CN106982514B - A kind of single-layer multi-material conductive circuit board and preparation method thereof - Google Patents
A kind of single-layer multi-material conductive circuit board and preparation method thereof Download PDFInfo
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- 239000000463 material Substances 0.000 title claims abstract description 38
- 239000002356 single layer Substances 0.000 title claims abstract description 15
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 239000010410 layer Substances 0.000 claims abstract description 99
- 239000000853 adhesive Substances 0.000 claims abstract description 12
- 230000001070 adhesive effect Effects 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 238000005530 etching Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 20
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 238000010329 laser etching Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 238000010146 3D printing Methods 0.000 claims description 3
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- 229910001416 lithium ion Inorganic materials 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 2
- 229910052743 krypton Inorganic materials 0.000 claims description 2
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000006262 metallic foam Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 229910052724 xenon Inorganic materials 0.000 claims description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910001339 C alloy Inorganic materials 0.000 description 1
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/66—Selection of materials
- H01M4/665—Composites
- H01M4/667—Composites in the form of layers, e.g. coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
本发明提供一种单层多材质导电线路板及制备方法。其制备方法包括：(1)在绝缘层上通过粘结剂粘合有第一导电层，在第一导电层上刻蚀出预留图案的轮廓，使得第一导电层上的预留图案部分与非预留图案部分分离，剥离掉第一导电层上的非预留图案部分，制得第一导电线路板；(2)在第一导电线路板的导电层一侧覆盖有第二导电层，第二导电层通过粘结剂与绝缘层粘结，在第二导电层的导电基底上刻蚀出预留图案的轮廓，使得第二导电层的预留图案部分与非预留图案部分分离，剥离掉第二导电层的非预留图案部分，制得第二导电线路板。本发明的制备方法简单高效，同一绝缘基底上可以排布不同材质的导电线路，大大扩展了电路板的应用领域。
The invention provides a single-layer multi-material conductive circuit board and a preparation method. The preparation method includes: (1) adhering a first conductive layer on the insulating layer through an adhesive, and etching the outline of the reserved pattern on the first conductive layer, so that the reserved pattern part on the first conductive layer is formed; Separated from the non-reserved pattern part, stripped off the non-reserved pattern part on the first conductive layer, to obtain a first conductive circuit board; (2) A second conductive layer is covered on one side of the conductive layer of the first conductive circuit board , the second conductive layer is bonded with the insulating layer by the adhesive, and the outline of the reserved pattern is etched on the conductive substrate of the second conductive layer, so that the reserved pattern part of the second conductive layer is separated from the non-reserved pattern part , strip off the non-reserved pattern part of the second conductive layer to obtain a second conductive circuit board. The preparation method of the invention is simple and efficient, and conductive lines of different materials can be arranged on the same insulating base, thereby greatly expanding the application field of the circuit board.
Description
技术领域technical field
本发明涉及电路板技术领域，尤其涉及一种单层多材质导电线路板及制备方法。The invention relates to the technical field of circuit boards, in particular to a single-layer multi-material conductive circuit board and a preparation method.
背景技术Background technique
随着可穿戴电子设备的发展，电子器件发挥越来越重要的作用。导电基底是电子功能器件的载体，其重要性不言而喻。传统的电路板，采用化学刻蚀加掩膜板的方法来制备图案化的导电基底，制备工艺复杂，且环境污染大。而且其工艺适用的导电层材料仅限于铜和铝等常规单一金属导电材料，而多材质导电线路一般通过多层线路板工艺实现，不仅大大增加了工艺复杂性，而且使得线路板变厚，极大地限制了导电线路板，尤其是柔性导电线路板的应用范围。而且，这种工艺所兼容的导电材料有限，这些导电材料由于自身的耐腐蚀性，限制了其在各种电化学领域的应用。With the development of wearable electronic devices, electronic devices play an increasingly important role. The conductive substrate is the carrier of electronic functional devices, and its importance is self-evident. The traditional circuit board adopts the method of chemical etching and masking to prepare the patterned conductive substrate, the preparation process is complicated, and the environmental pollution is large. Moreover, the conductive layer materials applicable to its process are limited to conventional single-metal conductive materials such as copper and aluminum, while multi-material conductive lines are generally realized through a multi-layer circuit board process, which not only greatly increases the complexity of the process, but also makes the circuit board thicker and extremely The ground limits the application range of conductive circuit boards, especially flexible conductive circuit boards. Moreover, the conductive materials compatible with this process are limited, which limit their application in various electrochemical fields due to their corrosion resistance.
发明内容SUMMARY OF THE INVENTION
有鉴于此，本发明的目的之一在于提供一种单层多材质导电线路板的制备方法，其制备方法简单高效，同一绝缘基底上可以排布不同材质的导电线路，大大扩展了电路板的应用领域。In view of this, one of the purposes of the present invention is to provide a method for preparing a single-layer multi-material conductive circuit board, which is simple and efficient, and can arrange conductive lines of different materials on the same insulating substrate, which greatly expands the performance of the circuit board. field of application.
本发明的目的之二在于提供一种单层多材质导电线路板，其单层多材质导电线路板在同一绝缘基底上可以排布不同材质的导电线路，大大扩展了电路板的应用领域。The second purpose of the present invention is to provide a single-layer multi-material conductive circuit board, which can arrange conductive lines of different materials on the same insulating base, which greatly expands the application field of the circuit board.
本发明的目的之三在于提供一种用于3D打印锂离子电池的正负极集流体，其单层多材质导电线路板在同一绝缘基底上可以排布不同材质的导电线路，大大扩展了电路板的应用领域。The third purpose of the present invention is to provide a positive and negative current collector for 3D printing lithium ion batteries, whose single-layer multi-material conductive circuit board can arrange conductive circuits of different materials on the same insulating substrate, which greatly expands the circuit Application areas of the board.
为达第一个目的，本发明采用以下方案：For reaching first purpose, the present invention adopts following scheme:
一种单层多材质导电线路板的制备方法，包括以下步骤：A preparation method of a single-layer multi-material conductive circuit board, comprising the following steps:
(1)在绝缘层上通过粘结剂粘合有第一导电层，在所述第一导电层上刻蚀出预留图案的轮廓，使得所述第一导电层上的预留图案部分与非预留图案部分分离，剥离掉所述第一导电层上的非预留图案部分，制得第一导电线路板；(1) A first conductive layer is adhered on the insulating layer through an adhesive, and the outline of the reserved pattern is etched on the first conductive layer, so that the reserved pattern on the first conductive layer is partially The non-reserved pattern part is separated, and the non-reserved pattern part on the first conductive layer is peeled off to prepare a first conductive circuit board;
(2)在所述第一导电线路板的导电层一侧覆盖有第二导电层，所述第二导电层通过所述粘结剂与所述绝缘层粘结，在所述第二导电层的导电基底上刻蚀出预留图案的轮廓，使得所述第二导电层的预留图案部分与非预留图案部分分离，剥离掉第二导电层的非预留图案部分，制得第二导电线路板。(2) A second conductive layer is covered on the conductive layer side of the first conductive circuit board, the second conductive layer is bonded to the insulating layer through the adhesive, and the second conductive layer is The outline of the reserved pattern is etched on the conductive substrate, so that the reserved pattern portion of the second conductive layer is separated from the non-reserved pattern portion, and the non-reserved pattern portion of the second conductive layer is peeled off to obtain a second conductive layer. Conductive circuit board.
其中，还包括步骤(3)：在所述第二导电线路板的导电层一侧覆盖第三导电层，所述第三导电层通过所述粘结剂与所述绝缘层粘结，在所述第三导电层的导电基底上刻蚀出预留图案的轮廓，使得所述第三导电层的预留图案部分与非预留图案部分分离，剥离掉第三导电层的非预留图案部分，制得第三导电线路板，以此类推，能制得多种材质的导电线路板。Wherein, it also includes step (3): covering a third conductive layer on one side of the conductive layer of the second conductive circuit board, the third conductive layer is bonded to the insulating layer through the adhesive, and the third conductive layer is bonded to the insulating layer through the adhesive. The outline of the reserved pattern is etched on the conductive substrate of the third conductive layer, so that the reserved pattern portion of the third conductive layer is separated from the non-reserved pattern portion, and the non-reserved pattern portion of the third conductive layer is peeled off. , the third conductive circuit board is obtained, and so on, conductive circuit boards of various materials can be obtained.
其中，所述第一导电层和所述第二导电层的材质不同。Wherein, the materials of the first conductive layer and the second conductive layer are different.
其中，所述第一导电层和第二导电层的预留图案不能重叠。Wherein, the reserved patterns of the first conductive layer and the second conductive layer cannot overlap.
其中，所述第一导电层和第二导电层的材质选自金属薄膜材料及其合金材料、金属泡沫材料及其合金材料、导电碳薄膜、导电碳布材料或金属与碳的合金薄膜材料中的一种或至少两种的组合。Wherein, the materials of the first conductive layer and the second conductive layer are selected from metal thin film materials and their alloy materials, metal foam materials and their alloy materials, conductive carbon films, conductive carbon cloth materials or metal and carbon alloy thin film materials one or a combination of at least two.
其中，所述第一导电层和第二导电层的材质选自铜箔或铝箔。Wherein, the materials of the first conductive layer and the second conductive layer are selected from copper foil or aluminum foil.
其中，所述步骤(1)和步骤(2)中刻蚀方式为激光刻蚀。Wherein, the etching method in the steps (1) and (2) is laser etching.
其中，所述激光刻蚀的激光为CO2激光器，氪灯泵浦YAG激光器，氙灯泵浦YAG激光器，半导体侧面泵浦YAG激光器。Wherein, the laser for the laser etching is a CO2 laser, a krypton lamp-pumped YAG laser, a xenon lamp-pumped YAG laser, and a semiconductor side-pumped YAG laser.
为达第二个目的，本发明采用以下方案：For reaching the second purpose, the present invention adopts the following scheme:
一种单层多材质导电线路板，采用上述的制备方法制得。A single-layer multi-material conductive circuit board is prepared by the above-mentioned preparation method.
为达第三个目的，本发明采用以下方案：For reaching the 3rd purpose, the present invention adopts following scheme:
一种用于3D打印锂离子电池的正负极集流体，包括上述的单层多材质导电线路板。A positive and negative current collector for 3D printing lithium ion batteries, comprising the above-mentioned single-layer multi-material conductive circuit board.
与现有技术相比，本发明的有益效果为：本发明的绝缘层上壳排布第一导电层和第二导线层，并对其进行蚀刻成导电线路，大大扩展了电路板的应用领域。本发明制备方法简单高效，同一绝缘基底上可以排布不同材质的导电线路，大大扩展了电路板的应用领域。Compared with the prior art, the beneficial effects of the present invention are: the first conductive layer and the second conductive layer are arranged on the upper shell of the insulating layer of the present invention, and are etched into conductive lines, which greatly expands the application field of the circuit board . The preparation method of the invention is simple and efficient, and conductive lines of different materials can be arranged on the same insulating base, thereby greatly expanding the application field of the circuit board.
附图说明Description of drawings
图1为本发明实施例的绝缘层上粘结第一导电层的结构示意图；1 is a schematic structural diagram of bonding a first conductive layer on an insulating layer according to an embodiment of the present invention;
图2为本发明实施例的第一导电线路板的结构示意图；2 is a schematic structural diagram of a first conductive circuit board according to an embodiment of the present invention;
图3为本发明实施例的第一导电线路板上覆上第二导电层的结构示意图；3 is a schematic structural diagram of a first conductive circuit board covered with a second conductive layer according to an embodiment of the present invention;
图4为本发明实施例的第二导电层刻蚀出预留图案的结构示意图；4 is a schematic structural diagram of a reserved pattern etched from a second conductive layer according to an embodiment of the present invention;
图5为本发明实施例的单层多材质导电线路板的结构示意图。FIG. 5 is a schematic structural diagram of a single-layer multi-material conductive circuit board according to an embodiment of the present invention.
