flat; when the workpiece to be processed or its surface to be processed is curved, the body 41 may be curved. Of course, the present invention is not limited thereto.

In the present invention, the plate body 41 of the laser focusing template 4 can be prevented from passing through in various ways. In one embodiment, a light-shielding film can be provided on the plate body 41, for example, a layer A gold film made of gold is used to block laser light from passing through the plate body 41 . In another embodiment, the surface of the plate body 41 is treated as a rough surface, for example, the roughness value is between 1 and 10 microns, so that the laser light is scattered when incident on the rough surface of the plate body 41 and cannot pass through the plate body 41 . It should be understood that the solution for preventing or reducing the light transmission of the plate body 41 is not limited to the above two specific methods, and other existing design methods capable of shielding and avoiding light can also be applied in the present invention. When a plurality of microlenses 42 in the laser focusing template 4 form a microlens array, especially when adjacent microlens arrays are connected to each other, since the microlens arrangement is more concentrated, it is more convenient to process the plate body 41 into an opaque plate body. For convenience.

In one embodiment, the relative positional relationship between the laser collimation module 1, the laser beam expansion module 2, the laser shaping module 3 and the laser focusing template 4 is fixed, for example, the laser collimation module 1, the laser beam expansion module 2 , the laser shaping module 3 and the laser focusing template 4 are fixedly installed on the same bracket (not shown in the figure). In this way, after a commissioning is completed, frequent adjustments are not required during the processing, but only the workpiece to be processed needs to be moved, so the operation is easier and the operation is more reliable.

In other embodiments, only the relative positional relationship between some parts of the laser collimation module 1, the laser beam expander module 2, the laser shaping module 3 and the laser focusing template 4 may be fixed, while the relative positions between other parts may be fixed. The positional relationship is adjustable, for example, the relative positional relationship between the laser shaping module 3 and the laser focusing template 4 is fixed, and the laser collimation module 1, the laser beam expansion module 2 and the laser shaping module 3 can be along the optical axis Orientation moves to form an adjustable position; even in some embodiments, the relative position between all components is adjustable.

In some embodiments, the microhole processing device of the present invention further includes a workpiece platform 5 , which is arranged on the light emitting side of the laser focusing template 4 , and the workpiece 100 to be processed is installed on the workpiece platform 5 . Further, the workpiece 100 platform can be a three-dimensional numerical control displacement platform, which can be controlled by a computer to move in the three directions of X, Y, and Z, and can even rotate an angle in each direction, so as the three-dimensional numerical control displacement platform moves , the workpiece 100 to be processed can be accurately set on the surface where each focal point is located, thereby realizing automatic and efficient numerical control machining of micro-holes.

The microhole processing device of the present invention can process a plurality of microholes at the same time, wherein the number of microholes processed at one time is the same as the number of microlenses 42 of the laser focusing template 4, and the arrangement of the processed microholes is also the same as that of multiple microholes. The arrangement of the microlenses 42 on the board 41 matches. Therefore, the number and arrangement of the multiple microlenses 42 of the laser focusing template 4 can be designed according to needs, specifically, depending on the number and arrangement of microholes required by the workpiece to be processed. In detail, when it is necessary to process a plurality of microholes on a workpiece to be processed, a laser focusing template 4 can be processed by ultra-precision processing technology, that is, a plurality of microlenses 42 are processed on a plate body 41, these The quantity of the microlenses 42 and the arrangement form on the plate body 41 are exactly the same as the quantity and arrangement form of the microholes designed on the workpiece to be processed, that is, the quantity and arrangement form of the microholes on the finished finished product. If the arrangement forms are exactly the same, qualified products can be processed quickly by using the microlens lens (laser focusing template 4).

In some embodiments, the microhole processing device of the present invention further includes a laser (not shown in the figure) for generating laser light, which may be a continuous laser or a pulsed laser.

Referring to Fig. 1, take the processing out microhole array on a plate-shaped workpiece 100 as an example below to illustrate the machining process of the microhole machining device of the present invention:

