CN106986636B - A kind of low temperature sintering microwave ceramic material and preparation method thereof - Google Patents
A kind of low temperature sintering microwave ceramic material and preparation method thereof Download PDFInfo
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- 229910010293 ceramic material Inorganic materials 0.000 title claims abstract description 26
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 238000009766 low-temperature sintering Methods 0.000 title claims description 6
- 238000005245 sintering Methods 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 11
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- 229910052709 silver Inorganic materials 0.000 abstract description 4
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
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- 238000010309 melting process Methods 0.000 description 2
- LSGOVYNHVSXFFJ-UHFFFAOYSA-N vanadate(3-) Chemical compound [O-][V]([O-])([O-])=O LSGOVYNHVSXFFJ-UHFFFAOYSA-N 0.000 description 2
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Abstract
本发明属于电子功能陶瓷与元器件技术领域,涉及微波器件及电路,具体提供一种低温烧结微波陶瓷材料及其制备方法,用以克服现有低温烧结微波陶瓷温度系数未调零的缺点;本发明微波陶瓷材料的化学表达式为:Ca5+ACo4+BV6+ CO24-XCaTiO3,其中A+B+C=‑0.05,‑0.05≤A≤0,‑0.05≤B≤0,‑0.05≤C≤0,2wt%<X≤10wt%;该微波陶瓷能与金属银共烧并且不与银发生化学反应,并且能够实现谐振频率温度系数为:‑10ppm/℃~+10ppm/℃,即零温度系数;同时,该材料具备烧结温度低的特性,不需添加任何助烧剂,有效防止了助烧剂造成其介电性能恶化的发生,并保持较高的致密度和瓷体强度,制备工艺简单、环保节能、重复好、且成本低廉,易于实现工业化生产。
The invention belongs to the technical field of electronic functional ceramics and components, relates to microwave devices and circuits, and specifically provides a low-temperature sintered microwave ceramic material and a preparation method thereof, which are used to overcome the disadvantage that the temperature coefficient of the existing low-temperature sintered microwave ceramics is not zero-adjusted; The chemical expression of the invented microwave ceramic material is: Ca 5+A Co 4+B V 6+ C O 24 -XCaTiO 3 , where A+B+C=‑0.05,‑0.05≤A≤0,‑0.05≤B≤ 0, ‑0.05≤C≤0, 2wt%<X≤10wt%; the microwave ceramic can be co-fired with metallic silver without chemical reaction with silver, and the temperature coefficient of resonant frequency can be achieved: ‑10ppm/℃~+10ppm /℃, that is, zero temperature coefficient; at the same time, the material has the characteristics of low sintering temperature, and does not need to add any sintering aid, which effectively prevents the deterioration of its dielectric properties caused by the sintering aid, and maintains a high density and Porcelain body strength, simple preparation process, environmental protection and energy saving, good repetition, low cost, easy to realize industrialized production.
Description
技术领域technical field
本发明属于电子功能陶瓷与元器件技术领域,尤其是微波器件及电路,涉及一种低温烧结微波陶瓷材料及其制备方法。The invention belongs to the technical field of electronic functional ceramics and components, in particular to microwave devices and circuits, and relates to a low-temperature sintered microwave ceramic material and a preparation method thereof.
背景技术Background technique
微电子器件和集成器件的快速发展对电子设备小型化、轻量化提出了高的要求,单一的有源器件集成已经无法满足生成应用,无源器件必须小型化成为一种趋势,但传统所用大体积的金属谐振腔使微带电路的集成变得困难。微波多芯片组件(MMCM)模块因具有重量轻,体积小,成本低和可靠性高的技术特点而被广泛应用,实现这一技术的有效途径是发展多层式元件。低温共烧陶瓷(Low Temperature Co-fired Ceramics,LTCC)技术因为其具有较高的集成密度、较好的高频特性等优点,已经成为实现当前电子元器件集成化的一种主要方式。LTCC技术采用的多层布线结构是一种三维立体组装的无源器件集成及无源器件混合集成技术,能够实现无源元件(电阻、电容、电感、滤波器)与传输线的集成,又可表面贴装IC,为实现期间的小型化、多重功能的模块化和提高信号的可靠性方面扮演了重要的角色。The rapid development of microelectronic devices and integrated devices has put forward high requirements for the miniaturization and light weight of electronic equipment. A single active device integration has been unable to meet the generation application. Passive devices must be miniaturized. It has become a trend, but the traditional use of large Bulk metal resonators make the integration of microstrip circuits difficult. Microwave multi-chip module (MMCM) modules are widely used due to their technical characteristics of light weight, small size, low cost and high reliability. The effective way to realize this technology is to develop multi-layer components. Low Temperature Co-fired Ceramics (LTCC) technology has become a main way to realize the integration of current electronic components because of its advantages of high integration density and good high frequency characteristics. The multi-layer wiring structure adopted by LTCC technology is a three-dimensional assembly of passive device integration and passive device hybrid integration technology, which can realize the integration of passive components (resistors, capacitors, inductors, filters) and transmission lines, and can Mounting ICs plays an important role in realizing miniaturization, modularization of multiple functions, and improved signal reliability.