附图标示：1-绝缘层、2-粘结剂、3-第一导电层、4-第二导电层、31-第一导电层的预留图案部分、41-第二导电层的预留图案部分。Reference signs: 1-insulation layer, 2-adhesive, 3-first conductive layer, 4-second conductive layer, 31-reserved pattern portion of the first conductive layer, 41-reservation of the second conductive layer pattern part.
具体实施方式Detailed ways
下面分别结合实施例来进一步说明本发明的技术方案。The technical solutions of the present invention are further described below in conjunction with the embodiments.
本实施例中单层多材质导电线路板的制备方法，包括以下步骤：The preparation method of the single-layer multi-material conductive circuit board in this embodiment includes the following steps:
(1)在绝缘层1，例如聚酰亚胺薄膜上涂一层粘结剂2，在粘结剂2上覆盖第一导电层3，例如可以为铝箔，用激光在第一导电层3上刻蚀出预留图案部分31，使第一导电层3的预留图案部分31与非预留图案部分分离，剥离掉非预留图案部分，得到第一导电线路板，在第一导电线路板上覆上第二导电层4，例如铜箔，由于第一导电层3的非预留图案部分已分离，第二导电层4在第一导电层3的非预留图案部分的位置与绝缘层1粘结，用激光在第二导电层4刻蚀出预留图案，使第二导电层4的预留图案部分41与非预留图案部分分离，剥离掉非预留图案部分，得到单层的铜铝电路板，以此类推，能制得多种材质的导电线路板。(1) Coat a layer of
本发明方法兼容所有能成膜的导电材料，且始终将导电层控制为单层，能大大简化导电层的结构，扩大其应用范围。特别的，本发明的方法，同样适用于柔性多材质导电线路板的制备。The method of the invention is compatible with all conductive materials that can be formed into a film, and the conductive layer is always controlled to be a single layer, which can greatly simplify the structure of the conductive layer and expand its application range. In particular, the method of the present invention is also applicable to the preparation of flexible multi-material conductive circuit boards.
应该注意到并理解，在不脱离后附的权利要求所要求保护的本发明的精神和范围的情况下，能够对上述详细描述的本发明做出各种修改和改进。因此，要求保护的技术方案的范围不受所给出的任何特定示范教导的限制。It should be noted and understood that various modifications and improvements can be made to the invention described in the foregoing detailed description without departing from the spirit and scope of the invention as claimed in the appended claims. Accordingly, the scope of the claimed solution is not to be limited by any specific exemplary teachings presented.
申请人声明，本发明通过上述实施例来说明本发明的详细工艺设备和工艺流程，但本发明并不局限于上述详细工艺设备和工艺流程，即不意味着本发明必须依赖上述详细工艺设备和工艺流程才能实施。所属技术领域的技术人员应该明了，对本发明的任何改进，对本发明产品各原料的等效替换及辅助成分的添加、具体方式的选择等，均落在本发明的保护范围和公开范围之内。The applicant declares that the present invention illustrates the detailed process equipment and process flow of the present invention through the above-mentioned embodiments, but the present invention is not limited to the above-mentioned detailed process equipment and process flow, that is, it does not mean that the present invention must rely on the above-mentioned detailed process equipment and process flow. Process flow can be implemented. Those skilled in the art should understand that any improvement of the present invention, the equivalent replacement of each raw material of the product of the present invention, the addition of auxiliary components, the selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.
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| CN108282964A (en) * | 2018-01-31 | 2018-07-13 | 深圳光韵达激光应用技术有限公司 | A kind of circuit board machining process forming circuit and figure using laser ablation |
| CN111935909B (en) * | 2020-07-31 | 2021-12-17 | 上海安费诺永亿通讯电子有限公司 | Recyclable electronic circuit with paper substrate and preparation method and recycling method thereof |
| DE102020211081A1 (en) * | 2020-09-02 | 2022-03-03 | Robert Bosch Gesellschaft mit beschränkter Haftung | Control device, in particular steering control device |
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| US9380709B2 (en) * | 2013-03-15 | 2016-06-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of cutting conductive patterns |
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