CN106995665B - Heat-resistant UV (ultraviolet) anti-adhesion film and preparation method thereof - Google Patents
Heat-resistant UV (ultraviolet) anti-adhesion film and preparation method thereof Download PDFInfo
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- CN106995665B CN106995665B CN201710242271.1A CN201710242271A CN106995665B CN 106995665 B CN106995665 B CN 106995665B CN 201710242271 A CN201710242271 A CN 201710242271A CN 106995665 B CN106995665 B CN 106995665B
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- Prior art keywords
- resistant
- film
- layer
- heat
- adhesive
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- 238000002360 preparation method Methods 0.000 title abstract description 4
- 239000010410 layer Substances 0.000 claims abstract description 63
- 239000000853 adhesive Substances 0.000 claims abstract description 30
- 230000001070 adhesive effect Effects 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 239000012790 adhesive layer Substances 0.000 claims abstract description 11
- 239000002904 solvent Substances 0.000 claims abstract description 11
- 239000000654 additive Substances 0.000 claims abstract description 10
- 230000000996 additive effect Effects 0.000 claims abstract description 9
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 7
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 7
- 230000001588 bifunctional effect Effects 0.000 claims abstract description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 21
- 239000000203 mixture Substances 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 19
- 238000000576 coating method Methods 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 15
- 239000003431 cross linking reagent Substances 0.000 claims description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Substances CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- -1 2-hydroxy-methyl phenyl Chemical group 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 6
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 6
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 5
- 239000000178 monomer Substances 0.000 claims description 5
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 4
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 claims description 4
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 4
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 claims description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 4
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 claims description 4
- 238000004026 adhesive bonding Methods 0.000 claims description 4
- 125000001931 aliphatic group Chemical group 0.000 claims description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 4
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 claims description 4
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 claims description 4
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 4
- 239000008096 xylene Substances 0.000 claims description 4
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 claims description 3
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 claims description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 3
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 claims description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 claims description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 claims description 2
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 claims description 2
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 claims description 2
- BMZWRXOVNFVRJL-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;[2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound CCC(CO)(CO)CO.C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C BMZWRXOVNFVRJL-UHFFFAOYSA-N 0.000 claims description 2
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 claims description 2
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 claims description 2
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 claims description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 2
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 claims description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 claims description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 claims description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 claims description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 2
- 244000028419 Styrax benzoin Species 0.000 claims description 2
- 235000000126 Styrax benzoin Nutrition 0.000 claims description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 claims description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 229960002130 benzoin Drugs 0.000 claims description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 235000019382 gum benzoic Nutrition 0.000 claims description 2
- 239000012948 isocyanate Substances 0.000 claims description 2
- 150000002513 isocyanates Chemical class 0.000 claims description 2
- 229910021645 metal ion Inorganic materials 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- ZGLJZIDHAZXABI-UHFFFAOYSA-N 2-butyl-2-(hydroxymethyl)propane-1,3-diol 2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.CC(=C)C(O)=O.CC(=C)C(O)=O.CCCCC(CO)(CO)CO ZGLJZIDHAZXABI-UHFFFAOYSA-N 0.000 claims 1
- VFZKVQVQOMDJEG-UHFFFAOYSA-N 2-prop-2-enoyloxypropyl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(=O)C=C VFZKVQVQOMDJEG-UHFFFAOYSA-N 0.000 claims 1
- 125000000524 functional group Chemical group 0.000 claims 1
- 230000000181 anti-adherent effect Effects 0.000 abstract description 18
- 239000002313 adhesive film Substances 0.000 abstract description 14
- 238000005516 engineering process Methods 0.000 abstract description 5
- 239000004848 polyfunctional curative Substances 0.000 abstract 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 37
- 239000005020 polyethylene terephthalate Substances 0.000 description 37
- 238000003756 stirring Methods 0.000 description 7
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 6
- 239000002390 adhesive tape Substances 0.000 description 6
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- 238000005520 cutting process Methods 0.000 description 2
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- 230000005855 radiation Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- VFZRULITCDZDLZ-UHFFFAOYSA-N C(C=C)(=O)OCC(COC(C=C)=O)(COCC(COC(C=C)=O)(COC(C=C)=O)COC(C=C)=O)CO.C(C=C)(=O)OCC(COC(C=C)=O)(COC(C=C)=O)COC(C=C)=O Chemical compound C(C=C)(=O)OCC(COC(C=C)=O)(COCC(COC(C=C)=O)(COC(C=C)=O)COC(C=C)=O)CO.C(C=C)(=O)OCC(COC(C=C)=O)(COC(C=C)=O)COC(C=C)=O VFZRULITCDZDLZ-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- WYBMZRZARDIPLQ-UHFFFAOYSA-N NCC.[C] Chemical compound NCC.[C] WYBMZRZARDIPLQ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 210000004877 mucosa Anatomy 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
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- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention provides a heat-resistant UV (ultraviolet) anti-adhesive film which sequentially comprises a substrate layer, a UV photosensitive adhesive layer and a release film layer. The UV photosensitive adhesive layer comprises the following components in percentage by weight: 30-50% of solvent type high temperature resistant polyacrylate pressure-sensitive adhesive, 1-25% of low molecular weight mixed additive, 0.1-3% of bifunctional or polyfunctional special additive, 0.1-1.5% of photoinitiator, 0.5-2% of hardener and 35-60% of solvent. Also provides a preparation method of the heat-resistant UV anti-sticking film. The invention not only improves the adherence and high temperature resistance of the UV photosensitive adhesive to the corona PET substrate, but also reduces the primer treatment technology and optimizes the product structure.