The laser emits a first laser beam 10, and the first laser beam 10 enters the laser collimation module 1 as an incident light, and outputs a second laser beam 20 after being collimated by the laser collimation module 1, and the second laser beam 20 serves as an incident light The light is incident on the laser beam expander module 2, and forms a third laser beam 30 with a larger diameter after beam expansion by the laser beam expander module 2. For example, the diameter of the third laser beam 30 is 2-10 times that of the second laser beam 20. The three laser beams 30 are incident to the laser shaping module 3 as incident light. As shown in FIG. 1, the laser shaping module 3 shapes the third laser beam 30 whose energy distribution is Gaussian distribution into a flat top beam with uniform energy distribution, that is, the fourth laser beam 40; then the fourth laser beam 40 is incident on the laser focusing template 4, and the microlens array of the laser focusing template 4 splits and focuses the fourth laser beam 40. Since the focal lengths of each microlens 42 of the microlens array are the same, the fourth After the laser beam 40 is focused, a plurality of focal points are on the same focal plane; the workpiece 100 to be processed is arranged on the focal plane, for example, by moving the workpiece platform 5, and the workpiece 100 is driven by the workpiece platform 5 to move to the focal plane, then these The focused laser beam can process a microhole array on the workpiece 100 to be processed.

The microhole processing device of the present invention can process a plurality of microholes at one time after the laser focusing template 4 splits the laser beam and focuses them respectively, so the microhole processing device of the present invention can greatly improve the laser microhole processing. Processing efficiency.

The micropore processing device of the present invention can be widely used in the fields of aviation, biology, micromachine manufacturing, etc., such as functional membrane materials with micropore arrays in the biological field, such as antibody screening microwell plates; or used in

Micropore arrays in the aviation field to improve aerodynamic performance, such as micropore arrays on aircraft wings; or micropore array filter plates used in the fields of micromechanics and microfluidics.

Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification only for convenience, such as according to the Example orientation. It will be appreciated that if the illustrated device is turned over so that it is upside down, then elements described as being "upper" will become elements that are "lower". When a structure is "on" another structure, it may mean that a structure is integrally formed on another structure, or that a structure is "directly" placed on another structure, or that a structure is "indirectly" placed on another structure through another structure. other structures. The terms "first", "second" and the like are used only as marks, not to limit the number of their objects.

In the claims, the terms "a", "an", "" and "at least one" are used to indicate the presence of one or more elements/components/etc; is used in an open, inclusive sense and means that additional elements/components/etc. may be present in addition to the listed elements/components/etc.

It should be understood that the invention is not limited in its application to the detailed construction and arrangement of components set forth in this specification. The invention is capable of other embodiments and of being practiced and carried out in various ways. The foregoing variations and modifications fall within the scope of the present invention. It shall be understood that the invention disclosed and defined in this specification extends to all alternative combinations of two or more of the individual features mentioned or evident from the text and/or drawings. All of these different combinations constitute alternative aspects of the invention. The embodiments described herein describe the best modes known for carrying out the invention and will enable others skilled in the art to utilize the invention.

Claims (10)

1. A microhole processing device, used to process a plurality of microholes on a workpiece, characterized in that the microhole processing device comprises: A laser collimation module, which is used for collimating and adjusting a laser; A laser beam expansion module, which is arranged on the light output side of the laser collimation module, and is used to expand the incident laser beam with a smaller diameter to form a laser beam with a larger diameter; A laser shaping module, which is arranged on the light output side of the laser beam expanding module, and is used to adjust the light intensity distribution of the incident light; The laser focusing template, which is arranged on the light output side of the laser shaping module, includes a plate body and a plurality of microlenses arranged on the plate body, wherein the plate body blocks incident light from passing through, and the microlenses can The incident light is transmitted and focused, and the surfaces where the multiple focal points of the incident light are focused by the multiple microlenses are consistent with the shape of the surface to be processed of the workpiece. 2 . The microhole processing device according to claim 1 , wherein a light-shielding film is provided on the board to prevent laser light from passing through the board. 3 . 3 . The microhole processing device according to claim 1 , wherein the surface of the plate body is a rough surface, so that the incident light is scattered on the rough surface and cannot pass through the plate body. 4 . 4 . The microhole machining device according to claim 1 , wherein a plurality of microlenses of the laser focusing module form a microlens array. 5. The microhole machining device according to claim 4, wherein each microlens in the microlens array is connected to each other. 6 . The microhole processing device according to claim 1 , wherein the laser shaping module adjusts the light intensity distribution of the incident light to a uniform distribution. 7 . 7 . The microhole processing device according to claim 1 , wherein the plate body of the laser focusing template is in the shape of a flat plate or a curved plate. 8. The microhole processing device according to claim 3, wherein the relative positional relationship between the laser alignment module, the laser beam expansion module, the laser shaping module and the laser focusing template is stable. 9. The microhole machining device according to any one of claims 1-8, further comprising: The workpiece platform is arranged on the light emitting side of the laser focusing template, and the workpiece is installed on the workpiece platform. 10. The microhole machining device according to claim 9, wherein the workpiece platform is a three-dimensional numerical control displacement platform.