CN107013009A - A kind of floor heating bed board - Google Patents
A kind of floor heating bed board Download PDFInfo
- Publication number
- CN107013009A CN107013009A CN201710373227.4A CN201710373227A CN107013009A CN 107013009 A CN107013009 A CN 107013009A CN 201710373227 A CN201710373227 A CN 201710373227A CN 107013009 A CN107013009 A CN 107013009A
- Authority
- CN
- China
- Prior art keywords
- floor heating
- bed board
- heating bed
- mushroom head
- collet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 57
- 235000001674 Agaricus brunnescens Nutrition 0.000 claims abstract description 47
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 230000006978 adaptation Effects 0.000 claims abstract description 8
- 210000002435 tendon Anatomy 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 7
- 238000010276 construction Methods 0.000 abstract description 6
- 235000003140 Panax quinquefolius Nutrition 0.000 abstract description 3
- 240000005373 Panax quinquefolius Species 0.000 abstract description 3
- 239000004570 mortar (masonry) Substances 0.000 abstract description 3
- 238000009434 installation Methods 0.000 abstract description 2
- 239000004576 sand Substances 0.000 abstract description 2
- 238000007711 solidification Methods 0.000 abstract description 2
- 230000008023 solidification Effects 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 description 5
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000003908 quality control method Methods 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009430 construction management Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/02005—Construction of joints, e.g. dividing strips
- E04F15/02011—Construction of joints, e.g. dividing strips with joint fillings integrated in the flooring elements
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/02038—Flooring or floor layers composed of a number of similar elements characterised by tongue and groove connections between neighbouring flooring elements
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F2201/00—Joining sheets or plates or panels
- E04F2201/04—Other details of tongues or grooves
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F2290/00—Specially adapted covering, lining or flooring elements not otherwise provided for
- E04F2290/02—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets
- E04F2290/023—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets for heating
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Floor Finish (AREA)
Abstract
The present invention relates to a kind of floor heating bed board, including mainboard body, the main substrate being made up of plate part and mushroom head of mainboard body and the overlay film laid thereon are constituted, the opposite end of mainboard body is respectively first end and the second end, first end is convexly equipped with upper buckles edge for being buckled at the top of the second end of adaptation floor heating bed board, second end is convexly equipped with buckles edge for being buckled in the lower of first end bottom of adaptation floor heating bed board, upper button is along the grouting channel provided with up/down perforation, and lower button is along the Sheng stock tank closed provided with open top, remaining side seal.After concrete mortar solidification, concrete sand lumps can be connected between floor heating bed board, it is achieved thereby that what is connected between floor heating bed board is rearmounted, on the one hand the installation of floor heating bed board need not be fully finished in preposition construction procedure, on the other hand the intensity connected between floor heating bed board can be improved, so as to simplify construction procedure during ground heater laying, it is easily installed.
Description
Technical field
The present invention relates to a kind of floor heating bed board.
Background technology
At present, floor heating is a kind of comfortable domestic heating mode, with the raising of quality of life, this " warm from underfooting life "
Novel heating mode, received and used by increasing people, field of heating is well received by the public in family, floor heating is from heating property
From the point of view of be divided into electricity floor heating and water floor heating, it is more to install water floor heating now, and water floor heating is warmed up dry floor heating with being divided into wet type.
Traditional floor heating is typically that heat pipe is laid on benzene plate and radiation film, then cast-in-place coagulation at the construction field (site)
Soil, this mounting means is referred to as wet type floor heating.This floor heating mode needs field operation, and not only tedious process is dirty and messy, pollution is big,
Engineering time is long, and maintenance is inconvenient, is additionally, since that site construction management is very different, and the construction of floor heating recuperation layer is in uneven thickness,
Easily occur that floor heating pipe is exposed or the blocked up phenomenon of coating, make heated uneven, quality control precision is not high.For wet type floor heating
The deficiency of technique, occurs in that dry floor heating in recent years, and current existing dry-type floor warming device generally comprises heat-conducting layer, thermal insulation layer, leads
Thermosphere is affixed with thermal insulation layer, and heat-conducting layer on thermal insulation layer with being correspondingly provided with grounding heat coil tube groove, and floor is directly layed on heat-conducting layer,
But this kind of dry-type floor warming device or module due to when dispatching from the factory its grounding heat coil tube groove arrangement form it has been determined that thus without
Method selects optimal floor heating pipe arrangement mode according to actual conditions.