Description
Technical Field
The invention belongs to the technical field of functional adhesive tapes, relates to a UV (ultraviolet) anti-adhesive film, and particularly relates to a heat-resistant UV anti-adhesive film and a preparation method thereof.
Background
With the increasing growth of electronic products, the demand for functional materials such as functional tapes is becoming higher and higher. At present, the UV anti-adhesive film adhesive tape is different from a functional adhesive tape and is mainly applied to the protection of a wafer cutting process and an electronic glass reprocessing process. In the process of wafer cutting and picking, the UV anti-sticking film mainly takes a PO film with certain flexibility as a base material, so that the sticking of the wafer curved surface is facilitated; the UV anti-adhesive film taking PET as a base material is mainly applied to plane electronic glass, no specific requirement is made on the softness of the adhesive tape, but the requirement on the high temperature resistance of the adhesive tape is higher and higher, and the adhesive force of the UV anti-adhesive film adhesive tape to the electronic glass is generally required to be more than 1500gf/inch, which provides great challenge to the performance of the UV anti-adhesive film.
The invention discloses a heat-resistant UV (ultraviolet) viscosity reducing adhesive composition and a UV viscosity reducing protective film, wherein a base coat is coated on a corona PET (polyethylene terephthalate) coiled material, and a formula technology is matched, so that the problem that the UV viscosity reducing protective film is high-temperature resistant, especially high-temperature resistant at 120 ℃ is solved, the UV viscosity reducing protective film has large stripping force before UV illumination, low stripping force after UV illumination and no residual adhesive, but the invention technology cannot overcome the requirement of high temperature resistant at 150 ℃, and simultaneously a production process is added by adopting a coating base coat technology, so that the production cost is increased, and the production efficiency is reduced.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, it is an object of the present invention to provide a heat-resistant UV anti-adhesive film.
The invention realizes the purpose through the following technical scheme:
the utility model provides a heat-resistant type UV subtracts mucosa, includes substrate layer, UV photosensitive adhesive layer and leaves type rete in proper order.
Further, the substrate layer is the corona PET substrate layer, UV photosensitive gluing agent layer is UV visbreaking PSA layer, it is PET release film layer to leave the type rete.
Further, the UV photosensitive adhesive layer comprises the following components in percentage by weight:
further, the solvent type high temperature resistant polyacrylate pressure-sensitive adhesive is a two-component or multi-component solvent type high temperature resistant polyacrylate pressure-sensitive adhesive, the relative molecular mass is 20-150 ten thousand, the solid content is 30-55%, and the viscosity is 5 multiplied by 103CPS-20×103CPS。
Further, the low-molecular mixing additive is a polyfunctional oligomer or a polyfunctional monomer or a combination thereof selected from the group consisting of aliphatic urethane acrylate oligomer, aromatic urethane acrylate oligomer, pure acrylate oligomer, epoxy acrylate oligomer, polyester acrylate oligomer, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, 2-hydroxyethyl methacrylate, acrylamide, 1, 6-hexanediol dimethacrylate, 1, 6-hexanediol diacrylate, ethylene glycol diacrylate, triethylene glycol diacrylate, tripropylene glycol diacrylate, ethylene glycol diacrylate, propylene, Two or more of neopentyl glycol diacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, trimethylolpropane pentaerythritol triacrylate, propoxylated neopentyl glycol diacrylate, ethoxylated 1, 6-hexanediol diacrylate, tris (2-acryloxyethyl) isocyanurate, and two or more of aliphatic urethane acrylate oligomer, epoxy acrylate oligomer, pentaerythritol tetraacrylate dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate or trimethylolpropane triacrylate as the polyfunctional oligomer or polyfunctional monomer or its composition.
