CN106993396A - A kind of anti-shielding construction of mobile phone and cell phone mainboard - Google Patents
A kind of anti-shielding construction of mobile phone and cell phone mainboard Download PDFInfo
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- CN106993396A CN106993396A CN201710346619.1A CN201710346619A CN106993396A CN 106993396 A CN106993396 A CN 106993396A CN 201710346619 A CN201710346619 A CN 201710346619A CN 106993396 A CN106993396 A CN 106993396A
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- Prior art keywords
- mobile phone
- heat
- mainboard
- cell phone
- shielding construction
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Telephone Set Structure (AREA)
Abstract
The present invention discloses the anti-shielding construction of cell phone mainboard a kind of, including mobile phone center and and cell phone mainboard, mobile phone center, which is opened up, accommodates working media and medium phase change component in airtight cavity, airtight cavity.The present invention also provides a kind of mobile phone.The present invention is transferred heat to by heat transfer leads hot linked mobile phone center therewith.Working media in the airtight cavity of mobile phone center absorbs heat vaporization and reaches cavity inner wall, and heat release is liquefied when to the cold, then via medium phase change component backflow cavity.The process causes the anti-shielding construction of the cell phone mainboard not only to have anti-shielding action, and the coefficient of heat conduction is high, and thermal resistance is small, and heat output is big, efficiency high.Heat can be exported from interior of mobile phone rapidly, make to run under mainboard chip thermophilic, effectively avoid heat waste, extend the service life of mainboard.
Description
Technical field
The present invention relates to the technical field of mobile phone radiating, more particularly, to the anti-shielding of a kind of mobile phone and cell phone mainboard
Structure.
Background technology
Developing rapidly and popularizing with smart mobile phone, the components' placement density more and more higher in mobile phone productses, with it
And come is the heat dissipation problem that brings of power consumption increase, complete machine hot-spot problem has badly influenced the experience comfort level of user
And safety in utilization.
The main pyrotoxin of the mobile phone such as platelet, battery connects with mobile phone center under mainboard, mobile phone on mobile phone screen, mobile phone
Touch.Have following two using the mode of more utilization mobile phone center heat conduction at present：In center surface mount Heat Conduction Material, make to lead
The heat generating components such as hot material and cell phone mainboard are contacted, and absorb the heat of mainboard using Heat Conduction Material, and by center metal by heat
Amount is conducted to low-temperature region.Or, by by filling heat-conducting medium inside metal center, using the high heat conduction ability of medium, with
Center metal is combined, and improves the capacity of heat transmission of overall center.
However, above-mentioned utilization center metal material, pastes the heat dissipating method of highly heat-conductive material on center surface, there is following ask
Topic：Heat conductivility is poor, and comprehensive thermal conductivity factor is relatively low；The thicker influence complete machine thickness of center；Complete machine is influenceed to lightening development；
Cost is high.
The content of the invention
In view of the above problems, the present invention proposes a kind of anti-shielding construction of cell phone mainboard, by improving and mainboard heat conduction
The mobile phone middle frame structure of connection, improves the heat transfer efficiency of mobile phone center, preferably resolves the heat dissipation problem of mobile phone.
A kind of anti-shielding construction of cell phone mainboard is provided in the embodiment of the present invention, the structure includes having electromagnetic shielding special
The mobile phone center of property and lead hot linked cell phone mainboard with mobile phone center.Mobile phone center is offered in airtight cavity, airtight cavity
Accommodate the working media and medium phase change component for realizing phase transformation., will by heat transfer when cell phone mainboard temperature is higher
Heat transfer to leading hot linked mobile phone center therewith.Working media in the airtight cavity of mobile phone center absorbs heat vaporization and arrived
Up to cavity inner wall, and when to the cold, heat release is liquefied, then via medium phase change component backflow cavity.The process causes the cell phone mainboard
Anti- shielding construction not only has anti-shielding action, and the coefficient of heat conduction is high, and thermal resistance is small, and heat output is big, efficiency high.Can be rapidly by heat
Amount makes to run under mainboard chip thermophilic, effectively avoids heat waste, extend the service life of mainboard from interior of mobile phone export.