Therefore, how to overcome the problem of wet type floor heating site operation quality control precision is not high simultaneously and can select
Optimal grounding heat coil tube arrangement is selected, is the technical problem of current those skilled in the art's urgent need to resolve.
The content of the invention
The present invention is intended to provide a kind of floor heating bed board being easily installed.
In order to solve the above technical problems, the technical scheme of floor heating bed board is as follows in the present invention：
Floor heating bed board, including mainboard body, the main substrate being made up of plate part and mushroom head of mainboard body and covering of laying thereon
Film is constituted, and the opposite end of mainboard body is respectively first end and the second end, and first end is convexly equipped with for being buckled in adaptation floor heating paving
Upper button edge at the top of second end of plate, the second end is convexly equipped with buckles for being buckled in the lower of first end bottom of adaptation floor heating bed board
Edge, upper button is along the grouting channel provided with up/down perforation, and lower button is along the Sheng stock tank closed provided with open top, remaining side seal.
The lower port of grouting channel is provided with the joint of downward drawdown, and it is the big tripe that chamber width is more than width of rebate to contain stock tank
Groove.
The root of mushroom head is provided with the collet on the top surface of plate part, and the top surface of collet is less than the top of mushroom head
Face, the bottom of collet is flushed with the root of mushroom head.
Mushroom head is in array distribution on the top surface of substrate, the mushroom head mutual dislocation distribution of adjacent two row.
Mushroom head is square column, and collet is disc, and the edge of collet exposes from the surrounding of mushroom head.
Mushroom head is square column, and collet is the strip convex tendon at mushroom head center side position, and collet has four, four
Individual collet is distributed on the surrounding of mushroom head.
Mushroom head is octagonal post, strip convex tendon of the collet for bridge joint between adjacent two mushroom head, each collet and mushroom
Top surface formation network structure of the mushroom head in substrate.
The beneficial effects of the invention are as follows：
It is attached between floor heating bed board by the way of post-grouting is first snapped connection, grouting is concrete perfusion mortar, this
Sample is after concrete mortar solidification, and concrete sand lumps can be connected between floor heating bed board, it is achieved thereby that between floor heating bed board
What is connected is rearmounted, and the installation of floor heating bed board on the one hand need not be fully finished in preposition construction procedure, on the other hand can improve ground
The intensity connected between warm bed board, so that construction procedure when simplifying ground heater laying, is easily installed.
Brief description of the drawings
Fig. 1 is the structural representation of floor heating bed board in embodiments of the invention 1；
Fig. 2 is the two-end structure schematic diagram of floor heating bed board in Fig. 1；
Fig. 3 is the structural representation of floor heating bed board in a state of use in Fig. 2；
Fig. 4 is the structural representation of floor heating bed board in embodiments of the invention 2；
Fig. 5 is the structural representation of floor heating bed board in embodiments of the invention 3.
Embodiment
Describe the present invention in detail below with reference to accompanying drawing and in conjunction with the embodiments.It should be noted that not conflicting
In the case of, the embodiment in the present invention and the feature in embodiment can be mutually combined.
The embodiment 1 of floor heating bed board in the present invention：As shown in Figure 1 to Figure 3, the floor heating bed board includes mainboard body, mainboard body
The main substrate being made up of plate part 11 and mushroom head 12 and the overlay film laid thereon are constituted, the opposite end difference of mainboard body
For first end and the second end, first end be convexly equipped with for be buckled at the top of the second end of adaptation floor heating bed board it is upper buckle along 13, the
Two ends are convexly equipped with buckles along 14 for being buckled in the lower of first end bottom of adaptation floor heating bed board, and upper button is provided with up/down perforation along 13
Grouting channel 15, lower button is along the 14 Sheng stock tanks 16 closed provided with open top, remaining side seal.The lower port of grouting channel 15 is set
There is the joint for letting droop and stretching, it is the big tripe groove that chamber width is more than width of rebate to contain stock tank 16.
