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CN107011843A - A kind of resin adhesive of high folding resistance - Google Patents

A kind of resin adhesive of high folding resistance Download PDF

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Publication number
CN107011843A
CN107011843A CN201710162397.8A CN201710162397A CN107011843A CN 107011843 A CN107011843 A CN 107011843A CN 201710162397 A CN201710162397 A CN 201710162397A CN 107011843 A CN107011843 A CN 107011843A
Authority
CN
China
Prior art keywords
parts
resin adhesive
ethyl acetate
adhesive
tmg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201710162397.8A
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Chinese (zh)
Inventor
张玲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201710162397.8A priority Critical patent/CN107011843A/en
Publication of CN107011843A publication Critical patent/CN107011843A/en
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
    • C08J9/12—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
    • C08J9/14—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent organic
    • C08J9/143—Halogen containing compounds
    • C08J9/144—Halogen containing compounds containing carbon, halogen and hydrogen only
    • C08J9/146—Halogen containing compounds containing carbon, halogen and hydrogen only only fluorine as halogen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2203/00—Foams characterized by the expanding agent
    • C08J2203/14—Saturated hydrocarbons, e.g. butane; Unspecified hydrocarbons
    • C08J2203/142—Halogenated saturated hydrocarbons, e.g. H3C-CF3
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2467/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2467/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/14—Applications used for foams
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention provides a kind of resin adhesive of high folding resistance：By biphenyl epoxy resin (NC 3000P), polyethylene terephthalate (PET), dimethyl silicone polymer polyalkylene block copolymer, aluminium hydroxide and ethyl acetate, which are placed in ball mill, to be fully ground, and then adds 1,1,1,2,3,4,4,4 octafluorobutanes, TMG trifluoro-methanyl sulfonate and ethyl acetate, are blended resin adhesive.

