CN106987863A - The preparation technology of the bimodal nano-crystal nickel cobalt alloy of single pulse electrodpositing light two-phase - Google Patents
The preparation technology of the bimodal nano-crystal nickel cobalt alloy of single pulse electrodpositing light two-phase Download PDFInfo
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- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 229910000531 Co alloy Inorganic materials 0.000 title claims abstract description 40
- 238000002360 preparation method Methods 0.000 title claims abstract description 27
- 230000002902 bimodal effect Effects 0.000 title claims abstract description 22
- 238000005516 engineering process Methods 0.000 title claims description 17
- 239000002159 nanocrystal Substances 0.000 title claims 11
- 238000007747 plating Methods 0.000 claims abstract description 118
- 238000009713 electroplating Methods 0.000 claims abstract description 57
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 32
- 238000000576 coating method Methods 0.000 claims abstract description 31
- 239000011248 coating agent Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000003756 stirring Methods 0.000 claims abstract description 11
- 238000004070 electrodeposition Methods 0.000 claims abstract description 10
- 239000010935 stainless steel Substances 0.000 claims abstract description 10
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 10
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims abstract description 8
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 claims abstract description 8
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims abstract description 8
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims abstract description 8
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims abstract description 8
- 150000003839 salts Chemical class 0.000 claims abstract description 8
- 239000000243 solution Substances 0.000 claims description 90
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 29
- 239000008367 deionised water Substances 0.000 claims description 26
- 229910021641 deionized water Inorganic materials 0.000 claims description 26
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 22
- 239000012535 impurity Substances 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 239000000654 additive Substances 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 14
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 12
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 claims description 12
- 229940081974 saccharin Drugs 0.000 claims description 12
- 235000019204 saccharin Nutrition 0.000 claims description 12
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 claims description 12
- 239000003513 alkali Substances 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 10
- 239000004327 boric acid Substances 0.000 claims description 10
- 238000005868 electrolysis reaction Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 239000002585 base Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 3
- 230000000996 additive effect Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 3
- 239000000080 wetting agent Substances 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 230000009471 action Effects 0.000 claims description 2
- 238000001994 activation Methods 0.000 claims description 2
- 239000003945 anionic surfactant Substances 0.000 claims description 2
- 239000010425 asbestos Substances 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 229910052895 riebeckite Inorganic materials 0.000 claims description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 2
- 235000011152 sodium sulphate Nutrition 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 239000003115 supporting electrolyte Substances 0.000 claims description 2
- 238000003828 vacuum filtration Methods 0.000 claims description 2
- 238000003556 assay Methods 0.000 claims 4
- RCEAADKTGXTDOA-UHFFFAOYSA-N OS(O)(=O)=O.CCCCCCCCCCCC[Na] Chemical compound OS(O)(=O)=O.CCCCCCCCCCCC[Na] RCEAADKTGXTDOA-UHFFFAOYSA-N 0.000 claims 3
- 238000002474 experimental method Methods 0.000 claims 3
- 239000007788 liquid Substances 0.000 claims 3
- 238000010521 absorption reaction Methods 0.000 claims 2
- 239000003610 charcoal Substances 0.000 claims 2
- 239000011159 matrix material Substances 0.000 claims 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- 238000005282 brightening Methods 0.000 claims 1
- 238000010790 dilution Methods 0.000 claims 1
- 239000012895 dilution Substances 0.000 claims 1
- MOTZDAYCYVMXPC-UHFFFAOYSA-N dodecyl hydrogen sulfate Chemical compound CCCCCCCCCCCCOS(O)(=O)=O MOTZDAYCYVMXPC-UHFFFAOYSA-N 0.000 claims 1
- 229940043264 dodecyl sulfate Drugs 0.000 claims 1
- 239000003906 humectant Substances 0.000 claims 1
- 238000002156 mixing Methods 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
- 238000013268 sustained release Methods 0.000 claims 1
- 239000012730 sustained-release form Substances 0.000 claims 1
- 238000002604 ultrasonography Methods 0.000 claims 1
- 239000003643 water by type Substances 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 abstract description 9
- 229910000361 cobalt sulfate Inorganic materials 0.000 abstract description 6
- 229940044175 cobalt sulfate Drugs 0.000 abstract description 6
- 238000005260 corrosion Methods 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 5
- 238000004381 surface treatment Methods 0.000 abstract description 5
- 238000005202 decontamination Methods 0.000 abstract description 3
- 230000003588 decontaminative effect Effects 0.000 abstract description 3
- 238000002425 crystallisation Methods 0.000 abstract 1
- 230000008025 crystallization Effects 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 15
- 239000000758 substrate Substances 0.000 description 13
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 8
- DLDJFQGPPSQZKI-UHFFFAOYSA-N but-2-yne-1,4-diol Chemical compound OCC#CCO DLDJFQGPPSQZKI-UHFFFAOYSA-N 0.000 description 8
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 8
- 238000005406 washing Methods 0.000 description 8
- 239000010941 cobalt Substances 0.000 description 7
- 229910017052 cobalt Inorganic materials 0.000 description 7
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 7