The root of mushroom head 12 is provided with the collet on the top surface of plate part 11, and the top surface of collet is less than mushroom head 12
Top surface, the bottom of collet is flushed with the root of mushroom head 12.Mushroom head 12 is in array distribution, adjacent two on the top surface of substrate
The mutual dislocation of mushroom head 12 distribution of row.Mushroom head 12 is square column, and collet is disc, and the edge of collet is from mushroom head 12
Surrounding is exposed.
The embodiment 2 of heat supply insulation board in the present invention：As shown in figure 4, the present embodiment and the difference of embodiment 1 are, mushroom
Mushroom first 212 is square column, and collet 213 is the strip convex tendon at the center side position of mushroom head 212, and collet 213 has four,
Four collets 213 are distributed on the surrounding of mushroom head 212.
The embodiment 3 of heat supply insulation board in the present invention：As shown in figure 5, the present embodiment and the difference of embodiment 1 are, mushroom
Mushroom first 312 is octagonal post, strip convex tendon of the collet 313 for bridge joint between adjacent two mushroom head 312, each He of collet 313
Top surface formation network structure of the mushroom head 312 in substrate.Also, because adjacent column mushroom head 312 is mutual dislocation, so net
Shape structure is honeycomb.In addition, the mark groove shape of different lines is different, a such as row labeled slots are circle, adjacent another row mark
Note groove is cross.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
The present invention is described in detail with reference to the foregoing embodiments, it will be understood by those within the art that：It still may be used
To be modified to the technical scheme described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic；
And these modification or replace, do not make appropriate technical solution essence depart from various embodiments of the present invention technical scheme spirit and
Scope.
Claims (7)
1. floor heating bed board, including mainboard body, the mainboard body main substrate being made up of plate part and mushroom head and lay thereon
Overlay film is constituted, it is characterised in that：The opposite end of mainboard body is respectively first end and the second end, and first end is convexly equipped with for buckle
Edge is buckled in upper at the top of the second end of adaptation floor heating bed board, and the second end is convexly equipped with the first end for being buckled in adaptation floor heating bed board
The lower button edge of bottom, upper button is closed along the grouting channel provided with up/down perforation, lower button along provided with open top, remaining side seal
Contain stock tank.
2. floor heating bed board according to claim 1, it is characterised in that：The lower port of grouting channel connecing provided with downward drawdown
Head, it is the big tripe groove that chamber width is more than width of rebate to contain stock tank.
3. floor heating bed board according to claim 1 or 2, it is characterised in that：The root of mushroom head, which is provided with, is located at plate part
Top surface on collet, the top surface of collet is less than the top surface of mushroom head, and the bottom of collet is flushed with the root of mushroom head.
4. floor heating bed board according to claim 1 or 2, it is characterised in that：Mushroom head is on the top surface of substrate in array point
Cloth, the mushroom head mutual dislocation distribution of adjacent two row.
5. floor heating bed board according to claim 1 or 2, it is characterised in that：Mushroom head is square column, and collet is disc,
Expose from the surrounding of mushroom head at the edge of collet.
6. floor heating bed board according to claim 1 or 2, it is characterised in that：Mushroom head is square column, and collet is positioned at mushroom
The strip convex tendon of rostral face center position, collet has four, and four collets are distributed on the surrounding of mushroom head.