Description

A kind of resin adhesive of high folding resistance
Technical field
The present invention relates to a kind of preparation method of adhesive, especially a kind of resin adhesive of high folding resistance.
Background technology
Adhesive really begins with the production of scale in China, is since 1958.Into the eighties, adhesive Development occurs in that climax.The synthetic adhesive industry of World Developed Countries has had been enter into the highly developed stage at present, puts down the nineties Equal growth rate is 3% or so, and China's balanced growth is 19.5%.Adhesive turns into China's chemical field and developed after 2008 One of most fast key industry.
CN104419352A discloses a kind of polyvinyl chloride adhesive, and component is by the PS foams, cyclohexanone, the dimethylbenzene that reclaim Constitute.Classify by the PS foams that reclaim through cleaning, cleaned, dried, be broken into fritter after replacement resin of industry make solid constituent；Press Percentage by weight, cyclohexanone 50%, dimethylbenzene 48%, PVC resin powder 2%, in open metal container in situation about mixing slowly Under, PVC resin powder is first dissolved in after cyclohexanone, dimethylbenzene, dissolving PS fragments to liquid are added into sticky glue, by filtering off The removal of impurity is PS adhesive.
CN105385410A discloses a kind of adhesive, wherein：The adhesive includes glass cement and is mixed in described Alose, Rush Pith, Lepiota brunneoincarnata powder, AEO and oleoyl methyl ox in glass cement Sodium sulfonate, wherein, the percentage by weight that each composition accounts for the adhesive respectively is：Alose 1%；Rush Pith 0.01%；Lepiota brunneoincarnata powder 0.04%；AEO 0.03%；Oleoyl methyl sodium taurocholate 0.02%；Glass cement 98.9%.Compound adhesive penetration and bonding force in the present invention are significantly increased.
Existing adhesive production technology there are adhesive using rear ductility it is not strong, gluing performance is with product deformation The shortcoming of reduction.
The content of the invention
The purpose of the present invention is：There is provided a kind of resin adhesive of high folding resistance, it is characterised in that preparation process includes：
By weight, by 100 parts of biphenyl epoxy resin, 1-5 parts of polyethylene terephthalate (PET), polydimethylsiloxanes 100-500 parts of alkane -0.1-1 parts of polyalkylene block copolymer, 5-10 parts of aluminium hydroxide and ethyl acetate are placed in ball mill and filled Divide grinding, then add 0.5-2 parts of 1,1,1,2,3,4,4,4- octafluorobutane, TMG trifluoro-methanyl sulfonate 0.01-0.1 100-500 parts of part and ethyl acetate, continue high-speed stirred 5-10 hours, are blended resin adhesive compound.
The 1,1,1,2,3,4,4,4- octafluorobutanes parts by weight are 0.5-2 parts；TMG trifluoro-methanyl sulfonate 0.01-0.1 parts of parts by weight are 0.5-2 parts.
Described biphenyl polyoxy resin is commercially available prod, the product of such as Japanese chemical drug company production；Poly terephthalic acid second Diol ester (PET) is commercially available prod, such as the product of Anyang Chemical Industry Group Co., Ltd production；Dimethyl silicone polymer-poly- Alkylene group block copolymer is commercially available prod；1,1,1,2,3,4,4,4- octafluorobutane is commercially available prod, and such as Shenzhen's regent is given birth to Change the product of Science and Technology Ltd.'s production；TMG trifluoro-methanyl sulfonate is commercially available prod, such as Chinese Academy of Sciences Lanzhou Chemistry and Physics Institute The product of production.
The product of the present invention has the advantages that：
1st, it is flexible strong after, it is difficult because deformation loses effect.
2nd, with high folding resistance, more application fields are gone for.
3rd, light weight, and tend to smear out uniformly, 1,1,1,2,3,4,4,4- octafluorobutane produces small space and avoided carefully The generation of line stress, improves folding resistance.
Embodiment
Following instance is only to further illustrate the present invention, is not limitation the scope of protection of the invention.
Embodiment 1
In 2000L reactors, 100Kg biphenyl epoxy resins (NC-3000P), 3Kg polyethylene terephthalates are added (PET), 0.5Kg dimethyl silicone polymers-polyalkylene block copolymer, 8Kg aluminium hydroxides, 300Kg ethyl acetate is placed in ball It is fully ground in grinding machine, then adds 1Kg1,1,1,2,3,4,4,4- octafluorobutane, 0.05Kg TMG trifluoromethayl sulfonic acids Salt, 300Kg ethyl acetate continues high-speed stirred 8 hours, is blended resin adhesive compound.Production code member M-1.
Embodiment 2
In 2000L reactors, 100Kg biphenyl epoxy resins (NC-3000P), 1Kg polyethylene terephthalates are added (PET), 0.1Kg dimethyl silicone polymers-polyalkylene block copolymer, 5Kg aluminium hydroxides, 100Kg ethyl acetate is placed in ball It is fully ground in grinding machine, then adds 0.5Kg1,1,1,2,3,4,4,4- octafluorobutane, 0.01Kg TMG fluoroform sulphurs Hydrochlorate, 100Kg ethyl acetate continues high-speed stirred 5 hours, is blended resin adhesive compound.Production code member M-2.
Embodiment 3
In 2000L reactors, 100Kg biphenyl epoxy resins (NC-3000P), 5Kg polyethylene terephthalates are added (PET), 1Kg dimethyl silicone polymers-polyalkylene block copolymer, 10Kg aluminium hydroxides, 500Kg ethyl acetate is placed in ball milling It is fully ground in machine, then adds 0.5Kg1,1,1,2,3,4,4,4- octafluorobutane, 0.1Kg TMG trifluoromethayl sulfonic acids Salt, 500Kg ethyl acetate continues high-speed stirred 10 hours, is blended resin adhesive compound.Production code member M-3.
Comparative example 1
It is added without polyethylene terephthalate (PET), other conditions be the same as Example 1.Production code member M-4.
Comparative example 2
It is added without dimethyl silicone polymer-polyalkylene block copolymer, other conditions be the same as Example 1.Production code member M-5.
Comparative example 3
It is added without 1,1,1,2,3,4,4,4- octafluorobutane, other conditions be the same as Example 1.Production code member M-6.
Comparative example 4
It is added without TMG trifluoro-methanyl sulfonate, other conditions be the same as Example 1.Production code member M-7.
Embodiment 4
The product that embodiment 1-3 and comparative example 1-4 are made examines folding resistance by JIS C 6471, is shown in Table 1.
Table 1：The product performance index that different process is produced
Production code member MD（It is secondary） TD（It is secondary）
M-1 907 911
M-2 896 891
M-3 921 916
M-4 860 854
M-5 869 861
M-6 855 862
M-7 866 863

Claims (3)