Further, the photoinitiator is one or more of 1-hydroxycyclohexyl phenyl ketone (184), 2-hydroxy-methyl phenyl propane-1-ketone (1173), 2-methyl-1- (4-methylthiophenyl) -2-morpholinyl-1-acetone (907), benzoin dimethyl ether (651), xylene ketone (BP), 2-Isopropyl Thioxanthone (ITX), 2,4,6- (trimethylbenzoyl) -diphenyl phosphine oxide (TPO) and DR-575.
Further, the bifunctional or polyfunctional special additive is one or more of hydroxylated oligomer, carboxylated oligomer, epoxy oligomer, aminated oligomer and oligomer containing isocyanate group.
Further, the hardening agent is one or more of a metal ion crosslinking agent, an isocyanate crosslinking agent, an amine crosslinking agent and an aziridine crosslinking agent.
Further, the solvent is one or more of ethyl acetate, butyl acetate, methanol, ethanol, propanol, isopropanol, isobutanol, n-butanol, methyl isobutyl ketone, isophorone, acetone, butanone, cyclohexanone, toluene, xylene, propylene glycol methyl ether and dipropylene glycol methyl ether.
A method of preparing the heat resistant UV detackifying film of claim 1 by: providing a base material; uniformly mixing all components of the UV photosensitive adhesive layer, coating the mixture on the surface of the base material, and drying and curing; and attaching a release film to the surface of the UV photosensitive adhesive layer to obtain the heat-resistant UV adhesive reducing film.
Compared with the prior art, the invention has the beneficial effects that:
1. the high-temperature-resistant polyacrylate pressure-sensitive adhesive and the high-shrinkage low-molecular mixed additive are matched, so that the whole adhesive layer is plasticized, and the effects of large stripping force before UV radiation and sharp reduction of the stripping force after UV radiation are achieved;
2. special additives capable of performing UV reaction and chemical reaction are added, so that the adherence of the photosensitive adhesive layer to the corona PET substrate layer is effectively improved, and the high temperature resistance of the UV photosensitive adhesive layer is enhanced;
3. the primer treatment technology is reduced, the product structure of the UV anti-sticking film is optimized, and the production cost is reduced.
Drawings
FIG. 1 is a schematic view showing the structure of heat-resistant UV ray-curable adhesive films according to examples 1 to 4 of the present invention and comparative example 2;
wherein, 11 corona PET substrate layer; 12UV visbreaking PSA layer; 13PET release film layer;
FIG. 2 is a schematic structural view of a UV detackifying film of comparative example 1 of the present invention;
21 corona PET substrate layer; 22PET primer layer; 23UV visbreaking PSA layer; 24PET release film layer.
Detailed Description
The following detailed description will be given with reference to examples to make the technical solution of the present invention easier to understand and grasp, but the present invention is not limited thereto. The experimental methods described in the following examples are all conventional methods unless otherwise specified; the reagents and materials are commercially available, unless otherwise specified.
Example 1
As shown in fig. 1, the heat-resistant UV anti-adhesive film of the present embodiment includes a corona PET substrate layer 11, a UV anti-adhesive PSA layer 12, and a PET release film layer 13 in this order.
Preparing a heat-resistant UV photosensitive adhesive: 28g of DR-U202 (manufactured by Changxing chemical Co., Ltd.), 8g of EM231 (manufactured by Changxing chemical Co., Ltd.), 120g of DS-203A (manufactured by Dongsheng chemical Co., Ltd.), and 118g of ethyl acetate are put into a 500mL light-shielding cup, uniformly stirred by a dispersion machine, then 0.5g of XY-2 (manufactured by Shanghai Seikensen materials science and technology Co., Ltd.), 1.9g of photoinitiator 184 (manufactured by Tianjin Tianjiao chemical Co., Ltd.) and 4.14g L-45E (manufactured by Nanjing Sounda chemical Co., Ltd.) are added in sequence while stirring, after the addition is finished, the mixture is stirred at the rotating speed of 500rpm for 30min, and is kept for natural defoaming for more than 30min, so that the heat-resistant UV photosensitive adhesive can be obtained.