- 238000000151 deposition Methods 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 5
- 238000005554 pickling Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000003917 TEM image Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000000967 suction filtration Methods 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910001361 White metal Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002051 biphasic effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- RYZCLUQMCYZBJQ-UHFFFAOYSA-H lead(2+);dicarbonate;dihydroxide Chemical compound [OH-].[OH-].[Pb+2].[Pb+2].[Pb+2].[O-]C([O-])=O.[O-]C([O-])=O RYZCLUQMCYZBJQ-UHFFFAOYSA-H 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000003760 magnetic stirring Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000742 single-metal deposition Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000009210 therapy by ultrasound Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000010969 white metal Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
- C25C1/24—Alloys obtained by cathodic reduction of all their ions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C7/00—Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
- C25C7/02—Electrodes; Connections thereof
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
本发明涉及单脉冲电沉积光亮双相双峰纳米晶镍钴合金的制备工艺。具体步骤是:电镀前先将电镀液经活性炭吸附除杂和电解除杂,然后在霍尔槽装置中进行预镀试验确定光亮双相双峰镍钴合金镀层的条件。在PH值稳定在2~5之间,浓度为硫酸镍50~70g/L、氯化镍40~60g/L、硫酸钴40~50g/L为主盐的镀液中进行电镀,以可溶性镍板经表面处理后作为阳极,不锈钢经表面处理后作为阴极,采用单脉冲电沉积光亮双相双峰纳米晶镍钴合金的镀层,其中电沉积时间为2h~4h,脉冲电流密度为2.5~3A/dm2,占空比为20%~40%,周期为1~2ms,搅拌速度为100~500r/min。该方法制得的镍钴合金镀层表面光亮,结构致密,结晶细致,平整性好,无裂纹,且具有很好的耐腐蚀性能和较高的强度和塑性。
The invention relates to a preparation process of single-pulse electrodeposited bright double-phase double-peak nanocrystalline nickel-cobalt alloy. The specific steps are as follows: prior to electroplating, the electroplating solution is subjected to activated carbon adsorption and electrolytic decontamination, and then a pre-plating test is carried out in a Hall cell device to determine the conditions of the bright dual-phase bimodal nickel-cobalt alloy coating. Electroplating is carried out in a plating solution with a pH value between 2 and 5, a concentration of nickel sulfate 50-70g/L, nickel chloride 40-60g/L, and cobalt sulfate 40-50g/L as the main salt. The plate is used as the anode after surface treatment, and the stainless steel is used as the cathode after surface treatment. The coating of bright dual-phase bimodal nanocrystalline nickel-cobalt alloy is deposited by single pulse electrodeposition. The electrodeposition time is 2h~4h, and the pulse current density is 2.5~3A. /dm 2 , the duty ratio is 20%-40%, the period is 1-2ms, and the stirring speed is 100-500r/min. The nickel-cobalt alloy coating prepared by the method has bright surface, compact structure, fine crystallization, good flatness, no cracks, good corrosion resistance, high strength and plasticity.
Description
技术领域technical field
本发明涉及单脉冲电沉积光亮双相双峰纳米晶镍钴合金的制备工艺,属于电镀合金领域。The invention relates to a preparation process of a single-pulse electrodeposited bright dual-phase bimodal nano-crystalline nickel-cobalt alloy, belonging to the field of electroplating alloys.
技术背景technical background
镍是一种银白色金属,密度8.9,熔点1455℃,沸点2915℃。镍具有良好的机械强度、延展性和耐腐蚀性,被广泛用于军工制造业、民用工业、机械制造业、石油行业等;镍钴合金是一种永磁材料,广泛用于电子遥控、原子能工业和超声工艺等领域。Nickel is a silver-white metal with a density of 8.9, a melting point of 1455°C and a boiling point of 2915°C. Nickel has good mechanical strength, ductility and corrosion resistance, and is widely used in military manufacturing, civil industry, machinery manufacturing, petroleum industry, etc.; nickel-cobalt alloy is a permanent magnetic material, widely used in electronic remote control, atomic energy, etc. Industrial and ultrasonic technology and other fields.
电化学沉积法俗称电镀,是一种在含有金属镀层化合物的镀液中,以被镀的导电零件为阴极,通过电解作用,在零件表面以期获得结合力牢固的、镀层均匀的、表面细致的金属膜的电化学加工方法,同时也是目前应用相当广泛的表面处理技术之一。根据其电源提供电压电流的方式不同可分为普通直流电镀、交直流叠加电镀、脉冲电镀等种类,其中脉冲电镀又分为单脉冲电镀和双脉冲电镀。根据电镀金属元素的种类又分为单金属电镀和合金电镀。The electrochemical deposition method, commonly known as electroplating, is a method in which the conductive part to be plated is used as the cathode in a plating solution containing a metal plating compound, and through electrolysis, it is expected to obtain a firm bond, a uniform coating, and a fine surface on the surface of the part. The electrochemical processing method of metal film is also one of the most widely used surface treatment technologies at present. According to the way the power supply provides voltage and current, it can be divided into ordinary DC electroplating, AC-DC superimposed electroplating, pulse electroplating, etc., and pulse electroplating is further divided into single pulse electroplating and double pulse electroplating. According to the type of electroplating metal elements, it is divided into single metal electroplating and alloy electroplating.
随着科学技术和现代工业的发展对功能材料和结构材料的性能提出了各种各样的新要求,对防护性镀层的质量要求也越来越高,传统的电镀单一金属镍镀层由于:(1)镀层结合强度差(2)镀层分散能力差(3)镀层光亮度差(4)电流效率低、沉积速率慢等因(5)耐酸、耐碱、耐磨性不够高等因素已不能完全满足某些特殊要求。因而,以一种金属镍为基体,通过电沉积方法使金属镍与金属钴共沉积获得的,以其具有较高的硬度、耐温、耐酸、耐碱、耐磨性、自润滑性、耐蚀性、特殊的装饰外观以及电接触功能、电催化等功能的镍钴合金镀层倍受人们关注。With the development of science and technology and modern industry, various new requirements are put forward for the performance of functional materials and structural materials, and the quality requirements for protective coatings are also getting higher and higher. The traditional electroplating single metal nickel coating is due to:( 1) The bonding strength of the coating is poor (2) The dispersion ability of the coating is poor (3) The brightness of the coating is poor (4) The current efficiency is low, the deposition rate is slow, etc. (5) The factors such as acid resistance, alkali resistance, and wear resistance are not high enough. Certain special requirements. Therefore, using a metal nickel as the substrate, the co-deposition of metal nickel and metal cobalt is obtained by electrodeposition method, and it has high hardness, temperature resistance, acid resistance, alkali resistance, wear resistance, self-lubricating property, and corrosion resistance. Nickel-cobalt alloy coatings with corrosion resistance, special decorative appearance, electrical contact function, electrocatalysis and other functions have attracted much attention.
合金电镀除必须具备单金属沉积的一些基本条件外,还应该具备以下两个要素:In addition to some basic conditions for single metal deposition, alloy electroplating should also have the following two elements:
(1)合金电镀的两种金属中,必须至少要有一种金属能从其盐的水溶液中沉积出来。特别要强调的是,有些特殊金属如钨、钼虽不能从其盐的水溶液中沉积出来,但它能与铁族元素进行共沉积,所以金属共沉积的必要条件,并不一定要求各组分都能单独从水中沉积。(1) Of the two metals to be electroplated by the alloy, at least one of the metals must be able to deposit from an aqueous solution of its salt. In particular, it should be emphasized that although some special metals such as tungsten and molybdenum cannot be deposited from the aqueous solution of their salts, they can co-deposit with iron group elements, so the necessary conditions for metal co-deposition do not necessarily require that the components can be deposited from water alone.
(2)两种金属共沉积必须满足它们的沉积电位要相近方可,如果两种金属电位相差很大的话,金属电位较正的会抢先沉积,甚至会排斥后面另一金属的沉积析出。(2) The co-deposition of two metals must meet their deposition potentials to be similar. If the potential difference between the two metals is large, the metal with a relatively positive potential will be deposited first, and will even repel the deposition of another metal later.
脉冲电镀镍钴合金与直流电镀镍钴合金相比,脉冲电镀镍钴合金具有以下几个方面的效能:Compared with DC electroplating nickel-cobalt alloy, pulse electroplating nickel-cobalt alloy has the following performances:
(1)能得到致密的、导电率高的沉积层;(1) A dense, high-conductivity deposition layer can be obtained;
(2)降低浓差极化,提高阴极电流密度;(2) Reduce concentration polarization and increase cathode current density;
(3)减小或消除氧脆,改善镀层的物理和机械性能;(3) Reduce or eliminate oxygen embrittlement and improve the physical and mechanical properties of the coating;
(4)减少添加剂用量,提高镀层的纯度;(4) Reduce the amount of additives and improve the purity of the coating;
(5)减少孔隙率,提高镀层的防护性能。(5) Reduce porosity and improve the protective performance of the coating.
(6)脉冲电键能显著改善镀层的性能,为电镀技术的发展开辟了新的途径。(6) The pulse electric bond can significantly improve the performance of the coating, which opens up a new way for the development of electroplating technology.
总之,单脉冲电镀光亮双相纳米晶镍钴合金镀层的耐温、耐酸、耐碱、耐磨、焊接、韧性、塑性、强度、防腐、导电率、抗变色、光洁度等性能指标大幅度提高。同时利用单脉冲电沉积镍钴合金能避免许多传统工艺的缺点。In short, the temperature resistance, acid resistance, alkali resistance, wear resistance, welding, toughness, plasticity, strength, anti-corrosion, electrical conductivity, anti-discoloration, smoothness and other performance indicators of single-pulse electroplating bright dual-phase nanocrystalline nickel-cobalt alloy coating have been greatly improved. At the same time, the use of single-pulse electrodeposition of nickel-cobalt alloy can avoid many shortcomings of traditional processes.
发明内容Contents of the invention
本发明所要解决的技术问题是针对现有技术的不足而提供一种单脉冲电沉积光亮双相双峰纳米晶镍钴合金的方法,该方法制得的镍钴合金镀层表面光亮,结构致密,平整性好,无裂纹,且具有很好的耐腐蚀性能和较高的强度和塑性。在钴含量为66.7%(质量分数)时呈现出含有面心立方和密排六方晶体结构的双相结构,同时晶粒还呈现特殊的双峰分布即晶粒呈现大小晶粒分布,即在同一个视野范围内可以观察到大晶粒和小晶粒(大晶粒的尺寸能达到100nm以上,小晶粒尺寸能达到几十纳米)。The technical problem to be solved by the present invention is to provide a method for single-pulse electrodeposition of bright dual-phase bimodal nanocrystalline nickel-cobalt alloy in view of the deficiencies in the prior art. The nickel-cobalt alloy coating obtained by this method has a bright surface and a compact structure. Good flatness, no cracks, good corrosion resistance, high strength and plasticity. When the cobalt content is 66.7% (mass fraction), it presents a dual-phase structure containing face-centered cubic and close-packed hexagonal crystal structures. At the same time, the grains also present a special bimodal distribution, that is, the grains present a large and small grain distribution, that is, at the same time Large grains and small grains can be observed within a field of view (the size of large grains can reach more than 100nm, and the size of small grains can reach tens of nanometers).
为解决上述技术问题,本发明采用的技术方案为:In order to solve the problems of the technologies described above, the technical solution adopted in the present invention is:
单脉冲电沉积光亮双相双峰纳米晶镍钴合金的制备工艺,其特征在于:包括以下工艺步骤:电镀之前先将电镀液经活性炭吸附除杂和电解除杂,然后再在霍尔槽装置中进行预镀试验确定光亮双相镍钴合金镀层的添加剂的添加范围,然后在以PH值稳定在2~5之间,浓度为硫酸镍50~70g/L、氯化镍40~60g/L、硫酸钴40~50g/L为主盐的镀液中进行电镀,以可溶性镍板经表面处理后作为阳极,经表面处理后不锈钢作为阴极,采用单脉冲电沉积工艺电镀光亮双相双峰纳米晶镍钴合金镀层,其中电沉积时间为2h~4h,脉冲电流密度为2.5~3A/dm2,占空比为20%~40%,周期为1~2ms,搅拌速度为100~500r/min。The preparation technology of single-pulse electrodeposited bright dual-phase bimodal nanocrystalline nickel-cobalt alloy is characterized in that: it comprises the following process steps: prior to electroplating, the electroplating solution is first subjected to active carbon adsorption and electrolytic removal of impurities, and then in the Hall cell device The pre-plating test is carried out to determine the additive range of the bright dual-phase nickel-cobalt alloy coating, and then the pH value is stabilized between 2 and 5, and the concentration is 50-70g/L of nickel sulfate and 40-60g/L of nickel chloride. , cobalt sulfate 40 ~ 50g/L electroplating in the main salt plating solution, the soluble nickel plate is used as the anode after surface treatment, and the stainless steel after surface treatment is used as the cathode, and the single pulse electrodeposition process is used to electroplate bright biphasic bimodal nanometer Crystalline nickel-cobalt alloy coating, wherein the electrodeposition time is 2h~4h, the pulse current density is 2.5~3A/dm 2 , the duty ratio is 20%~40%, the cycle is 1~2ms, and the stirring speed is 100~500r/min .
按照上述方案,所述的镀液中还包括20~30g/L的硫酸钠作为支持电解质,0.1~0.5g/L的糖精,0.01~0.05g/L的1,4-丁炔二醇,0.5g/L的十二烷基硫酸钠。According to the above scheme, the plating solution also includes 20-30 g/L of sodium sulfate as a supporting electrolyte, 0.1-0.5 g/L of saccharin, 0.01-0.05 g/L of 1,4-butynediol, 0.5 g/L sodium lauryl sulfate.
按上述方案,所述的镀液中各组分及其含量为:According to the above scheme, each component and its content in the described plating solution are:
所述电镀液配制步骤如下:The preparation steps of the electroplating solution are as follows:
(1)用分析天平称取定量的硫酸镍,加入到事先准备好的装有去离子水的烧杯中,加热溶解;(1) Take quantitative nickel sulfate with analytical balance, join in the beaker that deionized water is housed prepared in advance, heat to dissolve;
(2)再用分析天平分别称取定量的氯化镍和硫酸钴分别加入到步骤(1)中的溶液中,加热使其溶解。(2) Add quantitative nickel chloride and cobalt sulfate to the solution in step (1) respectively with an analytical balance, and heat to dissolve it.
所述的电镀液中用于调节PH的缓释酸为硼酸,其配制过程如下:The slow-release acid used to regulate pH in the described electroplating solution is boric acid, and its preparation process is as follows:
(1)将洗净的烧杯加入定量的去离子水;(1) Add quantitative deionized water to the cleaned beaker;
(2)将步骤(1)中的去离子水放到垫有石棉网的加热炉上煮沸,然后将称好的定量的硼酸加入煮沸的去离子水中使硼酸完全溶解;(2) the deionized water in step (1) is put on the heating furnace that is cushioned with asbestos net and boiled, then the quantitative boric acid that weighs is added into the deionized water that boils and boric acid is dissolved completely;
(3)将步骤(2)中全部溶解的硼酸迅速倒入所配置的镀液中。(3) Pour all the boric acid dissolved in the step (2) into the configured plating solution rapidly.
所述的镀液中还包括0.5-0.6g/L的阴离子型表面活性剂十二烷基硫酸钠作为润湿剂,所用的润湿剂的配制过程如下:The anionic surfactant sodium lauryl sulfate of 0.5-0.6g/L is also included in the described plating solution as a wetting agent, and the preparation process of the wetting agent used is as follows:
(1)先用分析天平称取一定量的十二烷基硫酸钠置于干净的烧杯中;(1) take by weighing a certain amount of sodium lauryl sulfate earlier with analytical balance and be placed in clean beaker;
(2)然后加很少量的去离子水将步骤(1)中的十二烷基硫酸钠调成浆糊状;(2) Then add a small amount of deionized water to adjust the sodium lauryl sulfate in the step (1) into a paste;
(3)最后将用电热炉煮沸的去离子水倒入装有浆糊状的十二烷基硫酸钠的烧杯中,煮30min使其充分溶解,最后在倒入所配置的镀液中。(3) Finally, pour deionized water boiled in an electric furnace into a beaker filled with pasty sodium lauryl sulfate, boil for 30 minutes to fully dissolve, and finally pour it into the prepared plating solution.
所述镀液在电镀之前要进行吸附除杂,用分析天平称取3g/L的粒状活性炭加入到所述配制的镀液中,在磁子搅拌作用下搅拌吸附1h,然后将粒状的活性炭取出,最后通过真空抽滤去除残留在镀液中的粉末状的活性炭;The plating solution should be adsorbed and removed before electroplating. Use an analytical balance to weigh 3g/L granular activated carbon and add it to the prepared plating solution. Stir and adsorb for 1h under the action of magnetic stirring, and then take out the granular activated carbon. , and finally remove the powdery activated carbon remaining in the plating solution by vacuum filtration;
所述镀液在经活性炭吸附除杂之后还要进行电解除杂,电解除杂的条件为低电流即通常为0.1A,电解时间为6h,阳极还是纯度为99.99%以上的可溶性镍板,阴极为折成波纹状的薄的钢板。The plating solution will also be electrolytically decontaminated after being adsorbed and decontaminated by activated carbon. The condition of electrolytic decontamination is low current, that is, usually 0.1A, the electrolysis time is 6h, and the anode is still a soluble nickel plate with a purity of more than 99.99%. It is a thin steel plate folded into a corrugated shape.