Mobile phone center includes the first bottom plate and the first cover plate for enclosing cavity.Wherein, the first bottom plate is led with cell phone mainboard
It is thermally coupled.Inwall of the medium phase change component of inside cavity along the first bottom plate towards the first cover plate direction is placed in set.Work as hand
When owner's plate temperature is higher, is transferred heat to by heat transfer and lead hot linked first bottom plate therewith.First bottom plate will absorb
Heat transfer to working media, the inwall that working media heat absorption vaporization reaches the first cover plate then liquefies to the cold.Again via medium
Phase change component returns to the inwall of the first bottom plate.The first bottom plate and the first cover plate being provided separately, which are generated, to be easy to assemble and changes,
The effect that the form of assembling is relatively flexible.First bottom plate and the first cover plate can suit measures to local conditions to select identical or different material system
Into.
Cavity is provided with being in communication with the outside for injecting the opening vacuumized again after working media, and opening is kept after evacuation
It is normally closed.By will be vacuumized in cavity so that the atmospheric pressure of cavity is less than external atmosphere pressure.Have the benefit that：Liquid
Boiling point is directly proportional to the air pressure of local environment, when evacuated in cavity after, and the air pressure of working media local environment is relatively low, compared with
Seethe with excitement and vaporize under low temperature.Similarly, in working media, also easily quickly liquefaction is back to inside cavity after heat release.It is greatly improved
The heat conduction and heat radiation efficiency of mobile phone center, mobile phone center rapidly can be led the heat of aggregation by elements such as the mainboards of interior of mobile phone
Go out, chip is run under reasonable temperature, it is ensured that service life, and make the temperature difference in the rapid samming of mobile phone entire surface, reduced plan.
Medium phase change component includes the tin silk extended vertically along the inwall of inwall towards the first cover plate of the first bottom plate.When
During one baseplate heated, working media heat absorption vaporization reaches the first cover plate, and the working media that heat condenses into liquid is released to the cold.It is solidifying
The capillary structure that is formed of the working media along tin silk after knot, is back to the first bottom plate.So circulation, completes turning for heat
Move.
The cross section of medium phase change component is in mesh arrangement.Have the benefit that：Using standard metal punching press, welding procedure
Plane heat pipe is formed in mobile phone center so that the thermal conductivity factor of mobile phone center is improved.Tiny tin silk is formed on first bottom plate
Capillary structure, so that the formation capillary structure that liquefied working media is formed by tiny tin silk after to the cold, quickly falls
The first bottom plate is returned, the process of circulation cooling is completed.
Mobile phone center is provided with heat-conducting piece towards the side of cell phone mainboard；Heat-conducting piece abuts progress with the chip on cell phone mainboard
Heat exchange.Mobile phone center is towards the surface mount heat-conducting piece of the side of cell phone mainboard, the heat generating components such as heat-conducting piece and cell phone mainboard
Contact, heat-conducting piece realizes the process for the heat for absorbing mainboard by contacting cell phone mainboard by heat transfer.Avoid cell phone mainboard
Heat is difficult to export and is stranded in interior of mobile phone.Preferably, heat-conducting piece is made of highly heat-conductive material, for example：Copper foil, graphite is thin
Film, hot phase-change material etc..
Heat-conducting piece offers the thermal conductive cavity of filling heat-conducting medium.Have the effect that：Mobile phone center is towards cell phone mainboard
Side is provided with heat-conducting piece, and the heat generating components such as heat-conducting piece and cell phone mainboard is contacted, and heat-conducting piece passes through heat biography by contacting cell phone mainboard
Lead the process for realizing the heat for absorbing mainboard.The heat of cell phone mainboard is avoided to be difficult to export and be stranded in interior of mobile phone.Heat-conducting piece
Provided with thermal conductive cavity, the working media and medium phase change component for realizing phase transformation are accommodated in thermal conductive cavity.When cell phone mainboard temperature
When higher, the airtight cavity for the mobile phone center for being connected the heat heat transfer of cell phone mainboard to heat-conducting piece therewith by thermal conductive cavity
It is interior.Into in the radiating cyclic process of mobile phone center.The setting of this kind of structure, can be constant even with the cavity volume of mobile phone center
In the case of reduction, remain to keep preferable radiating efficiency.And the heat-conducting piece of cell phone mainboard is convex to by setting, can be caused
It is more frivolous that the thickness of mobile phone center further becomes, so as to reduce the thickness of mobile phone.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, makes required in being described below to embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those skilled in the art, on the premise of not paying creative work, it can also be obtained according to these accompanying drawings other attached
Figure.