And (3) coating a UV photosensitive adhesive: coating a UV photosensitive adhesive on a corona PET substrate 11 by using a blade coater, wherein the baking temperature is 105 ℃, the baking time is 3min, forming a uniform UV viscosity-reducing PSA layer 12 with the thickness of 15 microns, and then pasting a PET release film layer 13 with the thickness of 50 microns on the surface of the UV viscosity-reducing PSA layer 12 to obtain the heat-resistant UV viscosity-reducing film.
Example 2
As shown in fig. 1, the heat-resistant UV anti-adhesive film of the present embodiment includes a corona PET substrate layer 11, a UV anti-adhesive PSA layer 12, and a PET release film layer 13 in this order.
Preparing a heat-resistant UV photosensitive adhesive: 31g of DM87A (manufactured by double bond chemical Co., Ltd.), 7.5g of EM231 (manufactured by Changxing chemical Co., Ltd.), 110g of DS-201A (manufactured by Dongsheng chemical Co., Ltd.) and 125g of ethyl acetate are put into a 500mL light-shielding cup, the mixture is uniformly stirred by a dispersion machine, then 0.65g of XY-2 (manufactured by Shanghai Seikensen materials science and technology Co., Ltd.), 1.9g of photoinitiator 184 (manufactured by Tianjin Tianjiao chemical Co., Ltd.) and 3.98g L-45E (manufactured by Nanjing Sounda general research chemical) are added in sequence while stirring, after the addition is finished, the mixture is stirred for 30min at the rotating speed of 500rpm, and the mixture is kept stand for more than 30min to naturally defoam, so that the heat-resistant UV photosensitive.
And (3) coating a UV photosensitive adhesive: coating a UV photosensitive adhesive on a corona PET substrate 11 by using a blade coater, wherein the baking temperature is 105 ℃, the baking time is 3min, forming a uniform UV viscosity-reducing PSA layer 12 with the thickness of 15 microns, and then pasting a PET release film layer 13 with the thickness of 50 microns on the surface of the UV viscosity-reducing PSA layer 12 to obtain the heat-resistant UV viscosity-reducing film.
Example 3
As shown in fig. 1, the heat-resistant UV anti-adhesive film of the present embodiment includes a corona PET substrate layer 11, a UV anti-adhesive PSA layer 12, and a PET release film layer 13 in this order.
Preparing a heat-resistant UV photosensitive adhesive: 35g of 8415 resin (manufactured by Zhanxin Co., Ltd.), 3g of EM264 (manufactured by Changxing chemical Co., Ltd.), 100g of 1537-2 (manufactured by Toyo ink) and 130g of ethyl acetate are put into a 500mL light-shielding cup, the mixture is stirred uniformly by a dispersion machine, then 0.55g of XY-2 (manufactured by Shanghai Seikensen materials science and technology Co., Ltd.), 2.0g of photoinitiator 184 (manufactured by Tianjin Tianjiao chemical Co., Ltd.) and 3.93g L-45E (manufactured by Nanjing Sounda chemical Co., Ltd.) are added in sequence while stirring, after the addition is completed, the mixture is stirred at the rotating speed of 500rpm for 30min, and the mixture is naturally defoamed after standing for more than 30min, so that the heat-resistant UV visbreaking adhesive is.
And (3) coating a UV photosensitive adhesive: coating a UV photosensitive adhesive on a corona PET substrate 11 by using a blade coater, wherein the baking temperature is 105 ℃, the baking time is 3min, forming a uniform UV viscosity-reducing PSA layer 12 with the thickness of 15 microns, and then pasting a PET release film layer 13 with the thickness of 50 microns on the surface of the UV viscosity-reducing PSA layer 12 to obtain the heat-resistant UV viscosity-reducing film.
Example 4
As shown in fig. 1, the heat-resistant UV anti-adhesive film of the present embodiment includes a corona PET substrate layer 11, a UV anti-adhesive PSA layer 12, and a PET release film layer 13 in this order.
Preparing a heat-resistant UV photosensitive adhesive: 38g of DU7900 resin (manufactured by national essence chemical Co., Ltd.), 130g of 1507 solvent type adhesive (Hangao Co., Ltd.) and 163g of butyl acetate are put into a 500mL light-shielding cup, the materials are uniformly stirred by a dispersion machine, then 0.5g of XY-2 (Shanghai Seikansen materials science and technology Co., Ltd.), 2.1g of photoinitiator 184 (manufactured by Tianjin Tianjiao chemical Co., Ltd.) and 4.98g L-45E (Nanjing Sounda general research chemical Co., Ltd.) are added in sequence while stirring, after the addition is completed, the materials are stirred for 30min at the rotating speed of 500rpm, and the materials are naturally defoamed after standing for more than 30min, so that the high-temperature resistant UV viscosity-reducing adhesive can be.
And (3) coating a UV photosensitive adhesive: coating a UV photosensitive adhesive on a corona PET substrate 11 by using a blade coater, wherein the baking temperature is 105 ℃, the baking time is 3min, forming a uniform UV viscosity-reducing PSA layer 12 with the thickness of 15 microns, and then pasting a PET release film layer 13 with the thickness of 50 microns on the surface of the UV viscosity-reducing PSA layer 12 to obtain the heat-resistant UV viscosity-reducing film.
Comparative example 1
As shown in fig. 2, the UV tack-reducing film of this comparative example sequentially includes a corona PET substrate layer 21, a PET primer layer 22, a UV tack-reducing PSA layer 23, and a PET release film layer 24.
Preparing a heat-resistant UV photosensitive adhesive: 35g of 8415 resin (manufactured by Zhanxin Co., Ltd.), 3g of EM264 (manufactured by Changxing chemical Co., Ltd.), 100g of 1537-2 (Toyobo ink) and 130g of ethyl acetate are put into a 500mL light-shielding cup, the mixture is uniformly stirred by a dispersion machine, then 2.0g of photoinitiator 184 (manufactured by Tianjin Tianjiao chemical Co., Ltd.) and 3.93g L-45E (Nanjing Soundai chemical Co., Ltd.) are added in sequence while stirring, after the addition is completed, the mixture is stirred for 30min at the rotating speed of 500rpm, and the mixture is kept stand for more than 30min for natural defoaming, so that the heat-resistant UV visbreaking adhesive can be obtained.
Coating PET primer 22: selecting a corona PET substrate with the thickness of 50 microns, selecting 50g of waterborne polyurethane emulsion (Shanghaishixian) with the model number of HD2081 as a primer, 2.5g of a carbon-ethylamine crosslinking agent and 10g of deionized water as the primer, uniformly stirring, standing for defoaming for 10min, coating the mixture on the corona surface of the corona PET substrate layer 21, baking at 90 ℃ for 2min, and forming a uniform coating with the dry coating thickness of 0.5 micron.
And (3) coating a UV photosensitive adhesive: coating a UV photosensitive adhesive on the corona PET substrate layer 21 coated with the PET base coat 22 by using a blade coater, wherein the baking temperature is 105 ℃, the baking time is 3min, forming a uniform UV viscosity-reducing PSA layer 23 with the thickness of 15 microns, and then pasting a PET release film layer 24 with the thickness of 50 microns on the surface of the UV viscosity-reducing PSA layer 23 to obtain the heat-resistant UV viscosity-reducing film.
Comparative example 2
As shown in fig. 1, the UV anti-adhesive film of the present comparative example sequentially includes a corona PET substrate layer 11, a UV anti-adhesive PSA layer 12, and a PET release film layer 13.
Preparing a heat-resistant UV photosensitive adhesive: 35g of 8415 resin (manufactured by Zhanxin Co., Ltd.), 3g of EM264 (manufactured by Changxing chemical Co., Ltd.), 100g of 1537-2 (Toyobo ink) and 130g of ethyl acetate are put into a 500mL light-shielding cup, the mixture is uniformly stirred by a dispersion machine, then 2.0g of photoinitiator 184 (manufactured by Tianjin Tianjiao chemical Co., Ltd.) and 3.93g L-45E (Nanjing Soundai chemical Co., Ltd.) are added in sequence while stirring, after the addition is completed, the mixture is stirred for 30min at the rotating speed of 500rpm, and the mixture is kept stand for more than 30min for natural defoaming, so that the heat-resistant UV visbreaking adhesive can be obtained.