通过霍尔槽进行预镀试验确定电镀光亮镍钴合金的条件,霍尔槽预镀试验包含以下步骤:Carry out pre-plating test by Hall cell to determine the condition of electroplating bright nickel-cobalt alloy, Hall cell pre-plating test includes the following steps:
步骤一:用量筒量取250ml的试镀液,不加糖精和1,4-丁炔二醇,调节好PH值稳定在2~5之间;Step 1: Use a graduated cylinder to measure 250ml of the test plating solution, without adding saccharin and 1,4-butynediol, and adjust the pH value to be stable between 2 and 5;
步骤二:通过霍尔槽中的加热棒将其中的镀液加热到45~65℃;Step 2: heating the plating solution to 45-65°C through the heating rod in the Hall tank;
步骤三:将表面经过处理洗净的特定的用于霍尔槽试验的铜片放到霍尔槽中;Step 3: Put the specific copper sheet used for the Hall cell test with the surface treated and cleaned into the Hall cell;
步骤四:开始试镀,试镀电流为直流且恒定为1A,试镀过程中通过用玻璃棒手动进行搅拌,随时调节PH的大小使其稳定在步骤一所要求的范围内,试镀时间10min;Step 4: Start trial plating. The trial plating current is DC and constant at 1A. During the trial plating process, manually stir with a glass rod to adjust the pH at any time to stabilize it within the range required by step 1. The trial plating time is 10 minutes. ;
步骤五:将试镀完的铜片洗净后吹干,肉眼观察其表面是否有较大面积的光亮区域;然后将其放在表面平整且放平的桌面上观察铜片四周翘起的情况,从而判断镀层中应力的大小;Step 5: Clean and dry the copper sheet after trial plating, and observe with the naked eye whether there is a large area of bright area on the surface; then place it on a table with a flat surface and observe the curling around the copper sheet , so as to determine the magnitude of the stress in the coating;
步骤六:假如试镀完的铜片表面光亮区域不大且四个角有翘起的情况,需重新量取250ml的镀液,再在上一个试镀件的基础上不断地改变糖精和1,4-丁炔二醇的用量,从而确定光亮镀层添加剂的添加的条件。Step 6: If the bright area on the surface of the copper plated after the trial plating is not large and the four corners are warped, it is necessary to re-measure 250ml of the plating solution, and then continuously change the saccharin and 1 , The amount of 4-butynediol, so as to determine the conditions for adding bright coating additives.
镀液过程通过电动搅拌桨进行搅拌,从而使得镀液各个部位的成分均匀一致。The plating solution is stirred by an electric stirring paddle, so that the composition of each part of the plating solution is uniform.
所述的阳极用可溶性镍板的纯度为99.99%以上,所述阳极和阴极的电极间距为15~20cm,规格均为10㎝×10㎝×0.2㎝,且阳极与阴极的面积比大于等于4:1。The purity of the soluble nickel plate for the anode is above 99.99%, the electrode spacing between the anode and the cathode is 15-20cm, the specifications are 10cm×10cm×0.2cm, and the area ratio of the anode and the cathode is greater than or equal to 4 :1.
阴极不锈钢依次经过120目,220目,400目,600目,800目,1000目,1500目,2000目,3000目的金相砂纸打磨至镜面效果,将其放入到80℃碱洗液中超声8~10min进行除污除油处理,然后将除油处理过的基体放入到80℃的去离子水中超声处理2min,除去残留在不锈钢基体表面的碱洗液,最后将基体放入稀硫酸溶液中超声震荡30~60s进行除锈及表面活化处理。The cathode stainless steel is sequentially polished to a mirror effect by metallographic sandpaper of 120 mesh, 220 mesh, 400 mesh, 600 mesh, 800 mesh, 1000 mesh, 1500 mesh, 2000 mesh, and 3000 mesh. Carry out decontamination and degreasing treatment for 8 to 10 minutes, then put the degreasing treated substrate into deionized water at 80°C for ultrasonic treatment for 2 minutes, remove the alkali washing solution remaining on the surface of the stainless steel substrate, and finally put the substrate into dilute sulfuric acid solution Medium ultrasonic vibration for 30-60s for rust removal and surface activation treatment.
本发明的有益效果:Beneficial effects of the present invention:
1.本发明利用多孔的活性炭具有较好的吸附能力吸附镀液中的一些杂质来净化镀液。1. The present invention utilizes porous activated carbon to have better adsorption capacity to absorb some impurities in the plating solution to purify the plating solution.
2.本电镀工艺在经过活性炭除杂后,在低电流下,经过电解除杂来进一步去除镀液中的杂质,使得镀液更为纯净,从而保证合金镀层的纯度及表面平整性。2. In this electroplating process, after removing impurities by activated carbon, the impurities in the plating solution are further removed by electrolytic removal under low current, making the plating solution more pure, thereby ensuring the purity and surface smoothness of the alloy coating.
3.本电镀工艺在真正电镀之前,先进行霍尔槽试验来确定电镀光亮镍钴合金镀层的添加剂的添加范围,从而保证合金镀层的亮度。3. In this electroplating process, before the actual electroplating, the Hall cell test is carried out to determine the additive range of the electroplating bright nickel-cobalt alloy coating, so as to ensure the brightness of the alloy coating.
4.本电镀工艺酸洗所用的酸为体积分数为10%的稀硫酸,避免了用稀盐酸给环境带来的污染。4. The acid used for pickling in this electroplating process is dilute sulfuric acid with a volume fraction of 10%, which avoids the pollution to the environment caused by dilute hydrochloric acid.
5.本电镀工艺在碱洗、水洗、酸洗这三步洗涤过程中都用到超声震荡,以便使洗涤效果更好。5. In this electroplating process, ultrasonic vibration is used in the three-step washing process of alkali washing, water washing and pickling, so as to make the washing effect better.
6.本电镀工艺镀层光亮,成分均匀,具有较高的强度硬度和塑性,耐酸耐碱以及耐磨性能也有了较大的提高。在微观结构上较特别呈现兼具FCC和HCP的双相结构,以及大小晶粒分布的双峰结构。6. The coating of this electroplating process is bright, uniform in composition, high in strength, hardness and plasticity, and its acid and alkali resistance and wear resistance have also been greatly improved. In terms of microstructure, it shows a dual-phase structure with both FCC and HCP, as well as a bimodal structure with grain size distribution.
附图说明Description of drawings
图1为单脉冲电沉积双峰镍钴合金镀层的TEM图Figure 1 is a TEM image of a single-pulse electrodeposited bimodal nickel-cobalt alloy coating
图2为钴含量为50%的纳米晶镍钴合金镀层的TEM图Fig. 2 is the TEM image of the nanocrystalline nickel-cobalt alloy coating of 50% cobalt content
图3为钴含量为70%的纳米晶镍钴合金镀层的TEM图Fig. 3 is the TEM image of the nanocrystalline nickel-cobalt alloy coating of 70% cobalt content
图4为钴含量为50%的纳米晶镍钴合金镀层的能谱图Fig. 4 is the energy spectrogram of the nanocrystalline nickel-cobalt alloy coating of 50% for cobalt content
图5为钴含量为70%的纳米晶镍钴合金镀层的能谱图Fig. 5 is the energy spectrum diagram of the nanocrystalline nickel-cobalt alloy coating of 70% cobalt content
图6为不同钴含量的纳米晶镍钴合金镀层的XRD图Fig. 6 is the XRD figure of the nanocrystalline nickel-cobalt alloy coating of different cobalt content
具体实施方式detailed description
实施例1Example 1
一种单脉冲电沉积光亮双相双峰纳米晶镍钴合金的制备工艺,包括以下步骤:A preparation process of single-pulse electrodeposited bright dual-phase bimodal nanocrystalline nickel-cobalt alloy, comprising the following steps:
A.镀液的配制:在硫酸镍60g/L、氯化镍50g/L、硫酸钴45g/L为主盐的镀液中加入50g/L的硼酸,再加入去离子水将镀液配平至5L(4L用于正式电镀,1L用于试镀试验)。A. The preparation of plating solution: add the boric acid of 50g/L in the plating solution of nickel sulfate 60g/L, nickel chloride 50g/L, cobalt sulfate 45g/L main salt, then add deionized water to balance the plating solution to 5L (4L is used for formal electroplating, 1L is used for trial plating test).
B.吸附除杂:将配好的没有加添加剂的镀液加入3g/L的活性炭并放入磁子,在室温下搅拌吸附1h。最后通过抽滤将镀液中残留的活性炭去除掉。B. Adsorption and impurity removal: add 3g/L activated carbon to the prepared plating solution without additives and put it into a magnet, stir and adsorb at room temperature for 1h. Finally, the activated carbon remaining in the plating solution was removed by suction filtration.
C.电解除杂:将抽滤完的镀液在平均电流为0.1A的脉冲电源下进行电解吸附除杂,电解6h。C. Electrolytic impurity removal: Electrolytic adsorption and impurity removal were performed on the filtered plating solution under a pulse power supply with an average current of 0.1A, and electrolysis was performed for 6 hours.
D.预镀试验:D. Pre-plating test:
步骤一:从电解完的5L镀液中量取250ml的镀液,只加入0.5g/L的十二烷基硫酸钠,不加糖精和1,4-丁炔二醇。通过加热棒将霍尔槽中的镀液的温度加热到55℃且维持恒定。Step 1: Measure 250ml of the plating solution from the 5L of the electrolytic plating solution, add only 0.5g/L sodium lauryl sulfate, without adding saccharin and 1,4-butynediol. The temperature of the plating solution in the Hall cell was heated to 55° C. by a heating rod and kept constant.
步骤二:在直流电源且电流恒定在1A的情况下,进行预镀。在试镀的过程中PH值稳定在3.8,且不断对镀液进行搅拌,试镀时间10min。Step 2: Pre-plating is carried out under the condition of a DC power supply and a constant current of 1A. During the test plating process, the pH value was stable at 3.8, and the plating solution was continuously stirred, and the test plating time was 10 minutes.
步骤三:将镀件用去离子水冲洗干净,然后吹干。Step 3: Rinse the plated parts with deionized water, and then blow dry.
步骤四:将吹干的镀件放在表面平整且放平的桌子上,观察铜片四角翘起的角度大小。同时观察铜片表面的光亮度。Step 4: Place the blow-dried plated parts on a table with a flat surface and observe the angle of the four corners of the copper sheet. At the same time, observe the brightness of the surface of the copper sheet.
步骤五:假如上述镀件四角有较大的翘起或镀件表面不够光亮。重新量取250ml的镀液在步骤一的镀液的基础上不断地改变糖精和1,4-丁炔二醇的用量得到光亮镀层的添加剂的用量范围。Step 5: If the four corners of the above-mentioned plated parts are slightly lifted or the surface of the plated parts is not bright enough. Re-measure 250ml of plating solution and constantly change the amount of saccharin and 1,4-butynediol on the basis of the plating solution in step 1 to obtain the range of additives for bright plating.
E.洗件:将基体不锈钢放入到80℃的碱洗液中,在超声频率为30kHz的超声机中超声10min,然后放入到80℃的去离子水中超声震荡2min(f=30kHz)去除基体表面残留的碱洗液。最后将基体放入到体积分数10%的稀硫酸中超声酸洗30s。E. Cleaning: Put the base stainless steel into the alkali washing solution at 80°C, ultrasonicate for 10min in an ultrasonic machine with an ultrasonic frequency of 30kHz, and then put it into deionized water at 80°C for 2min (f=30kHz) to remove Alkaline cleaning solution remaining on the surface of the substrate. Finally, put the substrate into 10% dilute sulfuric acid for ultrasonic pickling for 30s.