Fig. 1 is the assembling structure schematic diagram of one embodiment of the invention；
Fig. 2 is the mobile phone middle frame structure schematic diagram of one embodiment of the invention；
Fig. 3 is the structural representation of two embodiments of the anti-shielding construction of cell phone mainboard of the present invention；
Fig. 4 is the structural representation of three embodiments of the anti-shielding construction of cell phone mainboard of the present invention；
Fig. 5 is the structural representation of four embodiments of the anti-shielding construction of cell phone mainboard of the present invention；
Fig. 6 is the cross-sectional view of the mobile phone center of the anti-shielding construction of cell phone mainboard of the present invention；
Fig. 7 is the cross-sectional view of the lower cover of the anti-shielding construction of cell phone mainboard of the present invention；
Fig. 8 coats the cross-sectional view of photoresists for the lower cover of the anti-shielding construction of cell phone mainboard of the present invention；
Exposure mask making and the structural representation of apply pressure mask of the Fig. 9 for the anti-shielding construction of cell phone mainboard of the present invention；
Figure 10 is the exposure process schematic diagram of the anti-shielding construction of cell phone mainboard of the present invention；
Figure 11 is the schematic diagram for removing film development of the anti-shielding construction of cell phone mainboard of the present invention；
Figure 12 is the cross-sectional structure schematic diagram of the etching of the anti-shielding construction of cell phone mainboard of the present invention；
The cross-sectional structure schematic diagram that Figure 13 is molded for the capillary structure of the anti-shielding construction of cell phone mainboard of the present invention.
Drawing reference numeral explanation：
| Title | Numbering | Title | Numbering |
| Mobile phone center | 1 | First cover plate | 15 |
| Airtight cavity | 11 | Structure perforate | 16 |
| Opening | 111 | Cell phone mainboard | 2 |
| Working media | 12 | Platelet under mobile phone | 3 |
| Medium phase change component | 13 | Battery of mobile phone | 4 |
| First bottom plate | 14 | Conducting resinl | 5 |
Embodiment
In order that those skilled in the art more fully understand the present invention program, below in conjunction with the embodiment of the present invention
Accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described.
In some flows of description in description and claims of this specification and above-mentioned accompanying drawing, contain according to
Particular order occur multiple operations, but it should be clearly understood that these operation can not herein occur according to it is suitable
Sequence is performed or performed parallel, and the sequence number such as 101,102 etc. of operation is only used for distinguishing each different operation, sequence number
Any execution sequence is not represented for itself.In addition, these flows can include more or less operations, and these operations can
To perform or perform parallel in order.It should be noted that the description such as " first ", " second " herein, is to be used to distinguish not
Same message, equipment, module etc., does not represent sequencing, it is different types also not limit " first " and " second ".
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, the every other implementation that those skilled in the art are obtained under the premise of creative work is not made
Example, belongs to the scope of protection of the invention.
Referring to Figures 1 and 2, Fig. 1 illustrates for the assembling structure of an embodiment of the anti-shielding construction of cell phone mainboard 2 of the present invention
Figure, Fig. 2 is the structural representation of mobile phone center 1 of an embodiment of the anti-shielding construction of cell phone mainboard 2 of the present invention.
The present invention provides a kind of anti-shielding construction of cell phone mainboard 2, including the mobile phone center 1 with electromagnetic shielding characteristic and
Hot linked cell phone mainboard 2 is led with the mobile phone center 1,
The mobile phone center 1 opens up the work accommodated in airtight cavity 11, the airtight cavity 11 for realizing phase transformation
Medium 12 and medium phase change component 13, in first state, the heat absorption of working media 12 vaporization reaches the cavity inner wall,
During second state, the working media 12 of the arrival inwall liquefies to the cold to flow back via the medium phase change component 13
The cavity.
Present embodiments provide a kind of anti-shielding construction of cell phone mainboard 2, the structure include mobile phone center 1 and with mobile phone
Frame 1 leads hot linked cell phone mainboard 2.Mobile phone center 1, which is offered, to be accommodated in airtight cavity 11, airtight cavity 11 for realizing phase
The working media 12 and medium phase change component 13 of change.When the temperature of cell phone mainboard 2 is higher, by heat transfer transfer heat to
Lead hot linked mobile phone center 1.Working media 12 in the airtight cavity 11 of mobile phone center 1 absorbs heat vaporization and reaches cavity
Inwall, and heat release is liquefied when to the cold, then via the backflow cavity of medium phase change component 13.The process causes the anti-of the cell phone mainboard 2
Shielding construction not only has anti-shielding action, and the coefficient of heat conduction is high, and thermal resistance is small, and heat output is big, efficiency high.Can be rapidly by heat
From interior of mobile phone export, make to run under mainboard chip thermophilic, effectively avoid heat waste, extend the service life of mainboard.
Further, the reference picture 3 on the basis of Fig. 1 and Fig. 2, Fig. 3 is the two of the anti-shielding construction of cell phone mainboard 2 of the present invention
The structural representation of embodiment.
The mobile phone center 1 includes the first bottom plate 14 and the first cover plate 15 for enclosing the cavity；First bottom plate
14 are connected with the heat conduction of cell phone mainboard 2；
Inwall of the medium phase change component 13 along first bottom plate 14 towards the direction of the first cover plate 15 is set,
During first state, the heat absorption of working media 12 vaporization reaches the inwall of first cover plate 15, in second state, arrives
The working media 12 up to first cover plate 15 liquefies return to the first bottom plate 14 via the medium phase change component 13 to the cold
Inwall.
It is above-mentioned, when the temperature of cell phone mainboard 2 is higher, is transferred heat to by heat transfer and lead hot linked first bottom therewith
Plate 14.The heat transfer of absorption to working media 12, the heat absorption vaporization of working media 12 are reached the first cover plate 15 by the first bottom plate 14
Inwall then liquefy to the cold.The inwall of the first bottom plate 14 is returned to via medium phase change component 13 again.The first bottom plate being provided separately
14 and first cover plate 15 generate and be easy to assemble and change, the effect that the form of assembling is relatively flexible.First bottom plate 14 and
One cover plate 15 can suit measures to local conditions to select identical or different material to be made.
The mobile phone center 1 covers the cell phone mainboard 2.
First bottom plate 14 covers platelet 3 and battery of mobile phone 4 under the cell phone mainboard 2, mobile phone.
The cavity is described provided with being in communication with the outside for injecting the opening 111 vacuumized again after the working media 12
Opening 111 keeps normally closed after evacuation.
Air pressure is less than external atmosphere pressure in the cavity.
Above-mentioned, cavity, which is provided with, to be in communication with the outside for injecting the opening 111 vacuumized again after working media 12, opening 111
Keep after evacuation normally closed.By will be vacuumized in cavity so that the atmospheric pressure of cavity is less than external atmosphere pressure.Have
Benefit be：The boiling point of liquid is directly proportional to the air pressure of local environment, when evacuated in cavity after, ring residing for working media 12
The air pressure in border is relatively low, at a lower temperature boiling vaporization.Similarly, in the also quickly liquefaction backflow easily after heat release of working media 12
To inside cavity.The heat conduction and heat radiation efficiency of mobile phone center 1 is greatly improved, mobile phone center 1 can be rapidly by the heat of aggregation by hand
Exported at the elements such as the mainboard inside machine, chip is run under reasonable temperature, it is ensured that service life, and make mobile phone entire surface fast
The temperature difference in fast samming, reduced plan.
The medium phase change component 13 include along first bottom plate 14 inwall towards first cover plate 15 inwall
The tin silk extended vertically.
The cross section of the medium phase change component 13 is in mesh arrangement.
Medium phase change component 13 includes the tin extended vertically along the inwall of inwall towards the first cover plate 15 of the first bottom plate 14
Silk.When the first bottom plate 14 is heated, the heat absorption vaporization of working media 12 reaches the first cover plate 15, and heat is released to the cold and condenses into liquid
Working media 12.The capillary structure that is formed of the working media 12 along tin silk after condensation, is back to the first bottom plate 14.So
Circulation, completes the transfer of heat.