And (3) coating a UV photosensitive adhesive: coating a UV photosensitive adhesive on the corona PET substrate layer 11 by using a blade coater, wherein the baking temperature is 105 ℃, and the baking time is 3min, so as to form a uniform UV viscosity-reducing PSA layer 12 with the thickness of 15 microns, and then pasting a PET release film layer 13 with the thickness of 50 microns on the surface of the UV viscosity-reducing PSA layer 12, so as to obtain the heat-resistant UV viscosity-reducing film.
What has been described above are merely some embodiments of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept thereof, and these changes and modifications can be made without departing from the spirit and scope of the invention.
Claims (8)
1. A heat-resistant UV visbreaking film can resist a high temperature of 150 ℃, and is characterized in that: include substrate layer, UV photosensitive gluing agent layer in proper order and leave the type rete, the substrate layer is corona PET substrate layer, UV photosensitive gluing agent layer is UV visbreaking PSA layer, it is PET to leave the type rete from the type rete, UV photosensitive gluing agent layer includes following component according to weight percent:
30-50% of solvent type high-temperature resistant polyacrylate pressure-sensitive adhesive
1 to 25 percent of low-molecular mixed additive
0.1 to 3 percent of special additive with double functional groups or polyfunctional groups
0.1 to 1.5 percent of photoinitiator
0.5 to 2 percent of hardening agent
35 to 60 percent of solvent
The special bifunctional or polyfunctional additive is a carboxylated oligomer which can be subjected to UV reaction and chemical reaction.
2. The heat resistant UV detackifying film of claim 1, wherein: the solvent type high-temperature-resistant polyacrylate pressure-sensitive adhesive is a two-component or multi-component solvent type high-temperature-resistant polyacrylate pressure-sensitive adhesive, the relative molecular mass is 20-150 ten thousand, the solid content is 30-55%, and the viscosity is 5 × 103CPS-20 × 103 CPS.
3. The heat resistant UV detackifying film of claim 1, wherein: the low-molecular mixed additive is a multifunctional oligomer, a multifunctional monomer or a composition thereof, and the multifunctional oligomer, the multifunctional monomer or the composition thereof is prepared from aliphatic urethane acrylate oligomer, aromatic urethane acrylate oligomer, pure acrylate oligomer, epoxy acrylate oligomer, polyester acrylate oligomer, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, 2-hydroxyethyl methacrylate, acrylamide, 1, 6-hexanediol dimethacrylate, 1, 6-hexanediol diacrylate, ethylene glycol diacrylate, propylene glycol diacrylate, triethylene glycol diacrylate, tripropylene glycol diacrylate, neopentyl glycol diacrylate, trimethylol pentane trimethacrylate, trimethylolpropane pentaerythritol triacrylate, propoxylated neopentyl glycol diacrylate, ethoxylated 1, 6-hexanediol diacrylate, tris (2-acryloxyethyl) isocyanurate.
4. The heat resistant UV pressure reducing film according to claim 3, wherein: the multifunctional oligomer, the multifunctional monomer or the composition thereof is composed of two or more of aliphatic urethane acrylate oligomer, epoxy acrylate oligomer, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate or trimethylolpropane triacrylate.
5. The heat resistant UV detackifying film of claim 1, wherein: the photoinitiator is one or more of 1-hydroxycyclohexyl phenyl ketone (184), 2-hydroxy-methyl phenyl propane-1-ketone (1173), 2-methyl-1- (4-methylthiophenyl) -2-morpholinyl-1-acetone (907), benzoin dimethyl ether (651), xylene ketone (BP), 2-Isopropyl Thioxanthone (ITX), 2,4,6- (trimethylbenzoyl) -diphenyl phosphine oxide (TPO) and DR-575.
6. The heat resistant UV detackifying film of claim 1, wherein: the hardening agent is one or more of a metal ion crosslinking agent, an isocyanate crosslinking agent, an amine crosslinking agent and an aziridine crosslinking agent.
7. The heat resistant UV detackifying film of claim 1, wherein: the solvent is one or more of ethyl acetate, butyl acetate, methanol, ethanol, propanol, isopropanol, isobutanol, n-butanol, methyl isobutyl ketone, isophorone, acetone, butanone, cyclohexanone, toluene, xylene, propylene glycol methyl ether and dipropylene glycol methyl ether.
8. A method of preparing the heat resistant UV detackifying film of claim 1, wherein: providing a base material; uniformly mixing all components of the UV photosensitive adhesive layer, coating the mixture on the surface of the base material, and drying and curing; and attaching a release film to the surface of the UV photosensitive adhesive layer to obtain the heat-resistant UV adhesive reducing film.
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