F.正式电镀:将预镀阶段确定的添加剂的用量加到4L的镀液中,同时将处理过的基体放入4L的镀液中开始电镀。电镀条件为:单脉冲电镀,平均电流0.4A,ton=0.2ms,toff=0.8ms,占空比20%,电镀时间2h,厚度25um,镀液温度稳定在55℃,PH值稳定在3.8。F. Formal electroplating: Add the amount of additives determined in the pre-plating stage to the 4L plating solution, and at the same time put the treated substrate into the 4L plating solution to start electroplating. The electroplating conditions are: single pulse electroplating, average current 0.4A, t on = 0.2ms, t off = 0.8ms, duty cycle 20%, electroplating time 2h, thickness 25um, bath temperature stable at 55°C, pH value stable at 3.8.
G.镀后处理:将镀完的件用去离子水冲净后,吹干即得到试验件。G. Post-plating treatment: Rinse the plated piece with deionized water and dry it to get the test piece.
实施例2Example 2
一种单脉冲电沉积光亮双相纳米晶镍钴合金的制备工艺,包括以下步骤:A preparation process of single-pulse electrodeposited bright dual-phase nanocrystalline nickel-cobalt alloy, comprising the following steps:
A.镀液的配制:在硫酸镍50g/L、氯化镍40g/L、硫酸钴40g/L为主盐的镀液中加入40g/L的硼酸,再加入去离子水将镀液配平至5L(4L用于正式电镀,1L用于试镀试验)。A. Preparation of plating solution: Add 40g/L boric acid to the plating solution of nickel sulfate 50g/L, nickel chloride 40g/L, and cobalt sulfate 40g/L as the main salt, then add deionized water to balance the plating solution to 5L (4L is used for formal electroplating, 1L is used for trial plating test).
B.吸附除杂:将配好的没有加添加剂的镀液加入3g/L的活性炭并放入磁子,在室温下搅拌吸附1h。最后通过抽滤将镀液中残留的活性炭去除掉。B. Adsorption and impurity removal: add 3g/L activated carbon to the prepared plating solution without additives and put it into a magnet, stir and adsorb at room temperature for 1h. Finally, the activated carbon remaining in the plating solution was removed by suction filtration.
C.电解除杂:将抽滤完的镀液在平均电流为0.1A的脉冲电源下进行电解吸附除杂,电解6h。C. Electrolytic impurity removal: Electrolytic adsorption and impurity removal were performed on the filtered plating solution under a pulse power supply with an average current of 0.1A, and electrolysis was performed for 6 hours.
D.预镀试验:D. Pre-plating test:
步骤一:从电解完的5L镀液中量取250ml的镀液,只加入0.5g/L的十二烷基硫酸钠,不加糖精和1,4-丁炔二醇。通过加热棒将霍尔槽中的镀液的温度加热到45℃且维持恒定。Step 1: Measure 250ml of the plating solution from the 5L of the electrolytic plating solution, add only 0.5g/L sodium lauryl sulfate, without adding saccharin and 1,4-butynediol. The temperature of the plating solution in the Hall cell was heated to 45° C. by a heating rod and kept constant.
步骤二:在直流电源且电流恒定在1A的情况下,进行预镀。在试镀的过程中PH值稳定在4.5,且不断对镀液进行搅拌,试镀时间10min。Step 2: Pre-plating is carried out under the condition of a DC power supply and a constant current of 1A. During the test plating process, the pH value was stable at 4.5, and the plating solution was continuously stirred, and the test plating time was 10 minutes.
步骤三:将镀件用去离子水冲洗干净,然后吹干。Step 3: Rinse the plated parts with deionized water, and then blow dry.
步骤四:将吹干的镀件放在表面平整且放平的桌子上,观察铜片四角翘起的角度大小。同时观察铜片表面的光亮度。Step 4: Place the blow-dried plated parts on a table with a flat surface and observe the angle of the four corners of the copper sheet. At the same time, observe the brightness of the surface of the copper sheet.
步骤五:假如上述镀件四角有较大的翘起或镀件表面不够光亮。重新量取250ml的镀液在步骤一的镀液的基础上不断地改变糖精和1,4-丁炔二醇的用量得到光亮镀层的添加剂的用量范围。Step 5: If the four corners of the above-mentioned plated parts are slightly lifted or the surface of the plated parts is not bright enough. Re-measure 250ml of plating solution and constantly change the amount of saccharin and 1,4-butynediol on the basis of the plating solution in step 1 to obtain the range of additives for bright plating.
E.洗件:将基体不锈钢放入到60℃的碱洗液中,在超声频率为35kHz的超声机中超声8min,然后放入到60℃的去离子水中超声震荡2min(f=30kHz)去除基体表面残留的碱洗液。最后将基体放入到体积分数10%的稀硫酸中超声酸洗45s。E. Cleaning: Put the base stainless steel into the alkali washing solution at 60°C, ultrasonicate it in an ultrasonic machine with an ultrasonic frequency of 35kHz for 8min, and then put it into deionized water at 60°C and oscillate ultrasonically for 2min (f=30kHz) to remove Alkaline cleaning solution remaining on the surface of the substrate. Finally, put the substrate into 10% dilute sulfuric acid for ultrasonic pickling for 45s.