The cross section of medium phase change component 13 is in mesh arrangement.Have the benefit that：Using standard metal punching press, Welder
Skill forms plane heat pipe in mobile phone center 1 so that the thermal conductivity factor of mobile phone center 1 is improved.Tiny tin on first bottom plate 14
Silk formation capillary structure, so that the formation capillary knot that liquefied working media 12 is formed by tiny tin silk after to the cold
Structure, quickly refunds the first bottom plate 14, completes the process of circulation cooling.
The medium phase change device is included along the axially arranged sintered type liquid-sucking core of the cavity, silk screen screen liquid-sucking core, groove
Any one or a few combination in road formula liquid-sucking core, tow liquid-sucking core.
The medium phase change device includes at least one layer of wire screen liquid-sucking core.
The sintered type liquid-sucking core is metal powder sintered sintered type liquid-sucking core.
Medium phase change device is included along the axially arranged sintered type liquid-sucking core of cavity, silk screen screen liquid-sucking core, groove-type imbibition
Any one or a few combination in core, tow liquid-sucking core.Have the benefit that：The heat-transfer capability of sintered type liquid-sucking core is main
Depending on capillary limitation, can preferably it be conducted heat by the particle diameter and sintering thickness that adjust when the particle of sintered type liquid-sucking core
Performance.
The working media 12 is the liquid that boiling point is not more than 100 DEG C.
The working media 12 is any one in distilled water, acetone, methanol, ammoniacal liquor.
The Heat Conduction Material includes any one in copper, stainless steel, aluminium.
Working media 12 is the liquid that boiling point is not more than 100 DEG C.For example：It is any in distilled water, acetone, methanol, ammoniacal liquor
It is a kind of.Have the benefit that：The boiling point of working media 12 is relatively low so that working media 12 seethes with excitement vaporization at a lower temperature.Together
Reason, in working media 12, also easily quickly liquefaction is back to inside cavity after heat release.Greatly improve the heat conduction of mobile phone center 1
Radiating efficiency, mobile phone center 1 rapidly can be exported the heat of aggregation by elements such as the mainboards of interior of mobile phone, make chip reasonable
At a temperature of run, it is ensured that service life, and make the temperature difference in the rapid samming of mobile phone entire surface, reduced plan.
Further, based on an embodiment, reference picture 4, Fig. 4 is three realities of the anti-shielding construction of cell phone mainboard 2 of the present invention
Apply the structural representation of example.
The mobile phone center 1 is provided with heat-conducting piece towards the side of the cell phone mainboard 2；The heat-conducting piece and the mobile phone master
Chip on plate 2, which is abutted, carries out heat exchange.
The current method radiated using center is included in the surface mount heat-conducting piece of center, heat-conducting piece and mobile phone master
The grade of plate 2 heat generating components is contacted, and the heat of mainboard is absorbed using highly heat-conductive material, and conducts heat to low temperature by center metal
Region.Highly heat-conductive material used mainly has：Copper foil, graphite film, hot phase-change material etc..
Further, based on an embodiment, reference picture 5, Fig. 5 is four realities of the anti-shielding construction of cell phone mainboard 2 of the present invention
Apply the structural representation of example.
The heat-conducting piece offers the thermal conductive cavity of filling heat-conducting medium.
Heat-conducting piece offers the thermal conductive cavity of filling heat-conducting medium.Have the effect that：Mobile phone center 1 is towards cell phone mainboard 2
Side be provided with heat-conducting piece, heat-conducting piece contacted with the grade heat generating components of cell phone mainboard 2, and heat-conducting piece is passed through by contacting cell phone mainboard 2
Heat transfer realizes the process for the heat for absorbing mainboard.The heat of cell phone mainboard 2 is avoided to be difficult to export and be stranded in interior of mobile phone.Lead
Warmware is provided with the working media 12 and medium phase change component 13 accommodated in thermal conductive cavity, thermal conductive cavity for realizing phase transformation.Work as mobile phone
When the temperature of mainboard 2 is higher, the mobile phone center 1 for being connected the heat heat transfer of cell phone mainboard 2 to heat-conducting piece therewith by thermal conductive cavity
Airtight cavity 11 in.Into in the radiating cyclic process of mobile phone center 1.The setting of this kind of structure, can be with the chamber of mobile phone center 1
In the case that body constancy of volume even reduces, remain to keep preferable radiating efficiency.And it is convex to cell phone mainboard 2 by setting
Heat-conducting piece, can cause the thickness of mobile phone center 1 further becomes more frivolous, so as to reduce the thickness of mobile phone.
The heat-conducting piece is copper foil, the heat-conducting piece that graphite film is made.
Conducting resinl 5 is provided between the cell phone mainboard 2 and the mobile phone center 1.
The mobile phone center 1 is provided with structure perforate 16.
In addition, the present invention also provides a kind of mobile phone, including the screen set gradually, mobile phone center 1, and it is arranged at the hand
The platelet 3 under mainboard, battery and mobile phone on the mobile phone of the screen side of machine center 1.
In addition, the anti-shielding construction of cell phone mainboard 2 in the present invention is prepared as follows：
1st, required to determine center thickness and shape according to overall design.Manufacture center is determined according to center thickness and shape
Lower shoe, thickness and shape, the plating tin bar thickness of upper cover plate.Ensure upper cover plate, the thickness of wire netting and lower shoe and be less than
Frame thickness.
2nd, upper and lower cover plates shapes：Sheet metal is processed using metal cutting, upper cover plate is shaped.Such as Fig. 6 signals.
3rd, lower cover is tin plating：The certain thickness tin metal layer of plating on lower cover, such as Fig. 7 signals.
4th, photoresists are coated, one layer of photoresists are covered on tin coating, can not be by sour eating away after photoresists exposure.Such as
Shown in Fig. 8.
5. exposure mask makes and apply pressure mask.Mask piece is made according to center shape, it is necessary to retain the part correspondence of tin
Mask at for black it is light tight, it is not necessary to retain the part correspondence mask of tin to be transparent.As shown in Figure 9.
6. exposure：Using the light irradiation mask of certain wavelength, the part that photoresists are irradiated by light becomes can not be by sour
Erosion.As shown in Figure 10.
7th, film development is removed：Photosensitive mask is removed, with sour developing sensitive glue, photoresists are not irradiated by light part and will be acid washed
Fall, be irradiated by light part and be retained on tin film, as shown in figure 11.
8th, etch：With tin can be corroded, and the solution of tin can not be corroded, rinse structure upper surface shown in Figure 11, get rid of
The tin not covered by photoresists, as shown in figure 12.
9th, striping：Remove the light-sensitive surface on tin bar surface, the shaping of lower cover capillary structure.As shown in figure 13
10th, weld：After upper cover plate is alignd with lower cover, by upper and lower cover plates edge welded seal.
12nd, water filling is vacuumized：From the water filling vacuum orifice shown in Figure 13, vacuumized after injecting a certain amount of distilled water, so
Water filling vacuum orifice is welded closed afterwards.
So far, a kind of high heat conduction mobile terminal center manufacture proposed by the present invention is completed.
It is apparent to those skilled in the art that, for convenience and simplicity of description, the system of foregoing description,
The specific work process of device and unit, may be referred to the corresponding process in preceding method embodiment, will not be repeated here.
In several embodiments provided herein, it should be understood that disclosed system, apparatus and method can be with
Realize by another way.For example, device embodiment described above is only schematical, for example, the unit
Divide, only a kind of division of logic function there can be other dividing mode when actually realizing, such as multiple units or component
Another system can be combined or be desirably integrated into, or some features can be ignored, or do not perform.It is another, it is shown or
The coupling each other discussed or direct-coupling or communication connection can be the indirect couplings of device or unit by some interfaces
Close or communicate to connect, can be electrical, machinery or other forms.
The unit illustrated as separating component can be or may not be it is physically separate, it is aobvious as unit
The part shown can be or may not be physical location, you can with positioned at a place, or can also be distributed to multiple
On NE.Some or all of unit therein can be selected to realize the mesh of this embodiment scheme according to the actual needs
's.
In addition, each functional unit in each embodiment of the invention can be integrated in a processing unit, can also
That unit is individually physically present, can also two or more units it is integrated in a unit.Above-mentioned integrated list
Member can both be realized in the form of hardware, it would however also be possible to employ the form of SFU software functional unit is realized.
One of ordinary skill in the art will appreciate that all or part of step in the various methods of above-described embodiment is can
To instruct the hardware of correlation to complete by program, the program can be stored in a computer-readable recording medium, storage
Medium can include：Read-only storage (ROM, Read Only Memory), random access memory (RAM, Random
Access Memory), disk or CD etc..
Can be with one of ordinary skill in the art will appreciate that realizing that all or part of step in above-described embodiment method is
The hardware of correlation is instructed to complete by program, described program can be stored in a kind of computer-readable recording medium, on
It can be read-only storage, disk or CD etc. to state the storage medium mentioned.
A kind of anti-shielding construction of mobile phone and cell phone mainboard 2 provided by the present invention is described in detail above, it is right
In those of ordinary skill in the art, according to the thought of the embodiment of the present invention, can in specific embodiments and applications
There is change part, in summary, this specification content should not be construed as limiting the invention.
The embodiment of the present invention is further disclosed, A1, a kind of anti-shielding construction of cell phone mainboard, including with electromagnetic shielding characteristic
Mobile phone center 1 and lead hot linked cell phone mainboard 2 with the mobile phone center 1,
The mobile phone center 1 opens up the work accommodated in airtight cavity 11, the airtight cavity 11 for realizing phase transformation
Medium 12 and medium phase change component 13, in first state, the heat absorption of working media 12 vaporization reaches the cavity inner wall,
During second state, the working media 12 of the arrival inwall liquefies to the cold to flow back via the medium phase change component 13
The cavity.
A2, cell phone mainboard 2 as described in A1 anti-shielding construction, the mobile phone center 1 include enclosing the cavity
First bottom plate 14 and the first cover plate 15；First bottom plate 14 is connected with the heat conduction of cell phone mainboard 2；
Inwall of the medium phase change component 13 along first bottom plate 14 towards the direction of the first cover plate 15 is set,
During first state, the heat absorption of working media 12 vaporization reaches the inwall of first cover plate 15, in second state, arrives
The working media 12 up to first cover plate 15 liquefies return to the first bottom plate 14 via the medium phase change component 13 to the cold
Inwall.
A3, cell phone mainboard 2 as described in A1 anti-shielding construction, the mobile phone center 1 cover the cell phone mainboard 2.
A4, cell phone mainboard 2 as described in A2 anti-shielding construction, first bottom plate 14 cover the cell phone mainboard 2, hand
Platelet 3 and battery of mobile phone 4 under machine.
A5, cell phone mainboard 2 as described in A1 anti-shielding construction, the cavity are described for injecting provided with being in communication with the outside
The opening 111 vacuumized again after working media 12, the opening 111 keeps normally closed after evacuation.
Air pressure is less than external atmosphere pressure in A6, cell phone mainboard 2 as described in A1 anti-shielding construction, the cavity.
A7, cell phone mainboard 2 as described in A2 anti-shielding construction, the medium phase change component 13 are included along first bottom
The tin silk that the inwall of the inwall of plate 14 towards first cover plate 15 extends vertically.
A8, cell phone mainboard 2 as described in A7 anti-shielding construction, the cross section of the medium phase change component 13 is in mesh cloth
Put.
A9, cell phone mainboard 2 as described in A1 anti-shielding construction, the medium phase change device are included along cavity axial direction
Any one or a few group in the sintered type liquid-sucking core of setting, silk screen screen liquid-sucking core, groove-type liquid-sucking core, tow liquid-sucking core
Close.
A10, cell phone mainboard 2 as described in A9 anti-shielding construction, the medium phase change device include at least one layer of metal
Silk screen screen liquid-sucking core.
A11, cell phone mainboard 2 as described in A9 anti-shielding construction, the sintered type liquid-sucking core is metal powder sintered
Into sintered type liquid-sucking core.
A12, cell phone mainboard 2 as described in A1 anti-shielding construction, the working media 12 are that boiling point is not more than 100 DEG C
Liquid.
A13, cell phone mainboard 2 as described in A12 anti-shielding construction, the working media 12 are distilled water, acetone, first
Any one in alcohol, ammoniacal liquor.
A14, cell phone mainboard 2 as described in A1 anti-shielding construction, the Heat Conduction Material are included in copper, stainless steel, aluminium
Any one.
A15, cell phone mainboard 2 as described in A1 anti-shielding construction, the mobile phone center 1 is towards the cell phone mainboard 2
Side is provided with heat-conducting piece；The heat-conducting piece abuts progress heat exchange with the chip on the cell phone mainboard 2.