7. floor heating bed board according to claim 1 or 2, it is characterised in that：Mushroom head is octagonal post, and collet exists for bridge joint
The top surface formation network structure of strip convex tendon between adjacent two mushroom head, each collet and mushroom head in substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710373227.4A CN107013009A (en) | 2017-05-24 | 2017-05-24 | A kind of floor heating bed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710373227.4A CN107013009A (en) | 2017-05-24 | 2017-05-24 | A kind of floor heating bed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107013009A true CN107013009A (en) | 2017-08-04 |
Family
ID=59450827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710373227.4A Pending CN107013009A (en) | 2017-05-24 | 2017-05-24 | A kind of floor heating bed board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107013009A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111712607A (en) * | 2017-12-22 | 2020-09-25 | 2600302安大略有限公司 | Interconnectable collage system |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000186823A (en) * | 1998-12-18 | 2000-07-04 | Inax Corp | Method for executing floor heating |
| CN101313114A (en) * | 2005-10-04 | 2008-11-26 | Comc有限责任公司 | Modular flooring assemblies |
| CN102337779A (en) * | 2010-07-20 | 2012-02-01 | 青岛海景包装制品有限公司 | Ground-heating thermal insulation layer |
| CN102700142A (en) * | 2012-06-06 | 2012-10-03 | 北京利达保能科技发展有限责任公司 | Method for coating thin floor-heating insulation benzene plate |
| CN202787888U (en) * | 2012-06-06 | 2013-03-13 | 北京利达保能科技发展有限责任公司 | Thin floor-heating thermal insulation board |
| CN203475767U (en) * | 2013-08-16 | 2014-03-12 | 东营瑞源特种建筑材料有限公司 | Novel splicing type floor heating module |
| CN206073246U (en) * | 2016-08-31 | 2017-04-05 | 上海天合智能科技股份有限公司 | A kind of module type floor heating mushroom plate |
| CN206800891U (en) * | 2017-05-24 | 2017-12-26 | 济源市北海源泉包装材料加工厂 | A kind of floor heating bed board |
-
2017
- 2017-05-24 CN CN201710373227.4A patent/CN107013009A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000186823A (en) * | 1998-12-18 | 2000-07-04 | Inax Corp | Method for executing floor heating |
| CN101313114A (en) * | 2005-10-04 | 2008-11-26 | Comc有限责任公司 | Modular flooring assemblies |
| CN102337779A (en) * | 2010-07-20 | 2012-02-01 | 青岛海景包装制品有限公司 | Ground-heating thermal insulation layer |
| CN102700142A (en) * | 2012-06-06 | 2012-10-03 | 北京利达保能科技发展有限责任公司 | Method for coating thin floor-heating insulation benzene plate |
| CN202787888U (en) * | 2012-06-06 | 2013-03-13 | 北京利达保能科技发展有限责任公司 | Thin floor-heating thermal insulation board |
| CN203475767U (en) * | 2013-08-16 | 2014-03-12 | 东营瑞源特种建筑材料有限公司 | Novel splicing type floor heating module |
| CN206073246U (en) * | 2016-08-31 | 2017-04-05 | 上海天合智能科技股份有限公司 | A kind of module type floor heating mushroom plate |
| CN206800891U (en) * | 2017-05-24 | 2017-12-26 | 济源市北海源泉包装材料加工厂 | A kind of floor heating bed board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111712607A (en) * | 2017-12-22 | 2020-09-25 | 2600302安大略有限公司 | Interconnectable collage system |
| US11609501B2 (en) | 2017-12-22 | 2023-03-21 | Tac-Fast Systems Sa | Interconnectable tiling system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206204901U (en) | A kind of accurate heating and anti-freezing anti-seepage channel | |
| CN206800891U (en) | A kind of floor heating bed board | |
| CN107013009A (en) | A kind of floor heating bed board | |
| CN109707114A (en) | Tile roofing antiskid construction technology engineering method | |
| CN206803292U (en) | A kind of floor heating installing plate | |
| CN102287039B (en) | Integrated quickly-paved substrate system for electric heating floor heater | |
| CN101245928A (en) | Assembly type ground radiation heating installation | |
| CN207112953U (en) | A kind of heat supply insulation board | |
| CN206800749U (en) | A kind of floor heating mushroom plate | |
| CN107013964A (en) | A kind of floor heating installing plate | |
| CN204285695U (en) | The indoor air-conditioning system of ground cold or warm radiating element and formation thereof fast | |
| CN107035052A (en) | A kind of floor heating mushroom plate | |
| CN217759772U (en) | Floor heating system | |
| CN206803307U (en) | A kind of ground heating heat insulation module | |
| CN110735534A (en) | Installation method of water floor heaters | |
| DE102007025103A1 (en) | Method e.g. for using heat from surface collector on building, involves having surface and collector in area of building with temperature differential between heat transfer fluid and base | |
| US20070295827A1 (en) | Floor with radiant heat and method of construction | |
| CN212836282U (en) | A tile roof structure | |
| CN209523431U (en) | A kind of reinforcement heat supply insulation board | |
| CN203249309U (en) | A floor heating module | |
| CN209891660U (en) | Hollowed-out floor heating insulation board | |
| CN210241751U (en) | A energy-conserving floor heating pipe way for construction | |
| CN111851871A (en) | A large-area landscape planting roof dissipative structure device and its construction method | |
| JP2732396B2 (en) | Roof structure | |
| CN218721784U (en) | Floor heating pipe template of mating formation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |