CN106988104A - Thermoelectric heat pump dehumidifying drying system and clothes-drying method - Google Patents

Abstract

A kind of thermoelectric heat pump dehumidifying drying system and clothes-drying method, belong to dry field.To solve big current dehumidifying products noise, high energy consumption, not be suitable for a series of problems, such as poor fabric of heat resistance is dried.System includes casing, semiconductor heat pump module, voltage controller, circulating fan and gas-liquid separation device.Wherein semiconductor heat pump module is made up of semiconductor refrigerating chip arrays, cool and heat ends heat exchange structure.Present invention maintenance easy to maintain simple in construction compared with similar products, without damp-heat air discharge, energy consumption is low, controllable drying temperature.

Description

Semiconductor heat pump dehumidification drying system and drying method

technical field

The invention belongs to the field of drying, and in particular relates to a semiconductor heat pump dehumidification drying system and a drying method. Specifically applied to the laundry drying process on the washing machine.

Background technique

At present, the washing machines with drying function on the market can be roughly divided into exhaust type, condensation type, and heat pump type.

Exhaust type: The principle is to use electric heating air and blow it into the drum, and use high temperature air to heat the moisture in the clothes, so that it evaporates into water vapor and is discharged with the air. This kind of system has high energy consumption, low efficiency, high noise, and high drying temperature, which will cause great damage to clothes, and is not suitable for some clothes with temperature-sensitive fabrics. An exhaust pipe is needed to discharge the humid air, which has high requirements for the use environment.

Condensing type: firstly, the air passes through the heater and is heated into hot air; then the hot air passes through the clothes to become humid air; the humid air passes through the condensation system to precipitate moisture and become dry and cold air, and the precipitated condensed water is stored in the water storage box; The dry and cold air passes through the heater again and turns into hot air to pass through the clothes, and this cycle continuously drains the moisture from the clothes. These systems do not exhaust air to the outside environment and therefore do not require an exhaust duct. Condensation drying temperature is lower than that of exhaust drying, which causes less damage to clothes.

Heat pump type: It is also a kind of condensation type from the basic principle. The difference is that the heat pump system can skillfully recover the heat released by the water vapor during the condensation process, so no additional heating device is needed, and the temperature is usually around 60 degrees Celsius. , will not damage clothes due to high temperature, so it is more energy-saving. So to put it simply, the heat pump type has higher energy efficiency and lower power consumption than the other two types, and can save energy by up to 50%-70% compared to the condensing type.

At present, heat pump drying systems mainly use traditional vapor compression heat pumps. Due to their own limitations, such heat pumps are large in size, heavy in weight, loud in noise and have the risk of refrigerant leakage. Therefore, there is a need to adopt a new type of heat pump system to solve the above problems.

Contents of the invention

The object of the present invention is to provide a semi-conductor heat pump dehumidification and drying system and drying method with small volume, light weight, low noise, low cost and environment friendliness.

A semiconductor heat pump dehumidification and drying system, characterized in that: it includes a box-type shell, a drum, a semiconductor cooling chip array, a first circulating fan, a second circulating fan, and a gas-liquid separation device; the semiconductor cooling chip array includes Two rows of semiconductor cooling fins, the two rows of cooling fins are connected by a set of cold end fins to form a vertical cooling channel, the outer sides of the two rows of semiconductor cooling fins are the left cooling channel and the right cooling channel respectively; the left cooling channel and the right cooling channel The inside of the right heat dissipation channel forms a serpentine channel structure through the hot end fins; the upper part of the above-mentioned drum is connected to the inlet of the first circulation fan; the outlet of the first circulation fan is connected to the inlet of the cooling channel of the semiconductor refrigeration chip array, and the outlet of the cooling channel is connected to the vapor-liquid separation device The inlet is connected, the liquid outlet of the vapor-liquid separation device is connected to the external environment, the gas outlet of the vapor-liquid separation device is connected to the inlet of the right cooling channel, the outlet of the right cooling channel is connected to the inlet of the left cooling channel, and the outlet of the left cooling channel is connected to the second circulation fan The inlet is connected; the outlet of the second circulation fan is connected with the lower part of the drum; the system also includes a temperature sensor arranged on the drum, and a voltage controller connected with the semiconductor refrigerating sheet.

The clothes drying method of the semiconductor heat pump includes the following process: power on and enter the drying program, set the drying temperature, the first circulating fan starts to work, and the humid air is passed from the upper part of the drum into the refrigeration channel of the semiconductor refrigeration chip array, and at the same time The semiconductor refrigeration chip starts to work, the temperature of the cold end decreases, and the wet air condenses on the fins of the cold end when it meets cold in the cooling channel. The condensed water flows into the gas-liquid separation device under the action of gravity, and then is discharged into the external environment; the separated cold air is then It enters the right cooling channel and the left cooling channel of the semiconductor cooling chip array in turn, and becomes hot air with low relative humidity and enters the lower part of the drum through the second circulating fan; the voltage controller obtains the actual drying temperature through the temperature sensor located at the lower part of the drum. Compared with the set temperature, the power of the heat pump is adjusted by adjusting the working voltage of the semiconductor refrigeration chip array to achieve the purpose of controlling the actual drying temperature. The hot air contacts with the wet clothes in the drum and becomes humid air again, and the cycle continues until the drying is completed. dry program.

The invention provides a novel clothes drying system and method based on a semiconductor heat pump, which has obvious advantages in energy saving compared with the traditional electric heating drying system; There are many disadvantages such as heavy weight, loud noise, and not being environmentally friendly; and the drying temperature can be set, which has little damage to the clothes and can be used for drying some temperature-sensitive fabrics. It can be widely used in the field of clothes drying represented by household clothes drying.

Description of drawings

Fig. 1 is the novel semiconductor heat pump clothes drying system diagram that the present invention proposes;

Fig. 2 is a top view of the semiconductor refrigeration chip array proposed by the present invention;

Fig. 3 is the left side view of the semiconductor refrigeration chip array proposed by the present invention;

Label names in the figure: 1 box body, 2 drum, 3 first circulation fan, 4 semiconductor cooling chip array, 5 gas-liquid separation device, 6 voltage controller, 7 second circulating fan, 8 semiconductor cooling chip, 9 cold end fin 10 cooling channels, 11 right cooling channels, 12 left cooling channels, 13 hot end fins, 14 temperature sensors.

detailed description

The operating process of the system will be described in detail below in conjunction with FIG. 1 .

Turn on the power to enter the drying program, set the drying temperature, and the two circulating fans start to work, passing the humid air from the upper part of the drum into the cooling channel of the semiconductor cooling chip array, wherein the semiconductor cooling chip array is arranged in two rows, with the cold side facing inward Place, hot side out. At the same time, the semiconductor refrigeration chip starts to work, the temperature of the cold end decreases, and the wet air condenses on the fins of the cold end when it is cooled in the cooling channel. The fins at the cold end are coated with a hydrophobic coating, and the condensed water flows into the gas-liquid separation under the action of gravity. device and then discharged into the external environment. The separated cold air then enters the right cooling channel and the left cooling channel of the semiconductor refrigeration chip array in turn, becomes hot air with low relative humidity and enters the lower part of the drum through the second circulating fan, and the voltage controller obtains it through the temperature sensor located at the lower part of the drum. Compared with the set temperature, the actual drying temperature is adjusted by adjusting the operating voltage of the semiconductor array to adjust the power of the heat pump to achieve the purpose of controlling the actual drying temperature. The hot air contacts with the wet clothes in the drum and becomes moist air again. Cycle continuously until the drying program is complete.

Claims (2)

1. A semiconductor heat pump dehumidification drying system, characterized in that: Including a box-type housing (1), a drum (2), a semiconductor refrigeration chip array (4), a first circulation fan (3), a second circulation fan (7), and a gas-liquid separation device (5); The semiconductor cooling chip array (4) includes two rows of semiconductor cooling chips (8), and the two rows of cooling fins are connected by a set of cold end fins (9) to form a vertical cooling channel (10). The outer sides of the sheet (8) are respectively the left cooling channel (12) and the right cooling channel (11); the inside of the left cooling channel (12) and the right cooling channel (11) form a serpentine channel structure through the hot end fins (13); The upper part of the drum (2) is connected to the inlet of the first circulation fan (3); the outlet of the first circulation fan (3) is connected to the inlet of the cooling channel (10) of the semiconductor refrigeration chip array (4), and the outlet of the cooling channel (10) is connected to the steam The inlet of the liquid-liquid separation device (5) is connected, the liquid outlet of the vapor-liquid separation device (5) is connected to the external environment, the gas outlet of the vapor-liquid separation device (5) is connected to the inlet of the right cooling channel (11), and the right cooling channel (11) The outlet is connected to the inlet of the left cooling channel (12), and the outlet of the left cooling channel (12) is connected to the inlet of the second circulation fan (7); the outlet of the second circulation fan (7) is connected to the lower part of the drum (2); The system also includes a temperature sensor (14) arranged on the drum (2), and a voltage controller (6) connected to the semiconductor cooling chip (8). 2. The drying method of the semiconductor heat pump dehumidification drying system according to claim 1, characterized in that it comprises the following process: Turn on the power to enter the drying program, set the drying temperature, and the first circulation fan (3) starts to work, passing the humid air from the upper part of the drum (2) into the cooling channel (10) of the semiconductor cooling chip array (4), at the same time The semiconductor refrigerating plate (8) starts to work, the temperature of the cold end decreases, and the wet air condenses on the fins (9) at the cold end when it meets cold in the cooling channel (10), and the condensed water flows into the gas-liquid separation device (5) under the action of gravity , and then discharged into the external environment; The separated cold air then enters the right heat dissipation channel (11) and the left heat dissipation channel (12) of the semiconductor refrigeration chip array (4) in turn, and becomes hot air with low relative humidity and enters the drum through the second circulation fan (7) ( 2) the lower part; The voltage controller (6) obtains the actual drying temperature through the temperature sensor located at the lower part of the drum (2). Compared with the set temperature, the power of the heat pump is adjusted by adjusting the working voltage of the semiconductor refrigeration chip array (4) to control the actual drying temperature. For the purpose of temperature, the hot air is in contact with the wet clothes in the drum (2) and becomes moist air, which is continuously circulated until the drying process is completed.