LTCC技术使用的互联导体一般具有优异导电性的银金属,其熔点约为961℃,这就要求应用在LTCC技术上的陶瓷材料必须要在950℃以下烧结致密,另外,应用在LTCC技术上的微波陶瓷材料还应具有以下特点:(1)适宜的介电常数以有利于器件的小型化;(2)高的品质因数以降低损耗,一般要求Q×f≥20000GHz;(3)近零的温度系数(10~+10ppm/℃)以有利于温度稳定性。然而,许许多多的高温烧结微波陶瓷为了满足LTCC的温度要求(烧结致密温度低于950℃)都必须添加助烧剂(B2O3、玻璃和V2O5等低熔点氧化物),例如在OhsatoH,Ohhashi T,Kato H,et al.Microwave Dielectric Properties and Structure of theBa6-3xSm8+2xTi18O54Solid Solutions[J].Japanese Journal of Applied Physics,1995,34(1):187-191中报道,Ba6-3xSm8+2xTi18O54通过添加0.5wt%B2O3将烧结温度从1733K降到1473K,同时也降低了品质因数和介电常数,这就是典型的牺牲微波介电性能换取低温烧结的案例。由此可知,助烧剂虽然能起到降烧的效果,但助烧剂的添加,会恶化其微波介电性能,同时降低致密度和瓷体强度;添加助烧剂所形成的结构难于控制,制备工艺相对复杂,通常助烧剂都必须单独制备,如经过玻璃熔融过程,在此过程中不仅增加了工艺的复杂性,并且需耗费大量能源增加了能耗。因此开发出低温烧结微波陶瓷已经成了一种趋势。The interconnecting conductors used in LTCC technology generally have silver metal with excellent electrical conductivity, and its melting point is about 961 ° C, which requires that the ceramic materials used in LTCC technology must be sintered and dense below 950 ° C. In addition, applied in LTCC technology. Microwave ceramic materials should also have the following characteristics: (1) suitable dielectric constant to facilitate the miniaturization of the device; (2) high quality factor to reduce loss, generally requiring Q×f≥20000GHz; (3) near-zero Temperature coefficient (10~+10ppm/°C) to facilitate temperature stability. However, many high-temperature sintered microwave ceramics must be added with sintering aids (low melting point oxides such as B 2 O 3 , glass and V 2 O 5 ) in order to meet the temperature requirements of LTCC (the sintering densification temperature is lower than 950°C). For example in OhsatoH, Ohhashi T, Kato H, et al. Microwave Dielectric Properties and Structure of the Ba 6-3x Sm 8+2x Ti 18 O 54 Solid Solutions [J]. Japanese Journal of Applied Physics, 1995, 34(1): It was reported in 187-191 that Ba 6-3x Sm 8+2x Ti 18 O 54 reduced the sintering temperature from 1733K to 1473K by adding 0.5wt% B 2 O 3 , and also lowered the quality factor and dielectric constant, which is typical A case of sacrificing microwave dielectric properties for low temperature sintering. It can be seen that although the sintering aid can reduce the sintering effect, the addition of the sintering aid will deteriorate its microwave dielectric properties, and at the same time reduce the density and the strength of the porcelain body; the structure formed by the addition of the sintering aid is difficult to control. , the preparation process is relatively complicated, and usually the sintering aid must be prepared separately, such as through the glass melting process, which not only increases the complexity of the process, but also consumes a lot of energy and increases energy consumption. Therefore, the development of low-temperature sintered microwave ceramics has become a trend.