F.正式电镀:将预镀阶段确定的添加剂的用量加到4L的镀液中,同时将处理过的基体放入4L的镀液中开始电镀。电镀条件为:单脉冲电镀,平均电流0.6A,ton=0.8ms,toff=1.2ms,占空比40%,电镀时间3h,厚度35um,镀液温度稳定在45℃,PH值稳定在4.5。F. Formal electroplating: Add the amount of additives determined in the pre-plating stage to the 4L plating solution, and at the same time put the treated substrate into the 4L plating solution to start electroplating. The electroplating conditions are: single pulse electroplating, average current 0.6A, t on = 0.8ms, t off = 1.2ms, duty cycle 40%, electroplating time 3h, thickness 35um, bath temperature stable at 45°C, pH value stable at 4.5.
G.镀后处理:将镀完的件用去离子水冲净后,吹干即得到试验件。G. Post-plating treatment: Rinse the plated piece with deionized water and dry it to get the test piece.
实施例3Example 3
一种单脉冲电沉积光亮双相纳米晶镍钴合金的制备工艺,包括以下步骤:A preparation process of single-pulse electrodeposited bright dual-phase nanocrystalline nickel-cobalt alloy, comprising the following steps:
A.镀液的配制:在硫酸镍70g/L、氯化镍60g/L、硫酸钴50g/L为主盐的镀液中加入45g/L的硼酸,再加入去离子水将镀液配平至5L(4L用于正式电镀,1L用于试镀试验)。A. The preparation of plating solution: add the boric acid of 45g/L in the plating solution of nickel sulfate 70g/L, nickel chloride 60g/L, cobalt sulfate 50g/L main salt, then add deionized water to balance the plating solution to 5L (4L is used for formal electroplating, 1L is used for trial plating test).
B.吸附除杂:将配好的没有加添加剂的镀液加入3g/L的活性炭并放入磁子,在室温下搅拌吸附1h。最后通过抽滤将镀液中残留的活性炭去除掉。B. Adsorption and impurity removal: add 3g/L activated carbon to the prepared plating solution without additives and put it into a magnet, stir and adsorb at room temperature for 1h. Finally, the activated carbon remaining in the plating solution was removed by suction filtration.
C.电解除杂:将抽滤完的镀液在平均电流为0.1A的脉冲电源下进行电解吸附除杂,电解6h。C. Electrolytic impurity removal: Electrolytic adsorption and impurity removal were performed on the filtered plating solution under a pulse power supply with an average current of 0.1A, and electrolysis was performed for 6 hours.
D.预镀试验:D. Pre-plating test:
步骤一:从电解完的5L镀液中量取250ml的镀液,只加入0.5g/L的十二烷基硫酸钠,不加糖精和1,4-丁炔二醇。通过加热棒将霍尔槽中的镀液的温度加热到65℃且维持恒定。Step 1: Measure 250ml of the plating solution from the 5L of the electrolytic plating solution, add only 0.5g/L sodium lauryl sulfate, without adding saccharin and 1,4-butynediol. The temperature of the plating solution in the Hall cell was heated to 65° C. by a heating rod and kept constant.
步骤二:在直流电源且电流恒定在1A的情况下,进行预镀。在试镀的过程中PH值稳定在5,且不断对镀液进行搅拌,试镀时间10min。Step 2: Pre-plating is carried out under the condition of a DC power supply and a constant current of 1A. During the test plating process, the pH value was stable at 5, and the plating solution was continuously stirred, and the test plating time was 10 minutes.
步骤三:将镀件用去离子水冲洗干净,然后吹干。Step 3: Rinse the plated parts with deionized water, and then blow dry.
步骤四:将吹干的镀件放在表面平整且放平的桌子上,观察铜片四角翘起的角度大小。同时观察铜片表面的光亮度。Step 4: Place the blow-dried plated parts on a table with a flat surface and observe the angle of the four corners of the copper sheet. At the same time, observe the brightness of the surface of the copper sheet.
步骤五:假如上述镀件四角有较大的翘起或镀件表面不够光亮。重新量取250ml的镀液在步骤一的镀液的基础上不断地改变糖精和1,4-丁炔二醇的用量得到光亮镀层的添加剂的用量范围。Step 5: If the four corners of the above-mentioned plated parts are slightly lifted or the surface of the plated parts is not bright enough. Re-measure 250ml of plating solution and constantly change the amount of saccharin and 1,4-butynediol on the basis of the plating solution in step 1 to obtain the range of additives for bright plating.
E.洗件:将基体不锈钢放入到40℃的碱洗液中,在超声频率为40kHz的超声机中超声6min,然后放入到40℃的去离子水中超声震荡2min(f=30kHz)去除基体表面残留的碱洗液。最后将基体放入到体积分数10%的稀硫酸中超声酸洗60s。E. Cleaning: Put the base stainless steel into the alkali washing solution at 40°C, ultrasonicate it in an ultrasonic machine with an ultrasonic frequency of 40kHz for 6min, and then put it into deionized water at 40°C and oscillate ultrasonically for 2min (f=30kHz) to remove Alkaline cleaning solution remaining on the surface of the substrate. Finally, put the substrate into 10% dilute sulfuric acid for ultrasonic pickling for 60s.
F.正式电镀:将预镀阶段确定的添加剂的用量加到4L的镀液中,同时将处理过的基体放入4L的镀液中开始电镀。电镀条件为:单脉冲电镀,平均电流0.4A,ton=0.2ms,toff=0.8ms,占空比20%,电镀时间4h,厚度40um,镀液温度稳定在65℃,PH值稳定在5。F. Formal electroplating: Add the amount of additives determined in the pre-plating stage to the 4L plating solution, and at the same time put the treated substrate into the 4L plating solution to start electroplating. The electroplating conditions are: single pulse electroplating, average current 0.4A, t on = 0.2ms, t off = 0.8ms, duty cycle 20%, electroplating time 4h, thickness 40um, bath temperature stable at 65°C, pH value stable at 5.
G.镀后处理:将镀完的件用去离子水冲净后,吹干即得到试验件。G. Post-plating treatment: Rinse the plated piece with deionized water and dry it to get the test piece.
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