A16, cell phone mainboard 2 as described in A15 anti-shielding construction, the heat-conducting piece offer leading for filling heat-conducting medium
Hot chamber.
A17, cell phone mainboard 2 as described in A16 anti-shielding construction, the heat-conducting piece are copper foil, what graphite film was made
Heat-conducting piece.
A18, cell phone mainboard 2 as described in A1 anti-shielding construction, between the cell phone mainboard 2 and the mobile phone center 1
Provided with conducting resinl 5.
A19, cell phone mainboard 2 as described in A1 anti-shielding construction, the mobile phone center 1 are provided with structure perforate 16.
A20, mobile phone, including the screen set gradually, mobile phone center 1, and the mobile phone center 1 is arranged at away from the screen
Platelet 3 under mainboard, battery and mobile phone on the mobile phone of side.
Claims (10)
1. a kind of anti-shielding construction of cell phone mainboard, it is characterised in that including the mobile phone center with electromagnetic shielding characteristic and with
The mobile phone center leads hot linked cell phone mainboard,
The mobile phone center opens up working media and the medium phase transformation accommodated in airtight cavity, the cavity for realizing phase transformation
Component, in first state, the working media heat absorption vaporization reaches the cavity inner wall, in the second state, reaches described
The working media of inwall liquefies via the medium phase change component backflow cavity to the cold.
2. the anti-shielding construction of cell phone mainboard as claimed in claim 1, it is characterised in that
The mobile phone center includes the first bottom plate and the first cover plate for enclosing the cavity；First bottom plate and the mobile phone
Mainboard heat conduction is connected；
Inwall of the medium phase change component along first bottom plate towards the first cover plate direction is set, in first shape
During state, the working media heat absorption vaporization reaches the inwall of first cover plate, in second state, reaches described first
The working media of cover plate liquefies to the cold returns to the inwall of first bottom plate via the medium phase change component.
3. the anti-shielding construction of cell phone mainboard as claimed in claim 1, it is characterised in that the mobile phone center covers the hand
Mainboard.
4. the anti-shielding construction of cell phone mainboard as claimed in claim 1, it is characterised in that the cavity is provided with and is in communication with the outside
For injecting the opening vacuumized again after the working media, the opening keeps normally closed after evacuation.
5. the anti-shielding construction of cell phone mainboard as claimed in claim 2, it is characterised in that the medium phase change component includes edge
The tin silk that the inwall of the inwall of first bottom plate towards first cover plate extends vertically.
6. the anti-shielding construction of cell phone mainboard as claimed in claim 5, it is characterised in that the medium phase change component it is crosscutting
Face is in mesh arrangement.
7. the anti-shielding construction of cell phone mainboard as claimed in claim 1, it is characterised in that the mobile phone center is towards the hand
The side of mainboard is provided with heat-conducting piece；The heat-conducting piece abuts progress heat exchange with the chip on the cell phone mainboard.
8. the anti-shielding construction of cell phone mainboard as claimed in claim 7, it is characterised in that the heat-conducting piece offers filling and led
The thermal conductive cavity of thermal medium.
9. the anti-shielding construction of cell phone mainboard as claimed in claim 8, it is characterised in that the heat-conducting piece is copper foil or graphite
The heat-conducting piece that film is made.
10. a kind of mobile phone, it is characterised in that including the screen set gradually, mobile phone center, and it is arranged at the mobile phone center back of the body
From platelet under mainboard, battery and mobile phone on the mobile phone of the screen side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710346619.1A CN106993396A (en) | 2017-05-16 | 2017-05-16 | A kind of anti-shielding construction of mobile phone and cell phone mainboard |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710346619.1A CN106993396A (en) | 2017-05-16 | 2017-05-16 | A kind of anti-shielding construction of mobile phone and cell phone mainboard |
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| Publication Number | Publication Date |
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| CN106993396A true CN106993396A (en) | 2017-07-28 |
Family
ID=59419295
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710346619.1A Pending CN106993396A (en) | 2017-05-16 | 2017-05-16 | A kind of anti-shielding construction of mobile phone and cell phone mainboard |
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| CN112954985A (en) * | 2021-03-31 | 2021-06-11 | 上海天马微电子有限公司 | Heat dissipation mechanism and display device |
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