钒酸盐体系是一种新型LTCC微波介质材料,不仅烧结温度低,并且具有Q×f值高的优点,近几年逐渐地被人们所关注。例如在Journal of the American CeramicSociety,2013,96(6):1691-1693《Novel Series of Low‐Firing Microwave DielectricCeramics:Ca5A4(VO4)6(A2+=Mg,Zn)》报道,Ca5Zn4(VO4)6和Ca5Mg4(VO4)6微波陶瓷在725℃和800℃下烧结的微波介电性能:介电常数11.7和9.2、品质因数Q×f=49400GHz和53300GHz、温度系数-83ppm/℃和-50ppm/℃;在Journal of Materials Science:Materials inElectronics 2016,27(7):7292-7296《Microwave dielectric properties of lowtemperature sintering Ca5Mn4(VO4)6》报道,Ca5Mn4(VO4)6的微波介电性能:介电常数11.7、品质因数Q×f=33800GHz,温度系数-70ppm/℃。尽管上述钒酸盐体系微波陶瓷能够满足LTCC的温度要求(烧结致密温度低于950℃),但无法满足近零的温度系数的要求,严重限制了其在微波器件的应用,由此研究出满足LTCC技术的各项要求的微波陶瓷已经成为了迫切的需要。Vanadate system is a new type of LTCC microwave dielectric material, which not only has a low sintering temperature, but also has the advantages of high Q×f value, and has gradually attracted attention in recent years. For example, it is reported in Journal of the American Ceramic Society, 2013, 96(6): 1691-1693 "Novel Series of Low-Firing Microwave DielectricCeramics: Ca 5 A 4 (VO 4 ) 6 (A2+=Mg, Zn)", Ca 5 Zn Microwave dielectric properties of 4 (VO 4 ) 6 and Ca 5 Mg 4 (VO 4 ) 6 microwave ceramics sintered at 725℃ and 800℃: dielectric constants 11.7 and 9.2, quality factor Q×f=49400GHz and 53300GHz, temperature Coefficients -83ppm/℃ and -50ppm/℃; reported in Journal of Materials Science: Materials in Electronics 2016, 27(7): 7292-7296 "Microwave dielectric properties of low temperature sintering Ca 5 Mn 4 (VO 4 ) 6 ", Ca 5 Microwave dielectric properties of Mn 4 (VO 4 ) 6 : dielectric constant 11.7, quality factor Q×f=33800GHz, temperature coefficient -70ppm/°C. Although the above-mentioned vanadate system microwave ceramics can meet the temperature requirements of LTCC (the sintering and densification temperature is lower than 950 °C), they cannot meet the requirements of near-zero temperature coefficient, which seriously limits their application in microwave devices. Microwave ceramics for the various requirements of LTCC technology have become an urgent need.
发明内容SUMMARY OF THE INVENTION
本发明的目的在于提供一种低温烧结微波陶瓷材料及其制备方法,用以克服现有低温烧结微波陶瓷温度系数未调零的缺点;该微波陶瓷材料的化学表达式为:Ca5+ACo4+BV6+ CO24-XCaTiO3,其中A+B+C=-0.05,-0.05≤A≤0,-0.05≤B≤0,-0.05≤C≤0,0<X≤15;该微波陶瓷能与金属银共烧并且不与银发生化学反应,并且能够实现谐振频率温度系数为:-10ppm/℃~+10ppm/℃,同时,制备工艺简单、成本低、重复好、易于工业化生产。The object of the present invention is to provide a low-temperature sintered microwave ceramic material and a preparation method thereof, so as to overcome the disadvantage that the temperature coefficient of the existing low-temperature sintered microwave ceramic is not zero-adjusted; the chemical expression of the microwave ceramic material is: Ca 5+A Co 4+B V 6+ C O 24 -XCaTiO 3 , wherein A+B+C=-0.05, -0.05≤A≤0, -0.05≤B≤0, -0.05≤C≤0, 0<X≤15; The microwave ceramic can be co-fired with metallic silver without chemical reaction with silver, and can realize the temperature coefficient of resonant frequency: -10ppm/℃~+10ppm/℃, meanwhile, the preparation process is simple, the cost is low, the repetition is good, and the industrialization is easy. Production.