1. a kind of resin adhesive of high-peeling strength, it is characterised in that comprise the following steps：
By weight, by 100 parts of biphenyl epoxy resin (NC-3000P), 1-5 parts of polyethylene terephthalate (PET) gathers Dimethyl siloxane -0.1-1 parts of polyalkylene block copolymer, 100-500 parts of 5-10 parts of aluminium hydroxide and ethyl acetate are placed in It is fully ground in ball mill, then adds 1,1,1,2,3,4,4,4- octafluorobutane, TMG trifluoro-methanyl sulfonate, and 100-500 parts of ethyl acetate, continues high-speed stirred 5-10 hours, is blended resin adhesive compound.
2. a kind of resin adhesive of high-peeling strength described in claim 1, it is characterised in that described 1,1,1,2,3,4,4,4- Octafluorobutane parts by weight are 0.5-2 parts.
3. a kind of resin adhesive of high-peeling strength described in claim 1, it is characterised in that the TMG fluoroform 0.01-0.1 parts of parts by weight of sulfonate are 0.5-2 parts.
CN201710162397.8A 2017-03-18 2017-03-18 A kind of resin adhesive of high folding resistance Withdrawn CN107011843A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710162397.8A CN107011843A (en) 2017-03-18 2017-03-18 A kind of resin adhesive of high folding resistance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710162397.8A CN107011843A (en) 2017-03-18 2017-03-18 A kind of resin adhesive of high folding resistance

Publications (1)

Publication Number Publication Date
CN107011843A true CN107011843A (en) 2017-08-04

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Country Status (1)

Country Link
CN (1) CN107011843A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119021030A (en) * 2024-08-21 2024-11-26 湖南鼎一致远科技发展股份有限公司 A kind of monochrome thermal erasable paper and its preparation method

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1071694A (en) * 1991-10-18 1993-05-05 纳幕尔杜邦公司 1,1,2,2,3,3,4, the Azeotrope compositions of 4-Octafluorobutane and alcohols or ketone
CN1429245A (en) * 2000-03-29 2003-07-09 陶氏环球技术公司 Integral skin foams employing pentafluorobutane blowing agents
CN1585789A (en) * 2001-11-13 2005-02-23 大金工业株式会社 Process for producing synthetic resin foam
CN101747854A (en) * 2008-12-04 2010-06-23 比亚迪股份有限公司 Adhesive combination, covering film and flexible circuit board
CN101851480A (en) * 2010-05-11 2010-10-06 华烁科技股份有限公司 Halogen-free and phosphorous-free flame-retardant synthetic resin adhesive used for flexible copper clad laminate
CN101892027A (en) * 2010-07-08 2010-11-24 广东生益科技股份有限公司 Low-halogen-content flame-retardant adhesive and flexible copper clad laminate prepared from same
CN104672463A (en) * 2015-01-21 2015-06-03 浙江大学 Polyalkysiloxane-polyolefin segmented copolymer as well as preparation method and application thereof
CN105949493A (en) * 2016-05-05 2016-09-21 巨化集团技术中心 Foaming composition and preparation method thereof

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1071694A (en) * 1991-10-18 1993-05-05 纳幕尔杜邦公司 1,1,2,2,3,3,4, the Azeotrope compositions of 4-Octafluorobutane and alcohols or ketone
CN1429245A (en) * 2000-03-29 2003-07-09 陶氏环球技术公司 Integral skin foams employing pentafluorobutane blowing agents
CN1585789A (en) * 2001-11-13 2005-02-23 大金工业株式会社 Process for producing synthetic resin foam
CN101747854A (en) * 2008-12-04 2010-06-23 比亚迪股份有限公司 Adhesive combination, covering film and flexible circuit board
CN101851480A (en) * 2010-05-11 2010-10-06 华烁科技股份有限公司 Halogen-free and phosphorous-free flame-retardant synthetic resin adhesive used for flexible copper clad laminate
CN101892027A (en) * 2010-07-08 2010-11-24 广东生益科技股份有限公司 Low-halogen-content flame-retardant adhesive and flexible copper clad laminate prepared from same
CN104672463A (en) * 2015-01-21 2015-06-03 浙江大学 Polyalkysiloxane-polyolefin segmented copolymer as well as preparation method and application thereof
CN105949493A (en) * 2016-05-05 2016-09-21 巨化集团技术中心 Foaming composition and preparation method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
李俊妮: "新型聚硅氧烷嵌段共聚物的合成研究进展", 《精细与专用化学品》 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119021030A (en) * 2024-08-21 2024-11-26 湖南鼎一致远科技发展股份有限公司 A kind of monochrome thermal erasable paper and its preparation method

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Application publication date: 20170804

WW01 Invention patent application withdrawn after publication