为实现上述目的,本发明采用的技术方案为:To achieve the above object, the technical scheme adopted in the present invention is:
一种低温烧结微波陶瓷材料,其特征在于,所述微波陶瓷材料的化学表达式为:Ca5+ACo4+BV6+CO24-XCaTiO3,其中A+B+C=-0.05,-0.05≤A≤0,-0.05≤B≤0,-0.05≤C≤0,2wt%<X≤10wt%(尤其4wt%<X≤8wt%)。A low-temperature sintering microwave ceramic material, characterized in that the chemical expression of the microwave ceramic material is: Ca 5+A Co 4+B V 6+C O 24 -XCaTiO 3 , wherein A+B+C=-0.05 , -0.05≤A≤0, -0.05≤B≤0, -0.05≤C≤0, 2wt%<X≤10wt% (especially 4wt%<X≤8wt%).
所述微波介质陶瓷的主晶相为Ca5Co4(VO4)6,次晶相为CaTiO3。The main crystal phase of the microwave dielectric ceramic is Ca 5 Co 4 (VO 4 ) 6 , and the secondary crystal phase is CaTiO 3 .
上述低温烧结微波陶瓷材料的制备方法,包括以下步骤:The preparation method of the above-mentioned low-temperature sintered microwave ceramic material comprises the following steps:
步骤1:以CaCO3、Co2O3、V2O5和CaTiO3为原料,按照摩尔比CaCO3:Co2O3:V2O5=5+A:4+B:6+C进行配料,混合均匀得到混合料,其中,A+B+C=-0.05,-0.05≤A≤0,-0.05≤B≤0,-0.05≤C≤0,2wt%<X≤10wt%;Step 1: Using CaCO 3 , Co 2 O 3 , V 2 O 5 and CaTiO 3 as raw materials, according to the molar ratio of CaCO 3 : Co 2 O 3 : V 2 O 5 =5+A:4+B:6+C ingredients, mix evenly to obtain a mixture, wherein A+B+C=-0.05, -0.05≤A≤0, -0.05≤B≤0, -0.05≤C≤0, 2wt%<X≤10wt%;
步骤2:将步骤1所得混合料依次经过球磨、烘干、过筛,得到干燥粉体;并于750~850℃温度下预烧4~6h,得到预烧料;Step 2: the mixture obtained in
步骤3:将步骤2所得预烧料再依次经过球磨、烘干、过筛,得到二次球磨料;Step 3: pass the pre-sintered material obtained in step 2 through ball milling, drying and sieving in turn to obtain secondary ball abrasive;
步骤4:将步骤3所得二次球磨料添加5~10wt%的粘结剂PVA混合后造粒、成型得到生坯;Step 4: adding 5-10 wt% of the binder PVA to the secondary ball abrasive obtained in step 3 and mixing, granulating and molding to obtain a green body;
步骤5:将步骤4所得生坯在温度为900~950℃、气氛为空气的条件下烧结1~7h,得到所述微波陶瓷材料。Step 5: sintering the green body obtained in step 4 at a temperature of 900-950° C. and an atmosphere of air for 1-7 hours to obtain the microwave ceramic material.
进一步的,所述步骤2和步骤3中,球磨时间均为:4~7h,烘干温度均为:80~100℃。Further, in the steps 2 and 3, the ball milling time is 4-7 h, and the drying temperature is 80-100°C.
所述步骤4中,造粒尺寸为100~250目,于20MPa的压力下成型。In the step 4, the granulation size is 100-250 mesh, and the granulation is formed under a pressure of 20 MPa.
本发明的有益效果在于:The beneficial effects of the present invention are:
本发明提供一种低温烧结微波陶瓷材料及其制备方法,该微波陶瓷材料能够实现谐振频率温度系数为:-10ppm/℃~+10ppm/℃,即零温度系数;该材料具备烧结温度低的特性(烧结温度<950℃),不需添加任何助烧剂,有效防止了助烧剂造成其介电性能恶化的发生,并保持较高的致密度和瓷体强度;同时,有效避免了添加助烧剂所形成的复相结构难于控制、制备工艺复杂(助烧剂必须单独制备,如经过玻璃熔融过程)等问题;综上,本发明提供一种零温度系数低温烧结微波介质,同时,该微波陶瓷材料制备工艺简单、环保节能、重复好、且成本低廉,易于实现工业化生产。The invention provides a low-temperature sintered microwave ceramic material and a preparation method thereof. The microwave ceramic material can realize a resonant frequency temperature coefficient of -10ppm/℃~+10ppm/℃, that is, zero temperature coefficient; the material has the characteristics of low sintering temperature (sintering temperature <950℃), no need to add any sintering aids, which effectively prevents the deterioration of its dielectric properties caused by sintering aids, and maintains high density and porcelain body strength; The complex phase structure formed by the sintering agent is difficult to control, and the preparation process is complicated (the sintering agent must be prepared separately, such as through the glass melting process), etc. In conclusion, the present invention provides a zero temperature coefficient low-temperature sintering microwave medium, and at the same time, the The microwave ceramic material has the advantages of simple preparation process, environmental protection and energy saving, good repetition and low cost, and is easy to realize industrial production.
附图说明Description of drawings
图1为实施例1制备得微波陶瓷材料Ca5+ACo4+BV6+CO24-XCaTiO3的XRD衍射分析图。1 is the XRD diffraction analysis diagram of the microwave ceramic material Ca 5+A Co 4+B V 6+C O 24 -XCaTiO 3 prepared in Example 1.
图2为实施例1制备得微波陶瓷材料Ca5+ACo4+BV6+CO24-XCaTiO3的SEM电子显微镜图。FIG. 2 is a SEM electron microscope image of the microwave ceramic material Ca 5+A Co 4+B V 6+C O 24 -XCaTiO 3 prepared in Example 1. FIG.
具体实施方式Detailed ways
下面结合具体实施例对本发明作进一步阐述:Below in conjunction with specific embodiment, the present invention is further elaborated:
实施例1~实施例5Example 1 to Example 5
上述实施例中提供微波介质的化学表达式为:The chemical expression of the microwave medium provided in the above embodiment is:
制得这些实施实例的微波陶瓷具体实施步骤如下:Ca5+ACo4+BV6+CO24-XCaTiO3,其中,A=B=0,C=-0.05,X=6wt%;该微波陶瓷材料的具体制备过程如下:The specific implementation steps for preparing the microwave ceramics of these examples are as follows: Ca 5+A Co 4+B V 6+C O 24 -XCaTiO 3 , wherein A=B=0, C=-0.05, X=6wt%; the The specific preparation process of microwave ceramic materials is as follows:
步骤1:按照权利要求1所述根据发明材料的化学通式配比称取原料CaCO3、Co2O3、V2O5和CaTiO3进行配料并混合得到混合料;Step 1: according to
步骤2:将由步骤1所得混合料,经过球磨7h,100℃下烘干并过40目筛,在775℃温度下预烧3h,得到预烧料;Step 2: Ball milling the mixture obtained in
步骤3:将得到的预烧料进行二次球磨7h,球磨完后将球磨料于100℃下烘干,得到二次球磨料;Step 3: the obtained pre-sintered material is subjected to secondary ball milling for 7 hours, and after the ball milling is completed, the ball abrasive is dried at 100° C. to obtain secondary ball abrasive;
步骤4:将得到的二次球磨料添加相当于所述二次球磨料加入5~10wt%的粘结剂PVA混合后造粒,造粒尺寸控制在100~250目,并在20MPa的压力下成型得到生坯;Step 4: Add 5-10wt% binder PVA to the obtained secondary ball abrasive, and then granulate, and the granulation size is controlled at 100-250 mesh, and under the pressure of 20MPa molding to obtain a green body;
步骤5:将步骤4得到的生坯在温度为900~950℃、气氛为空气的条件下烧结1~7h,得到最终所需要的微波陶瓷。Step 5: The green body obtained in Step 4 is sintered at a temperature of 900-950° C. and an atmosphere of air for 1-7 hours to obtain the final microwave ceramic required.
步骤6:测试:根据Hakki-Coleman介质谐振法,用网络分析仪测试样品的微波介质性能。Step 6: Testing: According to the Hakki-Coleman dielectric resonance method, the microwave dielectric properties of the samples were tested with a network analyzer.
实施例1~实施例5的具体成分组成、工艺参数和微波介电性能如下表所示:The specific components, process parameters and microwave dielectric properties of Examples 1 to 5 are shown in the following table:
以上所述,仅为本发明的具体实施方式,本说明书中所公开的任一特征,除非特别叙述,均可被其他等效或具有类似目的的替代特征加以替换;所公开的所有特征、或所有方法或过程中的步骤,除了互相排斥的特征和/或步骤以外,均可以任何方式组合。The above descriptions are only specific embodiments of the present invention, and any feature disclosed in this specification, unless otherwise stated, can be replaced by other equivalent or alternative features with similar purposes; all the disclosed features, or All steps in a method or process, except mutually exclusive features and/or steps, may be combined in any way.
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